NCP512 80 mA CMOS Low Iq Voltage Regulator Features • • • • • • Low Quiescent Current of 40 A Typical Low Dropout Voltage of 180 mV at 80 mA and 3.0 V Vout Low Output Voltage Option Output Voltage Accuracy of 2.0% Industrial Temperature Range of −40°C to 85°C These are Pb−Free Devices Cellular Phones Battery Powered Consumer Products Hand−Held Instruments Camcorders and Cameras Battery or Unregulated Voltage C1 + 1 3 Vout 5 + 2 ON MARKING DIAGRAM 5 1 SC70−5/SC−88A/ SOT−353 SQ SUFFIX CASE 419A xxx M G G xxx = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN CONNECTIONS Typical Applications • • • • http://onsemi.com M The NCP512 series of fixed output linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. The NCP512 series features an ultra−low quiescent current of 40 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP512 has been designed to be used with low cost ceramic capacitors. The device is housed in the micro−miniature SC70−5 surface mount package. Standard voltage versions are 1.3, 1.5, 1.8, 2.2, 2.5, 2.7, 2.8, 3.0, 3.1, 3.3, and 5.0 V. Other voltages are available in 100 mV steps. Vin 1 GND 2 Enable 3 5 Vout 4 N/C (Top View) C2 ORDERING INFORMATION 4 OFF See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. This device contains 86 active transistors Figure 1. Typical Application Diagram © Semiconductor Components Industries, LLC, 2009 June, 2009 − Rev. 15 1 Publication Order Number: NCP512/D NCP512 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 Vin Description 2 GND 3 Enable 4 N/C No internal connection. 5 Vout Regulated output voltage. Positive power supply input voltage. Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. MAXIMUM RATINGS ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ Rating Symbol Value Unit Vin 0 to 6.0 V Enable Voltage Enable −0.3 to Vin +0.3 V Output Voltage Vout −0.3 to Vin +0.3 V Power Dissipation and Thermal Characteristics Power Dissipation Thermal Resistance, Junction−to−Ambient PD RJA Internally Limited 400 W °C/W Operating Junction Temperature TJ +150 °C Maximum Junction Temperature TJ(max) +150 °C Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Voltage Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch−up capability (85°C) "200 mA DC with trigger voltage. http://onsemi.com 2 NCP512 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TJ = 25°C, unless otherwise noted.) Symbol Characteristic Output Voltage (TA = 25°C, Iout = 10 mA) 1.3 V 1.5 V 1.8 V 2.2 V 2.5 V 2.7 V 2.8 V 3.0 V 3.1 V 3.3 V 5.0 V Output Voltage (TA = −40°C to 85°C, Iout = 10 mA) 1.3 V 1.5 V 1.8 V 2.2 V 2.5 V 2.7 V 2.8 V 3.0 V 3.1 V 3.3 V 5.0 V Line Regulation (Iout = 10 mA) 1.3 V−4.4 V (Vin = Vout(nom.) + 1.0 V to 6.0 V) 4.5 V−5.0 V (Vin = 5.5 V to 6.0 V) Load Regulation (Iout = 1.0 mA to 80 mA) Output Current (Vout = (Vout at Iout = 80 mA) −3%) 1.3 V−3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Dropout Voltage (TA = −40°C to 85°C, Iout = 80 mA, Measured at Vout = Vout(nom) −3.0%) 1.3 V 1.5 V 1.8 V 2.2 V 2.5 V 2.7 V 2.8 V 3.0 V 3.1 V 3.3 V 5.0 V Vout Vout Regline Regload Io(nom.) Min Typ Max 1.261 1.455 1.746 2.134 2.425 2.646 2.744 2.94 3.038 3.234 4.900 1.3 1.5 1.8 2.2 2.5 2.7 2.8 3.0 3.1 3.3 5.0 1.339 1.545 1.854 2.266 2.575 2.754 2.856 3.06 3.162 3.366 5.100 1.261 1.455 1.746 2.134 2.425 2.619 2.716 2.910 3.007 3.201 4.900 1.3 1.5 1.8 2.2 2.5 2.7 2.8 3.0 3.1 3.3 5.0 1.339 1.545 1.854 2.266 2.575 2.781 2.884 3.09 3.193 3.399 5.100 − − − 1.0 1.0 0.3 3.0 3.0 0.8 80 80 200 200 − − V V mV/V Vin−Vout Ground Current (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) Quiescent Current (TA = −40°C to 85°C) (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) Output Short Circuit Current (Vout = 0 V) 1.3 V−3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) IGND IQ Iout(max) Output Voltage Noise (f = 100 Hz to 100 kHz, Iout = 30 mA, Cout = 1 F) Ripple Rejection (f = 1.0 kHz, 60 mA) Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Output Voltage Temperature Coefficient Vn RR Vth(en) TC − − − − − − − − − − 520 450 350 240 220 200 200 180 170 160 120 700 550 450 300 300 300 300 300 300 300 300 − 40 90 − − 0.1 40 1.0 90 150 150 − − 250 250 180 50 400 400 − − 1.3 − − − − "100 − 0.3 − A A mA T *TA PD + J(max) RJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 3 mV/mA mA mV 3. Maximum package power dissipation limits must be observed. http://onsemi.com Unit VRMS dB V ppm/°C NCP512 300 3.020 NCP512SQ30 Vout, OUTPUT VOLTAGE (V) Vin − Vout, DROPOUT VOLTAGE (mV) TYPICAL CHARACTERISTICS 250 Io = 80 mA 200 150 Io = 40 mA 100 50 Io = 10 mA 0 −50 −25 0 25 50 75 100 3.015 Vin = 6.0 V 3.010 Vin = 4.0 V 3.005 3.000 2.995 2.990 2.985 −60 125 −40 −20 0 TEMPERATURE (°C) Iq, QUIESCENT CURRENT (A) Iq, QUIESCENT CURRENT (A) 44 42 40 −60 100 −40 −20 0 20 40 60 80 Vout = 3.0 V Cin = 1.0 F Cout = 1.0 F TA = 25°C 50 40 30 20 10 0 0 100 1.0 2.0 3.0 4.0 5.0 6.0 7.0 Vin, INPUT VOLTAGE (V) TEMPERATURE (°C) Figure 5. Quiescent Current vs. Input Voltage Figure 4. Quiescent Current vs. Temperature 60 70 Vout = 3.0 V Cin = 1.0 F Cout = 1.0 F Iout = 30 mA TA = 25°C 30 20 10 1.0 Vin = 4.0 V Cout = 1.0 F Iout = 30 mA 60 RIPPLE REJECTION (dB) Ignd, GROUND CURRENT (A) 80 Figure 3. Output Voltage vs. Temperature Iout = 0 mA Vin = 4.0 V Vout = 3.0 V 46 0 0 60 60 48 40 40 TEMPERATURE (°C) Figure 2. Dropout Voltage vs. Temperature 50 20 2.0 3.0 4.0 5.0 6.0 50 40 30 20 10 0 100 7.0 1.0k 10k 100k Vin, INPUT VOLTAGE (V) FREQUENCY (Hz) Figure 6. Ground Pin Current vs. Input Voltage Figure 7. Ripple Rejection vs. Frequency http://onsemi.com 4 1.0M NCP512 TYPICAL CHARACTERISTICS 7 6 5 Vin, INPUT VOLTAGE (V) Vin = 4.0 V Cout = 1.0 F Iout = 30 mA 4 3 2 1 0 10 100 1.0k 10k 100k 1.0M OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE NOISE (V/ǰHz ) 7 6 Cout = 1.0 F Iout = 10 mA 5 4 3 200 100 0 −100 0 50 100 150 200 250 Figure 9. Line Transient Response Figure 8. Output Noise Density Vin, INPUT VOLTAGE (V) 6 60 mA 0 200 OUTPUT VOLTAGE (V) 0 Iout = 1 mA to 60 mA Vin = 4.0 V Cin = 1.0 F Cout = 1.0 F −100 −200 0 4 2 0 4 100 100 200 300 400 500 600 700 Iout = 10 mA Vin = 4.0 V Cin = 1.0 F Cout = 1.0 F 3 2 1 0 0 800 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 TIME (s) TIME (ms) Figure 10. Load Transient Response Figure 11. Turn−on Response 3.5 Vout, OUTPUT VOLTAGE (V) Io, OUTPUT CURRENT (mA) 500 TIME (s) FREQUENCY (Hz) OUTPUT VOLTAGE DEVIATION (mV) 300 350 400 450 3.0 2.5 2.0 1.5 1.0 0.5 0 0 1.0 2.0 3.0 4.0 5.0 Vin, INPUT VOLTAGE (V) Figure 12. Output Voltage vs. Input Voltage http://onsemi.com 5 6.0 1.8 2.0 NCP512 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current. http://onsemi.com 6 NCP512 APPLICATIONS INFORMATION Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. A typical application circuit for the NCP512 series is shown in Figure 1, front page. Input Decoupling (C1) A 1.0 F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP512 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K Thermal As power across the NCP512 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP512 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Output Decoupling (C2) The NCP512 is a stable regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 5.0 can thus safely be used. The minimum decoupling value is 1.0 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum capacitors. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K T *TA PD + J(max) RJA If junction temperature is not allowed above the maximum 125°C, then the NCP512 can dissipate up to 250 mW @ 25°C. The power dissipated by the NCP512 can be calculated from the following equation: Enable Operation The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout or P ) Vout * Iout VinMAX + tot Ignd ) Iout If an 80 mA output current is needed then the ground current from the data sheet is 40 A. For an NCP512 (3.0 V), the maximum input voltage will then be 6.12 V. Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. http://onsemi.com 7 NCP512 ORDERING INFORMATION Device NCP512SQ13T1G Nominal Output Voltage* Marking 1.3 LIW 1.5 LCK 1.8 LCL 2.2 LIA 2.5 LCM 2.7 LCN 2.8 LCO 3.0 LCP 3.1 LFO 3.3 LCQ 5.0 LCR Package Shipping† SC−88A (SOT−353) (Pb−Free) 3000 Units/ 7″ Tape & Reel NCP512SQ13T2G NCP512SQ15T1G NCP512SQ15T2G NCP512SQ18T1G NCP512SQ18T2G NCP512SQ22T1G NCP512SQ22T2G NCP512SQ25T1G NCP512SQ25T2G NCP512SQ27T1G NCP512SQ27T2G NCP512SQ28T1G NCP512SQ28T2G NCP512SQ30T1G NCP512SQ30T2G NCP512SQ31T1G NCP512SQ31T2G NCP512SQ33T1G NCP512SQ33T2G NCP512SQ50T1G NCP512SQ50T2G *Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 8 NCP512 PACKAGE DIMENSIONS SC−88A/SOT−353/SC70−5 SQ SUFFIX CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 3 D 5 PL 0.2 (0.008) M B INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 DIM A B C D G H J K N S M N J MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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