ETC OSC-15802-170Q

OSC-15802
®
SYNCHRO/RESOLVER/INDUCTOSYN
REFERENCE OSCILLATOR
DESCRIPTION
FEATURES
The OSC-15802 is a power oscillator
with two outputs that are 90° out of
phase. These outputs provide both
the reference and quadrature signals,
simultaneously, making the OSC15802 ideally suited for synchro,
resolver, Linear Variable Differential
Transformer (LVDT), Rotary Variable
Differential Transformer (RVDT) and
Inductosyn applications.
The oscillator’s outputs are pin-programmable for both frequency and
amplitude. The output frequency can
be programmed from 400 Hz to 10
kHz by simply connecting two exter-
nal capacitors. The Reference output
voltage, 7 Vrms, can be scaled down
by connecting a single resistor.
• ADI Alternate Source
• Quadrature Reference Output
Voltages for Inductosyn
Applications
APPLICATIONS
Packaged in an 18-pin hermetic DDIP,
the OSC-15802 operates over a temperature range of -55°C to +125°C.
This, combined with its small size and
programmable output voltage and frequency capabilities, makes it an
excellent choice for synchro, resolver,
LVDT, RVDT and Inductosyn applications.
• Programmable Output Frequency
to 10 kHz
• Small 18-Pin DDIP
• Scalable Reference Output
• -55°C to +125°C Operating
Temperature Range
G = +2.8
Cext
C1
+15 VDC
Rext
GND
-
PA IN
PA OUT
QUAD OSCILLATOR
+
REF
OUT
-15 VDC
C2
Cext
5350 Ω
REF OUT +90˚
FIGURE 1. OSC-15802 BLOCK DIAGRAM
© 1981, 1999 Data Device Corporation
® Inductosyn is a registered trademark of Farrand Controls Corporation.
PROGRAMMABLE FREQUENCY OUTPUT
TABLE 1. OSC-15802 SPECIFICATIONS
Specifications apply over temperature range and power supply range.
PARAMETER
UNITS
FREQUENCY
Hz
OUTPUTS
PA OUT
Voltage
Current
REF
Voltage
Current
REF +90°
Voltage
Current
Protection
The output frequency of the OSC-15802 is programmable to
10 kHz. The frequency is programmed using two external equal
value capacitors (see FIGURE 2). The value of the capacitors
(Cext) is calculated as follows:
VALUE
Programmable from
400 to 10k
Cext = 10
f
V rms 7 ±1% for 2.5 V input
mA rms 190 min
where: Cext is capacitance in picofarads (use NPO ceramic),
V rms 2.5 ±10%
mA rms 3 min
f is frequency in Hertz.
V rms 2.5 ±10%
mA rms 3 min
Momentary short circuit
and transient proof
(1 sec. max.)
POWER SUPPLIES
Voltage
Current
Max Voltage without damage
Vdc
mA
Vdc
TEMPERATURE RANGE
Operating
-10X
-30X
Storage
7
To scale down the PA OUT voltage, an external resistor (Rext) is
connected between pins 3 and 7. The value of Rext is calculated
as follows:
Rext = 37.5 - 5.35
Vout
±15 ±5%
20 max plus current load
±18
where: Rext is in kOhms,
Vout is the desired voltage in Vrms.
°C
°C
°C
PHYSICAL CHARACTERISTICS
Size
in
(mm)
oz
(gm)
Weight
-55 to +125
0 to +70
-65 to +150
1.0 x 0.8 x 0.2
(25.45 x 20.32 x 4.83)
18 pin DDIP
0.4
(1)
+15 V
18
11
-15 V
16
15
C2
Cext
REF OUT +90˚
12
6
C2
13
OSC-15802
C1
PA OUT (REF)
Cext
7
REF OUT
PA IN
3
Rext
FIGURE 2. PROGRAMMING RESISTOR AND CAPACITOR CONNECTIONS
2
TABLE 2. OSC-15802 PIN FUNCTIONS
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
NAME
FUNCTION
NC
No connection
NC
No connection
PA IN
Power amplifier input
NC
No connection
NC
No connection
C1
Capacitor connection (pin-programmable freq)
REF OUT
Reference Output
NC
No connection
NC
No connection
NC
No connection
C2
Capacitor connection (pin-programmable freq)
REF OUT +90° +90° reference output signal
PA OUT
Power amplifier output
NC
No connection
-15 V
-15 Vdc power supply voltage
GND
Ground
NC
No connection
+15 V
+15 Vdc power supply voltage
1.002 MAX
(25.45)
18
10
0.800
MAX
(20.32)
0.600
(15.24)
1
0.035 TYP
(0.89)
9
PIN 1 INDEX
0.190
MAX (4.83)
TOP VIEW
0.010 ±0.002
TYP
(0.25 ±0.05)
SIDE VIEW
0.240
(6.10)
0.100 TYP
(2.54)
0.018 ±0.002
(0.46 ±0.05)
0.040 TYP
(1.02)
8 EQ. SP. @ 0.100 = 0.800
TOL NONCUM
(@ 2.54 = 20.32)
FIGURE 3. OSC-15802 MECHANICAL OUTLINE
3
NOTES:
1. Dimensions shown are in inches (mm).
2. Lead cluster shall be centralized
within ±0.010 (±2.54) of outline dimensions.
3. Pin material meets solderability
requirements of MIL-STD-202E,
Method 208C.
4. Pin numbers are for reference only.
ORDERING INFORMATION
OSC-15802- X X 0 X
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
Blank = None of the Above
Process Requirements:
0 = Standard DDC Processing, no Burn-In
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In
Temperature Grade/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
8 = 0°C to +70°C with Variables Test Data
*Standard DDC Processing with burn-in and full temperature test - see table below
STANDARD DDC PROCESSING
MIL-STD-883
TEST
METHOD(S)
CONDITION(S)
INSPECTION
2009, 2010, 2017, and 2032
—
SEAL
1014
A and C
TEMPERATURE CYCLE
1010
C
CONSTANT ACCELERATION
2001
A
BURN-IN
1015, Table 1
—
The information in this data sheet is believed to be accurate; however, no responsibility is
assumed by Data Device Corporation for its use, and no license or rights
are granted by implication or otherwise in connection therewith.
Specifications are subject to change without notice.
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F1/DOM REP MEM 1455-07/99-0
ILC DATA DEVICE CORPORATION
REGISTERED TO ISO 9001
FILE NO. A5976
PRINTED IN THE U.S.A.
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