Omni TECHNICAL BULLETIN ision TM OmniVision Packaging Specifications Last Modified: 3 February 2003 Document Version: 1.2 Revision Number Date Revision 1.0 04/02/02 Release to Marketing 1.1 10/09/02 Minor corrections 1.2 02/03/03 Add backend chip package specifications and minor corrections This document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, non-infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. OmniVision Technologies, Inc. disclaims all liability, including liability for infringement of any proprietary rights, relating to the use of information in this document. No license, expressed or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. * Third-party brands, names, and trademarks are the property of their respective owners. Note: The information contained in this document is considered proprietary to OmniVision Technologies, Inc. This information may be distributed only to individuals or organizations authorized by OmniVision Technologies, Inc. to receive said information. Individuals and/or organizations are not allowed to re-distribute said information OmniVision Packaging Specifications Omni ision 00Table of Contents Section 1, General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Section 2, Die Position. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Die Shift Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Die Tilt Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 Die Rotation Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Section 3, CameraChip Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 24-Pin CLCC Ceramic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 28-Pin CLCC Ceramic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.3 28-Pin PLCC Plastic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4 48-Pin CLCC Ceramic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.5 48-Pin PLCC Plastic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Section 4, Backend Chip Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2 4.1 64-Pin TQFP Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 100-Pin TQFP Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.3 64-Pin BGA Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.4 100-Pin BGA Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Proprietary to OmniVision Technologies Version 1.2, February 3, 2003 Omni ision 00List of Figures Figure 2-1. Die Shift Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2-2. Die Tilt Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2-3. Die Rotation Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 3-1. 24-Pin CLCC Ceramic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 3-2. 28-Pin CLCC Ceramic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 3-3. 28-Pin PLCC Plastic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 3-4. 48-Pin CLCC Ceramic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 3-5. 48-Pin PLCC Plastic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 4-1. 64-Pin TQFP Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 4-2. 100-Pin TQFP Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 4-3. 64-Pin BGA Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 4-4. 100-Pin BGA Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Version 1.2, February 3, 2003 Proprietary to OmniVision Technologies 3 OmniVision Packaging Specifications Omni ision 00List of Tables 4 Table 3-1 24-Pin CLCC Ceramic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 3-2 28-Pin CLCC Ceramic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 3-3 28-Pin PLCC Plastic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 3-4 48-Pin CLCC Ceramic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 3-5 48-Pin PLCC Plastic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Proprietary to OmniVision Technologies Version 1.2, February 3, 2003 Omni General Description ision 1 General Description This document defines and describes the package specifications and dimensions for OmniVision Technologies CAMERACHIPSTM. 2 Die Position 2.1 Die Shift Specification Figure 2-1. illustrates the CameraChip die shift tolerances which are as follows: • X-axis: + 0.15 mm (6.0 mils) maximum • Y-axis: + 0.15 mm (6.0 mils) maximum Figure 2-1. Die Shift Tolerances Package Substrate Dam Area Cavity Boundary of Maximum Die Shift Allowed Die (at package center) 0.15 mm X-Axis 0.15 mm Y-Axis Version 1.2, February 3, 2003 Proprietary to OmniVision Technologies 5 OmniVision Packaging Specifications Omni ision 2.2 Die Tilt Specification Figure 2-2. illustrates the OmniVision CAMERACHIP die tilt tolerances. The tilt angle (θ) must be less than 1 degree. Figure 2-2. Die Tilt Tolerances e f a b c d e f b a tan = tan < a-b e 0.017 d c tan = c-d f tan < 0.017 < 1 degree 6 < 1 degree Proprietary to OmniVision Technologies Version 1.2, February 3, 2003 Omni Die Position ision 2.3 Die Rotation Specification Figure 2-3. illustrates the OmniVision CAMERACHIP die rotation tolerances. The rotation angle (θ) must be less than 3 degrees. Figure 2-3. Die Rotation Tolerances a b Dam c Chip tan = tan < a-b c 0.035 < 3 degrees Version 1.2, February 3, 2003 Proprietary to OmniVision Technologies 7 OmniVision Packaging Specifications Omni ision 3 CameraChip Package Specification 3.1 24-Pin CLCC Ceramic Package Specification Figure 3-1. 24-Pin CLCC Ceramic Package Specifications + + .010 - .005 .270 ± .006 .065 ± .007 .015 ± .002 .030 ± .003 .400 SQ 3 1 6 4 .005 x 45 o PIN 1 INDEX 24 22 1 24 .075 ± .010 .250 TYP .020 ± .002 22 .050 TYP .020 TYP 24 1 3 .040 REF TYP .085 REF .006 R TYP 19 21 21 4 .006 R TYP .320 ± .008 .270 ± .006 .009 R REF TYP 9 7 10 16 9 15 10 .022 TYP MP-2 .050 REF TYP CERAMIC (METALLIZED) KYOCERA A440 (BLACK) .012 R REF TYP MP-1 MP-3 24-Pin CLCC Ceramic Package Dimensions Dimensions Millimeters (mm) Inches (in.) 10.16 + 0.25 / -0.13 SQ .400 +.01 / -.005 SQ Package Height 2.24 + 0.28 .088 + .011 Substrate Height 0.51 + 0.05 .020 + .002 6.99 + 0.15 SQ .275 + .006 SQ Castellation Height 1.14 + 0.13 .045 + .005 Pin #1 Pad Size 0.51 x 2.16 .020 x .085 Pad Size 0.51 x 1.02 .020 x .04 Pad Pitch 1.27 + 0.10 .050 + .004 Package Edge to First Lead Center 1.91 + 0.25 .075 + .01 End-to-End Pad Center-Center 6.35 + 0.13 .250 + .005 9.50 + 0.10 SQ .374 + .004 SQ 0.55 + 0.05 .022 + .002 Package Size Cavity Size Glass Size Glass Height 8 .005 REF TYP 15 .012 TYP Table 3-1. 16 18 Proprietary to OmniVision Technologies Version 1.2, February 3, 2003 Omni CameraChip Package Specification ision 3.2 28-Pin CLCC Ceramic Package Specification Figure 3-2. 28-Pin CLCC Ceramic Package Specifications .083 ± .01 .450 SQ ± .008 .060 ± .006 .350 SQ ± .006 .020 ± .002 .020 ± .002 11 12 5 5 8 9 .050 ± .004 11 .012 R TYP. 7 6 4 .050 TYP 12 4 .022 ± .004 .001 to .005 TYP .014 TYP .010 x 45 o CHAMFER PIN 1 INDEX PIN NO. 1 INDEX .409 ± .004 .020 TYP .300 SQ ± .005 .075 ± .010 .300 ± .005 .020 ± .002 .013 MIN B/F EXPOSURE .011 MIN 1 1 1 28 28 26 26 28 .025 ± .003 20 23 20 22 21 19 25 .007 MAX B/F PULL BACK .110 REF TYP .008 R REF TYP 25 .035 MIN. .012 R TYP. .040 TYP .085 TYP .200 ± .005 18 19 .009 R REF TYP .015 MIN TYP MP-2 MP-3 .040 REF (METALLIZED) MP-4 CERAMIC KYOCERA A440 (BLACK) Table 3-2. 28-Pin CLCC Ceramic Package Dimensions Dimensions Millimeters (mm) Inches (in.) 11.43 + 0.20 SQ .450 + .008 SQ Package Height 2.11 + 0.25 .083 + .01 Substrate Height 0.51 + 0.05 .020 + .002 7.62 + 0.13 SQ .300 + .005 SQ Castellation Height 1.02 + 0.1 .040 + .004 Pin #1 Pad Size 0.64 x 2.16 .025 x .085 Pad Size 0.64 x 1.27 .025 x .050 Pad Pitch 1.27 + 0.10 .050 + .004 Package Edge to First Lead Center 1.91 + 0.25 .075 + .010 End-to-End Pad Center-Center 7.62 + 0.13 .300 + .005 10.41 + 0.10 SQ .409 + .004 SQ 0.55 + 0.05 .022 + .002 Package Size Cavity Size Glass Size Glass Height Version 1.2, February 3, 2003 Proprietary to OmniVision Technologies 9 OmniVision Packaging Specifications Omni ision 3.3 28-Pin PLCC Plastic Package Specification Figure 3-3. 28-Pin PLCC Plastic Package Specifications .093 ± .004 .450 SQ ± .004 .042 ± .002 .075 ± .004 .300 ± .004 .350 SQ ± .006 .028 ± .002 .275 SQ ± .004 .050 ± .004 4 5 .012 x 45 o 11 12 5 11 .050 TYP 8 12 .022 ± .002 7 4 9 .001 to .005 TYP Pin 1 Index 6 .010 x 45 o Chamfer Pin 1 Index .406 ± .004 1 1 1 28 28 28 20 26 19 25 18 18 23 21 22 19 25 .009 R REF TYP .035 MIN. .085 TYP 26 .025 ± .003 TYP .028 ± .002 (Metallized) Table 3-3. 28-Pin PLCC Plastic Package Dimensions Dimensions Millimeters (mm) Inches (in.) 11.43 + 0.10 SQ .450 + .004 SQ Package Height 2.35 + 0.1 .093 + .004 Substrate Height 0.70 + 0.05 .028 + .002 7.00 + 0.10 SQ .275 + .004 SQ Castellation Height 1.07 + 0.05 .042 + .002 Pin #1 Pad Size 0.64 x 2.16 .025 x .085 Pad Size 0.64 x 1.27 .025 x .050 Pad Pitch 1.27 + 0.10 .050 + .004 Package Edge to First Lead Center 1.90 + 0.10 .075 + .004 End-to-End Pad Center-Center 7.62 + 0.10 .300 + .004 10.30 + 0.10 SQ .406 + .004 SQ 0.55 + 0.05 .022 + .002 Package Size Cavity Size Glass Size Glass Height 10 Proprietary to OmniVision Technologies Version 1.2, February 3, 2003 Omni CameraChip Package Specification ision 3.4 48-Pin CLCC Ceramic Package Specification Figure 3-4. 48-Pin CLCC Ceramic Package Specifications .088 ± .011 .065 ± .007 .030 ± .002 .015 ± .002 .020 ± .002 .560 SQ + .012 / - .005 .430 SQ ± .005 .350 SQ ± .005 42 .032 MIN 43 42 31 31 43 48 1 30 30 Pin 1 Index 19 18 48 1 .020 TYP 19 19 R .0075 (4 CORNERS) Table 3-4. .040 TYP 43 .022 ± .004 .001 to .005 TYP 18 7 42 31 .012 TYP REF 6 7 .06 + .010 / - .005 30 .488 ± .004 48 1 6 .440 ± .005 .040 ± .003 18 R .0075 (48 PLCS) 6 7 .085 TYP 48-Pin CLCC Ceramic Package Dimensions Dimensions Millimeters (mm) Inches (in.) 14.22 + 0.30 / -0.13 SQ .560 + .012 / - .005 SQ Package Height 2.23 + 0.28 .088 + .011 Substrate Height 0.51 + 0.05 .020 + .002 8.89 + 0.13 SQ .350 + .005 SQ Castellation Height 1.14 + 0.13 .045 + .005 Pin #1 Pad Size 0.51 x 2.16 .020 x .085 Pad Size 0.51 x 1.02 .020 x .040 Pad Pitch 1.02 + 0.08 .040 + .003 1.524 + 0.25 / -0.13 .06 + .010 / - .005 11.18 + 0.13 .440 + .005 12.40 + 0.10 SQ / 13.00 + 0.10 SQ .488 + .004 SQ / .512 + .004 SQ 0.55 + 0.05 .022 + .002 Package Size Cavity Size Package Edge to First Lead Center End-to-End Pad Center-Center Glass Size Glass Height Version 1.2, February 3, 2003 Proprietary to OmniVision Technologies 11 OmniVision Packaging Specifications Omni ision 3.5 48-Pin PLCC Plastic Package Specification Figure 3-5. 48-Pin PLCC Plastic Package Specifications .091 ± .004 .560 SQ ± .004 .068 ± .004 .442 SQ ± .004 .340 SQ ± .004 43 43 31 42 .044 TYP 31 42 .060 ± .004 .040 ± .004 .028 ± .002 31 42 .036 MIN .442 ± .004 .040 ± .002 30 43 30 30 .022 ± .002 .001 to .005 TYP 48 1 .512 ± .004 48 1 6 6 19 18 7 18 R .0075 (4 CORNERS) Table 3-5. 6 7 R .0075 (48 PLCS) .079 TYP 48-Pin PLCC Plastic Package Dimensions Dimensions Millimeters (mm) Inches (in.) 14.22 + 0.10 SQ .560 + .004 SQ Package Height 2.30 + 0.10 .091 + .004 Substrate Height 0.70 + 0.05 .028 + .002 8.60 + 0.10 SQ .340 + .004 SQ Castellation Height 1.02 + 0.05 .040 + .002 Pin #1 Pad Size 0.51 x 2.00 .020 x .079 Pad Size 0.51 x 1.11 .020 x .044 Pad Pitch 1.02 + 0.10 .040 + .004 Package Edge to First Lead Center 1.50 + 0.10 .060 + .004 End-to-End Pad Center-Center 11.22 + 0.10 .442 + .004 13.00 + 0.10 SQ .512 + .004 SQ 0.55 + 0.05 .022 + .002 Package Size Cavity Size Glass Size Glass Height 12 .020 TYP 19 19 18 7 48 1 Proprietary to OmniVision Technologies Version 1.2, February 3, 2003 Omni Backend Chip Package Specifications ision 4 Backend Chip Package Specifications 4.1 64-Pin TQFP Package Specification Figure 4-1. 64-Pin TQFP Package Specifications 12.00 0 ~ 7o 33 49 32 64 17 10.00 12.00 48 10.00 0.60 + 0.15 1 0.22 + 0.05 16 1.00 + 0.05 0.5 1.20 MAX 0.05 ~ 0.15 1.00 0.60 + 0.15 NOTE: All dimensions are in mm Version 1.2, February 3, 2003 Proprietary to OmniVision Technologies 13 OmniVision Packaging Specifications Omni ision 4.2 100-Pin TQFP Package Specification Figure 4-2. 100-Pin TQFP Package Specifications 16.00 14.00 75 0 ~ 7o 51 76 50 14.00 16.00 26 100 0.60 + 0.15 1 0.5 25 0.22 + 0.05 1.00 + 0.05 1.20 MAX 0.08 1.00 0.60 + 0.15 NOTE: All dimensions are in mm 14 Proprietary to OmniVision Technologies Version 1.2, February 3, 2003 Omni Backend Chip Package Specifications ision 4.3 64-Pin BGA Package Specification Figure 4-3. 64-Pin BGA Package Specifications Detail A 0.10 Indicates Ball A1 8.00 + 0.20 8.00 + 0.20 8 7 6 5 4 3 2 1 8.00 + 0.20 5.60 BCS A B C D E F G H 0.80 BCS 8.00 + 0.20 5.60 BCS Top View Bottom View Detail B 0.50 + 0.05 1.20 + 0.10 1.20 + 0.20 Side View 0.50 + 0.05 Detail A 0.70 + 0.05 0.25 + 0.05 1.25 + 0.15 0.30 + 0.05 Seating Plane 0.12 Max Detail B NOTE: All dimensions are in mm Version 1.2, February 3, 2003 Proprietary to OmniVision Technologies 15 OmniVision Packaging Specifications Omni ision 4.4 100-Pin BGA Package Specification Figure 4-4. 100-Pin BGA Package Specifications Detail A 0.10 Indicates Ball A1 9.00 + 0.20 10 9 8 7 6 5 4 3 2 1 A B C D E F G H I J 0.80 BCS 9.00 + 0.20 9.00 + 0.20 7.20 BCS 9.00 + 0.20 7.20 BCS Top View Bottom View Detail B 0.50 + 0.05 0.90 + 0.10 0.90 + 0.20 Side View 0.50 + 0.05 Detail A 0.70 + 0.05 0.25 + 0.05 1.25 + 0.15 0.30 + 0.05 Seating Plane 0.10 Max Detail B NOTE: All dimensions are in mm 16 Proprietary to OmniVision Technologies Version 1.2, February 3, 2003