05107 P0402FC3.3C* thru Only One Name Means ProTek’Tion™ P0402FC36C* FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns 0402 FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0402 ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Tin-Lead or Lead-Free Plating ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION *U.S. Patent No. Des. “D456,367S” 05107.R9 4/05 1 www.protekdevices.com P0402FC3.3C* thru P0402FC36C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 250 Watts Operating Temperature TJ -55°C to 150°C °C TSTG -55°C to 150°C °C PARAMETER Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1) P0402FC3.3C P0402FC05C P0402FC08C P0402FC12C P0402FC15C P0402FC24C P0402FC36C RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) TYPICAL CAPACITANCE V WM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS @8/20µs VC @ IPP @VWM ID µA @0V, 1 MHz C pF 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 9.8 13.4 19.0 24.0 43.0 64.0 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A 75* 10** 10*** 1 1 1 1 150 100 75 50 40 30 25 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 250W, 8/20µs Waveform 100 10 0.01 FIGURE 2 PULSE WAVE FORM 120 tf 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 10,000 0 5 10 15 t - Time - µs 20 25 30 *U.S. Patent No. Des. “D456,367S” 05107.R9 4/05 2 www.protekdevices.com P0402FC3.3C* thru P0402FC24C* GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs % Of Rated Power 80 60 40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR P0402FC05C 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0402FC05C VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps *U.S. Patent No. Des. “D456,367S” 05107.R9 4/05 3 www.protekdevices.com P0402FC3.3C* thru P0402FC36C* APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS VALUE PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-265°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Temperature - °C Ramp-up Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat t 25°C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down *U.S. Patent No. Des. “D456,367S” 05107.R9 4/05 4 www.protekdevices.com P0402FC3.3C* thru P0402FC24C* PACKAGE OUTLINE & DIMENSIONS 0402 SIDE PACKAGE DIMENSIONS G B TOP C A PACKAGE OUTLINE D E F H DIM MILLIMETERS INCHES A B C D E F G H 0.46 NOM 0.86 NOM 0.99 ± 0.0254 0.10 NOM 0.35 NOM 0.483 ± 0.0254 0.20 NOM 0.127 MAX 0.076 MIN 0.406 NOM 0.018 NOM 0.034 NOM 0.039 ± 0.001 0.004 NOM 0.014 NOM 0.019 ± 0.001 0.008 NOM 0.005 MAX 0.003 MIN 0.016 NOM I END I NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”). MOUNTING PAD PAD DIMENSIONS C D B SOLDER PAD A MILLIMETERS INCHES A B C D E F G H I 0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13 0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005 F E H DIE SOLDER BUMP DIM I TAPE & REEL ORIENTATION G SOLDER PRINT DIAMETER 0.010” 0.012” NOTE: 1. Top view of tape. Metal contacts are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE Single Die - 0402 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0402FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0402FC05C-T710-2). 4. Suffix - LF = Lead-Free, i.e., P0402FC05C-LF-T75-1. COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). NOTE: 1. Preferred: Using 0.1mm (0.004”) stencil. Outline & Dimensions: Rev 3 - 11/02, 06001 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. *U.S. Patent No. Des. “D456,367S” 05107.R9 4/05 5 www.protekdevices.com