05323 CSP040605C CHIP SCALE LOW CAPACITANCE FLIP CHIP TVSARRAY APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers ✔ SMART Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FLIP CHIP DFN-6 FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in 5V ✔ 200 Watts Peak Pulse Power per Line (tp = 8/20μs) ✔ Low Clamping Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 3 to 5 Lines ✔ Low Capacitance ✔ Low Leakage Current ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ ✔ ✔ ✔ ✔ Molded Chip Scale Package Low Profile - 0.254 mm Maximum Height Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ No Under-Fill Required ✔ Prevents Solder Leakage and Solder Shorts PIN CONFIGURATION 05323.R0 11/09 1 www.protekdevices.com CSP040605C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS PPP 200 Watts Peak Pulse Power (tp = 8/20μs) - See Figure 1 Operating Temperature Storage Temperature TA -55 to 150 °C TSTG -55 to 150 °C ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER (See Note 1) @ 25°C Unless Otherwise Specified RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) TYPICAL CAPACITANCE VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS @8/20μs VC @ IPP @VWM ID μA @0V, 1 MHz C pF 5.9 6.0 11.0 13V @ 15A 10 35 CSP040605C Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: Maximum leakage current <500nA @ 3.3V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Power - Watts 1000 200W 8/20µs Waveform 100 10 0.1 05323.R0 11/09 1 10 100 td - Pulse Duration - µs FIGURE 2 PULSE WAVE FORM 120 10000 1000 10000 2 tf 100 TEST WAVEFORM PARAMETERS tf = 8μs td = 20μs Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 0 5 10 15 t - Time - μs 20 25 30 www.protekdevices.com CSP040605C GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20μs % Of Rated Power 80 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - °C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 05323.R0 11/09 3 www.protekdevices.com CSP040605C APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS VALUE PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50μm ±20μm 60 Seconds 270°C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) TP Temperature - °C Ramp-Up Solder Melt (Maximum Temp) Ramp-Down Flux Activation Temp Preheat (Stay Below Flux Activation Temp) 30-60 seconds 05323.R0 11/09 Ramp-Up 15 seconds (Minimize) 4 Solder-Time 15-20 seconds Ramp-Down www.protekdevices.com CSP040605C CHIP SCALE PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE G A PACKAGE DIMENSIONS DIM D F TOP A B C D E F G H I J E MILLIMETERS MIN MAX 1.47 0.97 0.102 0.230 0.457 0.230 0.457 0.051 0.076 0.177 1.57 1.07 0.152 0.279 0.558 0.279 0.558 0.051 0.101 0.203 INCHES MIN MAX 0.058 0.038 0.004 0.009 0.018 0.009 0.018 0.002 0.003 0.007 0.062 0.042 0.006 0.011 0.022 0.011 0.022 0.002 0.004 0.008 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Dimension “H” is between centers. 3. Suffix-T7 = 7 Inch Reel - 5,000 pieces per 8mm tape, i.e., CSP040605C-T7. C H I SIDE 05323.R0 11/09 J 5 www.protekdevices.com