PC714VxNSZXF Series PC714VxNSZXF Series DIP 6 pin General Purpose Photocoupler ■ Description ■ Agency approvals/Compliance PC714VxNSZXF Series contains an IRED optically coupled to a phototransistor. It is packaged in a 6 pin DIP. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 80V and CTR is 50% to 600% at input current of 5mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC714V) 2. Approved by VDE, DIN EN60747-5-2 (∗) (as an option), file No. 40008189 (as model No. PC714V) 3. Package resin : UL flammability grade (94V-0) (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Features ■ Applications 1. 6 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO:80V) 4. High isolation voltage between input and output (Viso(rms) : 5.0kV) 5. Lead-free and RoHS directive compliant 1. Home appliances 2. Programmable controllers 3. Personal computer peripherals Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A04102EN Date Jun. 30. 2005 © SHARP Corporation PC714VxNSZXF Series ■ Internal Connection Diagram 1 1 6 2 5 2 3 4 3 4 5 6 Anode Cathode NC Emitter Collector NC ■ Outline Dimensions (Unit : mm) 2. Through-Hole (VDE option) [ex. PC714VxYSZXF] 1. Through-Hole [ex. PC714VxNSZXF] 1.2±0.3 ±0.3 1.2 ±0.2 ±0.2 0.6 4 PC714V Anode mark 1 2 ±0.5 3 5 4 1 2 3 Date code 7.12±0.3 7.12 7.62±0.3 7.62±0.3 Rank mark 2.9±0.5 0.5TYP. 3.5±0.5 Rank mark 2.9±0.5 Factory identification mark PC714V Anode mark Date code VDE Identification mark 4 0.5TYP. 5 6 3.5±0.5 6 SHARP mark "S" 6.5±0.5 SHARP mark "S" Factory identification mark 6.5±0.5 0.6 Epoxy resin 0.5±0.1 θ 2.54±0.25 θ θ : 0 to 13˚ Product mass : approx. 0.36g 0.5±0.1 3.25±0.5 2.54±0.25 3.25±0.5 Epoxy resin θ θ θ : 0 to 13˚ Product mass : approx. 0.36g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A04102EN 2 PC714VxNSZXF Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please Contact the local SHARP sales reprsentative to see the actual status of the production. Rank mark Refer to the Model Line-up Sheet No.: D2-A04102EN 3 PC714VxNSZXF Series ■ Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation Topr Operating temperature Tstg Storage temperature *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 6 70 80 6 50 150 170 −25 to +100 −40 to +125 5 260 (Ta=25˚C) Unit mA A V mW V V mA mW mW ˚C ˚C kV ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF VFM Peak forward voltage IR Reverse current Ct Terminal capacitance ICEO Collector dark current Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Current transfer ratio IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance fC Cut-off frequency tr Rise time Response time Fall time tf Conditions IF=20mA IFM=0.5A VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10µA, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=5V, IC=2mA, RL=100Ω −3dB VCE=2V, IC=2mA, RL=100Ω MIN. − − − − − 80 6 2.5 − 5×1010 − − − − TYP. 1.2 − − 30 − − − − 0.1 1×1011 0.6 80 4 3 MAX. 1.4 3.0 10 250 100 − − 30.0 0.2 − 1.0 − 18 18 (Ta=25˚C) Unit V V µA pF nA V V mA V Ω pF kHz µs µs Sheet No.: D2-A04102EN 4 PC714VxNSZXF Series ■ Model Line-up Through-Hole Sleeve Rank mark Package 50pcs/sleeve DIN EN60747-5-2 −−−−−− Approved PC714V0NSZXF PC714V0YSZXF with or without A PC714V1NSZXF PC714V1YSZXF B PC714V2NSZXF PC714V2YSZXF Model No. C PC714V3NSZXF PC714V3YSZXF A or B PC714V5NSZXF PC714V5YSZXF B or C PC714V6NSZXF PC714V6YSZXF A, B or C PC714V8NSZXF PC714V8YSZXF Lead Form IC [mA] (IF=5mA, VCE=5V, Ta=25˚C) 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 4.0 to 13.0 6.5 to 20.0 4.0 to 20.0 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A04102EN 5 PC714VxNSZXF Series Fig.1 Forward Current vs. Ambient Temperature Fig.2 Diode Power Dissipation vs. Ambient Temperature 60 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 -25 0 25 50 55 75 100 80 70 60 40 20 0 −25 125 0 Ambient temperature Ta (˚C) 250 Total power dissipation Ptot (mW) Collector power dissipation PC (mW) 200 150 100 50 0 −25 0 25 50 75 100 200 170 150 100 50 0 −25 125 0 Ambient temperature Ta (˚C) 10 Ta=25˚C Forward current IF (mA) 50˚C 1 0.1 10−2 10−1 125 Ta=75˚C Pulse width≤100µs 10−3 25 50 75 100 Ambient temperature Ta (˚C) Fig.6 Forward Current vs. Forward Voltage Fig.5 Peak Forward Current vs. Duty Ratio Peak forward current IFM (A) 125 Fig.4 Total Power Dissipation vs. Ambient Temperature Fig.3 Collector Power Dissipation vs. Ambient Temperature 0.01 25 100 50 55 75 Ambient temperature Ta (˚C) −25˚C 10 1 1 25˚C 0˚C 100 0 0.5 1 1.5 2 2.5 3 3.5 Forward voltage VF (V) Duty ratio Sheet No.: D2-A04102EN 6 PC714VxNSZXF Series Fig.8 Collector Current vs. Collectoremitter Voltage Fig.7 Current Transfer Ratio vs. Forward Current 30 200 180 Ta=25˚C 25 160 Collector current IC (mA) Current transfer ratio CTR (%) IF=30mA VCE=5V Ta=25˚C 140 120 100 80 60 40 PC (MAX.) 20mA 20 15 10mA 10 5mA 5 20 0 0 0 10 1 1 Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Collector-emitter saturation voltage VCE(sat) (V) Relative current transfer ratio (%) IF=5mA VCE=5V 100 50 25 50 4 5 6 7 8 9 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 150 0 3 Collector-emitter voltage VCE (V) Forward current IF (mA) 0 −25 2 75 100 0.14 IF=20mA IC=1mA 0.12 0.1 0.08 0.06 0.04 0.02 −25 0 Ambient temperature Ta (˚C) 20 40 60 80 100 Ambient temperature Ta(˚C) Fig.11 Collector Dark Current vs. Ambient Temperature Fig.12 Response Time vs. Load Resistance 10−5 VCE=2V Ta=25˚C IC=2mA VCE=50V 100 10−7 Response time (µs) Collector dark current ICEO (A) 10−6 10−8 10−9 tr tf 10 td ts 1 −10 10 10−11 −25 0.1 0 25 50 75 0.1 100 1 10 Load resistance RL (kΩ) Ambient temperature Ta (˚C) Sheet No.: D2-A04102EN 7 PC714VxNSZXF Series Fig.13 Test Circuit for Response Time Fig.14 Frequency Response Input VCC VCE=5V IC=2mA Ta=25˚C 0 Output RD RL 10% Output VCE Voltage gain Av (dB) Input 90% td ts tr tf RL=10kΩ 1kΩ 100Ω −10 Please refer to the conditions in Fig.12 −20 1 10 100 Frequency f (kHz) Fig.15 Test Circuit for Frequency Response VCC RD RL Output VCE Please refer to the conditions in Fig.14 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A04102EN 8 PC714VxNSZXF Series ■ Design Considerations ● Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A04102EN 9 PC714VxNSZXF Series ■ Manufacturing Guidelines ● Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A04102EN 10 PC714VxNSZXF Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A04102EN 11 PC714VxNSZXF Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabbed stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A04102EN 12 PC714VxNSZXF Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E219] Sheet No.: D2-A04102EN 13