ETC PCM12XA0

M
®
MPLAB ICE
Processor Module and Device Adapter Specification
CONTENTS
2.0
1.0 INTRODUCTION ................................................ 1
A brief overview of the different components of the system is shown in the figure below. Each component is
discussed in the following subsections.
2.0 TERMINOLOGY ................................................. 1
3.0 PROCESSOR MODULES .................................. 2
4.0 EMULATOR-RELATED ISSUES......................... 4
TERMINOLOGY
FIGURE 2-1:
5.0 DEVICE ADAPTER ISSUES .............................. 5
MPLAB ICE EMULATOR
SYSTEM
Host to Pod Cable
Emulator Pod
1.0
INTRODUCTION
Processor Module
The Processor Modules for MPLAB ICE are
interchangeable personality modules that allow
MPLAB ICE to be reconfigured for emulation of different PICmicro® microcontrollers (MCUs). This modularity allows the emulation of many different devices by
the addition of just a Processor Module and Device
Adapter, which makes for a very cost effective multiprocessor emulation system.
The Device Adapters for MPLAB ICE are interchangeable assemblies that allow the emulator system to
interface to a target application system. Device Adapters also have control logic that allows the target application to provide a clock source and power to the
Processor Module. The Device Adapters support PICmicro MCUs in DIP, SDIP, and PLCC packages.
Transition Sockets, used along with a Device Adapter,
provide a method of accommodating all PICmicro MCU
packages, including SOIC, SSOP, PQFP, and TQFP
packages.
Flexible Circuit
Cable
Logic Probe
Connector
Device
Adapter
Transition
Socket
2.1
Host to Pod Cable
This is a standard parallel interface cable. MPLAB ICE
is tested with a 6-foot cable. A longer cable may work,
but is not guaranteed. The cable connects to a parallel
port on the PC. If a PC has a printer connected to an
LPT device, it is recommended that an additional interface card be installed, rather than using a splitter or an
A/B switch.
2.2
Emulator Pod
The Emulator Pod contains emulator memory and control logic. MPLAB ICE 2000 contains a main board and
an additional board for expanded trace memory and
complex control logic. There are no field serviceable
parts in the pod. For more information on the pod, see
the MPLAB ICE User’s Guide (DS51159).
The MPLAB ICE Processor Module is inserted into the
pod for operation.
2.3
Processor Module
The Processor Module contains the emulator chip,
logic and low-voltage circuitry. There are no field serviceable parts mounted on the printed circuit board
housed within the Processor Module enclosure.
MPLAB is a registered trademark of Microchip Technology Inc.
PICMASTER is a registered trademark of Microchip Technology Inc.
 2001 Microchip Technology Inc.
DS51140D-page 1
MPLAB® ICE
2.4
Flex Circuit Cable
Once the Processor Module is inserted into the Emulator Pod, the flex circuit cable extends the emulator system to the target application. This is a custom cable that
is attached inside the Processor Module enclosure and
can be replaced in the field by removing the end cap of
the Processor Module enclosure.
Please, DO NOT PULL on the flex circuit cable to
remove the Processor Module from the pod. Use the
fins of the Processor Module end cap to leverage the
module from the pod.
2.5
Device Adapter
The Device Adapter provides a common interface for
the device being emulated. They are provided in standard DIP and PLCC styles. The adapter also contains
a special device that provides an oscillator clock to
accurately emulate the oscillator characteristics of the
PICmicro MCU.
2.6
Transition Socket
Transition Sockets are available in various styles to
allow a common Device Adapter to be connected to
one of the supported surface mount package styles.
Transition Sockets are available for various pin counts
and pitches for SOIC, QFP and other styles. For more
information on transition sockets, see the MPLAB ICE
Transition Socket Specification (DS51194).
An emulator system consists of the following components which are ordered separately:
• An Emulator Pod (including the host-to-pod cable
and power supply)
• A Processor Module (including the flex circuit
cable)
• A Device Adapter
• An optional Transition Socket (for surface mount
emulation)
3.0
PROCESSOR MODULES
Processor Modules are identified on the top of the
assembly (e.g., PCM17XA0). To determine which processors are supported by a specific module, refer to the
latest Development Systems Ordering Guide
(DS30177) or Product Line Card (DS00148). Both can
be found on our Web site (www.microchip.com).
A typical Processor Module contains a special bondout version of a PICmicro MCU, device buffers to control data flow and control logic. It provides the means of
configuring the MPLAB ICE emulator for a specific PICmicro MCU family and handles low-voltage emulation
when needed.
Note:
When removing the Processor Module,
DO NOT pull on the flex cable. Use the
tabs on the Processor Module or damage
to the flex cable may occur.
DS51140D-page 2
3.1
POWER
The operating voltage for most of the control logic and
buffering on the Processor Module is +5V and is
supplied by the Emulator Pod. Power to the emulator
processor and some of its surrounding buffers is user
selectable, and can be powered by the Emulator Pod
(at +5V only) or the target application system (from
2.0V to 5.5V). This is software selectable and is configurable through the MPLAB IDE software. At no time will
the emulator system directly power the target application system. ALWAYS insert the Processor Module into
the Emulator Pod before applying power to the pod.
When connecting to a target application system, the
user may notice a voltage level on the target application
even though they have not yet applied power to the target application circuit. This is normal, and is due to current leakage through VCC of the Device Adapter. The
current leakage will typically be less than 20 mA.
However, if the target application is using a voltage
regulator, it should be noted that some regulators
require the use of an external shunt diode between VIN
and VOUT for reverse-bias protection. Refer to the
manufacturer’s data sheets for additional information.
3.1.1
EMULATOR PROCESSOR POWER
SUPPLIED BY EMULATOR SYSTEM
If the emulator system is selected to power the
emulator processor in the Processor Module, the emulator system can be operated without being connected
to a target application. If the system is being connected
to a target application, the power to the pod should be
applied before applying power to the target application.
Note that the target application system’s VCC will experience a small current load (10 mA typical) when the
emulator system is connected via a Device Adapter.
This is because the target system must always power
the clock chip in the Processor Module.
3.1.2
EMULATOR PROCESSOR POWER
SUPPLIED BY TARGET APPLICATION
SYSTEM
When the MPLAB IDE software is brought up, the emulator system is first initialized with the emulator system
powering the emulator processor. The “Processor
Power Supplied by Target Board” option may then be
selected using the Power tab of the Options>Development Mode dialog to power the Processor Module from
the target board.
When operating from external power, the Processor
Module will typically represent a current load equivalent
to the device being emulated (according to its data
sheet) plus approximately 100 mA. Keep in mind that
the target application will affect the overall current load
of the Processor Module, dependent upon the load
placed upon the processor I/O.
 2001 Microchip Technology Inc.
Processor Module and Device Adapter Specification
When the processor power is supplied by the target
application system, an external clock (from the target
board) may also be provided. MPLAB IDE will not allow
use of an external clock without the use of external
power.
3.1.3
OPERATING VOLTAGE OF 4.6 TO 5.5
VOLTS
If the target application system’s operating voltage is
between 4.55V (±120 mV) and 5.5V, the Processor
Module will consider this a STANDARD VOLTAGE
condition. In this mode the processor can run to its
highest rated speed (as indicated in its data sheet).
The recommended power-up sequence is:
1.
2.
3.
4.
5.
6.
Apply power to the PC host.
Apply power to the Emulator Pod and Processor
Module assembly.
Invoke MPLAB IDE.
Configure system for Processor Power Supplied
by Target Board through the Power tab of the
Options/Development Mode dialog box.
At the error message, apply power to the target
application circuit. Then acknowledge the error.
Issue a System Reset (from the Debug Menu)
before proceeding.
3.1.4
OPERATING VOLTAGE OF 2.0 TO 4.6
VOLTS
If the target application system’s operating voltage is
between 2.0V and 4.55V (±120 mV), the Processor
Module will consider this a LOW VOLTAGE condition.
In this mode the processor is limited to its rated speed
at a given voltage level (as indicated in its data sheet).
To minimize the amount of reverse current that the target system is exposed to, the recommended power-up
sequence is:
1.
2.
3.
4.
5.
6.
7.
Apply power to the PC host.
Apply power to the Emulator Pod and Processor
Module assembly.
Invoke MPLAB IDE.
Configure system for Processor Power Supplied
by Target Board through the Power tab of the
Options/Development Mode dialog box.
At the error message, apply power to the target
application circuit. Then acknowledge the error.
Issue a System Reset (from the Debug Menu)
before proceeding.
Select Options > Development Mode and click
the Power tab. Verify that the dialog says “Low
Voltage Enabled.” Click Cancel to close the dialog.
3.2
OPERATING FREQUENCY
The Processor Modules will support the maximum
frequency (except where noted in Section 4.0) of the
device under emulation. Note that the maximum frequency of a PICmicro MCU device is significantly lower
when the operating voltage is less than 4.5V.
The Processor Modules will support a minimum
frequency of 32 kHz. When operating at low frequencies, response to the screen may be slow.
3.3
CLOCK OPTIONS
MPLAB ICE allows internal and external clocking.
When set to internal, the clock is supplied from the
internal programmable clock, located in the Emulator
Pod. When set to external, the oscillator on the target
application system will be utilized.
3.3.1
CLOCK SOURCE FROM EMULATOR
Refer to the MPLAB ICE User’s Guide (DS51159),
“Chapter 3, Using the On-Board Clock” for configuring
MPLAB IDE to supply the clock source.
3.3.2
CLOCK SOURCE FROM THE TARGET
APPLICATION
If the Target Application is selected to provide the clock
source, the target board must also be selected to
power the emulator processor (see the MPLAB ICE
User’s Guide (DS51159), “Chapter 3. Using a Target
Board Clock”).
At low voltage, the maximum speed of the processor
will be limited to the rated speed of the device under
emulation.
An oscillator circuit on the Device Adapter generates a
clock to the Processor Module and buffers the clock circuit on the target board. In this way, the MPLAB ICE
emulator closely matches the oscillator options of the
actual device. All oscillator modes are supported (as
documented in the device’s data sheet) except as
noted in Section 4.0. The OSC1 and OSC2 inputs of
the Device Adapter have a 5 pF to 10 pF load. Note this
when using a crystal in HS, XT, LP or LF modes, or an
RC network in RC mode.
The frequency of the emulated RC network may vary
relative to the actual device due to emulator circuitry. If
a specific frequency is important, adjust the RC values
to achieve the desired frequency. Another alternative
would be to allow the emulator to provide the clock as
described in Section 3.3.1.
3.4
ESD PROTECTION AND ELECTRICAL
OVERSTRESS
All CMOS chips are susceptible to electrostatic
discharge (ESD). In the case of the Processor Modules, the pins of the CMOS emulator are directly connected to the target connector, making the chip
vulnerable to ESD. Note that ESD can also induce
 2001 Microchip Technology Inc.
DS51140D-page 3
MPLAB® ICE
latch-up in CMOS chips, causing excessive current
through the chip and possible damage. MPLAB ICE
has been designed to minimize potential damage by
implementing over-current protection and transient
suppressors. However, care should be given to minimizing ESD conditions while using the system.
4.0
EMULATOR-RELATED ISSUES
The following general limitations apply to the MPLAB
ICE 2000 Emulator.
The MPLAB ICE system allows the option of “freezing”
peripheral operation or allowing them to continue operating when the processor is halted. This option is configured in the MPLAB IDE. The Freeze function is
available on all Processor Modules except the
PCM16XA0.
• All configuration bit settings are enabled/disabled
through Options>Development Mode of MPLAB
IDE rather than through MPASM _ _CONFIG
directive.
• The Reset Processor (Debug>Run>Reset) function in MPLAB IDE will not currently wake the processor if it is in SLEEP mode. To wake the
processor, you must use Debug>System Reset.
• Do not single step into a SLEEP instruction. If you
do step into a SLEEP instruction, you will need to
select Debug>System Reset in order to wake up
the processor module.
• Initiating a master clear on the MCLR pin will not
reset the processor if you are in step or animate
mode.
• Debug > Power On Reset randomizes GPRs,
(i.e., SFR's are not set to POR values). This can
help in debugging. If your application works on the
emulator but not the simulator, try using this feature.
This function is useful to halt an on-board timer while at
a break point. Note that at a break point and while single stepping, interrupts are disabled.
Device-specific limitations can be found in MPLAB IDE
by selecting Options > Development Mode and clicking
the Details button.
During development, contention on an I/O pin is possible (e.g., when an emulator pin is driving a ‘1’ and the
target board is driving a ‘0’). Prolonged contention may
cause latch-up and damage to the emulator chip. One
possible precaution is to use current limiting resistors
(~100 Ω) during the development phase on
bidirectional I/O pins. Using limiting resistors can also
help avoid damage to modules, device adapters and
pods that occurs when a voltage source is accidentally
connected to an I/O pin on the target board.
3.5
FREEZE MODE
DS51140D-page 4
 2001 Microchip Technology Inc.
Processor Module and Device Adapter Specification
5.0
DEVICE ADAPTER ISSUES
This section details processor-specific considerations
that have been made on Device Adapters. Only adapters with special considerations are listed.
There will be a max of 10 mA of current draw from the
users target system even when the emulator Processor
Module is being powered by the emulator system, and
running internal clock. This is due to components on
the Device Adapter being powered by the user target
board.
5.1
DVA12XP080
This Device Adapter is intended for use with
PIC12C50X 8-pin DIP devices. It has four mechanical
switches that allow target pins GP2 to GP5 to be routed
to the emulator silicon on the PCM16XA0 Processor
Module or the oscillator chip on the Device Adapter, as
shown in Table 5-1.
In addition, a 24C00 EEPROM (U1) is connected to
RA0 and RA1 of the emulator silicon to support the
EEPROM capabilities of the PIC12CE51X family
devices. For information on how to use EEPROM
memory, see the online device-specific limitations for
the PCM16XA0, PIC12CE518/519 devices by selecting Options > Development Mode and clicking the
Details button.
5.2
DVA12XP081
This Device Adapter is intended for use with
PIC12C67X 8-pin DIP devices. It has two mechanical
switches that allow target pins GP4 and GP5 to be
routed to the emulator silicon on the PCM12XA0 Processor Module or the oscillator device on the Device
Adapter, as shown in Table 5-2.
5.3
DVA16XP140
This Device Adapter is intended for use with the
PIC16C505 14-pin DIP device. It has four mechanical
switches. Two of the switches allow target pins RB4
and RB5 to be routed to the emulator silicon on the
PCM16XA0 Processor Module or the oscillator device
on the Device Adapter. The other two switches control
the routing of RB3 and RC5 signals. RB3 can be a general-purpose input or MCLR. RC5 can be a general
purpose I/O or can drive the TOCKI input, as shown in
Table 5-3.
5.4
DVA16XP182
This Device Adapter is intended for use with
PIC16C712/716 18-pin DIP devices. It has a second
oscillator device that allows TIMER1 oscillator input
ranging from 32-40 kHz. It has four mechanical
 2001 Microchip Technology Inc.
switches. Target pins RB1 and RB2 can be routed to
the emulator silicon on the PCM16XE1 Processor Module or the TIMER1 oscillator device on the Device
Adapter. Target pin RB1 is routed to T1CKI. Target pin
RB3 can be a general purpose input or CCP1, as
shown in Table 5-4.
5.5
DVA16XP200
This Device Adapter is intended for use with
PIC16C770/771 20-pin DIP devices. It has three
mechanical switches that allow target pins RA6 and
RA7 to be routed to the emulator silicon on the
PCM16XM0 Processor Module or the oscillator device
on the Device Adapter. Target pin RA5 routed MCLR of
the emulator silicon on the PCM16XM0, as shown in
Table 5-5.
Target pins RB6 and RB7 can be routed (via software)
to the emulator silicon of the PCM16XM0 or to a second oscillator supporting a TIMER1 oscillator input
ranging from 32 to 40 kHz.
5.6
DVA16XP282, DVA16XP401,
DVA16XL441, and DVA16PQ441
These Device Adapters are intended for use with PICmicro MCU devices supported by the PCM16XB0/B1,
PCM16XE0/E1, PCM16XK0, PCM16XL0, and the
PCM18XA0 Processor Modules. The Device Adapters
have a second oscillator device that allows TIMER1
oscillator input ranging from 32 to 40 kHz.
For PCM16XB0/B1, PCM16XE0/E1, PCM16XK0 and
PCM16XL0, configure jumper J1 per Table 5-6.
For PCM18XA0 leave the jumper on pins 1-2 (OFF);
the timer1 oscillator enable/disable function is software
configurable.
5.7
DVA17xxxx0
These Device Adapters are intended for use with PICmicro MCU devices supported by the PCM17XA0 Processor Module. In all processors in EC mode, OSC/4 is
not supported. OSC/4 in EC mode is supported in
DVA17xxxx1 Device Adapters.
5.8
Emulating a .600 28-Pin Part
When emulating a .600 wide, 28-pin device, an adapter
will be needed to convert the standard .300 wide
socket on the Device Adapters to the .600 wide socket
on the target board.
There are many adapters available for this purpose,
such as Digi-Key part number A502-ND.
DS51140D-page 5
MPLAB® ICE
TABLE 5-1:
DVA12XP080 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function
Switch Positions
RB2
Set S4 to RB2.
RB3
Set S3 to RB3.
RB4
Set S2 to RB4.
RB5
Set S1 to RB5.
MCLR
Set S3 to MCLR.
External Oscillator Input
Set S1 to OSC1 and
set S2 to OSC2.
TIMER0 Clock Input
Set S4 to T0CLK.
TABLE 5-2:
DVA12XP081 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function
GP4
Switch Positions
Set S2 to GP4.
GP5
Set S1 to GP5.
External Oscillator Input
Set S1 to OSC1 and
set S2 to OSC2.
TABLE 5-3:
DVA16XP140 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function
Switch Positions
RC5
Set S4 to RC5.
RB3
Set S3 to RB3.
RB4
Set S2 to RB4.
RB5
Set S1 to RB5.
MCLR
Set S3 to MCLR.
External Oscillator Input
Set S1 to OSC1 and
set S2 to OSC2.
TIMER0 Clock Input
Set S4 to TOCKI.
DS51140D-page 6
 2001 Microchip Technology Inc.
Processor Module and Device Adapter Specification
TABLE 5-4:
DVA16XP182 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function
Switch Positions
RB1
Set S2-1 to position B.
RB2
Set S2-2 to position B.
RB3
Set S2-3 to position B.
CCP1
Set S2-3 to position A.
TIMER1 Clock Input
Set S2-1 to position A and
set S1 to position B.
TIMER1 Oscillator Input
Set S2-1 to position A and
set S2-2 to position A and
set S1 to position A.
TABLE 5-5:
DVA16XP200 DEVICE ADAPTER SWITCH ASSIGNMENT
Desired Function
Switch Positions
RA5
Set S1 to RA5.
RA6
Set S3 to RA6.
RA7
Set S2 to RA7.
MCLR
Set S1 to MCLR.
External Oscillator Input
Set S3 to OSC1 and
set S2 to OSC2.
TABLE 5-6:
DVA16XP282, DVA16XP401, DVA16XL441, AND DVA16PQ441 JUMPER SETTINGS
Desired Function
Switch Positions
TIMER1 Oscillator Input enabled
Short J1 pins 2-3 (ON).
TIMER1 Oscillator Input disabled
Short J1 pins 1-2 (OFF).
 2001 Microchip Technology Inc.
DS51140D-page 7
MPLAB® ICE
NOTES:
DS51140D-page 8
 2001 Microchip Technology Inc.
Processor Module and Device Adapter Specification
NOTES:
 2001 Microchip Technology Inc.
DS51140D-page 9
MPLAB® ICE
NOTES:
DS51140D-page 10
 2001 Microchip Technology Inc.
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© 2001, Microchip Technology Incorporated, Printed in the
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 2001 Microchip Technology Inc.
DS51140D-page 11
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Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Arizona Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Germany
Analog Product Sales
Lochhamer Strasse 13
D-82152 Martinsried, Germany
Tel: 49-89-895650-0 Fax: 49-89-895650-22
Italy
Arizona Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
01/30/01
All rights reserved. © 2001 Microchip Technology Incorporated. Printed in the USA. 3/01
Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by
updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual
property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights
reserved. All other trademarks mentioned herein are the property of their respective companies.
DS51140D-page 12
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 2001 Microchip Technology Inc.