2SK3131 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSV) 2SK3131 Chopper Regulator DC−DC Converter and Motor Drive Applications z Fast reverse recovery time Unit: mm : trr = 105 ns (typ.) z Built-in high-speed free-wheeling diode z Low drain−source ON resistance : RDS (ON) = 0.085 Ω (typ.) z High forward transfer admittance : |Yfs| = 35 S (typ.) z Low leakage current : IDSS = 100 μA (max) (VDS = 500 V) z Enhancement mode : Vth = 2.4 to 3.4 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain−source voltage VDSS 500 V Drain−gate voltage (RGS = 20 kΩ) VDGR 500 V Gate−source voltage VGSS ±30 V (Note 1) ID 50 A JEDEC — Pulse (Note 1) IDP 200 A JEITA — Drain power dissipation (Tc = 25°C) PD 250 W Single pulse avalanche energy (Note 2) EAS 525 mJ Avalanche current IAR 50 A Repetitive avalanche energy (Note 3) EAR 25 mJ Channel temperature Tch 150 °C Storage temperature range Tstg −55 to 150 °C DC Drain current DC TOSHIBA 2-21F1B Weight: 9.75 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance, channel to case Rth (ch−c) 0.5 °C / W Thermal resistance, channel to ambient Rth (ch−a) 35.7 °C / W Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: VDD = 90 V, Tch = 25°C (initial), L = 357 μH, RG = 25 Ω, IAR = 50 A Note 3: Repetitive rating: pulse width limited by maximum channel temperature. This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2009-09-29 2SK3131 Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Gate−source breakdown voltage Drain cut−off current Drain−source breakdown voltage Symbol Test Condition Min Typ. Max Unit IGSS VGS = ±25 V, VDS = 0 V — — ±10 μA V (BR) GSS IG = ±100 μA, VDS = 0 V ±30 — — V IDSS VDS = 500 V, VGS = 0 V — — 100 μA V (BR) DSS ID = 10 mA, VGS = 0 V 500 — — V Vth VDS = 10 V, ID = 1 mA 2.4 — 3.4 V Drain−source ON resistance RDS (ON) VGS = 10 V, ID = 25 A — 0.085 0.11 Ω Forward transfer admittance |Yfs| VDS = 10 V, ID = 25 A 15 35 — S Input capacitance Ciss — 11000 — Reverse transfer capacitance Crss — 2100 — Output capacitance Coss — 4200 — tr — 105 — ton — 160 — Gate threshold voltage Rise time Turn−on time VDS = 10 V, VGS = 0 V, f = 1 MHz Switching time pF ns Fall time tf — 65 — toff — 245 — Total gate charge (Gate−source plus gate−drain) Qg — 280 — Gate−source charge Qgs — 150 — Gate−drain (“miller”) charge Qgd — 130 — Turn−off time VDD ≈ 400 V, VGS = 10 V, ID = 50 A nC Source−Drain Ratings and Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Continuous drain reverse current (Note 1) IDR — — — 50 A Pulse drain reverse current (Note 1) IDRP — — — 200 A Forward voltage (diode) VDSF VDR = 25 A, VGS = 0 V — — −1.7 V Reverse recovery time trr — 105 — ns Reverse recovery charge Qrr IDR = 50 A, VGS = 0 V dIDR / dt = 100 A / μs — 380 — nC Marking TOSHIBA 2SK3131 Note 4: A line under a Lot No. identifies the indication of product Labels. Part No. (or abbreviation code) Not underlined: [[Pb]]/INCLUDES > MCV Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Lot No. JAPAN Note 4 Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2 2009-09-29 2SK3131 3 2009-09-29 2SK3131 4 2009-09-29 2SK3131 RG = 25 Ω VDD = 90 V, L = 357 μH 5 EAS = 1 BVDSS ⎛ ⎞ ⋅ L ⋅ I2 ⋅ ⎜ ⎟ 2 ⎝ BVDSS − VDD ⎠ 2009-09-29 2SK3131 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. 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Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2009-09-29