DATA SHEET Solid State Relay OCMOS FET PS7241E-1B 4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET −NEPOC Series− DESCRIPTION The PS7241E-1B is an optically coupled element that combines a GaAs infrared LED on the input side with a normally close MOS FET on the output side to realize an excellent cost performance. The small, thin package and high sensitivity of this element makes it ideal for battery-driven mobile devices, and its small offset voltage at power-on and good linearity also make it suitable for controlling micro analog signals. FEATURES PIN CONNECTION (Top View) • Small and thin package (4-pin SOP, Height = 2.1 mm) • 1 channel type (1 b output) 4 3 • Low LED operating current (IF = 3 mA) • Designed for AC/DC switching line changer 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET • Low offset voltage • Ordering number of taping product: PS7241E-1B-E3, E4, F3, F4 • Pb-Free product <R> 1 • Safety standards 2 • UL approved: File No. E72422 • BSI approved: File No. 8241/8242 APPLICATIONS • Laptop PC, PDA • Modem card • Telephone, FAX • Measurement equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PN10552EJ03V0DS (3rd edition) Date Published June 2006 NS CP(K) Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2005, 2006 PS7241E-1B PACKAGE DIMENSIONS (UNIT: mm) 4.0±0.5 0.05+0.08 –0.05 2.05+0.08 –0.05 0.15+0.10 –0.05 7.0±0.3 4.4 0.5±0.3 2.54 0.40+0.10 –0.05 0.25 M MARKING EXAMPLE 41EB N 603 No. 1 pin Mark Initial of NEC (Engraved mark) Assembly Lot N *1 N 6 03 Week Assembled Year Assembled (Last 1 Digit) Rank Code *1 2 Bar : Pb-Free Data Sheet PN10552EJ03V0DS PS7241E-1B <R> ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification PS7241E-1B PS7241E-1B-A PS7241E-1B-E3 PS7241E-1B-E3-A PS7241E-1B-E4 PS7241E-1B-E4-A PS7241E-1B-F3 PS7241E-1B-F3-A PS7241E-1B-F4 PS7241E-1B-F4-A Pb-Free Magazine case 100 pcs Standard products Embossed Tape 900 pcs/reel (UL, BSI approved) *1 PS7241E-1B Embossed Tape 3 500 pcs/reel *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V PD 50 mW IFP 1 A Break Down Voltage VL 400 V Continuous Load Current IL 120 mA Pulse Load Current (AC/DC Connection) ILP 240 mA Power Dissipation PD 300 mW BV 1 500 Vr.m.s. Total Power Dissipation PT 350 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C Diode Power Dissipation Peak Forward Current MOS FET *1 *2 Isolation Voltage *3 *1 PW = 100 µs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. Data Sheet PN10552EJ03V0DS 3 PS7241E-1B RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF 3 10 20 mA LED Off Voltage VF 0 0.5 V ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode MOS FET Coupled Symbol Conditions MIN. TYP. MAX. Unit 1.2 1.4 V 5.0 µA 1.0 µA Forward Voltage VF IF = 10 mA Reverse Current IR VR = 5 V Off-state Leakage Current ILoff IF = 10 mA, VD = 400 V 0.03 Output Capacitance Cout IF = 10 mA, VD = 0 V, f = 1 MHz 206 LED Off-state Current IFoff IL = 120 mA On-state Resistance Ron1 IF = 0 mA, IL = 10 mA pF 3.0 mA 22 35 Ω Ron2 IF = 0 mA, IL = 120 mA, t ≤ 10 ms 17 24 *1, 2 ton IF = 10 mA, VO = 5 V, RL = 500 Ω, 0.07 0.2 *1, 2 toff PW ≥ 10 ms 1.0 3.0 Turn-on Time Turn-off Time Isolation Resistance RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz 10 ms Ω 9 0.5 pF *1 Test Circuit for Switching Time IF Pulse Input VL Input 50% 0 VO = 5 V Input monitor 90% VO monitor Output Rin RL 10% toff <R> ton *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. 4 Data Sheet PN10552EJ03V0DS PS7241E-1B TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE 300 Maximum Load Current IL (mA) Maximum Forward Current IF (mA) 100 80 60 40 20 0 –25 0 25 7585 50 200 100 0 –25 100 0 25 75 85 50 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 1.6 100 200 IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1.2 1.0 1 mA 0.8 –25 0 25 50 75 Output Capacitance Cout (pF) 1.4 150 100 50 0 100 20 40 60 80 100 120 Ambient Temperature TA (˚C) Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE LOAD CURRENT vs. LOAD VOLTAGE 10–5 200 IF = 10 mA IF = 0 mA TA = 85˚C 10–6 Load Current IL (mA) Forward Voltage VF (V) f = 1 MHz Off-state Leakage Current ILoff (A) <R> 10–7 25˚C 10–8 10–9 0 100 200 300 400 100 –4.0 500 –2.0 0 2.0 4.0 –100 –200 Load Voltage VL (V) Applied Voltage VD (V) Remark The graphs indicate nominal characteristics. Data Sheet PN10552EJ03V0DS 5 PS7241E-1B NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION 30 Normalized to 1.0 at TA = 25˚C, IF = 0 mA, IL = 10 mA 2.5 2.0 1.5 1.0 n = 50 pcs, IF = 0 mA, IL = 10 mA 25 Number (pcs) Normalized On-state Resistance Ron 3.0 20 15 10 5 0.5 0.0 –25 0 25 50 75 0 100 21 22 23 24 Ambient Temperature TA (˚C) On-state Resistance Ron (Ω) TURN-ON TIME vs. FORWARD CURRENT TURN-OFF TIME vs. FORWARD CURRENT 0.30 3.0 VO = 5 V VO = 5 V 2.5 Turn-off Time toff (ms) Turn-on Time ton (ms) 0.25 0.20 0.15 0.10 0 2.0 1.5 1.0 0.5 0.05 5 10 15 20 25 30 0 5 Forward Current IF (mA) 20 25 TURN-OFF TIME DISTRIBUTION 15 10 5 n = 50 pcs, IF = 10 mA, VO = 5 V 25 Number (pcs) Number (pcs) 20 0 15 30 n = 50 pcs, IF = 10 mA, VO = 5 V 25 10 Forward Current IF (mA) TURN-ON TIME DISTRIBUTION 30 20 15 10 5 0.04 0.06 0.08 0.10 0 0.12 Turn-on Time ton (ms) 0.8 1.0 1.2 1.4 Turn-off Time toff (ms) Remark The graphs indicate nominal characteristics. 6 25 Data Sheet PN10552EJ03V0DS 1.6 30 PS7241E-1B NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE 3.0 Normalized to 1.0 at TA = 25˚C, IF = 10 mA, VO = 5 V 2.5 2.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 100 Normalized Turn-off Time toff Normalized Turn-on Time ton 3.0 Normalized to 1.0 at TA = 25˚C, IF = 10 mA, VO = 5 V 2.5 2.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 100 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. Data Sheet PN10552EJ03V0DS 7 PS7241E-1B TAPING SPECIFICATIONS (in millimeters) 1.55±0.1 2.9 MAX. 12.0±0.2 5.5±0.05 1.5+0.1 –0 7.4±0.1 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.4±0.1 4.6±0.1 0.3 8.0±0.1 Tape Direction PS7241E-1B-E3 PS7241E-1B-E4 Outline and Dimensions (Reel) 2.0±0.5 φ 60 +1 –0 R 1.0 φ 180+0 –1.5 2.0±0.5 φ13.0±0.2 φ 21.0±0.8 13.5±1.0 17.5±1.0 Packing: 900 pcs/reel 8 Data Sheet PN10552EJ03V0DS 11.9 to 15.4 Outer edge of flange PS7241E-1B 1.55±0.1 2.9 MAX. 12.0±0.2 5.5±0.05 1.5+0.1 –0 7.4±0.1 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.4±0.1 4.6±0.1 0.3 8.0±0.1 Tape Direction PS7241E-1B-F4 PS7241E-1B-F3 Outline and Dimensions (Reel) φ 21.0±0.8 φ 100±1.0 R 1.0 φ 13.0±0.2 2.0±0.5 φ13.0±0.2 φ 330±2.0 2.0±0.5 13.5±1.0 17.5±1.0 Packing: 3 500 pcs/reel Data Sheet PN10552EJ03V0DS 11.9 to 15.4 Outer edge of flange 9 PS7241E-1B RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) <R> (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 10 Data Sheet PN10552EJ03V0DS PS7241E-1B <R> USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10552EJ03V0DS 11 PS7241E-1B • The information in this document is current as of June, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PN10552EJ03V0DS PS7241E-1B Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: [email protected] Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604