FREQUENCY QESM07 SMD 3.0x2.5 Crystal – Ceramic SMD packaged Specification (Rev-A) Electrical Characteristics ......................................................P01 ESR vs. frequency range and Mode of vibration ..................P01 Mechanical Characteristics ...................................................P01 Ordering Information .............................................................P02 Suggested Reflow Soldering profile ......................................P02 Tape Drawing........................................................................P03 Reel Drawing ........................................................................P03 Frequency QESM07 SMD 3.2x2.5 Crystal – Ceramic SMD packaged June 26th, 2006 Specification (rev-A) Electrical Characteristics Electrical Parameters Unit Frequency range MHz Minimum Typical Maximum 13 Test conditions 54 Frequency Tolerance (at 25°C) ± ppm 10 15 30 Refer to Ordering Information ± ppm 10 15 30 Refer to Ordering Information -20/+70 -40/+85 Refer to Ordering Information Temperature Stability Operating Temperature Range °C Storage temperature range °C Shunt capacitance C0 pF Load capacitance pF Drive level µW Aging (First Year) -40 +85 3.0 8pF ~ 12pF 10 100 ± ppm Insulator resistance Refer to Ordering Information 300 2 MΩ Ref at 25°C 500 At 100VDC Customized specification upon request ESR vs. frequency range and Mode of vibration Frequency range (MHz) 13.000 to 19.999 20.000 to 25.999 26.000 to 54.000 Mode of vibration Max ESR (Ω) Fundamental (AT-cut) Fundamental (AT-cut) Fundamental (AT-cut) 80 70 50 Mechanical Characteristics Line 1 Line 2 Marking for QESM06 Temex code (3 digits) T+date code (2digits) Mechanical conditions Vibration 10g, 10Hz to 2KHz according to standard CEI 68-2-63 Shocks 100g, 6ms according to standard CEI 68-227 Note 1 : Pin 2 and Pin 4 are connected through cover. In case connected to GND, frequency might be drifted. Note 2 : QESM07 is fully RoHS compliant. H = 0.65 ± 0.10 mm 1 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. Frequency QESM07 SMD 3.2x2.5 Crystal – Ceramic SMD packaged June 26th, 2006 Specification (rev-A) Ordering Information Part numbering system HQ QESM07 1 10 Package type Vibration mode Frequency tolerance SMD Package QESM07 : SMD ceramic 3.2 x 2.5 1=Fundamental 10=±10ppm 20=±20ppm 30=±30ppm 10 10 14.7456MHZ Operating temperature range Frequency stability Load Capacitance Nominal Frequency (MHz) D=-40°C F= -30°C H=-20°C J=-10°C L=0°C M=+50°C N=+55°C O=+60°C Q=+70°C T=+85°C 10=±10ppm 20=±20ppm 30=±30ppm 10=10pF Please enter the nominal frequency Please, enter the value of load capacitance Suggested Reflow Soldering Profile 2 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. Frequency QESM07 SMD 3.2x2.5 Crystal – Ceramic SMD packaged June 26th, 2006 Specification (rev-A) Tape Drawing Item Code Dimension Tolerance P 4.0 ± 0.1 Po 4.0 ± 0.1 P1 2.0 ± 0.1 W 8.0 ± 0.3 W0 3.5 ± 0.1 A 3.5 ± 0.1 B 2.8 ± 0.1 Gap of hold down tape and carrier tape W2 0.5 ± 0.1 Diameter of sprocket hole Do ∅ 1.5 ± 0.05 Diameter of feed hole D1 ∅ 1.5 ± 0.25 K 1.0 ± 0.1 Pitch of components Pitch of sprocket hole Length from hole center to component center Width of carrier tape Width of adhesive tape Height of component hole Width of component hole Total of tape thickness Reel Drawing 9.5 2.5 Multiple : 2000pcs per reel Ø 178 Ø13.5 Ø 60 Ø21.6 1.6 3 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.