Page No. : 1/9 RS2596 150KHz, 3A PWM Buck DC/DC Converter General Description The RS2596 is Monolithic IC that design for a step‐down DC/DC Converter, and own the ability of driving a 3A load without additional transistor component. The output version included 3.3V, 5V, 12V and an adjustable type. It operates at a switching frequency of 150KHz thus allowing smaller sized filter components than what would be needed with lower frequency switching regulators. Other features include a guaranteed ±4% tolerance on output voltage under specified input voltage and output load conditions, and ±15% on the oscillator frequency. Regarding protected function, thermal shutdown is to prevent over temperature operating from damage, and current limit is against over current operating of the output switch. Features Applications ● ● ● ● ● ● ● ● ● ● ● Simple High‐efficiency step‐down regulator 3.3V, 5V, 12V and adjustable ● Positive to negative converter Adjustable version output voltage range: 1.23‐37V ● On‐card switching regulators ±4% max over line and load conditions 150KHz ±15% fixed switching frequency TTL shutdown capability Operating voltage can be up to 40V Output load current: 3A TO220‐5 and TO263‐5 packages Low power standby mode Thermal‐shunt down and current‐limit protection ● Built‐in switching a transistor on chip, requires only 4 external components Application Circuits Adjustable Output Voltage Versions This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DS‐RS2596‐07 September, 2009 www.Orister.com Page No. : 2/9 Pin Assignments TO‐263‐5 TO‐220‐5 PACKAGE TO‐263‐5 PIN 1 2 3, 6 4 5 SYMBOL VIN VOUT GND FB SD DESCRIPTION Regulator Input Pin Regulator Output Pin Ground Pin Output Voltage Feed Back Control Pin ON/OFF Shutdown Pin PIN 1 2 3, 6 4 5 SYMBOL VIN VOUT GND FB SD DESCRIPTION Regulator Input Pin Regulator Output Pin Ground Pin Output Voltage Feed Back Control Pin ON/OFF Shutdown Pin PACKAGE TO‐220‐5 Ordering Information DEVICE RS2596‐XX Y Z DEVICE CODE XX is nominal output voltage (for example, AD=ADJ, 33 = 3.3V, 50 = 5.0V, 12 = 12V). Y is package designator : U : TO‐263‐5 E : TO‐220‐5 Z is Lead Free designator : P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package G: Green (Halogen Free with Commercial Standard) Block Diagram SD VIN + Current Source Bias 1.235V Reference 2.5V Regulator Start Up 200mV + 220mV R + COMP Current Limit FB R2 + AMP - R1=2.5K DS‐RS2596‐07 September, 2009 + COMP - COMP + COMP + 3A Switch Driver 150KHz OSC. Thermal Limit Output GND www.Orister.com Page No. : 3/9 Absolute Maximum Ratings (Note1) Parameter Supply Voltage On/Off Pin Input Voltage Feedback Pin Voltage Output Voltage to Ground Power Dissipation Operating Temperature Storage Temperature Operating Junction Temperature Range Operating Voltage Symbol VCC VSD VFB VOUT PD Topr Tstg TJ VOP Value 40 ‐0.3~+25 ‐0.3~+25 ‐1 Internally Limited 0~+70 ‐65~+150 ‐40~+125 +4.5~+40 Unit V V V V W o C o C o C V Electrical Characteristics (Continued) Specifications with boldface type apply over for full operating temperature range, the other type are for TJ=25oC(Note 2) Part No. RS2596‐3.3V RS2596‐5.0V RS2596‐12V RS2596‐ADJ Parameter Symbol Conditions Output Voltage VOUT 5V≤VIN≤40V, 0.2A≤ILOAD≤3A Efficiency η VIN =12V, ILOAD=3A Output Voltage VOUT 7V≤VIN≤40V, 0.2A≤ILOAD≤3A Efficiency η VIN=12V, ILOAD=3A Output Voltage VOUT 15V≤VIN≤40V, 0.2A≤ILOAD≤3A Efficiency η Reference Voltage VFB Efficiency η VIN=25V, ILOAD=3A 4.5V≤VIN≤40V, 0.2A≤ILOAD≤3A VOUT programmed for 3V VIN=12V, ILOAD=3A DS‐RS2596‐07 September, 2009 Typ. Max. Unit (Note3) (Note4) 3.168 3.342 3.3 V 3.135 3.465 ‐ 72 ‐ % 4.800 5.200 5.0 V 5.250 4.750 ‐ 79 ‐ % 11.52 12.48 12.0 V 11.40 12.60 ‐ 90 ‐ % 1.267 1.193 1.230 V 1.280 ‐ 72 ‐ % Min. www.Orister.com Page No. : 4/9 All Output Voltage Versions Electrical Characteristics Specifications with boldface type apply over for full operating temperature range, the other type are for TJ=25oC (Unless otherwise specified, VIN=12V for the 3.3V, 5V, and adjustable version and VIN=24V for the 12V version, ILOAD=500mA) Parameter Symbol Feedback Bias Current Ib Oscillator Frequency Test Condition Device Parameters Min. Typ. Adjustable Version Only, VFB=1.3V ‐ 40 fO (Note 5) 127 110 150 Saturation Voltage VSAT IOUT=3A (Note 6,7) ‐ 1.16 Max. Duty Cycle (ON) Min. Duty Cycle (OFF) DC ‐ 100 0 Current Limit ICL Peak Current (Note 6,7) 3.6 ‐ Output Leakage Current Quiescent Current IL IQ Output=0V (Note 6,8) (Note 8) ‐ ‐ ‐ 5 Standby Quiescent Current ISTBY ON/OFF pin=5V (Note 9) ‐ 85 ‐ ‐ ‐ ‐ 2.5 3.5 28 30 (Note 7) (Note 8) TO220‐5L Junction to Case TO263‐5L θJA(Note TO220‐5L Junction to ambient 10) TO263‐5L ON/OFF Control θJC Thermal Resistance ON/OFF Pin Logic Input Threshold Voltage ON/OFF Pin Input Current VIH Low (Regulator ON) ‐ VIL IIH IIL High (Regulator OFF) VLOGIC=2.5V (Regulator OFF) VLOGIC=0.5V (Regulator ON) 2.0 ‐ ‐ 1.4 6 0.02 Max. Unit 50 nA 100 173 KHz 173 1.4 V 1.5 ‐ % 5.5 A 6.9 50 uA 30 mA 200 uA 300 ‐ o C/W ‐ ‐ o C/W ‐ 0.6 ‐ 15 5 V uA NOTE: 1. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. 2. External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect switching regulator system performance. 3. Typical numbers are at 25 oC and represent the most likely norm. 4. All limits guaranteed at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). 5. The switching frequency is reduced when the second stage current limit is activated. 6. No diode, inductor or capacitor connected to output pin. 7. Feedback pin removed from output and connected to 0V to force the output transistor switch ON. Feedback pin removed from output and connected to 12V for the 3.3V, 5V, ADJ. version, and 15V for the 12V version, 8. to force the output transistor switch OFF. 9. VIN=40V. 10. Junction to ambient thermal resistance. (With copper area of approximately 3in2) DS‐RS2596‐07 September, 2009 www.Orister.com Page No. : 5/9 Characteristics Curve Normalized Output Voltage Shutdown Quiescent Current 160 1.5 VIN=12V 140 ILOAD=200mA 120 0.5 Current (uA) Output Voltage Change (%).. 1 0 100 VON/VOFF=5V 80 TJ=25oC 60 -0.5 40 -1 20 -1.5 0 25 50 75 100 125 150 0 175 0 o 10 20 30 Supply Voltage (V) Junction Temperature ( C) 40 Switch Saturation Voltage Switch Current Limit 1.30 6.00 VIN=12V TJ=25oC 1.20 5.80 Saturation Voltage (V) Switch Current Limit (A) 5.90 5.70 5.60 VIN=12V 5.50 VOUT =5V 5.40 1.10 1.00 0.90 5.30 0.80 5.20 0 25 50 75 100 o 125 150 0 1 2 3 4 Switch Current (A) Junction Temperature ( C) On/Off Pin Current (Sinking) 12 Current (uA) 10 VIN=40V 8 TJ=25oC 6 4 2 0 0 5 10 15 20 25 30 On/Off Pin Voltage (V) DS‐RS2596‐07 September, 2009 www.Orister.com Page No. : 6/9 TO‐263‐5 Dimension NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. Mold flash or protrusion not to exceed 0.005 (0.13) per side. D. Falls within JEDEC TO‐263 variation BA. Except minimum lead thickness, maximum seating height, and minimum body length. DS‐RS2596‐07 September, 2009 www.Orister.com Page No. : 7/9 TO‐220‐5 Dimension NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. All lead dimensions apply before solder dip. D. The center lead is in electrical contact with the tab. E. The chamfer is optional. F. Thermal pad contour optional within these dimensions. DS‐RS2596‐07 September, 2009 www.Orister.com Page No. : 8/9 Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat 25 Ramp-down t 25oC to Peak Time Profile Feature Average ramp‐up rate (TL to TP) Sn‐Pb Eutectic Assembly o <3 C/sec Preheat Pb‐Free Assembly <3oC/sec ‐ Temperature Min (Tsmin) 100oC 150oC ‐ Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec ‐ Time (min to max) (ts) Tsmax to TL ‐ Ramp‐up Rate o <3 C/sec <3 C/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) o 217oC 183 C 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp‐down Rate Time 25oC to Peak Temperature o o o 60~150 sec 240 C +0/‐5 C 260oC +0/‐5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb‐Free devices. o o 245 C ±5 C o o 260 C +0/‐5 C 5sec ±1sec 5sec ±1sec DS‐RS2596‐07 September, 2009 www.Orister.com Page No. : 9/9 Important Notice: © Orister Corporation Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. Orister reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. DS‐RS2596‐07 September, 2009 www.Orister.com