WIREWOUND CHIP INDUCTORS SDI565047 SERIES 1. PART NO. EXPRESSION : SDI565047-R12MF (a) (b) (c) (d)(e) (a) Series code (d) Tolerance code : K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : R12 = 0.12uH 2. CONFIGURATION & DIMENSIONS : B A E F E J I C H I PCB Pattern Unit:m/m A B C E F H I J 5.7±0.3 5.0±0.3 4.7±0.3 1.3 Min. 1.7 Min. 5.0 Ref. 2.0 Ref. 2.0 Ref. 3. SCHEMATIC : 1 2 4. GENERAL SPECIFICATION : a) Ambient temp. : 20°C b) Operating temp. : -25°C to 85°C c) Rated current : Base on temp. rise & ǻL/L0A=10% Max. NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 WIREWOUND CHIP INDUCTORS SDI565047 SERIES 5. ELECTRICAL CHARACTERISTICS : Part No. Tolerance Inductance ( uH ) Test Frequency ( Hz ) SRF ( MHz ) Min. DCR (ȍ) Max. IDC ( mA ) Max. SDI565047-R12 F M 0.12 1M 450 0.0098 6000 SDI565047-R27 F M 0.27 1M 300 0.0140 5300 SDI565047-R47 F M 0.47 1M 200 0.0182 4800 SDI565047-1R0 F M 1.0 1M 150 0.0270 4000 SDI565047-1R5 F M 1.5 1M 110 0.0310 3700 SDI565047-2R2 F M 2.2 1M 80 0.0410 3200 SDI565047-3R3 F M 3.3 1M 40 0.0500 2900 SDI565047-4R7 F M 4.7 1M 30 0.0574 2700 SDI565047-6R8 F M 6.8 1M 25 0.1040 2000 SDI565047-100 F M, K 10 1M 20 0.1300 1700 SDI565047-150 F M, K 15 1M 17 0.210 1400 SDI565047-220 F M, K 22 1M 15 0.266 1200 SDI565047-330 F M, K 33 1M 12 0.448 900 SDI565047-470 F M, K 47 1M 10 0.560 800 SDI565047-680 F M, K 68 1M 7.6 0.938 640 SDI565047-101 F M, K 100 100K 6.5 1.204 560 SDI565047-151 F M, K 150 100K 5.0 2.660 420 SDI565047-221 F M, K 220 100K 4.0 3.360 320 SDI565047-331 F M, K 330 100K 3.1 6.160 270 SDI565047-471 F M, K 470 100K 2.4 7.560 240 SDI565047-681 F M, K 680 100K 1.9 11.34 190 SDI565047-102 F M, K 1000 10K 1.7 14.42 150 SDI565047-222 F M, K 2200 10K 1.2 30.10 100 SDI565047-472 F M, K 4700 10K 0.8 61.04 70 SDI565047-103 F M, K 10000 10K 0.5 140.0 50 Inductance tolerance : : J : ±5% K : ±10% M : ±20% NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 WIREWOUND CHIP INDUCTORS SDI565047 SERIES 6. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Environmental Tests High Temperature Storage Test Reference documents: MIL-STD-202G Method 108A 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% Temperature : 85±2°C Time : 96±2 hours Tested after 1 hour (less than 2 hours) at room temperature Temp 85°C High temperature Room Temp 1H 0 Low Temperature Storage Test Reference documents: IEC 68-2-1A 6.1 6.2 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% 96H Test Time Temperature : -25±2°C Time : 96±2 hours Tested after 1 hour (less than 2 hours) at room temperature Room Temp 96H 0 Low temperature -25°C Test Time Temp Humidity Test Reference documents: MIL-STD-202G Method 103B 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% Dry oven at temperature of 40±5°C for 24 hours Measured after 24 hours Exposure : Temperature : 40±2°C, Humidity : 93±3% RH, Time : 96±2 hours Tested while the specimens are still in the chamber Tested after 1 hour (less than 2 hours) at room temperature Temp & Humidity 40°C 93%RH Room Conditions High temperature High humidity 1H 0 Thermal shock test Reference documents: MIL-STD-202G Method 107G 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% T : weight< 28g : 15 Min. 28g<weight<136g : 30 Min. 96H Test Time Conditions of 1 cycle : Step 1 : -40°C for T time Step 2 : 125°C for T time Total : 20 cycles Temp Change time < 5 min T 125°C Room Temp 0 -40°C T Time Physical Characteristics Tests More than 95% of termincal electrode should be covered with solder. Solderability Test Reference documents: MIL-STD-202G Method 208H IPC J-STD-002B Solder temperature : 245±5°C Dip time : 5 secs. Solder : Sn(63)/Pb(37) Flux : rosin flux NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 WIREWOUND CHIP INDUCTORS SDI565047 SERIES 6. RELIABILITY AND TEST CONDITION : ITEM Heat Endurance of Reflow Soldering Reference documents: IPC J-STD-020B Vibration Test Reference documents: MIL-STD-202G Method 201A PERFORMANCE TEST CONDITION 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% Refer to reflow curve. No. of cycle : 3 Peak temp. : 245±5°C 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% Frequency : 10~55Hz Amplitude : 0.75mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Freq 55Hz 10Hz 1Min Drop Test Reference documents: MIL-STD-202G Method 203C Terminal Strength Push Test Reference documents: JIS C 5321:1997 Time 1. No case deformation or change in appearance. 2. ǻL/L<30% (Closed Magnetic Circuit) ǻL/L<10% 3. ǻQ/Q < 30% 4. ǻDCR/DCR<10% Drop from a height of 1m with 981m/s² (100G) altitude (1 angle, 1 ridge and 2 surface orientations) Pulling Test : A : Sectional area of terminal Bend PCB at middle point, the deflection shall be 2mm. Pulling Test : Force Time (sec) A<8mm² >5N 30 8mm²<A<20mm² >10N 10 20mm²<A >20N 10 Y X Bending Test : R0.5 Bending Test : The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 1.0 Sample Reflow Curve 300 250 270 200 150 100 50 Preheat Ramp-up Peak Ramp-down NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 WIREWOUND CHIP INDUCTORS SDI565047 SERIES 7. SOLDERING AND MOUNTING : 7-1. Recommended PC Board Pattern 3.00 3.00 3.50 2.00 7-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 7-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 240°C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure 2. 7-2.3 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Soldering Natural cooling Preheating TEMPERATURE °C TEMPERATURE °C Preheating 230 150 Over 1min. Over 1min. Gradual Cooling Preheating TEMPERATURE °C Figure 1. Re-flow Soldering 280 Soldering Natural cooling Natural cooling 250 230 150 Over 2mins. Within 10secs. Soldering Gradual Cooling Within 3secs. Figure 2. Wave Soldering 230 150 Over 1min. Gradual Cooling Within 3secs. Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 WIREWOUND CHIP INDUCTORS SDI565047 SERIES 8. PACKAGING INFORMATION : ( Unit : mm ) 8-1. Reel & Tape Dimension 330 12 0° 2.5±0.5 13±1 23±1 4±0.1 12 1.75±0.1 16 1.50 +0.10 -0.00 Tape trailer 160mm Min. Tape leader 388mm Min. Components Cover tape 250mm Min. 4R7 4R7 4R7 4R7 4R7 4R7 Direction of feed 8-2. Quantity & G.W. per package INNER : REEL SERIES SDI565047 OUTER : CARTON Q'TY (PCS) G.W. (Kg) Q'TY (PCS) G.W. (Kg) SIZE (cm) 1000 0.78 16000 16 36 x 36 x 40 NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 WIREWOUND CHIP INDUCTORS SDI565047 SERIES 8-3. Tearing Off Force F 165° to 180° Top cover tape The force for tearing off cover tape is 10 to 60 grams in the arrow direction. Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 31.07.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7