SDLS095A – OCTOBER 1976 – REVISED MARCH 1988
description
Copyright 1988, Texas Instruments Incorporated
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SDLS095A – OCTOBER 1976 – REVISED MARCH 1988
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS095A – OCTOBER 1976 – REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SDLS095A – OCTOBER 1976 – REVISED MARCH 1988
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS095A – OCTOBER 1976 – REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
5962-7604301VEA
ACTIVE
CDIP
J
16
1
TBD
76043012A
ACTIVE
LCCC
FK
20
1
TBD
7604301EA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
7604301FA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/31202B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/31202BEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
JM38510/31202BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SN54LS283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN54S283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN74283N
OBSOLETE
PDIP
N
16
TBD
Call TI
SN74LS283D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283N
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS283N3
OBSOLETE
PDIP
N
16
TBD
Call TI
SN74LS283NE4
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS283NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS283NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S283D
OBSOLETE
SOIC
D
16
SN74S283N
ACTIVE
PDIP
N
16
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
25
25
Lead/Ball Finish
A42 SNPB
MSL Peak Temp (3)
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
Call TI
Call TI
Call TI
N / A for Pkg Type
SN74S283N3
OBSOLETE
PDIP
N
16
TBD
Call TI
SN74S283NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
SNJ54LS283FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LS283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS283W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SNJ54S283FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54S283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54S283W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
Addendum-Page 1
Call TI
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS283DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LS283NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS283DR
SN74LS283NSR
SOIC
D
16
2500
333.2
345.9
28.6
SO
NS
16
2000
346.0
346.0
33.0
Pack Materials-Page 2
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