SDLS055A – DECEMBER 1972 – REVISED MAY 2007 (1) (1) (1) SN54S153, SN74153, and SN74S153 are obsolete. PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 76011012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76011012A SNJ54LS 153FK 7601101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601101EA SNJ54LS153J 7601101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601101FA SNJ54LS153W JM38510/07902BEA OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 JM38510/07902BFA OBSOLETE CFP W 16 TBD Call TI Call TI -55 to 125 JM38510/30902B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30902B2A JM38510/30902BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30902BEA M38510/30902B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30902B2A M38510/30902BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30902BEA SN54153J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54153J SN54LS153J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS153J SN54S153J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 SN74153N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS153D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS153 SN74LS153DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS153 SN74LS153DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS153 SN74LS153DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS153 SN74LS153DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS153 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty SN74LS153DRG4 ACTIVE SOIC D 16 SN74LS153J OBSOLETE CDIP J 16 SN74LS153N ACTIVE PDIP N 16 Eco Plan Lead/Ball Finish (2) 2500 Green (RoHS & no Sb/Br) TBD 25 Pb-Free (RoHS) MSL Peak Temp Op Temp (°C) Device Marking (3) CU NIPDAU (4/5) Level-1-260C-UNLIM 0 to 70 Call TI Call TI 0 to 70 CU NIPDAU N / A for Pkg Type 0 to 70 LS153 SN74LS153N SN74LS153N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS153NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS153N SN74LS153NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS153 SN74LS153NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS153 SN74LS153NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS153 SN74S153D OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74S153N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S153N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SNJ54153J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54153J SNJ54153W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54153W SNJ54LS153FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76011012A SNJ54LS 153FK SNJ54LS153J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601101EA SNJ54LS153J SNJ54LS153W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601101FA SNJ54LS153W SNJ54S153FK OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 SNJ54S153J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 SNJ54S153W OBSOLETE CFP W 16 TBD Call TI Call TI -55 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF SN54153, SN54LS153, SN54S153, SN74153, SN74LS153, SN74S153 : • Catalog: SN74153, SN74LS153, SN74S153 • Military: SN54153, SN54LS153, SN54S153 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS153DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS153NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS153DR SN74LS153NSR SOIC D 16 2500 333.2 345.9 28.6 SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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