SCAS522F − AUGUST 1995 − REVISED OCTOBER 2003 D 2-V to 6-V VCC Operation D Inputs Accept Voltages to 6 V D Max tpd of 9.5 ns at 5 V SN54AC14 . . . J OR W PACKAGE SN74AC14 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 14 2 13 3 12 4 11 5 10 6 7 9 8 1Y A1 NC VCC 6A 1 VCC 6A 6Y 5A 5Y 4A 4Y 2A NC 2Y NC 3A 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 6Y NC 5A NC 5Y 3Y GND NC 4Y 4A 1A 1Y 2A 2Y 3A 3Y GND SN54AC14 . . . FK PACKAGE (TOP VIEW) NC − No internal connection description/ordering information These Schmitt-trigger devices contain six independent inverters. They perform the Boolean function Y = A. Because of the Schmitt action, they have different input threshold levels for positive-going (VT+) and for negative-going (VT−) signals. These circuits are temperature compensated and can be triggered from the slowest of input ramps and still give clean, jitter-free output signals. They also have a greater noise margin than conventional inverters. ORDERING INFORMATION PDIP − N SN74AC14N Tube SN74AC14D Tape and reel SN74AC14DR SOP − NS Tape and reel SN74AC14NSR AC14 SSOP − DB Tape and reel SN74AC14DBR AC14 Tube SN74AC14PW Tape and reel SN74AC14PWR CDIP − J Tube SNJ54AC14J SNJ54AC14J CFP − W Tube SNJ54AC14W SNJ54AC14W LCCC − FK Tube SNJ54AC14FK SNJ54AC14FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube SOIC − D −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER PACKAGE† TA SN74AC14N AC14 AC14 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) %(#"! "%' /0121 '' %$$! $ $!$( #'$!! *$,!$ $() '' *$ %(#"! %(#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCAS522F − AUGUST 1995 − REVISED OCTOBER 2003 FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H logic diagram, each inverter (positive logic) A Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54AC14 SN74AC14 MIN MAX MIN MAX UNIT VCC VI Supply voltage 2 6 2 6 V Input voltage 0 0 Output voltage VCC VCC V VO VCC VCC IOH IOL 0 High-level output current Low-level output current 0 VCC = 3 V VCC = 4.5 V −12 −12 −24 −24 VCC = 5.5 V VCC = 3 V −24 −24 12 12 VCC = 4.5 V VCC = 5.5 V 24 24 24 24 V mA mA TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCAS522F − AUGUST 1995 − REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TA = 25°C TYP MAX SN54AC14 SN74AC14 MIN MAX MIN MAX VT+ Positive-going threshold 3V 0.8 1.8 2.2 0.8 2.2 0.8 2.2 4.5 V 1.5 2.6 3.2 1.5 3.2 1.5 3.2 5.5 V 1.6 3.2 3.9 1.6 3.9 1.6 3.9 VT− Negative-going threshold 3V 0.5 0.8 1 0.5 1 0.5 1 4.5 V 0.9 1.4 1.8 0.9 1.8 0.9 1.8 5.5 V 1.1 1.8 2.3 1.1 2.3 1.1 2.3 ∆VT Hysteresis (VT+ − VT−) 3V 0.3 1 1.2 0.3 1.2 0.3 1.2 4.5 V 0.4 1.2 1.4 0.4 1.4 0.4 1.4 5.5 V 0.5 1.4 1.6 0.5 1.6 0.5 1.6 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 5.5 V 5.4 5.4 5.4 3V 2.56 2.4 2.48 4.5 V 3.86 3.7 3.8 5.5 V 4.86 4.7 4.8 IOH = −50 µA VOH IOH = −12 mA IOH = −24 mA VOL 5.5 V 3V 0.002 0.1 0.1 0.1 IOL = 50 µA 4.5 V 0.001 0.1 0.1 0.1 5.5 V 0.001 IOL = 50 mA† IOL = 75 mA† II ICC VI = VCC or GND VI = VCC or GND, Ci VI = VCC or GND V 3.85 0.1 0.1 0.1 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 5.5 V V 1.65 5.5 V IO = 0 V 3.85 5.5 V IOL = 24 mA V V IOH = −50 mA† IOH = −75 mA† IOL = 12 mA UNIT 1.65 5.5 V ±0.1 ±1 ±1 µA 5.5 V 2 40 20 µA 5V 4.5 pF † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V " 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y POST OFFICE BOX 655303 MIN TA = 25°C TYP MAX 1.5 6 1.5 6 • DALLAS, TEXAS 75265 SN54AC14 SN74AC14 MIN MAX MIN MAX 13.5 1 16 1.5 15 11.5 1 14 1.5 13 UNIT ns 3 SCAS522F − AUGUST 1995 − REVISED OCTOBER 2003 switching characteristics over recommended operating free-air temperature range, VCC = 5 V " 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y MIN TA = 25°C TYP MAX SN54AC14 SN74AC14 MIN MAX MIN 1.5 5 1.5 5 10 1.5 12 1.5 11 8.5 1.5 10 1.5 9.5 MAX UNIT ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance CL = 50 pF, f = 1 MHz TYP UNIT 25 pF PARAMETER MEASUREMENT INFORMATION TEST tPLH/tPHL S1 Open From Output Under Test CL = 50 pF (see Note A) S1 OPEN 50% VCC 50% VCC In-Phase Output 50% VCC Out-of-Phase Output LOAD CIRCUIT VOH 50% VCC VOL tPLH tPHL 500 Ω 0V tPHL tPLH 2 × VCC 500 Ω VCC Input (see Note B) 50% VCC VOH 50% VCC VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-87624012A ACTIVE LCCC FK 20 1 TBD 5962-8762401CA ACTIVE CDIP J 14 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 5962-8762401DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type 5962-8762401VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 5962-8762401VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN74AC14D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU SN74AC14DBLE OBSOLETE SSOP DB 14 TBD Call TI SN74AC14DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AC14NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AC14NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14PWLE OBSOLETE TSSOP PW 14 SN74AC14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54AC14FK ACTIVE LCCC FK 20 TBD 1 Addendum-Page 1 TBD Call TI Level-1-260C-UNLIM Call TI Call TI POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type SNJ54AC14J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ54AC14W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AC14DBR DB 14 SITE 41 330 16 8.2 6.6 2.5 12 16 Q1 SN74AC14DR D 14 SITE 27 330 16 6.5 9.0 2.1 8 16 Q1 SN74AC14DR D 14 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 SN74AC14NSR NS 14 SITE 41 330 16 8.2 10.5 2.5 12 16 Q1 SN74AC14PWR PW 14 SITE 41 330 12 7.0 5.6 1.6 8 12 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74AC14DBR DB 14 SITE 41 346.0 346.0 33.0 SN74AC14DR D 14 SITE 27 342.9 336.6 28.58 SN74AC14DR D 14 SITE 41 346.0 346.0 33.0 SN74AC14NSR NS 14 SITE 41 346.0 346.0 33.0 SN74AC14PWR PW 14 SITE 41 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265