SN54AHCT16374, SN74AHCT16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000 D D D D D D D D Members of the Texas Instruments Widebus Family EPIC (Enhanced-Performance Implanted CMOS) Process Inputs Are TTL-Voltage Compatible Distributed VCC and GND Pins Minimize High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings SN54AHCT16374 . . . WD PACKAGE SN74AHCT16374 . . . DGG, DGV, OR DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 GND 1Q7 1Q8 2Q1 2Q2 GND 2Q3 2Q4 VCC 2Q5 2Q6 GND 2Q7 2Q8 2OE description The ’AHCT16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1CLK 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2CLK These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. The SN54AHCT16374 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74AHCT16374 is characterized for operation from –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated. Copyright 2000, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54AHCT16374, SN74AHCT16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000 FUNCTION TABLE (each 8-bit flip-flop) INPUTS OE CLK D OUTPUT Q L ↑ H H L ↑ L L L H or L X Q0 H X X Z logic symbol† 1OE 1CLK 2OE 2CLK 1D1 1D2 1D3 1D4 1D5 1D6 1D7 1D8 2D1 2D2 2D3 2D4 2D5 2D6 2D7 2D8 1 1EN 48 C1 24 2EN 25 C2 47 1D 2 1 46 3 44 5 43 6 41 8 40 9 38 11 37 12 36 13 2D 2 35 14 33 16 32 17 30 19 29 20 27 22 26 23 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 1Q8 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7 2Q8 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OE 1CLK 1D1 1 2OE 48 47 2CLK C1 2 1D 1Q1 24 25 C1 2D1 36 To Seven Other Channels To Seven Other Channels 2 POST OFFICE BOX 655303 1D • DALLAS, TEXAS 75265 13 2Q1 SN54AHCT16374, SN74AHCT16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions (see Note 3) SN54AHCT16374 SN74AHCT16374 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage 0.8 V Input voltage 0 5.5 0 5.5 V VO IOH Output voltage 0 0 VCC –8 V High-level output current VCC –8 mA IOL ∆t/∆v Low-level output current 8 8 mA 20 20 ns/V High-level input voltage 2 2 0.8 Input transition rise or fall rate V V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54AHCT16374, SN74AHCT16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH IOH = –50 mA IOH = –8 mA 45V 4.5 VOL IOL = 50 mA IOL = 8 mA 45V 4.5 II IOZ ICC ∆ICC† Ci Co VI = VCC or GND VO = VCC or GND, VI = VIH or VIL VI = VCC or GND, IO = 0 One input at 3.4 V, Other inputs at VCC or GND VI = VCC or GND VO = VCC or GND MIN 4.4 TA = 25°C TYP MAX 4.5 3.94 SN54AHCT16374 MIN MAX SN74AHCT16374 MIN 4.4 4.4 3.8 3.8 MAX UNIT V 0.1 0.1 0.1 0.36 0.44 0.44 0 V to 5.5 V ±0.1 ±1* ±1 mA 5.5 V ±0.25 ±2.5 ±2.5 mA 5.5 V 4 40 40 mA 5.5 V 1.35 1.5 1.5 mA 10 pF 5V 2.5 5V 3.5 10 V pF * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. † This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC. timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX MIN MAX SN74AHCT16374 MIN MAX UNIT tw Pulse duration, CLK high or low 6.5 6.5 6.5 ns tsu Setup time, data before CLK↑ 2.5 2.5 2.5 ns th Hold time, data after CLK↑ 2.5 2.5 2.5 ns PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 4 SN54AHCT16374 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54AHCT16374, SN74AHCT16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 25°C TYP MAX SN54AHCT16374 SN74AHCT16374 LOAD CAPACITANCE MIN CL = 15 pF 90* 140* 80* 110 CL = 50 pF 85 130 75 75 fmax tPLH tPHL CLK Q CL = 15 pF tPZH tPZL OE Q CL = 15 pF tPHZ tPLZ OE Q CL = 15 pF tPLH tPHL CLK Q CL = 50 pF tPZH tPZL OE Q CL = 50 pF tPHZ tPLZ OE Q CL = 50 pF tsk(o) MIN MAX MIN MAX MHz 6.5* 9.4* 1* 10.5* 1 10.5 6.5* 9.4* 1* 10.5* 1 10.5 6.5* 9.5* 1* 10.5* 1 10.5 6.5* 9.5* 1* 10.5* 1 10.5 6.2* 10.2* 1* 11* 1 11 6.2* 10.2* 1* 11* 1 11 7.3 10.4 1 11.5 1 11.5 7.1 10.4 1 11.5 1 11.5 6.2 10.5 1 11.5 1 11.5 5.1 10.5 1 11.5 1 11.5 7.1 11.2 1 12 1 12 7.9 11.2 1 12 1 12 CL = 50 pF UNIT 1** 1 ns ns ns ns ns ns ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. ** On products compliant to MIL-PRF-38535, this parameter does not apply. noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) SN74AHCT16374 PARAMETER MIN TYP MAX UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 0.36 0.8 V Quiet output, minimum dynamic VOL –0.1 –0.8 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 4.7 High-level dynamic input voltage V 2 VIL(D) Low-level dynamic input voltage NOTE 4: Characteristics are for surface-mount packages only. V 0.8 V TYP UNIT operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, f = 1 MHz 27 pF PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54AHCT16374, SN74AHCT16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000 PARAMETER MEASUREMENT INFORMATION RL = 1 kΩ From Output Under Test Test Point From Output Under Test S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL 1.5 V tPLZ ≈VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPZH tPLH 50% VCC 3V Output Control VOL + 0.3 V VOL tPHZ 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74AHCT16374DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AHCT16374DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AHCT16374DGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AHCT16374DGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AHCT16374DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT16374DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT16374DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT16374DL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT16374DLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT16374DLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.6 15.8 1.8 12.0 24.0 Q1 SN74AHCT16374DGGR TSSOP DGG 48 2000 330.0 24.4 SN74AHCT16374DGVR TVSOP DGV 48 2000 330.0 24.4 6.8 10.1 1.6 12.0 24.0 Q1 SN74AHCT16374DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHCT16374DGGR TSSOP DGG 48 2000 346.0 346.0 41.0 SN74AHCT16374DGVR TVSOP DGV 48 2000 346.0 346.0 41.0 SN74AHCT16374DLR SSOP DL 48 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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