SN54AHCT244, SN74AHCT244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS228L – OCTOBER 1995 – REVISED JULY 2003 SN54AHCT244 . . . J OR W PACKAGE SN74AHCT244 . . . DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) Inputs Are TTL-Voltage Compatible Latch-Up Performance Exceeds 250 mA Per JESD 17 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description/ordering information These octal buffers/drivers are designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’AHCT244 devices are organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 2Y4 1A1 1OE VCC SN54AHCT244 . . . FK PACKAGE (TOP VIEW) To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. 1A2 2Y3 1A3 2Y2 1A4 2OE D D 4 3 2 1 20 19 18 5 17 6 16 7 15 14 8 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 9 10 11 12 13 ORDERING INFORMATION PDIP – N SN74AHCT244N Tube SN74AHCT244DW Tape and reel SN74AHCT244DWR SOP – NS Tape and reel SN74AHCT244NSR AHCT244 SSOP – DB Tape and reel SN74AHCT244DBR HB244 Tube SN74AHCT244PW Tape and reel SN74AHCT244PWR TVSOP – DGV Tape and reel SN74AHCT244DGVR HB244 CDIP – J Tube SNJ54AHCT244J SNJ54AHCT244J CFP – W Tube SNJ54AHCT244W SNJ54AHCT244W LCCC – FK Tube SNJ54AHCT244FK SNJ54AHCT244FK TSSOP – PW –55°C to 125°C TOP-SIDE MARKING Tube SOIC – DW –40°C 40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74AHCT244N AHCT244 HB244 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54AHCT244, SN74AHCT244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS228L – OCTOBER 1995 – REVISED JULY 2003 FUNCTION TABLE (each 4-bit buffer/driver) INPUTS OE A OUTPUT Y L H H L L L H X Z logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54AHCT244, SN74AHCT244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS228L – OCTOBER 1995 – REVISED JULY 2003 recommended operating conditions (see Note 3) SN54AHCT244 SN74AHCT244 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage 0.8 V Input voltage 0 5.5 0 5.5 V VO IOH Output voltage 0 0 VCC –8 V High-level output current VCC –8 mA IOL TA Low-level output current 8 8 mA 85 °C High-level input voltage 2 2 0.8 Operating free-air temperature –55 125 –40 V V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH IOH = –50 mA IOH = –8 mA 45V 4.5 VOL IOL = 50 mA IOL = 8 mA 45V 4.5 IOZ II VO = VCC or GND VI = 5.5 V or GND ICC VI = VCC or GND, IO = 0 One input at 3.4 V, Other inputs at VCC or GND ∆ICC† Ci Co VI = VCC or GND VO = VCC or GND TA = 25°C MIN TYP MAX 4.4 4.5 3.94 SN54AHCT244 MIN MAX SN74AHCT244 MIN 4.4 4.4 3.8 3.8 MAX UNIT V 0.1 0.1 0.1 0.36 0.44 0.44 5.5 V ±0.25 ±2.5 ±2.5 mA 0 V to 5.5 V ±0.1 ±1* ±1 mA 5.5 V 4 40 40 mA 5.5 V 1.35 1.5 1.5 mA 10 pF 5V 2.5 5V 3 10 V pF * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. † This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54AHCT244, SN74AHCT244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS228L – OCTOBER 1995 – REVISED JULY 2003 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF MIN TA = 25°C TYP MAX SN54AHCT244 SN74AHCT244 MIN MAX MIN MAX 5.4* 7.4* 1* 8.5* 1 8.5 5.4* 7.4* 1* 8.5* 1 8.5 7.7* 10.4* 1* 12* 1 12 7.7* 10.4* 1* 12* 1 12 5* 9.4* 1* 10* 1 10 5* 9.4* 1* 10* 1 10 5.9 8.4 1 9.5 1 9.5 5.9 8.4 1 9.5 1 9.5 8.2 11.4 1 13 1 13 8.2 11.4 1 13 1 13 8.8 11.4 1 13 1 13 8.8 11.4 1 13 1 13 tsk(o) CL = 50 pF * On products compliant to MIL-PRF-38535, this parameter is not production tested. ** On products compliant to MIL-PRF-38535, this parameter does not apply. 1** 1 UNIT ns ns ns ns ns ns ns noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) SN74AHCT244 PARAMETER VOH(V) VIH(D) MIN Quiet output, minimum dynamic VOH TYP MAX 4.1 High-level dynamic input voltage V 2 VIL(D) Low-level dynamic input voltage NOTE 4: Characteristics are for surface-mount packages only. UNIT V 0.8 V TYP UNIT 8.2 pF operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz SN54AHCT244, SN74AHCT244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS228L – OCTOBER 1995 – REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC 3V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9678301Q2A ACTIVE LCCC FK 20 1 TBD 5962-9678301QRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type 1 TBD Call TI N / A for Pkg Type TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type 5962-9678301QSA ACTIVE CFP W 20 SN74AHCT244DBLE OBSOLETE SSOP DB 20 SN74AHCT244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHCT244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHCT244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244PWLE OBSOLETE TSSOP PW 20 TBD Call TI SN74AHCT244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SNJ54AHCT244FK ACTIVE LCCC FK 20 1 TBD SNJ54AHCT244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54AHCT244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AHCT244, SN74AHCT244 : SN74AHCT244-Q1 • Automotive: • Enhanced Product: SN74AHCT244-EP NOTE: Qualified Version Definitions: - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Automotive Enhanced Product - Supports Defense, Aerospace and Medical Applications • Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.2 7.5 2.5 12.0 16.0 Q1 SN74AHCT244DBR SSOP DB 20 2000 330.0 16.4 SN74AHCT244DGVR TVSOP DGV 20 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74AHCT244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74AHCT244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74AHCT244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHCT244DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74AHCT244DGVR TVSOP DGV 20 2000 346.0 346.0 29.0 SN74AHCT244DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74AHCT244NSR SO NS 20 2000 346.0 346.0 41.0 SN74AHCT244PWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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