SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 QB QC QD QE QF QG QH GND description/ordering information The ’AHCT595 devices contain an 8-bit serial-in, parallel-out shift register that feeds an 8-bit D-type storage register. The storage register has parallel 3-state outputs. Separate clocks are provided for the shift and storage registers. The shift register has a direct overriding clear (SRCLR) input, serial (SER) input, and serial outputs for cascading. When the output-enable (OE) input is high, the outputs are in the high-impedance state. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC QA SER OE RCLK SRCLK SRCLR QH′ QC QB SN54AHCT595 . . . FK PACKAGE (TOP VIEW) 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 QH Both the shift register clock (SRCLK) and storage register clock (RCLK) are positive-edge triggered. If both clocks are connected together, the shift register always is one clock pulse ahead of the storage register. 4 SER OE NC RCLK SRCLK SRCLR QD QE NC QF QG NC VCC QA D SN54AHCT595 . . . J OR W PACKAGE SN74AHCT595 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) Inputs Are TTL-Voltage Compatible 8-Bit Serial-In, Parallel-Out Shift Shift Register Has Direct Clear Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) GND NC Q H′ D D D D NC − No internal connection ORDERING INFORMATION PDIP − N SN74AHCT595N Tube SN74AHCT595D Tape and reel SN74AHCT595DR SOP − NS Tape and reel SN74AHCT595NSR AHCT595 SSOP − DB Tape and reel SN74AHCT595DBR HB595 Tube SN74AHCT595PW Tape and reel SN74AHCT595PWR CDIP − J Tube SNJ54AHCT595J SNJ54AHCT595J CFP − W Tube SNJ54AHCT595W SNJ54AHCT595W LCCC − FK Tube SNJ54AHCT595FK SNJ54AHCT595FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube SOIC − D −40°C 85°C −40 C to 85 C ORDERABLE PART NUMBER PACKAGE† TA SN74AHCT595N AHCT595 HB595 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"#$%& "!&'& &(!)$'!& "#))%& ' !( *#+,"'!& '%- )!#" "!&(!)$ ! *%"("'!& *%) % %)$ !( %.' &)#$%& '&') /'))'&0)!#"!& *)!"%&1 !% &! &%"%'),0 &",#% %&1 !( ',, *')'$%%)POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 FUNCTION TABLE INPUTS 2 SER SRCLK X X X X X X L SRCLR FUNCTION RCLK OE X X H X X L Outputs QA−QH are disabled. Outputs QA−QH are enabled. L X X Shift register is cleared. ↑ H X X First stage of the shift register goes low. Other stages store the data of previous stage, respectively. H ↑ H X X First stage of the shift register goes high. Other stages store the data of previous stage, respectively. X X X ↑ X Shift-register data is stored in the storage register. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 logic diagram (positive logic) OE RCLK SRCLR SRCLK SER 13 12 10 11 14 1D Q C1 R 3D C3 Q 15 2D Q C2 R 3D C3 Q 1 2D Q C2 R 3D C3 Q 2 2D Q C2 R 3D C3 Q 3 2D Q C2 R 3D C3 Q 4 2D Q C2 R 3D C3 Q 5 2D Q C2 R 3D C3 Q 6 2D Q C2 R 3D C3 Q 7 9 QA QB QC QD QE QF QG QH QH′ Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 timing diagram SRCLK SER RCLK SRCLR OE ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ QA QB QC QD QE QF QG QH QH’ NOTE: 4 ÎÎÎÎ implies that the output is in 3-State mode. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54AHCT595 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 5.5 VO IOH Output voltage 0 High-level output current VCC −8 IOL ∆t/∆v Low-level output current High-level input voltage SN74AHCT595 2 2 0.8 Input transition rise or fall rate UNIT V V 0.8 V 0 5.5 V 0 VCC −8 mA 8 8 mA 20 20 ns/V V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 &(!)$'!& "!&"%)& *)!#" & % (!)$'3% !) %1& *'% !( %3%,!*$%&- ')'"%)" '' '& !%) *%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)3% % )1 ! "'&1% !) "!&&#% %% *)!#" /!# &!"%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH IOH = −50 mA IOH = −8 mA 4.5 V VOL IOL = 50 mA IOL = 8 mA 4.5 V II IOZ VI = 5.5 V or GND VO = VCC or GND, ICC ∆ICC† Ci MIN 4.4 QA−QH VI = VCC or GND, IO = 0 One input at 3.4V, Other inputs at VCC or GND TA = 25°C TYP MAX 4.5 3.94 SN54AHCT595 MIN MAX SN74AHCT595 MIN 4.4 4.4 3.8 3.8 MAX UNIT V 0.1 0.1 0.1 0.36 0.44 0.44 0 V to 5.5 V ±0.1 ±1* ±1 mA 5.5 V ±0.25 ±2.5 ±2.5 mA 5.5 V 4 40 40 mA 5.5 V 2 2.2 2.2 mA 10 pF VI = VCC or GND 5V 3 10 Co VO = VCC or GND 5V 5.5 * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. † This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC. V pF timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX tw tsu Pulse duration Setup time SN54AHCT595 MIN MAX SN74AHCT595 MIN SRCLK high or low 5 5.5 5.5 RCLK high or low 5 5.5 5.5 SRCLR low 5 5 5 SER before SRCLK↑ 3 3 3 SRCLK↑ before RCLK↑‡ 5 5 5 SRCLR low before RCLK↑ 5 5 5 3.4 3.8 3.8 SRCLR high (inactive) before SRCLK↑ MAX UNIT ns ns th Hold time SER after SRCLK↑ 2 2 2 ns ‡ This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case the shift register is one clock pulse ahead of the storage register. 2 &(!)$'!& "!&"%)& *)!#" & % (!)$'3% !) %1& *'% !( %3%,!*$%&- ')'"%)" '' '& !%) *%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)3% % )1 ! "'&1% !) "!&&#% %% *)!#" /!# &!"%- 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax TA = 25°C TYP MAX SN54AHCT595 SN74AHCT595 LOAD CAPACITANCE MIN CL = 15 pF 135* 170* 115* 115 CL = 50 pF 95 140 85 85 tPLH tPHL RCLK QA−QH CL = 15 pF tPLH tPHL SRCLK QH′ H CL = 15 pF tPHL SRCLR QH′ CL = 15 pF tPZH tPZL OE QA−QH CL = 15 pF tPLH tPHL RCLK QA−QH CL = 50 pF tPLH tPHL SRCLK QH′ H CL = 50 pF tPHL SRCLR QH′ CL = 50 pF tPZH tPZL OE QA−QH CL = 50 pF tPHZ tPLZ OE QA−QH CL = 50 pF MIN MAX MIN MAX UNIT MHz 4.3* 7.4* 1* 8.5* 1 8.5 4.3* 7.4* 1* 8.5* 1 8.5 4.5* 8.2* 1* 9.4* 1 9.4 4.5* 8.2* 1* 9.4* 1 9.4 4.5* 8* 1* 9.1* 1 9.1 4.3* 8.6* 1* 10* 1 10 5.4* 8.6* 1* 10* 1 10 5.6 9.4 1 10.5 1 10.5 5.6 9.4 1 10.5 1 10.5 6.4 10.2 1 11.4 1 11.4 6.4 10.2 1 11.4 1 11.4 6.4 10 1 11.1 1 11.1 5.7 10.6 1 12 1 12 6.8 10.6 1 12 1 12 3.5 10.3 1 11 1 11 3.4 10.3 1 11 1 11 ns ns ns ns ns ns ns ns ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) SN74AHCT595 PARAMETER MIN TYP MAX UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 1 V Quiet output, minimum dynamic VOL −0.6 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 3.8 V High-level dynamic input voltage 2 VIL(D) Low-level dynamic input voltage NOTE 4: Characteristics are for surface-mount packages only. V 0.8 V TYP UNIT 112 pF operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, f = 1 MHz 2 &(!)$'!& "!&"%)& *)!#" & % (!)$'3% !) %1& *'% !( %3%,!*$%&- ')'"%)" '' '& !%) *%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)3% % )1 ! "'&1% !) "!&&#% %% *)!#" /!# &!"%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SCLS374L − MAY 1997 − REVISED FEBRUARY 2004 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ S1 From Output Under Test Test Point VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL 1.5 V tPLZ ≈VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPZH tPLH 50% VCC 3V Output Control VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AHCT595D ACTIVE SOIC D 16 SN74AHCT595DBR ACTIVE SSOP DB SN74AHCT595DBRE4 ACTIVE SSOP SN74AHCT595DE4 ACTIVE SN74AHCT595DR 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT595DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT595N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHCT595NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHCT595NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT595NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT595PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT595PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT595PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT595PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 40 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Mailing Address: Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated