SN74ALVC14 HEX SCHMITT-TRIGGER INVERTER www.ti.com SCES107H – JULY 1997 – REVISED OCTOBER 2004 FEATURES • • • • • D, DGV, NS, OR PW PACKAGE (TOP VIEW) Operates From 2.3 V to 3.6 V Max tpd of 3.4 ns at 3.3 V ±24-mA Output Drive at 3.3 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 1A 1Y 2A 2Y 3A 3Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y DESCRIPTION/ORDERING INFORMATION This hex Schmitt-trigger inverter is designed for 2.3-V to 3.6-V VCC operation. The SN74ALVC14 contains six independent inverters and performs the Boolean function Y = A. ORDERING INFORMATION PACKAGE (1) TA (1) TOP-SIDE MARKING SN74ALVC14D Tape and reel SN74ALVC14DR SOP - NS Tape and reel SN74ALVC14NSR ALVC14 TSSOP - PW Tape and reel SN74ALVC14PWR VA14 TVSOP - DGV Tape and reel SN74ALVC14DGVR VA14 SOIC - D -40°C to 85°C ORDERABLE PART NUMBER Tube ALVC14 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H LOGIC DIAGRAM, EACH INVERTER (POSITIVE LOGIC) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997–2004, Texas Instruments Incorporated SN74ALVC14 HEX SCHMITT-TRIGGER INVERTER www.ti.com SCES107H – JULY 1997 – REVISED OCTOBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through VCC or GND D package θJA Package thermal impedance (4) Tstg Storage temperature range (2) (3) (4) mA -50 mA ±50 mA ±100 mA 86 DGV package 127 NS package 76 PW package (1) V -50 °C/W 113 -65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current TA Operating free-air temperature MIN MAX 2.3 3.6 V 0 3.6 V 0 VCC V VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V (1) 2 UNIT mA mA 24 -40 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. °C SN74ALVC14 HEX SCHMITT-TRIGGER INVERTER www.ti.com SCES107H – JULY 1997 – REVISED OCTOBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VT+ Positive-going threshold VTNegative-going threshold ∆VT Hysteresis (VT+ - VT-) MIN 2.3 V 0.7 1.7 2.7 V 0.8 2 3V 0.8 2 3.6 V 0.8 2 2.3 V 0.35 1.3 2.7 V 0.4 1.4 3V 0.6 1.5 3.6 V 0.8 1.8 2.3 V 0.3 1 2.7 V 0.3 1.1 3V 0.3 1.2 0.3 1.2 3.6 V VOH 2.3 V to 3.6 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 µA 2.3 V to 3.6 V 0.2 2.3 V 0.4 2.3 V 0.7 2.7 V 0.4 3V 0.55 IOL = 6 mA IOL = 12 mA IOL = 24 mA II VI = VCC or GND ICC VI = VCC or GND, IO = 0 One input at VCC - 0.6 V, Other inputs at VCC or GND ∆ICC Ci (1) MAX IOH = 100 µA IOH = -12 mA VOL TYP (1) VCC V V V VCC - 0.2 V V ±5 µA 3.6 V 10 µA 3 V to 3.6 V 750 µA 3.6 V VI = VCC or GND UNIT 3.3 V 4 pF All typical values are at VCC = 3.3 V, TA = 25°C. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 and Figure 2) PARAMETER FROM (INPUT) TO (OUTPUT) A Y tpd VCC = 2.5 V ± 0.2 V MIN MAX 1 3.7 VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V MAX MIN MAX 3.9 1 3.4 UNIT ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd Power dissipation capacitance per inverter TEST CONDITIONS CL = 0, f = 10 MHz VCC = 2.5 V VCC = 3.3 V TYP TYP 27 31 UNIT pF 3 SN74ALVC14 HEX SCHMITT-TRIGGER INVERTER www.ti.com SCES107H – JULY 1997 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V ± 0.2 V 2 × VCC S1 500 Ω From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 500 Ω S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 SN74ALVC14 HEX SCHMITT-TRIGGER INVERTER www.ti.com SCES107H – JULY 1997 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V ± 0.3 V 6V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND tw LOAD CIRCUIT 2.7 V 2.7 V Timing Input 1.5 V Input 1.5 V 1.5 V 0V 0V tsu VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V Output Control (low-level enabling) 1.5 V 0V tPZL 2.7 V Input 1.5 V 1.5 V 0V tPLH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ 3V 1.5 V tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPHL 1.5 V Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 2. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ALVC14D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Mailing Address: Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated