TI SN74CBT16244DGVR

SN54CBT16244, SN74CBT16244
16-BIT FET BUS SWITCHES
SCDS031I – MAY 1996 – REVISED OCTOBER 2000
D
D
D
D
Members of Texas Instruments’ Widebus 
Family
Standard ’16244-Type Pinout
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
SN54CBT16244 . . . WD PACKAGE
SN74CBT16244 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1OE
1B1
1B2
GND
1B3
1B4
VCC
2B1
2B2
GND
2B3
2B4
3B1
3B2
GND
3B3
3B4
VCC
4B1
4B2
GND
4B3
4B4
4OE
description
The ’CBT16244 devices provide 16 bits of
high-speed TTL-compatible bus switching in a
standard ’16244 device pinout. The low on-state
resistance of the switch allows connections to be
made with minimal propagation delay.
These devices are organized as four 4-bit
low-impedance
switches
with
separate
output-enable (OE) inputs. When OE is low, the
switch is on, and data can flow from port A to port
B, or vice versa. When OE is high, the switch is
open, and the high-impedance state exists
between the two ports.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube
SN74CBT16244DL
Tape and reel
SN74CBT16244DLR
TSSOP – DGG
Tape and reel
SN74CBT16244DGGR
CBT16244
TVSOP – DGV
Tape and reel
SN74CBT16244DGVR
CY244
SSOP – DL
–40°C
40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
CBT16244
–55°C to 125°C
CFP – WD
Tube
SNJ54CBT16244WD
SNJ54CBT16244WD
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each 4-bit bus switch)
INPUT
OE
OUTPUTS
A, B
L
A port = B port
H
Disconnect
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
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1
SN54CBT16244, SN74CBT16244
16-BIT FET BUS SWITCHES
SCDS031I – MAY 1996 – REVISED OCTOBER 2000
logic diagram (positive logic)
1A1
47
2
43
6
1A4
1B1
2A1
1B4
2A4
1
8
37
12
2B1
2B4
48
1OE
3A1
41
2OE
36
13
32
17
3A4
3B1
4A1
3B4
4A4
25
30
19
26
23
4B1
4B4
24
3OE
4OE
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54CBT16244
SN74CBT16244
MIN
MAX
MIN
MAX
5.5
4
5.5
VCC
VIH
Supply voltage
4
High-level control input voltage
2
VIL
TA
Low-level control input voltage
2
0.8
Operating free-air temperature
–55
125
–40
UNIT
V
V
0.8
V
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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SN54CBT16244, SN74CBT16244
16-BIT FET BUS SWITCHES
SCDS031I – MAY 1996 – REVISED OCTOBER 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
II
ICC
II = –18 mA
VI = 5.5 V
VCC = 5.5 V
VCC = 5.5 V,
VI = VCC or GND
VI = 5.5 V or GND
IO = 0,
One input at 3.4 V,
Control
inputs
VCC = 5.5 V,
Other inputs at VCC or GND
Ci
Control
inputs
VI = 3 V or 0
ron§
MIN
VCC = 4.5 V,
VCC = 0
∆ICC‡
Cio(OFF)
SN54CBT16244
TYP†
MAX
TEST CONDITIONS
VO = 3 V or 0,
VCC = 4 V,
VCC = 4.5 V
SN74CBT16244
TYP†
MAX
MIN
–1.2
–1.2
10
10
±1
±1
3.2
3
µA
2.5
2.5
mA
2.5
OE = VCC
2.5
4.5
VI = 2.4 V,
VI = 0,
II = 15 mA
II = 64 mA
VI = 0,
VI = 2.4 V,
II = 30 mA
II = 15 mA
UNIT
µA
pF
4.5
20
V
pF
20
5
10
5
7
5
10
5
7
Ω
8
14
8
12
† All typical values are at VCC = 5 V, TA = 25°C.
‡ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
§ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
SN54CBT16244
PARAMETER
tpd¶
FROM
(INPUT)
TO
(OUTPUT)
SN74CBT16244
VCC = 4 V
VCC = 5 V
± 0.5 V
VCC = 4 V
VCC = 5 V
± 0.5 V
MIN
MAX
MIN
MIN
MIN
MAX
MAX
UNIT
MAX
A or B
B or A
0.8*
0.35
0.25
ns
ten
OE
A or B
10.3
1
9.2
5.5
1
5.1
ns
tdis
OE
A or B
9.7
1
8.2
5.2
1
5.4
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
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3
SN54CBT16244, SN74CBT16244
16-BIT FET BUS SWITCHES
SCDS031I – MAY 1996 – REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
7V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
3V
Output
Control
LOAD CIRCUIT
1.5 V
1.5 V
0V
tPLZ
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
1.5 V
3.5 V
1.5 V
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPHZ
tPZH
tPHL
VOH
Output
Output
Waveform 1
S1 at 7 V
(see Note B)
1.5 V
VOH
VOH – 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
1
5962-9855301QXA
ACTIVE
CFP
WD
48
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16244DGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16244DGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16244DGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16244DL
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16244DLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54CBT16244WD
ACTIVE
CFP
WD
48
1
TBD
Call TI
MSL Peak Temp (3)
74CBT16244DGGRE4
25
TBD
Lead/Ball Finish
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
WD (R-GDFP-F**)
CERAMIC DUAL FLATPACK
48 LEADS SHOWN
0.120 (3,05)
0.075 (1,91)
0.009 (0,23)
0.004 (0,10)
1.130 (28,70)
0.870 (22,10)
0.370 (9,40)
0.250 (6,35)
0.390 (9,91)
0.370 (9,40)
0.370 (9,40)
0.250 (6,35)
48
1
0.025 (0,635)
A
0.014 (0,36)
0.008 (0,20)
25
24
NO. OF
LEADS**
48
56
A MAX
0.640
(16,26)
0.740
(18,80)
A MIN
0.610
(15,49)
0.710
(18,03)
4040176 / D 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification only
Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA
GDFP1-F56 and JEDEC MO -146AB
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MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
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MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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