SCES124L − DECEMBER 1997 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 6 ns at 5 V
D Typical VOLP (Output Ground Bounce)
2
14
13
3
12
4
11
5
10
6
9
7
8
VCC
4OE
4A
4Y
3OE
3A
3Y
1A
1Y
2OE
2A
2Y
14
1A
1OE
NC
VCC
4OE
1
2
13 4OE
3
12 4A
4
11 4Y
5
10 3OE
9 3A
6
7
8
SN54LV125A . . . FK PACKAGE
(TOP VIEW)
1Y
NC
2OE
NC
2A
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3OE
2Y
GND
NC
3Y
3A
1
VCC
1OE
1A
1Y
2OE
2A
2Y
GND
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LV125A . . . RGY PACKAGE
(TOP VIEW)
3Y
SN54LV125A . . . J OR W PACKAGE
SN74LV125A . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
D
1OE
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
GND
D
D Ioff Supports Partial-Power-Down Mode
NC − No internal connection
description/ordering information
The ‘LV125A quadruple bus buffer gates are designed for 2-V to 5.5-V VCC operation.
These devices feature independent line drivers with 3-state outputs. Each output is disabled when the
associated output-enable (OE) input is high.
ORDERING INFORMATION
Tube of 25
SN74LV125AN
SN74LV125AN
QFN − RGY
Reel of 1000
SN74LV125ARGYR
LV125A
Tube of 50
SN74LV125AD
Reel of 2500
SN74LV125ADR
SOP − NS
Reel of 2000
SN74LV125ANSR
74LV125A
SSOP − DB
Reel of 2000
SN74LV125ADBR
LV125A
Tube of 90
SN74LV125APW
Reel of 2000
SN74LV125APWR
Reel of 250
SN74LV125APWT
TVSOP − DGV
Reel of 2000
SN74LV125ADGVR
LV125A
CDIP − J
Tube of 25
SNJ54LV125AJ
SNJ54LV125AJ
CFP − W
Tube of 150
SNJ54LV125AW
SNJ54LV125AW
LCCC − FK
Tube of 55
SNJ54LV125AFK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
PDIP − N
SOIC − D
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV125A
LV125A
SNJ54LV125AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"#$%&' #"'(' )
'*"+%("' #$++&' ( "* ,$-.#("' !(&/ +"!$# #"'*"+% "
,&#*#("' ,&+ & &+% "* &0( '+$%&' ('!(+! 1(++('2/
+"!$#"' ,+"#&'3 !"& '" '&#&(+.2 '#.$!& &'3 "* (..
,(+(%&&+/
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCES124L − DECEMBER 1997 − REVISED APRIL 2005
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic diagram (positive logic)
1OE
1A
1
2
3OE
3
1Y
3A
9
3Y
4OE
5
6
2Y
4A
12
Pin numbers shown are for the D, DB, DGV, J, N, NS, PW, RGY, and W packages.
2
8
13
4
2OE
2A
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
4Y
SCES124L − DECEMBER 1997 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 3): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCES124L − DECEMBER 1997 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV125A
VCC
VIH
Supply voltage
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
IOL
∆t/∆v
High-level output current
Low-level output current
Input transition rise or fall rate
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
SN74LV125A
MIN
MAX
2
5.5
1.5
MIN
MAX
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
0.5
0
High or low state
0
3-state
0
VCC × 0.3
5.5
VCC
5.5
V
0.5
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
1.5
VCC × 0.7
VCC × 0.7
VCC = 2 V
VCC = 2.3 V to 2.7 V
UNIT
VCC × 0.3
VCC × 0.3
0
0
0
VCC × 0.3
5.5
V
V
VCC
5.5
V
µA
VCC = 2 V
VCC = 2.3 V to 2.7 V
−50
−50
−2
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
−8
−8
−16
−16
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
) '*"+%("' #"'#&+' ,+"!$# ' & *"+%(4& "+
!&3' ,(& "* !&4&.",%&'/ )(+(#&+# !(( ('! "&+
,&#*#("' (+& !&3' 3"(./ &0( '+$%&' +&&+4& & +3 "
#('3& "+ !#"''$& && ,+"!$# 1"$ '"#&/
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCES124L − DECEMBER 1997 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV125A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
MIN
2 V to 5.5 V
IOH = −8 mA
IOH = −16 mA
IOL = 50 µA
IOL = 2 mA
IOL = 8 mA
IOL = 16 mA
VI = 5.5 V or GND
VO = VCC or GND
ICC
Ioff
VI = VCC or GND,
IO = 0
VI or VO = 0 to 5.5 V
VI = VCC or GND
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
tdis
OE
Y
OE
Y
tpd
A
Y
ten
tdis
OE
Y
OE
Y
2.48
4.5 V
3.8
Y
ten
tdis
OE
Y
OE
Y
tpd
A
ten
tdis
OE
OE
Y
V
3.8
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
±5
±5
µA
5.5 V
20
20
µA
5
µA
0
5
3.3 V
1.6
1.6
5V
1.6
1.6
LOAD
CAPACITANCE
LOAD
CAPACITANCE
free-air
TA = 25°C
MIN
TYP
MAX
MIN
temperature
SN54LV125A
range,
SN74LV125A
MAX
MIN
MAX
13*
1*
15.5*
1
15.5
7*
13*
1*
15.5*
1
15.5
5.1*
14.*7
1*
17*
1
17
8.7
16.5
1
18.5
1
18.5
8.8
16.5
1
18.5
1
18.5
7.3
18.2
1
20.5
1
20.5
2
temperature
SN54LV125A
MAX
MIN
MAX
8*
1*
9.5*
1
9.5
4.8*
8*
1*
9.5*
1
9.5
4.1*
9.7*
1*
11.5*
1
11.5
Y
6.1
11.5
1
13
1
13
Y
6.2
11.5
1
13
1
13
5.5
13.2
1
15
1
15
CL = 15 pF
CL = 50 pF
tsk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
1.5
ns
ns
range,
SN74LV125A
MIN
4.8*
UNIT
2
free-air
TA = 25°C
TYP
MAX
V
pF
MIN
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
A
UNIT
0.1
CL = 50 pF
tpd
MAX
2 V to 5.5 V
CL = 15 pF
TO
(OUTPUT)
TYP
2.48
6.8*
FROM
(INPUT)
MIN
3V
tsk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
PARAMETER
MAX
VCC−0.1
2
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
SN74LV125A
TYP
VCC−0.1
2
2.3 V
II
IOZ
Ci
VCC
UNIT
ns
ns
1.5
) '*"+%("' #"'#&+' ,+"!$# ' & *"+%(4& "+
!&3' ,(& "* !&4&.",%&'/ )(+(#&+# !(( ('! "&+
,&#*#("' (+& !&3' 3"(./ &0( '+$%&' +&&+4& & +3 "
#('3& "+ !#"''$& && ,+"!$# 1"$ '"#&/
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCES124L − DECEMBER 1997 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
tdis
OE
Y
OE
tpd
A
ten
tdis
OE
Y
OE
Y
PARAMETER
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV125A
range,
SN74LV125A
MIN
MAX
MIN
MAX
3.4*
5.5*
1*
6.5*
1
6.5
3.4*
5.1*
1*
6*
1
6
Y
3.2*
6.8*
1*
8*
1
8
Y
4.3
7.5
1
8.5
1
8.5
4.4
7.1
1
8
1
8
4
8.8
1
10
1
10
CL = 15 pF
CL = 50 pF
tsk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
1
UNIT
ns
ns
1
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV125A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.4
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
−0.3
−0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
3
V
2.31
V
0.99
V
VCC
3.3 V
TYP
UNIT
5V
17.6
NOTE 6: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
Outputs enabled
POST OFFICE BOX 655303
CL = 50 pF,
• DALLAS, TEXAS 75265
f = 10 MHz
15.5
pF
SCES124L − DECEMBER 1997 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
CL
(see Note A)
CL
(see Note A)
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
50% VCC
Input
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC
50% VCC
tPLZ
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV125AD
ACTIVE
SOIC
D
14
SN74LV125ADBLE
OBSOLETE
SSOP
DB
14
SN74LV125ADBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADBRG4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADGVRG4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ADRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125AN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV125ANE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV125ANSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ANSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
SN74LV125APWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
50
Green (RoHS &
no Sb/Br)
TBD
Addendum-Page 1
Lead/Ball Finish
CU NIPDAU
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV125APWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV125ARGYR
ACTIVE
VQFN
RGY
14
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LV125ARGYRG4
ACTIVE
VQFN
RGY
14
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LV125ADBR
SSOP
DB
14
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74LV125ADGVR
TVSOP
DGV
14
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
SN74LV125ADR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74LV125ANSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74LV125APWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV125APWT
TSSOP
PW
14
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV125ARGYR
VQFN
RGY
14
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV125ADBR
SSOP
DB
14
2000
346.0
346.0
33.0
SN74LV125ADGVR
TVSOP
DGV
14
2000
346.0
346.0
29.0
SN74LV125ADR
SOIC
D
14
2500
346.0
346.0
33.0
SN74LV125ANSR
SO
NS
14
2000
346.0
346.0
33.0
SN74LV125APWR
TSSOP
PW
14
2000
346.0
346.0
29.0
SN74LV125APWT
TSSOP
PW
14
250
346.0
346.0
29.0
SN74LV125ARGYR
VQFN
RGY
14
3000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated