SCES131H − MARCH 1998 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 6.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
D
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
1OE
1A
1Y
2OE
2A
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4OE
4A
4Y
3OE
3A
3Y
SN54LV126A . . . FK PACKAGE
(TOP VIEW)
1A
1OE
NC
VCC
4OE
D
SN54LV126A . . . J OR W PACKAGE
SN74LV126A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
description/ordering information
1Y
NC
2OE
NC
2A
These quadruple bus buffer gates are designed
for 2-V to 5.5-V VCC operation.
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3OE
2Y
GND
NC
3Y
3A
The ’LV126A devices feature independent line
drivers with 3-state outputs. Each output is
disabled when the associated output-enable (OE)
input is low.
4
To ensure the high-impedance state during power
up or power down, OE should be tied to GND
through a pulldown resistor; the minimum value of
the resistor is determined by the current-sourcing
capability of the driver.
NC − No internal connection
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube of 50
SN74LV126AD
Reel of 2500
SN74LV126ADR
SOP − NS
Reel of 2000
SN74LV126ANSR
74LV126A
SSOP − DB
Reel of 2000
SN74LV126ADBR
LV126A
Tube of 90
SN74LV126APW
Reel of 2000
SN74LV126APWR
Reel of 250
SN74LV126APWT
TVSOP − DGV
Reel of 2000
SN74LV126ADGVR
LV126A
CDIP − J
Tube of 25
SNJ54LV126AJ
SNJ54LV126AJ
CFP − W
Tube of 150
SNJ54LV126AW
SNJ54LV126AW
LCCC − FK
Tube of 55
SNJ54LV126AFK
SOIC − D
−40°C to 85°C
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV126A
LV126A
SNJ54LV126AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
! "#$%&'( $#()(! *
(+#,&)#( $%,,'( )! #+ -%./$)#( ")'0 ,#"%$! $#(+#,& #
!-'$+$)#(! -', ' ',&! #+ '1)! (!,%&'(! !)(")," 2),,)(30
,#"%$#( -,#$'!!(4 "#'! (# ('$'!!),/3 ($/%"' '!(4 #+ )//
-),)&'',!0
POST OFFICE BOX 655303
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1
SCES131H − MARCH 1998 − REVISED APRIL 2005
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
H
H
H
H
L
L
L
X
Z
logic diagram (positive logic)
1OE
1A
2OE
2A
1
2
3OE
3
1Y
3A
4
5
4OE
6
2Y
4A
10
9
8
3Y
13
12
11
4Y
Pin numbers shown are for the D, DB, DGV, J, NS, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCES131H − MARCH 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 4)
SN54LV126A
VCC
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
IOL
∆t/∆v
MIN
MAX
2
5.5
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
Low-level output current
Input transition rise or fall rate
MIN
MAX
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
High or low state
0
0
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
3-state
UNIT
1.5
VCC × 0.3
5.5
0
High-level output current
SN74LV126A
VCC
5.5
VCC × 0.3
VCC × 0.3
0
VCC × 0.3
5.5
0
0
V
V
VCC
5.5
V
µA
VCC = 2 V
VCC = 2.3 V to 2.7 V
−50
−50
−2
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
−8
−8
−16
−16
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV126A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
VCC
MIN
2 V to 5.5 V
IOH = −8 mA
IOH = −16 mA
IOL = 50 µA
IOL = 2 mA
TYP
MAX
MIN
2.3 V
VCC−0.1
2
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
2 V to 5.5 V
IOL = 8 mA
IOL = 16 mA
SN74LV126A
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
±5
±5
µA
V
II
IOZ
VI = 5.5 V or GND
VO = VCC or GND
ICC
Ioff
VI = VCC or GND,
IO = 0
VI or VO = 0 to 5.5 V
5.5 V
20
20
µA
0
5
5
µA
Ci
VI = VCC or GND
3.3 V
1.6
1.6
pF
* (+#,&)#( $#($',(! -,#"%$! ( ' +#,&)5' #,
"'!4( -)!' #+ "'5'/#-&'(0 *),)$',!$ ")) )(" #',
!-'$+$)#(! ),' "'!4( 4#)/!0 '1)! (!,%&'(! ,'!',5'! ' ,4 #
$)(4' #, "!$#((%' '!' -,#"%$! 2#% (#$'0
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3
SCES131H − MARCH 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
tdis
OE
Y
OE
tpd
A
ten
tdis
OE
Y
OE
Y
PARAMETER
LOAD
CAPACITANCE
MIN
TA = 25°C
TYP
MAX
SN74LV126A
MIN
MAX
MIN
MAX
13*
1*
15.5*
1
15.5
13*
1*
15.5*
1
15.5
Y
5.7*
14.7*
1*
17*
1
17
Y
9.2
16.5
1
18.5
1
18.5
9.5
16.5
1
18.5
1
18.5
8.1
18.2
15
20.5
1
20.5
CL = 50 pF
2
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
tdis
OE
Y
OE
Y
tpd
A
ten
tdis
OE
OE
Y
LOAD
CAPACITANCE
MIN
temperature
SN54LV126A
MIN
MAX
8*
1*
9.5*
1
9.5
5.1*
8*
1*
9.5*
1
9.5
4.4*
9.7*
1*
11.5*
1
11.5
Y
6.4
11.5
1
13
1
13
Y
6.6
11.5
1
13
1
13
6.1
13.2
1
15
1
15
CL = 50 pF
1.5
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
tdis
OE
Y
OE
Y
tpd
A
ten
tdis
OE
OE
Y
LOAD
CAPACITANCE
temperature
SN54LV126A
MIN
MAX
MIN
MAX
1*
6.5*
1
6.5
3.6*
5.1*
1*
6*
1
6
3.3*
6.8*
1*
8*
1
8
Y
4.6
7.5
1
8.5
1
8.5
Y
4.6
7.1
1
8
1
8
4.3
8.8
1
10
1
10
tsk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
* (+#,&)#( $#($',(! -,#"%$! ( ' +#,&)5' #,
"'!4( -)!' #+ "'5'/#-&'(0 *),)$',!$ ")) )(" #',
!-'$+$)#(! ),' "'!4( 4#)/!0 '1)! (!,%&'(! ,'!',5'! ' ,4 #
$)(4' #, "!$#((%' '!' -,#"%$! 2#% (#$'0
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
ns
SN74LV126A
5.5*
CL = 50 pF
ns
range,
3.5*
CL = 15 pF
UNIT
1.5
free-air
TA = 25°C
MIN
TYP
MAX
ns
SN74LV126A
MAX
CL = 15 pF
ns
range,
MIN
5*
UNIT
2
free-air
TA = 25°C
TYP
MAX
tsk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
4
SN54LV126A
range,
7.4*
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
temperature
7.1*
CL = 15 pF
tsk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
PARAMETER
free-air
1
UNIT
ns
ns
SCES131H − MARCH 1998 − REVISED APRIL 2005
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74LV126A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.3
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
−0.2
−0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
3.1
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
V
2.31
V
0.97
V
VCC
3.3 V
TYP
UNIT
5V
15.9
NOTE 5: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
Outputs enabled
POST OFFICE BOX 655303
CL = 50 pF,
• DALLAS, TEXAS 75265
f = 10 MHz
14.4
pF
5
SCES131H − MARCH 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
CL
(see Note A)
CL
(see Note A)
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
50% VCC
Input
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
VOH
50% VCC
VOL
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC
50% VCC
tPLZ
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV126AD
ACTIVE
SOIC
D
14
SN74LV126ADBR
ACTIVE
SSOP
DB
SN74LV126ADBRE4
ACTIVE
SSOP
SN74LV126ADBRG4
ACTIVE
SN74LV126ADE4
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ADGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ADGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ADGVRG4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ADRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ADRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ANSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ANSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126ANSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV126APWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LV126ADBR
DB
14
MLA
330
16
8.2
6.6
2.5
12
16
Q1
SN74LV126ADGVR
DGV
14
MLA
330
12
6.8
4.0
1.6
8
16
Q1
SN74LV126ADR
D
14
MLA
330
16
6.5
9.0
2.1
8
16
Q1
SN74LV126ANSR
NS
14
MLA
330
16
8.2
10.5
2.5
12
16
Q1
SN74LV126APWR
PW
14
MLA
330
12
7.0
5.6
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LV126ADBR
DB
14
MLA
342.9
336.6
28.58
SN74LV126ADGVR
DGV
14
MLA
338.1
340.5
20.64
SN74LV126ADR
D
14
MLA
342.9
336.6
28.58
SN74LV126ANSR
NS
14
MLA
342.9
336.6
28.58
SN74LV126APWR
PW
14
MLA
338.1
340.5
20.64
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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