TI SN74LV157ADR

SCLS397F − APRIL 1998 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 7.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
D
D
D
<0.8 V at VCC, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC, TA = 25°C
Ioff Supports Partial-Power-Down-Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
A/B
1A
1B
1Y
2A
2B
2Y
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
G
4A
4B
4Y
3A
3B
3Y
SN54LV157A . . . FK PACKAGE
(TOP VIEW)
1A
A/B
NC
VCC
G
D
SN54LV157A . . . J OR W PACKAGE
SN74LV157A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
description/ordering information
The ’LV157A devices are quadruple 2-line to
1-line data selectors/multiplexers designed for
2-V to 5.5-V VCC operation.
1B
1Y
NC
2A
2B
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
4B
NC
4Y
3A
2Y
GND
NC
3Y
3B
These devices contain inverters and drivers to
supply full data selection to the four output gates.
A separate strobe (G) input is provided. A 4-bit
word is selected from one of two sources and is
routed to the four outputs. The ’LV157A devices
present true data.
4
NC − No internal connection
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube of 40
SN74LV157AD
Reel of 2500
SN74LV157ADR
SOP − NS
Reel of 2000
SN74LV157ANSR
74LV157A
SSOP − DB
Reel of 2000
SN74LV157ADBR
LV157A
Tube of 90
SN74LV157APW
Reel of 2000
SN74LV157APWR
Reel of 250
SN74LV157APWT
TVSOP − DGV
Reel of 2000
SN74LV157ADGVR
LV157A
CDIP − J
Tube of 25
SNJ54LV157AJ
SNJ54LV157AJ
CFP − W
Tube of 150
SNJ54LV157AW
SNJ54LV157AW
LCCC − FK
Tube of 55
SNJ54LV157AFK
SOIC − D
−40°C to 85°C
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV157A
LV157A
SNJ54LV157AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
!"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*.
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1
SCLS397F − APRIL 1998 − REVISED APRIL 2005
description/ordering information (continued)
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
INPUTS
OUTPUT
Y
DATA
G
SELECT
A/B
A
B
H
X
X
X
L
L
L
X
L
L
L
H
X
H
L
H
X
L
L
L
H
X
H
H
L
logic diagram (positive logic)
1A
2
4
1B
2A
3
5
7
2B
3A
6
4A
10
G
A/B
13
15
1
Pin numbers shown are for the D, DB, DGV, J, NS, PW, and W packages.
2
3Y
14
12
4B
2Y
11
9
3B
1Y
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4Y
SCLS397F − APRIL 1998 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range applied in high or low state, VO (see Notes 1 and 2) . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range applied in power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
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3
SCLS397F − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 4)
SN54LV157A
VCC
VIH
High-level input voltage
VIL
Low-level input voltage
VI
VO
Input voltage
IOH
IOL
∆t/∆v
MIN
MAX
2
5.5
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
0.5
Output voltage
0
0
VCC
−50
V
VCC × 0.3
5.5
0
VCC
−50
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
V
V
µA
−2
−6
−6
−12
−12
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
6
6
12
12
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
UNIT
0.5
VCC × 0.3
VCC × 0.3
0
Input transition rise or fall rate
MAX
1.5
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV157A
200
0
200
100
0
100
20
0
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV157A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
VCC
2 V to 5.5 V
IOL = 50 µA
IOL = 2 mA
VI = 5.5 V or GND
VI = VCC or GND,
Ioff
Ci
VI or VO = 0 to 5.5 V
VI = VCC or GND
MIN
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
IO = 0
3.3 V
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!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
4
SN74LV157A
MAX
2 V to 5.5 V
IOL = 6 mA
IOL = 12 mA
II
ICC
TYP
VCC−0.1
2
2.3 V
IOH = −6 mA
IOH = −12 mA
MIN
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1.7
1.7
pF
SCLS397F − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
A/B
Y
G
Y
A or B
Y
A/B
Y
G
Y
LOAD
CAPACITANCE
MIN
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
SN54LV157A
SN74LV157A
MIN
MAX
MIN
MAX
7.4*
15.9*
1*
19.5*
1
19.5
7.9*
19.4*
1*
23.5*
1
23.5
7.8*
19.8*
1*
24*
1
24
22
9.4
18.8
1
22
1
10.8
22.3
1
26
1
26
9.6
22.7
1
26.5
1
26.5
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
A/B
Y
G
Y
A or B
Y
A/B
Y
G
Y
LOAD
CAPACITANCE
MIN
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
SN54LV157A
SN74LV157A
MIN
MAX
MIN
MAX
5.2*
9.7*
1*
11.5*
1
11.5
5.8*
13.2*
1*
15.5*
1
15.5
5.5*
13.6*
1*
16*
1
16
6.7
13.2
1
15
1
15
7.6
16.7
1
19
1
19
7
17.1
1
19.5
1
19.5
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
A/B
Y
G
Y
A or B
Y
A/B
Y
G
Y
LOAD
CAPACITANCE
MIN
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
SN54LV157A
SN74LV157A
MIN
MAX
MIN
MAX
3.6*
6.4*
1*
7.5*
1
7.5
4.1*
8.1*
1*
9.5*
1
9.5
3.8*
8.6*
1*
10*
1
10
4.8
8.4
1
9.5
1
9.5
5.4
10.1
1
11.5
1
11.5
5
10.6
1
12
1
12
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74LV157A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.3
0.8
V
Quiet output, minimum dynamic VOL
−0.1
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3.2
High-level dynamic input voltage
V
2.31
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
V
0.99
V
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
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5
SCLS397F − APRIL 1998 − REVISED APRIL 2005
operating characteristics, TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
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• DALLAS, TEXAS 75265
f = 10 MHz
VCC
3.3 V
TYP
5V
13.1
UNIT
12.1
pF
SCLS397F − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VCC
Output
Control
50% VCC
50% VCC
0V
tPZL
tPLZ
50% VCC
VOL + 0.3 V
VOL
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
≈VCC
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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7
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV157AD
ACTIVE
SOIC
D
16
SN74LV157ADBR
ACTIVE
SSOP
DB
SN74LV157ADBRE4
ACTIVE
SSOP
SN74LV157ADBRG4
ACTIVE
SN74LV157ADE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ADGVRG4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157ANSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV157APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.6
2.5
12.0
16.0
Q1
SN74LV157ADBR
SSOP
DB
16
2000
330.0
16.4
8.2
SN74LV157ADGVR
TVSOP
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
SN74LV157ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LV157ANSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74LV157APWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV157ADBR
SSOP
DB
16
2000
346.0
346.0
33.0
SN74LV157ADGVR
TVSOP
DGV
16
2000
346.0
346.0
29.0
SN74LV157ADR
SOIC
D
16
2500
333.2
345.9
28.6
SN74LV157ANSR
SO
NS
16
2000
346.0
346.0
33.0
SN74LV157APWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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