SCLS384H − SEPTEMBER 1997 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 6.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
D
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54LV240A . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
VCC
description/ordering information
These octal buffers/drivers are designed for 2-V to
5.5-V VCC operation.
1A2
2Y3
1A3
2Y2
1A4
The ’LV240A devices are designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters.
2OE
D
SN54LV240A . . . J OR W PACKAGE
SN74LV240A . . . DB, DGV, DW, NS, OR PW PACKAGE
(TOP VIEW)
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2Y1
GND
2A1
1Y4
2A2
These devices are organized as two 4-bit
buffers/line drivers with separate output-enable
(OE) inputs. When OE is low, the device passes
data from the A inputs to the Y outputs. When OE
is high, the outputs are in the high-impedance
state.
1Y1
2A4
1Y2
2A3
1Y3
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube of 25
SN74LV240ADW
Reel of 2000
SN74LV240ADWR
SOP − NS
Reel of 2000
SN74LV240ANSR
74LV240A
SSOP − DB
Reel of 2000
SN74LV240ADBR
LV240A
Tube of 70
SN74LV240APW
Reel of 2000
SN74LV240APWR
Reel of 250
SN74LV240APWT
TVSOP − DGV
Reel of 2000
SN74LV240ADGVR
LV240A
CDIP − J
Tube of 20
SNJ54LV240AJ
SNJ54LV240AJ
CFP − W
Tube of 85
SNJ54LV240AW
SNJ54LV240AW
LCCC − FK
Tube of 55
SNJ54LV240AFK
SOIC − DW
−40°C to 85°C
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV240A
LV240A
SNJ54LV240AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS384H − SEPTEMBER 1997 − REVISED APRIL 2005
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
L
L
L
H
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
POST OFFICE BOX 655303
19
11
9
13
7
15
5
17
3
• DALLAS, TEXAS 75265
2Y1
2Y2
2Y3
2Y4
SCLS384H − SEPTEMBER 1997 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range applied in the high or low state, VO (see Notes 1 and 2) . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS384H − SEPTEMBER 1997 − REVISED APRIL 2005
recommended operating conditions (see Note 4)
VCC
VIH
VI
Input voltage
VO
Output voltage
∆t/∆v
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level input voltage
Low-level input voltage
IOL
SN74LV240A
MIN
MAX
MIN
MAX
2
5.5
2
5.5
Supply voltage
VIL
IOH
SN54LV240A
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
Input transition rise or fall rate
0.5
0
0
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
High-level output current
V
0.5
VCC × 0.3
VCC × 0.3
3-state
V
1.5
VCC × 0.7
VCC × 0.7
High or low state
UNIT
0
VCC
5.5
VCC × 0.3
5.5
0
0
V
V
VCC
5.5
V
µA
VCC = 2 V
VCC = 2.3 V to 2.7 V
−50
−50
−2
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
−8
−8
−16
−16
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV240A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
VCC
MIN
2 V to 5.5 V
IOL = 50 µA
IOL = 2 mA
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
±5
±5
µA
V
II
IOZ
VI = 5.5 V or GND
VO = VCC or GND
ICC
Ioff
VI = VCC or GND, IO = 0
VI or VO = 0 to 5.5 V
5.5 V
20
20
µA
0
5
5
µA
Ci
VI = VCC or GND
3.3 V
2.3
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
4
MIN
VCC−0.1
2
2 V to 5.5 V
IOL = 8 mA
IOL = 16 mA
MAX
VCC−0.1
2
2.3 V
IOH = −8 mA
IOH = −16 mA
TYP
SN74LV240A
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2.3
pF
SCLS384H − SEPTEMBER 1997 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tdis
OE
Y
tpd
A
ten
OE
tdis
OE
PARAMETER
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
∗
6.3
11.6∗
temperature
SN54LV240A
range,
SN74LV240A
MIN
1∗
MAX
14∗
MIN
MAX
1
14
8.5∗
14.6∗
1∗
17∗
1
17
9.7∗
14.1∗
1∗
16∗
1
16
Y
8.2
14.4
1
17
1
17
Y
10.3
17.8
1
21
1
21
14.2
19.2
1
21
1
21
CL = 15 pF
CL = 50 pF
Y
tsk(o)
2
UNIT
ns
ns
2
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
ten
free-air
FROM
(INPUT)
TO
(OUTPUT)
A
Y
TA = 25°C
MIN
TYP
MAX
4.6∗
7.5∗
Y
6.2∗
OE
LOAD
CAPACITANCE
CL = 15 pF
temperature
SN54LV240A
range,
SN74LV240A
MIN
1∗
MAX
9∗
MIN
MAX
1
9
10.6∗
1∗
12.5∗
1
12.5
12.5∗
1∗
13.5∗
tdis
OE
Y
8.3∗
1
13.5
tpd
A
Y
5.9
11
1
12.5
1
12.5
ten
OE
Y
7.5
14.1
1
16
1
16
tdis
OE
11.8
15
1
17
1
17
CL = 50 pF
Y
tsk(o)
1.5
UNIT
ns
ns
1.5
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tdis
OE
tpd
ten
tdis
OE
Y
PARAMETER
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
∗
3.4
5.5∗
temperature
SN54LV240A
range,
SN74LV240A
MIN
1∗
MAX
6.5∗
MIN
MAX
1
6.5
4.6∗
7.3∗
1∗
8.5∗
1
8.5
Y
7.4∗
12.2∗
1∗
13.5∗
1
13.5
A
Y
4.4
7.5
1
8.5
1
8.5
OE
Y
5.6
9.3
1
10.5
1
10.5
9.7
14.2
1
15.5
1
15.5
CL = 15 pF
CL = 50 pF
tsk(o)
1
UNIT
ns
ns
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCLS384H − SEPTEMBER 1997 − REVISED APRIL 2005
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74LV240A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.56
V
Quiet output, minimum dynamic VOL
−0.49
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
2.82
V
High-level dynamic input voltage
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
16.4
operating characteristics, TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
14
pF
SCLS384H − SEPTEMBER 1997 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPLZ
tPZL
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
VOH
50% VCC
VOL
VCC
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV240ADBLE
OBSOLETE
SSOP
DB
20
SN74LV240ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADGVRG4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWLE
OBSOLETE
TSSOP
PW
20
SN74LV240APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV240APWTG4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
TBD
TBD
Addendum-Page 1
Lead/Ball Finish
Call TI
Call TI
MSL Peak Temp (3)
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
4-Jun-2007
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.2
7.5
2.5
12.0
16.0
Q1
SN74LV240ADBR
SSOP
DB
20
2000
330.0
16.4
SN74LV240ADGVR
TVSOP
DGV
20
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
SN74LV240ADWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74LV240APWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV240ADBR
SSOP
DB
20
2000
346.0
346.0
33.0
SN74LV240ADGVR
TVSOP
DGV
20
2000
346.0
346.0
29.0
SN74LV240ADWR
SOIC
DW
20
2000
346.0
346.0
41.0
SN74LV240APWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated