SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 FEATURES • • • • • • • • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 5.1 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C DCT PACKAGE (TOP VIEW) • • • Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) DCU PACKAGE (TOP VIEW) G 1 8 VCC Y1 2 7 Y0 A0 3 6 A1 GND 4 5 Y2 G Y1 A0 GND 1 8 2 7 3 6 4 5 YEP OR YZP PACKAGE (BOTTOM VIEW) VCC Y0 A1 Y2 GND A0 Y1 G 4 5 3 6 2 7 1 8 Y2 A1 Y0 VCC See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This decoder is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G29 is a 2-of-3 decoder/demultiplexer. When the enable (G) input signal is low, only one of the outputs is in the low state, depending on the input levels of A0 and A1. When G is high, Y0, Y1, and Y2 are high, regardless of the input states. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disable the outputs, preventing damaging current backflow through the device when it is powered down. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2006, Texas Instruments Incorporated SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 ORDERING INFORMATION TA PACKAGE (1) NanoStar™– WCSP (DSBGA) 0.23-mm Large Bump – YEP –40°C to 85°C SSOP – DCT VSSOP – DCU (2) TOP-SIDE MARKING Reel of 3000 _ _ _D9_ SN74LVC1G29YZPR Reel of 3000 SN74LVC1G29DCTR Reel of 250 SN74LVC1G29DCTT Reel of 3000 SN74LVC1G29DCUR Reel of 250 SN74LVC1G29DCUT C29_ _ _ C29_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUTS G OUTPUTS A1 A0 Y0 Y1 Y2 L L L H X L H H L H L L H H H H H L H X X H H H LOGIC DIAGRAM (POSITIVE LOGIC) G 1 7 Y0 A1 6 2 Y1 A0 3 5 Y2 2 (2) SN74LVC1G29YEPR NanoFree™– WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) (1) ORDERABLE PART NUMBER Submit Documentation Feedback SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range VI Input voltage range (2) state (2) MIN MAX –0.5 6.5 UNIT V –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.5 VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Tstg (1) (2) (3) (4) Package thermal impedance (4) DCT package 220 DCU package 227 YEP/YZP package 102 Storage temperature range –65 150 V °C/W °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback 3 SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 Recommended Operating Conditions (1) VCC Supply voltage Operating Data retention only VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 5.5 Low-level input voltage 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 3.0 V to 3.6 V 2 VCC = 4.5 V to 5.5 V 0.7 × VCC V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3.0 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V 0.3 × VCC V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V IOH High-level output current –8 –16 VCC = 3 V –32 VCC = 1.65 V 4 VCC = 2.3 V IOL Low-level output current ∆t/∆v Input transition rise or fall rate 8 16 VCC = 3 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 (1) Operating free-air temperature mA 24 VCC = 4.5 V VCC = 5 V ± 0.5 V TA mA –24 VCC = 4.5 V 4 V 1.5 VCC = 1.65 V to 1.95 V VIL UNIT ns/V 5 –40 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback °C SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH 1.65 V to 5.5 V 1.2 IOH = –8 mA 2.3 V 1.9 IOH = –16 mA 3V (1) 2.3 4.5 V 1.65 V to 5.5 V 0.1 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 IOL = 16 mA 3.8 0.4 3V VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 One input at VCC – 0.6 V, Other inputs at VCC or GND VI = VCC or GND V 0.55 4.5 V VI = 5.5 V or GND UNIT V 2.4 IOL = 100 µA Ioff Ci MAX IOH = –32 mA IOL= 32 mA ∆ICC TYP (1) VCC – 0.1 1.65 V IOL= 24 mA II MIN IOH = –4 mA IOH = –24 mA VOL VCC 0.55 0 to 5.5 V ±1 µA 0 ±10 µA 1.65 V to 5.5 V 10 µA 500 µA 3 V to 5.5 V 3.3 V 3.5 pF All typical values are at VCC = 3.3 V, TA = 25°C. Submit Documentation Feedback 5 SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 Switching Characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or G Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN MAX MIN 2.5 15.4 MAX 1.5 7.1 VCC = 3.3 V ± 0.3 V MIN MAX 1 5.1 VCC = 5 V ± 0.5 V MIN MAX 0.5 4.2 UNIT ns Switching Characteristics over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or G Y VCC = 1.8 V ± 0.15 V MIN MAX 2.5 15.8 VCC = 2.5 V ± 0.2 V MIN MAX 1.5 7.5 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V MIN MAX MIN MAX 1 6.1 0.5 5.1 UNIT ns Operating Characteristics TA = 25°C TEST CONDITIONS PARAMETER Cpd 6 Power dissipation capacitance G to Y1 A1 to Yn f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 17 17 18 19 33 33 33 35 Submit Documentation Feedback UNIT pF SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC £2 ns £2 ns £2.5 ns £2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 15 pF 15 pF 15 pF 15 pF 1 MW 1 MW 1 MW 1 MW 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 7 SN74LVC1G29 2-OF-3 DECODER/DEMULTIPLEXER www.ti.com SCES569A – JUNE 2004 – REVISED SEPTEMBER 2006 PARAMETER MEASUREMENT INFORMATION (continued) VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC £2 ns £2 ns £2.5 ns £2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF 1 kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VM VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 2. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC1G29DCTR ACTIVE SM8 DCT 8 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G29DCTRE4 ACTIVE SM8 DCT 8 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G29DCTT PREVIEW SM8 DCT 8 250 TBD Call TI SN74LVC1G29DCUR ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G29DCURE4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G29DCUT ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G29DCUTE4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC1G29YEPR NRND WCSP YEP 8 3000 TBD SNPB Level-1-260C-UNLIM SN74LVC1G29YZPR ACTIVE WCSP YZP 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0° – 8° 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. B. C. D. 4188781/C 09/02 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion Falls within JEDEC MO-187 variation DA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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