*Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-UHPT801 [Contents] 1. Features ------------------------------------------------------------- 2 2. Absolute Maximum Ratings ------------------------------------------ 2 3. Electro-optical Characteristics ---------------------------------------- 2 4. Soldering Profile 5. Outline Dimension 6. Packing ---------------------------------------------------- 3 ----------------------------------------------- 4 ------------------------------------------------------------- 4 7. Reel Packing Structure ------------------------------------------------- 5 8. Precaution for Use --------------------------------------------------- 6 9. Characteristic Diagram Drawn by SSC-QP-0401-06(REV.1.2) -------------------------------------------- Checked by Approved by SEOUL SEMICONDUCTOR CO.,LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 1/7 - 7 SSC-UHPT801 1. Features White colored SMT package and colorless clear window Material : AlGaInP Suitable for all SMT assembly methods; Suitable for all soldering methods 2. Absolute Maximum Ratings *1 (Ta=25ºC) Parameter Symbol Value Unit Power Dissipation Pd 90 mW Forward Current IF 30 mA 100 mA Peak Forward Current *2 IFM Reverse Voltage VR 5 V Operating Temperature Topr -40 ~ +100 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 0.1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electro-Optical Characteristics Parameter (Ta=25ºC) Symbol Condition Min Typ Max Unit VF IF =20mA 1.8 2.2 2.6 V IR VR=5V - - 10 µA IV IF =20mA 260 320 500 mcd Peak Wavelength λP IF =20mA - 640 - nm Dominant Wavelength λd IF =20mA 620 630 636 nm Spectral Bandwidth 50% ∆λ IF =20mA - 20 - nm Viewing Angle *2 2θ ½ IF =20mA - 120 - deg. Forward Voltage Reverse Current Luminance Intensity *1 *1 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. *2 2θ½ was the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-0401-06(REV.1.2) SEOUL SEMICONDUCTOR CO.,LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 2/7 - SSC-UHPT801 4. Soldering Profile The LED can be soldered in place using the reflow soldering method. (1) Lead solder Preliminary heating to be at maximum 210°C for maximum 2 minutes. Soldering heat to be at maximum 240°C for maximum 10 seconds. o Device Surface Temperature [ C] 280 240 200 160 120 80 40 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Times [sec] (2) Lead-free solder Preliminary heating to be at maximum 220°C for maximum 2 minutes. Soldering heat to be at maximum 260°C for maximum 10 seconds. o Device Surface Temperature [ C] 280 240 200 160 120 80 40 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Times [sec] (3) Hand Soldering conditions Not more than 5 seconds @MAX300°C, under Soldering iron. In case the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-0401-06(REV.1.2) SEOUL SEMICONDUCTOR CO.,LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 3/7 - SSC-UHPT801 5. Outline Dimension Uhfrpphqghg#Vroghu#Sdwwhuq 41< 51; 3148 41; 31; 515 41; 615 517 419 419 31; Dqrgh Fdwkrgh Fdwkrgh#Pdun 515 ( Tolerance: ±0.2, Unit: mm ) 6. Packing 1.75±0.1 0.22±0.05 3.83±0.1 5° 3.5±0.1 8±0.1 1.55 ± 0.05 4.0±0.1 2.0±0.05 1.0±0.1 8° 3.1±0.1 2.22±0.1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 2.0 ± 0.2 10 30° 60 13 ±0.2 22 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-0401-06(REV.1.2) SEOUL SEMICONDUCTOR CO.,LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 4/7 - SSC-UHPT801 7. Reel Packing Structure Reel RANK : QUANTITY : XXXX XXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Aluminum Vinyl Bag RANK : QUANTITY : XXXX XXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 c 1 SIDE 1 RANK : QUANTITY : XXXX XXX TOP LED b a LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-0401-06(REV.1.2) SEOUL SEMICONDUCTOR CO.,LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 5/7 - SSC-UHPT801 8. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%HR (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) In the case of that the components is humided, the components shall be dried; 24Hr at 80±5ºC or 12Hr at 100±5ºC. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of L/F. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-0401-06(REV.1.2) SEOUL SEMICONDUCTOR CO.,LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 6/7 - SSC-UHPT801 9. Characteristic Diagram Relative Luminous Intensity vs Forward Current Forward Current vs Forward Voltage (Ta=25ºC) (Ta=25ºC) Relative Luminous Intensity IV / IV (25ºC) Forward Current IF [mA] 100 10 1 1.9 2.0 2.1 2.2 2.3 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.4 0 5 10 15 20 25 30 Forward Current IF [mA] Forward Voltage VF [V] Radiation Diagram Forward Current Derating Curve (Ta=25ºC) 40 0 Forward Current IF [mA] -30 30 -60 20 10 0 -60 30 60 90 -90 -40 -20 0 20 40 60 80 Ambient Temperature Ta [ºC] SSC-QP-0401-06(REV.1.2) 100 120 SEOUL SEMICONDUCTOR CO.,LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 7/7 - SSC-UHPT801