ST3024 Audio Decoder/ Encoder P r e l i m i n a r y Datasheet Version 0.1 2007/06/20 Note: Sitronix Technology Corp. reserves the right to change the contents in this document without prior notice. This is not a final specification. Some parameters are subject to change ST3024 1 FEATURES n DSP based voice/audio processor n Operation voltage n Speech playback/recorder _ Low Bit Rate Compression (LBRC) _ 1.2K/1.6K/2.4Kbps@8KHz playback _ 1.6K/2.2K/[email protected] playback _ AB-repeat _ Time stretch (speed up x 2, speed down x 2) _ Combine syllable _ Encryption _ Audio Playback (CBR, VBR – all bit rates) _ Forward/backward play, AB-repeat _ Spectrum gain _ Time stretch (speed up x 1.5, speed down x 1.5) _ Combine syllable _ Encryption _ Wav Playback _ Forward/backward play, AB-repeat _ Wav Record {(MS-ADPCM(3.8:1)} _ Software AGC _ Motion-JPEG playback _ JPEG-baseline decoder _ RS-Word, RS-PY _ TTS – Core logic: 2.25V~2.7V – I/O pads: 3.0V~3.6V n Voltage regulator for core logic n Low Voltage Reset (LVR) _ 2.5V low voltage reset n One PLL to generate high system frequency from a 3MHz source _ 12M~30MHz PLL output n Triple clock sources _ Crystal..................................3MHz _ External input...… … … … ......3MHz n Low power down current _Typical current: 3uA n One 16-bit programmable Timer n One clocking output n One external interrupt _ Edge/level trigger supported n One 14-bit direct-drive DAC – Maximum current: 145mA n MCU interfaces _ Parallel mode n Two Serial PORT interfaces(SP) _ Programmable data length from 8-bit to 16-bit _ I2S, Left/Right Justified interfaces to external DAC/ADC 2 GENERAL DESCRIPTION The ST3024 is a highly integrated and cost-effective DSP based audio processor for various consumer applications. It consists of one powerful DSP for advanced voice decoder and encoder algorithms of natural speech with less memory. It provides low bit rate compression (LBRC) for voice playback, audio playback, motion-JPEG playback, and JPEG-baseline decoder. System clock comes from 3MHz crystal or external input. ST3024 has 32 I/Os and these can be either GPIO or functional pins. Each pin can be programmed to input or output. One external interrupt pin can be requested by external devices. One internal 16-bit DAC can provide significant volume equipping with internal amplifier. For particular application or recorder, two general audio interfaces are supported to interface with external DAC/ADC. Audio interface can be configured to I2S or Left/Right Justified compatible mode. There are parallel interface to connect with different MCUs. Preliminary Ver 0.1 Page 2/13 2007/06/20 ST3024 2.1 Block Diagram Figure 2-1 Preliminary Ver 0.1 ST3024 Block Diagram Page 3/13 2007/06/20 ST3024 3 SIGNAL DESCRIPTIONS Table 3-1 Function Group System control Special I/O GPIO External Interrupt Serial Port0/ DPA[4:0] Serial Port1/ DPA[12:8] MCU Interface Preliminary Ver 0.1 Signal Function Description Pin Name Pin # I/O Description RESET PWD PWDA 1 1 1 I I O OSCXI 1 I OSXO ECLK 1 1 O I CMODE[1:0] 2 I TEST[2:0] SO[1:0]/ DPA[7,15] CLKO/ DPA[6] DAP[13,14], DPB[0:15] 3 I 2 O System reset, low active Power down, low active Power down acknowledge, high active Crystal input or R-oscillator input. If not used, it connects to GND Crystal output. If not used, it connects to GND External clock input. If not used, it connects to GND Clock source select 01=Crystal. ECLK connects to GND 1X=ECLK. OSCXI and OSXO connect to GND Test mode. TEST[2:0] connect to GND SO0/DPA[7], SO1/DPA[15] 1 O 18 I/O XREQ/DPA[5] 1 I TF0/DPA[0] RF0/DPA[1] TX0/DPA[2] RX0/DPA[3] SCLK0/DPA[4] TF1/DPA[8] RF1/DPA[9] TX1/DPA[10] RX1/DPA[11] SCLK1/DPA[12] D[0]/SCL D[1]/SDI D[2]/SDO D[3:7] 1 1 1 1 1 1 1 1 1 1 1 1 1 5 O I O I O O I O I O I/O I/O I/O I/O WR 1 I Parallel : Write enable, low active RD 1 I Parallel : Read enable, low active CS 1 I Parallel : Chip select, low active CMD 1 I REQ 1 O Parallel : Command/data select “H”: Data “L”: Command DSP wants to sent command to MCU, low active RDY 1 O DSP permit MCU access data, low active PMODE 1 I Parallel interface select 0: Parallel (default). Connecting to GND 1: Not used Clock output/DPA[6] General I/O External interrupt/DPA[5] Transmit frame synchronization/DPA[0] Receive frame synchronization/DPA[1] Serial data transmit/DPA[2] Serial data receive/DPA[3] Serial clock/DPA[4] Transmit frame synchronization/DPA[8] Receive frame synchronization/DPA[9] Serial data transmit/DPA[10] Serial data receive/DPA[11] Serial clock/DPA[12] Parallel : Data bus Parallel : Data bus Parallel : Data bus Parallel : Data bus Page 4/13 2007/06/20 ST3024 Power Regulator DAC Preliminary Ver 0.1 P/S 1 I VDD25 VSS25 VDD33 VSS33 REGVDD33 REGVSS33 PLLVDD25 PLLVSS25 PLLVDD25A PLLVSS25A DACVDD33A DACVSS33A DACOVDD33A DACOVSS33A VCCOUT VREF DACO DACOB VCM 2 2 2 2 1 1 1 1 1 1 1 1 2 2 1 1 2 2 1 I I I I I I I I I I I I I I O O O O O Parallel/serial interface select 0: Not used 1: Parallel. Connect to VDD33. 2.5V power 2.5V power ground 3.3V power 3.3V power ground Digital power input of regulator Digital power ground of regulator Digital power input of PLL Digital power ground of PLL Analog power input of PLL Analog power ground of PLL Analog power input of DAC Analog power ground of DAC Analog power input of DAC output stage Analog power ground of DAC output stage 2.5V output of regulator Voltage reference DAC direct drive pin(+) DAC direct drive pin(-) Common mode voltage reference Page 5/13 2007/06/20 ST3024 4 ELECTRICAL CHARACTERISTICS 4.1 Absolute Maximum Rations *Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. All the ranges are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposed to the absolute maximum rating conditions for extended periods may affect device reliability. DC Supply Voltage: VDD33 ----------------- -0.3V to +4.5V Operating Ambient Temperature ---------- -10°C to +60°C Storage Temperature ------------------------ -10°C to +125°C 4.2 DC Electrical Characteristics Table 4-1 DC Electrical Characteristics Standard operation conditions: VDD33 = 3.3V, GND = 0V, TA = 25°C, unless otherwise specified Parameter Symbol Min. Operating Voltage VDD33 3.0 Operating Voltage VDD25 2.25 Operating Current IOP1 30 Power Down Current I PD 3 Output driving I od 16 mA Output sinking Ios 26 mA Input low voltage V IL 0.6 V Input high voltage VIH 1.3 V Pull-up resistor RPU 54 KΩ Pull-down resistor RPD 50 KΩ Low Voltage Reset Level V LVR Preliminary Ver 0.1 2.4 Typ. 2.5 2.5 Page 6/13 Max. Unit 3.6 V 2.7 V mA 4.5 2.6 Condition Run at 24MHz without speaker mA V 2007/06/20 ST3024 4.3 AC Electrical Characteristics Figure 4-1 Parallel Interface Timing Diagram Table 4-2 Timing parameters for Figure 4-1 Standard operation conditions: VDD33 = 3.3V, GND = 0V, TA = 25°C Symbol Characteristic tCH tCS tCYC tCCLW tCCHW tCCLR tCCHR tDS tDH tACC tOH Cmd pin hold time Cmd pin setup time System cycle time Write pulse width Enable H write width Read pulse width Enable H read width Write data setup time Write data hold time Read access time Read data disable time Rating Min. Typ. Max. 5 5 3.5D 0.5D 3D 0.5D 3D 0.5D 5 25 4 Unit nS nS nS nS nS nS nS nS nS nS nS Remark: D = time of one DSP system clock Preliminary Ver 0.1 Page 7/13 2007/06/20 ST3024 5 PAD DIAGRAM Preliminary Ver 0.1 Page 8/13 2007/06/20 ST3024 6 DEVICE INFORMATION Substrate: PAD Symbol No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 TF0 RF0 TX0 RX0 SCLK0 XREQ CLKO SO0 TF1 RF1 TX1 RX1 SCLK1 DPA13 DPA14 SO1 VDD25 VSS25 TEST2 TEST1 TEST0 VSS33 VDD33 DPB0 DPB1 DPB2 DPB3 DPB4 DPB5 DPB6 GND X Y PAD Symbol No. X Y 1616.23 1716.23 1816.23 1916.23 2016.23 2116.23 2216.23 2316.23 2416.23 2516.23 2616.23 2716.23 2826.23 2936.23 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 406.55 516.55 626.55 736.55 836.55 936.55 1036.55 1136.55 1236.55 1336.55 1436.55 1536.55 1636.55 1736.55 1836.55 1936.55 31 DPB7 32 DPB8 33 DPB9 34 DPB10 35 DPB11 36 DPB12 37 DPB13 38 DPB14 39 DPB15 40 VSS33 41 VDD33 42 PWDA 43 PWD 44 D7 45 D6 46 D5 47 D4 48 D3 49 SDO 50 SDI 51 SCL 52 VDD25 53 VSS25 54 CMD 55 PMODE 56 REQ 57 RDY 58 WR 59 RD 60 CS 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2977.5 2940 2830 2720 2620 2520 2420 2320 2220 2120 2020 1920 1820 1720 1620 1520 1420 1320 1220 1120 1020 920 820 2036.55 2136.55 2236.55 2336.55 2436.55 2546.55 2656.55 2766.55 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 Preliminary Ver 0.1 Page 9/13 PAD No. Symbol X Y 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 P/S RESET CMODE0 CMODE1 OSCXI OSXO ECLK VREF VCCOUT REGVDD33 REGVSS33 PLLVSS25 PLLVDD25 PLLVSS25A PLLVDD25A DACVSS33 DACVDD33 VCM DACOB DACOB DACOVSS3 DACOVSS3 DACOVDD3 DACOVDD3 DACO DACO 720 620 520 420 320 210 100 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 62.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 3107.5 2753.0 2643.0 2533.0 2433.0 2257.0 2157.0 2057.0 1957.0 1781.0 1681.0 1581.0 1481.0 1381.0 1281.0 1181.0 1081.0 981.04 881.04 781.04 2007/06/20 ST3024 7 APPLICATION CIRCUIT 7.1 ST3024 Figure 7-1 Application Circuit Diagram Note: 1. If any of OSCXI, OSXO, and ECLK is not used, it needs to connect to GND. 2. The cascade resistor and parallel capacitor on CMD, RD, WR, and CS pins can reduce noise interference. In general, resistor is short and capacitor is open. Please preserve the options on PCB. Preliminary Ver 0.1 Page 10/13 2007/06/20 ST3024 7.2 ADC 10K 10K 1.2K 1.5K 2K Figure 7-2 Preliminary Ver 0.1 ADC Application Circuit Diagram Page 11/13 2007/06/20 ST3024 7.3 DAC Figure 7-3 Preliminary Ver 0.1 DAC Application Circuit Diagram Page 12/13 2007/06/20 ST3024 8 REVISION REVISION 0.1 DESCRIPTION PAGE First release DATE 2007/06/20 The above information is the exclusive intellectual property of Sitronix Technology Corp. and shall not be disclosed, distributed or reproduced without permission from Sitronix. Sitronix Technology Corp. reserves the right to change this document without prior notice and makes no warranty for any errors which may appear in this document. Sitronix products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where products failure could result in injury, or loss of life, or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. Preliminary Ver 0.1 Page 13/13 2007/06/20