STMICROELECTRONICS ST72F321BAR6TCRE

ST72321Bxxx-Auto
8-bit MCU for automotive with 32 to 60 Kbyte Flash/ROM,
ADC, 5 timers, SPI, SCI, I2C interface
Features
Memories
■
32 to 60 Kbyte dual voltage High Density Flash
(HDFlash) ROM with readout protection
capability. In-application programming and incircuit programming for HDFlash devices
■ 1 to 2 Kbyte RAM
■ HDFlash endurance: 100 cycles, data retention
20 years
LQFP64
14 x 14
LQFP64
10 x 10
LQFP44
10 x 10
Up to 48 I/O ports
■
Clock, reset and supply management
48/32/24 multifunctional bidirectional I/O lines
■ 34/22/17 alternate function lines
■ 16/12/10 high sink outputs
■
5 timers
Enhanced low voltage supervisor (LVD) for
main supply and auxiliary voltage detector
(AVD) with interrupt capability
■ Clock sources: crystal/ceramic resonator
oscillators, internal RC oscillator and bypass
for external clock
■ PLL for 2x frequency multiplication
■ 4 power saving modes: Halt, Active Halt, Wait
and Slow
■
Main clock controller with Real-time base,
Beep and Clock-out capabilities
■ Configurable watchdog timer
■ Two 16-bit timers with 2 input captures, 2
output compares, external clock input on 1
timer, PWM and pulse generator modes
■ 8-bit PWM auto-reload timer with 2 input
captures, 4 PWM outputs, output compare and
time base interrupt, external clock with event
detector
Interrupt management
■
Nested interrupt controller
■ 14 interrupt vectors plus TRAP and RESET
■ Top Level Interrupt (TLI) pin on 64-pin devices
■ 15/9 external interrupt lines (on 4 vectors)
3 communications interfaces
■
SPI synchronous serial interface
■ SCI asynchronous serial interface
2
■ I C multimaster interface
1 analog peripheral (low current coupling)
■
Development tools
10-bit ADC with up to 16 input ports
■
Table 1.
Device summary
Device
ST72321BR9-Auto
ST72321BAR9-Auto
ST72321BJ9-Auto
ST72321BR7-Auto
ST72321BAR7-Auto
ST72321BJ7-Auto
ST72321BR6-Auto
ST72321BAR6-Auto
ST72321BJ6-Auto
October 2007
Full HW/SW development pkg, ICT capability
Prog. memory
RAM (stack)
Flash/ROM
60 Kbytes
2048 (256)
bytes
Flash/ROM
48 Kbytes
1536 (256)
bytes
Flash/ROM
32 Kbytes
1024 (256)
bytes
Rev 1
Oper. voltage Temp. range
Package
LQFP64
LQFP44
3.8 to 5.5V
Up to
-40 to 125°C
LQFP64
LQFP44
LQFP64
LQFP44
14x14
10x10
10x10
14x14
10x10
10x10
14x14
10x10
10x10
1/247
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1
Contents
ST72321Bxxx-Auto
Contents
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.2
Differences between ST72321B-Auto and ST72321B datasheets . . . . . . 20
1.2.1
Principal differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.2.2
Minor content differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.2.3
Editing and formatting differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Package pinout and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.1
Package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3
Register and memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4
Flash program memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.3
Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.3.1
5
2/247
Readout protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.4
ICC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.5
ICP (in-circuit programming) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.6
IAP (in-application programming) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4.7
Related documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4.8
Flash control/status register (FCSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Central processing unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.3
CPU registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.3.1
Accumulator (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.3.2
Index registers (X and Y) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.3.3
Program counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.3.4
Condition code (CC) register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.3.5
Stack pointer (SP) register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
ST72321Bxxx-Auto
6
Supply, reset and clock management . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.3
Phase locked loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.4
Multi-oscillator (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.5
Reset sequence manager (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.6
7
6.5.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.5.2
Asynchronous external RESET pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6.5.3
External power-on RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.5.4
Internal low voltage detector (LVD) RESET . . . . . . . . . . . . . . . . . . . . . . 48
6.5.5
Internal watchdog RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
System integrity management (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.6.1
Low voltage detector (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.6.2
Auxiliary voltage detector (AVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.6.3
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.6.4
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.6.5
System Integrity (SI) Control/Status register (SICSR) . . . . . . . . . . . . . . 53
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7.2
Masking and processing flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7.3
Interrupts and low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.4
Concurrent and nested management . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.5
Interrupt register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.6
8
Contents
7.5.1
CPU CC register interrupt bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.5.2
Interrupt software priority registers (ISPRx) . . . . . . . . . . . . . . . . . . . . . . 60
External interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
7.6.1
I/O port interrupt sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
7.6.2
External interrupt control register (EICR) . . . . . . . . . . . . . . . . . . . . . . . . 64
Power saving modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
8.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
8.2
Slow mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
8.3
Wait mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
8.4
Active Halt and Halt modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
3/247
Contents
9
10
ST72321Bxxx-Auto
8.4.1
Active Halt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
8.4.2
Halt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
I/O ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
9.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
9.2
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
9.2.1
Input modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
9.2.2
Output modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
9.2.3
Alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
9.3
I/O port implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
9.4
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
9.5
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Watchdog timer (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10.3
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10.4
How to program the watchdog timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.5
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
10.6
Hardware watchdog option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
10.7
Using Halt mode with the WDG (WDGHALT option) . . . . . . . . . . . . . . . . 85
10.8
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
10.9
Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
10.9.1
11
Main clock controller with real-time clock and beeper (MCC/RTC) . . 87
11.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.2
Programmable CPU clock prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.3
Clock-out capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.4
Real-time clock timer (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.5
Beeper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11.6
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
11.7
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
11.8
Main clock controller registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
11.8.1
4/247
Control register (WDGCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
MCC control/status register (MCCSR) . . . . . . . . . . . . . . . . . . . . . . . . . . 89
ST72321Bxxx-Auto
Contents
11.8.2
12
PWM auto-reload timer (ART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
12.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
12.2
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.3
13
MCC beep control register (MCCBCR) . . . . . . . . . . . . . . . . . . . . . . . . . 90
12.2.1
Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.2.2
Counter clock and prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.2.3
Counter and prescaler initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.2.4
Output compare control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.2.5
Independent PWM signal generation . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.2.6
Output compare and time base interrupt . . . . . . . . . . . . . . . . . . . . . . . . 95
12.2.7
External clock and event detector mode . . . . . . . . . . . . . . . . . . . . . . . . 95
12.2.8
Input capture function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
12.2.9
External interrupt capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
ART registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
12.3.1
Control/status register (ARTCSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
12.3.2
Counter access register (ARTCAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
12.3.3
Auto-reload register (ARTARR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
12.3.4
PWM control register (PWMCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
12.3.5
Duty cycle registers (PWMDCRx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
12.3.6
Input capture control / status register (ARTICCSR) . . . . . . . . . . . . . . . 101
12.3.7
Input capture registers (ARTICRx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
16-bit timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.3
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
13.3.1
Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
13.3.2
External clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
13.3.3
Input capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
13.3.4
Output compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
13.3.5
Forced compare output capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
13.3.6
One Pulse mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
13.3.7
Pulse width modulation mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
13.4
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
13.5
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
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Contents
ST72321Bxxx-Auto
13.6
Summary of timer modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
13.7
16-bit timer registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
13.7.1
Control register 1 (CR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
13.7.2
Control register 2 (CR2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
13.7.3
Control/status register (CSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
13.7.4
Input capture 1 high register (IC1HR) . . . . . . . . . . . . . . . . . . . . . . . . . 121
13.7.5
Input capture 1 low register (IC1LR) . . . . . . . . . . . . . . . . . . . . . . . . . . 122
13.7.6
Output compare 1 high register (OC1HR) . . . . . . . . . . . . . . . . . . . . . . 122
13.7.7
Output compare 1 low register (OC1LR) . . . . . . . . . . . . . . . . . . . . . . . 122
13.7.8
Output compare 2 high register (OC2HR) . . . . . . . . . . . . . . . . . . . . . . 122
13.7.9
Output compare 2 low register (OC2LR) . . . . . . . . . . . . . . . . . . . . . . . 123
13.7.10 Counter high register (CHR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
13.7.11 Counter low register (CLR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
13.7.12 Alternate counter high register (ACHR) . . . . . . . . . . . . . . . . . . . . . . . . 123
13.7.13 Alternate counter low register (ACLR) . . . . . . . . . . . . . . . . . . . . . . . . . 124
13.7.14 Input capture 2 high register (IC2HR) . . . . . . . . . . . . . . . . . . . . . . . . . 124
13.7.15 Input capture 2 low register (IC2LR) . . . . . . . . . . . . . . . . . . . . . . . . . . 124
14
Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
14.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
14.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
14.3
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
14.3.1
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
14.3.2
Slave select management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
14.3.3
Master mode operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
14.3.4
Master mode transmit sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
14.3.5
Slave mode operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
14.3.6
Slave mode transmit sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
14.4
Clock phase and clock polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
14.5
Error flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
14.6
14.5.1
Master mode fault (MODF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
14.5.2
Overrun condition (OVR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
14.5.3
Write collision error (WCOL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
14.5.4
Single master systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
14.6.1
6/247
Using the SPI to wake up the MCU from Halt mode . . . . . . . . . . . . . . 135
ST72321Bxxx-Auto
15
16
Contents
14.7
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
14.8
SPI registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
14.8.1
Control register (SPICR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
14.8.2
Control/status register (SPICSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
14.8.3
Data I/O register (SPIDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Serial communications interface (SCI) . . . . . . . . . . . . . . . . . . . . . . . . 140
15.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
15.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
15.3
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
15.4
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
15.4.1
Serial data format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
15.4.2
Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
15.4.3
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
15.5
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
15.6
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
15.7
SCI registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
15.7.1
Status register (SCISR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
15.7.2
Control register 1 (SCICR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
15.7.3
Control register 2 (SCICR2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
15.7.4
Data register (SCIDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
15.7.5
Baud rate register (SCIBRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
15.7.6
Extended receive prescaler division register (SCIERPR) . . . . . . . . . . 157
15.7.7
Extended transmit prescaler division register (SCIETPR) . . . . . . . . . . 158
I2C bus interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
16.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
16.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
16.3
16.4
16.2.1
I2C master features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
16.2.2
I2C slave features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
16.3.1
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
16.3.2
Communication flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
16.3.3
SDA/SCL line control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
16.4.1
Slave mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
7/247
Contents
ST72321Bxxx-Auto
16.4.2
17
18
16.5
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
16.6
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
16.7
Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
16.7.1
I2C control register (CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
16.7.2
I2C status register 1 (SR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
16.7.3
I2C status register 2 (SR2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
16.7.4
I2C clock control register (CCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
16.7.5
I2C data register (DR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
16.7.6
I2C own address register (OAR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
16.7.7
I2C own address register (OAR2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
10-bit A/D converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
17.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
17.2
Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
17.3
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
17.3.1
A/D converter configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
17.3.2
Starting the conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
17.3.3
Changing the conversion channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
17.4
Low power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
17.5
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
17.6
ADC registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
17.6.1
Control/status register (ADCCSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
17.6.2
Data register (ADCDRH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
17.6.3
Data register (ADCDRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
17.6.4
ADC register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
18.1
8/247
Master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
CPU addressing modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
18.1.1
Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
18.1.2
Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
18.1.3
Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
18.1.4
Indexed (no offset, short, long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
18.1.5
Indirect (short, long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
18.1.6
Indirect Indexed (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
18.1.7
Relative (Direct, Indirect) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
ST72321Bxxx-Auto
18.2
Contents
Instruction groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
18.2.1
19
Using a prebyte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
19.1
19.2
19.3
19.4
19.5
19.6
19.7
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
19.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
19.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
19.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
19.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
19.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
19.2.1
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
19.2.2
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
19.2.3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
19.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
19.3.2
Operating conditions with low voltage detector (LVD) . . . . . . . . . . . . . 194
19.3.3
Auxiliary voltage detector (AVD) thresholds . . . . . . . . . . . . . . . . . . . . . 194
19.3.4
External voltage detector (EVD) thresholds . . . . . . . . . . . . . . . . . . . . . 195
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
19.4.1
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
19.4.2
Supply and clock managers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
19.4.3
On-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
Clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
19.5.1
General timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
19.5.2
External clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
19.5.3
Crystal and ceramic resonator oscillators . . . . . . . . . . . . . . . . . . . . . . 200
19.5.4
RC oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
19.5.5
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
19.6.1
RAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
19.6.2
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
EMC (electromagnetic compatibility) characteristics . . . . . . . . . . . . . . . 204
19.7.1
Functional EMS (electromagnetic susceptibility) . . . . . . . . . . . . . . . . . 204
19.7.2
EMI (electromagnetic interference) . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
19.7.3
Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 206
9/247
Contents
ST72321Bxxx-Auto
19.8
19.9
I/O port pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
19.8.1
General characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
19.8.2
Output driving current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Control pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
19.9.1
Asynchronous RESET pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
19.9.2
ICCSEL/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
19.10 Timer peripheral characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
19.11 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . 215
19.11.1 SPI (serial peripheral interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
19.11.2 I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
19.12 10-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
19.12.1 Analog power supply and reference pins . . . . . . . . . . . . . . . . . . . . . . . 221
19.12.2 General PCB design guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
19.12.3 ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
20
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
20.1
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
20.2
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
20.3
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
20.3.1
21
Device configuration and ordering information . . . . . . . . . . . . . . . . . 228
21.1
21.1.1
Flash configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
21.1.2
Flash ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
ROM device ordering information and transfer of customer code . . . . . 232
21.3
Development tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
21.3.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
21.3.2
Evaluation tools and starter kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
21.3.3
Development and debugging tools . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
21.3.4
Programming tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
21.3.5
Socket and emulator adapter information . . . . . . . . . . . . . . . . . . . . . . 238
ST7 application notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Known limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
22.1
10/247
Flash devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
21.2
21.4
22
Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
All Flash and ROM devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
ST72321Bxxx-Auto
22.2
23
Contents
22.1.1
Unexpected reset fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
22.1.2
External interrupt missed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
22.1.3
Clearing active interrupts outside interrupt routine . . . . . . . . . . . . . . . 242
22.1.4
SCI wrong break duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243
22.1.5
16-bit timer PWM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243
22.1.6
TIMD set simultaneously with OC interrupt . . . . . . . . . . . . . . . . . . . . . 244
22.1.7
I2C multimaster . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
22.1.8
Pull-up always active on PE2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
Limitations specific to 44-pin 32 Kbyte ROM devices . . . . . . . . . . . . . . . 244
22.2.1
Halt/Active Halt mode power consumption with external clock
enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
22.2.2
Active Halt power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
22.2.3
I²C exit from Halt/Active Halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246
11/247
List of tables
ST72321Bxxx-Auto
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.
12/247
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Device pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Hardware register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Sectors available in Flash devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Flash control/status register address and reset value . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Arithmetic management bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Interrupt management bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Interrupt software priority selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
ST7 clock sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Effect of low power modes on SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
AVD interrupt control/wake-up capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
SICSR description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Reset source flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Interrupt software priority levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
CPU CC register interrupt bits description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Interrupt software priority levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Interrupt priority bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Interrupt dedicated instruction set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Interrupt mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
EICR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Interrupt sensitivity - ei2 (port B3..0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Interrupt sensitivity - ei3 (port B7..4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Interrupt sensitivity - ei0 (port A3..0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Interrupt sensitivity - ei1 (port F2..0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Nested interrupts register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
MCC/RTC low power mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
I/O output mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
I/O port mode options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
I/O port configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
I/O port configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Effect of low power modes on I/O ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
I/O port interrupt control/wake-up capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
I/O port register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Effect of low power modes on WDG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
WDGCR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Watchdog timer register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Effect of low power modes on MCC/RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
MCC/RTC interrupt control/wake-up capability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
MCCSR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Time base selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
MCCBCR register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Beep frequency selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Main clock controller register map and reset values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
ARTCSR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Prescaler selection for ART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
ARTCAR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
ARTAAR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
PWM frequency versus resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
ST72321Bxxx-Auto
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
Table 86.
Table 87.
Table 88.
Table 89.
Table 90.
Table 91.
Table 92.
Table 93.
Table 94.
Table 95.
Table 96.
Table 97.
Table 98.
Table 99.
Table 100.
List of tables
PWMCR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
PWM output signal polarity selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
PWMDCRx register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
ARTICCSR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
ARTICRx register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
PWM auto-reload timer register map and reset values. . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Effect of low power modes on 16-bit timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
16-bit timer interrupt control/wake-up capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Timer modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
CR1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
CR2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Timer clock selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
CSR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
16-bit timer register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Effect of low power modes on SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
SPI interrupt control/wake-up capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
SPICR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
SPI master mode SCK frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
SPICSR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
SPI register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Frame formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
Effect of low power modes on SCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
SCI interrupt control/wake-up capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
SCISR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
SCICR1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
SCICR2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
SCIBRR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
SCIERPR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
SCIETPR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Baud rate selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
SCI register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
Effect of low power modes on I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
I2C interrupt control/wake-up capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
CR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
SR1 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
SR2 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
CCR register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
DR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
OAR1 register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
OAR2 register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
I2C register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
Effect of low power modes on ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
ADCCSR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
ADCDRH register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
ADCDRL register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
ADC register map and reset values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Addressing modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
CPU addressing mode overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
Inherent instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
Immediate instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
Instructions supporting direct, indexed, indirect, and indirect indexed addressing modes 185
Available relative direct/indirect instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
13/247
List of tables
Table 101.
Table 102.
Table 103.
Table 104.
Table 105.
Table 106.
Table 107.
Table 108.
Table 109.
Table 110.
Table 111.
Table 112.
Table 113.
Table 114.
Table 115.
Table 116.
Table 117.
Table 118.
Table 119.
Table 120.
Table 121.
Table 122.
Table 123.
Table 124.
Table 125.
Table 126.
Table 127.
Table 128.
Table 129.
Table 130.
Table 131.
Table 132.
Table 133.
Table 134.
Table 135.
Table 136.
Table 137.
Table 138.
Table 139.
Table 140.
Table 141.
Table 142.
Table 143.
Table 144.
Table 145.
Table 146.
Table 147.
Table 148.
Table 149.
Table 150.
14/247
ST72321Bxxx-Auto
Instruction groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
Instruction set overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
Operating conditions with low voltage detector (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
Auxiliary voltage detector (AVD) thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
External voltage detector (EVD) thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
Oscillators, PLL and LVD current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
On-chip peripherals current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
General timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
External clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
Crystal and ceramic resonator oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
OSCRANGE selection for typical resonators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
RC oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
RAM supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Dual voltage HDFlash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
EMS test results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
EMI emissions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
I/O port pin general characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Output driving current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Asynchronous RESET pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
ICCSEL/VPP pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
8-bit PWM-ART auto-reload timer characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
16-bit timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
I2C control interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
SCL frequency table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
10-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
64-pin (14x14) low profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . 224
64-pin (10x10) low profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . 225
44-pin (10x10) low profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . 226
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Soldering compatibility (wave and reflow soldering process) . . . . . . . . . . . . . . . . . . . . . . 227
Flash option bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
Option byte 0 bit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
Option byte 1 bit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Package selection (OPT7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Flash user programmable device types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
FASTROM factory coded device types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
ROM factory coded device types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
STMicroelectronics development tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Suggested list of socket types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246
ST72321Bxxx-Auto
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Device block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
64-pin LQFP 14x14 and 10x10 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
44-pin LQFP package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Memory map and sector address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Typical ICC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
CPU registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Stack manipulation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Clock, reset and supply block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
PLL block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Reset block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
RESET sequence phases. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
RESET sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Low voltage detector versus reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Using the AVD to monitor VDD (AVDS bit = 0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Using the voltage detector to monitor the EVD pin (AVDS bit = 1). . . . . . . . . . . . . . . . . . . 52
Interrupt processing flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Priority decision process flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Concurrent interrupt management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Nested interrupt management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
External interrupt control bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Power saving mode transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Slow mode clock transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Wait mode flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Active Halt timing overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Active Halt mode flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Halt timing overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Halt mode flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
I/O port general block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Interrupt I/O port state transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Watchdog block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Approximate timeout duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Exact timeout duration (tmin and tmax) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Main clock controller (MCC/RTC) block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
PWM auto-reload timer block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Output compare control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
PWM auto-reload timer function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
PWM signal from 0% to 100% duty cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
External event detector example (3 counts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Input capture timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Timer block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
16-bit read sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Counter timing diagram, internal clock divided by 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Counter timing diagram, internal clock divided by 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Counter timing diagram, internal clock divided by 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Input capture block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Input capture timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Output compare block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
15/247
List of figures
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
Figure 59.
Figure 60.
Figure 61.
Figure 62.
Figure 63.
Figure 64.
Figure 65.
Figure 66.
Figure 67.
Figure 68.
Figure 69.
Figure 70.
Figure 71.
Figure 72.
Figure 73.
Figure 74.
Figure 75.
Figure 76.
Figure 77.
Figure 78.
Figure 79.
Figure 80.
Figure 81.
Figure 82.
Figure 83.
Figure 84.
Figure 85.
Figure 86.
Figure 87.
Figure 88.
Figure 89.
Figure 90.
Figure 91.
Figure 92.
Figure 93.
Figure 94.
Figure 95.
Figure 96.
Figure 97.
Figure 98.
Figure 99.
Figure 100.
16/247
ST72321Bxxx-Auto
Output compare timing diagram, fTIMER = fCPU/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Output compare timing diagram, fTIMER = fCPU/4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
One pulse mode cycle flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
One pulse mode timing example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Pulse width modulation mode timing example with 2 output compare functions . . . . . . . 115
Pulse width modulation cycle flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Serial peripheral interface block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Single master/single slave application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Generic SS timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Hardware/Software slave select management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Data clock timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Clearing the WCOL bit (Write Collision Flag) software sequence . . . . . . . . . . . . . . . . . . 134
Single master / multiple slave configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
SCI block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Word length programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
SCI baud rate and extended prescaler block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Bit sampling in reception mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
I2C interface block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Transfer sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
Interrupt control logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
ADC block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
fCPU max versus VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
Typical application with an external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
Typical application with a crystal or ceramic resonator. . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Application with a crystal or ceramic resonator for ROM (LQFP64 or any 48/60K ROM) 201
Typical fOSC(RCINT) versus TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
Integrated PLL jitter versus signal frequency(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Unused I/O pins configured as input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Typical IPU vs VDD with VIN = VSS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Typical VOL at VDD = 5V (standard) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
Typical VOL at VDD = 5V (high-sink) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
Typical VOH at VDD = 5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
Typical VOL versus VDD (standard). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Typical VOL versus VDD (high-sink) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Typical VDD-VOH versus VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
RESET pin protection when LVD is enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
RESET pin protection when LVD is disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
Two typical applications with ICCSEL/VPP pin(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
SPI slave timing diagram with CPHA = 0(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
SPI slave timing diagram with CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
SPI master timing diagram(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Typical application with I2C BUS and timing diagram(1) . . . . . . . . . . . . . . . . . . . . . . . . . 219
RAIN maximum versus fADC with CAIN = 0pF(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Recommended CAIN and RAIN values(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Typical A/D converter application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Power supply filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
ADC error classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
64-pin (14x14) low profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
64-pin (10x10) low profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
ST72321Bxxx-Auto
Figure 101.
Figure 102.
Figure 103.
Figure 104.
List of figures
44-pin (10x10) low profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
Flash commercial product code structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
FASTROM commercial product code structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
ROM commercial product code structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
17/247
Introduction
ST72321Bxxx-Auto
1
Introduction
1.1
Description
The ST72F321B-Auto Flash and ST72321B-Auto ROM devices are members of the ST7
microcontroller family designed for mid-range automotive applications. Different package
options offer up to 48 I/O pins.
All devices are based on a common industry-standard 8-bit core, featuring an enhanced
instruction set and are available with Flash or ROM program memory. The ST7 family
architecture offers both power and flexibility to software developers, enabling the design of
highly efficient and compact application code.
The on-chip peripherals include an A/D converter, a PWM autoreload timer, two general
purpose timers, a watchdog timer, a real-time base main clock controller, I2C, SPI and SCI
interfaces.
For power economy, the microcontroller can switch dynamically into Wait, Slow, Active Halt
or Halt mode when the application is in idle or standby state.
Typical applications include
●
all types of car body applications such as window lift, DC motor control, rain sensors
●
safety microcontroller in airbag and engine management applications
●
auxiliary functions in car radios
Related documentation
Migrating applications from ST72511/311/314 to ST72521/321/324 (AN1131)
18/247
ST72321Bxxx-Auto
Figure 1.
Introduction
Device block diagram
8-BIT CORE
ALU
RESET
VPP
TLI
VSS
VDD
EVD
PROGRAM
MEMORY
(32 - 60 Kbytes)
CONTROL
RAM
(1024 - 2048 bytes)
LVD
AVD
WATCHDOG
OSC1
OSC2
OSC
PORT F
PF7:0
(8-bits)
TIMER A
BEEP
ADDRESS AND DATA BUS
MCC/RTC/BEEP
I2C
PORT A
PORT B
PB7:0
(8-bits)
PWM ART
PORT C
PORT E
TIMER B
PE7:0
(8-bits)
PA7:0
(8-bits)
PC7:0
(8-bits)
SCI
SPI
PORT D
PD7:0
(8-bits)
10-BIT ADC
VAREF
VSSA
19/247
Introduction
1.2
ST72321Bxxx-Auto
Differences between ST72321B-Auto and ST72321B
datasheets
The following sections list the differences between the ST72321B-Auto datasheet
(version 1) and the ST72321B datasheet (version 4 dated 10 April 2007).
1.2.1
Principal differences
1.
2.
3.
Table 2: Device pin description on page 28:
–
removed LQFP32
–
added caution text for PC6
–
replaced VREF with VAREF in Note 3
–
added Note 4 to LQFP44 pin No. 22
Table 30: I/O port configuration on page 79:
–
modified Input and Output table headers
–
changed configuration of pin PE2 and modified Note 1
Table 104: Current characteristics on page 192:
–
changed maximum value for output current sunk by any standard I/O and control
pin
–
changed maximum value for output current sunk by any high sink I/O pin
–
added “Injected current on PC6 pin (Flash devices only)” to IINJ(PIN) ratings
–
reorganized footnotes
–
modified Note 3
4.
Table 110: Current consumption on page 196: Changed Flash device typical and
maximum values in Active Halt mode
5.
Table 120: Dual voltage HDFlash memory on page 203:
6.
7.
8.
9.
–
changed data retention conditions and minimum value
–
replaced TA=25°C with TA=85°C in conditions for NRW
Table 134: 10-bit ADC characteristics on page 220:
–
modified parameter for input leakage current
–
removed negative input leakage current parameter
–
added Note 2
Table 135: ADC accuracy on page 223
–
added maximum values specific to 32 Kbyte Flash devices only
–
added conditions to total unadjusted error, to offset error and to gain error
–
redistributed footnotes
–
modified Note 1
Table 141: Flash option bytes on page 228:
–
Option byte 0: Changed OPT1 to reserved
–
Option byte 1: Replaced OPT7 default value with Note 1
–
Option byte 1: Changed OPT3 default value of from 1 to 0
Table 142: Option byte 0 bit description on page 228: Changed OPT1 to reserved
10. Table 143: Option byte 1 bit description on page 229: Modified function description for
OPT3:1
20/247
ST72321Bxxx-Auto
Introduction
11. Table 144: Package selection (OPT7) on page 230: Removed K version
12. ST72321B-Auto MIcrocontroller FASTROM/ROM Option List on page 236:
1.2.2
–
updated to include only automotive devices
–
added notes 1 and 2 to PLL option
–
added caution about readout protection binary value being inverted between ROM
and Flash products
Minor content differences
1.
2.
ST72321Bxxx-Auto on page 1:
–
changed document title and description
–
removed LQFP32 package outline
Features on page 1:
–
modified data retention in Memories
–
replaced ‘up to 16 robust input ports’ with ‘up to 16 input ports’ in 1 analog
peripheral (low current coupling)
–
removed Instruction set from list
–
modified Development tools list
3.
Section 1.1: Description on page 18: Edited content
4.
Figure 3: 44-pin LQFP package pinout on page 27:
–
added Note 1 for pin 22
–
aligned names of pins 2, 3, 4, 5 and 6 to those in Table 2
5.
Section 2.1: Package pinout: Removed figure 32-pin LQFP package pinout
6.
Table 8: Interrupt software priority selection on page 42
–
- removed footnote link from PA6 and PA7 alternate functions cells
–
- linked Note 1 to unbonded I/O pins in LQFP44 column
–
- defined pin EVD as type ‘I’ and as input level ‘A’
7.
Table 8: Interrupt software priority selection on page 42: Added ‘level’ column
8.
Section 9.3: I/O port implementation on page 79: Removed following five tables:
9.
–
Standard ports PA5:4, PC7:0, PD7:0, PE7:3, PE1:0, PF7:3
–
Interrupt ports PA2:0, PB6:5, PB4, PB2:0, PF1:0 (with pull-up)
–
Interrupt ports PA3, PB7, PB3, PF2 (without pull-up)
–
True open drain ports PA7:6
–
Pull-up input port PE2 (configurations already exist in Table 30: I/O port
configuration on page 79)
Master mode operation on page 129: Modified text concerning SPI operation
10. Section 17.3.2: Starting the conversion on page 178: Replaced ‘A read to the ADCDRH
resets the EOC bit’ with ‘A read to the ADCDRH or a write to any bit of the ADCCSR
register resets the EOC bit’
11. Table 106: General operating conditions on page 193:
–
modified TA conditions to include only automotive temperature versions
–
added Note 1
12. Table 115: Crystal and ceramic resonator oscillators on page 200:
–
modified Note 2
21/247
Introduction
ST72321Bxxx-Auto
–
added Note 3
13. Table 116: OSCRANGE selection for typical resonators on page 201:
–
added title
–
removed footnote detailing SMD- and LEAD-devices
14. Table 121: EMS test results on page 205:
–
removed LQFP32 from conditions
–
added Note 1
15. Table 122: EMI emissions on page 205:
–
removed footnote 2
–
added 32/48/60 Kbyte Flash/LQFP64 configuration
–
added 48/60 Kbyte ROM/LQFP44 configuration
–
added 32/48 Kbyte ROM/LQFP64 configuration
–
changed values for 60 Kbyte ROM devices
16. Section 19.7.3: Absolute maximum ratings (electrical sensitivity) on page 206:
Removed text concerning dynamic latch-up (DLU)
17. Electrostatic discharge (ESD) on page 206: Replaced “JESD22-A114A/A115A
standard” with “AEC-Q100-002/-003/-011 standard” in last sentence
18. Table 123: ESD absolute maximum ratings on page 206:
–
added AEC-Q100 standards to conditions
–
added ‘Class’ column
–
added CDM
19. Static latch-up (LU) on page 206:
–
updated LU content
–
deleted DLU content
20. Table 124: Electrical sensitivities on page 206:
–
updated LU conditions and class
–
removed DLU row
21. Table 125: I/O port pin general characteristics on page 207:
–
replaced symbol for input leakage current IL with Ilkg
–
modified Note 4
–
Added Note 5
22. Table 136: 64-pin (14x14) low profile quad flat package mechanical data on page 224:
Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in
inches from 3 to 4 decimal digits
23. Table 137: 64-pin (10x10) low profile quad flat package mechanical data on page 225:
Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in
inches from 3 to 4 decimal digits
24. Table 138: 44-pin (10x10) low profile quad flat package mechanical data on page 226:
Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in
inches from 3 to 4 decimal digits
25. Added Section 20.3.1: Compatibility on page 227
26. Chapter 21: Device configuration and ordering information on page 228: Reorganized
subsections and made minor text editing changes
27. Table 139: Thermal characteristics on page 227:
22/247
ST72321Bxxx-Auto
Introduction
–
removed LQFP32 package
–
reorganized order of Note 1 and Note 2
28. Table 145: Flash user programmable device types on page 231:
–
updated to include only automotive device order codes
–
added Note 1
29. Added Figure 102: Flash commercial product code structure on page 231
30. Section 21.2: ROM device ordering information and transfer of customer code on
page 232: Edited and updated content
31. Added Table 146: FASTROM factory coded device types on page 232
32. Added Figure 103: FASTROM commercial product code structure on page 233
33. Added Table 147: ROM factory coded device types on page 234
34. Figure 104: ROM commercial product code structure on page 235: Updated to include
only automotive devices
35. Section 21.3: Development tools on page 237: Edited and updated content
36. Table 148: STMicroelectronics development tools on page 238: Removed K devices
from supported products
37. Table 149: Suggested list of socket types on page 238: Removed LQFP32 device
38. Section 21.4: ST7 application notes on page 238: Removed table ST7 application
notes
39. Chapter 22: Known limitations on page 239:
1.2.3
–
removed section ADC accuracy 32 Kbyte Flash devices
–
updated workaround in Section 22.1.6: TIMD set simultaneously with OC interrupt
on page 244
–
added Section 22.2: Limitations specific to 44-pin 32 Kbyte ROM devices on
page 244
Editing and formatting differences
1.
Reformatted document
2.
Table 1: Device summary on page 1: Updated to include only automotive specific
devices
3.
Section 1.1: Description on page 18: Edited content
4.
Section 4.6: IAP (in-application programming) on page 39: Removed text concerning
possibility to download code from USB and CAN interfaces
5.
Section 5.3.4: Condition code (CC) register on page 41: Replaced IxSPR with ISPRx
6.
Table 7: Interrupt management bits on page 42: Modified bit names
7.
Monitoring the VDD main supply on page 50: Edited bullet text at end of section
8.
Table 10: Effect of low power modes on SI on page 52: Added title
9.
Table 11: AVD interrupt control/wake-up capability on page 52: Added title
10. Table 13: Reset source flags on page 53: Added title
11. Figure 18: Priority decision process flowchart on page 56: Changed title
12. Table 15: CPU CC register interrupt bits description on page 59: Modified bit names
13. Table 17: Interrupt priority bits on page 60: Added title
14. Table 26: MCC/RTC low power mode selection on page 70: Added title
23/247
Introduction
ST72321Bxxx-Auto
15. Table 27: I/O output mode selection on page 76: Added title
16. Table 31: Effect of low power modes on I/O ports on page 80: Added title
17. Table 32: I/O port interrupt control/wake-up capability on page 80: Added title
18. Table 34: Effect of low power modes on WDG on page 85: Added title
19. Table 37: Effect of low power modes on MCC/RTC on page 88: Added title
20. Table 38: MCC/RTC interrupt control/wake-up capability on page 88: Added title
21. Table 40: Time base selection on page 90: Added title
22. Table 42: Beep frequency selection on page 90: Added title
23. Table 45: Prescaler selection for ART on page 98: Added title
24. Table 50: PWM output signal polarity selection on page 100: Added title
25. 16-bit read sequence on page 106: Minor text editing changes
26. Section 13.3.6: One Pulse mode on page 113: Edited step 1 of procedure
27. Section 13.3.7: Pulse width modulation mode on page 115: Edited steps 1 and 2 of
procedure
28. Table 55: Effect of low power modes on 16-bit timer on page 117: Added title
29. Table 56: 16-bit timer interrupt control/wake-up capability on page 117: Added title
30. Table 63: Effect of low power modes on SPI on page 135: Added title
31. Table 64: SPI interrupt control/wake-up capability on page 135: Added title
32. Table 70: Effect of low power modes on SCI on page 151: Added title
33. Table 71: SCI interrupt control/wake-up capability on page 151: Added title
34. Table 80: Effect of low power modes on I2C on page 168: Added title
35. Figure 69: Interrupt control logic diagram on page 168: Changed title
36. Table 81: I2C interrupt control/wake-up capability on page 168: Added title
37. Table 90: Effect of low power modes on ADC on page 179: Changed title
38. Table 103: Voltage characteristics on page 191: Removed note 2
39. Removed note below Figure 73: fCPU max versus VDD on page 193
40. Table 111: Oscillators, PLL and LVD current consumption on page 197: Added title
41. Table 114: External clock source on page 199: Replaced symbol for input leakage
current IL with Ilkg
42. Figure 74: Typical application with an external clock source on page 199: Replaced
symbol IL with Ilkg
43. Section 19.7: EMC (electromagnetic compatibility) characteristics on page 204:
Modified title
44. Table 128: ICCSEL/VPP pin characteristics on page 213: Replaced symbol for input
leakage current IL with Ilkg
45. Table 131: SPI characteristics on page 215: Added Note 1
46. Figure 90: SPI slave timing diagram with CPHA = 0(1) on page 216: Reorganized
footnotes
47. Figure 91: SPI slave timing diagram with CPHA = 1(1) on page 216: Reorganized
footnotes
48. Figure 92: SPI master timing diagram(1) on page 217: Reorganized footnotes
49. Table 132: I2C control interface characteristics on page 218: Reorganized footnotes
24/247
ST72321Bxxx-Auto
Introduction
50. Figure 93: Typical application with I2C BUS and timing diagram(1) on page 219:
Reorganized footnotes
51. Figure 96: Typical A/D converter application on page 221:
–
replaced symbol IL with Ilkg
–
removed Ilkg value ‘±1µA’
52. Figure 98: ADC error classification on page 223: Changed title
53. Table 136: 64-pin (14x14) low profile quad flat package mechanical data on page 224:
Added Note 1
54. Table 137: 64-pin (10x10) low profile quad flat package mechanical data on page 225:
Added Note 1
25/247
Package pinout and pin description
ST72321Bxxx-Auto
Package pinout and pin description
2.1
Package pinout
Figure 2.
64-pin LQFP 14x14 and 10x10 package pinout
PE3
PE2
PE1 / RDI
PE0 / TDO
VDD_2
OSC1
OSC2
VSS_2
TLI
EVD
RESET
VPP / ICCSEL
PA7 (HS) / SCLI
PA6 (HS) / SDAI
PA5 (HS)
PA4 (HS)
2
64
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
47
46
45
ei0
44
43
ei2
42
41
40
39
ei3
38
37
36
35
ei1
34
33
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
VSS_1
VDD_1
PA3 (HS)
PA2
PA1
PA0
PC7 / SS / AIN15
PC6 / SCK / ICCCLK
PC5 / MOSI / AIN14
PC4 / MISO / ICCDATA
PC3 (HS) / ICAP1_B
PC2 (HS) / ICAP2_B
PC1 / OCMP1_B / AIN13
PC0 / OCMP2_B / AIN12
VSS_0
VDD_0
AIN4 / PD4
AIN5 / PD5
AIN6 / PD6
AIN7 / PD7
VAREF
VSSA
VDD_3
VSS_3
MCO / AIN8 / PF0
BEEP / (HS) PF1
(HS) PF2
OCMP2_A / AIN9 / PF3
OCMP1_A / AIN10 / PF4
ICAP2_A / AIN11 / PF5
ICAP1_A / (HS) PF6
EXTCLK_A / (HS) PF7
(HS) PE4
(HS) PE5
(HS) PE6
(HS) PE7
PWM3 / PB0
PWM2 / PB1
PWM1 / PB2
PWM0 / PB3
ARTCLK / (HS) PB4
ARTIC1 / PB5
ARTIC2 / PB6
PB7
AIN0 / PD0
AIN1 / PD1
AIN2 / PD2
AIN3 / PD3
(HS) 20mA high sink capability
eix associated external interrupt vector
26/247
ST72321Bxxx-Auto
44-pin LQFP package pinout
PE0 / TDO
VDD_2
OSC1
OSC2
VSS_2
RESET
VPP / ICCSEL
PA7 (HS) / SCLI
PA6 (HS) / SDAI
PA5 (HS)
PA4 (HS)
Figure 3.
Package pinout and pin description
44 43 42 41 40 39 38 37 36 35 34
1
33
2
32
3
31
ei0
ei2
4
30
5
29
ei3
6
28
7
27
8
26
9
25
ei1
10
24
11
23
12 13 14 15 16 17 18 19 20 21 22
VSS_1
VDD_1
PA3 (HS)
PC7 / SS / AIN15
PC6 / SCK / ICCCLK
PC5 / MOSI / AIN14
PC4 / MISO / ICCDATA
PC3 (HS) / ICAP1_B
PC2 (HS) / ICAP2_B
PC1 / OCMP1_B / AIN13
PC0 / OCMP2_B / AIN12
AIN5 / PD5
VAREF
VSSA
MCO / AIN8 / PF0
BEEP / (HS) PF1
(HS) PF2
OCMP1_A / AIN10 / PF4
ICAP1_A / (HS) PF6
EXTCLK_A / (HS) PF7
VDD_0
VSS_0(1)
RDI / PE1
PWM3 / PB0
PWM2 / PB1
PWM1 / PB2
PWM0 / PB3
ARTCLK / (HS) PB4
AIN0 / PD0
AIN1 / PD1
AIN2 / PD2
AIN3 / PD3
AIN4 / PD4
(HS) 20mA high sink capability
eix associated external interrupt vector
1. Pin 22 is not connected on 48 Kbyte and 64 Kbyte ROM devices
For external pin connection guidelines, refer to Chapter 19: Electrical characteristics.
27/247
Package pinout and pin description
2.2
ST72321Bxxx-Auto
Pin description
In the device pin description table, the RESET configuration of each pin is shown in bold.
This configuration is valid as long as the device is in reset state.
Refer to Chapter 9: I/O ports on page 75 for more details on the software configuration of
the I/O ports.
Table 2.
Device pin description
4
(1)(2)
5
I/O CT
HS
X
X
X
X
Port E4
PE5(HS)
I/O CT
HS
X
X
X
X
Port E5
PE6(HS)
I/O CT
HS
X
X
X
X
Port E6
PE7(HS)
I/O CT
HS
X
X
X
X
Port E7
2
PB0/PWM3
I/O CT
X
ei2
X
X
Port B0
PWM Output 3
6
3
PB1/PWM2
I/O CT
X
ei2
X
X
Port B1
PWM Output 2
7
4
PB2/PWM1
I/O CT
X
ei2
X
X
Port B2
PWM Output 1
8
5
PB3/PWM0
I/O CT
X
X
X
Port B3
PWM Output 0
9
6
PB4(HS)/ARTCLK I/O CT
10
(1)(2)
11
(1)(2)
12
(1)(2)
13
-
-
HS
ana
PE4(HS)
-
Pin name
int
PP
(1)(2)
OD
3
wpu
(1)(2)
Output
float
2
Input
Main
function
(after
reset)
Output
(1)(2)
Port
Input
LQFP44
1
Level
Type
LQFP64
Pin No.
ei2
Alternate function
X
ei3
X
X
Port B4
PWM-ART External
Clock
PB5 / ARTIC1
I/O CT
X
ei3
X
X
Port B5
PWM-ART Input
Capture 1
PB6 / ARTIC2
I/O CT
X
ei3
X
X
Port B6
PWM-ART Input
Capture 2
PB7
I/O CT
X
X
X
Port B7
7
PD0/AIN0
I/O CT
X
X
X
X
X
Port D0
ADC Analog Input 0
14
8
PD1/AIN1
I/O CT
X
X
X
X
X
Port D1
ADC Analog Input 1
15
9
PD2/AIN2
I/O CT
X
X
X
X
X
Port D2
ADC Analog Input 2
16
10
PD3/AIN3
I/O CT
X
X
X
X
X
Port D3
ADC Analog Input 3
17
11
PD4/AIN4
I/O CT
X
X
X
X
X
Port D4
ADC Analog Input 4
18
12
PD5/AIN5
I/O CT
X
X
X
X
X
Port D5
ADC Analog Input 5
19
(1)(2)
PD6/AIN6
I/O CT
X
X
X
X
X
Port D6
ADC Analog Input 6
20
(2)(1)
PD7/AIN7
I/O CT
X
X
X
X
X
Port D7
ADC Analog Input 7
28/247
-
-
ei3
ST72321Bxxx-Auto
Table 2.
Package pinout and pin description
Device pin description (continued)
Level
Main
function
(after
reset)
13
VAREF(3)
I
Analog Reference Voltage for ADC
14
VSSA(3)
22
PP
OD
Output
ana
int
wpu
Input
float
Output
21
Pin name
Input
LQFP44
Port
LQFP64
Type
Pin No.
Alternate function
S
Analog Ground Voltage
(3)
S
Digital Main Supply Voltage
S
Digital Ground Voltage
23
-
VDD_3
24
-
VSS_3(3)
25
15
PF0/MCO/AIN8
I/O CT
26
16
PF1 (HS)/BEEP
I/O CT
27
17
PF2 (HS)
I/O CT
28
(1)(2)
PF3/OCMP2_A/
AIN9
I/O CT
X
X
29
18
PF4/OCMP1_A/
AIN10
I/O CT
X
30
(1)(2)
PF5/ICAP2_A/
AIN11
I/O CT
31
19
PF6(HS)/ICAP1_A I/O CT
32
20
PF7(HS)/
EXTCLK_A
33
21
VDD_0(3)
S
Digital Main Supply Voltage
34
22(4)
(3)
S
Digital Ground Voltage
35
23
PC0/OCMP2_B/
AIN12
I/O CT
X
X
X
X
X
Port C0
Timer B
Output
Compare 2
ADC
Analog
Input 12
36
24
PC1/OCMP1_B/
AIN13
I/O CT
X
X
X
X
X
Port C1
Timer B
Output
Compare 1
ADC
Analog
Input 13
37
25
PC2(HS)/
ICAP2_B
I/O CT
HS
X
X
X
X
Port C2
Timer B Input Capture 2
38
26
PC3(HS)/
ICAP1_B
I/O CT
HS
X
X
X
X
Port C3
Timer B Input Capture 1
39
27
PC4/MISO/
ICCDATA
I/O CT
X
X
X
X
Port C4
SPI Master
In / Slave
Out Data
ICC Data
Input
40
28
PC5/MOSI/AIN14
I/O CT
X
X
X
X
Port C5
SPI Master
Out / Slave
In Data
ADC
Analog
Input 14
-
-
VSS_0
I/O CT
X
X
Port F0
ADC
Main clock
Analog
out (fOSC/2)
Input 8
X
X
Port F1
Beep signal output
X
X
Port F2
X
X
X
Port F3
Timer A
Output
Compare 2
ADC
Analog
Input 9
X
X
X
X
Port F4
Timer A
Output
Compare 1
ADC
Analog
Input 10
X
X
X
X
X
Port F5
Timer A
Input
Capture 2
ADC
Analog
Input 11
HS
X
X
X
X
Port F6
Timer A Input Capture 1
HS
X
X
X
X
Port F7
Timer A External Clock
Source
X
ei1
HS
X
ei1
HS
X
X
ei1
X
29/247
Package pinout and pin description
Device pin description (continued)
Port
PP
OD
Output
ana
int
wpu
Input
float
Input
Pin name
Type
Level
LQFP44
LQFP64
Pin No.
Output
Table 2.
ST72321Bxxx-Auto
Main
function
(after
reset)
Alternate function
SPI Serial
Clock
29
PC6/SCK/ICCCLK I/O CT
X
X
42
30
PC7/SS/AIN15
I/O CT
X
X
43
(1)(2)
PA0
I/O CT
X
44
(2)(1)
PA1
I/O CT
45
(1)(2)
PA2
I/O CT
46
31
PA3(HS)
47
32
VDD_1
(3)
S
Digital Main Supply Voltage
48
33
VSS_1(3)
S
Digital Ground Voltage
49
34
PA4(HS)
I/O CT
HS
X
X
X
X
Port A4
50
35
PA5(HS)
I/O CT
HS
X
X
X
X
Port A5
51
36
PA6(HS)/SDAI
I/O CT
HS
X
T
Port A6
I2C Data
52
37
PA7(HS)/SCLI
I/O CT
HS
X
T
Port A7
I2C Clock
-
53
38
VPP/ ICCSEL
54
39
RESET
55
-
EVD
56
-
TLI
(3)
I/O CT
HS
X
Port C6
X
X
Port C7
ei0
X
X
Port A0
X
ei0
X
X
Port A1
X
ei0
X
X
Port A2
X
X
Port A3
Caution: Negative
current injection not
allowed on this pin
(Flash devices only)
41
-
X
ICC Clock
Output
X
X
ei0
SPI Slave
Select
(active low)
ADC
Analog
Input 15
Must be tied low. In Flash
programming mode, this pin acts
as the programming voltage input
VPP. See Section 19.9.2:
ICCSEL/VPP pin for more details.
High voltage must not be applied
to ROM devices.
I
I/O CT
I
A
I
CT
Top priority non-maskable interrupt
External voltage detector
X
Top level interrupt input pin
S
Digital Ground Voltage
57
40
VSS_2
58
41
OSC2(5)
I/O
59
42
OSC1(5)
I
External clock input or Resonator
oscillator inverter input
60
43
VDD_2(3)
S
Digital Main Supply Voltage
61
44
PE0/TDO
30/247
I/O CT
Resonator oscillator inverter output
X
X
X
X
Port E0
SCI Transmit Data Out
ST72321Bxxx-Auto
Device pin description (continued)
(2)(1)
I/O CT
PE3
I/O CT
X
X
X
Port E1
X
(6)
(6)
Port E2
X
Port E3
X
X
ana
X
int
Output
Type
PE2
PP
-
I/O CT
Output
OD
63
PE1/RDI
Input
Main
function
(after
reset)
wpu
1
(1)
Pin name
Port
float
62
64
Level
LQFP44
LQFP64
Pin No.
Input
Table 2.
Package pinout and pin description
X
X
X
Alternate function
SCI Receive Data In
1. On the chip, each I/O port may have up to 8 pads. Pads that are not bonded to external pins are in input pull-up
configuration after reset. The configuration of these pads must be kept at reset state to avoid added current consumption.
2. On the chip, each I/O port may have up to eight pads. Pads that are not bonded to external pins are in input pull-up
configuration after reset. The configuration of these pads must be kept at reset state to avoid added current consumption.
3. It is mandatory to connect all available VDD and VAREF pins to the supply voltage and all VSS and VSSA pins to ground.
4. Not connected in 48 Kbyte and 64 Kbyte ROM devices
5. OSC1 and OSC2 pins connect a crystal/ceramic resonator or an external source to the on-chip oscillator; see Chapter 1:
Introduction on page 18 and Section 19.5: Clock and timing characteristics on page 199 for more details.
6. Pull-up always activated on PE2; see limitation Section 22.1.8: Pull-up always active on PE2 on page 244.
Legend / Abbreviations for Table 2:
Type:
I = input
O = output
S = supply
Input level:
A = dedicated analog input
In/Output level:
C = CMOS 0.3VDD/0.7VDD
CT = CMOS 0.3VDD/0.7VDD with input trigger
Output level:
HS = 20mA high sink (on N-buffer only)
Port and control configuration:
●
Input:
float = floating
wpu = weak pull-up
int = interrupt(a)
ana = analog
●
Output:
OD = open-drain(b)
PP = push-pull
a. In the interrupt input column, “eiX” defines the associated external interrupt vector. If the weak pull-up column
(wpu) is merged with the interrupt column (int), then the I/O configuration is pull-up interrupt input, otherwise
the configuration is floating interrupt input.
b. In the open-drain output column, “T” defines a true open-drain I/O (P-Buffer and protection diode to VDD are not
implemented). See Chapter 9: I/O ports on page 75 and Section 19.8: I/O port pin characteristics on page 207
for more details.
31/247
Register and memory map
3
ST72321Bxxx-Auto
Register and memory map
As shown in Figure 4, the MCU is capable of addressing 64 Kbytes of memories and I/O
registers.
The available memory locations consist of 128 bytes of register locations, up to 2 Kbytes of
RAM and up to 60 Kbytes of user program memory. The RAM space includes up to 256
bytes for the stack from 0100h to 01FFh.
The highest address bytes contain the user reset and interrupt vectors.
Caution:
Memory locations marked as “Reserved” must never be accessed. Accessing a reserved
area can have unpredictable effects on the device.
Related documentation
Executing Code in ST7 RAM (AN 985)
Figure 4.
0000h
007Fh
0080h
Memory map
HW Registers
(see Table 3)
087Fh
0880h
Reserved
0FFFh
1000h
Program Memory
(60, 48 or 32 Kbytes)
FFFFh
32/247
Short Addressing
RAM (zero page)
00FFh
0100h
RAM
(2048, 1536 or 1024 bytes)
FFDFh
FFE0h
0080h
Interrupt and Reset Vectors
(see Table 19)
256 bytes Stack
01FFh
0200h
or 047Fh
or 067Fh
or 087Fh
1000h
16-bit Addressing
RAM
4000h
8000h
FFFFh
60 Kbytes
48 Kbytes
32 Kbytes
ST72321Bxxx-Auto
Table 3.
Address
Register and memory map
Hardware register map
Block
Register label
Register name
Reset status
Remarks
0000h
0001h
0002h
Port
A(2)
PADR
PADDR
PAOR
Port A Data Register
Port A Data Direction Register
Port A Option Register
00h(1)
00h
00h
R/W
R/W
R/W
0003h
0004h
0005h
Port B(2)
PBDR
PBDDR
PBOR
Port B Data Register
Port B Data Direction Register
Port B Option Register
00h(1)
00h
00h
R/W
R/W
R/W
Port C
PCDR
PCDDR
PCOR
Port C Data Register
Port C Data Direction Register
Port C Option Register
00h(1)
00h
00h
R/W
R/W
R/W
Port
D(2)
PDDR
PDDDR
PDOR
Port D Data Register
Port D Data Direction Register
Port D Option Register
00h(1)
00h
00h
R/W
R/W
R/W
000Ch
000Dh
000Eh
Port
E(2)
PEDR
PEDDR
PEOR
Port E Data Register
Port E Data Direction Register
Port E Option Register
00h(1)
00h
00h
R/W
R/W(2)
R/W(2)
000Fh
0010h
0011h
Port F(2)
PFDR
PFDDR
PFOR
Port F Data Register
Port F Data Direction Register
Port F Option Register
00h(1)
00h
00h
R/W
R/W
R/W
0006h
0007h
0008h
0009h
000Ah
000Bh
0012h
to
0017h
0018h
0019h
001Ah
001Bh
001Ch
001Dh
001Eh
Reserved area (6 bytes)
I2C
I2CCR
I2CSR1
I2CSR2
I2CCCR
I2COAR1
I2COAR2
I2CDR
001Fh
0020h
0021h
0022h
0023h
0024h
0025h
0026h
0027h
002Ah
SPI
ITC
FLASH
R/W
Read only
Read only
R/W
R/W
R/W
R/W
SPIDR
SPICR
SPICSR
SPI Data I/O Register
SPI Control Register
SPI Control/Status Register
xxh
0xh
00h
R/W
R/W
R/W
ISPR0
ISPR1
ISPR2
ISPR3
Interrupt Software Priority Register 0
Interrupt Software Priority Register 1
Interrupt Software Priority Register 2
Interrupt Software Priority Register 3
FFh
FFh
FFh
FFh
R/W
R/W
R/W
R/W
EICR
External Interrupt Control Register
00h
R/W
FCSR
Flash Control/Status Register
00h
R/W
Watchdog Control Register
7Fh
R/W
000x 000xb
R/W
00h
00h
R/W
R/W
WATCHDOG WDGCR
002Bh
002Ch
002Dh
00h
00h
00h
00h
00h
00h
00h
Reserved area (2 bytes)
0028h
0029h
I2C Control Register
I2C Status Register 1
I2C Status Register 2
I2C Clock Control Register
I2C Own Address Register 1
I2C Own Address Register2
I2C Data Register
MCC
SICSR
System Integrity Control/Status Register
MCCSR
MCCBCR
Main Clock Control/Status Register
Main Clock Controller/Beep Control Register
33/247
Register and memory map
Table 3.
Address
Hardware register map (continued)
Block
Register label
002Eh
to
0030h
0031h
0032h
0033h
0034h
0035h
0036h
0037h
0038h
0039h
003Ah
003Bh
003Ch
003Dh
003Eh
003Fh
0050h
0051h
0052h
0053h
0054h
0055h
0056h
0057h
TIMER A
TACR2
TACR1
TACSR
TAIC1HR
TAIC1LR
TAOC1HR
TAOC1LR
TACHR
TACLR
TAACHR
TAACLR
TAIC2HR
TAIC2LR
TAOC2HR
TAOC2LR
34/247
Reset status
Remarks
Timer A Control Register 2
Timer A Control Register 1
Timer A Control/Status Register
Timer A Input Capture 1 High Register
Timer A Input Capture 1 Low Register
Timer A Output Compare 1 High Register
Timer A Output Compare 1 Low Register
Timer A Counter High Register
Timer A Counter Low Register
Timer A Alternate Counter High Register
Timer A Alternate Counter Low Register
Timer A Input Capture 2 High Register
Timer A Input Capture 2 Low Register
Timer A Output Compare 2 High Register
Timer A Output Compare 2 Low Register
00h
00h
xxxx x0xxb
xxh
xxh
80h
00h
FFh
FCh
FFh
FCh
xxh
xxh
80h
00h
R/W
R/W
R/W
Read only
Read only
R/W
R/W
Read only
Read only
Read only
Read only
Read only
Read only
R/W
R/W
Reserved area (1 byte)
TIMER B
SCI
TBCR2
TBCR1
TBCSR
TBIC1HR
TBIC1LR
TBOC1HR
TBOC1LR
TBCHR
TBCLR
TBACHR
TBACLR
TBIC2HR
TBIC2LR
TBOC2HR
TBOC2LR
Timer B Control Register 2
Timer B Control Register 1
Timer B Control/Status Register
Timer B Input Capture 1 High Register
Timer B Input Capture 1 Low Register
Timer B Output Compare 1 High Register
Timer B Output Compare 1 Low Register
Timer B Counter High Register
Timer B Counter Low Register
Timer B Alternate Counter High Register
Timer B Alternate Counter Low Register
Timer B Input Capture 2 High Register
Timer B Input Capture 2 Low Register
Timer B Output Compare 2 High Register
Timer B Output Compare 2 Low Register
00h
00h
xxxx x0xxb
xxh
xxh
80h
00h
FFh
FCh
FFh
FCh
xxh
xxh
80h
00h
R/W
R/W
R/W
Read only
Read only
R/W
R/W
Read only
Read only
Read only
Read only
Read only
Read only
R/W
R/W
SCISR
SCIDR
SCIBRR
SCICR1
SCICR2
SCIERPR
SCI Status Register
SCI Data Register
SCI Baud Rate Register
SCI Control Register 1
SCI Control Register 2
SCI Extended Receive Prescaler Register
Reserved area
SCI Extended Transmit Prescaler Register
C0h
xxh
00h
x000 0000b
00h
00h
--00h
Read only
R/W
R/W
R/W
R/W
R/W
00h
00h
00h
R/W
Read only
Read only
SCIETPR
0058h
to
006Fh
0070h
0071h
0072h
Register name
Reserved area (3 bytes)
0040h
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
ST72321Bxxx-Auto
R/W
Reserved Area (24 bytes)
ADC
ADCCSR
ADCDRH
ADCDRL
Control/Status Register
Data High Register
Data Low Register
ST72321Bxxx-Auto
Table 3.
Address
0073h
0074h
0075h
0076h
0077h
0078h
0079h
007Ah
007Bh
007Ch
007Dh
007Eh
007Fh
Register and memory map
Hardware register map (continued)
Block
PWM ART
Register label
PWMDCR3
PWMDCR2
PWMDCR1
PWMDCR0
PWMCR
ARTCSR
ARTCAR
ARTARR
ARTICCSR
ARTICR1
ARTICR2
Register name
Reset status
Remarks
PWM AR Timer Duty Cycle Register 3
PWM AR Timer Duty Cycle Register 2
PWM AR Timer Duty Cycle Register 1
PWM AR Timer Duty Cycle Register 0
PWM AR Timer Control Register
Auto-Reload Timer Control/Status Register
Auto-Reload Timer Counter Access Register
Auto-Reload Timer Auto-Reload Register
AR Timer Input Capture Control/Status Reg.
AR Timer Input Capture Register 1
AR Timer Input Capture Register 1
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Read only
Read only
Reserved area (2 bytes)
1. The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the
I/O pins are returned instead of the DR register contents.
2. The bits associated with unavailable pins must always keep their reset value.
Legend: x = undefined, R/W = read/write
35/247
Flash program memory
ST72321Bxxx-Auto
4
Flash program memory
4.1
Introduction
The ST7 dual voltage High Density Flash (HDFlash) is a non-volatile memory that can be
electrically erased as a single block or by individual sectors and programmed on a byte-bybyte basis using an external VPP supply.
The HDFlash devices can be programmed and erased off-board (plugged in a programming
tool) or on-board using ICP (in-circuit programming) or IAP (in-application programming).
The array matrix organization allows each sector to be erased and reprogrammed without
affecting other sectors.
4.2
Main features
●
4.3
3 Flash programming modes:
–
Insertion in a programming tool. In this mode, all sectors including option bytes
can be programmed or erased.
–
ICP (in-circuit programming). In this mode, all sectors including option bytes can
be programmed or erased without removing the device from the application board.
–
IAP (in-application programming). In this mode, all sectors except Sector 0 can be
programmed or erased without removing the device from the application board
and while the application is running.
●
ICT (in-circuit testing) for downloading and executing user application test patterns in
RAM
●
Readout protection
●
Register Access Security System (RASS) to prevent accidental programming or
erasing
Structure
The Flash memory is organized in sectors and can be used for both code and data storage.
Depending on the overall Flash memory size in the microcontroller device, there are up to
three user sectors (see Table 4). Each of these sectors can be erased independently to
avoid unnecessary erasing of the whole Flash memory when only a partial erasing is
required.
Table 4.
Sectors available in Flash devices
Flash size (bytes)
Available sectors
4K
Sector 0
8K
Sectors 0, 1
> 8K
Sectors 0, 1, 2
The first two sectors have a fixed size of 4 Kbytes (see Figure 5). They are mapped in the
upper part of the ST7 addressing space so the reset and interrupt vectors are located in
Sector 0 (F000h-FFFFh).
36/247
ST72321Bxxx-Auto
Flash program memory
Figure 5.
Memory map and sector address
4K
8K
10K
16K
24K
32K
48K
60K
1000h
3FFFh
FLASH
MEMORY SIZE
7FFFh
9FFFh
SECTOR 2
BFFFh
D7FFh
2 Kbytes
DFFFh
4.3.1
8 Kbytes
16 Kbytes
24 Kbytes
40 Kbytes
52 Kbytes
EFFFh
4 Kbytes
SECTOR 1
FFFFh
4 Kbytes
SECTOR 0
Readout protection
Readout protection, when selected, provides a protection against program memory content
extraction and against write access to Flash memory. Even if no protection can be
considered as totally unbreakable, the feature provides a very high level of protection for a
general purpose microcontroller.
In Flash devices, this protection is removed by reprogramming the option. In this case, the
entire program memory is first automatically erased and the device can be reprogrammed.
Readout protection selection depends on the device type:
●
In Flash devices it is enabled and removed through the FMP_R bit in the option byte.
●
In ROM devices it is enabled by mask option specified in the Option List.
Note:
4.4
ICC interface
ICC needs a minimum of 4 and up to 6 pins to be connected to the programming tool (see
Figure 6). These pins are:
RESET:
device reset
VSS:
device power supply ground
ICCCLK:
ICC output serial clock pin
ICCDATA:
ICC input/output serial data pin
ICCSEL/VPP:
programming voltage
OSC1 (or OSCIN): main clock input for external source (optional)
VDD:
application board power supply (optional, see Figure 6, Note 3)
37/247
Flash program memory
Figure 6.
ST72321Bxxx-Auto
Typical ICC interface
PROGRAMMING TOOL
ICC CONNECTOR
ICC Cable
APPLICATION BOARD
(See Note 3)
ICC CONNECTOR
HE10 CONNECTOR TYPE
OPTIONAL
(See Note 4)
9
7
5
3
1
10
8
6
4
2
APPLICATION
RESET SOURCE
See Note 2
10kΩ
ICCDATA
ICCCLK
ST7
RESET
See Note 1
ICCSEL/VPP
OSC1
CL1
OSC2
VDD
CL2
VSS
APPLICATION
POWER SUPPLY
APPLICATION
I/O
1. If the ICCCLK or ICCDATA pins are only used as outputs in the application, no signal isolation is necessary. As soon as the
programming tool is plugged to the board, even if an ICC session is not in progress, the ICCCLK and ICCDATA pins are
not available for the application. If they are used as inputs by the application, isolation such as a serial resistor has to
implemented in case another device forces the signal. Refer to the programming tool documentation for recommended
resistor values.
2. During the ICC session, the programming tool must control the RESET pin. This can lead to conflicts between the
programming tool and the application reset circuit if it drives more than 5mA at high level (push-pull output or pull-up
resistor < 1K). A schottky diode can be used to isolate the application RESET circuit in this case. When using a classical
RC network with R > 1K or a reset management IC with open-drain output and pull-up resistor > 1K, no additional
components are needed. In all cases the user must ensure that no external reset is generated by the application during the
ICC session.
3. The use of Pin 7 of the ICC connector depends on the programming tool architecture. This pin must be connected when
using most ST programming tools (it is used to monitor the application power supply). Please refer to the programming tool
manual.
4. Pin 9 has to be connected to the OSC1 or OSCIN pin of the ST7 when the clock is not available in the application or if the
selected clock option is not programmed in the option byte. ST7 devices with multi-oscillator capability need to have OSC2
grounded in this case.
4.5
ICP (in-circuit programming)
To perform ICP the microcontroller must be switched to ICC (in-circuit communication) mode
by an external controller or programming tool.
Depending on the ICP code downloaded in RAM, Flash memory programming can be fully
customized (number of bytes to program, program locations, or selection serial
communication interface for downloading).
When using an STMicroelectronics or third-party programming tool that supports ICP and
the specific microcontroller device, the user needs only to implement the ICP hardware
interface on the application board (see Figure 6). For more details on the pin locations, refer
to the device pinout description.
38/247
ST72321Bxxx-Auto
4.6
Flash program memory
IAP (in-application programming)
This mode uses a BootLoader program previously stored in Sector 0 by the user (in ICP
mode or by plugging the device in a programming tool).
This mode is fully controlled by user software. This allows it to be adapted to the user
application, (such as user-defined strategy for entering programming mode, choice of
communications protocol used to fetch the data to be stored). For example, it is possible to
download code from the serial peripheral or serial communication interface and program it in
the Flash. IAP mode can be used to program any of the Flash sectors except Sector 0,
which is write/erase protected to allow recovery in case errors occur during the
programming operation.
4.7
Related documentation
For details on Flash programming and ICC protocol, refer to the ST7 Flash Programming
Reference Manual and to the ST7 ICC Protocol Reference Manual.
4.8
Flash control/status register (FCSR)
FSCR
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
RW
RW
RW
RW
RW
RW
RW
RW
This register is reserved for use by programming tool software. It controls the Flash
programming and erasing operations.
Table 5.
Flash control/status register address and reset value
Address (Hex.)
0029h
Register label
FCSR
Reset value
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
39/247
Central processing unit (CPU)
ST72321Bxxx-Auto
5
Central processing unit (CPU)
5.1
Introduction
This CPU has a full 8-bit architecture and contains six internal registers allowing efficient 8bit data manipulation.
5.2
5.3
Main features
●
Enable executing 63 basic instructions
●
Fast 8-bit by 8-bit multiply
●
17 main addressing modes (with indirect addressing mode)
●
Two 8-bit index registers
●
16-bit stack pointer
●
Low power Halt and Wait modes
●
Priority maskable hardware interrupts
●
Non-maskable software/hardware interrupts
CPU registers
The six CPU registers shown in Figure 7 are not present in the memory mapping and are
accessed by specific instructions.
Figure 7.
CPU registers
7
0
Accumulator
Reset value = XXh
7
0
X index register
Reset value = XXh
7
0
Y index register
Reset value = XXh
15
PCH
8 7
PCL
0
Program counter
Reset value = reset vector @ FFFEh-FFFFh
7
0
1 1 I1 H I0 N Z C
Reset value = 1 1 1 X 1 X X X
15
8 7
Condition code register
0
Stack pointer
Reset value = stack higher address
X = undefined value
40/247
ST72321Bxxx-Auto
5.3.1
Central processing unit (CPU)
Accumulator (A)
The accumulator is an 8-bit general purpose register used to hold operands and the results
of the arithmetic and logic calculations as well as data manipulations.
5.3.2
Index registers (X and Y)
These 8-bit registers are used to create effective addresses or as temporary storage areas
for data manipulation (the Cross-Assembler generates a precede instruction (PRE) to
indicate that the following instruction refers to the Y register.)
The Y register is not affected by the interrupt automatic procedures.
5.3.3
Program counter (PC)
The program counter is a 16-bit register containing the address of the next instruction to be
executed by the CPU. It is made of two 8-bit registers PCL (Program Counter Low which is
the LSB) and PCH (Program Counter High which is the MSB).
5.3.4
Condition code (CC) register
The 8-bit condition code register contains the interrupt masks and four flags representative
of the result of the instruction just executed. This register can also be handled by the PUSH
and POP instructions.
These bits can be individually tested and/or controlled by specific instructions.
Reset value: 111x1xxx
CC
7
6
5
4
3
2
1
0
1
1
I1
H
I0
N
Z
C
RW
RW
RW
RW
RW
RW
Table 6.
Bit Name
4
2
Arithmetic management bits
Function
H
Half carry
This bit is set by hardware when a carry occurs between bits 3 and 4 of the ALU
during an ADD or ADC instructions. It is reset by hardware during the same
instructions.
0: No half carry has occurred.
1: A half carry has occurred.
This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD
arithmetic subroutines.
N
Negative
This bit is set and cleared by hardware. It is representative of the result sign of the
last arithmetic, logical or data manipulation. It is a copy of the result 7th bit.
0: The result of the last operation is positive or null.
1: The result of the last operation is negative (that is, the most significant bit is a logic
1).
This bit is accessed by the JRMI and JRPL instructions.
41/247
Central processing unit (CPU)
Table 6.
ST72321Bxxx-Auto
Arithmetic management bits (continued)
Bit Name
1
0
Function
Z
Zero
This bit is set and cleared by hardware. This bit indicates that the result of the last
arithmetic, logical or data manipulation is zero.
0: The result of the last operation is different from zero.
1: The result of the last operation is zero.
This bit is accessed by the JREQ and JRNE test instructions.
C
Carry/borrow
This bit is set and cleared by hardware and software. It indicates an overflow or an
underflow has occurred during the last arithmetic operation.
0: No overflow or underflow has occurred.
1: An overflow or underflow has occurred.
This bit is driven by the SCF and RCF instructions and tested by the JRC and JRNC
instructions. It is also affected by the “bit test and branch”, shift and rotate
instructions.
Table 7.
Interrupt management bits
Bit Name
Function
5
I1
Interrupt Software Priority 1
The combination of the I1 and I0 bits gives the current interrupt software priority.
3
I0
Interrupt Software Priority 0
The combination of the I1 and I0 bits gives the current interrupt software priority.
Table 8.
Interrupt software priority selection
Interrupt software priority
Level
I1
I0
Low
1
0
Level 1
0
1
Level 2
0
0
1
1
Level 0 (main)
High
Level 3 (= interrupt disable)
These two bits are set/cleared by hardware when entering in interrupt. The loaded value is
given by the corresponding bits in the interrupt software priority registers (ISPRx). They can
be also set/cleared by software with the RIM, SIM, IRET, HALT, WFI and PUSH/POP
instructions.
See Chapter 7: Interrupts on page 55 for more details.
5.3.5
Stack pointer (SP) register
7
SP
Reset value: 01 FFh
15
14
13
12
11
10
9
8
0
0
0
0
0
0
0
1
7
5
4
3
2
1
0
SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0
RW
42/247
6
RW
RW
RW
RW
RW
RW
RW
ST72321Bxxx-Auto
Central processing unit (CPU)
The stack pointer is a 16-bit register which is always pointing to the next free location in the
stack. It is then decremented after data has been pushed onto the stack and incremented
before data is popped from the stack (see Figure 8).
Since the stack is 256 bytes deep, the 8 most significant bits are forced by hardware.
Following an MCU Reset, or after a reset stack pointer instruction (RSP), the stack pointer
contains its reset value (the SP7 to SP0 bits are set) which is the stack higher address.
The least significant byte of the stack pointer (called S) can be directly accessed by an LD
instruction.
Note:
When the lower limit is exceeded, the stack pointer wraps around to the stack upper limit,
without indicating the stack overflow. The previously stored information is then overwritten
and therefore lost. The stack also wraps in case of an underflow.
The stack is used to save the return address during a subroutine call and the CPU context
during an interrupt. The user may also directly manipulate the stack by means of the PUSH
and POP instructions. In the case of an interrupt, the PCL is stored at the first location
pointed to by the SP. The other registers are then stored in the next locations as shown in
Figure 8.
●
When an interrupt is received, the SP is decremented and the context is pushed on the
stack.
●
On return from interrupt, the SP is incremented and the context is popped from the
stack.
A subroutine call occupies two locations and an interrupt five locations in the stack area.
Figure 8.
Stack manipulation example
CALL
Subroutine
PUSH Y
Interrupt
Event
POP Y
RET
or RSP
IRET
@ 0100h
SP
SP
CC
A
SP
CC
A
X
X
X
PCH
PCH
PCH
PCL
PCL
PCL
PCH
PCH
PCH
PCH
PCH
PCL
PCL
PCL
PCL
PCL
SP
@ 01FFh
Y
CC
A
SP
SP
Stack Higher Address = 01FFh
Stack Lower Address = 0100h
43/247
Supply, reset and clock management
ST72321Bxxx-Auto
6
Supply, reset and clock management
6.1
Introduction
The device includes a range of utility features for securing the application in critical
situations (for example in case of a power brown-out), and reducing the number of external
components. An overview is shown in Figure 9.
For more details, refer to the dedicated parametric section.
6.2
Main features
●
Optional PLL for multiplying the frequency by 2 (not to be used with internal RC
oscillator)
●
Reset Sequence Manager (RSM)
●
Multi-oscillator Clock Management (MO)
●
Figure 9.
OSC2
–
5 crystal/ceramic resonator oscillators
–
1 internal RC oscillator
System Integrity Management (SI)
–
Main supply low voltage detection (LVD)
–
Auxiliary voltage detector (AVD) with interrupt capability for monitoring the main
supply or the EVD pin
Clock, reset and supply block diagram
MULTI-
fOSC
OSCILLATOR
OSC1
fOSC2
PLL
(option)
(MO)
MAIN CLOCK
fCPU
CONTROLLER
WITH REAL-TIME
CLOCK (MCC/RTC)
SYSTEM INTEGRITY MANAGEMENT
RESET SEQUENCE
RESET
MANAGER
(RSM)
WATCHDOG
AVD Interrupt Request
TIMER (WDG)
SICSR
AVD AVD AVD LVD
S
F RF
IE
0
0
0
LOW VOLTAGE
VSS
DETECTOR
VDD
(LVD)
0
EVD
44/247
AUXILIARY VOLTAGE
DETECTOR
1
(AVD)
WDG
RF
ST72321Bxxx-Auto
6.3
Supply, reset and clock management
Phase locked loop
If the clock frequency input to the PLL is in the range 2 to 4 MHz, the PLL can be used to
multiply the frequency by two to obtain an fOSC2 of 4 to 8 MHz. The PLL is enabled by option
byte. If the PLL is disabled, then fOSC2 = fOSC/2.
Caution:
The PLL is not recommended for applications where timing accuracy is required (see
Section 19.5.5: PLL characteristics on page 202).
Figure 10. PLL block diagram
PLL x 2
0
/2
1
fOSC
fOSC2
PLL OPTION BIT
6.4
Multi-oscillator (MO)
The main clock of the ST7 can be generated by three different source types coming from the
multi-oscillator block:
●
an external source
●
4 crystal or ceramic resonator oscillators
●
an internal high frequency RC oscillator
Each oscillator is optimized for a given frequency range in terms of consumption and is
selectable through the option byte. The associated hardware configurations are shown in
Table 9. Refer to Chapter 19: Electrical characteristics for more details.
Caution:
The OSC1 and/or OSC2 pins must not be left unconnected. For the purposes of Failure
Mode and Effect Analysis, it should be noted that if the OSC1 and/or OSC2 pins are left
unconnected, the ST7 main oscillator may start and, in this configuration, could generate an
fOSC clock frequency in excess of the allowed maximum (> 16 MHz), putting the ST7 in an
unsafe/undefined state. The product behavior must therefore be considered undefined when
the OSC pins are left unconnected.
External clock source
In this external clock mode, a clock signal (square, sinus or triangle) with ~50% duty cycle
has to drive the OSC1 pin while the OSC2 pin is tied to ground.
Crystal/ceramic oscillators
This family of oscillators has the advantage of producing a very accurate rate on the main
clock of the ST7. The selection within a list of four oscillators with different frequency ranges
has to be done by option byte in order to reduce consumption (refer to Section 21.1.1: Flash
configuration on page 228 for more details on the frequency ranges). In this mode of the
45/247
Supply, reset and clock management
ST72321Bxxx-Auto
multi-oscillator, the resonator and the load capacitors have to be placed as close as possible
to the oscillator pins in order to minimize output distortion and start-up stabilization time.
The loading capacitance values must be adjusted according to the selected oscillator.
These oscillators are not stopped during the RESET phase to avoid losing time in the
oscillator start-up phase.
Internal RC oscillator
This oscillator allows a low cost solution for the main clock of the ST7 using only an internal
resistor and capacitor. Internal RC oscillator mode has the drawback of a lower frequency
accuracy and should not be used in applications that require accurate timing.
In this mode, the two oscillator pins have to be tied to ground.
Table 9.
ST7 clock sources
Hardware configuration
External clock
ST7
OSC1
OSC2
Internal RC oscillator Crystal/Ceramic resonators
EXTERNAL
SOURCE
ST7
OSC1
CL1
OSC2
LOAD
CAPACITORS
CL2
ST7
OSC1
6.5
Reset sequence manager (RSM)
6.5.1
Introduction
OSC2
The reset sequence manager includes three RESET sources as shown in Figure 11:
●
External RESET source pulse
●
Internal LVD RESET (low voltage detection)
●
Internal WATCHDOG RESET
These sources act on the RESET pin and it is always kept low during the delay phase.
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ST72321Bxxx-Auto
Supply, reset and clock management
The RESET service routine vector is fixed at addresses FFFEh-FFFFh in the ST7 memory
map.
The basic RESET sequence consists of three phases as shown in Figure 12:
Caution:
●
Active phase depending on the RESET source
●
256 or 4096 CPU clock cycle delay (selected by option byte)
●
RESET vector fetch
When the ST7 is unprogrammed or fully erased, the Flash is blank and the RESET vector is
not programmed. For this reason, it is recommended to keep the RESET pin in low state
until programming mode is entered, in order to avoid unwanted behavior.
The 256 or 4096 CPU clock cycle delay allows the oscillator to stabilize and ensures that
recovery has taken place from the Reset state. The shorter or longer clock cycle delay
should be selected by option byte to correspond to the stabilization time of the external
oscillator used in the application (see Section 21.1.1: Flash configuration on page 228).
The RESET vector fetch phase duration is 2 clock cycles.
Figure 11. Reset block diagram
VDD
RON
INTERNAL
RESET
Filter
RESET
PULSE
GENERATOR
WATCHDOG RESET
LVD RESET
Figure 12. RESET sequence phases
RESET
ACTIVE PHASE
6.5.2
INTERNAL RESET
256 or 4096 CLOCK CYCLES
FETCH
VECTOR
Asynchronous external RESET pin
The RESET pin is both an input and an open-drain output with integrated RON weak pull-up
resistor. This pull-up has no fixed value but varies in accordance with the input voltage. It
can be pulled low by external circuitry to reset the device. See Section 19.9: Control pin
characteristics on page 211 for more details.
A RESET signal originating from an external source must have a duration of at least
th(RSTL)in in order to be recognized (see Figure 13). This detection is asynchronous and
therefore the MCU can enter reset state even in Halt mode.
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Supply, reset and clock management
ST72321Bxxx-Auto
The RESET pin is an asynchronous signal which plays a major role in EMS performance. In
a noisy environment, it is recommended to follow the guidelines mentioned in Chapter 19:
Electrical characteristics.
If the external RESET pulse is shorter than tw(RSTL)out (see short ext. Reset in Figure 13),
the signal on the RESET pin may be stretched. Otherwise the delay will not be applied (see
long ext. Reset in Figure 13). Starting from the external RESET pulse recognition, the
device RESET pin acts as an output that is pulled low during at least tw(RSTL)out.
6.5.3
External power-on RESET
If the LVD is disabled by option byte, to start up the microcontroller correctly, the user must
ensure by means of an external reset circuit that the reset signal is held low until VDD is over
the minimum level specified for the selected fOSC frequency (see Section 19.3: Operating
conditions on page 193).
A proper reset signal for a slow rising VDD supply can generally be provided by an external
RC network connected to the RESET pin.
6.5.4
Internal low voltage detector (LVD) RESET
Two different RESET sequences caused by the internal LVD circuitry can be distinguished:
●
Power-on RESET
●
Voltage drop RESET
The device RESET pin acts as an output that is pulled low when VDD < VIT+ (rising edge) or
VDD < VIT- (falling edge) as shown in Figure 13.
The LVD filters spikes on VDD larger than tg(VDD) to avoid parasitic resets.
6.5.5
Internal watchdog RESET
The RESET sequence generated by an internal Watchdog counter overflow is shown in
Figure 13.
Starting from the Watchdog counter underflow, the device RESET pin acts as an output that
is pulled low during at least tw(RSTL)out.
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ST72321Bxxx-Auto
Supply, reset and clock management
Figure 13. RESET sequences
VDD
VIT+(LVD)
VIT-(LVD)
LVD
RESET
RUN
SHORT EXT.
RESET
RUN
Active Phase
LONG EXT.
RESET
RUN
Active
Phase
tw(RSTL)out
WATCHDOG
RESET
RUN
Active
Phase
RUN
Active
Phase
tw(RSTL)out
th(RSTL)in
tw(RSTL)out
th(RSTL)in
DELAY
EXTERNAL
RESET
SOURCE
RESET PIN
WATCHDOG
RESET
WATCHDOG UNDERFLOW
INTERNAL RESET (256 or 4096 TCPU)
VECTOR FETCH
6.6
System integrity management (SI)
The System Integrity Management block contains the Low Voltage Detector (LVD) and
Auxiliary Voltage Detector (AVD) functions. It is managed by the SICSR register.
6.6.1
Low voltage detector (LVD)
The low voltage detector function (LVD) generates a static reset when the VDD supply
voltage is below a VIT- reference value. This means that it secures the power-up as well as
the power-down keeping the ST7 in reset.
The VIT- reference value for a voltage drop is lower than the VIT+ reference value for poweron in order to avoid a parasitic reset when the MCU starts running and sinks current on the
supply (hysteresis).
The LVD reset circuitry generates a reset when VDD is below:
–
VIT+ when VDD is rising
–
VIT- when VDD is falling
The LVD function is illustrated in Figure 14.
The voltage threshold can be configured by option byte to be low, medium or high.
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Supply, reset and clock management
ST72321Bxxx-Auto
Provided the minimum VDD value (guaranteed for the oscillator frequency) is above VIT-, the
MCU can only be in two modes:
–
under full software control
–
in static safe reset
In these conditions, secure operation is always ensured for the application without the need
for external reset hardware.
During a low voltage detector reset, the RESET pin is held low, thus permitting the MCU to
reset other devices.
Note:
The LVD allows the device to be used without any external RESET circuitry.
If the medium or low thresholds are selected, the detection may occur outside the specified
operating voltage range. Below 3.8V, device operation is not guaranteed.
The LVD is an optional function which can be selected by option byte.
It is recommended to make sure that the VDD supply voltage rises monotonously when the
device is exiting from Reset, to ensure the application functions properly.
Figure 14. Low voltage detector versus reset
VDD
Vhys
VIT+
VIT-
RESET
6.6.2
Auxiliary voltage detector (AVD)
The auxiliary voltage detector function (AVD) is based on an analog comparison between a
VIT-(AVD) and VIT+(AVD) reference value and the VDD main supply or the external EVD pin
voltage level (VEVD). The VIT- reference value for falling voltage is lower than the VIT+
reference value for rising voltage in order to avoid parasitic detection (hysteresis).
The output of the AVD comparator can be read directly by the application software through a
real-time status bit (AVDF) in the SICSR register. This bit is read only.
Caution:
The AVD function is active only if the LVD is enabled through the option byte.
Monitoring the VDD main supply
This mode is selected by clearing the AVDS bit in the SICSR register.
The AVD voltage threshold value is relative to the selected LVD threshold configured by
option byte (see Section 21.1.1: Flash configuration on page 228).
If the AVD interrupt is enabled, an interrupt is generated when the voltage crosses the
VIT+(AVD) or VIT-(AVD) threshold (AVDF bit toggles).
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ST72321Bxxx-Auto
Supply, reset and clock management
In the case of a drop in voltage, the AVD interrupt acts as an early warning, allowing
software to shut down safely before the LVD resets the microcontroller. See Figure 15.
The interrupt on the rising edge is used to inform the application that the VDD warning state
is over.
If the voltage rise time trv is less than 256 or 4096 CPU cycles (depending on the reset delay
selected by option byte), no AVD interrupt will be generated when VIT+(AVD) is reached.
If trv is greater than 256 or 4096 cycles
●
two AVD interrupts will be received if the AVD interrupt is enabled before the VIT+(AVD)
threshold is reached: the first when the AVDIE bit is set, and the second when the
threshold is reached.
●
only one AVD interrupt will occur if the AVD interrupt is enabled after the VIT+(AVD)
threshold is reached.
Figure 15. Using the AVD to monitor VDD (AVDS bit = 0)
VDD
Early Warning Interrupt
(Power has dropped, MCU not
not yet in reset)
Vhyst
VIT+(AVD)
VIT-(AVD)
VIT+(LVD)
VIT-(LVD)
trv
AVDF bit
0
1
RESET VALUE
VOLTAGE RISE TIME
1
0
AVD INTERRUPT
REQUEST
IF AVDIE bit = 1
INTERRUPT PROCESS
INTERRUPT PROCESS
LVD RESET
Monitoring a voltage on the EVD pin
This mode is selected by setting the AVDS bit in the SICSR register.
The AVD circuitry can generate an interrupt when the AVDIE bit of the SICSR register is set.
This interrupt is generated on the rising and falling edges of the comparator output. This
means it is generated when either one of these two events occur:
●
VEVD rises up to VIT+(EVD)
●
VEVD falls down to VIT-(EVD)
The EVD function is illustrated in Figure 16.
For more details, refer to Chapter 19: Electrical characteristics.
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Supply, reset and clock management
ST72321Bxxx-Auto
Figure 16. Using the voltage detector to monitor the EVD pin (AVDS bit = 1)
VEVD
Vhyst
VIT+(EVD)
VIT-(EVD)
AVDF
0
1
0
AVD INTERRUPT
REQUEST
IF AVDIE = 1
INTERRUPT PROCESS
6.6.3
Low power modes
Table 10.
Effect of low power modes on SI
Mode
6.6.4
INTERRUPT PROCESS
Effect
Wait
No effect on SI. AVD interrupts cause the device to exit from Wait mode.
Halt
The SICSR register is frozen.
Interrupts
The AVD interrupt event generates an interrupt if the corresponding Enable Control Bit
(AVDIE) is set and the interrupt mask in the CC register is reset (RIM instruction).
Table 11.
52/247
AVD interrupt control/wake-up capability
Interrupt event
Event flag
Enable control bit
Exit from Wait
Exit from Halt
AVD event
AVDF
AVDIE
Yes
No
ST72321Bxxx-Auto
6.6.5
Supply, reset and clock management
System Integrity (SI) Control/Status register (SICSR)
Reset value: 000x 000x (00h)
SICSR
7
6
5
4
AVDS
AVDIE
AVDF
LVDRF
Reserved
WDGRF
RW
RW
RW
RW
-
RW
2
1
0
SICSR description
Table 12.
Bit
3
Name
Function
AVDS
Voltage Detection selection
This bit is set and cleared by software. Voltage Detection is available only if the
LVD is enabled by option byte.
0: Voltage detection on VDD supply
1: Voltage detection on EVD pin
AVDIE
Voltage Detector interrupt enable
This bit is set and cleared by software. It enables an interrupt to be generated
when the AVDF flag changes (toggles). The pending interrupt information is
automatically cleared when software enters the AVD interrupt routine.
0: AVD interrupt disabled
1: AVD interrupt enabled
AVDF
Voltage Detector flag
This read-only bit is set and cleared by hardware. If the AVDIE bit is set, an
interrupt request is generated when the AVDF bit changes value. Refer to
Figure 15 and to Monitoring the VDD main supply on page 50 for additional
details.
0: VDD or VEVD over VIT+(AVD) threshold
1: VDD or VEVD under VIT-(AVD) threshold
4
LVDRF
LVD reset flag
This bit indicates that the last Reset was generated by the LVD block. It is set by
hardware (LVD reset) and cleared by software (writing zero). See Table 13: Reset
source flags for more details. When the LVD is disabled by OPTION BYTE, the
LVDRF bit value is undefined.
3:1
-
7
6
5
0
Reserved, must be kept cleared.
Watchdog reset flag
This bit indicates that the last Reset was generated by the Watchdog peripheral. It
is set by hardware (watchdog reset) and cleared by software (writing zero) or an
WDGRF
LVD Reset (to ensure a stable cleared state of the WDGRF flag when CPU starts).
Combined with the LVDRF flag information, the flag description is given in
Table 13.
Table 13.
Reset source flags
Reset sources
LVDRF
WDGRF
External RESET pin
0
0
Watchdog
0
1
LVD
1
X
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Supply, reset and clock management
ST72321Bxxx-Auto
Application notes
The LVDRF flag is not cleared when another RESET type occurs (external or watchdog); the
LVDRF flag remains set to keep trace of the original failure.
In this case, software can detect a watchdog reset but cannot detect an external reset.
Caution:
54/247
When the LVD is not activated with the associated option byte, the WDGRF flag cannot be
used in the application.
ST72321Bxxx-Auto
Interrupts
7
Interrupts
7.1
Introduction
The ST7 enhanced interrupt management provides the following features:
●
Hardware interrupts
●
Software interrupt (TRAP)
●
Nested or concurrent interrupt management with flexible interrupt priority and level
management:
–
Up to 4 software programmable nesting levels
–
Up to 16 interrupt vectors fixed by hardware
–
2 non-maskable events: RESET, TRAP
–
1 maskable Top Level event: TLI
This interrupt management is based on:
●
Bit 5 and bit 3 of the CPU CC register (I1:0)
●
Interrupt software priority registers (ISPRx)
●
Fixed interrupt vector addresses located at the high addresses of the memory map
(FFE0h to FFFFh) sorted by hardware priority order
This enhanced interrupt controller guarantees full upward compatibility with the standard
(not nested) ST7 interrupt controller.
7.2
Masking and processing flow
The interrupt masking is managed by the I1 and I0 bits of the CC register and the ISPRx
registers which give the interrupt software priority level of each interrupt vector (see Table
14). The processing flow is shown in Figure 17.
When an interrupt request has to be serviced:
●
Normal processing is suspended at the end of the current instruction execution.
●
The PC, X, A and CC registers are saved onto the stack.
●
I1 and I0 bits of CC register are set according to the corresponding values in the ISPRx
registers of the serviced interrupt vector.
●
The PC is then loaded with the interrupt vector of the interrupt to service and the first
instruction of the interrupt service routine is fetched (refer to Table 19: Interrupt
mapping for vector addresses).
The interrupt service routine should end with the IRET instruction which causes the
contents of the saved registers to be recovered from the stack.
Note:
As a consequence of the IRET instruction, the I1 and I0 bits will be restored from the stack
and the program in the previous level will resume.
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Interrupts
ST72321Bxxx-Auto
Table 14.
Interrupt software priority levels
Interrupt software priority
Level
I1
I0
Low
1
0
Level 1
0
1
Level 2
0
0
1
1
Level 0 (main)
High
Level 3 (= interrupt disable)
Figure 17. Interrupt processing flowchart
Y
TRAP
Interrupt has the same or a
lower software priority
than current one
N
FETCH NEXT
INSTRUCTION
Y
THE INTERRUPT
STAYS PENDING
“IRET”
N
RESTORE PC, X, A, CC
FROM STACK
EXECUTE
INSTRUCTION
Y
N
I1:0
Interrupt has a higher
software priority
than current one
PENDING
INTERRUPT
RESET
STACK PC, X, A, CC
LOAD I1:0 FROM INTERRUPT SW REG.
LOAD PC FROM INTERRUPT VECTOR
Servicing pending interrupts
As several interrupts can be pending at the same time, the interrupt to be taken into account
is determined by the following two-step process:
●
the highest software priority interrupt is serviced,
●
if several interrupts have the same software priority then the interrupt with the highest
hardware priority is serviced first.
Figure 18 describes this decision process.
Figure 18. Priority decision process flowchart
PENDING
INTERRUPTS
Same
SOFTWARE
PRIORITY
Different
HIGHEST SOFTWARE
PRIORITY SERVICED
HIGHEST HARDWARE
PRIORITY SERVICED
56/247
ST72321Bxxx-Auto
Interrupts
When an interrupt request is not serviced immediately, it is latched and then processed
when its software priority combined with the hardware priority becomes the highest one.
Note:
1
The hardware priority is exclusive while the software one is not. This allows the previous
process to succeed with only one interrupt.
2
TLI, RESET and TRAP can be considered as having the highest software priority in the
decision process.
Different interrupt vector sources
Two interrupt source types are managed by the ST7 interrupt controller: the non-maskable
type (RESET, TRAP) and the maskable type (external or from internal peripherals).
Non-maskable sources
These sources are processed regardless of the state of the I1 and I0 bits of the CC register
(see Figure 17). After stacking the PC, X, A and CC registers (except for RESET), the
corresponding vector is loaded in the PC register and the I1 and I0 bits of the CC are set to
disable interrupts (level 3). These sources allow the processor to exit Halt mode.
●
TRAP (non-maskable software interrupt)
This software interrupt is serviced when the TRAP instruction is executed. It will be
serviced according to the flowchart in Figure 17.
Caution:
TRAP can be interrupted by a TLI.
●
RESET
The RESET source has the highest priority in the ST7. This means that the first current
routine has the highest software priority (level 3) and the highest hardware priority.
See Section 6.5: Reset sequence manager (RSM) for more details.
Maskable sources
Maskable interrupt vector sources can be serviced if the corresponding interrupt is enabled
and if its own interrupt software priority (in ISPRx registers) is higher than the one currently
being serviced (I1 and I0 in CC register). If any of these two conditions is false, the interrupt
is latched and thus remains pending.
●
Caution:
TLI (top level hardware interrupt)
This hardware interrupt occurs when a specific edge is detected on the dedicated TLI pin. It
will be serviced according to the flowchart in Figure 17 as a trap.
A TRAP instruction must not be used in a TLI service routine.
●
External Interrupts
External interrupts allow the processor to exit from HALT low power mode. External
interrupt sensitivity is software selectable through the External Interrupt Control register
(EICR).
External interrupt triggered on edge will be latched and the interrupt request
automatically cleared upon entering the interrupt service routine.
If several input pins of a group connected to the same interrupt line are selected
simultaneously, these will be logically ORed.
●
Peripheral Interrupts
Usually the peripheral interrupts cause the MCU to exit from Halt mode except those
mentioned in Table 19: Interrupt mapping. A peripheral interrupt occurs when a specific
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Interrupts
ST72321Bxxx-Auto
flag is set in the peripheral status registers and if the corresponding enable bit is set in
the peripheral control register.
The general sequence for clearing an interrupt is based on an access to the status
register followed by a read or write to an associated register.
Note:
The clearing sequence resets the internal latch. A pending interrupt (that is, waiting to be
serviced) will therefore be lost if the clear sequence is executed.
7.3
Interrupts and low power modes
All interrupts allow the processor to exit the Wait low power mode. On the contrary, only
external and other specified interrupts allow the processor to exit from the Halt modes (see
column “Exit from Halt/Active Halt” in Table 19: Interrupt mapping). When several pending
interrupts are present while exiting Halt mode, the first one serviced can only be an interrupt
with “exit from Halt mode” capability and it is selected through the same decision process
shown in Figure 18.
Note:
If an interrupt that is not able to exit from Halt mode is pending with the highest priority when
exiting Halt mode, this interrupt is serviced after the first one serviced.
7.4
Concurrent and nested management
The following Figure 19 and Figure 20 show two different interrupt management modes. The
first is called concurrent mode and does not allow an interrupt to be interrupted, unlike the
nested mode in Figure 20. The interrupt hardware priority is given in this order from the
lowest to the highest: MAIN, IT4, IT3, IT2, IT1, IT0, TLI. The software priority is given for
each interrupt.
Warning:
A stack overflow may occur without notifying the software of
the failure.
IT0
TRAP
IT3
IT4
IT1
SOFTWARE
PRIORITY
LEVEL
TRAP
IT0
IT1
IT1
IT2
IT3
I0
3
1 1
3
1 1
3
1 1
3
1 1
3
1 1
3
1 1
RIM
IT4
MAIN
11 / 10
58/247
I1
MAIN
10
3/0
USED STACK = 10 BYTES
HARDWARE PRIORITY
IT2
Figure 19. Concurrent interrupt management
ST72321Bxxx-Auto
Interrupts
HARDWARE PRIORITY
TRAP
IT0
IT1
IT1
IT2
IT2
IT3
I0
I1
3
1 1
3
1 1
2
0 0
1
0 1
3
1 1
3
1 1
USED STACK = 20 BYTES
SOFTWARE
PRIORITY
LEVEL
IT0
TRAP
IT3
IT4
IT1
IT2
Figure 20. Nested interrupt management
RIM
IT4
IT4
MAIN
MAIN
11 / 10
3/0
10
7.5
Interrupt register description
7.5.1
CPU CC register interrupt bits
CPU CC
Reset value: 111x 1010 (xAh)
7
6
5
4
3
2
1
0
1
1
I1
H
I0
N
Z
C
RW
RW
RW
RW
RW
RW
Table 15.
CPU CC register interrupt bits description
Bit
Name
Function
5
I1
Interrupt Software Priority 1
3
I0
Interrupt Software Priority 0
These two bits indicate the current interrupt software priority (see Table 16) and are
set/cleared by hardware when entering in interrupt. The loaded value is given by the
corresponding bits in the interrupt software priority registers (ISPRx).
They can be also set/cleared by software with the RIM, SIM, HALT, WFI, IRET and
PUSH/POP instructions (see Table 18: Interrupt dedicated instruction set).
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Table 16.
Interrupt software priority levels
Interrupt software priority
Level
I1
I0
Low
1
0
Level 1
0
1
Level 2
0
0
1
1
Level 0 (main)
Level 3 (= interrupt disable(1))
High
1. TLI, TRAP and RESET events can interrupt a level 3 program.
7.5.2
Interrupt software priority registers (ISPRx)
These four registers are read/write, with the exception of bits 7:4 of ISPR3, which are read
only.
ISPRx
Reset value: 1111 1111 (FFh)
7
6
5
4
3
2
1
0
ISPR0
I1_3
I0_3
I1_2
I0_2
I1_1
I0_1
I1_0
I0_0
ISPR1
I1_7
I0_7
I1_6
I0_6
I1_5
I0_5
I1_4
I0_4
ISPR2
I1_11
I0_11
I1_10
I0_10
I1_9
I0_9
I1_8
I0_8
ISPR3
1
1
1
1
I1_13
I0_13
I1_12
I0_12
These four registers contain the interrupt software priority of each interrupt vector.
●
Each interrupt vector (except RESET and TRAP) has corresponding bits in these
registers where its own software priority is stored. This correspondence is shown in the
following Table 17.
Table 17.
Interrupt priority bits
Vector address
ISPRx bits
FFFBh-FFFAh
I1_0 and I0_0 bits(1)
FFF9h-FFF8h
I1_1 and I0_1 bits
...
...
FFE1h-FFE0h
I1_13 and I0_13 bits
1. Bits in the ISPRx registers which correspond to the TLI can be read and written but they are not significant
in the interrupt process management.
●
Each I1_x and I0_x bit value in the ISPRx registers has the same meaning as the I1
and I0 bits in the CC register.
●
Level 0 cannot be written (I1_x = 1, I0_x = 0). In this case, the previously stored value
is kept (Example: previous = CFh, write = 64h, result = 44h).
The TLI, RESET, and TRAP vectors have no software priorities. When one is serviced, the
I1 and I0 bits of the CC register are both set.
Caution:
60/247
If the I1_x and I0_x bits are modified while the interrupt x is executed the following behavior
has to be considered: If the interrupt x is still pending (new interrupt or flag not cleared) and
the new software priority is higher than the previous one, the interrupt x is re-entered.
ST72321Bxxx-Auto
Interrupts
Otherwise, the software priority stays unchanged up to the next interrupt request (after the
IRET of the interrupt x).
Table 18.
Instruction
New description
Function/Example
HALT
Entering Halt mode
IRET
Interrupt routine return
Pop CC, A, X, PC
JRM
Jump if I1:0 = 11 (level 3)
I1:0 = 11 ?
Jump if I1:0 <> 11
I1:0 <> 11 ?
Pop CC from the Stack
RIM
Enable interrupt (level 0 set)
SIM
JRNM
POP CC
TRAP
WFI
Note:
Interrupt dedicated instruction set
I1
H
1
I0
N
Z
C
0
I1
H
I0
N
Z
C
Mem => CC
I1
H
I0
N
Z
C
Load 10 in I1:0 of CC
1
0
Disable interrupt (level 3 set) Load 11 in I1:0 of CC
1
1
Software trap
1
1
1
0
Wait for interrupt
Software NMI
During the execution of an interrupt routine, the HALT, POPCC, RIM, SIM and WFI
instructions change the current software priority up to the next IRET instruction or one of the
previously mentioned instructions.
61/247
Interrupts
Table 19.
No.
ST72321Bxxx-Auto
Interrupt mapping
Source
block
RESET
Description
Register
label
Priority
order
Reset
Exit
from
Halt /
Active
Halt
Address
vector
yes
FFFEh-FFFFh
no
FFFCh-FFFDh
yes
FFFAh-FFFBh
yes
FFF8h-FFF9h
yes
FFF6h-FFF7h
yes
FFF4h-FFF5h
N/A
TRAP
0
1
TLI
Software interrupt
External top level interrupt
EICR
MCC/RTC Main clock controller time base interrupt
MCCSR
2
ei0
External interrupt port A3..0
3
ei1
External interrupt port F2..0
Higher
priority
N/A
4
ei2
External interrupt port B3..0
yes
FFF2h-FFF3h
5
ei3
External interrupt port B7..4
yes
FFF0h-FFF1h
6
Not used
SPI peripheral interrupts
FFEEh-FFEFh
yes
FFECh-FFEDh
7
SPI
8
TIMER A
TIMER A peripheral interrupts
TASR
no
FFEAh-FFEBh
9
TIMER B
TIMER B peripheral interrupts
TBSR
no
FFE8h-FFE9h
10
SCI
SCI peripheral interrupts
SCISR
no
FFE6h-FFE7h
11
AVD
Auxiliary voltage detector interrupt
SICSR
no
FFE4h-FFE5h
12
I2C
I2C peripheral interrupts
(see
peripheral)
no
FFE2h-FFE3h
13
PWM ART
ARTCSR
yes(2)
FFE0h-FFE1h
PWM ART interrupt
SPICSR
(1)
Lower
priority
1. Exit from HALT possible when SPI is in slave mode.
2. Exit from HALT possible when PWM ART is in external clock mode.
7.6
External interrupts
7.6.1
I/O port interrupt sensitivity
The external interrupt sensitivity is controlled by the IPA, IPB and ISxx bits of the EICR
register (Figure 21). This control allows to have up to four fully independent external
interrupt source sensitivities.
Each external interrupt source can be generated on four (or five) different events on the pin:
62/247
●
Falling edge
●
Rising edge
●
Falling and rising edge
●
Falling edge and low level
●
Rising edge and high level (only for ei0 and ei2)
ST72321Bxxx-Auto
Interrupts
To guarantee correct functionality, the sensitivity bits in the EICR register can be modified
only when the I1 and I0 bits of the CC register are both set to 1 (level 3). This means that
interrupts must be disabled before changing sensitivity.
The pending interrupts are cleared by writing a different value in the ISx[1:0], IPA or IPB bits
of the EICR.
Figure 21. External interrupt control bits
PORT A [3:0] INTERRUPTS
PAOR.3
PADDR.3
EICR
IS20
IS21
SENSITIVITY
PA3
CONTROL
IPA BIT
PORT F [2:0] INTERRUPTS
IS21
SENSITIVITY
PF2
CONTROL
PORT B [3:0] INTERRUPTS
PBOR.3
PBDDR.3
IS10
SENSITIVITY
IPB BIT
PB7
ei1 INTERRUPT SOURCE
IS11
CONTROL
PBOR.7
PBDDR.7
PF2
PF1
PF0
EICR
PB3
PORT B [7:4] INTERRUPTS
ei0 INTERRUPT SOURCE
EICR
IS20
PFOR.2
PFDDR.2
PA3
PA2
PA1
PA0
PB3
PB2
PB1
PB0
ei2 INTERRUPT SOURCE
EICR
IS10
IS11
SENSITIVITY
CONTROL
PB7
PB6
PB5
PB4
ei3 INTERRUPT SOURCE
63/247
Interrupts
7.6.2
ST72321Bxxx-Auto
External interrupt control register (EICR)
EICR
Reset value: 0000 0000 (00h)
7
6
7:6
5
4:3
2
1
0
64/247
4
3
2
1
0
IS1[1:0]
IPB
IS2[1:0]
IPA
TLIS
TLIE
RW
RW
RW
RW
RW
RW
Table 20.
Bit
5
EICR register description
Name
Function
IS1[1:0]
ei2 and ei3 sensitivity
The interrupt sensitivity, defined using the IS1[1:0] bits, is applied to the following
external interrupts:
- ei2 (port B3..0) (see Table 21)
- ei3 (port B7..4) (see Table 22)
These 2 bits can be written only when I1 and I0 of the CC register are both set to 1
(level 3).
IPB
Interrupt polarity for port B
This bit is used to invert the sensitivity of the port B [3:0] external interrupts. It can
be set and cleared by software only when I1 and I0 of the CC register are both set
to 1 (level 3).
0: No sensitivity inversion
1: Sensitivity inversion
IS2[1:0]
ei0 and ei1 sensitivity
The interrupt sensitivity, defined using the IS2[1:0] bits, is applied to the following
external interrupts:
- ei0 (port A3..0) (see Table 23)
- ei1 (port F2..0) (see Table 24)
These 2 bits can be written only when I1 and I0 of the CC register are both set to 1
(level 3).
IPA
Interrupt polarity for port A
This bit is used to invert the sensitivity of the port A [3:0] external interrupts. It can
be set and cleared by software only when I1 and I0 of the CC register are both set
to 1 (level 3).
0: No sensitivity inversion
1: Sensitivity inversion
TLIS
TLI sensitivity
This bit allows to toggle the TLI edge sensitivity. It can be set and cleared by
software only when TLIE bit is cleared.
0: Falling edge
1: Rising edge
TLIE
TLI enable
This bit allows to enable or disable the TLI capability on the dedicated pin. It is set
and cleared by software.
0: TLI disabled
1: TLI enabled
Note: A parasitic interrupt can be generated when clearing the TLIE bit.
ST72321Bxxx-Auto
Table 21.
Interrupts
Interrupt sensitivity - ei2 (port B3..0)
External interrupt sensitivity
IS11
IS10
IPB bit = 0
IPB bit = 1
0
0
Falling edge and low level
Rising edge and high level
0
1
Rising edge only
Falling edge only
1
0
Falling edge only
Rising edge only
1
1
Table 22.
Rising and falling edge
Interrupt sensitivity - ei3 (port B7..4)
IS11
IS10
External interrupt sensitivity
0
0
Falling edge and low level
0
1
Rising edge only
1
0
Falling edge only
1
1
Rising and falling edge
Table 23.
Interrupt sensitivity - ei0 (port A3..0)
External interrupt sensitivity
IS21
IS20
IPA bit = 0
IPA bit = 1
0
0
Falling edge and low level
Rising edge and high level
0
1
Rising edge only
Falling edge only
1
0
Falling edge only
Rising edge only
1
1
Table 24.
Rising and falling edge
Interrupt sensitivity - ei1 (port F2..0)
IS21
IS20
External interrupt sensitivity
0
0
Falling edge and low level
0
1
Rising edge only
1
0
Falling edge only
1
1
Rising and falling edge
65/247
Interrupts
Table 25.
ST72321Bxxx-Auto
Nested interrupts register map and reset values
Address (Hex.)
Register label
7
6
5
ei1
0024h
ISPR0
Reset value
4
3
ei0
I1_3
1
I0_3
1
I1_2
1
2
MCC
I0_2
1
I1_1
1
SPI
0025h
ISPR1
Reset value
1
TLI
I0_1
1
1
ei3
I1_7
1
I0_7
1
I1_6
1
AVD
I0_6
1
SCI
I1_5
1
0
1
ei2
I0_5
1
TIMER B
I1_4
1
I0_4
1
TIMER A
0026h
ISPR2
Reset value
0027h
ISPR3
Reset value
1
1
1
1
I1_13
1
I0_13
1
I1_12
1
I0_12
1
EICR
Reset value
IS11
0
IS10
0
IPB
0
IS21
0
IS20
0
IPA
0
TLIS
0
TLIE
0
I1_11
1
I0_11
1
I1_10
1
I0_10
1
I1_9
1
I0_9
1
I1_8
1
PWMART
0028h
66/247
I0_8
1
I2C
ST72321Bxxx-Auto
Power saving modes
8
Power saving modes
8.1
Introduction
To give a large measure of flexibility to the application in terms of power consumption, four
main power saving modes are implemented in the ST7 (see Figure 22): Slow, Wait (Slow
Wait), Active Halt and Halt.
After a RESET the normal operating mode is selected by default (Run mode). This mode
drives the device (CPU and embedded peripherals) by means of a master clock which is
based on the main oscillator frequency divided or multiplied by 2 (fOSC2).
From Run mode, the different power saving modes may be selected by setting the relevant
register bits or by calling the specific ST7 software instruction whose action depends on the
oscillator status.
Figure 22. Power saving mode transitions
High
RUN
SLOW
WAIT
SLOW WAIT
ACTIVE HALT
HALT
Low
POWER CONSUMPTION
8.2
Slow mode
This mode has two targets:
●
To reduce power consumption by decreasing the internal clock in the device,
●
To adapt the internal clock frequency (fCPU) to the available supply voltage.
Slow mode is controlled by three bits in the MCCSR register: the SMS bit which enables or
disables Slow mode and two CPx bits which select the internal slow frequency (fCPU).
In this mode, the master clock frequency (fOSC2) can be divided by 2, 4, 8 or 16. The CPU
and peripherals are clocked at this lower frequency (fCPU).
Note:
Slow Wait mode is activated when entering the Wait mode while the device is already in
Slow mode.
67/247
Power saving modes
ST72321Bxxx-Auto
Figure 23. Slow mode clock transitions
fOSC2/2
fOSC2/4
fOSC2
fCPU
MCCSR
fOSC2
CP1:0
00
01
SMS
NORMAL RUN MODE
NEW SLOW
REQUEST
FREQUENCY
REQUEST
8.3
Wait mode
Wait mode places the MCU in a low power consumption mode by stopping the CPU.
This power saving mode is selected by calling the ‘WFI’ instruction.
All peripherals remain active. During Wait mode, the I[1:0] bits of the CC register are forced
to ‘10’, to enable all interrupts. All other registers and memory remain unchanged. The MCU
remains in Wait mode until an interrupt or RESET occurs, whereupon the Program Counter
branches to the starting address of the interrupt or Reset service routine.
The MCU will remain in Wait mode until a Reset or an Interrupt occurs, causing it to wake
up.
Refer to the following Figure 24.
68/247
ST72321Bxxx-Auto
Power saving modes
Figure 24. Wait mode flowchart
WFI INSTRUCTION
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
OFF
10
N
RESET
Y
N
INTERRUPT
Y
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
OFF
ON
10
256 OR 4096 CPU CLOCK
CYCLE DELAY
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
ON
XX(1)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
1. Before servicing an interrupt, the CC register is pushed on the stack. The I[1:0] bits of the CC register are
set to the current software priority level of the interrupt routine and recovered when the CC register is
popped.
8.4
Active Halt and Halt modes
Active Halt and Halt modes are the two lowest power consumption modes of the MCU. They
are both entered by executing the ‘HALT’ instruction. The decision to enter either in Active
Halt or Halt mode is given by the MCC/RTC interrupt enable flag (OIE bit in MCCSR
register) as shown in Table 26.
69/247
Power saving modes
Table 26.
8.4.1
ST72321Bxxx-Auto
MCC/RTC low power mode selection
MCCSR OIE bit
Power saving mode entered when HALT instruction is executed
0
Halt
1
Active Halt
Active Halt mode
Active Halt mode is the lowest power consumption mode of the MCU with a real-time clock
available. It is entered by executing the ‘HALT’ instruction when the OIE bit of the Main Clock
Controller Status register (MCCSR) is set (see Section 12.3: ART registers for more details
on the MCCSR register).
The MCU can exit Active Halt mode on reception of an external interrupt, MCC/RTC
interrupt or a RESET. When exiting Active Halt mode by means of an interrupt, no 256 or
4096 CPU cycle delay occurs. The CPU resumes operation by servicing the interrupt or by
fetching the reset vector which woke it up (see Figure 26).
When entering Active Halt mode, the I[1:0] bits in the CC register are forced to ‘10b’ to
enable interrupts. Therefore, if an interrupt is pending, the MCU wakes up immediately.
In Active Halt mode, only the main oscillator and its associated counter (MCC/RTC) are
running to keep a wake-up time base. All other peripherals are not clocked except those
which get their clock supply from another clock generator (such as external or auxiliary
oscillator).
The safeguard against staying locked in Active Halt mode is provided by the oscillator
interrupt.
Note:
As soon as the interrupt capability of one of the oscillators is selected (MCCSR.OIE bit set),
entering Active Halt mode while the Watchdog is active does not generate a RESET.
This means that the device cannot spend more than a defined delay in this power saving
mode.
Caution:
When exiting Active Halt mode following an MCC/RTC interrupt, OIE bit of MCCSR register
must not be cleared before tDELAY after the interrupt occurs (tDELAY = 256 or 4096 tCPU
delay depending on option byte). Otherwise, the ST7 enters Halt mode for the remaining
tDELAY period.
Figure 25. Active Halt timing overview
RUN
ACTIVE
HALT
HALT
INSTRUCTION
[MCCSR.OIE = 1]
256 OR 4096 CPU
CYCLE DELAY(1)
RESET
OR
INTERRUPT
RUN
FETCH
VECTOR
1. This delay occurs only if the MCU exits Active Halt mode by means of a RESET.
70/247
ST72321Bxxx-Auto
Power saving modes
Figure 26. Active Halt mode flowchart
HALT INSTRUCTION
(MCCSR.OIE = 1)
OSCILLATOR
PERIPHERALS(1)
CPU
I[1:0] BITS
N
N
INTERRUPT
Y
ON
OFF
OFF
10
RESET
Y
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
OFF
ON
XX(2)
256 OR 4096 CPU CLOCK
CYCLE DELAY
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
ON
XX(2)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
1. Peripheral clocked with an external clock source can still be active.
2. Before servicing an interrupt, the CC register is pushed on the stack. The I[1:0] bits of the CC register are
set to the current software priority level of the interrupt routine and restored when the CC register is
popped.
8.4.2
Halt mode
The Halt mode is the lowest power consumption mode of the MCU. It is entered by
executing the ‘HALT’ instruction when the OIE bit of the Main Clock Controller Status
register (MCCSR) is cleared (see Chapter 11: Main clock controller with real-time clock and
beeper (MCC/RTC) for more details on the MCCSR register).
The MCU can exit Halt mode on reception of either a specific interrupt (see Table 19:
Interrupt mapping on page 62) or a RESET. When exiting Halt mode by means of a RESET
or an interrupt, the oscillator is immediately turned on and the 256 or 4096 CPU cycle delay
is used to stabilize the oscillator. After the start up delay, the CPU resumes operation by
servicing the interrupt or by fetching the reset vector which woke it up (see Figure 28).
When entering Halt mode, the I[1:0] bits in the CC register are forced to ‘10b’ to enable
interrupts. Therefore, if an interrupt is pending, the MCU wakes up immediately.
In Halt mode, the main oscillator is turned off causing all internal processing to be stopped,
including the operation of the on-chip peripherals. All peripherals are not clocked except the
71/247
Power saving modes
ST72321Bxxx-Auto
ones which get their clock supply from another clock generator (such as an external or
auxiliary oscillator).
The compatibility of Watchdog operation with Halt mode is configured by the ‘WDGHALT’
option bit of the option byte. The HALT instruction when executed while the Watchdog
system is enabled, can generate a Watchdog RESET (see Section 21.1.1: Flash
configuration on page 228 for more details).
Figure 27. Halt timing overview
RUN
HALT
HALT
INSTRUCTION
[MCCSR.OIE = 0]
72/247
256 OR 4096 CPU
CYCLE DELAY
RUN
RESET
OR
INTERRUPT
FETCH
VECTOR
ST72321Bxxx-Auto
Power saving modes
Figure 28. Halt mode flowchart
HALT INSTRUCTION
(MCCSR.OIE = 0)
ENABLE
WDGHALT (1)
WATCHDOG
0
DISABLE
1
WATCHDOG
RESET
OSCILLATOR
PERIPHERALS (2)
CPU
I[1:0] BITS
OFF
OFF
OFF
10
N
RESET
Y
N
INTERRUPT (3)
Y
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
OFF
ON
XX (4)
256 OR 4096 CPU CLOCK
CYCLE DELAY
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
ON
XX (4)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
1. WDGHALT is an option bit. See Section 21.1.1: Flash configuration for more details.
2. Peripheral clocked with an external clock source can still be active.
3. Only some specific interrupts can exit the MCU from Halt mode (such as external interrupt). Refer to
Table 19: Interrupt mapping for more details.
4. Before servicing an interrupt, the CC register is pushed on the stack. The I[1:0] bits of the CC register are
set to the current software priority level of the interrupt routine and recovered when the CC register is
popped.
73/247
Power saving modes
ST72321Bxxx-Auto
Halt mode recommendations
●
Make sure that an external event is available to wake up the microcontroller from Halt
mode.
●
When using an external interrupt to wake up the microcontroller, re-initialize the
corresponding I/O as “Input Pull-up with Interrupt” before executing the HALT
instruction. The main reason for this is that the I/O may be wrongly configured due to
external interference or by an unforeseen logical condition.
●
For the same reason, reinitialize the level sensitiveness of each external interrupt as a
precautionary measure.
●
The opcode for the HALT instruction is 0x8E. To avoid an unexpected HALT instruction
due to a program counter failure, it is advised to clear all occurrences of the data value
0x8E from memory. For example, avoid defining a constant in ROM with the value
0x8E.
●
As the HALT instruction clears the interrupt mask in the CC register to allow interrupts,
the user may choose to clear all pending interrupt bits before executing the HALT
instruction. This avoids entering other peripheral interrupt routines after executing the
external interrupt routine corresponding to the wake-up event (reset or external
interrupt).
Related documentation
ST7 Keypad Decoding Techniques, Implementing Wake-Up on Keystroke (AN 980)
How to Minimize the ST7 Power Consumption (AN1014)
Using an active RC to wake up the ST7LITE0 from power saving mode (AN1605)
74/247
ST72321Bxxx-Auto
9
I/O ports
9.1
Introduction
I/O ports
The I/O ports offer different functional modes:
●
transfer of data through digital inputs and outputs
and for specific pins:
●
external interrupt generation
●
alternate signal input/output for the on-chip peripherals.
An I/O port contains up to eight pins. Each pin can be programmed independently as digital
input (with or without interrupt generation) or digital output.
9.2
Functional description
Each port has two main registers:
●
Data Register (DR)
●
Data Direction Register (DDR)
and one optional register:
●
Option Register (OR)
Each I/O pin may be programmed using the corresponding register bits in the DDR and OR
registers (bit X corresponding to pin X of the port). The same correspondence is used for
the DR register.
The following description takes into account the OR register (for specific ports which do not
provide this register refer to Section 9.3: I/O port implementation on page 79). The generic
I/O block diagram is shown in Figure 29.
9.2.1
Input modes
The input configuration is selected by clearing the corresponding DDR register bit.
In this case, reading the DR register returns the digital value applied to the external I/O pin.
Different input modes can be selected by software through the OR register.
Note:
1
Writing the DR register modifies the latch value but does not affect the pin status.
2
When switching from input to output mode, the DR register has to be written first to drive the
correct level on the pin as soon as the port is configured as an output.
3
Do not use read/modify/write instructions (BSET or BRES) to modify the DR register as this
might corrupt the DR content for I/Os configured as input.
External interrupt function
When an I/O is configured as Input with Interrupt, an event on this I/O can generate an
external interrupt request to the CPU.
Each pin can independently generate an interrupt request. The interrupt sensitivity is
independently programmable using the sensitivity bits in the EICR register.
75/247
I/O ports
ST72321Bxxx-Auto
Each external interrupt vector is linked to a dedicated group of I/O port pins (see pinout
description and interrupt section). If several input pins are selected simultaneously as
interrupt sources, these are first detected according to the sensitivity bits in the EICR
register and then logically ORed.
The external interrupts are hardware interrupts, which means that the request latch (not
accessible directly by the application) is automatically cleared when the corresponding
interrupt vector is fetched. To clear an unwanted pending interrupt by software, the
sensitivity bits in the EICR register must be modified.
9.2.2
Output modes
The output configuration is selected by setting the corresponding DDR register bit. In this
case, writing the DR register applies this digital value to the I/O pin through the latch. Then
reading the DR register returns the previously stored value.
Two different output modes can be selected by software through the OR register: Output
push-pull and open-drain. The DR register value and output pin status are shown in the
following Table 27.
Table 27.
9.2.3
I/O output mode selection
DR
Push-pull
Open-drain
0
VSS
VSS
1
VDD
Floating
Alternate functions
When an on-chip peripheral is configured to use a pin, the alternate function is automatically
selected. This alternate function takes priority over the standard I/O programming.
When the signal is coming from an on-chip peripheral, the I/O pin is automatically
configured in output mode (push-pull or open-drain according to the peripheral).
When the signal is going to an on-chip peripheral, the I/O pin must be configured in input
mode. In this case, the pin state is also digitally readable by addressing the DR register.
Note:
76/247
Input pull-up configuration can cause unexpected value at the input of the alternate
peripheral input. When an on-chip peripheral use a pin as input and output, this pin has to
be configured in input floating mode.
ST72321Bxxx-Auto
I/O ports
Figure 29. I/O port general block diagram
ALTERNATE
OUTPUT
REGISTER
ACCESS
1
VDD
0
P-BUFFER
(see table below)
ALTERNATE
ENABLE
PULL-UP
(see table below)
DR
VDD
DDR
PULL-UP
CONDITION
DATA BUS
OR
PAD
If implemented
OR SEL
N-BUFFER
DIODES
(see table below)
DDR SEL
DR SEL
ANALOG
INPUT
CMOS
SCHMITT
TRIGGER
1
0
ALTERNATE
INPUT
EXTERNAL
INTERRUPT
SOURCE (eix)
Table 28.
I/O port mode options
Diodes
Configuration mode
Pull-up
P-buffer
to VDD
Floating with/without Interrupt
Off
Pull-up with/without Interrupt
On
Input
to VSS
Off
On
Push-pull
On
On
Off
Output
Open-drain (logic level)
True open-drain
Off
NI
NI
NI(1)
1. The diode to VDD is not implemented in the true open-drain pads. A local protection between the pad and
VSS is implemented to protect the device against positive stress.
Legend:
Off - Implemented not activated
On - Implemented and activated
NI
- Not implemented
77/247
I/O ports
Table 29.
ST72321Bxxx-Auto
I/O port configurations
Hardware configuration
NOT IMPLEMENTED IN
TRUE OPEN DRAIN
I/O PORTS
DR REGISTER ACCESS
VDD
RPU
PULL-UP
CONDITION
DR
REGISTER
PAD
W
DATA BUS
Input(1)
R
ALTERNATE INPUT
EXTERNAL INTERRUPT
SOURCE (eix)
INTERRUPT
CONDITION
Open-drain output(2)
ANALOG INPUT
NOT IMPLEMENTED IN
TRUE OPEN DRAIN
I/O PORTS
DR REGISTER ACCESS
VDD
RPU
DR
REGISTER
PAD
Push-pull output(2)
ALTERNATE
ENABLE
NOT IMPLEMENTED IN
TRUE OPEN DRAIN
I/O PORTS
R/W
DATA BUS
ALTERNATE
OUTPUT
DR REGISTER ACCESS
VDD
RPU
DR
REGISTER
PAD
ALTERNATE
ENABLE
R/W
DATA BUS
ALTERNATE
OUTPUT
1. When the I/O port is in input configuration and the associated alternate function is enabled as an output, reading the DR
register will read the alternate function output status.
2. When the I/O port is in output configuration and the associated alternate function is enabled as an input, the alternate
function reads the pin status given by the DR register content.
78/247
ST72321Bxxx-Auto
Caution:
I/O ports
The alternate function must not be activated as long as the pin is configured as input with
interrupt, in order to avoid generating spurious interrupts.
Analog alternate function
When the pin is used as an ADC input, the I/O must be configured as floating input. The
analog multiplexer (controlled by the ADC registers) switches the analog voltage present on
the selected pin to the common analog rail which is connected to the ADC input.
It is recommended not to change the voltage level or loading on any port pin while
conversion is in progress. Furthermore it is recommended not to have clocking pins located
close to a selected analog pin.
Warning:
9.3
The analog input voltage level must be within the limits
stated in the absolute maximum ratings.
I/O port implementation
The hardware implementation on each I/O port depends on the settings in the DDR and OR
registers and specific feature of the I/O port such as ADC Input or true open-drain.
Switching these I/O ports from one state to another should be done in a sequence that
prevents unwanted side effects. Recommended safe transitions are illustrated in Figure 30.
Other transitions are potentially risky and should be avoided, since they are likely to present
unwanted side-effects such as spurious interrupt generation.
Figure 30. Interrupt I/O port state transitions
01
00
10
11
INPUT
floating/pull-up
interrupt
INPUT
floating
(reset state)
OUTPUT
open-drain
OUTPUT
push-pull
XX
= DDR, OR
The I/O port register configurations are summarized in the following table.
Table 30.
I/O port configuration
Input (DDR = 0)
Port
Output (DDR = 1)
Pin name
OR = 0
PA7:6
OR = 1
floating
OR = 0
OR = 1
true open-drain
PA5:4
floating
pull-up
open-drain
push-pull
PA3
floating
floating interrupt
open-drain
push-pull
PA2:0
floating
pull-up interrupt
open-drain
push-pull
Port A
79/247
I/O ports
ST72321Bxxx-Auto
Table 30.
I/O port configuration (continued)
Input (DDR = 0)
Port
Output (DDR = 1)
Pin name
OR = 0
OR = 1
OR = 0
OR = 1
PB7, PB3
floating
floating interrupt
open-drain
push-pull
PB6:5, PB4, PB2:0
floating
pull-up interrupt
open-drain
push-pull
Port C PC7:0
floating
pull-up
open-drain
push-pull
Port D PD7:0
floating
pull-up
open-drain
push-pull
floating
pull-up
open-drain
push-pull
Port B
PE7:3, PE1:0
Port E
PE2
(1)
pull-up
PF7:3
Port F PF2
PF1:0
push-pull(1)
open-drain
floating
pull-up
open-drain
push-pull
floating
floating interrupt
open-drain
push-pull
floating
pull-up interrupt
open-drain
push-pull
1. Pull-up is always enabled leading to unwanted power consumption if output is tied to low level
9.4
Low power modes
Table 31.
Effect of low power modes on I/O ports
Mode
9.5
Effect
Wait
No effect on I/O ports. External interrupts cause the device to exit from Wait mode.
Halt
No effect on I/O ports. External interrupts cause the device to exit from Halt mode.
Interrupts
The external interrupt event generates an interrupt if the corresponding configuration is
selected with DDR and OR registers and the interrupt mask in the CC register is not active
(RIM instruction).
Table 32.
I/O port interrupt control/wake-up capability
Interrupt event
Event flag
Enable
control bit
Exit from
Wait
Exit from
Halt
-
DDRx, ORx
Yes
Yes
External interrupt on selected
external event
Table 33.
I/O port register map and reset values
Address (Hex.)
Register label
Reset value of all I/O port registers
80/247
0000h
PADR
0001h
PADDR
0002h
PAOR
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
MSB
LSB
ST72321Bxxx-Auto
Table 33.
I/O ports
I/O port register map and reset values (continued)
Address (Hex.)
Register label
Reset value of all I/O port registers
0003h
PBDR
0004h
PBDDR
0005h
PBOR
0006h
PCDR
0007h
PCDDR
0008h
PCOR
0009h
PDDR
000Ah
PDDDR
000Bh
PDOR
000Ch
PEDR
000Dh
PEDDR
000Eh
PEOR
000Fh
PFDR
0010h
PFDDR
0011h
PFOR
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
MSB
LSB
MSB
LSB
MSB
LSB
MSB
LSB
MSB
LSB
Related documentation
SPI Communication between ST7 and EEPROM (AN 970)
S/W implementation of I2C bus master (AN1045)
Software LCD driver (AN1048)
81/247
Watchdog timer (WDG)
10
Watchdog timer (WDG)
10.1
Introduction
ST72321Bxxx-Auto
The Watchdog timer is used to detect the occurrence of a software fault, usually generated
by external interference or by unforeseen logical conditions, which causes the application
program to abandon its normal sequence. The Watchdog circuit generates an MCU reset on
expiry of a programmed time period, unless the program refreshes the counter’s contents
before the T6 bit becomes cleared.
10.2
10.3
Main features
●
Programmable free-running downcounter
●
Programmable reset
●
Reset (if watchdog activated) when the T6 bit reaches zero
●
Optional reset on HALT instruction (configurable by option byte)
●
Hardware Watchdog selectable by option byte
Functional description
The counter value stored in the Watchdog Control register (WDGCR bits T[6:0]), is
decremented every 16384 fOSC2 cycles (approx.), and the length of the timeout period can
be programmed by the user in 64 increments.
If the watchdog is activated (the WDGA bit is set) and when the 7-bit timer (bits T[6:0]) rolls
over from 40h to 3Fh (T6 becomes cleared), it initiates a reset cycle pulling the RESET pin
low for typically 30µs.
The application program must write in the WDGCR register at regular intervals during
normal operation to prevent an MCU reset. This downcounter is free-running: It counts down
even if the watchdog is disabled. The value to be stored in the WDGCR register must be
between FFh and C0h:
–
The WDGA bit is set (watchdog enabled)
–
The T6 bit is set to prevent generating an immediate reset
–
The T[5:0] bits contain the number of increments which represents the time delay
before the watchdog produces a reset (see Figure 32: Approximate timeout
duration). The timing varies between a minimum and a maximum value due to the
unknown status of the prescaler when writing to the WDGCR register (see
Figure 33).
Following a reset, the watchdog is disabled. Once activated it cannot be disabled, except by
a reset.
The T6 bit can be used to generate a software reset (the WDGA bit is set and the T6 bit is
cleared).
If the watchdog is activated, the HALT instruction will generate a Reset.
82/247
ST72321Bxxx-Auto
Watchdog timer (WDG)
Figure 31. Watchdog block diagram
RESET
fOSC2
MCC/RTC
WATCHDOG CONTROL REGISTER (WDGCR)
DIV 64
WDGA
T6
T5
T4
T3
T2
T1
T0
6-BIT DOWNCOUNTER (CNT)
12-BIT MCC
RTC COUNTER
MSB
11
10.4
WDG PRESCALER
LSB
6 5
0
DIV 4
TB[1:0] bits
(MCCSR
Register)
How to program the watchdog timeout
Figure 32 shows the linear relationship between the 6-bit value to be loaded in the
Watchdog Counter (CNT) and the resulting timeout duration in milliseconds. This can be
used for a quick calculation without taking the timing variations into account. If more
precision is needed, use the formulae in Figure 33.
When writing to the WDGCR register, always write 1 in the T6 bit to avoid generating an
immediate reset.
Figure 32. Approximate timeout duration
3F
38
30
CNT Value (hex.)
Caution:
28
20
18
10
08
00
1.5
18
34
50
65
82
98
114
128
Watchdog timeout (ms) @ 8 MHz fOSC2
83/247
Watchdog timer (WDG)
ST72321Bxxx-Auto
Figure 33. Exact timeout duration (tmin and tmax)
WHERE:
tmin0 = (LSB + 128) x 64 x tOSC2
tmax0 = 16384 x tOSC2
tOSC2 = 125ns if fOSC2= 8 MHz
CNT = Value of T[5:0] bits in the WDGCR register (6 bits)
MSB and LSB are values from the table below depending on the timebase selected by the TB[1:0] bits
in the MCCSR register
TB1 bit
TB0 bit
(MCCSR reg.)
0
0
1
1
(MCCSR reg.)
0
1
0
1
Selected MCCSR
timebase
MSB
LSB
2ms
4ms
10ms
25ms
4
8
20
49
59
53
35
54
To calculate the minimum Watchdog Timeout (tmin):
MSB
IF CNT < ------------4
THEN tmin = t min0 + 16384 × CNT × tosc2
4CNT
ELSE t min = tmin0 + 16384 × ⎛⎝ CNT – 4CNT
----------------- ⎞ + ( 192 + LSB ) × 64 × ----------------MSB ⎠
MSB
× tosc2
To calculate the maximum Watchdog Timeout (tmax):
IF CNT ≤ MSB
------------4
THEN t max = t max0 + 16384 × CNT × t osc2
4CNT
ELSE t max = tmax0 + 16384 × ⎛⎝ CNT – 4CNT
----------------- ⎞ + ( 192 + LSB ) × 64 × ----------------MSB ⎠
MSB
Note: In the above formulae, division results must be rounded down to the next integer value.
Example:
With 2ms timeout selected in MCCSR register
Value of T[5:0] bits in
WDGCR register (Hex.)
00
3F
84/247
Min. Watchdog
Timeout (ms)
tmin
1.496
128
Max. Watchdog
Timeout (ms)
tmax
2.048
128.552
× t osc2
ST72321Bxxx-Auto
10.5
Watchdog timer (WDG)
Low power modes
Table 34.
Effect of low power modes on WDG
Mode
Effect
Slow
No effect on Watchdog
Wait
No effect on Watchdog
OIE bit in
MCCSR
register
WDGHALT
bit in
Option
Byte
0
0
No Watchdog reset is generated. The MCU enters Halt mode.
The Watchdog counter is decremented once and then stops
counting and is no longer able to generate a watchdog reset
until the MCU receives an external interrupt or a reset.
If an external interrupt is received, the Watchdog restarts
counting after 256 or 4096 CPU clocks. If a reset is generated,
the Watchdog is disabled (reset state) unless Hardware
Watchdog is selected by option byte. For application
recommendations see Section 10.7 below.
0
1
A reset is generated.
x
No reset is generated. The MCU enters Active Halt mode. The
Watchdog counter is not decremented. It stop counting. When
the MCU receives an oscillator interrupt or external interrupt,
the Watchdog restarts counting immediately. When the MCU
receives a reset the Watchdog restarts counting after 256 or
4096 CPU clocks.
Halt
1
10.6
Hardware watchdog option
If Hardware Watchdog is selected by option byte, the watchdog is always active and the
WDGA bit in the WDGCR is not used. Refer to the option byte description in Section 21.1.1:
Flash configuration on page 228.
10.7
Using Halt mode with the WDG (WDGHALT option)
The following recommendation applies if Halt mode is used when the watchdog is enabled:
Before executing the HALT instruction, refresh the WDG counter to avoid an unexpected
WDG reset immediately after waking up the microcontroller.
10.8
Interrupts
None.
85/247
Watchdog timer (WDG)
ST72321Bxxx-Auto
10.9
Register description
10.9.1
Control register (WDGCR)
WDGCR
7
6
5
4
3
WDGA
T[6:0]
RW
RW
Table 35.
Bit
2
1
0
WDGCR register description
Name
Function
7
Activation bit
This bit is set by software and only cleared by hardware after a reset. When
WDGA = 1, the watchdog can generate a reset.
WDGA
0: Watchdog disabled
1: Watchdog enabled
Note: This bit is not used if the hardware watchdog option is enabled by option byte.
6:0
7-bit counter (MSB to LSB)
These bits contain the value of the watchdog counter. It is decremented every 16384
T[6:0]
fOSC2 cycles (approx.). A reset is produced when it rolls over from 40h to 3Fh (T6
becomes cleared).
Table 36.
Address
(Hex.)
002Ah
86/247
Reset value: 0111 1111 (7Fh)
Watchdog timer register map and reset values
Register
label
WDGCR
Reset Value
7
6
5
4
3
2
1
0
WDGA
0
T6
1
T5
1
T4
1
T3
1
T2
1
T1
1
T0
1
ST72321Bxxx-Auto
Main clock controller with real-time clock and beeper (MCC/RTC)
11
Main clock controller with real-time clock and beeper
(MCC/RTC)
11.1
Introduction
The Main Clock Controller consists of three different functions:
●
a programmable CPU clock prescaler
●
a clock-out signal to supply external devices
●
a real-time clock timer with interrupt capability
Each function can be used independently and simultaneously.
11.2
Programmable CPU clock prescaler
The programmable CPU clock prescaler supplies the clock for the ST7 CPU and its internal
peripherals. It manages Slow power saving mode (see Section 8.2: Slow mode on page 67
for more details).
The prescaler selects the fCPU main clock frequency and is controlled by three bits in the
MCCSR register: CP[1:0] and SMS.
11.3
Clock-out capability
The clock-out capability is an alternate function of an I/O port pin that outputs a fCPU clock to
drive external devices. It is controlled by the MCO bit in the MCCSR register.
Caution:
When selected, the clock out pin suspends the clock during Active Halt mode.
11.4
Real-time clock timer (RTC)
The counter of the real-time clock timer allows an interrupt to be generated based on an
accurate real-time clock. Four different time bases depending directly on fOSC2 are available.
The whole functionality is controlled by four bits of the MCCSR register: TB[1:0], OIE and
OIF.
When the RTC interrupt is enabled (OIE bit set), the ST7 enters Active Halt mode when the
HALT instruction is executed. See Section 8.4: Active Halt and Halt modes on page 69 for
more details.
11.5
Beeper
The beep function is controlled by the MCCBCR register. It can output three selectable
frequencies on the BEEP pin (I/O port alternate function).
87/247
Main clock controller with real-time clock and beeper (MCC/RTC)
ST72321Bxxx-Auto
Figure 34. Main clock controller (MCC/RTC) block diagram
BC1
BC0
MCCBCR
BEEP
BEEP SIGNAL
SELECTION
MCO
12-BIT MCC RTC
COUNTER
DIV 64
MCO
CP1
CP0
SMS
TB1
TB0
OIE
TO
WATCHDOG
TIMER
OIF
MCCSR
fOSC2
MCC/RTC INTERRUPT
DIV 2, 4, 8, 16
1
CPU CLOCK
TO CPU AND
PERIPHERALS
fCPU
0
11.6
Low power modes
Table 37.
Effect of low power modes on MCC/RTC
Mode
Effect
No effect on MCC/RTC peripheral.
MCC/RTC interrupt causes the device to exit from Wait mode.
Wait
Active Halt
MCC/RTC counter and registers are frozen.
MCC/RTC operation resumes when the MCU is woken up by an interrupt with
“exit from HALT” capability.
Halt
11.7
No effect on MCC/RTC counter (OIE bit is set), the registers are frozen.
MCC/RTC interrupt causes the device to exit from Active Halt mode.
Interrupts
The MCC/RTC interrupt event generates an interrupt if the OIE bit of the MCCSR register is
set and the interrupt mask in the CC register is not active (RIM instruction).
Table 38.
MCC/RTC interrupt control/wake-up capability
Interrupt event
Event flag
Enable
control bit
Exit from
Wait
Exit from
Halt
Time base overflow event
OIF
OIE
Yes
No(1)
1. The MCC/RTC interrupt wakes up the MCU from Active Halt mode, not from Halt mode.
88/247
ST72321Bxxx-Auto
Main clock controller with real-time clock and beeper (MCC/RTC)
11.8
Main clock controller registers
11.8.1
MCC control/status register (MCCSR)
MCCSR
7
6
5
4
3
2
1
0
MCO
CP[1:0]
SMS
TB[1:0]
OIE
OIF
RW
RW
RW
RW
RW
RW
Table 39.
Bit
7
6:5
4
3:2
1
Reset value: 0000 0000 (00h)
Name
MCO
MCCSR register description
Function
Main clock out selection
This bit enables the MCO alternate function on the PF0 I/O port. It is set and
cleared by software.
0: MCO alternate function disabled (I/O pin free for general-purpose I/O)
1: MCO alternate function enabled (fCPU on I/O port)
Note: To reduce power consumption, the MCO function is not active in Active Halt
mode.
CPU clock prescaler
These bits select the CPU clock prescaler which is applied in the different slow
modes. Their action is conditioned by the setting of the SMS bit. These two bits are
set and cleared by software.
CP[1:0]
00: fCPU in Slow mode = fOSC2/2
01: fCPU in Slow mode = fOSC2/4
10: fCPU in Slow mode = fOSC2/8
11: fCPU in Slow mode = fOSC2/16
SMS
Slow mode select
This bit is set and cleared by software.
0: Normal mode. fCPU = fOSC2
1: Slow mode. fCPU is given by CP1, CP0
See Section 8.2: Slow mode on page 67 and Chapter 11: Main clock controller with
real-time clock and beeper (MCC/RTC) for more details.
Time base control
These bits select the programmable divider time base. They are set and cleared by
software (see Table 40).
TB[1:0]
A modification of the time base is taken into account at the end of the current period
(previously set) to avoid an unwanted time shift. This allows to use this time base
as a real-time clock.
OIE
Oscillator interrupt enable
This bit set and cleared by software.
0: Oscillator interrupt disabled
1: Oscillator interrupt enabled
This interrupt can be used to exit from Active Halt mode.
When this bit is set, calling the ST7 software HALT instruction enters the Active Halt
power saving mode.
89/247
Main clock controller with real-time clock and beeper (MCC/RTC)
Table 39.
Bit
0
ST72321Bxxx-Auto
MCCSR register description (continued)
Name
Function
OIF
Oscillator interrupt flag
This bit is set by hardware and cleared by software reading the MCCSR register. It
indicates when set that the main oscillator has reached the selected elapsed time
(TB1:0).
0: Timeout not reached
1: Timeout reached
Caution: The BRES and BSET instructions must not be used on the MCCSR
register to avoid unintentionally clearing the OIF bit.
Table 40.
Time base selection
Time base
Counter prescaler
11.8.2
TB1
TB0
2ms
0
0
8ms
4ms
0
1
80000
20ms
10ms
1
0
200000
50ms
25ms
1
1
fOSC2 = 4 MHz
fOSC2 = 8 MHz
16000
4ms
32000
MCC beep control register (MCCBCR)
MCCBCR
Reset value: 0000 0000 (00h)
7
6
Table 41.
4
3
2
1
0
Reserved
BC[1:0]
-
RW
MCCBCR register description
Bit
Name
7:2
-
1:0
BC[1:0]
Table 42.
5
Function
Reserved, must be kept cleared.
Beep control
These 2 bits select the PF1 pin beep capability (see Table 42).
Beep frequency selection
BC1
BC0
Beep mode with fOSC2 = 8 MHz
0
0
Off
0
1
~2 kHz
1
0
~1 kHz
1
1
~500 Hz
Output
Beep signal
~50% duty cycle
The beep output signal is available in Active Halt mode but has to be disabled to reduce
consumption.
90/247
ST72321Bxxx-Auto
Table 43.
Main clock controller with real-time clock and beeper (MCC/RTC)
Main clock controller register map and reset values
Address (Hex.) Register label
7
6
5
4
3
2
1
0
002Bh
SICSR
Reset value
AVDS
0
AVDIE
0
AVDF
0
LVDRF
x
0
0
0
WDGRF
x
002Ch
MCCSR
Reset value
MCO
0
CP1
0
CP0
0
SMS
0
TB1
0
TB0
0
OIE
0
OIF
0
002Dh
MCCBCR
Reset value
0
0
0
0
0
0
BC1
0
BC0
0
91/247
PWM auto-reload timer (ART)
ST72321Bxxx-Auto
12
PWM auto-reload timer (ART)
12.1
Introduction
The Pulse Width Modulated Auto-Reload Timer on-chip peripheral consists of an 8-bit autoreload counter with compare/capture capabilities and of a 7-bit prescaler clock source.
These resources allow five possible operating modes:
●
Generation of up to 4 independent PWM signals
●
Output compare and Time base interrupt
●
Up to 2 input capture functions
●
External event detector
●
Up to 2 external interrupt sources
The three first modes can be used together with a single counter frequency.
The timer can be used to wake up the MCU from Wait and Halt modes.
Figure 35. PWM auto-reload timer block diagram
OEx
PWMCR
OCRx
REGISTER
OPx
DCRx
REGISTER
LOAD
PWMx
PORT
ALTERNATE
FUNCTION
POLARITY
CONTROL
COMPARE
8-BIT COUNTER
ARR
REGISTER
INPUT CAPTURE
CONTROL
ARTICx
ICSx
ARTCLK
ICIEx
LOAD
(CAR REGISTER)
LOAD
ICFx
ICRx
REGISTER
ICCSR
ICx INTERRUPT
fEXT
fCOUNTER
fCPU
MUX
fINPUT
EXCL
PROGRAMMABLE
PRESCALER
CC2
CC1
CC0
TCE
FCRL
OIE
OVF
ARTCSR
OVF INTERRUPT
92/247
ST72321Bxxx-Auto
PWM auto-reload timer (ART)
12.2
Functional description
12.2.1
Counter
The free running 8-bit counter is fed by the output of the prescaler, and is incremented on
every rising edge of the clock signal.
It is possible to read or write the contents of the counter on the fly by reading or writing the
Counter Access register (ARTCAR).
When a counter overflow occurs, the counter is automatically reloaded with the contents of
the ARTARR register (the prescaler is not affected).
12.2.2
Counter clock and prescaler
The counter clock frequency is given by:
fCOUNTER = fINPUT / 2CC[2:0]
The timer counter’s input clock (fINPUT) feeds the 7-bit programmable prescaler, which
selects one of the 8 available taps of the prescaler, as defined by CC[2:0] bits in the
Control/Status Register (ARTCSR). Thus the division factor of the prescaler can be set to 2n
(where n = 0, 1,..7).
This fINPUT frequency source is selected through the EXCL bit of the ARTCSR register and
can be either the fCPU or an external input frequency fEXT.
The clock input to the counter is enabled by the TCE (Timer Counter Enable) bit in the
ARTCSR register. When TCE is reset, the counter is stopped and the prescaler and counter
contents are frozen. When TCE is set, the counter runs at the rate of the selected clock
source.
12.2.3
Counter and prescaler initialization
After RESET, the counter and the prescaler are cleared and fINPUT = fCPU.
The counter can be initialized by:
●
writing to the ARTARR register and then setting the FCRL (Force Counter Re-Load)
and the TCE (Timer Counter Enable) bits in the ARTCSR register
●
writing to the ARTCAR counter access register
In both cases the 7-bit prescaler is also cleared, whereupon counting will start from a known
value.
Direct access to the prescaler is not possible.
12.2.4
Output compare control
The timer compare function is based on four different comparisons with the counter (one for
each PWMx output). Each comparison is made between the counter value and an output
compare register (OCRx) value. This OCRx register can not be accessed directly, it is
loaded from the duty cycle register (PWMDCRx) at each overflow of the counter.
This double buffering method avoids glitch generation when changing the duty cycle on the
fly.
93/247
PWM auto-reload timer (ART)
ST72321Bxxx-Auto
Figure 36. Output compare control
fCOUNTER
ARTARR = FDh
COUNTER
FDh
FEh
FFh
OCRx
PWMDCRx
FDh
FEh
FFh
FDh
FFh
FEh
FDh
FDh
FEh
FEh
PWMx
12.2.5
Independent PWM signal generation
This mode allows up to four Pulse Width Modulated signals to be generated on the PWMx
output pins with minimum core processing overhead. This function is stopped during Halt
mode.
Each PWMx output signal can be selected independently using the corresponding OEx bit
in the PWM Control register (PWMCR). When this bit is set, the corresponding I/O pin is
configured as output push-pull alternate function.
The PWM signals all have the same frequency which is controlled by the counter period and
the ARTARR register value.
fPWM = fCOUNTER / (256 - ARTARR)
When a counter overflow occurs, the PWMx pin level is changed depending on the
corresponding OPx (output polarity) bit in the PWMCR register. When the counter reaches
the value contained in one of the output compare register (OCRx) the corresponding PWMx
pin level is restored.
It should be noted that the reload values will also affect the value and the resolution of the
duty cycle of the PWM output signal. To obtain a signal on a PWMx pin, the contents of the
OCRx register must be greater than the contents of the ARTARR register.
The maximum available resolution for the PWMx duty cycle is:
Resolution = 1 / (256 - ARTARR)
Note:
94/247
To get the maximum resolution (1/256), the ARTARR register must be 0. With this maximum
resolution, 0% and 100% can be obtained by changing the polarity.
ST72321Bxxx-Auto
PWM auto-reload timer (ART)
Figure 37. PWM auto-reload timer function
COUNTER
255
DUTY CYCLE
REGISTER
(PWMDCRx)
AUTO-RELOAD
REGISTER
(ARTARR)
PWMx OUTPUT
000
t
WITH OEx=1
AND OPx=0
WITH OEx=1
AND OPx=1
Figure 38. PWM signal from 0% to 100% duty cycle
fCOUNTER
ARTARR = FDh
COUNTER
FDh
FEh
FFh
FDh
FEh
FFh
FDh
FEh
PWMx OUTPUT
WITH OEx=1
AND OPx=0
OCRx=FCh
OCRx=FDh
OCRx=FEh
OCRx=FFh
t
12.2.6
Output compare and time base interrupt
On overflow, the OVF flag of the ARTCSR register is set and an overflow interrupt request is
generated if the overflow interrupt enable bit, OIE, in the ARTCSR register, is set. The OVF
flag must be reset by the user software. This interrupt can be used as a time base in the
application.
12.2.7
External clock and event detector mode
Using the fEXT external prescaler input clock, the auto-reload timer can be used as an
external clock event detector. In this mode, the ARTARR register is used to select the
nEVENT number of events to be counted before setting the OVF flag.
nEVENT = 256 - ARTARR
Caution:
The external clock function is not available in Halt mode. If Halt mode is used in the
application, prior to executing the HALT instruction, the counter must be disabled by clearing
the TCE bit in the ARTCSR register to avoid spurious counter increments.
95/247
PWM auto-reload timer (ART)
ST72321Bxxx-Auto
Figure 39. External event detector example (3 counts)
fEXT = fCOUNTER
ARTARR = FDh
COUNTER
FDh
FEh
FFh
FDh
FEh
FFh
FDh
OVF
ARTCSR READ
INTERRUPT
IF OIE = 1
ARTCSR READ
INTERRUPT
IF OIE = 1
t
12.2.8
Input capture function
This mode allows the measurement of external signal pulse widths through ARTICRx
registers.
Each input capture can generate an interrupt independently on a selected input signal
transition. This event is flagged by a set of the corresponding CFx bits of the Input Capture
Control/Status register (ARTICCSR).
These input capture interrupts are enabled through the CIEx bits of the ARTICCSR register.
The active transition (falling or rising edge) is software programmable through the CSx bits
of the ARTICCSR register.
The read only input capture registers (ARTICRx) are used to latch the auto-reload counter
value when a transition is detected on the ARTICx pin (CFx bit set in ARTICCSR register).
After fetching the interrupt vector, the CFx flags can be read to identify the interrupt source.
Note:
After a capture detection, data transfer in the ARTICRx register is inhibited until it is read
(clearing the CFx bit).
The timer interrupt remains pending while the CFx flag is set when the interrupt is enabled
(CIEx bit set). This means that the ARTICRx register has to be read at each capture event to
clear the CFx flag.
The timing resolution is given by auto-reload counter cycle time (1/fCOUNTER).
Note:
96/247
During Halt mode, if both the input capture and the external clock are enabled, the ARTICRx
register value is not guaranteed if the input capture pin and the external clock change
simultaneously.
ST72321Bxxx-Auto
12.2.9
PWM auto-reload timer (ART)
External interrupt capability
This mode allows the input capture capabilities to be used as external interrupt sources. The
interrupts are generated on the edge of the ARTICx signal.
The edge sensitivity of the external interrupts is programmable (CSx bit of ARTICCSR
register) and they are independently enabled through CIEx bits of the ARTICCSR register.
After fetching the interrupt vector, the CFx flags can be read to identify the interrupt source.
During Halt mode, the external interrupts can be used to wake up the micro (if the CIEx bit is
set).
Figure 40. Input capture timing diagram
fCOUNTER
COUNTER
01h
02h
03h
04h
05h
06h
07h
INTERRUPT
ARTICx PIN
CFx FLAG
xxh
04h
ICRx REGISTER
t
97/247
PWM auto-reload timer (ART)
ST72321Bxxx-Auto
12.3
ART registers
12.3.1
Control/status register (ARTCSR)
ARTCSR
Reset value: 0000 0000 (00h)
7
6
4
3
2
1
0
EXCL
CC[2:0]
TCE
FCRL
OIE
OVF
RW
RW
RW
RW
RW
RW
Table 44.
Bit
7
ARTCSR register description
Name
EXCL
6:4 CC[2:0]
3
2
1
0
TCE
Function
External Clock
This bit is set and cleared by software. It selects the input clock for the 7-bit
prescaler.
0: CPU clock
1: External clock
Counter Clock Control
These bits are set and cleared by software. They determine the prescaler division
ratio from fINPUT (see Table 45).
Timer Counter Enable
This bit is set and cleared by software. It puts the timer in the lowest power
consumption mode.
0: Counter stopped (prescaler and counter frozen)
1: Counter running
FCRL
Force Counter Re-Load
This bit is write-only and any attempt to read it will yield a logical zero. When set, it
causes the contents of ARTARR register to be loaded into the counter, and the
content of the prescaler register to be cleared in order to initialize the timer before
starting to count.
OIE
Overflow Interrupt Enable
This bit is set and cleared by software. It allows to enable/disable the interrupt which
is generated when the OVF bit is set.
0: Overflow Interrupt disable
1: Overflow Interrupt enable
OVF
Overflow Flag
This bit is set by hardware and cleared by software reading the ARTCSR register. It
indicates the transition of the counter from FFh to the ARTARR value.
0: New transition not yet reached
1: Transition reached
Table 45.
98/247
5
Prescaler selection for ART
fCOUNTER
With fINPUT = 8 MHz
CC2
CC1
CC0
fINPUT
8 MHz
0
0
0
fINPUT / 2
4 MHz
0
0
1
fINPUT / 4
2 MHz
0
1
0
ST72321Bxxx-Auto
PWM auto-reload timer (ART)
Table 45.
12.3.2
Prescaler selection for ART (continued)
fCOUNTER
With fINPUT = 8 MHz
CC2
CC1
CC0
fINPUT / 8
1 MHz
0
1
1
fINPUT / 16
500 kHz
1
0
0
fINPUT / 32
250 kHz
1
0
1
fINPUT / 64
125 kHz
1
1
0
fINPUT / 128
62.5 kHz
1
1
1
Counter access register (ARTCAR)
ARTCAR
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
CA[7:0]
RW
Table 46.
Bit
Name
7:0
12.3.3
ARTCAR register description
CA[7:0]
Function
Counter Access Data
These bits can be set and cleared either by hardware or by software. The
ARTCAR register is used to read or write the auto-reload counter “on the fly”
(while it is counting).
Auto-reload register (ARTARR)
ARTARR
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
AR[7:0]
RW
Table 47.
Bit
7:0
ARTAAR register description
Name
Function
AR[7:0]
Counter Auto-Reload Data
These bits are set and cleared by software. They are used to hold the auto-reload
value which is automatically loaded in the counter when an overflow occurs. At the
same time, the PWM output levels are changed according to the corresponding
OPx bit in the PWMCR register.
This register has two PWM management functions:
–
Adjusting the PWM frequency
–
Setting the PWM duty cycle resolution
99/247
PWM auto-reload timer (ART)
Table 48.
ST72321Bxxx-Auto
PWM frequency versus resolution
fPWM
ARTARR value
12.3.4
Resolution
Min
Max
0
8-bit
~0.244 kHz
31.25 kHz
[ 0..127 ]
> 7-bit
~0.244 kHz
62.5 kHz
[ 128..191 ]
> 6-bit
~0.488 kHz
125 kHz
[ 192..223 ]
> 5-bit
~0.977 kHz
250 kHz
[ 224..239 ]
> 4-bit
~1.953 kHz
500 kHz
PWM control register (PWMCR)
PWMCR
Reset value: 0000 0000 (00h)
7
6
Table 49.
Bit
5
4
3
2
1
OE[3:0]
OP[3:0]
RW
RW
PWMCR register description
Name
Function
7:4
PWM Output Enable
These bits are set and cleared by software. They enable or disable the PWM
OE[3:0]
output channels independently acting on the corresponding I/O pin.
0: PWM output disabled
1: PWM output enabled
3:0
OP[3:0]
Table 50.
PWM Output Polarity
These bits are set and cleared by software. They independently select the polarity
of the four PWM output signals (see Table 50).
PWM output signal polarity selection
PWMx output level
OPx(1)
Counter <= OCRx
Counter > OCRx
1
0
0
0
1
1
1. When an OPx bit is modified, the PWMx output signal polarity is immediately reversed.
100/247
0
ST72321Bxxx-Auto
12.3.5
PWM auto-reload timer (ART)
Duty cycle registers (PWMDCRx)
PWMDCRx
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
DC[7:0]
RW
Table 51.
PWMDCRx register description
Bit
Name
7:0
DC[7:0]
Function
Duty Cycle Data
These bits are set and cleared by software.
A PWMDCRx register is associated with the OCRx register of each PWM channel to
determine the second edge location of the PWM signal (the first edge location is common to
all channels and given by the ARTARR register). These PWMDCR registers allow the duty
cycle to be set independently for each PWM channel.
12.3.6
Input capture control / status register (ARTICCSR)
ARTICCSR
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
Reserved
CS[2:1]
CIE[2:1]
CF[2:1]
-
RW
RW
RW
Table 52.
ARTICCSR register description
Bit
Name
7:6
-
Function
Reserved, always read as 0.
Capture Sensitivity
These bits are set and cleared by software. They determine the trigger event
polarity on the corresponding input capture channel.
0: Falling edge triggers capture on channel x
1: Rising edge triggers capture on channel x
5:4
CS[2:1]
3:2
Capture Interrupt Enable
These bits are set and cleared by software. They enable or disable the Input
CIE[2:1]
capture channel interrupts independently.
0: Input capture channel x interrupt disabled
1: Input capture channel x interrupt enabled
1:0
CF[2:1]
Capture Flag
These bits are set by hardware and cleared by software reading the
corresponding ARTICRx register. Each CFx bit indicates that an input capture x
has occurred.
0: No input capture on channel x
1: An input capture has occurred on channel x.
101/247
PWM auto-reload timer (ART)
12.3.7
ST72321Bxxx-Auto
Input capture registers (ARTICRx)
ARTICRx
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
IC[7:0]
RO
Table 53.
Bit
7:0
ARTICRx register description
Name
IC[7:0]
Table 54.
Function
Input Capture Data
These read only bits are set and cleared by hardware. An ARTICRx register
contains the 8-bit auto-reload counter value transferred by the input capture
channel x event.
PWM auto-reload timer register map and reset values
Address (Hex.) Register label
102/247
7
6
5
4
3
2
1
0
0073h
PWMDCR3
Reset value
DC7
0
DC6
0
DC5
0
DC4
0
DC3
0
DC2
0
DC1
0
DC0
0
0074h
PWMDCR2
Reset value
DC7
0
DC6
0
DC5
0
DC4
0
DC3
0
DC2
0
DC1
0
DC0
0
0075h
PWMDCR1
Reset value
DC7
0
DC6
0
DC5
0
DC4
0
DC3
0
DC2
0
DC1
0
DC0
0
0076h
PWMDCR0
Reset value
DC7
0
DC6
0
DC5
0
DC4
0
DC3
0
DC2
0
DC1
0
DC0
0
0077h
PWMCR
Reset value
OE3
0
OE2
0
OE1
0
OE0
0
OP3
0
OP2
0
OP1
0
OP0
0
0078h
ARTCSR
Reset value
EXCL
0
CC2
0
CC1
0
CC0
0
TCE
0
FCRL
0
RIE
0
OVF
0
0079h
ARTCAR
Reset value
CA7
0
CA6
0
CA5
0
CA4
0
CA3
0
CA2
0
CA1
0
CA0
0
007Ah
ARTARR
Reset value
AR7
0
AR6
0
AR5
0
AR4
0
AR3
0
AR2
0
AR1
0
AR0
0
007Bh
ARTICCSR
Reset value
0
0
CS2
0
CS1
0
CIE2
0
CIE1
0
CF2
0
CF1
0
007Ch
ARTICR1
Reset value
IC7
0
IC6
0
IC5
0
IC4
0
IC3
0
IC2
0
IC1
0
IC0
0
007Dh
ARTICR2
Reset value
IC7
0
IC6
0
IC5
0
IC4
0
IC3
0
IC2
0
IC1
0
IC0
0
ST72321Bxxx-Auto
16-bit timer
13
16-bit timer
13.1
Introduction
The timer consists of a 16-bit free-running counter driven by a programmable prescaler.
It may be used for a variety of purposes, including pulse length measurement of up to two
input signals (input capture) or generation of up to two output waveforms (output compare
and PWM).
Pulse lengths and waveform periods can be modulated from a few microseconds to several
milliseconds using the timer prescaler and the CPU clock prescaler.
Some ST7 devices have two on-chip 16-bit timers. They are completely independent, and
do not share any resources. They are synchronized after an MCU reset as long as the timer
clock frequencies are not modified.
This description covers one or two 16-bit timers. In ST7 devices with two timers, register
names are prefixed with TA (Timer A) or TB (Timer B).
13.2
Main features
●
Programmable prescaler: fCPU divided by 2, 4 or 8
●
Overflow status flag and maskable interrupt
●
External clock input (must be at least four times slower than the CPU clock speed) with
the choice of active edge
●
1 or 2 Output Compare functions each with:
●
–
2 dedicated 16-bit registers
–
2 dedicated programmable signals
–
2 dedicated status flags
–
1 dedicated maskable interrupt
1 or 2 Input Capture functions each with:
–
2 dedicated 16-bit registers
–
2 dedicated active edge selection signals
–
2 dedicated status flags
–
1 dedicated maskable interrupt
●
Pulse Width Modulation mode (PWM)
●
One Pulse mode
●
Reduced Power mode
●
5 alternate functions on I/O ports (ICAP1, ICAP2, OCMP1, OCMP2, EXTCLK)(a)
The block diagram is shown in Figure 41.
Note:
When reading an input signal on a non-bonded pin, the value will always be ‘1’.
a. Some timer pins may not be available (not bonded) in some ST7 devices. Refer to the device pinout
description.
103/247
16-bit timer
ST72321Bxxx-Auto
13.3
Functional description
13.3.1
Counter
The main block of the Programmable Timer is a 16-bit free running upcounter and its
associated 16-bit registers. The 16-bit registers are made up of two 8-bit registers called
high and low.
Counter Register (CR)
●
Counter High Register (CHR) is the most significant byte (MS Byte)
●
Counter Low Register (CLR) is the least significant byte (LS Byte)
Alternate Counter Register (ACR)
●
Alternate Counter High Register (ACHR) is the most significant byte (MS Byte)
●
Alternate Counter Low Register (ACLR) is the least significant byte (LS Byte)
These two read-only 16-bit registers contain the same value but with the difference that
reading the ACLR register does not clear the TOF bit (Timer overflow flag), located in the
Status register (SR) (see note at the end of paragraph entitled 16-bit read sequence).
Writing in the CLR register or ACLR register resets the free running counter to the FFFCh
value.
Both counters have a reset value of FFFCh (this is the only value which is reloaded in the
16-bit timer). The reset value of both counters is also FFFCh in One Pulse mode and PWM
mode.
The timer clock depends on the clock control bits of the CR2 register, as illustrated in
Table 60: Timer clock selection. The value in the counter register repeats every 131072,
262144 or 524288 CPU clock cycles depending on the CC[1:0] bits.
The timer frequency can be fCPU/2, fCPU/4, fCPU/8 or an external frequency.
104/247
ST72321Bxxx-Auto
16-bit timer
Figure 41. Timer block diagram
ST7 INTERNAL BUS
fCPU
MCU-PERIPHERAL INTERFACE
8 low
8
8
8
low
8
high
8
low
low
EXEDG
8
high
8
high
8
low
8-bit
buffer
high
8 high
16
1/2
1/4
1/8
OUTPUT
COMPARE
REGISTER
2
OUTPUT
COMPARE
REGISTER
1
COUNTER
REGISTER
ALTERNATE
COUNTER
REGISTER
EXTCLK
pin
INPUT
CAPTURE
REGISTER
1
INPUT
CAPTURE
REGISTER
2
16
16
16
CC[1:0]
TIMER INTERNAL BUS
16
OVERFLOW
DETECT
CIRCUIT
16
OUTPUT COMPARE
CIRCUIT
6
ICF1 OCF1 TOF ICF2 OCF2 TIMD
0
EDGE DETECT
CIRCUIT1
ICAP1
pin
EDGE DETECT
CIRCUIT2
ICAP2
pin
OCMP1
pin
LATCH2
OCMP2
pin
0
(Control/Status Register)
CSR
ICIE
LATCH1
OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1
(Control Register 1) CR1
OC1E OC2E
OPM
PWM
CC1
CC0
IEDG2 EXEDG
(Control Register 2) CR2
(1)
TIMER INTERRUPT
1. If IC, OC and TO interrupt request have separate vectors, then the last OR is not present (see device interrupt vector table).
105/247
16-bit timer
ST72321Bxxx-Auto
16-bit read sequence
The 16-bit read sequence (from either the Counter Register or the Alternate Counter
Register) is illustrated in Figure 42.
Figure 42. 16-bit read sequence
Beginning of the sequence
At t0
Read
MS Byte
LS Byte
is buffered
Other
instructions
At t0 +Dt
Read
LS Byte
Returns the buffered
LS Byte value at t0
Sequence completed
The user must read the MS Byte first; the LS Byte value is then buffered automatically.
This buffered value remains unchanged until the 16-bit read sequence is completed, even if
the user reads the MS Byte several times.
After a complete reading sequence, if only the CLR register or ACLR register are read, they
return the LS Byte of the count value at the time of the read.
Whatever timer mode is used (input capture, output compare, one pulse mode or PWM
mode) an overflow occurs when the counter rolls over from FFFFh to 0000h, after which
●
the TOF bit of the SR register is set
●
a timer interrupt is generated if
–
the TOIE bit of the CR1 register is set and
–
the I bit of the CC register is cleared
If one of these conditions is false, the interrupt remains pending to be issued as soon as
they are both true.
Clearing the overflow interrupt request is done in two steps:
Note:
1.
Reading the SR register while the TOF bit is set
2.
An access (read or write) to the CLR register
The TOF bit is not cleared by accesses to ACLR register. The advantage of accessing the
ACLR register rather than the CLR register is that it allows simultaneous use of the overflow
function and reading the free running counter at random times (for example, to measure
elapsed time) without the risk of clearing the TOF bit erroneously.
The timer is not affected by Wait mode.
In Halt mode, the counter stops counting until the mode is exited. Counting then resumes
from the previous count (MCU awakened by an interrupt) or from the reset count (MCU
awakened by a Reset).
106/247
ST72321Bxxx-Auto
13.3.2
16-bit timer
External clock
The external clock (where available) is selected if CC0 = 1 and CC1 = 1 in the CR2 register.
The status of the EXEDG bit in the CR2 register determines the type of level transition on
the external clock pin EXTCLK that will trigger the free running counter.
The counter is synchronized with the falling edge of the internal CPU clock.
A minimum of four falling edges of the CPU clock must occur between two consecutive
active edges of the external clock; thus, the external clock frequency must be less than a
quarter of the CPU clock frequency.
Figure 43. Counter timing diagram, internal clock divided by 2
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
COUNTER REGISTER
FFFD FFFE FFFF 0000
0001
0002
0003
TIMER OVERFLOW FLAG (TOF)
Figure 44. Counter timing diagram, internal clock divided by 4
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
COUNTER REGISTER
FFFC
FFFD
0000
0001
TIMER OVERFLOW FLAG (TOF)
Figure 45. Counter timing diagram, internal clock divided by 8
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
COUNTER REGISTER
FFFC
FFFD
0000
TIMER OVERFLOW FLAG (TOF)
Note:
The MCU is in reset state when the internal reset signal is high; when it is low the MCU is
running.
107/247
16-bit timer
13.3.3
ST72321Bxxx-Auto
Input capture
In this section, the index, i, may be 1 or 2 because there are two input capture functions in
the 16-bit timer.
The two 16-bit input capture registers (IC1R and IC2R) are used to latch the value of the
free running counter after a transition is detected on the ICAPi pin (see Figure 46).
ICiR
MS Byte
LS Byte
ICiHR
ICiLR
ICiR register is a read-only register.
The active transition is software programmable through the IEDGi bit of Control Registers
(CRi).
Timing resolution is one count of the free running counter: (fCPU/CC[1:0]).
Procedure:
To use the input capture function select the following in the CR2 register:
●
Select the timer clock (CC[1:0]) (see Table 60: Timer clock selection).
●
Select the edge of the active transition on the ICAP2 pin with the IEDG2 bit (the ICAP2
pin must be configured as floating input or input with pull-up without interrupt if this
configuration is available).
And select the following in the CR1 register:
●
Set the ICIE bit to generate an interrupt after an input capture coming from either the
ICAP1 pin or the ICAP2 pin
●
Select the edge of the active transition on the ICAP1 pin with the IEDG1 bit (the
ICAP1pin must be configured as floating input or input with pull-up without interrupt if
this configuration is available).
When an input capture occurs:
●
ICFi bit is set.
●
The ICiR register contains the value of the free running counter on the active transition
on the ICAPi pin (see Figure 47).
●
A timer interrupt is generated if the ICIE bit is set and the I bit is cleared in the CC
register. Otherwise, the interrupt remains pending until both conditions become true.
Clearing the input capture interrupt request (that is, clearing the ICFi bit) is done in two
steps:
Note:
108/247
1.
Reading the SR register while the ICFi bit is set
2.
An access (read or write) to the ICiLR register
1
After reading the ICiHR register, transfer of input capture data is inhibited and ICFi will never
be set until the ICiLR register is also read.
2
The ICiR register contains the free running counter value which corresponds to the most
recent input capture.
3
The two input capture functions can be used together even if the timer also uses the two
output compare functions.
4
In One pulse Mode and PWM mode only Input Capture 2 can be used.
ST72321Bxxx-Auto
16-bit timer
5
The alternate inputs (ICAP1 and ICAP2) are always directly connected to the timer. So any
transitions on these pins activates the input capture function.
6
Moreover if one of the ICAPi pins is configured as an input and the second one as an output,
an interrupt can be generated if the user toggles the output pin and if the ICIE bit is set.
7
This can be avoided if the input capture function i is disabled by reading the ICiHR (see note
1).
8
The TOF bit can be used with interrupt generation in order to measure events that go
beyond the timer range (FFFFh).
Figure 46. Input capture block diagram
ICAP1
pin
(Control Register 1) CR1
EDGE DETECT
EDGE DETECT
CIRCUIT2
CIRCUIT1
ICAP2
pin
ICIE
IEDG1
(Status Register) SR
IC1R Register
IC2R Register
ICF1
ICF2
0
0
0
(Control Register 2) CR2
16-BIT
16-BIT FREE RUNNING
COUNTER
CC1
CC0
IEDG2
Figure 47. Input capture timing diagram
TIMER CLOCK
COUNTER REGISTER
FF01
FF02
FF03
ICAPi PIN
ICAPi FLAG
ICAPi REGISTER
FF03
Note: The rising edge is the active edge.
109/247
16-bit timer
13.3.4
ST72321Bxxx-Auto
Output compare
In this section, the index, i, may be 1 or 2 because there are two output compare functions in
the 16-bit timer.
This function can be used to control an output waveform or indicate when a period of time
has elapsed.
When a match is found between the Output Compare register and the free running counter,
the output compare function:
●
Assigns pins with a programmable value if the OCiE bit is set
●
Sets a flag in the status register
●
Generates an interrupt if enabled
Two 16-bit registers Output Compare Register 1 (OC1R) and Output Compare Register 2
(OC2R) contain the value to be compared to the counter register each timer clock cycle.
OCiR
MS byte
LS byte
OCiHR
OCiLR
These registers are readable and writable and are not affected by the timer hardware. A
reset event changes the OCiR value to 8000h.
Timing resolution is one count of the free running counter: (fCPU/CC[1:0]).
Procedure
To use the output compare function, select the following in the CR2 register:
●
Set the OCiE bit if an output is needed then the OCMPi pin is dedicated to the output
compare i signal.
●
Select the timer clock (CC[1:0]) (see Table 60: Timer clock selection).
And select the following in the CR1 register:
●
Select the OLVLi bit to applied to the OCMPi pins after the match occurs.
●
Set the OCIE bit to generate an interrupt if it is needed.
When a match is found between OCRi register and CR register:
●
OCFi bit is set.
●
The OCMPi pin takes OLVLi bit value (OCMPi pin latch is forced low during reset).
●
A timer interrupt is generated if the OCIE bit is set in the CR1 register and the I bit is
cleared in the CC register (CC).
The OCiR register value required for a specific timing application can be calculated using
the following formula:
∆t * fCPU
∆ OCiR =
PRESC
Where:
∆t
= Output compare period (in seconds)
fCPU
= CPU clock frequency (in hertz)
PRESC = Timer prescaler factor (2, 4 or 8 depending on CC[1:0] bits; see Table 60:
Timer clock selection)
110/247
ST72321Bxxx-Auto
16-bit timer
If the timer clock is an external clock, the formula is:
∆ OCiR = ∆t * fEXT
Where:
∆t
= Output compare period (in seconds)
fCPU
= External timer clock frequency (in hertz)
Clearing the output compare interrupt request (that is, clearing the OCFi bit) is done by:
1.
Reading the SR register while the OCFi bit is set
2.
An access (read or write) to the OCiLR register
The following procedure is recommended to prevent the OCFi bit from being set between
the time it is read and the write to the OCiR register:
Note:
13.3.5
●
Write to the OCiHR register (further compares are inhibited).
●
Read the SR register (first step of the clearance of the OCFi bit, which may be already
set).
●
Write to the OCiLR register (enables the output compare function and clears the OCFi
bit).
1
After a processor write cycle to the OCiHR register, the output compare function is inhibited
until the OCiLR register is also written.
2
If the OCiE bit is not set, the OCMPi pin is a general I/O port and the OLVLi bit will not
appear when a match is found but an interrupt could be generated if the OCIE bit is set.
3
In both internal and external clock modes, OCFi and OCMPi are set while the counter value
equals the OCiR register value (see Figure 49 on page 112 for an example with fCPU/2 and
Figure 50 on page 112 for an example with fCPU/4). This behavior is the same in OPM or
PWM mode.
4
The output compare functions can be used both for generating external events on the
OCMPi pins even if the input capture mode is also used.
5
The value in the 16-bit OCiR register and the OLVi bit should be changed after each
successful comparison in order to control an output waveform or establish a new elapsed
timeout.
Forced compare output capability
When the FOLVi bit is set by software, the OLVLi bit is copied to the OCMPi pin. The OLVi bit
has to be toggled in order to toggle the OCMPi pin when it is enabled (OCiE bit = 1). The
OCFi bit is then not set by hardware, and thus no interrupt request is generated.
The FOLVLi bits have no effect in both one pulse mode and PWM mode.
111/247
16-bit timer
ST72321Bxxx-Auto
Figure 48. Output compare block diagram
16-BIT FREE RUNNING
COUNTER
OC1E OC2E
CC1
CC0
(Control Register 2) CR2
16-bit
(Control Register 1) CR1
OUTPUT COMPARE
CIRCUIT
16-bit
OCIE
FOLV2 FOLV1 OLVL2
OLVL1
16-bit
Latch
1
Latch
2
OC1R Register
OCF1
OC2R Register
OCF2
0
0
0
(Status Register) SR
Figure 49. Output compare timing diagram, fTIMER = fCPU/2
INTERNAL CPU CLOCK
TIMER CLOCK
COUNTER REGISTER
2ECF 2ED0
OUTPUT COMPARE REGISTER i (OCRi)
2ED1 2ED2 2ED3 2ED4
2ED3
OUTPUT COMPARE FLAG i (OCFi)
OCMPi PIN (OLVLi = 1)
Figure 50. Output compare timing diagram, fTIMER = fCPU/4
INTERNAL CPU CLOCK
TIMER CLOCK
COUNTER REGISTER
OUTPUT COMPARE REGISTER i (OCRi)
OUTPUT COMPARE FLAG i (OCFi)
OCMPi PIN (OLVLi = 1)
112/247
2ECF 2ED0
2ED1 2ED2 2ED3 2ED4
2ED3
OCMP1
pin
OCMP2
pin
ST72321Bxxx-Auto
13.3.6
16-bit timer
One Pulse mode
One Pulse mode enables the generation of a pulse when an external event occurs. This
mode is selected via the OPM bit in the CR2 register.
The one pulse mode uses the Input Capture1 function and the Output Compare1 function.
Procedure
To use one pulse mode:
1.
Load the OC1R register with the value corresponding to the length of the pulse (using
the appropriate formula below according to the timer clock source used).
2.
Select the following in the CR1 register:
3.
–
Using the OLVL1 bit, select the level to be applied to the OCMP1 pin after the
pulse.
–
Using the OLVL2 bit, select the level to be applied to the OCMP1 pin during the
pulse.
–
Select the edge of the active transition on the ICAP1 pin with the IEDG1 bit (the
ICAP1 pin must be configured as floating input).
Select the following in the CR2 register:
–
Set the OC1E bit, the OCMP1 pin is then dedicated to the Output Compare 1
function.
–
Set the OPM bit.
–
Select the timer clock CC[1:0] (see Table 60: Timer clock selection).
Then, on a valid event on the ICAP1 pin, the counter is initialized to FFFCh and OLVL2 bit is
loaded on the OCMP1 pin, the ICF1 bit is set and the value FFFDh is loaded in the IC1R
register.
Figure 51. One pulse mode cycle flowchart
When event occurs
on ICAP1
ICR1 = Counter
OCMP1 = OLVL2
Counter is reset
to FFFCh
ICF1 bit is set
When counter = OC1R
OCMP1 = OLVL1
Because the ICF1 bit is set when an active edge occurs, an interrupt can be generated if the
ICIE bit is set.
Clearing the input capture interrupt request (that is, clearing the ICFi bit) is done in two
steps:
1.
Reading the SR register while the ICFi bit is set
2.
An access (read or write) to the ICiLR register
113/247
16-bit timer
ST72321Bxxx-Auto
The OC1R register value required for a specific timing application can be calculated using
the following formula:
t * fCPU - 5
OCiR value =
PRESC
Where:
t
= Pulse period (in seconds)
fCPU
= CPU clock frequency (in hertz)
PRESC = Timer prescaler factor (2, 4 or 8 depending on the CC[1:0] bits; see Table 60:
Timer clock selection)
If the timer clock is an external clock the formula is:
OCiR = t * fEXT - 5
Where:
t
= Pulse period (in seconds)
fEXT
= External clock frequency (in hertz)
When the value of the counter is equal to the value of the contents of the OC1R register, the
OLVL1 bit is output on the OCMP1 pin (see Figure 52).
Note:
1
The OCF1 bit cannot be set by hardware in one pulse mode but the OCF2 bit can generate
an Output Compare interrupt.
2
When the Pulse Width Modulation (PWM) and One Pulse Mode (OPM) bits are both set, the
PWM mode is the only active one.
3
If OLVL1 = OLVL2 a continuous signal will be seen on the OCMP1 pin.
4
The ICAP1 pin cannot be used to perform input capture. The ICAP2 pin can be used to
perform input capture (ICF2 can be set and IC2R can be loaded) but the user must take
care that the counter is reset each time a valid edge occurs on the ICAP1 pin and ICF1 can
also generates interrupt if ICIE is set.
5
When one pulse mode is used OC1R is dedicated to this mode. Nevertheless OC2R and
OCF2 can be used to indicate a period of time has been elapsed but cannot generate an
output waveform because the level OLVL2 is dedicated to the one pulse mode.
Figure 52. One pulse mode timing example
COUNTER
2ED3
01F8
IC1R
01F8
FFFC FFFD
FFFE
2ED0
2ED1 2ED2
FFFC
FFFD
2ED3
ICAP1
OCMP1
OLVL2
OLVL1
compare1
Note: IEDG1 = 1, OC1R = 2ED0h, OLVL1 = 0, OLVL2 = 1
114/247
OLVL2
ST72321Bxxx-Auto
16-bit timer
Figure 53. Pulse width modulation mode timing example with 2 output compare
functions
2ED0 2ED1 2ED2
COUNTER 34E2 FFFC FFFD FFFE
OLVL2
OCMP1
compare2
OLVL1
compare1
34E2
FFFC
OLVL2
compare2
Note: OC1R = 2ED0h, OC2R = 34E2, OLVL1 = 0, OLVL2 = 1
Note:
On timers with only one Output Compare register, a fixed frequency PWM signal can be
generated using the output compare and the counter overflow to define the pulse length.
13.3.7
Pulse width modulation mode
Pulse Width Modulation (PWM) mode enables the generation of a signal with a frequency
and pulse length determined by the value of the OC1R and OC2R registers.
Pulse Width Modulation mode uses the complete Output Compare 1 function plus the
OC2R register, and so this functionality cannot be used when PWM mode is activated.
In PWM mode, double buffering is implemented on the output compare registers. Any new
values written in the OC1R and OC2R registers are taken into account only at the end of the
PWM period (OC2) to avoid spikes on the PWM output pin (OCMP1).
Procedure
To use pulse width modulation mode:
1.
Load the OC2R register with the value corresponding to the period of the signal using
the appropriate formula below according to the timer clock source used.
2.
Load the OC1R register with the value corresponding to the period of the pulse if
OLVL1 = 0 and OLVL2 = 1 using the appropriate formula below according to the timer
clock source used.
3.
Select the following in the CR1 register:
4.
–
Using the OLVL1 bit, select the level to be applied to the OCMP1 pin after a
successful comparison with the OC1R register.
–
Using the OLVL2 bit, select the level to be applied to the OCMP1 pin after a
successful comparison with the OC2R register.
Select the following in the CR2 register:
–
Set OC1E bit: the OCMP1 pin is then dedicated to the output compare 1 function.
–
Set the PWM bit.
–
Select the timer clock (CC[1:0]) (see Table 60: Timer clock selection).
115/247
16-bit timer
ST72321Bxxx-Auto
Figure 54. Pulse width modulation cycle flowchart
When
Counter
= OC1R
OCMP1 = OLVL1
When
Counter
= OC2R
OCMP1 = OLVL2
Counter is reset
to FFFCh
ICF1 bit is set
If OLVL1 = 1 and OLVL2 = 0 the length of the positive pulse is the difference between the
OC2R and OC1R registers.
If OLVL1 = OLVL2 a continuous signal will be seen on the OCMP1 pin.
The OCiR register value required for a specific timing application can be calculated using
the following formula:
t f
OCiR value = * CPU - 5
PRESC
Where:
t
= Signal or pulse period (in seconds)
fCPU
= CPU clock frequency (in hertz)
PRESC = Timer prescaler factor (2, 4 or 8 depending on CC[1:0] bits; see Table 60:
Timer clock selection)
If the timer clock is an external clock the formula is:
OCiR = t * fEXT -5
Where:
t
= Signal or pulse period (in seconds)
fEXT
= External timer clock frequency (in hertz)
The Output Compare 2 event causes the counter to be initialized to FFFCh (see Figure 53).
Note:
116/247
1
After a write instruction to the OCiHR register, the output compare function is inhibited until
the OCiLR register is also written.
2
The OCF1 and OCF2 bits cannot be set by hardware in PWM mode therefore the Output
Compare interrupt is inhibited.
3
The ICF1 bit is set by hardware when the counter reaches the OC2R value and can produce
a timer interrupt if the ICIE bit is set and the I bit is cleared.
4
In PWM mode the ICAP1 pin cannot be used to perform input capture because it is
disconnected to the timer. The ICAP2 pin can be used to perform input capture (ICF2 can be
set and IC2R can be loaded) but the user must take care that the counter is reset each
period and ICF1 can also generates interrupt if ICIE is set.
5
When the Pulse Width Modulation (PWM) and One Pulse Mode (OPM) bits are both set, the
PWM mode is the only active one.
ST72321Bxxx-Auto
13.4
16-bit timer
Low power modes
Table 55.
Effect of low power modes on 16-bit timer
Mode
13.5
Effect
Wait
No effect on 16-bit timer.
Timer interrupts cause the device to exit from Wait mode.
Halt
16-bit timer registers are frozen.
In Halt mode, the counter stops counting until Halt mode is exited. Counting resumes from
the previous count when the MCU is woken up by an interrupt with “exit from Halt mode”
capability or from the counter reset value when the MCU is woken up by a RESET.
If an input capture event occurs on the ICAPi pin, the input capture detection circuitry is
armed. Consequently, when the MCU is woken up by an interrupt with “exit from Halt
mode” capability, the ICFi bit is set, and the counter value present when exiting from Halt
mode is captured into the ICiR register.
Interrupts
Table 56.
16-bit timer interrupt control/wake-up capability
Event
flag
Interrupt event
Input Capture 1 event/Counter reset in PWM mode
ICF1
Input Capture 2 event
ICF2
Output Compare 1 event (not available in PWM mode)
OCF1
Enable
control
bit
Exit
from
Wait
Exit
from
Halt
Yes
No
ICIE
OCIE
Output Compare 2 event (not available in PWM mode)
Timer Overflow event
OCF2
TOF
TOIE
Note:
The 16-bit timer interrupt events are connected to the same interrupt vector (see Chapter 7:
Interrupts on page 55). These events generate an interrupt if the corresponding Enable
Control Bit is set and the interrupt mask in the CC register is reset (RIM instruction).
13.6
Summary of timer modes
Table 57.
Timer modes
Timer resources
Modes
Input
Capture 1
Input
Capture 2
Output
Compare 1
Output
Compare 2
Yes
Yes
Yes
Yes
Input Capture
(1 and/or 2)
Output Compare
(1 and/or 2)
117/247
16-bit timer
ST72321Bxxx-Auto
Table 57.
Timer modes
Timer resources
Modes
Input
Capture 1
Input
Capture 2
Output
Compare 1
Output
Compare 2
Not
recommended(1)
One Pulse mode
No
Partially(2)
No
Not
recommended(3)
PWM mode
No
1. See Note 4 in Section 13.3.6 One Pulse mode
2. See Note 5 in Section 13.3.6 One Pulse mode
3. See Note 4 in Section 13.3.7 Pulse width modulation mode
13.7
16-bit timer registers
Each timer is associated with 3 control and status registers, and with 6 pairs of data
registers (16-bit values) relating to the 2 input captures, the 2 output compares, the counter
and the alternate counter.
13.7.1
Control register 1 (CR1)
CR1
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
ICIE
OCIE
TOIE
FOLV2
FOLV1
OLVL2
IEDG1
OLVL1
RW
RW
RW
RW
RW
RW
RW
RW
Table 58.
Bit
Name
Function
ICIE
Input Capture Interrupt Enable
0: Interrupt is inhibited
1: A timer interrupt is generated whenever the ICF1 or ICF2 bit of the SR register is
set.
6
OCIE
Output Compare Interrupt Enable
0: Interrupt is inhibited
1: A timer interrupt is generated whenever the OCF1 or OCF2 bit of the SR register
is set.
5
TOIE
Timer Overflow Interrupt Enable
0: Interrupt is inhibited
1: A timer interrupt is enabled whenever the TOF bit of the SR register is set.
7
4
118/247
CR1 register description
Forced Output Compare 2
This bit is set and cleared by software.
FOLV2
0: No effect on the OCMP2 pin
1: Forces the OLVL2 bit to be copied to the OCMP2 pin, if the OC2E bit is set and
even if there is no successful comparison
ST72321Bxxx-Auto
Table 58.
Bit
13.7.2
16-bit timer
CR1 register description (continued)
Name
Function
3
Forced Output Compare 1
This bit is set and cleared by software.
FOLV1
0: No effect on the OCMP1 pin
1: Forces OLVL1 to be copied to the OCMP1 pin, if the OC1E bit is set and even if
there is no successful comparison
2
Output Level 2
This bit is copied to the OCMP2 pin whenever a successful comparison occurs with
OLVL2
the OC2R register and OCxE is set in the CR2 register. This value is copied to the
OCMP1 pin in One Pulse Mode and Pulse Width Modulation mode.
1
Input Edge 1
This bit determines which type of level transition on the ICAP1 pin will trigger the
IEDG1
capture.
0: A falling edge triggers the capture.
1: A rising edge triggers the capture.
0
OLVL1
Output Level 1
The OLVL1 bit is copied to the OCMP1 pin whenever a successful comparison
occurs with the OC1R register and the OC1E bit is set in the CR2 register.
Control register 2 (CR2)
CR2
Reset value: 0000 0000 (00h)
7
6
5
4
OC1E
OC2E
OPM
PWM
RW
RW
RW
RW
Table 59.
Bit
7
6
3
2
1
0
CC[1:0]
IEDG2
EXEDG
RW
RW
RW
CR2 register description
Name
Function
OC1E
Output Compare 1 Pin Enable
This bit is used only to output the signal from the timer on the OCMP1 pin (OLV1 in
Output Compare mode, both OLV1 and OLV2 in PWM and one-pulse mode).
Whatever the value of the OC1E bit, the Output Compare 1 function of the timer
remains active.
0: OCMP1 pin alternate function disabled (I/O pin free for general-purpose I/O)
1: OCMP1 pin alternate function enabled
OC2E
Output Compare 2 Pin Enable
This bit is used only to output the signal from the timer on the OCMP2 pin (OLV2 in
Output Compare mode). Whatever the value of the OC2E bit, the Output Compare
2 function of the timer remains active.
0: OCMP2 pin alternate function disabled (I/O pin free for general-purpose I/O)
1: OCMP2 pin alternate function enabled
119/247
16-bit timer
ST72321Bxxx-Auto
Table 59.
Bit
5
4
CR2 register description (continued)
Name
Function
OPM
One Pulse Mode
0: One Pulse Mode is not active.
1: One Pulse Mode is active, the ICAP1 pin can be used to trigger one pulse on the
OCMP1 pin; the active transition is given by the IEDG1 bit. The length of the
generated pulse depends on the contents of the OC1R register.
PWM
Pulse Width Modulation
0: PWM mode is not active.
1: PWM mode is active, the OCMP1 pin outputs a programmable cyclic signal; the
length of the pulse depends on the value of OC1R register; the period depends on
the value of OC2R register.
3:2 CC[1:0]
Clock Control
The timer clock mode depends on these bits (see Table 60).
1
Input Edge 2
This bit determines which type of level transition on the ICAP2 pin will trigger the
IEDG2
capture.
0: A falling edge triggers the capture.
1: A rising edge triggers the capture.
0
External Clock Edge
This bit determines which type of level transition on the external clock pin EXTCLK
EXEDG
will trigger the counter register.
0: A falling edge triggers the counter register.
1: A rising edge triggers the counter register.
Table 60.
Timer clock selection
Timer clock
CC1
CC0
fCPU / 4
0
0
fCPU / 2
0
1
fCPU / 8
1
0
External clock (where available)(1)
1
1
1. If the external clock pin is not available, programming the external clock configuration stops the counter.
13.7.3
Control/status register (CSR)
CSR
120/247
Reset value: xxxx x0xx (xxh)
7
6
5
4
3
2
1
0
ICF1
OCF1
TOF
ICF2
OCF2
TIMD
Reserved
RO
RO
RO
RO
RO
RW
-
ST72321Bxxx-Auto
16-bit timer
Table 61.
Bit
Name
Function
ICF1
Input Capture Flag 1
0: No input capture (reset value)
1: An input capture has occurred on the ICAP1 pin or the counter has reached the
OC2R value in PWM mode. To clear this bit, first read the SR register, then read
or write the low byte of the IC1R (IC1LR) register.
OCF1
Output Compare Flag 1
0: No match (reset value)
1: The content of the free running counter has matched the content of the OC1R
register. To clear this bit, first read the SR register, then read or write the low byte
of the OC1R (OC1LR) register.
TOF
Timer Overflow Flag
0: No timer overflow (reset value)
1: The free running counter rolled over from FFFFh to 0000h. To clear this bit, first
read the SR register, then read or write the low byte of the CR (CLR) register.
Note: Reading or writing the ACLR register does not clear TOF.
ICF2
Input Capture Flag 2
0: No input capture (reset value).
1: An input capture has occurred on the ICAP2 pin. To clear this bit, first read the
SR register, then read or write the low byte of the IC2R (IC2LR) register.
OCF2
Output Compare Flag 2
0: No match (reset value)
1: The content of the free running counter has matched the content of the OC2R
register. To clear this bit, first read the SR register, then read or write the low byte
of the OC2R (OC2LR) register.
2
TIMD
Timer disable
This bit is set and cleared by software. When set, it freezes the timer prescaler
and counter and disabled the output functions (OCMP1 and OCMP2 pins) to
reduce power consumption. Access to the timer registers is still available, allowing
the timer configuration to be changed, or the counter reset, while it is disabled.
0: Timer enabled
1: Timer prescaler, counter and outputs disabled
1:0
-
7
6
5
4
3
13.7.4
CSR register description
Reserved, must be kept cleared
Input capture 1 high register (IC1HR)
This is an 8-bit read only register that contains the high part of the counter value (transferred
by the input capture 1 event).
IC1HR
7
Reset value: Undefined
6
5
4
3
2
1
MSB
RO
0
LSB
RO
RO
RO
RO
RO
RO
RO
121/247
16-bit timer
13.7.5
ST72321Bxxx-Auto
Input capture 1 low register (IC1LR)
This is an 8-bit read only register that contains the low part of the counter value (transferred
by the input capture 1 event).
IC1LR
7
Reset value: Undefined
6
5
4
3
2
1
MSB
RO
13.7.6
0
LSB
RO
RO
RO
RO
RO
RO
RO
Output compare 1 high register (OC1HR)
This is an 8-bit register that contains the high part of the value to be compared to the CHR
register.
OC1HR
7
Reset value: 1000 0000 (80h)
6
5
4
3
2
1
MSB
RW
13.7.7
0
LSB
RW
RW
RW
RW
RW
RW
RW
Output compare 1 low register (OC1LR)
This is an 8-bit register that contains the low part of the value to be compared to the CLR
register.
OC1LR
7
Reset value: 0000 0000 (00h)
6
5
4
3
2
1
MSB
RW
13.7.8
0
LSB
RW
RW
RW
RW
RW
RW
RW
Output compare 2 high register (OC2HR)
This is an 8-bit register that contains the high part of the value to be compared to the CHR
register.
OC2HR
7
Reset value: 1000 0000 (80h)
6
5
4
3
2
1
MSB
RW
122/247
0
LSB
RW
RW
RW
RW
RW
RW
RW
ST72321Bxxx-Auto
13.7.9
16-bit timer
Output compare 2 low register (OC2LR)
This is an 8-bit register that contains the low part of the value to be compared to the CLR
register.
OC2LR
7
Reset value: 0000 0000 (00h)
6
5
4
3
2
1
MSB
RW
13.7.10
0
LSB
RW
RW
RW
RW
RW
RW
RW
Counter high register (CHR)
This is an 8-bit register that contains the high part of the counter value.
CHR
Reset value: 1111 1111 (FFh)
7
6
5
4
3
2
1
MSB
RO
13.7.11
0
LSB
RO
RO
RO
RO
RO
RO
RO
Counter low register (CLR)
This is an 8-bit register that contains the low part of the counter value. A write to this register
resets the counter. An access to this register after accessing the CSR register clears the
TOF bit.
CLR
Reset value: 1111 1100 (FCh)
7
6
5
4
3
2
1
MSB
RO
13.7.12
0
LSB
RO
RO
RO
RO
RO
RO
RO
Alternate counter high register (ACHR)
This is an 8-bit register that contains the high part of the counter value.
ACHR
7
Reset value: 1111 1111 (FFh)
6
5
4
3
2
1
MSB
RO
0
LSB
RO
RO
RO
RO
RO
RO
RO
123/247
16-bit timer
13.7.13
ST72321Bxxx-Auto
Alternate counter low register (ACLR)
This is an 8-bit register that contains the low part of the counter value. A write to this register
resets the counter. An access to this register after an access to CSR register does not clear
the TOF bit in the CSR register.
ACLR
7
Reset value: 1111 1100 (FCh)
6
5
4
3
2
1
MSB
RO
13.7.14
0
LSB
RO
RO
RO
RO
RO
RO
RO
Input capture 2 high register (IC2HR)
This is an 8-bit read only register that contains the high part of the counter value (transferred
by the Input Capture 2 event).
IC2HR
7
Reset value: Undefined
6
5
4
3
2
1
MSB
RO
13.7.15
0
LSB
RO
RO
RO
RO
RO
RO
RO
Input capture 2 low register (IC2LR)
This is an 8-bit read only register that contains the low part of the counter value (transferred
by the Input Capture 2 event).
IC2LR
7
Reset value: Undefined
6
5
4
3
2
1
MSB
RO
124/247
0
LSB
RO
RO
RO
RO
RO
RO
RO
ST72321Bxxx-Auto
Table 62.
Address
(Hex.)
16-bit timer
16-bit timer register map and reset values
Register
label
7
6
5
4
3
2
1
0
Timer A: 32 CR1
Timer B: 42 Reset value
ICIE
0
OCIE
0
TOIE
0
FOLV2
0
FOLV1
0
Timer A: 31 CR2
Timer B: 41 Reset value
OC1E
0
OC2E
0
OPM
0
PWM
0
CC1
0
CC0
0
Timer A: 33 CSR
Timer B: 43 Reset value
ICF1
x
OCF1
x
TOF
x
ICF2
x
OCF2
x
TIMD
0
x
x
Timer A: 34 IC1HR
Timer B: 44 Reset value
MSB
x
x
x
x
x
x
x
LSB
x
Timer A: 35 IC1LR
Timer B: 45 Reset value
MSB
x
x
x
x
x
x
x
LSB
x
Timer A: 36 OC1HR
Timer B: 46 Reset value
MSB
1
0
0
0
0
0
0
LSB
0
Timer A: 37 OC1LR
Timer B: 47 Reset value
MSB
0
0
0
0
0
0
0
LSB
0
Timer A: 3E OC2HR
Timer B: 4E Reset value
MSB
1
0
0
0
0
0
0
LSB
0
Timer A: 3F OC2LR
Timer B: 4F Reset value
MSB
0
0
0
0
0
0
0
LSB
0
Timer A: 38 CHR
Timer B: 48 Reset value
MSB
1
1
1
1
1
1
1
LSB
1
Timer A: 39 CLR
Timer B: 49 Reset value
MSB
1
1
1
1
1
1
0
LSB
0
Timer A: 3A ACHR
Timer B: 4A Reset value
MSB
1
1
1
1
1
1
1
LSB
1
Timer A: 3B ACLR
Timer B: 4B Reset value
MSB
1
1
1
1
1
1
0
LSB
0
Timer A: 3C IC2HR
Timer B: 4C Reset value
MSB
x
x
x
x
x
x
x
LSB
x
Timer A: 3D IC2LR
Timer B: 4D Reset value
MSB
x
x
x
x
x
x
x
LSB
x
OLVL2 IEDG1 OLVL1
0
0
0
IEDG2 EXEDG
0
0
Related documentation
SCI software communications using 16-bit timer (AN 973)
Real-time Clock with ST7 Timer Output Compare (AN 974)
Driving a buzzer through the ST7 Timer PWM function (AN 976)
Using ST7 PWM signal to generate analog input (sinusoid) (AN1041)
UART emulation software (AN1046)
PWM duty cycle switch implementing true 0 or 100 per cent duty cycle (AN1078)
Starting a PWM signal directly at high level using the ST7 16-bit timer (AN1504)
125/247
Serial peripheral interface (SPI)
14
Serial peripheral interface (SPI)
14.1
Introduction
ST72321Bxxx-Auto
The Serial Peripheral Interface (SPI) allows full-duplex, synchronous, serial communication
with external devices. An SPI system may consist of a master and one or more slaves
however the SPI interface cannot be a master in a multimaster system.
14.2
Main features
●
Full duplex synchronous transfers (on 3 lines)
●
Simplex synchronous transfers (on 2 lines)
●
Master or slave operation
●
6 master mode frequencies (fCPU/4 max.)
●
fCPU/2 max. slave mode frequency (see note)
●
SS Management by software or hardware
●
Programmable clock polarity and phase
●
End of transfer interrupt flag
●
Write collision, Master Mode Fault and Overrun flags
Note:
In slave mode, continuous transmission is not possible at maximum frequency due to the
software overhead for clearing status flags and to initiate the next transmission sequence.
14.3
General description
Figure 55 shows the serial peripheral interface (SPI) block diagram. There are three
registers:
●
SPI Control Register (SPICR)
●
SPI Control/Status Register (SPICSR)
●
SPI Data Register (SPIDR)
The SPI is connected to external devices through four pins:
126/247
●
MISO (Master In / Slave Out data)
●
MOSI (Master Out / Slave In data)
●
SCK (Serial Clock out by SPI masters and input by SPI slaves)
●
SS (Slave select): This input signal acts as a ‘chip select’ to let the SPI master
communicate with slaves individually and to avoid contention on the data lines. Slave
SS inputs can be driven by standard I/O ports on the master MCU.
ST72321Bxxx-Auto
Serial peripheral interface (SPI)
Figure 55. Serial peripheral interface block diagram
Data/Address Bus
SPIDR
Read
Interrupt
request
Read Buffer
MOSI
MISO
8-bit Shift Register
SPICSR 0
7
SPIF WCOL OVR MODF
SOD
bit
0
SOD
SSM
SSI
Write
SS
SPI
STATE
CONTROL
SCK
0
SPICR
7
SPIE
1
SPE
0
SPR2 MSTR CPOL CPHA SPR1 SPR0
MASTER
CONTROL
SERIAL CLOCK
GENERATOR
SS
14.3.1
Functional description
A basic example of interconnections between a single master and a single slave is
illustrated in Figure 56.
The MOSI pins are connected together and the MISO pins are connected together. In this
way data is transferred serially between master and slave (most significant bit first).
The communication is always initiated by the master. When the master device transmits
data to a slave device via MOSI pin, the slave device responds by sending data to the
master device via the MISO pin. This implies full duplex communication with both data out
and data in synchronized with the same clock signal (which is provided by the master device
via the SCK pin).
To use a single data line, the MISO and MOSI pins must be connected at each node (in this
case only simplex communication is possible).
Four possible data/clock timing relationships may be chosen (see Figure 59) but master and
slave must be programmed with the same timing mode.
127/247
Serial peripheral interface (SPI)
ST72321Bxxx-Auto
Figure 56. Single master/single slave application
SLAVE
MASTER
MSBit
LSBit
8-BIT SHIFT REGISTER
SPI
CLOCK
GENERATOR
MSBit
MISO
MISO
MOSI
MOSI
SCK
SCK
SS
+5V
LSBit
8-BIT SHIFT REGISTER
SS
Not used if SS is managed
by software
14.3.2
Slave select management
As an alternative to using the SS pin to control the Slave Select signal, the application can
choose to manage the Slave Select signal by software. This is configured by the SSM bit in
the SPICSR register (see Figure 58)
In software management, the external SS pin is free for other application uses and the
internal SS signal level is driven by writing to the SSI bit in the SPICSR register.
In Master mode
●
SS internal must be held high continuously
In Slave mode
There are two cases depending on the data/clock timing relationship (see Figure 57):
If CPHA = 1 (data latched on 2nd clock edge):
●
SS internal must be held low during the entire transmission. This implies that in single
slave applications the SS pin either can be tied to VSS, or made free for standard I/O by
managing the SS function by software (SSM = 1 and SSI = 0 in the in the SPICSR
register)
If CPHA = 0 (data latched on 1st clock edge):
●
128/247
SS internal must be held low during byte transmission and pulled high between each
byte to allow the slave to write to the shift register. If SS is not pulled high, a Write
Collision error will occur when the slave writes to the shift register (see Write collision
error (WCOL) on page 133).
ST72321Bxxx-Auto
Serial peripheral interface (SPI)
Figure 57. Generic SS timing diagram
MOSI/MISO
Byte 1
Byte 2
Byte 3
Master SS
Slave SS
(if CPHA=0)
Slave SS
(if CPHA=1)
Figure 58. Hardware/Software slave select management
SSM bit
SSI bit
SS external pin
14.3.3
1
SS internal
0
Master mode operation
In master mode, the serial clock is output on the SCK pin. The clock frequency, polarity and
phase are configured by software (refer to the description of the SPICSR register).
Note:
The idle state of SCK must correspond to the polarity selected in the SPICSR register (by
pulling up SCK if CPOL = 1 or pulling down SCK if CPOL = 0).
How to operate the SPI in master mode
To operate the SPI in master mode, perform the following steps in order:
1.
Note:
Write to the SPICR register:
a)
Select the clock frequency by configuring the SPR[2:0] bits.
b)
Select the clock polarity and clock phase by configuring the CPOL and CPHA bits.
Figure 59 shows the four possible configurations.
The slave must have the same CPOL and CPHA settings as the master.
2.
Write to the SPICSR register:
Either set the SSM bit and set the SSI bit or clear the SSM bit and tie the SS pin high
for the complete byte transmit sequence.
3.
Write to the SPICR register:
Set the MSTR and SPE bits
Note:
MSTR and SPE bits remain set only if SS is high).
IMPORTANT: If the SPICSR register is not written first, the SPICR register setting (MSTR
bit) may not be taken into account.
The transmit sequence begins when software writes a byte in the SPIDR register.
129/247
Serial peripheral interface (SPI)
14.3.4
ST72321Bxxx-Auto
Master mode transmit sequence
When software writes to the SPIDR register, the data byte is loaded into the 8-bit shift
register and then shifted out serially to the MOSI pin most significant bit first.
When data transfer is complete:
–
The SPIF bit is set by hardware
–
An interrupt request is generated if the SPIE bit is set and the interrupt mask in the
CCR register is cleared.
Clearing the SPIF bit is performed by the following software sequence:
1.
An access to the SPICSR register while the SPIF bit is set
2.
A read to the SPIDR register.
Note:
While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR
register is read.
14.3.5
Slave mode operation
In slave mode, the serial clock is received on the SCK pin from the master device.
To operate the SPI in slave mode:
1.
Write to the SPICSR register to perform the following actions:
a)
Note:
The slave must have the same CPOL and CPHA settings as the master.
b)
2.
14.3.6
Select the clock polarity and clock phase by configuring the CPOL and CPHA bits
(see Figure 59).
Manage the SS pin as described in Slave select management on page 128 and
Figure 57. If CPHA = 1, SS must be held low continuously. If CPHA = 0, SS must
be held low during byte transmission and pulled up between each byte to let the
slave write in the shift register.
Write to the SPICR register to clear the MSTR bit and set the SPE bit to enable the SPI
I/O functions.
Slave mode transmit sequence
When software writes to the SPIDR register, the data byte is loaded into the 8-bit shift
register and then shifted out serially to the MISO pin most significant bit first.
The transmit sequence begins when the slave device receives the clock signal and the most
significant bit of the data on its MOSI pin.
When data transfer is complete:
–
The SPIF bit is set by hardware.
–
An interrupt request is generated if SPIE bit is set and interrupt mask in the CCR
register is cleared.
Clearing the SPIF bit is performed by the following software sequence:
Note:
130/247
1.
An access to the SPICSR register while the SPIF bit is set
2.
A write or a read to the SPIDR register
While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR
register is read.
ST72321Bxxx-Auto
Serial peripheral interface (SPI)
The SPIF bit can be cleared during a second transmission; however, it must be cleared
before the second SPIF bit in order to prevent an Overrun condition (see Overrun condition
(OVR) on page 133).
14.4
Clock phase and clock polarity
Four possible timing relationships may be chosen by software, using the CPOL and CPHA
bits (see Figure 59).
Note:
The idle state of SCK must correspond to the polarity selected in the SPICSR register (by
pulling up SCK if CPOL = 1 or pulling down SCK if CPOL = 0).
The combination of the CPOL clock polarity and CPHA (clock phase) bits selects the data
capture clock edge
Figure 59 shows an SPI transfer with the four combinations of the CPHA and CPOL bits.
The diagram may be interpreted as a master or slave timing diagram where the SCK pin, the
MISO pin, the MOSI pin are directly connected between the master and the slave device.
Note:
If CPOL is changed at the communication byte boundaries, the SPI must be disabled by
resetting the SPE bit.
131/247
Serial peripheral interface (SPI)
ST72321Bxxx-Auto
Figure 59. Data clock timing diagram
CPHA = 1
SCK
(CPOL = 1)
SCK
(CPOL = 0)
MISO
(from master)
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
MOSI
(from slave)
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
SS
(to slave)
CAPTURE STROBE
CPHA = 0
SCK
(CPOL = 1)
SCK
(CPOL = 0)
MISO
(from master)
MOSI
(from slave)
MSBit
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
SS
(to slave)
CAPTURE STROBE
Note: This figure should not be used as a replacement for parametric information.
Refer to Chapter 19: Electrical characteristics.
132/247
ST72321Bxxx-Auto
14.5
Error flags
14.5.1
Master mode fault (MODF)
Serial peripheral interface (SPI)
Master mode fault occurs when the master device has its SS pin pulled low.
When a Master mode fault occurs:
●
The MODF bit is set and an SPI interrupt request is generated if the SPIE bit is set.
●
The SPE bit is reset. This blocks all output from the device and disables the SPI
peripheral.
●
The MSTR bit is reset, thus forcing the device into slave mode.
Clearing the MODF bit is done through a software sequence:
Note:
1.
A read access to the SPICSR register while the MODF bit is set.
2.
A write to the SPICR register.
To avoid any conflicts in an application with multiple slaves, the SS pin must be pulled high
during the MODF bit clearing sequence. The SPE and MSTR bits may be restored to their
original state during or after this clearing sequence.
Hardware does not allow the user to set the SPE and MSTR bits while the MODF bit is set
except in the MODF bit clearing sequence.
14.5.2
Overrun condition (OVR)
An overrun condition occurs, when the master device has sent a data byte and the slave
device has not cleared the SPIF bit issued from the previously transmitted byte.
When an Overrun occurs:
●
The OVR bit is set and an interrupt request is generated if the SPIE bit is set.
In this case, the receiver buffer contains the byte sent after the SPIF bit was last cleared. A
read to the SPIDR register returns this byte. All other bytes are lost.
The OVR bit is cleared by reading the SPICSR register.
14.5.3
Write collision error (WCOL)
A write collision occurs when the software tries to write to the SPIDR register while a data
transfer is taking place with an external device. When this happens, the transfer continues
uninterrupted; and the software write will be unsuccessful.
Write collisions can occur both in master and slave mode. See also Slave select
management on page 128.
Note:
A “read collision” will never occur since the received data byte is placed in a buffer in which
access is always synchronous with the MCU operation.
The WCOL bit in the SPICSR register is set if a write collision occurs.
No SPI interrupt is generated when the WCOL bit is set (the WCOL bit is a status flag only).
Clearing the WCOL bit is done through a software sequence (see Figure 60).
133/247
Serial peripheral interface (SPI)
ST72321Bxxx-Auto
Figure 60. Clearing the WCOL bit (Write Collision Flag) software sequence
Clearing sequence after SPIF = 1 (end of a data byte transfer)
1st Step
2nd Step
Read SPICSR
Read SPIDR
RESULT
SPIF = 0
WCOL = 0
Clearing sequence before SPIF = 1 (during a data byte transfer)
Read SPICSR
1st Step
RESULT
2nd Step
14.5.4
Read SPIDR
WCOL = 0
Note: Writing to the SPIDR register
instead of reading it does not reset the
WCOL bit.
Single master systems
A typical single master system may be configured, using an MCU as the master and four
MCUs as slaves (see Figure 61).
The master device selects the individual slave devices by using four pins of a parallel port to
control the four SS pins of the slave devices.
The SS pins are pulled high during reset since the master device ports will be forced to be
inputs at that time, thus disabling the slave devices.
Note:
To prevent a bus conflict on the MISO line the master allows only one active slave device
during a transmission.
For more security, the slave device may respond to the master with the received data byte.
Then the master will receive the previous byte back from the slave device if all MISO and
MOSI pins are connected and the slave has not written to its SPIDR register.
Other transmission security methods can use ports for handshake lines or data bytes with
command fields.
Figure 61. Single master / multiple slave configuration
SS
SCK
Slave
MCU
MOSI
MISO
5V
134/247
SS
Ports
MISO
SCK
Master
MCU
SCK
MOSI
MISO
MOSI
SS
SCK
Slave
MCU
Slave
MCU
Slave
MCU
MOSI
SS
SS
SCK
MISO
MOSI
MISO
ST72321Bxxx-Auto
14.6
Serial peripheral interface (SPI)
Low power modes
Table 63.
Effect of low power modes on SPI
Mode
14.6.1
Effect
Wait
No effect on SPI.
SPI interrupt events cause the device to exit from Wait mode.
Halt
SPI registers are frozen.
In Halt mode, the SPI is inactive. SPI operation resumes when the MCU is woken up by
an interrupt with “exit from Halt mode” capability. The data received is subsequently
read from the SPIDR register when the software is running (interrupt vector fetching). If
several data are received before the wake-up event, then an overrun error is generated.
This error can be detected after the fetch of the interrupt routine that woke up the
device.
Using the SPI to wake up the MCU from Halt mode
In slave configuration, the SPI is able to wake up the ST7 device from Halt mode through a
SPIF interrupt. The data received is subsequently read from the SPIDR register when the
software is running (interrupt vector fetch). If multiple data transfers have been performed
before software clears the SPIF bit, then the OVR bit is set by hardware.
Note:
When waking up from Halt mode, if the SPI remains in Slave mode, it is recommended to
perform an extra communications cycle to bring the SPI from Halt mode state to normal
state. If the SPI exits from Slave mode, it returns to normal state immediately.
Caution:
The SPI can wake up the ST7 from Halt mode only if the Slave Select signal (external SS
pin or the SSI bit in the SPICSR register) is low when the ST7 enters Halt mode. So if Slave
selection is configured as external (see Slave select management on page 128), make sure
the master drives a low level on the SS pin when the slave enters Halt mode.
14.7
Interrupts
Table 64.
SPI interrupt control/wake-up capability
Interrupt event
Event flag
SPI End of Transfer event
SPIF
Master Mode Fault event
MODF
Enable
control bit
Exit from
Wait
Exit from
Halt
Yes
SPIE
Yes
No
Overrun error
Note:
OVR
The SPI interrupt events are connected to the same interrupt vector (see Interrupts chapter).
They generate an interrupt if the corresponding Enable Control Bit is set and the interrupt
mask in the CC register is reset (RIM instruction).
135/247
Serial peripheral interface (SPI)
ST72321Bxxx-Auto
14.8
SPI registers
14.8.1
Control register (SPICR)
SPICR
Reset value: 0000 xxxx (0xh)
7
6
5
4
3
2
SPIE
SPE
SPR2
MSTR
CPOL
CPHA
SPR[1:0]
RW
RW
RW
RW
RW
RW
RW
Table 65.
Bit
7
6
5
4
3
2
136/247
1
0
SPICR register description
Name
Function
SPIE
Serial Peripheral Interrupt Enable
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SPI interrupt is generated whenever SPIF = 1, MODF = 1 or OVR = 1 in the
SPICSR register.
SPE
Serial Peripheral Output Enable
This bit is set and cleared by software. It is also cleared by hardware when, in
master mode, SS = 0 (see Master mode fault (MODF) on page 133). The SPE bit
is cleared by reset, so the SPI peripheral is not initially connected to the external
pins.
0: I/O pins free for general purpose I/O
1: SPI I/O pin alternate functions enabled
SPR2
Divider Enable
This bit is set and cleared by software and is cleared by reset. It is used with the
SPR[1:0] bits to set the baud rate. Refer to Table 66.
0: Divider by 2 enabled
1: Divider by 2 disabled
Note: This bit has no effect in slave mode.
MSTR
Master Mode
This bit is set and cleared by software. It is also cleared by hardware when, in
master mode, SS = 0 (see Master mode fault (MODF) on page 133).
0: Slave mode
1: Master mode. The function of the SCK pin changes from an input to an output
and the functions of the MISO and MOSI pins are reversed.
CPOL
Clock Polarity
This bit is set and cleared by software. This bit determines the idle state of the
serial Clock. The CPOL bit affects both the master and slave modes.
0: SCK pin has a low level idle state
1: SCK pin has a high level idle state
Note: If CPOL is changed at the communication byte boundaries, the SPI must be
disabled by resetting the SPE bit.
CPHA
Clock Phase
This bit is set and cleared by software.
0: The first clock transition is the first data capture edge.
1: The second clock transition is the first capture edge.
Note: The slave must have the same CPOL and CPHA settings as the master.
ST72321Bxxx-Auto
Table 65.
Bit
1:0
SPICR register description (continued)
Name
Function
Serial Clock Frequency
These bits are set and cleared by software. Used with the SPR2 bit, they select
SPR[1:0]
the baud rate of the SPI serial clock SCK output by the SPI in master mode.
Note: These 2 bits have no effect in slave mode.
Table 66.
14.8.2
Serial peripheral interface (SPI)
SPI master mode SCK frequency
Serial clock
SPR2
SPR1
SPR0
fCPU/4
1
0
0
fCPU/8
0
0
0
fCPU/16
0
0
1
fCPU/32
1
1
0
fCPU/64
0
1
0
fCPU/128
0
1
1
Control/status register (SPICSR)
SPICSR
7
6
5
4
3
2
1
0
SPIF
WCOL
OVR
MODF
Reserved
SOD
SSM
SSI
RO
RO
RO
RO
-
RW
RW
RW
Table 67.
Bit
7
6
5
Reset value: 0000 0000 (00h)
SPICSR register description
Name
Function
SPIF
Serial Peripheral Data Transfer Flag
This bit is set by hardware when a transfer has been completed. An interrupt is
generated if SPIE = 1 in the SPICR register. It is cleared by a software sequence (an
access to the SPICSR register followed by a write or a read to the SPIDR register).
0: Data transfer is in progress or the flag has been cleared
1: Data transfer between the device and an external device has been completed.
While the SPIF bit is set, all writes to the SPIDR register are inhibited until the
SPICSR register is read.
Write Collision status
This bit is set by hardware when a write to the SPIDR register is done during a
WCOL
transmit sequence. It is cleared by a software sequence (see Figure 60).
0: No write collision occurred.
1: A write collision has been detected.
OVR
SPI Overrun error
This bit is set by hardware when the byte currently being received in the shift register
is ready to be transferred into the SPIDR register while SPIF = 1 (see Overrun
condition (OVR) on page 133). An interrupt is generated if SPIE = 1 in SPICR
register. The OVR bit is cleared by software reading the SPICSR register.
0: No overrun error
1: Overrun error detected
137/247
Serial peripheral interface (SPI)
Table 67.
Bit
4
SPICSR register description (continued)
Name
Function
Mode Fault flag
This bit is set by hardware when the SS pin is pulled low in master mode (see
Master mode fault (MODF) on page 133). An SPI interrupt can be generated if
SPIE = 1 in the SPICSR register. This bit is cleared by a software sequence (An
MODF
access to the SPICR register while MODF = 1 followed by a write to the SPICR
register).
0: No master mode fault detected
1: A fault in master mode has been detected
3
-
2
1
Reserved, must be kept cleared
SOD
SPI Output Disable
This bit is set and cleared by software. When set, it disables the alternate function of
the SPI output (MOSI in master mode / MISO in slave mode).
0: SPI output enabled (if SPE = 1)
1: SPI output disabled
SSM
SS Management
This bit is set and cleared by software. When set, it disables the alternate function of
the SPI SS pin and uses the SSI bit value instead. See Slave select management on
page 128.
0: Hardware management (SS managed by external pin)
1: Software management (internal SS signal controlled by SSI bit. External SS pin
free for general-purpose I/O)
SSI
SS Internal Mode
This bit is set and cleared by software. It acts as a ‘chip select’ by controlling the
level of the SS slave select signal when the SSM bit is set.
0: Slave selected
1: Slave deselected
0
14.8.3
ST72321Bxxx-Auto
Data I/O register (SPIDR)
SPIDR
7
Reset value: Undefined
6
5
4
3
2
1
0
D[7:0]
RW
The SPIDR register is used to transmit and receive data on the serial bus. In a master
device, a write to this register will initiate transmission/reception of another byte.
Note:
During the last clock cycle the SPIF bit is set, a copy of the received data byte in the shift
register is moved to a buffer. When the user reads the serial peripheral data I/O register, the
buffer is actually being read.
While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR
register is read.
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ST72321Bxxx-Auto
Serial peripheral interface (SPI)
Warning:
A write to the SPIDR register places data directly into the
shift register for transmission.
A read to the SPIDR register returns the value located in the buffer and not the content of
the shift register (see Figure 55).
Table 68.
SPI register map and reset values
Address
(Hex.)
Register
label
7
6
5
4
3
2
1
0
0021h
SPIDR
Reset value
MSB
x
x
x
x
x
x
x
LSB
x
0022h
SPICR
Reset value
SPIE
0
SPE
0
SPR2
0
MSTR
0
CPOL
x
CPHA
x
SPR1
x
SPR0
x
0023h
SPICSR
Reset value
SPIF
0
WCOL
0
OVR
0
MODF
0
0
SOD
0
SSM
0
SSI
0
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Serial communications interface (SCI)
15
Serial communications interface (SCI)
15.1
Introduction
ST72321Bxxx-Auto
The Serial Communications Interface (SCI) offers a flexible means of full-duplex data
exchange with external equipment requiring an industry standard NRZ asynchronous serial
data format. The SCI offers a very wide range of baud rates using two baud rate generator
systems.
15.2
Main features
●
Full duplex, asynchronous communications
●
NRZ standard format (Mark/Space)
●
Dual baud rate generator systems
●
Independently programmable transmit and receive baud rates up to 500K baud
●
Programmable data word length (8 or 9 bits)
●
Receive buffer full, Transmit buffer empty and End of Transmission flags
●
2 receiver wake-up modes:
Address bit (MSB)
–
Idle line
●
Muting function for multiprocessor configurations
●
Separate enable bits for Transmitter and Receiver
●
4 error detection flags:
●
●
●
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–
–
Overrun error
–
Noise error
–
Frame error
–
Parity error
5 interrupt sources with flags:
–
Transmit data register empty
–
Transmission complete
–
Receive data register full
–
Idle line received
–
Overrun error detected
Parity control:
–
Transmits parity bit
–
Checks parity of received data byte
Reduced power consumption mode
ST72321Bxxx-Auto
15.3
Serial communications interface (SCI)
General description
The interface is externally connected to another device by two pins (see Figure 63):
●
TDO: Transmit Data Output. When the transmitter and the receiver are disabled, the
output pin returns to its I/O port configuration. When the transmitter and/or the receiver
are enabled and nothing is to be transmitted, the TDO pin is at high level.
●
RDI: Receive Data Input is the serial data input. Oversampling techniques are used for
data recovery by discriminating between valid incoming data and noise.
Through these pins, serial data is transmitted and received as frames comprising:
●
An Idle Line prior to transmission or reception
●
A start bit
●
A data word (8 or 9 bits) least significant bit first
●
A Stop bit indicating that the frame is complete
This interface uses two types of baud rate generator:
●
A conventional type for commonly-used baud rates
●
An extended type with a prescaler offering a very wide range of baud rates even with
non-standard oscillator frequencies
141/247
Serial communications interface (SCI)
ST72321Bxxx-Auto
Figure 62. SCI block diagram
Write
Read
(DATA REGISTER) DR
Transmit Data Register (TDR)
Received Data Register (RDR)
Transmit Shift Register
Received Shift Register
TDO
RDI
CR1
R8
WAKE
UP
UNIT
TRANSMIT
CONTROL
T8
SCID
M
WAKE PCE
PS
PIE
RECEIVER
CLOCK
RECEIVER
CONTROL
CR2
SR
TIE TCIE RIE
ILIE
TE
RE RWU SBK
TDRE TC
RDRF IDLE OR
NF
FE
SCI
INTERRUPT
CONTROL
TRANSMITTER
CLOCK
TRANSMITTER RATE
CONTROL
fCPU
/16
/PR
BRR
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0
RECEIVER RATE
CONTROL
CONVENTIONAL BAUD RATE GENERATOR
142/247
PE
ST72321Bxxx-Auto
15.4
Serial communications interface (SCI)
Functional description
The block diagram of the Serial Control Interface, is shown in Figure 62. It contains six
dedicated registers:
●
2 control registers (SCICR1 and SCICR2)
●
a status register (SCISR)
●
a baud rate register (SCIBRR)
●
an extended prescaler receiver register (SCIERPR)
●
an extended prescaler transmitter register (SCIETPR)
Refer to the register descriptions in Section 15.7 for the definitions of each bit.
15.4.1
Serial data format
Word length may be selected as being either 8 or 9 bits by programming the M bit in the
SCICR1 register (see Figure 62).
The TDO pin is in low state during the start bit.
The TDO pin is in high state during the stop bit.
An Idle character is interpreted as an entire frame of ‘1’s followed by the start bit of the next
frame which contains data.
A Break character is interpreted on receiving ‘0’s for some multiple of the frame period. At
the end of the last break frame the transmitter inserts an extra ‘1’ bit to acknowledge the
start bit.
Transmission and reception are driven by their own baud rate generator.
Figure 63. Word length programming
9-bit Word length (M bit is set)
Possible
Parity
Bit
Data Frame
Start
Bit
Bit0
Bit2
Bit1
Bit3
Bit4
Bit5
Bit6
Start
Bit
Break Frame
Extra
‘1’
Bit1
Bit2
Bit3
Idle Frame
Break Frame
Bit4
Bit5
Bit6
Bit7
Start
Bit
Next Data Frame
Possible
Parity
Bit
Data Frame
Bit0
Next
Start
Bit
Stop
Bit
Idle Frame
8-bit Word length (M bit is reset)
Start
Bit
Bit7
Bit8
Next Data Frame
Stop
Bit
Next
Start
Bit
Start
Bit
Extra
‘1’
Start
Bit
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Serial communications interface (SCI)
15.4.2
ST72321Bxxx-Auto
Transmitter
The transmitter can send data words of either 8 or 9 bits depending on the M bit status.
When the M bit is set, word length is 9 bits and the 9th bit (the MSB) has to be stored in the
T8 bit in the SCICR1 register.
Character transmission
During an SCI transmission, data shifts out least significant bit first on the TDO pin. In this
mode, the SCIDR register consists of a buffer (TDR) between the internal bus and the
transmit shift register (see Figure 62).
Procedure
1.
Select the M bit to define the word length.
2.
Select the desired baud rate using the SCIBRR and the SCIETPR registers.
3.
Set the TE bit to assign the TDO pin to the alternate function and to send an idle frame
as first transmission.
4.
Access the SCISR register and write the data to send in the SCIDR register (this
sequence clears the TDRE bit). Repeat this sequence for each data to be transmitted.
Clearing the TDRE bit is always performed by the following software sequence:
1.
An access to the SCISR register
2.
A write to the SCIDR register
The TDRE bit is set by hardware and it indicates:
●
The TDR register is empty.
●
The data transfer is beginning.
●
The next data can be written in the SCIDR register without overwriting the previous
data.
This flag generates an interrupt if the TIE bit is set and the I bit is cleared in the CCR
register.
When a transmission is taking place, a write instruction to the SCIDR register stores the
data in the TDR register and which is copied in the shift register at the end of the current
transmission.
When no transmission is taking place, a write instruction to the SCIDR register places the
data directly in the shift register, the data transmission starts, and the TDRE bit is
immediately set.
When a frame transmission is complete (after the stop bit) the TC bit is set and an interrupt
is generated if the TCIE is set and the I bit is cleared in the CCR register.
Clearing the TC bit is performed by the following software sequence:
Note:
1.
An access to the SCISR register
2.
A write to the SCIDR register
The TDRE and TC bits are cleared by the same software sequence.
Break characters
Setting the SBK bit loads the shift register with a break character. The break frame length
depends on the M bit (see Figure 63).
As long as the SBK bit is set, the SCI send break frames to the TDO pin. After clearing this
144/247
ST72321Bxxx-Auto
Serial communications interface (SCI)
bit by software the SCI insert a logic 1 bit at the end of the last break frame to guarantee the
recognition of the start bit of the next frame.
Idle characters
Setting the TE bit drives the SCI to send an idle frame before the first data frame.
Clearing and then setting the TE bit during a transmission sends an idle frame after the
current word.
Note:
Resetting and setting the TE bit causes the data in the TDR register to be lost. Therefore the
best time to toggle the TE bit is when the TDRE bit is set, that is, before writing the next byte
in the SCIDR.
15.4.3
Receiver
The SCI can receive data words of either 8 or 9 bits. When the M bit is set, word length is 9
bits and the MSB is stored in the R8 bit in the SCICR1 register.
Character reception
During a SCI reception, data shifts in least significant bit first through the RDI pin. In this
mode, the SCIDR register consists or a buffer (RDR) between the internal bus and the
received shift register (see Figure 62).
Procedure
1.
Select the M bit to define the word length.
2.
Select the desired baud rate using the SCIBRR and the SCIERPR registers.
3.
Set the RE bit, this enables the receiver which begins searching for a start bit.
When a character is received:
●
The RDRF bit is set. It indicates that the content of the shift register is transferred to the
RDR.
●
An interrupt is generated if the RIE bit is set and the I bit is cleared in the CCR register.
●
The error flags can be set if a frame error, noise or an overrun error has been detected
during reception.
Clearing the RDRF bit is performed by the following software sequence done by:
1.
An access to the SCISR register
2.
A read to the SCIDR register.
The RDRF bit must be cleared before the end of the reception of the next character to avoid
an overrun error.
Break character
When a break character is received, the SCI handles it as a framing error.
Idle character
When an idle frame is detected, there is the same procedure as a data received character
plus an interrupt if the ILIE bit is set and the I bit is cleared in the CCR register.
Overrun error
An overrun error occurs when a character is received when RDRF has not been reset. Data
cannot be transferred from the shift register to the RDR register as long as the RDRF bit is
not cleared.
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Serial communications interface (SCI)
ST72321Bxxx-Auto
When an overrun error occurs:
●
The OR bit is set.
●
The RDR content is not lost.
●
The shift register is overwritten.
●
An interrupt is generated if the RIE bit is set and the I bit is cleared in the CCR register.
The OR bit is reset by an access to the SCISR register followed by a SCIDR register read
operation.
Noise error
Oversampling techniques are used for data recovery by discriminating between valid
incoming data and noise. Normal data bits are considered valid if three consecutive samples
(8th, 9th, 10th) have the same bit value, otherwise the NF flag is set. In the case of start bit
detection, the NF flag is set on the basis of an algorithm combining both valid edge
detection and three samples (8th, 9th, 10th). Therefore, to prevent the NF flag getting set
during start bit reception, there should be a valid edge detection as well as three valid
samples.
When noise is detected in a frame:
●
The NF flag is set at the rising edge of the RDRF bit.
●
Data is transferred from the Shift register to the SCIDR register.
●
No interrupt is generated. However this bit rises at the same time as the RDRF bit
which itself generates an interrupt.
The NF flag is reset by a SCISR register read operation followed by a SCIDR register read
operation.
During reception, if a false start bit is detected (for example, 8th, 9th, 10th samples are 011,
101, 110), the frame is discarded and the receiving sequence is not started for this frame.
There is no RDRF bit set for this frame and the NF flag is set internally (not accessible to the
user). This NF flag is accessible along with the RDRF bit when a next valid frame is
received.
Note:
If the application Start Bit is not long enough to match the above requirements, then the NF
Flag may get set due to the short Start Bit. In this case, the NF flag may be ignored by the
application software when the first valid byte is received.
See also Noise error causes on page 150.
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ST72321Bxxx-Auto
Serial communications interface (SCI)
Figure 64. SCI baud rate and extended prescaler block diagram
TRANSMITTER
CLOCK
EXTENDED PRESCALER TRANSMITTER RATE CONTROL
SCIETPR
EXTENDED TRANSMITTER PRESCALER REGISTER
SCIERPR
EXTENDED RECEIVER PRESCALER REGISTER
RECEIVER
CLOCK
EXTENDED PRESCALER RECEIVER RATE CONTROL
EXTENDED PRESCALER
fCPU
TRANSMITTER RATE
CONTROL
/PR
/16
SCIBRR
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1 SCR0
RECEIVER RATE
CONTROL
CONVENTIONAL BAUD RATE GENERATOR
Framing error
A framing error is detected when:
●
The stop bit is not recognized on reception at the expected time, following either a desynchronization or excessive noise.
●
A break is received.
When the framing error is detected:
●
The FE bit is set by hardware.
●
Data is transferred from the Shift register to the SCIDR register.
●
No interrupt is generated. However this bit rises at the same time as the RDRF bit
which itself generates an interrupt.
The FE bit is reset by a SCISR register read operation followed by a SCIDR register read
operation.
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Serial communications interface (SCI)
ST72321Bxxx-Auto
Conventional baud rate generation
The baud rate for the receiver and transmitter (Rx and Tx) are set independently and
calculated as follows:
fCPU
fCPU
Rx =
Tx =
(16*PR)*RR
(16*PR)*TR
with:
PR = 1, 3, 4 or 13 (see SCP[1:0] bits)
TR = 1, 2, 4, 8, 16, 32, 64,128 (see SCT[2:0] bits)
RR = 1, 2, 4, 8, 16, 32, 64,128 (see SCR[2:0] bits)
All these bits are in the SCIBRR register.
Example: If fCPU is 8 MHz (normal mode) and if PR = 13 and TR = RR = 1, the transmit and
receive baud rates are 38400 baud.
Note:
The baud rate registers MUST NOT be changed while the transmitter or the receiver is
enabled.
Extended baud rate generation
The extended prescaler option provides a very fine tuning of the baud rate, using a 255
value prescaler, whereas the conventional baud rate generator retains industry standard
software compatibility.
The extended baud rate generator block diagram is described in the Figure 64.
The output clock rate sent to the transmitter or to the receiver is the output from the 16
divider divided by a factor ranging from 1 to 255 set in the SCIERPR or the SCIETPR
register.
Note:
The extended prescaler is activated by setting the SCIETPR or SCIERPR register to a value
other than zero. The baud rates are calculated as follows:
fCPU
fCPU
Rx =
Tx =
16*ERPR*(PR*RR)
16*ETPR*(PR*TR)
with:
ETPR = 1,..,255 (see SCIETPR register)
ERPR = 1,..,255 (see SCIERPR register)
Receiver muting and wake-up feature
In multiprocessor configurations it is often desirable that only the intended message
recipient should actively receive the full message contents, thus reducing redundant SCI
service overhead for all non-addressed receivers.
The non-addressed devices may be placed in sleep mode by means of the muting function.
Setting the RWU bit by software puts the SCI in sleep mode:
●
All the reception status bits cannot be set.
●
All the receive interrupts are inhibited.
A muted receiver may be awakened by one of the following two ways:
148/247
●
by Idle Line detection if the WAKE bit is reset
●
by Address Mark detection if the WAKE bit is set
ST72321Bxxx-Auto
Serial communications interface (SCI)
A receiver wakes up by Idle Line detection when the Receive line has recognized an Idle
Frame. Then the RWU bit is reset by hardware but the IDLE bit is not set.
Receiver wakes up by Address Mark detection when it received a ‘1’ as the most significant
bit of a word, thus indicating that the message is an address. The reception of this particular
word wakes up the receiver, resets the RWU bit and sets the RDRF bit, which allows the
receiver to receive this word normally and to use it as an address word.
Caution:
In Mute mode, do not write to the SCICR2 register. If the SCI is in Mute mode during the
read operation (RWU = 1) and a address mark wake-up event occurs (RWU is reset) before
the write operation, the RWU bit is set again by this write operation. Consequently the
address byte is lost and the SCI is not woken up from Mute mode.
Parity control
Parity control (generation of parity bit in transmission and parity checking in reception) can
be enabled by setting the PCE bit in the SCICR1 register. Depending on the frame length
defined by the M bit, the possible SCI frame formats are as listed in Table 69.
Table 69.
Frame formats
M bit
PCE bit
SCI frame
0
0
| SB | 8 bit data | STB |
0
1
| SB | 7-bit data | PB | STB |
1
0
| SB | 9-bit data | STB |
1
1
| SB | 8-bit data PB | STB |
Legend: SB = Start Bit, STB = Stop Bit, PB = Parity Bit
Note:
In case of wake-up by an address mark, the MSB bit of the data is taken into account and
not the parity bit
Even parity: the parity bit is calculated to obtain an even number of ‘1’s inside the frame
made of the 7 or 8 LSB bits (depending on whether M is equal to 0 or 1) and the parity bit.
Example: data = 00110101; 4 bits set => parity bit is 0 if even parity is selected (PS bit = 0).
Odd parity: the parity bit is calculated to obtain an odd number of ‘1’s inside the frame
made of the 7 or 8 LSB bits (depending on whether M is equal to 0 or 1) and the parity bit.
Example: data = 00110101; 4 bits set => parity bit is 1 if odd parity is selected (PS bit = 1).
Transmission mode: If the PCE bit is set then the MSB bit of the data written in the data
register is not transmitted but is changed by the parity bit.
Reception mode: If the PCE bit is set then the interface checks if the received data byte
has an even number of ‘1’s if even parity is selected (PS = 0) or an odd number of ‘1’s if odd
parity is selected (PS = 1). If the parity check fails, the PE flag is set in the SCISR register
and an interrupt is generated if PIE is set in the SCICR1 register.
SCI clock tolerance
During reception, each bit is sampled 16 times. The majority of the 8th, 9th and 10th
samples is considered as the bit value. For a valid bit detection, all the three samples should
have the same value otherwise the noise flag (NF) is set. For example: If the 8th, 9th and
10th samples are 0, 1 and 1 respectively, then the bit value is ‘1’, but the Noise Flag bit is set
because the three samples values are not the same.
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Serial communications interface (SCI)
ST72321Bxxx-Auto
Consequently, the bit length must be long enough so that the 8th, 9th and 10th samples
have the desired bit value. This means the clock frequency should not vary more than 6/16
(37.5%) within one bit. The sampling clock is resynchronized at each start bit, so that when
receiving 10 bits (one start bit, 1 data byte, 1 stop bit), the clock deviation must not exceed
3.75%.
Note:
The internal sampling clock of the microcontroller samples the pin value on every falling
edge. Therefore, the internal sampling clock and the time the application expects the
sampling to take place may be out of sync. For example: If the baud rate is 15.625 Kbaud
(bit length is 64µs), then the 8th, 9th and 10th samples are at 28µs, 32µs and 36µs
respectively (the first sample starting ideally at 0µs). But if the falling edge of the internal
clock occurs just before the pin value changes, the samples would then be out of sync by
~4us. This means the entire bit length must be at least 40µs (36µs for the 10th sample + 4µs
for synchronization with the internal sampling clock).
Clock deviation causes
The causes which contribute to the total deviation are:
–
DTRA: Deviation due to transmitter error (Local oscillator error of the transmitter or
the transmitter is transmitting at a different baud rate).
–
DQUANT: Error due to the baud rate quantization of the receiver.
–
DREC: Deviation of the local oscillator of the receiver: This deviation can occur
during the reception of one complete SCI message assuming that the deviation
has been compensated at the beginning of the message.
–
DTCL: Deviation due to the transmission line (generally due to the transceivers)
All the deviations of the system should be added and compared to the SCI clock tolerance:
DTRA + DQUANT + DREC + DTCL < 3.75%
Noise error causes
See also description of noise error in Receiver on page 145.
Start bit
The noise flag (NF) is set during start bit reception if one of the following conditions occurs:
1.
A valid falling edge is not detected. A falling edge is considered to be valid if the 3
consecutive samples before the falling edge occurs are detected as ‘1’ and, after the
falling edge occurs, during the sampling of the 16 samples, if one of the samples
numbered 3, 5 or 7 is detected as a ‘1’.
2.
During sampling of the 16 samples, if one of the samples numbered 8, 9 or 10 is
detected as a ‘1’.
Therefore, a valid Start Bit must satisfy both the above conditions to prevent the Noise Flag
getting set.
Data bits
The noise flag (NF) is set during normal data bit reception if the following condition occurs:
●
During the sampling of 16 samples, if all three samples numbered 8, 9 and10 are not
the same. The majority of the 8th, 9th and 10th samples is considered as the bit value.
Therefore, a valid Data Bit must have samples 8, 9 and 10 at the same value to prevent the
Noise Flag from getting set.
150/247
ST72321Bxxx-Auto
Serial communications interface (SCI)
Figure 65. Bit sampling in reception mode
RDI LINE
sampled values
Sample
clock
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
6/16
7/16
7/16
One bit time
15.5
Low power modes
Table 70.
Effect of low power modes on SCI
Mode
15.6
Effect
Wait
No effect on SCI.
SCI interrupts cause the device to exit from Wait mode.
Halt
SCI registers are frozen.
In Halt mode, the SCI stops transmitting/receiving until Halt mode is exited.
Interrupts
The SCI interrupt events are connected to the same interrupt vector.
These events generate an interrupt if the corresponding Enable Control Bit is set and the
interrupt mask in the CC register is reset (RIM instruction).
Table 71.
SCI interrupt control/wake-up capability
Interrupt event
Transmit Data Register Empty
Transmission Complete
Received Data Ready to be Read
Event flag
Enable control
bit
Exit from
Wait
Exit from
Halt
TDRE
TIE
Yes
No
TC
TCIE
Yes
No
Yes
No
Yes
No
RDRF
RIE
Overrun Error Detected
OR
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Serial communications interface (SCI)
Table 71.
ST72321Bxxx-Auto
SCI interrupt control/wake-up capability
Interrupt event
Idle Line Detected
Parity Error
15.7
SCI registers
15.7.1
Status register (SCISR)
Event flag
Enable control
bit
Exit from
Wait
Exit from
Halt
IDLE
ILIE
Yes
No
PE
PIE
Yes
No
SCISR
Reset value: 1100 0000 (C0h)
7
6
5
4
3
2
1
0
TDRE
TC
RDRF
IDLE
OR
NF
FE
PE
RO
RO
RO
RO
RO
RO
RO
RO
Table 72.
Bit
7
6
5
152/247
Name
SCISR register description
Function
Transmit data register empty
This bit is set by hardware when the content of the TDR register has been
transferred into the shift register. An interrupt is generated if the TIE bit = 1 in the
SCICR2 register. It is cleared by a software sequence (an access to the SCISR
TDRE
register followed by a write to the SCIDR register).
0: Data is not transferred to the shift register
1: Data is transferred to the shift register
Note: Data is not transferred to the shift register unless the TDRE bit is cleared.
TC
Transmission complete
This bit is set by hardware when transmission of a frame containing Data is
complete. An interrupt is generated if TCIE = 1 in the SCICR2 register. It is cleared
by a software sequence (an access to the SCISR register followed by a write to the
SCIDR register).
0: Transmission is not complete
1: Transmission is complete
Note: TC is not set after the transmission of a Preamble or a Break.
Received data ready flag
This bit is set by hardware when the content of the RDR register has been
transferred to the SCIDR register. An interrupt is generated if RIE = 1 in the SCICR2
RDRF
register. It is cleared by a software sequence (an access to the SCISR register
followed by a read to the SCIDR register).
0: Data is not received
1: Received data is ready to be read
ST72321Bxxx-Auto
Serial communications interface (SCI)
Table 72.
Bit
4
3
2
1
0
SCISR register description (continued)
Name
Function
IDLE
Idle line detect
This bit is set by hardware when an Idle Line is detected. An interrupt is generated if
the ILIE = 1 in the SCICR2 register. It is cleared by a software sequence (an access
to the SCISR register followed by a read to the SCIDR register).
0: No Idle Line is detected
1: Idle Line is detected
Note: The IDLE bit is not set again until the RDRF bit has been set itself (that is, a
new idle line occurs).
OR
Overrun error
This bit is set by hardware when the word currently being received in the shift
register is ready to be transferred into the RDR register while RDRF = 1. An interrupt
is generated if RIE = 1 in the SCICR2 register. It is cleared by a software sequence
(an access to the SCISR register followed by a read to the SCIDR register).
0: No Overrun error
1: Overrun error is detected
Note: When this bit is set RDR register content is not lost but the shift register is
overwritten.
NF
Noise flag
This bit is set by hardware when noise is detected on a received frame. It is cleared
by a software sequence (an access to the SCISR register followed by a read to the
SCIDR register).
0: No noise is detected
1: Noise is detected
Note: This bit does not generate interrupt as it appears at the same time as the
RDRF bit which itself generates an interrupt.
FE
Framing error
This bit is set by hardware when a de-synchronization, excessive noise or a break
character is detected. It is cleared by a software sequence (an access to the SCISR
register followed by a read to the SCIDR register).
0: No Framing error is detected
1: Framing error or break character is detected
Note: This bit does not generate interrupt as it appears at the same time as the
RDRF bit which itself generates an interrupt. If the word currently being transferred
causes both frame error and overrun error, it will be transferred and only the OR bit
will be set.
PE
Parity error
This bit is set by hardware when a parity error occurs in receiver mode. It is cleared
by a software sequence (a read to the status register followed by an access to the
SCIDR data register). An interrupt is generated if PIE = 1 in the SCICR1 register.
0: No parity error
1: Parity error
153/247
Serial communications interface (SCI)
15.7.2
ST72321Bxxx-Auto
Control register 1 (SCICR1)
SCICR1
Reset value: X000 0000 (x0h)
7
6
5
4
3
2
1
0
R8
T8
SCID
M
WAKE
PCE
PS
PIE
RW
RW
RW
RW
RW
RW
RW
RW
Table 73.
Bit
Name
7
R8
Receive data bit 8
This bit is used to store the 9th bit of the received word when M = 1.
6
T8
Transmit data bit 8
This bit is used to store the 9th bit of the transmitted word when M = 1.
5
4
3
2
1
154/247
SCICR1 register description
Function
SCID
Disabled for low power consumption
When this bit is set the SCI prescalers and outputs are stopped and the end of the
current byte transfer in order to reduce power consumption.This bit is set and
cleared by software.
0: SCI enabled
1: SCI prescaler and outputs disabled
M
Word length
This bit determines the word length. It is set or cleared by software.
0: 1 Start bit, 8 Data bits, 1 Stop bit
1: 1 Start bit, 9 Data bits, 1 Stop bit
Note: The M bit must not be modified during a data transfer (both transmission and
reception).
Wake-up method
This bit determines the SCI wake-up method. It is set or cleared by software.
WAKE
0: Idle line
1: Address mark
PCE
Parity control enable
This bit selects the hardware parity control (generation and detection). When the
parity control is enabled, the computed parity is inserted at the MSB position (9th
bit if M = 1; 8th bit if M = 0) and parity is checked on the received data. This bit is
set and cleared by software. Once it is set, PCE is active after the current byte (in
reception and in transmission).
0: Parity control disabled
1: Parity control enabled
PS
Parity selection
This bit selects the odd or even parity when the parity generation/detection is
enabled (PCE bit set). It is set and cleared by software. The parity is selected after
the current byte.
0: Even parity
1: Odd parity
ST72321Bxxx-Auto
Serial communications interface (SCI)
Table 73.
Bit
Name
Function
PIE
Parity interrupt enable
This bit enables the interrupt capability of the hardware parity control when a parity
error is detected (PE bit set). It is set and cleared by software.
0: Parity error interrupt disabled
1: Parity error interrupt enabled
0
15.7.3
SCICR1 register description (continued)
Control register 2 (SCICR2)
SCICR2
7
6
5
4
3
2
1
0
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
RW
RW
RW
RW
RW
RW
RW
RW
Table 74.
Bit Name
7
6
5
4
3
Reset value: 0000 0000 (00h)
TIE
SCICR2 register description
Function
Transmitter interrupt enable
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever TDRE = 1 in the SCISR register.
Transmission complete interrupt enable
This bit is set and cleared by software.
TCIE
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever TC = 1 in the SCISR register.
RIE
Receiver interrupt enable
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever OR = 1 or RDRF = 1 in the SCISR
register.
ILIE
Idle line interrupt enable
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SCI interrupt is generated whenever IDLE = 1 in the SCISR register.
TE
Transmitter enable
This bit enables the transmitter. It is set and cleared by software.
0: Transmitter is disabled
1: Transmitter is enabled
Notes:
During transmission, a ‘0’ pulse on the TE bit (‘0’ followed by ‘1’) sends a preamble
(idle line) after the current word.
When TE is set there is a 1 bit-time delay before the transmission starts.
Caution: The TDO pin is free for general purpose I/O only when the TE and RE bits
are both cleared (or if TE is never set).
155/247
Serial communications interface (SCI)
Table 74.
ST72321Bxxx-Auto
SCICR2 register description (continued)
Bit Name
2
15.7.4
RE
Function
Receiver enable
This bit enables the receiver. It is set and cleared by software.
0: Receiver is disabled
1: Receiver is enabled and begins searching for a start bit
1
Receiver wake-up
This bit determines if the SCI is in mute mode or not. It is set and cleared by software
and can be cleared by hardware when a wake-up sequence is recognized.
0: Receiver in Active mode
RWU
1: Receiver in Mute mode
Note: Before selecting Mute mode (setting the RWU bit), the SCI must receive some
data first, otherwise it cannot function in Mute mode with wake-up by idle line
detection.
0
Send break
This bit set is used to send break characters. It is set and cleared by software.
0: No break character is transmitted
1: Break characters are transmitted
Note: If the SBK bit is set to ‘1’ and then to ‘0’, the transmitter sends a BREAK word
at the end of the current word.
SBK
Data register (SCIDR)
This register contains the Received or Transmitted data character, depending on whether it
is read from or written to.
SCIDR
Reset value: Undefined
7
6
5
4
3
2
1
0
DR[7:0]
RW
The Data register performs a double function (read and write) since it is composed of two
registers, one for transmission (TDR) and one for reception (RDR).
The TDR register provides the parallel interface between the internal bus and the output
shift register (see Figure 62).
The RDR register provides the parallel interface between the input shift register and the
internal bus (see Figure 62).
15.7.5
Baud rate register (SCIBRR)
SCIBRR
Reset value: 0000 0000 (00h)
7
156/247
6
5
4
3
2
1
SCP[1:0]
SCT[2:0]
SCR[2:0]
RW
RW
RW
0
ST72321Bxxx-Auto
Table 75.
Bit
Serial communications interface (SCI)
SCIBRR register description
Name
Function
First SCI Prescaler
These 2 prescaling bits allow several standard clock division ranges.
00: PR prescaling factor = 1
7:6 SCP[1:0]
01: PR prescaling factor = 3
10: PR prescaling factor = 4
11: PR prescaling factor = 13
SCI Transmitter rate divisor
These 3 bits, in conjunction with the SCP1 and SCP0 bits define the total division
applied to the bus clock to yield the transmit rate clock in conventional Baud Rate
Generator mode.
000: TR dividing factor = 1
001: TR dividing factor = 2
5:3 SCT[2:0]
010: TR dividing factor = 4
011: TR dividing factor = 8
100: TR dividing factor = 16
101: TR dividing factor = 32
110: TR dividing factor = 64
111: TR dividing factor = 128
SCI Receiver rate divisor
These 3 bits, in conjunction with the SCP[1:0] bits define the total division applied
to the bus clock to yield the receive rate clock in conventional Baud Rate
Generator mode.
000: RR dividing factor = 1
001: RR dividing factor = 2
2:0 SCR[2:0]
010: RR dividing factor = 4
011: RR dividing factor = 8
100: RR dividing factor = 16
101: RR dividing factor = 32
110: RR dividing factor = 64
111: RR dividing factor = 128
15.7.6
Extended receive prescaler division register (SCIERPR)
This register allows setting of the extended prescaler rate division factor for the receive
circuit.
SCIERPR
7
Reset value: 0000 0000 (00h)
6
5
4
3
2
1
0
ERPR[7:0]
RW
157/247
Serial communications interface (SCI)
Table 76.
Bit
ST72321Bxxx-Auto
SCIERPR register description
Name
Function
8-bit Extended Receive Prescaler Register
The extended baud rate generator is activated when a value different from 00h is
stored in this register. Therefore the clock frequency issued from the 16 divider
7:0 ERPR[7:0]
(see Figure 64) is divided by the binary factor set in the SCIERPR register (in
the range 1 to 255).
The extended baud rate generator is not used after a reset.
15.7.7
Extended transmit prescaler division register (SCIETPR)
This register allows setting of the external prescaler rate division factor for the transmit
circuit.
SCIETPR
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
ETPR[7:0]
RW
Table 77.
Bit
SCIETPR register description
Name
Function
8-bit Extended Transmit Prescaler Register
The extended baud rate generator is activated when a value different from 00h is
stored in this register. Therefore the clock frequency issued from the 16 divider
7:0 ETPR[7:0]
(see Figure 64) is divided by the binary factor set in the SCIETPR register (in the
range 1 to 255).
The extended baud rate generator is not used after a reset.
Table 78.
Baud rate selection
Conditions
Symbol
Parameter
fCPU
Accuracy
versus
standard
~0.16%
fTx
fRx
Communication
frequency
8 MHz
~0.79%
158/247
Standard
Baud rate
Unit
Prescaler
Conventional mode
TR (or RR) = 128, PR = 13
TR (or RR) = 32, PR = 13
TR (or RR) = 16, PR = 13
TR (or RR) = 8, PR = 13
TR (or RR) = 4, PR = 13
TR (or RR) = 16, PR = 3
TR (or RR) = 2, PR = 13
TR (or RR) = 1, PR = 13
Extended mode
ETPR (or ERPR) = 35,
TR (or RR) = 1, PR = 1
300
1200
2400
4800
9600
10400
19200
38400
~300.48
~1201.92
~2403.84
~4807.69
~9615.38
~10416.67
~19230.77
~38461.54
14400
~14285.71
Hz
ST72321Bxxx-Auto
Table 79.
Serial communications interface (SCI)
SCI register map and reset values
Address (Hex.) Register label
7
6
5
4
3
2
1
0
0050h
SCISR
Reset value
TDRE
1
TC
1
RDRF
0
IDLE
0
OR
0
NF
0
FE
0
PE
0
0051h
SCIDR
Reset value
MSB
x
x
x
x
x
x
x
LSB
x
0052h
SCIBRR
Reset value
SCP1
0
SCP0
0
SCT2
0
SCT1
0
SCT0
0
SCR2
0
SCR1
0
SCR0
0
0053h
SCICR1
Reset value
R8
x
T8
0
SCID
0
M
0
WAKE
0
PCE
0
PS
0
PIE
0
0054h
SCICR2
Reset value
TIE
0
TCIE
0
RIE
0
ILIE
0
TE
0
RE
0
RWU
0
SBK
0
0055h
SCIERPR
Reset value
MSB
0
0
0
0
0
0
0
LSB
0
0057h
SCIPETPR
Reset value
MSB
0
0
0
0
0
0
0
LSB
0
159/247
I2C bus interface (I2C)
16
I2C bus interface (I2C)
16.1
Introduction
ST72321Bxxx-Auto
The I2C bus interface serves as an interface between the microcontroller and the serial I2C
bus. It provides both multimaster and slave functions, and controls all I2C bus-specific
sequencing, protocol, arbitration and timing. It supports fast I2C mode (400 kHz).
16.2
16.2.1
16.2.2
160/247
Main features
●
Parallel-bus/I2C protocol converter
●
Multimaster capability
●
7-bit/10-bit addressing
●
SMBus V1.1 compliant
●
Transmitter/Receiver flag
●
End-of-byte transmission flag
●
Transfer problem detection
I2C master features
●
Clock generation
●
I2C bus busy flag
●
Arbitration Lost flag
●
End of byte transmission flag
●
Transmitter/Receiver flag
●
Start bit detection flag
●
Start and Stop generation
I2C slave features
●
Stop bit detection
●
I2C bus busy flag
●
Detection of misplaced start or stop condition
●
Programmable I2C address detection
●
Transfer problem detection
●
End-of-byte transmission flag
●
Transmitter/Receiver flag
ST72321Bxxx-Auto
16.3
I2C bus interface (I2C)
General description
In addition to receiving and transmitting data, this interface converts it from serial to parallel
format and vice versa, using either an interrupt or polled handshake. The interrupts are
enabled or disabled by software. The interface is connected to the I2C bus by a data pin
(SDAI) and by a clock pin (SCLI). It can be connected both with a standard I2C bus and a
fast I2C bus. This selection is made by software.
16.3.1
Mode selection
The interface can operate in the four following modes:
●
Slave transmitter/receiver
●
Master transmitter/receiver
By default, it operates in slave mode.
The interface automatically switches from slave to master after it generates a START
condition and from master to slave in case of arbitration loss or a STOP generation, allowing
then Multimaster capability.
16.3.2
Communication flow
In Master mode, it initiates a data transfer and generates the clock signal. A serial data
transfer always begins with a start condition and ends with a stop condition. Both start and
stop conditions are generated in master mode by software.
In Slave mode, the interface is capable of recognizing its own address (7- or 10-bit), and the
General Call address. The General Call address detection may be enabled or disabled by
software.
Data and addresses are transferred as 8-bit bytes, MSB first. The first byte(s) following the
start condition contain the address (one in 7-bit mode, two in 10-bit mode). The address is
always transmitted in Master mode.
A 9th clock pulse follows the 8 clock cycles of a byte transfer, during which the receiver must
send an acknowledge bit to the transmitter. Refer to Figure 66.
Figure 66. I2C bus protocol
SDA
ACK
MSB
SCL
1
2
8
START
CONDITION
9
STOP
CONDITION
VR02119B
Acknowledge may be enabled and disabled by software.
The I2C interface address and/or general call address can be selected by software.
The speed of the I2C interface may be selected between standard (up to 100 kHz) and fast
I2C (up to 400 kHz).
161/247
I2C bus interface (I2C)
16.3.3
ST72321Bxxx-Auto
SDA/SCL line control
Transmitter mode
The interface holds the clock line low before transmission to wait for the microcontroller to
write the byte in the data register.
Receiver mode
The interface holds the clock line low after reception to wait for the microcontroller to read
the byte in the data register.
The SCL frequency (fSCL) is controlled by a programmable clock divider which depends on
the I2C bus mode.
When the I2C cell is enabled, the SDA and SCL ports must be configured as floating inputs.
In this case, the value of the external pull-up resistor used depends on the application.
When the I2C cell is disabled, the SDA and SCL ports revert to being standard I/O port pins.
Figure 67. I2C interface block diagram
DATA REGISTER (DR)
SDA or SDAI
DATA CONTROL
DATA SHIFT REGISTER
COMPARATOR
OWN ADDRESS REGISTER 1 (OAR1)
OWN ADDRESS REGISTER 2 (OAR2)
SCL or SCLI
CLOCK CONTROL
CLOCK CONTROL REGISTER (CCR)
CONTROL REGISTER (CR)
STATUS REGISTER 1 (SR1)
CONTROL LOGIC
STATUS REGISTER 2 (SR2)
INTERRUPT
162/247
ST72321Bxxx-Auto
16.4
I2C bus interface (I2C)
Functional description
Refer to the CR, SR1 and SR2 registers in Section 16.7 for the bit definitions.
By default the I2C interface operates in Slave mode (M/SL bit is cleared) except when it
initiates a transmit or receive sequence.
First the interface frequency must be configured using the FRi bits in the OAR2 register.
16.4.1
Slave mode
As soon as a start condition is detected, the address is received from the SDA line and sent
to the shift register; then it is compared with the address of the interface or the General Call
address (if selected by software).
Note:
In 10-bit addressing mode, the comparison includes the header sequence (11110xx0) and
the two most significant bits of the address.
Header matched (10-bit mode only): The interface generates an acknowledge pulse if the
ACK bit is set.
Address not matched: The interface ignores it and waits for another Start condition.
Address matched: The interface generates in sequence:
●
an acknowledge pulse if the ACK bit is set
●
EVF and ADSL bits are set with an interrupt if the ITE bit is set.
Then the interface waits for a read of the SR1 register, holding the SCL line low (see
Figure 68: Transfer sequencing EV1).
Next, in 7-bit mode read the DR register to determine from the least significant bit (Data
Direction Bit) if the slave must enter Receiver or Transmitter mode.
In 10-bit mode, after receiving the address sequence the slave is always in receive mode. It
will enter transmit mode on receiving a repeated Start condition followed by the header
sequence with matching address bits and the least significant bit set (11110xx1).
Slave receiver
Following the address reception and after the SR1 register has been read, the slave
receives bytes from the SDA line into the DR register via the internal shift register. After
each byte the interface generates in sequence:
●
an acknowledge pulse if the ACK bit is set
●
EVF and BTF bits are set with an interrupt if the ITE bit is set.
Then the interface waits for a read of the SR1 register followed by a read of the DR register,
holding the SCL line low (see Figure 68: Transfer sequencing EV2).
Slave transmitter
Following the address reception and after SR1 register has been read, the slave sends
bytes from the DR register to the SDA line via the internal shift register.
The slave waits for a read of the SR1 register followed by a write in the DR register, holding
the SCL line low (see Figure 68: Transfer sequencing EV3).
When the acknowledge pulse is received:
●
The EVF and BTF bits are set by hardware with an interrupt if the ITE bit is set.
163/247
I2C bus interface (I2C)
ST72321Bxxx-Auto
Closing slave communication
After the last data byte is transferred, a Stop Condition is generated by the master. The
interface detects this condition and sets:
●
EVF and STOPF bits with an interrupt if the ITE bit is set.
Then the interface waits for a read of the SR2 register (see Figure 68: Transfer sequencing
EV4).
Error cases
Note:
●
BERR: Detection of a Stop or a Start condition during a byte transfer. In this case, the
EVF and the BERR bits are set with an interrupt if the ITE bit is set.
If it is a Stop then the interface discards the data, released the lines and waits for
another Start condition.
If it is a Start then the interface discards the data and waits for the next slave address
on the bus.
●
AF: Detection of a non-acknowledge bit. In this case, the EVF and AF bits are set with
an interrupt if the ITE bit is set.
The AF bit is cleared by reading the I2CSR2 register. However, if read before the
completion of the transmission, the AF flag will be set again, thus possibly generating a
new interrupt. Software must ensure either that the SCL line is back at 0 before reading
the SR2 register, or be able to correctly handle a second interrupt during the 9th pulse
of a transmitted byte.
In case of errors, the SCL line is not held low; however, the SDA line can remain low if the
last bits transmitted are all 0. While AF = 1, the SCL line may be held low due to SB or BTF
flags that are set at the same time. It is then necessary to release both lines by software.
How to release the SDA / SCL lines
Set and subsequently clear the STOP bit while BTF is set. The SDA/SCL lines are released
after the transfer of the current byte.
SMBus compatibility
The ST7 I2C is compatible with the SMBus V1.1 protocol. It supports all SMBus addressing
modes, SMBus bus protocols and CRC-8 packet error checking. Refer to SMBus Slave
Driver For ST7 I2C Peripheral (AN1713).
16.4.2
Master mode
To switch from default Slave mode to Master mode a Start condition generation is needed.
Start condition
Setting the START bit while the BUSY bit is cleared causes the interface to switch to Master
mode (M/SL bit set) and generates a Start condition.
Once the Start condition is sent:
●
The EVF and SB bits are set by hardware with an interrupt if the ITE bit is set.
Then the master waits for a read of the SR1 register followed by a write in the DR register
with the Slave address, holding the SCL line low (see Figure 68: Transfer sequencing
EV5).
164/247
ST72321Bxxx-Auto
I2C bus interface (I2C)
Slave address transmission
Then the slave address is sent to the SDA line via the internal shift register.
●
In 7-bit addressing mode, one address byte is sent.
●
In 10-bit addressing mode, sending the first byte including the header sequence
causes the following event:
–
The EVF bit is set by hardware with interrupt generation if the ITE bit is set.
Then the master waits for a read of the SR1 register followed by a write in the DR register,
holding the SCL line low (see Figure 68: Transfer sequencing EV9).
Then the second address byte is sent by the interface.
After completion of this transfer (and acknowledge from the slave if the ACK bit is set):
●
The EVF bit is set by hardware with interrupt generation if the ITE bit is set.
Then the master waits for a read of the SR1 register followed by a write in the CR register
(for example set PE bit), holding the SCL line low (see Figure 68: Transfer sequencing
EV6).
Next, the master must enter Receiver or Transmitter mode.
Note:
In 10-bit addressing mode, to switch the master to Receiver mode, software must generate
a repeated Start condition and resend the header sequence with the least significant bit set
(11110xx1).
Master receiver
Following the address transmission and after SR1 and CR registers have been accessed,
the master receives bytes from the SDA line into the DR register via the internal shift
register. After each byte the interface generates in sequence:
●
Acknowledge pulse if the ACK bit is set
●
EVF and BTF bits are set by hardware with an interrupt if the ITE bit is set.
Then the interface waits for a read of the SR1 register followed by a read of the DR register,
holding the SCL line low (see Figure 68: Transfer sequencing EV7).
To close the communication: Before reading the last byte from the DR register, set the STOP
bit to generate the Stop condition. The interface goes automatically back to slave mode
(M/SL bit cleared).
Note:
In order to generate the non-acknowledge pulse after the last received data byte, the ACK
bit must be cleared just before reading the second last data byte.
Master transmitter
Following the address transmission and after SR1 register has been read, the master sends
bytes from the DR register to the SDA line via the internal shift register.
The master waits for a read of the SR1 register followed by a write in the DR register,
holding the SCL line low (see Figure 68: Transfer sequencing EV8).
When the acknowledge bit is received, the interface sets:
●
EVF and BTF bits with an interrupt if the ITE bit is set.
To close the communication: After writing the last byte to the DR register, set the STOP bit to
generate the Stop condition. The interface goes automatically back to slave mode (M/SL bit
cleared).
165/247
I2C bus interface (I2C)
ST72321Bxxx-Auto
Error cases
●
Note:
166/247
BERR: Detection of a Stop or a Start condition during a byte transfer. In this case, the
EVF and BERR bits are set by hardware with an interrupt if ITE is set.
Note that BERR will not be set if an error is detected during the first or second pulse of
each 9-bit transaction:
–
Single Master Mode
If a Start or Stop is issued during the first or second pulse of a 9-bit transaction,
the BERR flag will not be set and transfer will continue however the BUSY flag will
be reset. To work around this, slave devices should issue a NACK when they
receive a misplaced Start or Stop. The reception of a NACK or BUSY by the
master in the middle of communication makes it possible to re-initiate
transmission.
–
Multimaster Mode
Normally the BERR bit would be set whenever unauthorized transmission takes
place while transfer is already in progress. However, an issue will arise if an
external master generates an unauthorized Start or Stop while the I2C master is
on the first or second pulse of a 9-bit transaction. It is possible to work around this
by polling the BUSY bit during I2C master mode transmission. The resetting of the
BUSY bit can then be handled in a similar manner as the BERR flag being set.
●
AF: Detection of a non-acknowledge bit. In this case, the EVF and AF bits are set by
hardware with an interrupt if the ITE bit is set. To resume, set the Start or Stop bit.
The AF bit is cleared by reading the I2CSR2 register. However, if read before the
completion of the transmission, the AF flag will be set again, thus possibly generating a
new interrupt. Software must ensure either that the SCL line is back at 0 before reading
the SR2 register, or be able to correctly handle a second interrupt during the 9th pulse
of a transmitted byte.
●
ARLO: Detection of an arbitration lost condition.
In this case the ARLO bit is set by hardware (with an interrupt if the ITE bit is set and
the interface goes automatically back to slave mode (the M/SL bit is cleared).
In all these cases, the SCL line is not held low; however, the SDA line can remain low due to
possible ‘0’ bits transmitted last. It is then necessary to release both lines by software.
ST72321Bxxx-Auto
I2C bus interface (I2C)
Figure 68. Transfer sequencing
7-bit Slave receiver:
S Address
A
Data1
A
Data2
EV1
A
EV2
EV2
DataN
.....
A
P
EV2
EV4
7-bit Slave transmitter:
S Address
A
Data1
A
Data2
EV1 EV3
A
EV3
.....
EV3
DataN
NA
P
EV3-1
EV4
7-bit Master receiver:
S
Address
A
EV5
Data1
A
Data2
EV6
A
EV7
.....
EV7
DataN
NA
P
EV7
7-bit Master transmitter:
S
Address
A
EV5
Data1
A
EV6 EV8
Data2
A
EV8
EV8
DataN
.....
A
P
EV8
10-bit Slave receiver:
S
Header
A
Address
A
Data1
A
EV1
EV2
DataN
.....
A
P
EV2
EV4
10-bit Slave transmitter:
Sr Header
A
Data1
A
EV1 EV3
.... DataN
EV3 .
A
P
EV3-1
EV4
10-bit Master transmitter:
S
Header
A
EV5
Address
EV9
A
Data1
EV6 EV8
A
EV8
.....
DataN
A
P
EV8
10-bit Master receiver:
Header
Sr
EV5
A
Data1
EV6
A
EV7
.....
DataN
A
P
EV7
Legend:
S = Start, Sr = Repeated Start, P = Stop, A = Acknowledge, NA = Non-acknowledge, EVx = Event (with interrupt if ITE = 1)
EV1: EVF = 1, ADSL = 1, cleared by reading SR1 register.
EV2: EVF = 1, BTF = 1, cleared by reading SR1 register followed by reading DR register.
EV3: EVF = 1, BTF = 1, cleared by reading SR1 register followed by writing DR register.
EV3-1: EVF = 1, AF = 1, BTF = 1; AF is cleared by reading SR1 register. BTF is cleared by releasing the lines (STOP = 1, STOP = 0) or
by writing DR register (DR = FFh). Note: If lines are released by STOP = 1, STOP = 0, the subsequent EV4 is not seen.
EV4: EVF = 1, STOPF = 1, cleared by reading SR2 register.
EV5: EVF = 1, SB = 1, cleared by reading SR1 register followed by writing DR register.
EV6: EVF = 1, cleared by reading SR1 register followed by writing CR register (for example PE = 1).
EV7: EVF = 1, BTF = 1, cleared by reading SR1 register followed by reading DR register.
EV8: EVF = 1, BTF = 1, cleared by reading SR1 register followed by writing DR register.
EV9: EVF = 1, ADD10 = 1, cleared by reading SR1 register followed by writing DR register.
167/247
I2C bus interface (I2C)
16.5
ST72321Bxxx-Auto
Low power modes
Effect of low power modes on I2C
Table 80.
Mode
Effect
2
16.6
Wait
No effect on I C interface.
I2C interrupts cause the device to exit from Wait mode.
Halt
I2C registers are frozen.
In Halt mode, the I2C interface is inactive and does not acknowledge data on the bus. The
I2C interface resumes operation when the MCU is woken up by an interrupt with “exit from
Halt mode” capability.
Interrupts
Figure 69. Interrupt control logic diagram
ADD10
BTF
ADSL
SB
AF
STOPF
ARLO
BERR
ITE
INTERRUPT
EVF
*
* EVF can also be set by EV6 or an error from the SR2 register.
Table 81.
I2C interrupt control/wake-up capability
Interrupt event
10-bit Address Sent Event (Master mode)
End of Byte Transfer Event
Address Matched Event (Slave mode)
Event flag
Enable
Exit from
control bit
Wait
ADD10
BTF
ADSEL
Start Bit Generation Event (Master mode)
SB
Acknowledge Failure Event
AF
ITE
Note:
168/247
Exit from
Halt
Stop Detection Event (Slave mode)
STOPF
Arbitration Lost Event (Multimaster configuration)
ARLO
Bus Error Event
BERR
Yes
No
The I2C interrupt events are connected to the same interrupt vector (see Interrupts chapter).
They generate an interrupt if the corresponding Enable Control bit is set and the I-bit in the
CC register is reset (RIM instruction).
ST72321Bxxx-Auto
I2C bus interface (I2C)
16.7
Register description
16.7.1
I2C control register (CR)
CR
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
Reserved
PE
ENGC
START
ACK
STOP
ITE
-
RW
RW
RW
RW
RW
RW
Table 82.
Bit
Name
7:6
-
5
PE
CR register description
Function
Reserved. Forced to 0 by hardware.
Peripheral enable
This bit is set and cleared by software.
0: Peripheral disabled
1: Master/Slave capability
Notes:
- When PE = 0, all the bits of the CR register and the SR register except the Stop
bit are reset. All outputs are released while PE = 0
- When PE = 1, the corresponding I/O pins are selected by hardware as alternate
functions.
To enable the I2C interface, write the CR register TWICE with PE = 1 as the first
write only activates the interface (only PE is set).
4
Enable General Call
This bit is set and cleared by software. It is also cleared by hardware when the
interface is disabled (PE = 0). The 00h General Call address is acknowledged (01h
ignored).
ENGC
0: General Call disabled
1: General Call enabled
Note: In accordance with the I2C standard, when GCAL addressing is enabled, an
I2C slave can only receive data. It will not transmit data to the master.
3
Generation of a Start condition
This bit is set and cleared by software. It is also cleared by hardware when the
interface is disabled (PE = 0) or when the Start condition is sent (with interrupt
generation if ITE = 1).
In Master mode
START
0: No start generation
1: Repeated start generation
In Slave mode
0: No start generation
1: Start generation when the bus is free
2
Acknowledge enable
This bit is set and cleared by software. It is also cleared by hardware when the
interface is disabled (PE = 0).
0: No acknowledge returned
1: Acknowledge returned after an address byte or a data byte is received
ACK
169/247
I2C bus interface (I2C)
Table 82.
Bit
1
CR register description (continued)
Name
Function
STOP
Generation of a Stop condition
This bit is set and cleared by software. It is also cleared by hardware in master
mode.
Note: This bit is not cleared when the interface is disabled (PE = 0).
In Master mode
0: No stop generation
1: Stop generation after the current byte transfer or after the current Start condition
is sent. The STOP bit is cleared by hardware when the Stop condition is sent.
In Slave mode
0: No stop generation
1: Release the SCL and SDA lines after the current byte transfer (BTF = 1). In this
mode the STOP bit has to be cleared by software.
ITE
Interrupt enable
This bit is set and cleared by software and cleared by hardware when the interface
is disabled (PE = 0).
0: Interrupts disabled
1: Interrupts enabled
Refer to Figure 69 and Table 81 for the relationship between the events and the
interrupt.
SCL is held low when the ADD10, SB, BTF or ADSL flags or an EV6 event (see
Figure 68) is detected.
0
16.7.2
ST72321Bxxx-Auto
I2C status register 1 (SR1)
SR1
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
EVF
ADD10
TRA
BUSY
BTF
ADSL
M/SL
SB
RO
RO
RO
RO
RO
RO
RO
RO
Table 83.
Bit
7
170/247
Name
EVF
SR1 register description
Function
Event flag
This bit is set by hardware as soon as an event occurs. It is cleared by software
reading SR2 register in case of error event or as described in Figure 68. It is also
cleared by hardware when the interface is disabled (PE = 0).
0: No event
1: One of the following events has occurred:
- BTF = 1 (Byte received or transmitted)
- ADSL = 1 (Address matched in Slave mode while ACK = 1)
- SB = 1 (Start condition generated in Master mode)
- AF = 1 (No acknowledge received after byte transmission)
- STOPF = 1 (Stop condition detected in Slave mode)
- ARLO = 1 (Arbitration lost in Master mode)
- BERR = 1 (Bus error, misplaced Start or Stop condition detected)
- ADD10 = 1 (Master has sent header byte)
- Address byte successfully transmitted in Master mode
ST72321Bxxx-Auto
Table 83.
Bit
Name
I2C bus interface (I2C)
SR1 register description (continued)
Function
6
10-bit addressing in Master mode
This bit is set by hardware when the master has sent the first byte in 10-bit address
mode. It is cleared by software reading SR2 register followed by a write in the DR
ADD10
register of the second address byte. It is also cleared by hardware when the
peripheral is disabled (PE = 0).
0: No ADD10 event occurred.
1: Master has sent first address byte (header)
5
Transmitter/Receiver
When BTF is set, TRA = 1 if a data byte has been transmitted. It is cleared
automatically when BTF is cleared. It is also cleared by hardware after detection of
Stop condition (STOPF = 1), loss of bus arbitration (ARLO = 1) or when the
interface is disabled (PE = 0).
0: Data byte received (if BTF = 1)
1: Data byte transmitted
TRA
4
Bus busy
This bit is set by hardware on detection of a Start condition and cleared by hardware
on detection of a Stop condition. It indicates a communication in progress on the
bus. The BUSY flag of the I2CSR1 register is cleared if a Bus Error occurs.
0: No communication on the bus
BUSY
1: Communication ongoing on the bus
Note: The BUSY flag is NOT updated when the interface is disabled (PE = 0). This
can have consequences when operating in Multimaster mode; that is, a second
active I2C master commencing a transfer with an unset BUSY bit can cause a
conflict resulting in lost data. A software workaround consists of checking that the
I2C is not busy before enabling the I2C Multimaster cell.
3
Byte transfer finished
This bit is set by hardware as soon as a byte is correctly received or transmitted with
interrupt generation if ITE = 1. It is cleared by software reading SR1 register
followed by a read or write of DR register. It is also cleared by hardware when the
interface is disabled (PE = 0).
Following a byte transmission, this bit is set after reception of the acknowledge clock
pulse. In case an address byte is sent, this bit is set only after the EV6 event (see
Figure 68). BTF is cleared by reading SR1 register followed by writing the next byte
in DR register.
Following a byte reception, this bit is set after transmission of the acknowledge clock
pulse if ACK = 1. BTF is cleared by reading SR1 register followed by reading the
byte from DR register.
The SCL line is held low while BTF = 1.
0: Byte transfer not done
1: Byte transfer succeeded
2
BTF
Address matched (Slave mode)
This bit is set by hardware as soon as the received slave address matched with the
OAR register content or a general call is recognized. An interrupt is generated if
ITE = 1. It is cleared by software reading SR1 register or by hardware when the
ADSL
interface is disabled (PE = 0).
The SCL line is held low while ADSL = 1.
0: Address mismatched or not received
1: Received address matched
171/247
I2C bus interface (I2C)
Table 83.
Bit
1
0
16.7.3
ST72321Bxxx-Auto
SR1 register description (continued)
Name
Function
M/SL
Master/Slave
This bit is set by hardware as soon as the interface is in Master mode (writing
START = 1). It is cleared by hardware after detecting a Stop condition on the bus or
a loss of arbitration (ARLO = 1). It is also cleared when the interface is disabled
(PE = 0).
0: Slave mode
1: Master mode
SB
Start bit (Master mode)
This bit is set by hardware as soon as the Start condition is generated (following a
write START = 1). An interrupt is generated if ITE = 1. It is cleared by software
reading SR1 register followed by writing the address byte in DR register. It is also
cleared by hardware when the interface is disabled (PE = 0).
0: No Start condition
1: Start condition generated
I2C status register 2 (SR2)
SR2
Reset value: 0000 0000 (00h)
7
6
Table 84.
Bit
Name
7:5
-
4
3
172/247
AF
5
4
3
2
1
0
Reserved
AF
STOPF
ARLO
BERR
GCAL
-
RO
RO
RO
RO
RO
SR2 register description
Function
Reserved. Forced to 0 by hardware.
Acknowledge failure
This bit is set by hardware when no acknowledge is returned. An interrupt is
generated if ITE = 1. It is cleared by software reading SR2 register or by hardware
when the interface is disabled (PE = 0).
The SCL line is not held low while AF = 1 but by other flags (SB or BTF) that are set
at the same time.
0: No acknowledge failure
1: Acknowledge failure
Note: When an AF event occurs, the SCL line is not held low; however, the SDA line
can remain low if the last bits transmitted are all 0. It is then necessary to release
both lines by software.
Stop detection (Slave mode)
This bit is set by hardware when a Stop condition is detected on the bus after an
acknowledge (if ACK = 1). An interrupt is generated if ITE = 1. It is cleared by
software reading SR2 register or by hardware when the interface is disabled
STOPF
(PE = 0).
The SCL line is not held low while STOPF = 1.
0: No Stop condition detected
1: Stop condition detected
ST72321Bxxx-Auto
Table 84.
Bit
16.7.4
I2C bus interface (I2C)
SR2 register description (continued)
Name
Function
2
Arbitration lost
This bit is set by hardware when the interface loses the arbitration of the bus to
another master. An interrupt is generated if ITE = 1. It is cleared by software reading
SR2 register or by hardware when the interface is disabled (PE = 0).
After an ARLO event the interface switches back automatically to Slave mode
(M/SL = 0).
The SCL line is not held low while ARLO = 1.
ARLO
0: No arbitration lost detected
1: Arbitration lost detected
Note: In a Multimaster environment, when the interface is configured in Master
Receive mode it does not perform arbitration during the reception of the
Acknowledge bit. Mishandling of the ARLO bit from the I2CSR2 register may occur
when a second master simultaneously requests the same data from the same slave
and the I2C master does not acknowledge the data. The ARLO bit is then left at 0
instead of being set.
1
Bus error
This bit is set by hardware when the interface detects a misplaced Start or Stop
condition. An interrupt is generated if ITE = 1. It is cleared by software reading SR2
register or by hardware when the interface is disabled (PE = 0).
The SCL line is not held low while BERR = 1.
BERR
0: No misplaced Start or Stop condition
1: Misplaced Start or Stop condition
Note: If a Bus Error occurs, a Stop or a repeated Start condition should be
generated by the Master to re-synchronize communication, get the transmission
acknowledged and the bus released for further communication.
0
General Call (Slave mode)
This bit is set by hardware when a general call address is detected on the bus while
ENGC = 1. It is cleared by hardware detecting a Stop condition (STOPF = 1) or
GCAL
when the interface is disabled (PE = 0).
0: No general call address detected on bus
1: General call address detected on bus
I2C clock control register (CCR)
CCR
Reset value: 0000 0000 (00h)
7
6
5
4
3
FM/SM
CC[6:0]
RW
RW
Table 85.
Bit
2
1
0
CCR register description
Name
Function
2C
7
Fast/Standard I mode
This bit is set and cleared by software. It is not cleared when the interface is
FM/SM
disabled (PE = 0).
0: Standard I2C mode
1: Fast I2C mode
173/247
I2C bus interface (I2C)
Table 85.
Bit
ST72321Bxxx-Auto
CCR register description (continued)
Name
Function
7-bit clock divider
These bits select the speed of the bus (fSCL) depending on the I2C mode. They are
6:0 CC[6:0]
not cleared when the interface is disabled (PE = 0).
Refer to the Electrical characteristics chapter for the table of values.
Note: The programmed fSCL assumes no load on SCL and SDA lines.
16.7.5
I2C data register (DR)
DR
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
D[7:0]
RW
Table 86.
Bit
7:0
16.7.6
DR register description
Name
Function
D[7:0]
8-bit Data Register
These bits contain the byte to be received or transmitted on the bus.
Transmitter mode: Byte transmission start automatically when the software writes
in the DR register.
Receiver mode: The first data byte is received automatically in the DR register
using the least significant bit of the address.
Then, the following data bytes are received one by one after reading the DR
register.
I2C own address register (OAR1)
OAR1
174/247
Reset value: 0000 0000 (00h)
7
6
5
4
3
2
1
0
ADD7
ADD6
ADD5
ADD4
ADD3
ADD2
ADD1
ADD0
RW
RW
RW
RW
RW
RW
RW
RW
ST72321Bxxx-Auto
I2C bus interface (I2C)
Table 87.
OAR1 register description
Function
Bit
Name
7-bit addressing mode
10-bit addressing mode
Interface address
These bits define the I2C bus address
7:1 ADD[7:1]
of the interface. They are not cleared
when the interface is disabled
(PE = 0).
0
ADD0
7:0 ADD[7:0]
16.7.7
Not applicable
Address direction bit
This bit is ‘don’t care’, the interface
acknowledges either 0 or 1. It is not
cleared when the interface is disabled
(PE = 0).
Address 01h is always ignored.
Interface address
These are the least significant bits of
the I2C bus address of the interface.
They are not cleared when the
interface is disabled (PE = 0).
Not applicable
I2C own address register (OAR2)
OAR2
Reset value: 0100 0000 (40h)
7
6
4
3
2
1
0
FR[1:0]
Reserved
ADD[9:8]
Reserved
RW
-
RW
-
Table 88.
Bit
5
OAR2 register description
Name
Function
7:6
FR[1:0]
Frequency bits
These bits are set by software only when the interface is disabled (PE = 0). To
configure the interface to I2C specified delays, select the value corresponding to
the CPU frequency fCPU.
00: fCPU < 6 MHz
01: fCPU = 6 to 8 MHz
5:3
-
2:1
ADD[9:8]
0
-
Reserved
Interface address
These are the most significant bits of the I2C bus address of the interface (10-bit
mode only). They are not cleared when the interface is disabled (PE = 0).
Reserved
175/247
I2C bus interface (I2C)
Table 89.
Address
(Hex.)
176/247
ST72321Bxxx-Auto
I2C register map and reset values
Register
label
7
6
5
4
3
2
1
0
0018h
I2CCR
Reset value
0
0
PE
0
ENGC
0
START
0
ACK
0
STOP
0
ITE
0
0019h
I2CSR1
Reset value
EVF
0
ADD10
0
TRA
0
BUSY
0
BTF
0
ADSL
0
M/SL
0
SB
0
001Ah
I2CSR2
Reset value
0
0
0
AF
0
STOPF
0
ARLO
0
BERR
0
GCAL
0
001Bh
I2CCCR
Reset value
FM/SM
0
CC6
0
CC5
0
CC4
0
CC3
0
CC2
0
CC1
0
CC0
0
001Ch
I2COAR1
Reset value
ADD7
0
ADD6
0
ADD5
0
ADD4
0
ADD3
0
ADD2
0
ADD1
0
ADD0
0
001Dh
I2COAR2
Reset value
FR1
0
FR0
1
0
0
0
ADD9
0
ADD8
0
0
001Eh
I2CDR
Reset value
MSB
0
0
0
0
0
0
0
LSB
0
ST72321Bxxx-Auto
10-bit A/D converter (ADC)
17
10-bit A/D converter (ADC)
17.1
Introduction
The on-chip Analog to Digital Converter (ADC) peripheral is a 10-bit, successive
approximation converter with internal sample and hold circuitry. This peripheral has up to 16
multiplexed analog input channels (refer to device pin out description) that allow the
peripheral to convert the analog voltage levels from up to 16 different sources.
The result of the conversion is stored in a 10-bit data register. The A/D converter is
controlled through a control/status register.
17.2
Main features
●
10-bit conversion
●
Up to 16 channels with multiplexed input
●
Linear successive approximation
●
Data register (DR) which contains the results
●
Conversion complete status flag
●
On/off bit (to reduce consumption)
The block diagram is shown in Figure 70.
Figure 70. ADC block diagram
fCPU
DIV 4
0
DIV 2
EOC
fADC
1
SPEED ADON
CH3
0
CH2
CH1
CH0
ADCCSR
4
AIN0
AIN1
ANALOG TO DIGITAL
ANALOG
MUX
CONVERTER
AINx
ADCDRH
D9
D8
ADCDRL
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
D1
D0
177/247
10-bit A/D converter (ADC)
17.3
ST72321Bxxx-Auto
Functional description
The conversion is monotonic, meaning that the result never decreases if the analog input
does not and never increases if the analog input does not.
If the input voltage (VAIN) is greater than VAREF (high-level voltage reference) then the
conversion result is FFh in the ADCDRH register and 03h in the ADCDRL register (without
overflow indication).
If the input voltage (VAIN) is lower than VSSA (low-level voltage reference) then the
conversion result in the ADCDRH and ADCDRL registers is 00 00h.
The A/D converter is linear and the digital result of the conversion is stored in the ADCDRH
and ADCDRL registers. The accuracy of the conversion is described in Chapter 19:
Electrical characteristics.
RAIN is the maximum recommended impedance for an analog input signal. If the impedance
is too high, this will result in a loss of accuracy due to leakage and sampling not being
completed in the allotted time.
17.3.1
A/D converter configuration
The analog input ports must be configured as input, no pull-up, no interrupt. Refer to the
Chapter 9: I/O ports. Using these pins as analog inputs does not affect the ability of the port
to be read as a logic input.
In the ADCCSR register:
●
17.3.2
Select the CS[3:0] bits to assign the analog channel to convert.
Starting the conversion
In the ADCCSR register:
●
Set the ADON bit to enable the A/D converter and to start the conversion. From this
time on, the ADC performs a continuous conversion of the selected channel.
When a conversion is complete:
●
The EOC bit is set by hardware.
●
The result is in the ADCDR registers.
A read to the ADCDRH or a write to any bit of the ADCCSR register resets the EOC bit.
To read the 10 bits, perform the following steps:
Note:
1.
Poll the EOC bit.
2.
Read the ADCDRL register.
3.
Read the ADCDRH register. This clears EOC automatically.
The data is not latched, so both the low and the high data register must be read before the
next conversion is complete, so it is recommended to disable interrupts while reading the
conversion result.
To read only 8 bits, perform the following steps:
178/247
1.
Poll the EOC bit.
2.
Read the ADCDRH register. This clears EOC automatically.
ST72321Bxxx-Auto
17.3.3
10-bit A/D converter (ADC)
Changing the conversion channel
The application can change channels during conversion. When software modifies the
CH[3:0] bits in the ADCCSR register, the current conversion is stopped, the EOC bit is
cleared, and the A/D converter starts converting the newly selected channel.
17.4
Low power modes
Note:
The A/D converter may be disabled by resetting the ADON bit. This feature allows reduced
power consumption when no conversion is needed and between single shot conversions.
Table 90.
Effect of low power modes on ADC
Mode
17.5
Effect
Wait
No effect on A/D converter
Halt
A/D converter disabled.
After wake-up from Halt mode, the A/D converter requires a stabilization time tSTAB (see
Electrical characteristics) before accurate conversions can be performed.
Interrupts
None.
17.6
ADC registers
17.6.1
Control/status register (ADCCSR)
ADCCSR
7
6
5
4
EOC
SPEED
ADON
Reserved
CH[3:0]
RO
RW
RW
-
RW
Table 91.
Bit
7
6
Reset value: 0000 0000 (00h)
Name
EOC
3
2
1
0
ADCCSR register description
Function
End of Conversion
This bit is set by hardware. It is cleared by hardware when software reads the
ADCDRH register or writes to any bit of the ADCCSR register.
0: Conversion is not complete
1: Conversion complete
ADC clock selection
This bit is set and cleared by software.
SPEED
0: fADC = fCPU/4
1: fADC = fCPU/2
179/247
10-bit A/D converter (ADC)
Table 91.
Bit
ST72321Bxxx-Auto
ADCCSR register description (continued)
Name
Function
A/D Converter on
This bit is set and cleared by software.
ADON
0: Disable ADC and stop conversion
1: Enable ADC and start conversion
5
4
-
Reserved. Must be kept cleared
Channel Selection
These bits are set and cleared by software. They select the analog input to convert.
0000: Channel pin = AIN0
0001: Channel pin = AIN1
0010: Channel pin = AIN2
0011: Channel pin = AIN3
0100: Channel pin = AIN4
0101: Channel pin = AIN5
0110: Channel pin = AIN6
0111: Channel pin = AIN7
3:0 CH[3:0]
1000: Channel pin = AIN8
1001: Channel pin = AIN9
1010: Channel pin = AIN10
1011: Channel pin = AIN11
1100: Channel pin = AIN12
1101: Channel pin = AIN13
1110: Channel pin = AIN14
1111: Channel pin = AIN15
Note: The number of channels is device dependent. Refer to the device pinout
description.
17.6.2
Data register (ADCDRH)
ADCDRH
7
Reset value: 0000 0000 (00h)
6
5
4
3
D[9:2]
RO
Table 92.
180/247
Bit
Name
7:0
D[9:2]
ADCDRH register description
Function
MSB of Converted Analog Value
2
1
0
ST72321Bxxx-Auto
17.6.3
10-bit A/D converter (ADC)
Data register (ADCDRL)
ADCDRL
Reset value: 0000 0000 (00h)
7
6
Table 93.
17.6.4
5
4
3
2
1
0
Reserved
D[1:0]
-
RO
ADCDRL register description
Bit
Name
7:2
-
1:0
D[1:0]
Function
Reserved. Forced by hardware to 0.
LSB of Converted Analog Value
ADC register map and reset values
Table 94.
Address
(Hex.)
ADC register map and reset values
Register
label
7
6
5
4
3
2
1
0
0070h
ADCCSR
Reset value
EOC
0
SPEED
0
ADON
0
0
CH3
0
CH2
0
CH1
0
CH0
0
0071h
ADCDRH
Reset value
D9
0
D8
0
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
0072h
ADCDRL
Reset value
0
0
0
0
0
0
D1
0
D0
0
181/247
Instruction set
ST72321Bxxx-Auto
18
Instruction set
18.1
CPU addressing modes
The CPU features 17 different addressing modes which can be classified in seven main
groups as listed in the following table:
Table 95.
Addressing modes
Group
Example
Inherent
NOP
Immediate
LD A,#$55
Direct
LD A,$55
Indexed
LD A,($55,X)
Indirect
LD A,([$55],X)
Relative
JRNE loop
Bit operation
BSET
byte,#5
The CPU instruction set is designed to minimize the number of bytes required per
instruction: To do so, most of the addressing modes may be divided in two submodes called
long and short:
●
Long addressing mode is more powerful because it can use the full 64 Kbyte address
space; however, it uses more bytes and more CPU cycles.
●
Short addressing mode is less powerful because it can generally only access page
zero (0000h - 00FFh range), but the instruction size is more compact, and faster. All
memory to memory instructions use short addressing modes only (CLR, CPL, NEG,
BSET, BRES, BTJT, BTJF, INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP).
The ST7 Assembler optimizes the use of long and short addressing modes.
Table 96.
CPU addressing mode overview
Mode
182/247
Syntax
Destination
Pointer
address
(Hex.)
Pointer
size
(Hex.)
Length
(bytes)
Inherent
nop
+0
Immediate
ld A,#$55
+1
Short
Direct
ld A,$10
00..FF
+1
Long
Direct
ld A,$1000
0000..FFFF
+2
No Offset
Direct
Indexed
ld A,(X)
00..FF
+0
Short
Direct
Indexed
ld A,($10,X)
00..1FE
+1
Long
Direct
Indexed
ld A,($1000,X)
0000..FFFF
+2
Short
Indirect
ld A,[$10]
00..FF
00..FF
byte
+2
Long
Indirect
ld A,[$10.w]
0000..FFFF
00..FF
word
+2
Short
Indirect
ld A,([$10],X)
00..1FE
00..FF
byte
+2
Indexed
ST72321Bxxx-Auto
Table 96.
Instruction set
CPU addressing mode overview (continued)
Syntax
Destination
Pointer
address
(Hex.)
Pointer
size
(Hex.)
Length
(bytes)
ld A,([$10.w],X)
0000..FFFF
00..FF
word
+2
Mode
18.1.1
Long
Indirect
Indexed
Relative
Direct
jrne loop
PC+/-127
Relative
Indirect
jrne [$10]
PC+/-127
Bit
Direct
bset $10,#7
00..FF
Bit
Indirect
bset [$10],#7
00..FF
Bit
Direct
Relative
btjt $10,#7,skip
00..FF
Bit
Indirect
Relative
btjt [$10],#7,skip 00..FF
+1
00..FF
byte
+2
+1
00..FF
byte
+2
+2
00..FF
byte
+3
Inherent
All Inherent instructions consist of a single byte. The opcode fully specifies all the required
information for the CPU to process the operation.
Table 97.
Inherent instructions
Instruction
Function
NOP
No operation
TRAP
S/W Interrupt
WFI
Wait For Interrupt (Low Power Mode)
HALT
Halt Oscillator (Lowest Power Mode)
RET
Sub-routine Return
IRET
Interrupt Sub-routine Return
SIM
Set Interrupt Mask (level 3)
RIM
Reset Interrupt Mask (level 0)
SCF
Set Carry Flag
RCF
Reset Carry Flag
RSP
Reset Stack Pointer
LD
Load
CLR
Clear
PUSH/POP
Push/Pop to/from the stack
INC/DEC
Increment/Decrement
TNZ
Test Negative or Zero
CPL, NEG
1 or 2 Complement
MUL
Byte Multiplication
SLL, SRL, SRA, RLC, RRC
Shift and Rotate Operations
SWAP
Swap Nibbles
183/247
Instruction set
18.1.2
ST72321Bxxx-Auto
Immediate
Immediate instructions have 2 bytes. The first byte contains the opcode and the second byte
contains the operand value.
Table 98.
Immediate instructions
Instruction
18.1.3
Function
LD
Load
CP
Compare
BCP
Bit Compare
AND, OR, XOR
Logical Operations
ADC, ADD, SUB, SBC
Arithmetic Operations
Direct
In Direct instructions, the operands are referenced by their memory address.
The direct addressing mode consists of two submodes:
Direct (short)
The address is a byte, thus requires only one byte after the opcode, but only allows 00 - FF
addressing space.
Direct (long)
The address is a word, thus allowing 64 Kbyte addressing space, but requires 2 bytes after
the opcode.
18.1.4
Indexed (no offset, short, long)
In this mode, the operand is referenced by its memory address, which is defined by the
unsigned addition of an index register (X or Y) with an offset.
The indexed addressing mode consists of three submodes:
Indexed (no offset)
There is no offset, (no extra byte after the opcode), and allows 00 - FF addressing space.
Indexed (short)
The offset is a byte, thus requires only one byte after the opcode and allows 00 - 1FE
addressing space.
Indexed (long)
The offset is a word, thus allowing 64 Kbyte addressing space and requires 2 bytes after the
opcode.
184/247
ST72321Bxxx-Auto
18.1.5
Instruction set
Indirect (short, long)
The required data byte to do the operation is found by its memory address, located in
memory (pointer).
The pointer address follows the opcode. The indirect addressing mode consists of two
submodes:
Indirect (short)
The pointer address is a byte, the pointer size is a byte, thus allowing 00 - FF addressing
space, and requires 1 byte after the opcode.
Indirect (long)
The pointer address is a byte, the pointer size is a word, thus allowing 64 Kbyte addressing
space, and requires 1 byte after the opcode.
18.1.6
Indirect indexed (short, long)
This is a combination of indirect and short indexed addressing modes. The operand is
referenced by its memory address, which is defined by the unsigned addition of an index
register value (X or Y) with a pointer value located in memory. The pointer address follows
the opcode.
The indirect indexed addressing mode consists of two submodes:
Indirect indexed (short)
The pointer address is a byte, the pointer size is a byte, thus allowing 00 - 1FE addressing
space, and requires 1 byte after the opcode.
Indirect indexed (long)
The pointer address is a byte, the pointer size is a word, thus allowing 64 Kbyte addressing
space, and requires 1 byte after the opcode.
Table 99.
Instructions supporting direct, indexed, indirect, and indirect indexed
addressing modes
Type
Long and short instructions
Instruction
Function
LD
Load
CP
Compare
AND, OR, XOR
Logical operations
ADC, ADD, SUB, SBC
Arithmetic Additions/Subtractions
operations
BCP
Bit Compare
185/247
Instruction set
Table 99.
ST72321Bxxx-Auto
Instructions supporting direct, indexed, indirect, and indirect indexed
addressing modes (continued)
Type
Instruction
Short instructions only
Function
CLR
Clear
INC, DEC
Increment/Decrement
TNZ
Test Negative or Zero
CPL, NEG
1 or 2 Complement
BSET, BRES
Bit Operations
BTJT, BTJF
Bit Test and Jump Operations
SLL, SRL, SRA, RLC, RRC Shift and Rotate Operations
18.1.7
SWAP
Swap Nibbles
CALL, JP
Call or Jump subroutine
Relative (direct, indirect)
This addressing mode is used to modify the PC register value, by adding an 8-bit signed
offset to it.
Table 100. Available relative direct/indirect instructions
Instruction
Function
JRxx
Conditional Jump
CALLR
Call Relative
The relative addressing mode consists of two submodes:
Relative (direct)
The offset is following the opcode.
Relative (indirect)
The offset is defined in memory, which address follows the opcode.
18.2
Instruction groups
The ST7 family devices use an Instruction Set consisting of 63 instructions. The instructions
may be subdivided into 13 main groups as illustrated in the following table:
Table 101. Instruction groups
Group
Load and Transfer
LD
CLR
PUSH
POP
Increment/Decrement
INC
DEC
Compare and Tests
CP
TNZ
Stack operation
186/247
Instructions
RSP
BCP
ST72321Bxxx-Auto
Instruction set
Table 101. Instruction groups (continued)
Group
Logical operations
AND
OR
XOR
CPL
NEG
Bit Operation
BSET
BRES
Conditional Bit Test and Branch
BTJT
BTJF
Arithmetic operations
ADC
ADD
SUB
SBC
MUL
Shift and Rotates
SLL
SRL
SRA
RLC
RRC
SWAP
SLA
Unconditional Jump or Call
JRA
JRT
JRF
JP
CALL
CALLR
NOP
Conditional Branch
JRxx
Interruption management
TRAP
WFI
HALT
IRET
SIM
RIM
SCF
RCF
Condition Code Flag modification
18.2.1
Instructions
RET
Using a prebyte
The instructions are described with one to four opcodes.
In order to extend the number of available opcodes for an 8-bit CPU (256 opcodes), three
different prebyte opcodes are defined. These prebytes modify the meaning of the instruction
they precede.
The whole instruction becomes:
PC - 2
End of previous instruction
PC - 1
Prebyte
PC
Opcode
PC + 1
Additional word (0 to 2) according to the number of bytes required to
compute the effective address
These prebytes enable instruction in Y as well as indirect addressing modes to be
implemented. They precede the opcode of the instruction in X or the instruction using direct
addressing mode. The prebytes are:
PDY 90
Replace an X based instruction using immediate, direct, indexed, or
inherent addressing mode by a Y one.
PIX 92
Replace an instruction using direct, direct bit, or direct relative
addressing mode to an instruction using the corresponding indirect
addressing mode.
It also changes an instruction using X indexed addressing mode to an
instruction using indirect X indexed addressing mode.
PIY 91
Replace an instruction using X indirect indexed addressing mode by a Y
one.
187/247
Instruction set
ST72321Bxxx-Auto
Table 102. Instruction set overview
Mnemo
Description
Function/Example
Dst
Src
I1
H
I0
N
Z
C
ADC
Add with Carry
A=A+M+C
A
M
H
N
Z
C
ADD
Addition
A=A+M
A
M
H
N
Z
C
AND
Logical And
A=A.M
A
M
N
Z
BCP
Bit compare A, Memory
tst (A . M)
A
M
N
Z
BRES
Bit Reset
bres Byte, #3
M
BSET
Bit Set
bset Byte, #3
M
BTJF
Jump if bit is false (0)
btjf Byte, #3, Jmp1
M
C
BTJT
Jump if bit is true (1)
btjt Byte, #3, Jmp1
M
C
CALL
Call subroutine
CALLR Call subroutine relative
CLR
Clear
CP
Arithmetic Compare
tst(Reg - M)
reg
CPL
One Complement
A = FFH-A
DEC
Decrement
dec Y
HALT
Halt
IRET
Interrupt routine return
Pop CC, A, X, PC
INC
Increment
inc X
JP
Absolute Jump
jp [TBL.w]
JRA
Jump relative always
JRT
Jump relative
JRF
Never jump
jrf *
JRIH
Jump if ext. INT pin = 1
(ext. INT pin high)
JRIL
Jump if ext. INT pin = 0
(ext. INT pin low)
JRH
Jump if H = 1
H=1?
JRNH
Jump if H = 0
H=0?
JRM
Jump if I1:0 = 11
I1:0 = 11 ?
JRNM
Jump if I1:0 <> 11
I1:0 <> 11 ?
JRMI
Jump if N = 1 (minus)
N=1?
JRPL
Jump if N = 0 (plus)
N=0?
JREQ
Jump if Z = 1 (equal)
Z=1?
JRNE
Jump if Z = 0 (not equal)
Z=0?
JRC
Jump if C = 1
C=1?
JRNC
Jump if C = 0
C=0?
JRULT
Jump if C = 1
Unsigned <
JRUGE Jump if C = 0
188/247
reg, M
0
1
N
Z
C
reg, M
N
Z
1
reg, M
N
Z
N
Z
N
Z
M
1
Jmp if unsigned >=
I1
reg, M
0
H
I0
C
ST72321Bxxx-Auto
Instruction set
Table 102. Instruction set overview (continued)
Mnemo
Description
Function/Example
Dst
Src
JRUGT Jump if (C + Z = 0)
Unsigned >
JRULE
Jump if (C + Z = 1)
Unsigned <=
LD
Load
dst <= src
reg, M
M, reg
MUL
Multiply
X,A = X * A
A, X, Y
X, Y, A
NEG
Negate (2's compl)
neg $10
reg, M
NOP
No Operation
OR
OR operation
A=A+M
A
M
pop reg
reg
M
POP
Pop from the Stack
pop CC
CC
M
M
reg, CC
I1
H
I0
N
Z
N
Z
0
I1
H
C
0
I0
N
Z
N
Z
N
Z
C
C
PUSH
Push onto the Stack
push Y
RCF
Reset carry flag
C=0
RET
Subroutine Return
RIM
Enable Interrupts
I1:0 = 10 (level 0)
RLC
Rotate left true C
C <= A <= C
reg, M
N
Z
C
RRC
Rotate right true C
C => A => C
reg, M
N
Z
C
RSP
Reset Stack Pointer
S = Max allowed
SBC
Subtract with Carry
A=A-M-C
N
Z
C
SCF
Set carry flag
C=1
SIM
Disable Interrupts
I1:0 = 11 (level 3)
SLA
Shift left Arithmetic
C <= A <= 0
reg, M
N
Z
C
SLL
Shift left Logic
C <= A <= 0
reg, M
N
Z
C
SRL
Shift right Logic
0 => A => C
reg, M
0
Z
C
SRA
Shift right Arithmetic
A7 => A => C
reg, M
N
Z
C
SUB
Subtraction
A=A-M
A
N
Z
C
SWAP
SWAP nibbles
A7-A4 <=> A3-A0
reg, M
N
Z
TNZ
Test for Neg & Zero
tnz lbl1
N
Z
TRAP
S/W trap
S/W interrupt
WFI
Wait for Interrupt
XOR
Exclusive OR
N
Z
A = A XOR M
0
1
A
0
M
1
1
A
1
M
M
1
1
1
0
189/247
Electrical characteristics
ST72321Bxxx-Auto
19
Electrical characteristics
19.1
Parameter conditions
Unless otherwise specified, all voltages are referred to VSS.
19.1.1
Minimum and maximum values
Unless otherwise specified the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TA = 25°C and TA = TAmax (given by the
selected temperature range).
Data based on characterization results, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean ±3Σ).
19.1.2
Typical values
Unless otherwise specified, typical data is based on TA = 25°C, VDD = 5V. The typical values
are given only as design guidelines and are not tested.
19.1.3
Typical curves
Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.
19.1.4
Loading capacitor
The loading conditions used for pin parameter measurement are shown in Figure 71.
Figure 71. Pin loading conditions
ST7 PIN
CL
19.1.5
Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 72.
Figure 72. Pin input voltage
ST7 PIN
VIN
190/223
ST72321Bxxx-Auto
19.2
Electrical characteristics
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
19.2.1
Voltage characteristics
Table 103. Voltage characteristics
Symbol
Ratings
Maximum value
VDD - VSS
Supply voltage
6.5
VPP - VSS
Programming voltage
13
VIN(1)
V
Input voltage on true open-drain pin
Input voltage on any other pin
|∆VDDx| and |∆VSSx| Variations between different digital power pins
|VSSA - VSSx|
Unit
Variations between digital and analog ground pins
VESD(HBM)
Electrostatic discharge voltage (Human Body Model)
VESD(MM)
Electrostatic discharge voltage (Machine Model)
VSS - 0.3 to 6.5
VSS - 0.3 to VDD + 0.3
50
mV
50
See Section 19.7.3 on page 206.
1. Directly connecting the RESET and I/O pins to VDD or VSS could damage the device if an unintentional internal reset is
generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter). To
guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7kΩ for RESET,
10kΩ for I/Os). For the same reason, unused I/O pins must not be directly tied to VDD or VSS.
191/223
Electrical characteristics
19.2.2
ST72321Bxxx-Auto
Current characteristics
Table 104. Current characteristics
Symbol
Ratings
IVDD
Total current into VDD power lines (source)(1)
IVSS
Total current out of VSS ground lines (sink)(1)
IIO
Maximum value Unit
150
Output current sunk by any standard I/O and control pin
20
Output current sunk by any high sink I/O pin
40
Output current source by any I/Os and control pin
- 25
Injected current on VPP pin
±5
Injected current on RESET pin
±5
IINJ(PIN)(2)(3) Injected current on OSC1 and OSC2 pins
+5
(4)(5)
±5
Injected current on any other pin
ΣIINJ(PIN)
Total injected current (sum of all I/O and control
mA
±5
Injected current on PC6 pin (Flash devices only)
(2)
mA
pins)(4)
± 25
1. All power (VDD) and ground (VSS) lines must always be connected to the external supply.
2. IINJ(PIN) must never be exceeded. This is implicitly ensured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. For true open-drain
pads, there is no positive injection current, and the corresponding VIN maximum must always be respected.
3. Negative injection may disturb the analog performance of the device. See Note 1 in Table 135: ADC
accuracy on page 223.
4. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
5. True open-drain I/O port pins do not accept positive injection.
19.2.3
Thermal characteristics
Table 105. Thermal characteristics
Symbol
TSTG
TJ
192/223
Ratings
Storage temperature range
Value
Unit
-65 to +150
°C
Maximum junction temperature (see Section 20.2: Thermal characteristics on page 227)
ST72321Bxxx-Auto
Electrical characteristics
19.3
Operating conditions
19.3.1
General operating conditions
Table 106. General operating conditions
Symbol
fCPU
VDD
Parameter
Conditions
Internal clock frequency
Standard voltage range (except Flash
Write/Erase)
Operating voltage for Flash Write/Erase
Min
Max
Unit
0
8
MHz
3.8
5.5
V
VPP = 11.4 to 12.6V
4.5
A suffix version
TA
Ambient temperature range
B suffix
version(1)
C suffix version
5.5
85
-40
105
°C
125
1. Available only on ROM and FASTROM devices. Refer to Section 21.2: ROM device ordering information
and transfer of customer code on page 232.
Figure 73. fCPU max versus VDD
fCPU [MHz]
FUNCTIONALITY
GUARANTEED
IN THIS AREA
(UNLESS
OTHERWISE
SPECIFIED
IN THE TABLES
OF PARAMETRIC
DATA)
8
FUNCTIONALITY
NOT GUARANTEED
IN THIS AREA
6
4
2
1
0
3.5
3.8 4.0
4.5
5.5
SUPPLY VOLTAGE [V]
193/223
Electrical characteristics
19.3.2
ST72321Bxxx-Auto
Operating conditions with low voltage detector (LVD)
Subject to general operating conditions for VDD, fCPU, and TA.
Table 107. Operating conditions with low voltage detector (LVD)
Symbol
Parameter
Conditions
VD level = High in option byte
Reset release threshold
VIT+(LVD)
(VDD rise)
Reset generation threshold
(VDD fall)
Max
4.0(1)
4.2
4.5
VD level = Med. in option byte
3.55
3.75
4.0(1)
VD level = Low in option byte(2)
2.95(1)
3.15
3.35(1)
3.8
4.0
4.25(1)
VD level = Med. in option byte(2)
3.35(1)
3.55
3.75(1)
VD level = Low in option byte(2)
2.8(1)
3.0
3.15(1)
LVD voltage threshold
hysteresis
VIT+(LVD)-VIT-(LVD)
VtPOR
VDD rise time(2)(3)
LVD enabled
tg(VDD)
VDD glitches filtered (not
detected) by LVD(4)
Vhys(LVD)
Typ
(1)
(2)
VD level = High in option byte
VIT-(LVD)
Min
200
6µs/V
Unit
V
mV
100ms/V
-
40
ns
1. Data based on characterization results, tested in production for ROM devices only
2. Data based on characterization results, not tested in production
3. When VtPOR is faster than 100µs/V, the Reset signal is released after a delay of maximum 42µs after VDD crosses the
VIT+(LVD) threshold.
4. If the medium or low thresholds are selected, the detection may occur outside the specified operating voltage range. Below
3.8V, device operation is not guaranteed.
19.3.3
Auxiliary voltage detector (AVD) thresholds
Subject to general operating conditions for VDD, fCPU, and TA.
Table 108. Auxiliary voltage detector (AVD) thresholds
Symbol
VIT+(AVD)
VIT-(AVD)
Parameter
1⇒0 AVDF flag toggle threshold
(VDD rise)
0⇒1 AVDF flag toggle threshold
(VDD fall)
Vhys(AVD) AVD voltage threshold hysteresis
∆VIT-
Conditions
Min
Typ
Max
VD level = High in option byte
4.4(1)
4.6
4.9(1)
VD level = Med. in option byte
3.95(1)
4.15
4.4(1)
VD level = Low in option byte
3.4(1)
3.6
3.8(1)
VD level = High in option byte
4.2(1)
4.4
4.65(1)
VD level = Med. in option byte
3.75(1)
4.0
4.2(1)
VD level = Low in option byte
3.2(1)
3.4
3.6(1)
VIT+(AVD)-VIT-(AVD)
Voltage drop between AVD flag set
VIT-(AVD)-VIT-(LVD)
and LVD reset activated
1. Data based on characterization results, tested in production for ROM devices only
194/223
Unit
V
200
mV
450
ST72321Bxxx-Auto
19.3.4
Electrical characteristics
External voltage detector (EVD) thresholds
Subject to general operating conditions for VDD, fCPU, and TA.
Table 109. External voltage detector (EVD) thresholds
Symbol
Parameter
Conditions
VIT+(EVD)
1⇒0 AVDF flag toggle threshold (VDD rise(1)
VIT-(EVD)
0⇒1 AVDF flag toggle threshold (VDD fall)
(1)
Vhys(EVD)
EVD voltage threshold hysteresis
Min
Typ
Max
1.15
1.26
1.35
1.1
1.2
1.3
Unit
V
VIT+(EVD)-VIT-(EVD)
200
mV
1. Data based on characterization results, not tested in production
195/223
Electrical characteristics
19.4
ST72321Bxxx-Auto
Supply current characteristics
The following current consumption specified for the ST7 functional operating modes over
temperature range does not take into account the clock source current consumption. To
obtain the total device consumption, the two current values must be added (except for Halt
mode, for which the clock is stopped).
19.4.1
Current consumption
Table 110. Current consumption
Flash devices
Symbol
Parameter
Conditions
Max(1)
Typ
Max(1)
1.3
2.0
3.6
7.1
3.0
5.0
8.0
15.0
0.5
1.2
2.2
4.8
1.0
2.0
4.0
8.0
mA
600
700
800
1100
2700
3000
3600
4000
100
200
300
500
600
700
800
950
µA
0.8
1.2
2.0
3.5
3.0
4.0
5.0
7.0
0.5
0.8
1.5
3.0
1.0
1.3
2.2
4.0
mA
580
650
770
1050
1200
1300
1800
2000
50
90
180
350
100
150
300
600
µA
-40°C < TA < +85°C
<1
10
<1
10
-40°C < TA < +125°C
5
50
<1
50
415
430
460
550
525
550
600
700
15
30
60
120
25
50
100
200
fOSC = 2 MHz, fCPU = 1 MHz
fOSC = 4 MHz, fCPU = 2 MHz
fOSC = 8 MHz, fCPU = 4 MHz
fOSC = 16 MHz, fCPU = 8 MHz
Supply current in Slow
mode(2)
fOSC = 2 MHz, fCPU = 62.5 kHz
fOSC = 4 MHz, fCPU = 125 kHz
fOSC = 8 MHz, fCPU = 250 kHz
fOSC = 16 MHz, fCPU = 500 kHz
Supply current in Wait
mode(2)
fOSC = 2 MHz, fCPU = 1 MHz
fOSC = 4 MHz, fCPU = 2 MHz
fOSC = 8 MHz, fCPU = 4 MHz
fOSC = 16 MHz, fCPU = 8 MHz
Supply current in Slow Wait
mode(2)
fOSC = 2 MHz, fCPU = 62.5 kHz
fOSC = 4 MHz, fCPU = 125 kHz
fOSC = 8 MHz, fCPU = 250 kHz
fOSC = 16 MHz, fCPU = 500 kHz
Supply current in Halt
mode(3)
Supply current in Active Halt
mode(4)
Unit
Typ
Supply current in Run
mode(2)
IDD
ROM devices
fOSC = 2 MHz
fOSC = 4 MHz
fOSC = 8 MHz
fOSC = 16 MHz
µA
µA
1. Data based on characterization results, tested in production at VDD max. and fCPU max.
2. Measurements are done in the following conditions:
- Program executed from RAM, CPU running with RAM access
- All I/O pins in input mode with a static value at VDD or VSS (no load)
- All peripherals in reset state
- LVD disabled
- Clock input (OSC1) driven by external square wave
- In Slow and Slow Wait mode, fCPU is based on fOSC divided by 32
- To obtain the total current consumption of the device, add the clock source (Section 19.4.2) and the peripheral power
consumption (Section 19.4.3).
3. All I/O pins in push-pull 0 mode (when applicable) with a static value at VDD or VSS (no load), LVD disabled. Data based on
characterization results, tested in production at VDD max. and fCPU max.
4. Data based on characterization results, not tested in production. All I/O pins in push-pull 0 mode (when applicable) with a
static value at VDD or VSS (no load); clock input (OSC1) driven by external square wave, LVD disabled. To obtain the total
current consumption of the device, add the clock source consumption (Section 19.4.2).
196/223
ST72321Bxxx-Auto
19.4.2
Electrical characteristics
Supply and clock managers
The previous current consumption specified for the ST7 functional operating modes over
temperature range does not take into account the clock source current consumption. To
obtain the total device consumption, the two current values must be added (except for Halt
mode).
Table 111. Oscillators, PLL and LVD current consumption
Symbol
Parameter
Conditions
IDD(RCINT) Supply current of internal RC oscillator
IDD(RES)
Supply current of resonator
oscillator(1)(2)
IDD(PLL)
PLL supply current
IDD(LVD)
LVD supply current
Typ
Max
Unit
625
see section 19.5.3 on page
200
µA
360
VDD = 5V
150
300
1. Data based on characterization results done with the external components specified in Section 19.5.3, not
tested in production
2. As the oscillator is based on a current source, the consumption does not depend on the voltage.
197/223
Electrical characteristics
19.4.3
ST72321Bxxx-Auto
On-chip peripherals
Measured on LQFP64 generic board TA = 25°C, fCPU = 4 MHz.
Table 112. On-chip peripherals current consumption
Symbol
IDD(TIM)
IDD(ART)
Parameter
16-bit timer supply current(1)
ART PWM supply current
Typ
Unit
VDD = 5.0V
50
µA
VDD = 5.0V
75
µA
VDD = 5.0V
400
µA
VDD = 5.0V
175
µA
VDD = 5.0V
400
µA
(3)
IDD(SPI)
SPI supply current
IDD(SCI)
SCI supply current(4)
IDD(I2C)
I2C supply current(5)
IDD(ADC)
(2)
Conditions
ADC supply current when
converting(6)
1. Data based on a differential IDD measurement between reset configuration (timer counter running at
fCPU/4) and timer counter stopped (only TIMD bit set). Data valid for one timer.
2. Data based on a differential IDD measurement between reset configuration (timer stopped) and timer
counter enabled (only TCE bit set).
3. Data based on a differential IDD measurement between reset configuration (SPI disabled) and a permanent
SPI master communication at maximum speed (data sent equal to 55h). This measurement includes the
pad toggling consumption.
4. Data based on a differential IDD measurement between SCI low power state (SCID = 1) and a permanent
SCI data transmit sequence.
5. Data based on a differential IDD measurement between reset configuration (I2C disabled) and a permanent
I2C master communication at 100 kHz (data sent equal to 55h). This measurement includes the pad
toggling consumption (27k ohm external pull-up on clock and data lines).
6. Data based on a differential IDD measurement between reset configuration and continuous A/D
conversions.
198/223
ST72321Bxxx-Auto
19.5
Electrical characteristics
Clock and timing characteristics
Subject to general operating conditions for VDD, fCPU, and TA.
19.5.1
General timings
Table 113. General timings
Symbol
Parameter
tc(INST)
Instruction cycle time
tv(IT)
Conditions
fCPU = 8 MHz
Interrupt reaction time(2)
tv(IT) = ∆tc(INST) + 10
fCPU = 8 MHz
Min
Typ(1)
Max
Unit
2
3
12
tCPU
250
375
1500
ns
10
22
tCPU
1.25
2.75
µs
1. Data based on typical application software.
2. Time measured between interrupt event and interrupt vector fetch. ∆tc(INST) is the number of tCPU cycles
needed to finish the current instruction execution.
19.5.2
External clock source
Table 114. External clock source
Symbol
Parameter
Conditions
VOSC1H
OSC1 input pin high level voltage
0.7xVDD
VDD
VOSC1L
OSC1 input pin low level voltage
VSS
0.3xVDD
tw(OSC1H)
OSC1 high or low time(1)
tw(OSC1L)
tr(OSC1)
tf(OSC1)
Ilkg
Min
See Figure 74
Typ
Max
Unit
V
5
ns
OSC1 rise or fall time(1)
15
OSC1 input leakage current
VSS < VIN < VDD
±1
µA
1. Data based on design simulation and/or technology characteristics, not tested in production.
Figure 74. Typical application with an external clock source
90%
VOSC1H
10%
VOSC1L
tr(OSC1)
tf(OSC1)
OSC2
tw(OSC1H)
tw(OSC1L)
Not connected internally
fOSC
EXTERNAL
CLOCK SOURCE
OSC1
Ilkg
ST72XXX
199/223
Electrical characteristics
19.5.3
ST72321Bxxx-Auto
Crystal and ceramic resonator oscillators
The ST7 internal clock can be supplied with four different crystal/ceramic resonator
oscillators. All the information given in this paragraph is based on characterization results
with specified typical external components. In the application, the resonator and the load
capacitors have to be placed as close as possible to the oscillator pins in order to minimize
output distortion and start-up stabilization time. Refer to the crystal/ceramic resonator
manufacturer for more details (such as frequency, package or accuracy).
Table 115. Crystal and ceramic resonator oscillators
Symbol
fOSC
Parameter
Oscillator
Conditions
frequency(1)
LP:
MP:
MS:
HS:
Min Typ Max Unit
Low power oscillator
Medium power oscillator
Medium speed oscillator
High speed oscillator
1
>2
>4
>8
-
20
RF
Feedback resistor(2)
CL1
CL2
Recommended load
capacitance versus
equivalent serial resistance of
the crystal or ceramic
resonator (RS)(3)
RS = 200Ω
RS = 200Ω
RS = 200Ω
RS = 100Ω
OSC2 driving current
LP oscillator
MP oscillator
VDD = 5V, VIN = VSS
MS oscillator
HS oscillator
i2
LP oscillator
MP oscillator
MS oscillator
HS oscillator
-
2
4
8
16
MHz
-
40
kΩ
22
22
18
15
-
56
46
33
33
pF
-
80
160
310
610
150
250
460
910
µA
1. The oscillator selection can be optimized in terms of supply current using a high-quality resonator with
small RS value. Refer to crystal/ceramic resonator manufacturer for more details.
2. Data based on characterization results, not tested in production. The relatively low value of the RF resistor
offers a good protection against issues resulting from use in a humid environment, due to the induced
leakage and the bias condition change. However, it is recommended to take this point into account if the
microcontroller is used in tough humidity conditions.
3. For CL1 and CL2 it is recommended to use high-quality ceramic capacitors in the 5pF to 25pF range (typ.)
designed for high-frequency applications and selected to match the requirements of the crystal or
resonator. CL1 and CL2, are usually the same size. The crystal manufacturer typically specifies a load
capacitance which is the series combination of CL1 and CL2. PCB and MCU pin capacitance must be
included when sizing CL1 and CL2 (10pF can be used as a rough estimate of the combined pin and board
capacitance).
Figure 75. Typical application with a crystal or ceramic resonator
WHEN RESONATOR WITH
INTEGRATED CAPACITORS
CL1
fOSC
POWER DOWN
LOGIC
OSC1
LINEAR
AMPLIFIER
RESONATOR
RF
CL2
VDD/2
Ref
FEEDBACK
LOOP
i2
OSC2
ST72XXX
200/223
ST72321Bxxx-Auto
Electrical characteristics
Figure 76. Application with a crystal or ceramic resonator for ROM (LQFP64 or any 48/60K ROM)
WHEN RESONATOR WITH
i2
INTEGRATED CAPACITORS
fOSC
CL1
OSC1
RESONATOR
RF
CL2
OSC2
ST72XXX
Table 116. OSCRANGE selection for typical resonators
Typical ceramic resonators(1)
Supplier
Murata
fOSC (MHz)
Reference
Recommended OSCRANGE option bit
configuration
2
CSTCC2M00G56A-R0
MP mode(2)
4
CSTCR4M00G55B-R0
MS mode
8
CSTCE8M00G55A-R0
16
CSTCE16M0G53A-R0
HS mode
1. Resonator characteristics given by the ceramic resonator manufacturer. For more information on these
resonators, please consult www.murata.com.
2. LP mode is not recommended for 2 MHz resonator because the peak to peak amplitude is too small
(> 0.8V).
RC oscillators
Table 117. RC oscillator characteristics
Symbol
fOSC(RCINT)
Parameter
Internal RC oscillator frequency
(see Figure 77)
Conditions
Min
Typ
Max
Unit
TA = 25°C, VDD = 5V
2
3.5
5.6
MHz
Figure 77. Typical fOSC(RCINT) versus TA
4
fOSC(RCINT) (MHz)
19.5.4
Vdd = 5V
3.8
Vdd = 5.5V
3.6
3.4
3.2
3
-45
0
25
70
130
TA(°C)
201/223
Electrical characteristics
ST72321Bxxx-Auto
Note:
To reduce disturbance to the RC oscillator, it is recommended to place decoupling
capacitors between VDD and VSS as shown in Figure 97.
19.5.5
PLL characteristics
Table 118. PLL characteristics
Symbol
Parameter
Conditions
fOSC
PLL input frequency range
∆ fCPU/fCPU
Instantaneous PLL jitter(1)
Min
Typ
2
fOSC = 4 MHz
0.7
Max
Unit
4
MHz
2
%
1. Data characterized but not tested
The user must take the PLL jitter into account in the application (for example, in serial
communication or sampling of high frequency signals). The PLL jitter is a periodic effect,
which is integrated over several CPU cycles. Therefore, the longer the period of the
application signal, the less it is impacted by the PLL jitter.
Figure 78 shows the PLL jitter integrated on application signals in the range 125 kHz to
4 MHz. At frequencies of less than 125 kHz, the jitter is negligible.
Figure 78. Integrated PLL jitter versus signal frequency(1)
+/-Jitter (%)
1.2
FLASH typ
1
ROM max
ROM typ
0.8
0.6
0.4
0.2
0
4 MHz
2 MHz
1 MHz 500 kHz 250 kHz 125 kHz
Application Frequency
1. Measurement conditions: fCPU = 8 MHz
19.6
Memory characteristics
19.6.1
RAM and hardware registers
Table 119. RAM supply voltage
Symbol
VRM
Parameter
Data retention mode(1)
Conditions
Halt mode (or RESET)
Min
Typ
Max
1.6
1. Minimum VDD supply voltage without losing data stored in RAM (in Halt mode or under RESET) or in
hardware registers (only in Halt mode). Not tested in production.
202/223
Unit
V
ST72321Bxxx-Auto
19.6.2
Electrical characteristics
Flash memory
Table 120. Dual voltage HDFlash memory
Symbol
Parameter
fCPU
Operating frequency
VPP
Programming voltage(2)
Conditions
Min(1)
Typ
Read mode
0
8
Write / Erase mode
1
8
4.5V < VDD < 5.5V
11.4
12.6
IDD
Supply current
Unit
MHz
Run mode (fCPU = 4 MHz)
(3)
Max(1)
V
3
mA
Write / Erase
0
Power down mode / HALT
1
10
µA
Read (VPP = 12V)
200
Write / Erase
30
IPP
VPP current(3)
tVPP
Internal VPP stabilization
time
tRET
Data retention
TA = 55°C
20
years
NRW
Write erase cycles
TA = 85°C
100
cycles
TPROG
TERASE
mA
10
Programming or erasing
temperature range
-40
25
µs
85
°C
1. Data based on characterization results, not tested in production
2. VPP must be applied only during the programming or erasing operation and not permanently for reliability
reasons.
3. Data based on simulation results, not tested in production
Warning:
Do not connect 12V to VPP before VDD is powered on, as this
may damage the device.
203/223
Electrical characteristics
19.7
ST72321Bxxx-Auto
EMC (electromagnetic compatibility) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
19.7.1
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling two LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
●
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
●
FTB: A burst of fast transient voltage (positive and negative) is applied to VDD and VSS
through a 100pF capacitor until a functional disturbance occurs. This test conforms with
the IEC 1000-4-4 standard.
A device reset allows normal operations to be resumed. The test results given in Table 121
below are based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
●
Corrupted program counter
●
Unexpected reset
●
Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
204/223
ST72321Bxxx-Auto
Electrical characteristics
.
Table 121. EMS test results
Symbol
VFESD
VFFTB
Parameter
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Conditions
Level/Class
All Flash and ROM devices,
VDD = 5V, TA = +25°C, fOSC = 8 MHz,
conforms to IEC 1000-4-2
3B
32 Kbyte Flash device LQFP44(1),
VDD = 5V, TA = +25°C, fOSC = 8 MHz,
conforms to IEC 1000-4-4
3B
Fast transient voltage burst limits to be applied
through 100pF on VDD and VDD pins to induce a
48/60 Kbyte Flash and all ROM devices,
functional disturbance
VDD = 5V, TA = +25°C, fOSC = 8 MHz,
conforms to IEC 1000-4-4
4A
1. VFFTB test results unavailable for LQFP64 32 Kbyte Flash device at this time
19.7.2
EMI (electromagnetic interference)
Based on a simple application running on the product (toggling two LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm SAE J 1752/3 which specifies the board and the loading of each pin.
Table 122. EMI emissions
Max vs [fOSC/fCPU](1)
Conditions
Symbol Parameter
SEMI
SEMI
SEMI
SEMI
Peak level
Peak level
Peak level
Peak level
VDD = 5V, TA = +25°C,
conforming to SAE J 1752/3
48/60 Kbyte Flash devices in
LQFP44 and LQFP64 packages
and
32 Kbyte Flash devices in
LQFP64 package
32 Kbyte Flash devices in
LQFP44 package
48/60 Kbyte ROM devices in
LQFP44 and LQFP64 packages
and
32 Kbyte ROM devices in
LQFP64 package
32 Kbyte ROM devices in
LQFP44 package
Monitored
frequency band
Unit
8/4 MHz
16/8 MHz
0.1 MHz to 30 MHz
15
20
30 MHz to 130 MHz
20
27
130 MHz to 1 GHz
7
12
SAE EMI Level
2.5
3
0.1 MHz to 30 MHz
13
14
30 MHz to 130 MHz
20
25
130 MHz to 1 GHz
16
21
SAE EMI Level
3
3.5
0.1 MHz to 30 MHz
-
11
30 MHz to 130 MHz
-
23
130 MHz to 1 GHz
-
14
SAE EMI Level
-
3
0.1 MHz to 30 MHz
17
21
30 MHz to 130 MHz
24
30
130 MHz to 1 GHz
18
23
SAE EMI Level
3
3.5
dBµV
-
dBµV
-
dBµV
-
dBµV
-
1. Data based on characterization results, not tested in production.
205/223
Electrical characteristics
19.7.3
ST72321Bxxx-Auto
Absolute maximum ratings (electrical sensitivity)
Based on two different tests (ESD and LU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). This test
conforms to the AEC-Q100-002/-003/-011 standard. For more details, refer to the
application note AN1181.
Table 123. ESD absolute maximum ratings
Symbol
Ratings
Conditions
Class
Max. value(1)
VESD(HBM)
Electrostatic discharge voltage
(Human Body Model)
TA = +25°C
conforming to AEC-Q100-002
H1C
2000
VESD(MM)
Electrostatic discharge voltage
(Machine Model)
TA = +25°C
conforming to AEC-Q100-003
M2
200
VESD(CDM)
Electrostatic discharge voltage
(Charged Device Model)
TA = +25°C
conforming to AEC-Q100-011
C2
500
Unit
V
1. Data based on characterization results, not tested in production.
Static latch-up (LU)
Two complementary static tests are required on six parts to assess the latch-up
performance:
●
A supply overvoltage is applied to each power supply pin.
●
A current injection is applied to each input, output and configurable I/O pin.
These tests are compliant with the EIA/JESD 78 IC latch-up standard.
Table 124. Electrical sensitivities
Symbol
LU
206/223
Parameter
Static latch-up class
Conditions
TA = +125°C
conforming to JESD 78
Class
II level A
ST72321Bxxx-Auto
Electrical characteristics
19.8
I/O port pin characteristics
19.8.1
General characteristics
Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.
Table 125. I/O port pin general characteristics
Symbol
VIL
Parameter
Conditions
Vhys
Schmitt trigger voltage hysteresis(2)
CMOS ports
0
+4
VDD = 5V
±4
Total injected current (sum of all I/O and
control pins)
Input leakage current
VSS < VIN < VDD
±1
µA
mode(4)(5)
RPU
Weak pull-up equivalent resistor(6)
VIN = VSS VDD = 5V
CIO
I/O pin capacitance
Output high to low level fall
mA
±25
Floating input
tf(IO)out
V
0.7
Static current consumption
IS
Unit
0.7xVDD
Injected current on PC6 pin (Flash devices
only)
Injected current on an I/O pin
Ilkg
Max
0.3xVDD
(1)
Input high level voltage
ΣIINJ(PIN)(3)
Typ
Input low level voltage(1)
VIH
IINJ(PIN)(3)
Min
400
50
120
250
kΩ
5
time(1)
time(1)
tr(IO)out
Output low to high level rise
tw(IT)in
External interrupt pulse time(7)
pF
25
CL = 50pF
Between 10% and 90%
ns
25
1
tCPU
1. Data based on characterization results, not tested in production.
2. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
3. When the current limitation is not possible, the VIN maximum must be respected, otherwise refer to IINJ(PIN) specification. A
positive injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. Refer to Section 19.2.2:
Current characteristics for more details.
4. Static peak current value taken at a fixed VIN value, based on design simulation and technology characteristics, not tested
in production. This value depends on VDD and temperature values.
5. The Schmitt trigger that is connected to every I/O port is disabled for analog inputs only when ADON bit is ON and the
particular ADC channel is selected (with port configured in input floating mode). When the ADON bit is OFF, static current
consumption may result. This can be avoided by keeping the input voltage of this pin close to VDD or VSS.
6. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics described in
Figure 80).
7. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external
interrupt source.
207/223
Electrical characteristics
ST72321Bxxx-Auto
Figure 79. Unused I/O pins configured as
input
Figure 80. Typical IPU vs VDD with VIN = VSS
90
VDD
ST7XXX
Ta=1 40°C
80
Ta=9 5°C
70
10kΩ
UNUSED I/O PORT
10kΩ
ST7XXX
Ipu(uA)
UNUSED I/O PORT
Ta=2 5°C
Ta=-45 °C
60
50
40
30
20
Note: I/O can be left unconnected if it is configured as output
(0 or 1) by the software. This has the advantage of
greater EMC robustness and lower cost.
19.8.2
10
0
2
2.5
3
3.5
4
4.5
Vdd(V)
5
5.5
6
Output driving current
Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Table 126. Output driving current
Symbol
Parameter
Conditions
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
(see Figure 81)
VOL(1)
VOH(2)
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
(see Figure 82 and Figure 84)
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
(see Figure 83 and Figure 86)
VDD = 5V
Min
Max
IIO = +5mA
1.2
IIO = +2mA
0.5
IIO = +20mA,
TA < 85°C
TA > 85°C
1.3
1.5
IIO = +8mA
0.6
IIO = -5mA,
TA < 85°C
TA > 85°C
VDD - 1.4
VDD - 1.6
IIO = -2mA
VDD - 0.7
Unit
1. The IIO current sunk must always respect the absolute maximum rating specified in Section 19.2.2 and the sum of IIO (I/O
ports and control pins) must not exceed IVSS.
2. The IIO current sourced must always respect the absolute maximum rating specified in Section 19.2.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVDD. True open-drain I/O pins do not have VOH.
208/223
V
ST72321Bxxx-Auto
Electrical characteristics
Figure 81. Typical VOL at VDD = 5V (standard)
Figure 82. Typical VOL at VDD = 5V (high-sink)
1
1.4
0.9
0.8
1
V ol(V ) at Vdd=5V
V ol (V ) at Vdd=5V
1.2
0.8
0.6
Ta =14 0°C "
0.4
Ta =95 °C
0.7
0.6
0.5
0.4
Ta= 140 °C
0.3
Ta= 95 °C
0.2
Ta= 25 °C
0.1
Ta= -45°C
Ta =25 °C
0.2
Ta =-45 °C
0
0
0
0.005
0.01
0.015
0
0.01
0.02
0.03
Iio(A)
Iio(A)
Figure 83. Typical VOH at VDD = 5V
5.5
Vdd-V oh (V ) at Vdd=5V
5
4.5
4
3.5
V dd= 5V 1 40°C m in
3
V dd= 5v 95°C m in
V dd= 5v 25°C m in
2.5
V dd= 5v -4 5°C m in
2
-0.01
-0.008 -0.006 -0.004
-0.002
0
Iio (A)
209/223
Electrical characteristics
ST72321Bxxx-Auto
Figure 84. Typical VOL versus VDD (standard)
1
0.45
Ta= -4 5°C
0.9
0.8
Ta=2 5°C
Ta= 95°C
Ta=9 5°C
0.35
Ta= 140 °C
0.7
Ta=1 40°C
Vol(V) at Iio=2mA
V ol(V ) at Iio=5m A
Ta=-4 5°C
0.4
Ta= 25°C
0.6
0.5
0.4
0.3
0.3
0.25
0.2
0.15
0.2
0.1
0.1
0.05
0
2
2.5
3
3.5
4
4.5
5
5.5
0
6
2
Vdd(V )
2.5
3
3.5
4
4.5
5
5.5
6
Vdd(V)
Figure 85. Typical VOL versus VDD (high-sink)
1 .6
0 .6
Ta = 140 °C
1 .4
0 .5
Ta =95 °C
1 .2
Ta =25 °C
Ta =-45°C
Vol(V ) at Iio=20m A
Vol(V ) at Iio=8m A
0 .4
0 .3
0 .2
1
0 .8
0 .6
Ta= 14 0°C
0 .4
Ta=9 5°C
0 .1
Ta=2 5°C
0 .2
Ta=-45 °C
0
0
2
2.5
3
3.5
4
4.5
5
5.5
2
6
2.5
3
3.5
4
4.5
5
5.5
6
V dd(V )
V dd (V )
Figure 86. Typical VDD-VOH versus VDD
5.5
6
Ta= -4 5°C
5
Vdd-Voh(V) at Iio=-5mA
Vdd-V oh(V ) at Iio=-2m A
5
4.5
4
3.5
Ta= -4 5°C
3
Ta= 25°C
Ta= 25°C
Ta= 95°C
Ta= 140°C
4
3
2
Ta= 95°C
2.5
1
Ta= 140°C
2
0
2
2.5
3
3.5
4
Vdd(V)
210/223
4.5
5
5.5
6
2
2.5
3
3.5
4
Vdd(V)
4.5
5
5.5
6
ST72321Bxxx-Auto
Electrical characteristics
19.9
Control pin characteristics
19.9.1
Asynchronous RESET pin
Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Table 127. Asynchronous RESET pin characteristics
Symbol
VIL
Parameter
Conditions
Typ
Input low level voltage(1)
Input high level voltage
Vhys
Schmitt trigger voltage
hysteresis(2)
VOL
Output low level voltage(3)
IIO
Input current on RESET pin
V
2.5
tw(RSTL)out Generated reset pulse duration
External reset pulse hold
tg(RSTL)in
duration(6)
Filtered glitch
Unit
0.7xVDD
VDD = 5V, IIO = +2mA
0.2
0.5
2
Weak pull-up equivalent resistor
th(RSTL)in
Max
0.3xVDD
(1)
VIH
RON
Min
20
Stretch applied on external pulse
0
Internal reset sources
20
time(5)
30
mA
120
kΩ
42(4)
30
42(4)
µs
2.5
200
ns
1. Data based on characterization results, not tested in production.
2. Hysteresis voltage between Schmitt trigger switching levels.
3. The IIO current sunk must always respect the absolute maximum rating specified in Section 19.2.2 and the sum of IIO (I/O
ports and control pins) must not exceed IVSS.
4. Data guaranteed by design, not tested in production.
5. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on the
RESET pin with a duration below th(RSTL)in can be ignored.
6. The reset network (the resistor and two capacitors) protects the device against parasitic resets, especially in noisy
environments.
211/223
Electrical characteristics
ST72321Bxxx-Auto
Figure 87. RESET pin protection when LVD is enabled
VDD
Required
Optional
(note 3)
EXTERNAL
RESET
212/223
RON
INTERNAL
RESET
Filter
0.01µF
Note:
ST72XXX
1MΩ
PULSE
GENERATOR
WATCHDOG
LVD RESET
1
- The reset network protects the device against parasitic resets.
- The output of the external reset circuit must have an open-drain output to drive the ST7
reset pad. Otherwise the device can be damaged when the ST7 generates an internal reset
(LVD or watchdog).
- Whether the reset source is internal or external, the user must ensure that the level on the
RESET pin can go below the VIL maximum level specified in Section 19.9.1 on page 211.
Otherwise the reset will not be taken into account internally.
- Because the reset circuit is designed to allow the internal RESET to be output in the
RESET pin, the user must ensure that the current sunk on the RESET pin is less than the
absolute maximum value specified for IINJ(RESET) in Section 19.2.2 on page 192.
2
When the LVD is enabled, it is recommended not to connect a pull-up resistor or capacitor. A
10nF pull-down capacitor is required to filter noise on the reset line.
3
In case a capacitive power supply is used, it is recommended to connect a 1MΩ pull-down
resistor to the RESET pin to discharge any residual voltage induced by the capacitive effect
of the power supply (this will add 5µA to the power consumption of the MCU).
4
Tips when using the LVD:
A. Check that all recommendations related to reset circuit have been applied (see notes
above).
B. Check that the power supply is properly decoupled (100nF + 10µF close to the MCU).
Refer to AN1709 and AN2017. If this cannot be done, it is recommended to put a 100nF +
1MΩ pull-down on the RESET pin.
C. The capacitors connected on the RESET pin and also the power supply are key to avoid
any start-up marginality. In most cases, steps A and B above are sufficient for a robust
solution. Otherwise, replace 10nF pull-down on the RESET pin with a 5µF to 20µF
capacitor.
ST72321Bxxx-Auto
Electrical characteristics
Figure 88. RESET pin protection when LVD is disabled
VDD
ST72XXX
RON
USER
EXTERNAL
RESET
CIRCUIT
INTERNAL
RESET
Filter
0.01µF
PULSE
GENERATOR
WATCHDOG
Required
Note:
- The reset network protects the device against parasitic resets.
- The output of the external reset circuit must have an open-drain output to drive the ST7
reset pad. Otherwise the device can be damaged when the ST7 generates an internal reset
(LVD or watchdog).
- Whether the reset source is internal or external, the user must ensure that the level on the
RESET pin can go below the VIL maximum level specified in Section 19.9.1 on page 211.
Otherwise the reset will not be taken into account internally.
- Because the reset circuit is designed to allow the internal RESET to be output in the
RESET pin, the user must ensure that the current sunk on the RESET pin is less than the
absolute maximum value specified for IINJ(RESET) in Section 19.2.2 on page 192.
19.9.2
ICCSEL/VPP pin
Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Table 128. ICCSEL/VPP pin characteristics
Symbol
VIL
Parameter
Conditions
Input low level voltage(1)
(1)
VIH
Input high level voltage
Ilkg
Input leakage current
Min
Max(1)
VSS
0.3 x VDD
0.7 x VDD
VDD
VIN = VSS
±1
Unit
V
µA
1. Data based on design simulation and/or technology characteristics, not tested in production
213/223
Electrical characteristics
ST72321Bxxx-Auto
Figure 89. Two typical applications with ICCSEL/VPP pin(1)
ICCSEL/VPP
VPP
PROGRAMMING
TOOL
10kΩ
ST72XXX
ST72XXX
1. When ICC mode is not required by the application, the ICCSEL/VPP pin must be tied to VSS.
19.10
Timer peripheral characteristics
Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.
Refer to Section 19.8: I/O port pin characteristics for more details on the input/output
alternate function characteristics (such as output compare, input capture, external clock, or
PWM output).
Table 129. 8-bit PWM-ART auto-reload timer characteristics
Symbol
Parameter
tres(PWM) PWM resolution time
fEXT
ART external clock frequency
fPWM
PWM repetition rate
Conditions
fCPU = 8 MHz
Min
Typ
tCPU
125
ns
0
PWM/DAC output step voltage
Unit
1
ResPWM PWM resolution
VOS
Max
VDD = 5V,
Resolution = 8 bits
fCPU/2
MHz
8
bit
20
mV
Table 130. 16-bit timer characteristics
Symbol
Parameter
Conditions
tw(ICAP)in Input capture pulse time
tres(PWM) PWM resolution time
fEXT
Timer external clock frequency
fPWM
PWM repetition rate
Typ
Max
Unit
1
tCPU
2
tCPU
250
ns
0
ResPWM PWM resolution
214/223
fCPU = 8 MHz
Min
fCPU/4
MHz
16
bit
ST72321Bxxx-Auto
Electrical characteristics
19.11
Communication interface characteristics
19.11.1
SPI (serial peripheral interface)
Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Refer to Section 19.8: I/O port pin characteristics for more details on the input/output
alternate function characteristics (SS, SCK, MOSI, MISO).
Table 131. SPI characteristics
Symbol
fSCK
1/tc(SCK)
tr(SCK)
tf(SCK)
Parameter
SPI clock frequency
Conditions
Min
Max
Master, fCPU = 8 MHz
fCPU/128 = 0.0625
fCPU/4 = 2
Slave, fCPU = 8 MHz
0
fCPU/2 = 4
SPI clock rise and fall time
SS setup time(2)
Slave
tCPU + 50
th(SS)(1)
SS hold time
Slave
120
Master
Slave
100
90
tsu(MI)(1)
tsu(SI)(1)
Data input setup time
Master
Slave
100
100
th(MI)(1)
th(SI)(1)
Data input hold time
Master
Slave
100
100
ta(SO)(1)
Data output access time
Slave
tdis(SO)(1)
Data output disable time
Slave
tv(SO)
(1)
ns
120
240
120
Slave (after enable edge)
Data output hold time
tv(MO)(1)
Data output valid time
(1)
Data output hold time
th(MO)
0
Data output valid time
(1)
th(SO)
MHz
see I/O port pin description
tsu(SS)(1)
tw(SCKH)(1)
SCK high and low time
tw(SCKL)(1)
Unit
0
120
Master (after enable edge)
0
tCPU
1. Data based on design simulation and/or characterization results, not tested in production.
2. Depends on fCPU. For example, if fCPU = 8 MHz, then tCPU = 1 / fCPU = 125 ns and tsu(SS) = 175 ns.
215/223
Electrical characteristics
ST72321Bxxx-Auto
Figure 90. SPI slave timing diagram with CPHA = 0(1)
SS INPUT
SCK INPUT
tsu(SS)
tc(SCK)
th(SS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
tw(SCKH)
tw(SCKL)
ta(SO)
MISO OUTPUT
tv(SO)
MSB OUT
See note 2
tsu(SI)
th(SO)
BIT6 OUT
See
note 2
LSB OUT
th(SI)
MSB IN
MOSI INPUT
tdis(SO)
tr(SCK)
tf(SCK)
LSB IN
BIT1 IN
1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has its
alternate function capability released. In this case, the pin status depends on the I/O port configuration.
Figure 91. SPI slave timing diagram with CPHA = 1(1)
SS INPUT
SCK INPUT
tsu(SS)
tc(SCK)
th(SS)
CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(SCKH)
tw(SCKL)
ta(SO)
MISO OUTPUT
See
note 2
tv(SO)
MSB OUT
HZ
tsu(SI)
MOSI INPUT
th(SO)
BIT6 OUT
tr(SCK)
tf(SCK)
LSB OUT
tdis(SO)
See
note 2
th(SI)
MSB IN
BIT1 IN
LSB IN
1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has its
alternate function capability released. In this case, the pin status depends of the I/O port configuration.
216/223
ST72321Bxxx-Auto
Electrical characteristics
Figure 92. SPI master timing diagram(1)
SS INPUT
tc(SCK)
SCK INPUT
CPHA = 0
CPOL = 0
CPHA = 0
CPOL = 1
CPHA = 1
CPOL = 0
CPHA = 1
CPOL = 1
tw(SCKH)
tw(SCKL)
tsu(MI)
MISO INPUT
tr(SCK)
tf(SCK)
th(MI)
MSB IN
BIT6 IN
tv(MO)
MOSI OUTPUT
See note 2
MSB OUT
LSB IN
th(MO)
BIT6 OUT
LSB OUT
See note 2
1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has its
alternate function capability released. In this case, the pin status depends of the I/O port configuration.
217/223
Electrical characteristics
19.11.2
ST72321Bxxx-Auto
I2C - inter IC control interface
Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Refer to Section 19.8: I/O port pin characteristics for more details on the input/output
alternate function characteristics (SDAI and SCLI). The ST7 I2C interface meets the
requirements of the standard I2C communication protocol described in the following table.
Table 132. I2C control interface characteristics
Standard mode I2C
Symbol
Parameter
Min(2)
Max(2)
Fast mode I2C(1)
Min(2)
tw(SCLL)
SCL clock low time
4.7
1.3
tw(SCLH)
SCL clock high time
4.0
0.6
tsu(SDA)
SDA setup time
250
100
th(SDA)
SDA data hold time
0(3)
0(4)
tr(SDA)
tr(SCL)
SDA and SCL rise time
tf(SDA)
tf(SCL)
SDA and SCL fall time
th(STA)
START condition hold time
4.0
tsu(STA)
Repeated START condition setup time
4.7
tsu(STO)
STOP condition setup time
4.0
Unit
µs
900(3)
ns
1000
20+0.1Cb
300
300
0.6
µs
tw(STO:STA) STOP to START condition time (bus free)
Cb
Max(2)
4.7
Capacitive load for each bus line
1.3
400
400
pF
1. At 4 MHz fCPU, maximum I2C speed (400 kHz) is not achievable. In this case, maximum I2C speed will be approximately
260 kHz.
2. Data based on standard I2C protocol requirement, not tested in production.
3. The maximum hold time of the START condition has only to be met if the interface does not stretch the low period of SCL
signal.
4. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined region
of the falling edge of SCL.
218/223
ST72321Bxxx-Auto
Electrical characteristics
Figure 93. Typical application with I2C BUS and timing diagram(1)
VDD
VDD
4.7kΩ
4.7kΩ
I2C BUS
100Ω
SDAI
100Ω
SCLI
ST72XXX
REPEATED START
START
tsu(STA)
tw(STO:STA)
START
SDA
tf(SDA)
tr(SDA)
tsu(SDA)
STOP
th(SDA)
SCK
th(STA)
tw(SCKH)
tw(SCKL)
tr(SCK)
tf(SCK)
tsu(STO)
1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
The following table provides the values to be written in the I2CCCR register to obtain the
required I2C SCL line frequency.
Table 133. SCL frequency table
I2CCCR value
fCPU = 4 MHz
fSCL
(kHz)
VDD = 4.1V
fCPU = 8 MHz
VDD = 5V
VDD = 4.1V
VDD = 5V
RP = 3.3kΩ RP = 4.7kΩ RP = 3.3kΩ RP = 4.7kΩ RP = 3.3kΩ RP = 4.7kΩ RP = 3.3kΩ RP = 4.7kΩ
400
Not achievable
83h
300
Not achievable
85h
200
83h
8Ah
89h
100
10h
24h
23h
50
24h
4Ch
20
5Fh
FFh
8Ah
24h
23h
Legend:
RP
= External pull-up resistance
fSCL = I2C speed
Note:
- For speeds around 200 kHz, the achieved speed can have a ±5% tolerance.
- For other speed ranges, the achieved speed can have a ±2% tolerance.
The above variations depend on the accuracy of the external components used.
219/223
Electrical characteristics
19.12
ST72321Bxxx-Auto
10-bit ADC characteristics
Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Table 134. 10-bit ADC characteristics
Symbol
fADC
VAREF
VAIN
Ilkg
Parameter
Conditions
ADC clock frequency
Analog reference voltage
0.7*VDD < VAREF < VDD
Conversion voltage range(1)
Input leakage current for analog
input(2)
Min
Typ
Max
Unit
0.4
2
MHz
3.8
VDD
VSSA
VAREF
-40°C < TA < 85°C range
Other TA ranges
V
±250
nA
±1
µA
RAIN
External input impedance
CAIN
External capacitor on analog input
fAIN
Variation frequency of analog input
signal
CADC
Internal sample and hold capacitor
12
pF
tADC
Conversion time (Sample + Hold)
fCPU = 8 MHz, speed = 0,
fADC = 2 MHz
7.5
µs
tADC
kΩ
See
Figure 94
and
Figure 95
No. of sample capacitor loading
cycles
4
No. of hold conversion cycles
11
pF
Hz
1/fADC
1. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10kΩ). Data
based on characterization results, not tested in production.
2. Injecting negative current on adjacent pins may result in increased leakage currents. Software filtering of the converted
analog value is recommended.
220/223
ST72321Bxxx-Auto
Electrical characteristics
Figure 94. RAIN maximum versus fADC with
CAIN = 0pF(1)
Figure 95. Recommended CAIN and RAIN
values(1)
45
1000
Cain 10 nF
2 MHz
35
Cain 22 nF
100
30
1 MHz
25
20
15
10
Max. R AIN (Kohm)
Max. R AIN (Kohm)
40
Cain 47 nF
10
1
5
0
0.1
0
10
30
70
0.01
0.1
CPARASITIC (pF)
1
10
fAIN(KHz)
1. CPARASITIC represents the capacitance of the PCB
(dependent on soldering and PCB layout quality) plus
the pad capacitance (3pF). A high CPARASITIC value will
downgrade conversion accuracy. To remedy this, fADC
should be reduced.
1. This graph shows that, depending on the input signal
variation (fAIN), CAIN can be increased for stabilization
time and decreased to allow the use of a larger serial
resistor (RAIN).
Figure 96. Typical A/D converter application
VDD
RAIN
AINx
ST72XXX
VT
0.6V
2kΩ(max)
VAIN
CAIN
19.12.1
VT
0.6V
Ilkg
10-bit A/D
conversion
CADC
12pF
Analog power supply and reference pins
Depending on the MCU pin count, the package may feature separate VAREF and VSSA
analog power supply pins. These pins supply power to the A/D converter cell and function
as the high and low reference voltages for the conversion.
Separation of the digital and analog power pins allow board designers to improve A/D
performance. Conversion accuracy can be impacted by voltage drops and noise in the event
of heavily loaded or badly decoupled power supply lines (see Section 19.12.2: General PCB
design guidelines).
221/223
Electrical characteristics
19.12.2
ST72321Bxxx-Auto
General PCB design guidelines
To obtain best results, some general design and layout rules should be followed when
designing the application PCB to shield the noise-sensitive, analog physical interface from
noise-generating CMOS logic signals.
●
Use separate digital and analog planes. The analog ground plane should be connected
to the digital ground plane via a single point on the PCB.
●
Filter power to the analog power planes. It is recommended to connect capacitors, with
good high frequency characteristics, between the power and ground lines, placing
0.1µF and optionally, if needed 10pF capacitors as close as possible to the ST7 power
supply pins and a 1 to 10µF capacitor close to the power source (see Figure 97).
●
The analog and digital power supplies should be connected in a star network. Do not
use a resistor, as VAREF is used as a reference voltage by the A/D converter and any
resistance would cause a voltage drop and a loss of accuracy.
●
Properly place components and route the signal traces on the PCB to shield the analog
inputs. Analog signals paths should run over the analog ground plane and be as short
as possible. Isolate analog signals from digital signals that may switch while the analog
inputs are being sampled by the A/D converter. Do not toggle digital outputs on the
same I/O port as the A/D input being converted.
Figure 97. Power supply filtering
ST72XXX
1 to 10µF
+
0.1µF
ST7
DIGITAL NOISE
FILTERING
VSS
VDD
VDD
POWER
SUPPLY
SOURCE
0.1µF
EXTERNAL
NOISE
FILTERING
222/223
VAREF
VSSA
ST72321Bxxx-Auto
19.12.3
Electrical characteristics
ADC accuracy
Figure 98. ADC error classification
Digital Result ADCDR
EG
1023
1022
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
V
–V
AREF
SSA
1LSB
= -------------------------------------------IDEAL
1024
1021
ET = Total Unadjusted Error: maximum deviation
between the actual and the ideal transfer curves.
(2)
ET
EO = Offset Error: deviation between the first
actual transition and the first ideal one.
(3)
7
(1)
6
5
EO
3
EG = Gain Error: deviation between the last ideal
transition and the last actual one.
ED = Differential Linearity Error: maximum
deviation between actual steps and the ideal
one.
EL
4
Legend:
EL = Integral Linearity Error: maximum deviation
between any actual transition and the end point
correlation line.
ED
2
1 LSBIDEAL
1
Vin (LSBIDEAL)
0
1
2
3
4
5
VSSA
6
7
1021 1022 1023 1024
VAREF
Table 135. ADC accuracy
Max(2)
Symbol
Parameter(1)
|ET|
Total unadjusted error
|EO|
Offset error
|EG|
Gain error
|ED|
Differential linearity error
|EL|
Integral linearity error
Conditions
VDD = 5V(1)
CPU in run mode @ fADC 2 MHz
Typ
ROM and
48/60 Kbyte
Flash
32 Kbyte
Flash
3
4
6
2
3
5
0.5
3
4.5
1
2
Unit
LSB
2
3
1. ADC Accuracy versus Negative Injection Current: Injecting negative current may reduce the accuracy of the conversion
being performed on another analog input. Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN)
in Section 19.8 does not affect the ADC accuracy.
2. Data based on characterization results, monitored in production to guarantee 99.73% within ± max value from -40°C to
125°C (± 3σ distribution limits).
223/223
Package characteristics
ST72321Bxxx-Auto
20
Package characteristics
20.1
Package mechanical data
Figure 99. 64-pin (14x14) low profile quad flat package outline
A
A2
D
D1
A1
b
e
E1 E
L
L1
c
θ
Table 136. 64-pin (14x14) low profile quad flat package mechanical data
inches(1)
mm
Dimension
Min
Typ
A
Max
Min
1.600
A1
0.050
A2
1.350
b
0.300
c
0.090
Max
0.0630
0.150
0.0020
0.0059
1.400
1.450
0.0531
0.0551
0.0571
0.370
0.450
0.0118
0.0146
0.0177
0.200
0.0035
0.0079
D
16.000
0.6299
D1
14.000
0.5512
E
16.000
0.6299
E1
14.000
0.5512
e
0.800
0.0315
θ
0°
3.5°
7°
0°
3.5°
7°
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
1.000
1. Values in inches are converted from mm and rounded to 4 decimal digits.
224/247
Typ
0.0394
ST72321Bxxx-Auto
Package characteristics
Figure 100. 64-pin (10x10) low profile quad flat package outline
D
D1
A
A2
A1
b
E1 E
e
L
c
L1
θ
Table 137. 64-pin (10x10) low profile quad flat package mechanical data
inches(1)
mm
Dimension
Min
Typ
A
Max
Min
Typ
1.600
A1
0.050
A2
1.350
b
0.170
c
0.090
Max
0.0630
0.150
0.0020
0.0059
1.400
1.450
0.0531
0.0551
0.0571
0.220
0.270
0.0067
0.0087
0.0106
0.200
0.0035
0.0079
D
12.000
0.4724
D1
10.000
0.3937
E
12.000
0.4724
E1
10.000
0.3937
e
0.500
0.0197
θ
0°
3.5°
7°
0°
3.5°
7°
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
1.000
0.0394
1. Values in inches are converted from mm and rounded to 4 decimal digits.
225/247
Package characteristics
ST72321Bxxx-Auto
Figure 101. 44-pin (10x10) low profile quad flat package outline
D
A
D1
A2
A1
b
E1
e
E
c
L1
L
θ
Table 138. 44-pin (10x10) low profile quad flat package mechanical data
inches(1)
mm
Dimension
Min
Typ
A
Max
Min
1.600
A1
0.050
A2
1.350
b
0.300
C
0.090
Max
0.0630
0.150
0.0020
0.0059
1.400
1.450
0.0531
0.0551
0.0571
0.370
0.450
0.0118
0.0146
0.0177
0.200
0.0035
0.0079
D
12.000
0.4724
D1
10.000
0.3937
E
12.000
0.4724
E1
10.000
0.3937
e
0.800
0.0315
θ
0°
3.5°
7°
0°
3.5°
7°
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
1.000
1. Values in inches are converted from mm and rounded to 4 decimal digits.
226/247
Typ
0.0394
ST72321Bxxx-Auto
20.2
Package characteristics
Thermal characteristics
Table 139. Thermal characteristics
Symbol
RthJA
PD
TJmax
Ratings
Value
Unit
Package thermal resistance (junction to ambient)
LQFP64 14x14
LQFP64 10x10
LQFP44 10x10
47
50
52
°C/W
Power dissipation(1)
500
mW
Maximum junction temperature(2)
150
°C
1. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation
of an application can be defined by the user with the formula: PD = PINT + PPORT where PINT is the chip
internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the
application.
2. The maximum chip-junction temperature is based on technology characteristics.
20.3
Soldering information
In accordance with the RoHS European directive, all STMicroelectronics packages have
been converted to lead-free technology, named ECOPACK®.
20.3.1
●
ECOPACK® packages are qualified according to the JEDEC STD-020B compliant
soldering profile.
●
Detailed information on the STMicroelectronics ECOPACK® transition program is
available on www.st.com/stonline/leadfree/, with specific technical application notes
covering the main technical aspects related to lead-free conversion (AN2033, AN2034,
AN2035 and AN2036).
Compatibility
ECOPACK® LQFP packages are fully compatible with lead (Pb) containing soldering
process (see application note AN2034).
Table 140. Soldering compatibility (wave and reflow soldering process)
Package
Plating material
Pb solder paste
Pb-free solder paste
LQFP
Sn (pure tin)
Yes
Yes
227/247
Device configuration and ordering information
21
ST72321Bxxx-Auto
Device configuration and ordering information
Each device is available for production in user programmable versions (Flash) as well as in
factory coded versions (ROM/FASTROM).
ST72321B-Auto devices are ROM versions. ST72P321B-Auto devices are Factory
Advanced Service Technique ROM (FASTROM) versions: They are factory-programmed
HDFlash devices. Flash devices are shipped to customers with a default content, whereas
ROM/FASTROM factory coded parts contain the code supplied by the customer. This
implies that Flash devices have to be configured by the customer using the option bytes
while the ROM/FASTROM devices are factory-configured.
Detailed device configuration and ordering information is presented in the following
Section 21.1: Flash devices and Section 21.2: ROM device ordering information and
transfer of customer code.
21.1
Flash devices
21.1.1
Flash configuration
Table 141. Flash option bytes
4
WDG
3
1
0
Reserved
1
(1)
1
VD
Res
Default
value:
2
HALT
SW
1
1
1
1
0
0
0
1
1
7
6
5
4
3
2
1
0
1
0
2
1
0
PLLOFF
5
RSTC
6
PKG1
7
Static option byte 1
FMP_R
Static option byte 0
1
0
0
1
1
1
OSCTYPE
OSCRANGE
1. Depends on device type as defined in Table 144: Package selection (OPT7) on page 230
The option bytes allow the hardware configuration of the microcontroller to be selected.
They have no address in the memory map and can be accessed only in programming mode
(for example, using a standard ST7 programming tool). The default content of the Flash is
fixed to FFh. To program the Flash devices directly using ICP, Flash devices are shipped to
customers with the internal RC clock source enabled. In masked ROM devices, the option
bytes are fixed in hardware by the ROM code (see option list).
Table 142. Option byte 0 bit description
Bit
OPT7
228/247
Name
WDG HALT
Function
Watchdog and Halt mode
This option bit determines if a RESET is generated when entering
Halt mode while the Watchdog is active.
0: No Reset generation when entering Halt mode
1: Reset generation when entering Halt mode
ST72321Bxxx-Auto
Device configuration and ordering information
Table 142. Option byte 0 bit description (continued)
Bit
Name
OPT6
WDG SW
OPT5
-
OPT4:3
VD[1:0]
OPT2:1
-
OPT0
FMP_R
Function
Hardware or software watchdog
This option bit selects the watchdog type.
0: Hardware (watchdog always enabled)
1: Software (watchdog to be enabled by software)
Reserved, must be kept at default value.
Voltage detection
These option bits enable the voltage detection block (LVD and AVD)
with a selected threshold for the LVD and AVD (EVD + AVD).
00: Selected LVD = Highest threshold (VDD~4V)
01: Selected LVD = Medium threshold (VDD~3.5V)
10: Selected LVD = Lowest threshold (VDD~3V)
11: LVD and AVD off
Caution: If the medium or low thresholds are selected, the detection
may occur outside the specified operating voltage range. Below 3.8V,
device operation is not guaranteed. For details on the AVD and LVD
threshold levels refer to Section 19.3.2: Operating conditions with low
voltage detector (LVD) on page 194.
Reserved, must be kept at default value
Flash memory readout protection
Readout protection, when selected, provides a protection against
program memory content extraction and against write access to Flash
memory.
Erasing the option bytes when the FMP_R option is selected causes
the whole user memory to be erased first, after which the device can
be reprogrammed. Refer to Section 4.3.1: Readout protection on
page 37 and the ST7 Flash Programming Reference Manual for more
details.
0: Readout protection enabled
1: Readout protection disabled
Table 143. Option byte 1 bit description
Bit
Name
Function
OPT7
PKG1
Package selection bit 1
This option bit selects the package (see Table 144: Package selection
(OPT7)).
RSTC
RESET clock cycle selection
This option bit selects the number of CPU cycles applied during the
RESET phase and when exiting Halt mode. For resonator oscillators,
it is advised to select 4096 due to the long crystal stabilization time.
0: Reset phase with 4096 CPU cycles
1: Reset phase with 256 CPU cycles
OPT6
OPT5:4
OSCTYPE[1:0]
Oscillator type
These option bits select the ST7 main clock source type.
00: Clock source = Resonator oscillator
01: Reserved
10: Clock source = Internal RC oscillator
11: Clock source = External source
229/247
Device configuration and ordering information
ST72321Bxxx-Auto
Table 143. Option byte 1 bit description (continued)
Bit
Name
Function
Oscillator range
When the resonator oscillator type is selected, these option bits select
the resonator oscillator current source corresponding to the frequency
range of the resonator used. When the external clock source is
OPT3:1 OSCRANGE[2:0]
selected, these bits are set to medium power (2 ~ 4 MHz).
000: Typ. frequency range = 1 ~ 2 MHz
001: Typ. frequency range = 2 ~ 4 MHz
010: Typ. frequency range = 4 ~ 8 MHz
011: Typ. frequency range = 8 ~ 16 MHz
OPT0
PLLOFF
PLL activation
This option bit activates the PLL which allows multiplication by two of
the main input clock frequency. The PLL is guaranteed only with an
input frequency between 2 and 4 MHz. For this reason the PLL must
not be used with the internal RC oscillator.
0: PLL x2 enabled
1: PLL x2 disabled
Caution: The PLL can be enabled only if the OSCRANGE (OPT3:1) bits
are configured to 2 ~ 4 MHz. Otherwise, the device functionality is not
guaranteed.
Table 144. Package selection (OPT7)
Note:
230/247
Version
Selected package
Flash size
PKG1
R/AR
LQFP64
32/48/60 Kbytes
1
48/60 Kbytes
0
J
LQFP44
32 Kbytes
1
On the chip, each I/O port has up to eight pads. Pads that are not bonded to external pins
are in input pull-up configuration after reset. The configuration of these pads must be kept at
reset state to avoid added current consumption.
ST72321Bxxx-Auto
21.1.2
Device configuration and ordering information
Flash ordering information
The following Table 145 serves as a guide for ordering.
Table 145. Flash user programmable device types
Order code(1)
Package
Memory (Kbytes)
ST72F321BJ6TARE
ST72F321BJ7TARE
32
LQFP44 (10 x 10)
48
ST72F321BJ9TARE
60
ST72F321BAR6TARE
32
ST72F321BAR7TARE
LQFP64 (10 x 10)
48
ST72F321BAR9TARE
60
ST72F321BR6TARE
32
ST72F321BR7TARE
LQFP64 (14 x 14)
60
ST72F321BJ6TCRE
32
LQFP44 (10 x 10)
48
ST72F321BJ9TCRE
60
ST72F321BAR6TCRE
32
ST72F321BAR7TCRE
LQFP64 (10 x 10)
48
ST72F321BAR9TCRE
60
ST72F321BR6TCRE
32
ST72F321BR7TCRE
LQFP64 (14 x 14)
ST72F321BR9TCRE
-40°C to +85°C
48
ST72F321BR9TARE
ST72F321BJ7TCRE
Temperature range
-40°C to +125°C
48
60
1. R = Tape and Reel (left blank if Tray)
Figure 102. Flash commercial product code structure
DEVICE PINOUT PROG MEM PACKAGE TEMP RANGE R E
E = Lead-free (ECOPACK®)
Conditioning options:
R = Tape and Reel (left blank if Tray)
A = -40 to +85°C
C = -40 to +125°C
T = Low profile quad flat pack
6 = 32 Kbytes
7 = 48 Kbytes
9 = 60 Kbytes
J = 44 pins
AR = 64 pins (10x10)
R = 64 pins (14x14)
ST72F321B
231/247
Device configuration and ordering information
21.2
ST72321Bxxx-Auto
ROM device ordering information and transfer of customer
code
Customer code is made up of the ROM/FASTROM contents and the list of the selected
options (if any). The ROM/FASTROM contents are to be sent on diskette, or by electronic
means, with the S19 hexadecimal file generated by the development tool. All unused bytes
must be set to FFh.
Complete the appended ST72321B-Auto MIcrocontroller FASTROM/ROM Option List on
page 236 to communicate the selected options to STMicroelectronics and check for regular
updates of the option list on the ST website or ask your ST representative.
Refer to application note AN1635 for information on the counter listing returned by ST after
code has been transferred.
The following Table 146: FASTROM factory coded device types and Table 147: ROM factory
coded device types on page 234 serve as guides for ordering. The STMicroelectronics
Sales Organization will be pleased to provide detailed information on contractual points.
Caution:
The Readout Protection binary value is inverted between ROM and Flash products. The
option byte checksum will differ between ROM and Flash.
Table 146. FASTROM factory coded device types
Order code(1)
Package
ST72P321B(J6)TAxxxRE
ST72P321B(J7)TAxxxRE
LQFP44 (10 x 10)
48
60
ST72P321B(AR6)TAxxxRE
32
LQFP64 (10 x 10)
48
ST72P321B(AR9)TAxxxRE
60
ST72P321B(R6)TAxxxRE
32
ST72P321B(R7)TAxxxRE
LQFP64 (14 x 14)
60
ST72P321B(J6)TBxxxRE
32
LQFP44 (10 x 10)
48
ST72P321B(J9)TBxxxRE
60
ST72P321B(AR6)TBxxxRE
32
ST72P321B(AR7)TBxxxRE
LQFP64 (10 x 10)
48
ST72P321B(AR9)TBxxxRE
60
ST72P321B(R6)TBxxxRE
32
ST72P321B(R7)TBxxxRE
ST72P321B(R9)TBxxxRE
LQFP64 (14 x 14)
-40°C to +85°C
48
ST72P321B(R9)TAxxxRE
ST72P321B(J7)TBxxxRE
Temperature range
32
ST72P321B(J9)TAxxxRE
ST72P321B(AR7)TAxxxRE
232/247
Memory (Kbytes)
48
60
-40°C to +105°C
ST72321Bxxx-Auto
Device configuration and ordering information
Table 146. FASTROM factory coded device types (continued)
Order code(1)
Package
Memory (Kbytes)
ST72P321B(J6)TCxxxRE
ST72P321B(J7)TCxxxRE
32
LQFP44 (10 x 10)
48
ST72P321B(J9)TCxxxRE
60
ST72P321B(AR6)TCxxxRE
32
ST72P321B(AR7)TCxxxRE
LQFP64 (10 x 10)
48
ST72P321B(AR9)TCxxxRE
60
ST72P321B(R6)TCxxxRE
32
ST72P321B(R7)TCxxxRE
Temperature range
LQFP64 (14 x 14)
ST72P321B(R9)TCxxxRE
-40°C to +125°C
48
60
1. - The two or three characters in parentheses which represent the pinout and program memory size are for
reference only and are not visible in the final commercial product order code.
- ‘xxx’ represents the code name defined by STMicroelectronics: It denotes the ROM code, pinout and
program memory size.
- R = Tape and Reel (left blank if Tray)
Figure 103. FASTROM commercial product code structure
DEVICE PACKAGE TEMP RANGE xxx R E
E = Lead-free (ECOPACK®)
Conditioning options:
R = Tape and Reel (left blank if Tray)
Code name (defined by STMicroelectronics)
(denotes ROM code, pinout and program memory size)
A = -40 to 85°C
B = -40 to 105°C
C = -40 to 125°C
T = Low profile quad flat pack
ST72P321B
233/247
Device configuration and ordering information
ST72321Bxxx-Auto
Table 147. ROM factory coded device types
Order code(1)
Package
ST72321B(J6)TA/xxxRE
ST72321B(J7)TA/xxxRE
Memory (Kbytes)
32
LQFP44 (10 x 10)
48
ST72321B(J9)TA/xxxRE
60
ST72321B(AR6)TA/xxxRE
32
ST72321B(AR7)TA/xxxRE
LQFP64 (10 x 10)
48
ST72321B(AR9)TA/xxxRE
60
ST72321B(R6)TA/xxxRE
32
ST72321B(R7)TA/xxxRE
LQFP64 (14 x 14)
60
ST72321B(J6)TB/xxxRE
32
LQFP44 (10 x 10)
48
ST72321B(J9)TB/xxxRE
60
ST72321B(AR6)TB/xxxRE
32
ST72321B(AR7)TB/xxxRE
LQFP64 (10 x 10)
48
ST72321B(AR9)TB/xxxRE
60
ST72321B(R6)TB/xxxRE
32
ST72321B(R7)TB/xxxRE
LQFP64 (14 x 14)
60
ST72321B(J6)TC/xxxRE
32
LQFP44 (10 x 10)
48
ST72321B(J9)TC/xxxRE
60
ST72321B(AR6)TC/xxxRE
32
ST72321B(AR7)TC/xxxRE
LQFP64 (10 x 10)
48
ST72321B(AR9)TC/xxxRE
60
ST72321B(R6)TC/xxxRE
32
ST72321B(R7)TC/xxxRE
ST72321B(R9)TC/xxxRE
LQFP64 (14 x 14)
-40°C to +105°C
48
ST72321B(R9)TB/xxxRE
ST72321B(J7)TC/xxxRE
-40°C to +85°C
48
ST72321B(R9)TA/xxxRE
ST72321B(J7)TB/xxxRE
Temperature range
-40°C to +125°C
48
60
1. - The two or three characters in parentheses which represent the pinout and program memory size are for
reference only and are not visible in the final commercial product order code.
- ‘xxx’ represents the code name defined by STMicroelectronics: It denotes the ROM code, pinout and
program memory size.
- R = Tape and Reel (left blank if Tray)
234/247
ST72321Bxxx-Auto
Device configuration and ordering information
Figure 104. ROM commercial product code structure
DEVICE PACKAGE TEMP RANGE / xxx R E
E = Lead-free (ECOPACK®)
Conditioning options:
R = Tape and Reel (left blank if Tray)
Code name (defined by STMicroelectronics)
(denotes ROM code, pinout and program memory size)
A = -40 to 85°C
B = -40 to 105°C
C = -40 to 125°C
T = Low profile quad flat pack
ST72321B
235/247
Device configuration and ordering information
ST72321Bxxx-Auto
ST72321B-Auto MIcrocontroller FASTROM/ROM Option List
(Last update: October 2007)
Customer:
Address:
Contact:
Phone No:
Reference:
...................................
...................................
...................................
...................................
...................................
...................................
The FASTROM/ROM code name is assigned by STMicroelectronics.
FASTROM/ROM code must be sent in .S19 format. .Hex extension cannot be processed.
Device Type/Memory Size/Package (check only one option):
-----------------------------------------------------------------------------------------------------------------------------------------------------FASTROM DEVICE:
60K
48K
32K
-----------------------------------------------------------------------------------------------------------------------------------------------------LQFP44 10x10:
[ ] ST72P321B(J9)T
[ ] ST72P321B(J7)T
[ ] ST72P321B(J6)T
LQFP64 10x10:
[ ] ST72P321B(AR9)T
[ ] ST72P321B(AR7)T
[ ] ST72P321B(AR6)T
LQFP64 14x14:
[ ] ST72P321B(R9)T
[ ] ST72P321B(R7)T
[ ] ST72P321B(R6)T
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ROM DEVICE:
60K
48K
32K
------------------------------------------------------------------------------------------------------------------------------------------------------LQFP44 10x10:
[ ] ST72321B(J9)T
[ ] ST72321B(J7)T
[ ] ST72321B(J6)T
LQFP64 10x10:
[ ] ST72321B(AR9)T
[ ] ST72321B(AR7)T
[ ] ST72321B(AR6)T
LQFP64 14x14:
[ ] ST72321B(R9)T
[ ] ST72321B(R7)T
[ ] ST72321B(R6)T
------------------------------------------------------------------------------------------------------------------------------------------------------Conditioning for LQFP package (check only one option):
[ ] Tape & Reel
[ ] Tray
Temperature range :
[ ] A (-40°C to +85°C)
[ ] B (-40°C to +105°C)
[ ] C (-40°C to +125°C)
Special Marking:
[ ] No
Clock Source Selection:
[ ] Resonator:
[ ] LP: Low power resonator (1 to 2 MHz)
[ ] MP: Medium power resonator (2 to 4 MHz)
[ ] MS: Medium speed resonator (4 to 8 MHz)
[ ] HS: High speed resonator (8 to 16 MHz)
[ ] Internal RC
[ ] External Clock (sets MP Medium Power resonator in Option Byte)
PLL (1)(2)
[ ] Disabled
[ ] Enabled
LVD Reset
[ ] Disabled
[ ] Med.threshold
[ ] High threshold
[ ] Low threshold
Reset Delay
[ ] 256 Cycles
[ ] 4096 Cycles
Watchdog Selection
[ ] Software Activation [ ] Hardware Activation
Halt when Watchdog on
[ ] Reset
[ ] No reset
Readout Protection
[ ] Disabled
[ ] Enabled
Date
[ ] Yes "_ _ _ _ _ _ _ _ _ _ " (10 characters max)
Authorized characters are letters, digits, '.', '-', '/' and spaces only.
. . . . . . . . Signature . . . . . . . . . . . . . . . .
Note 1 : PLL must be disabled if internal RC Network is selected.
Note 2 : The PLL can be enabled only if the resonator is configured to “Medium Power: 2~4 MHz”.
CAUTION: The Readout Protection binary value is inverted between ROM and Flash products. The option byte checksum will
differ between ROM and Flash.
Please download the latest version of this option list from www.st.com.
236/247
ST72321Bxxx-Auto
21.3
Development tools
21.3.1
Introduction
Device configuration and ordering information
Development tools for the ST7 microcontrollers include a complete range of hardware
systems and software tools from STMicroelectronics and third-party tool suppliers. The
range of tools includes solutions to help you evaluate microcontroller peripherals, develop
and debug your application, and program your microcontrollers.
21.3.2
Evaluation tools and starter kits
ST offers complete, affordable starter kits and full-featured evaluation boards that allow you
to evaluate microcontroller features and quickly start developing ST7 applications. Starter
kits are complete, affordable hardware/software tool packages that include features and
samples to help you quickly start developing your application. ST evaluation boards are
open-design, embedded systems, which are developed and documented to serve as
references for your application design. They include sample application software to help you
demonstrate, learn about and implement your ST7’s features.
21.3.3
Development and debugging tools
Application development for ST7 is supported by fully optimizing C Compilers and the ST7
Assembler-Linker toolchain, which are all seamlessly integrated in the ST7 integrated
development environments in order to facilitate the debugging and fine-tuning of your
application. The Cosmic C Compiler is available in a free version that outputs up to
16 Kbytes of code.
The range of hardware tools includes cost effective ST7-DVP3 series emulators. These
tools are supported by the ST7 Toolset from STMicroelectronics, which includes the STVD7
integrated development environment (IDE) with high-level language debugger, editor,
project manager and integrated programming interface.
21.3.4
Programming tools
During the development cycle, the ST7-DVP3 and ST7-EMU3 series emulators and the
RLink provide in-circuit programming capability for programming the Flash microcontroller
on your application board.
ST also provides a low-cost dedicated in-circuit programmer, the ST7-STICK, as well as
ST7 socket boards which provide all the sockets required for programming any of the
devices in a specific ST7 subfamily on a platform that can be used with any tool with incircuit programming capability for ST7.
For production programming of ST7 devices, ST’s third-party tool partners also provide a
complete range of gang and automated programming solutions, which are ready to integrate
into your production environment.
For additional ordering codes for spare parts, accessories and tools available for the ST7
(including from third party manufacturers), refer to the online product selector at
www.st.com/mcu.
237/247
Device configuration and ordering information
ST72321Bxxx-Auto
Table 148. STMicroelectronics development tools
Emulation
Supported
products
ST7 DVP3 series
Emulator
ST72321BAR,
ST72F321BAR
ST72321BR,
ST72F321BR
Connection kit
ST7MDT20T6A/DVP
ST7MDT20DVP3
ST72321BJ,
ST72F321BJ
ST7MDT20T64/DVP
ST7MDT20T44/DVP
Programming
ST7 EMU3 series
ICC socket
board
Emulator
Active probe
and T.E.B.
ST7MDT20MEMU3
ST7MDT20MTEB
ST7SB20M/xx(1)
ST7MDT20JEMU3
ST7MDT20JTEB
ST7SB20J/xx(1)
1. Add suffix /EU, /UK, /US for the power supply of your region.
Table 149. Suggested list of socket types
Socket
(supplied with ST7MDT20M-EMU3)
Device
Emulator adapter
(supplied with ST7MDT20M-EMU3)
LQFP64 14 x14
CAB 3303262
CAB 3303351
LQFP64 10 x10
YAMAICHI IC149-064-*75-*5
YAMAICHI ICP-064-6
LQFP44 10 x10
YAMAICHI IC149-044-*52-*5
YAMAICHI ICP-044-5
21.3.5
Socket and emulator adapter information
For information on the type of socket that is supplied with the emulator, refer to the
suggested list of sockets in Table 149.
Note:
Before designing the board layout, it is recommended to check the overall dimensions of the
socket as they may be greater than the dimensions of the device.
For footprint and other mechanical information about these sockets and adapters, refer to
the manufacturer’s datasheet.
Related documentation
ST7 Visual Develop Software Key Debugging Features (AN 978)
ST7 Visual Develop for ST7 Cosmic C toolset users (AN 1938)
ST7 Visual Develop for ST7 Assembler Linker toolset users (AN 1940)
21.4
ST7 application notes
All relevant ST7 application notes can be found on www.st.com.
238/247
ST72321Bxxx-Auto
22
Known limitations
22.1
All Flash and ROM devices
22.1.1
Unexpected reset fetch
Known limitations
If an interrupt request occurs while a “POP CC” instruction is executed, the interrupt
controller does not recognize the source of the interrupt and, by default, passes the RESET
vector address to the CPU.
Workaround
To solve this issue, a “POP CC” instruction must always be preceded by a “SIM” instruction.
22.1.2
External interrupt missed
To avoid any risk of generating a parasitic interrupt, the edge detector is automatically
disabled for one clock cycle during an access to either DDR and OR. Any input signal edge
during this period will not be detected and will not generate an interrupt.
This case can typically occur if the application refreshes the port configuration registers at
intervals during runtime.
Workaround
The workaround is based on software checking the level on the interrupt pin before and after
writing to the PxOR or PxDDR registers. If there is a level change (depending on the
sensitivity programmed for this pin) the interrupt routine is invoked using the call instruction
with three extra PUSH instructions before executing the interrupt routine (this is to make the
call compatible with the IRET instruction at the end of the interrupt service routine).
But detection of the level change does not make sure that edge occurs during the critical 1
cycle duration and the interrupt has been missed. This may lead to occurrence of same
interrupt twice (one hardware and another with software call).
To avoid this, a semaphore is set to ‘1’ before checking the level change. The semaphore is
changed to level '0' inside the interrupt routine. When a level change is detected, the
semaphore status is checked. If it is ‘1’, it means that the last interrupt has been missed. In
this case, the interrupt routine is invoked with the call instruction.
There is another possible case, that is, if PxOR or PxDDR are written to with global
interrupts disabled (interrupt mask bit set). In this case, the semaphore is changed to ‘1’
when the level change is detected. Detecting a missed interrupt is done after the global
interrupts are enabled (interrupt mask bit reset) and by checking the status of the
semaphore. If it is ‘1’, it means that the last interrupt was missed and the interrupt routine is
invoked with the call instruction.
To implement the workaround, the following software sequence is to be followed for writing
into the PxOR/PxDDR registers. The example is for Port PF1 with falling edge interrupt
sensitivity. The software sequence is given for both cases (global interrupts disabled / global
interrupts enabled):
Case 1: Writing to PxOR or PxDDR with global interrupts enabled:
LD A,#01
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LD sema,A
; set the semaphore to '1'
LD A,PFDR
AND A,#02
LD X,A
; store the level before writing to PxOR/PxDDR
LD A,#$90
LD PFDDR,A
; Write to PFDDR
LD A,#$ff
LD PFOR,A
; Write to PFOR
LD A,PFDR
AND A,#02
LD Y,A
; store the level after writing to PxOR/PxDDR
LD A,X
; check for falling edge
cp A,#02
jrne OUT
TNZ Y
jrne OUT
LD A,sema
; check the semaphore status if edge is detected
CP A,#01
jrne OUT
call call_routine
; call the interrupt routine
OUT:LD A,#00
LD sema,A
.call_routine
; entry to call_routine
PUSH A
PUSH X
PUSH CC
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.ext1_rt
; entry to interrupt routine
LD A,#00
LD sema,A
IRET
Case 2: Writing to PxOR or PxDDR with global interrupts disabled:
SIM
; set the interrupt mask
LD A,PFDR
AND A,#$02
LD X,A
; store the level before writing to PxOR/PxDDR
LD A,#$90
LD PFDDR,A
; Write into PFDDR
LD A,#$ff
LD PFOR,A
; Write to PFOR
LD A,PFDR
AND A,#$02
LD Y,A
; store the level after writing to PxOR/PxDDR
LD A,X
; check for falling edge
cp A,#$02
jrne OUT
TNZ Y
jrne OUT
LD A,#$01
LD sema,A
; set the semaphore to '1' if edge is detected
RIM
; reset the interrupt mask
LD A,sema
; check the semaphore status
CP A,#$01
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jrne OUT
call call_routine
; call the interrupt routine
RIM
OUT:
RIM
JP while_loop
.call_routine
; entry to call_routine
PUSH A
PUSH X
PUSH CC
.ext1_rt
; entry to interrupt routine
LD A,#$00
LD sema,A
IRET
22.1.3
Clearing active interrupts outside interrupt routine
When an active interrupt request occurs at the same time as the related flag is being
cleared, an unwanted reset may occur.
Note:
Clearing the related interrupt mask will not generate an unwanted reset.
Concurrent interrupt context
The symptom does not occur when the interrupts are handled normally, that is, when:
●
The interrupt flag is cleared within its own interrupt routine
●
The interrupt flag is cleared within any interrupt routine
●
The interrupt flag is cleared in any part of the code while this interrupt is disabled
If these conditions are not met, the symptom can be avoided by implementing the following
sequence:
Perform SIM and RIM operation before and after resetting an active interrupt request.
Example:
SIM
Reset interrupt flag
RIM
Nested interrupt context
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The symptom does not occur when the interrupts are handled normally, that is, when:
●
The interrupt flag is cleared within its own interrupt routine
●
The interrupt flag is cleared within any interrupt routine with higher or identical priority
level
●
The interrupt flag is cleared in any part of the code while this interrupt is disabled
If these conditions are not met, the symptom can be avoided by implementing the following
sequence:
PUSH CC
SIM
Reset interrupt flag
POP CC
22.1.4
SCI wrong break duration
Description
A single break character is sent by setting and resetting the SBK bit in the SCICR2 register.
In some cases, the break character may have a longer duration than expected:
●
20 bits instead of 10 bits if M = 0
●
22 bits instead of 11 bits if M = 1
In the same way, as long as the SBK bit is set, break characters are sent to the TDO pin.
This may lead to generating one break more than expected.
Occurrence
The occurrence of the problem is random and proportional to the baud rate. With a transmit
frequency of 19200 baud (fCPU = 8 MHz and SCIBRR = 0xC9), the wrong break duration
occurrence is around 1%.
Workaround
If this wrong duration is not compliant with the communication protocol in the application,
software can request that an Idle line be generated before the break character. In this case,
the break duration is always correct assuming the application is not doing anything between
the idle and the break. This can be ensured by temporarily disabling interrupts.
The exact sequence is:
22.1.5
●
Disable interrupts
●
Reset and Set TE (IDLE request)
●
Set and Reset SBK (Break Request)
●
Re-enable interrupts
16-bit timer PWM mode
In PWM mode, the first PWM pulse is missed after writing the value FFFCh in the OC1R
register (OC1HR, OC1LR). It leads to either full or no PWM during a period, depending on
the OLVL1 and OLVL2 settings.
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Known limitations
22.1.6
ST72321Bxxx-Auto
TIMD set simultaneously with OC interrupt
If the 16-bit timer is disabled at the same time the output compare event occurs, the output
compare flag then gets locked and cannot be cleared before the timer is enabled again.
Impact on the application
If the output compare interrupt is enabled, then the output compare flag cannot be cleared in
the timer interrupt routine. Consequently, the interrupt service routine is called repeatedly.
Workaround
Disable the timer interrupt before disabling the timer. Again while enabling, first enable the
timer, then the timer interrupts.
●
●
22.1.7
Perform the following to disable the timer:
–
TACR1 or TBCR1 = 0x00h; // Disable the compare interrupt
–
TACSR | or TBCSR | = 0x40; // Disable the timer
Perform the following to enable the timer again:
–
TACSR & or TBCSR & = ~0x40; // Enable the timer
–
TACR1 or TBCR1 = 0x40; // Enable the compare interrupt
I2C multimaster
In multimaster configurations, if the ST7 I2C receives a START condition from another I2C
master after the START bit is set in the I2CCR register and before the START condition is
generated by the ST7 I2C, it may ignore the START condition from the other I2C master. In
this case, the ST7 master will receive a NACK from the other device. On reception of the
NACK, ST7 can send a restart and Slave address to re-initiate communication.
22.1.8
Pull-up always active on PE2
The I/O port internal pull-up is always active on I/O port E2. As a result, if PE2 is in output
mode low level, current consumption in Halt/Active Halt mode is increased.
22.2
Limitations specific to 44-pin 32 Kbyte ROM devices
22.2.1
Halt/Active Halt mode power consumption with external clock
enabled
The power consumption in Halt/Active Halt mode with external clock enabled is increased by
40µA typ.
22.2.2
Active Halt power consumption
The power consumption in Active Halt mode is 190µA typ. and 300µA max. These
measurements are done with an external clock source. However to obtain the total device
consumption, the clock source consumption has to be added.
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22.2.3
Known limitations
I²C exit from Halt/Active Halt
Contrary to the behavior specified in the datasheet, the I2C interrupt is capable of exiting the
device from Halt/Active Halt mode.
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Revision history
23
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Revision history
Table 150. Document revision history
Date
Revision
05-Oct-2007
1
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Changes
Initial release
ST72321Bxxx-Auto
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