STMICROELECTRONICS ST7FLITE25F2M6

ST7LITE2
8-BIT MICROCONTROLLER WITH SINGLE VOLTAGE FLASH
MEMORY, DATA EEPROM, ADC, TIMERS, SPI
Memories
– 8 Kbytes single voltage Flash Program memory with read-out protection, In-Circuit Programming and In-Application programming
(ICP and IAP). 10K write/erase cycles guaranteed, data retention: 20 years at 55°C.
– 384 bytes RAM
■ Clock, Reset and Supply Management
– Enhanced reset system
– Enhanced low voltage supervisor (LVD) for
main supply and an auxiliary voltage detector
(AVD) with interrupt capability for implementing safe power-down procedures
– Clock sources: Internal 1% RC oscillator,
crystal/ceramic resonator or external clock
– Internal 32-MHz input clock for Auto-reload
timer
– Optional x4 or x8 PLL for 4 or 8 MHz internal
clock
– Five Power Saving Modes: Halt, Active-Halt,
Wait and Slow, Auto Wake Up From Halt
■ I/O Ports
– Up to 15 multifunctional bidirectional I/O lines
– 7 high sink outputs
■ 4 Timers
– Configurable Watchdog Timer
– Two 8-bit Lite Timers with prescaler,
1 realtime base and 1 input capture
– One 12-bit Auto-reload Timer with 4 PWM
outputs, input capture and output compare
functions
Device Summary
■
Features
Program memory - bytes
RAM (stack) - bytes
Data EEPROM - bytes
Peripherals
ST7LITE20
Lite Timer with Watchdog,
Autoreload Timer, SPI,
10-bit ADC with Op-Amp
Operating Supply
CPU Frequency
Operating Temperature
Packages
Up to 8Mhz
(w/ ext OSC up to 16MHz)
DIP20
■
■
■
■
■
SO20
300”
1 Communication Interface
– SPI synchronous serial interface
Interrupt Management
– 10 interrupt vectors plus TRAP and RESET
– 15 external interrupt lines (on 4 vectors)
A/D Converter
– 7 input channels
– Fixed gain Op-amp
– 13-bit resolution for 0 to 430 mV (@ 5V VDD)
– 10-bit resolution for 430 mV to 5V (@ 5V VDD)
Instruction Set
– 8-bit data manipulation
– 63 basic instructions with illegal opcode detection
– 17 main addressing modes
– 8 x 8 unsigned multiply instructions
Development Tools
– Full hardware/software development package
– DM (Debug Module)
ST7LITE25
ST7LITE29
8K
384 (128)
256
Lite Timer with Watchdog,
Autoreload Timer with 32-MHz input clock,
SPI, 10-bit ADC with Op-Amp
2.4V to 5.5V
Up to 8Mhz (w/ ext OSC up to 16MHz
and int 1MHz RC 1% PLLx8/4MHz)
-40°C to +85°C
SO20 300”, DIP20
Rev. 4
July 2006
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1
Table of Contents
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2
MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3
PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.4
ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.5
MEMORY PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.6
RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.7
REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 DATA EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2
MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.3
MEMORY ACCESS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.4
POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.5
ACCESS ERROR HANDLING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.6
DATA EEPROM READ-OUT PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.7
REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.2
MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.3
CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.1 INTERNAL RC OSCILLATOR ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.2
PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.3
REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.4
MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.5
RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.6
SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.1 NON MASKABLE SOFTWARE INTERRUPT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.2
EXTERNAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.3
PERIPHERAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.2
SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.3
WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9.4
HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
9.5
ACTIVE-HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
133
AUTO WAKE UP FROM HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9.6
10 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
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Table of Contents
10.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
10.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
10.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
10.4 UNUSED I/O PINS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
10.5 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
10.6 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
10.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
11.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
11.2
12-BIT AUTORELOAD TIMER 2 (AT2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
11.3 LITE TIMER 2 (LT2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
11.4 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
11.5 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
12.1 ST7 ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
13.10 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 113
13.11 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
14.2 SOLDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
15 DEVICE CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
15.1 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 124
15.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
15.4 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
16 IMPORTANT NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
16.1 EXECUTION OF BTJX INSTRUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
16.2 ADC CONVERSION SPURIOUS RESULTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
16.3 A/ D CONVERTER ACCURACY FOR FIRST CONVERSION . . . . . . . . . . . . . . . . . . . 130
16.4 NEGATIVE INJECTION IMPACT ON ADC ACCURACY . . . . . . . . . . . . . . . . . . . . . . . 130
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16.5 CLEARING ACTIVE INTERRUPTS OUTSIDE INTERRUPT ROUTINE . . . . . . . . . . . . 130
16.6 USING PB4 AS EXTERNAL INTERRUPT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
16.7 TIMEBASE 2 INTERRUPT IN SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
17 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
To obtain the most recent version of this datasheet,
please check at www.st.com>products>technical literature>datasheet
Please also pay special attention to the Section “IMPORTANT NOTES” on page 130.
133
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ST7LITE2
1 INTRODUCTION
The ST7LITE2 is a member of the ST7 microcontroller family. All ST7 devices are based on a common industry-standard 8-bit core, featuring an enhanced instruction set.
The ST7LITE2 features FLASH memory with
byte-by-byte In-Circuit Programming (ICP) and InApplication Programming (IAP) capability.
Under software control, the ST7LITE2 device can
be placed in WAIT, SLOW, or HALT mode, reducing power consumption when the application is in
idle or standby state.
The enhanced instruction set and addressing
modes of the ST7 offer both power and flexibility to
software developers, enabling the design of highly
efficient and compact application code. In addition
to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing
modes.
For easy reference, all parametric data are located
in section 13 on page 91.
The devices feature an on-chip Debug Module
(DM) to support in-circuit debugging (ICD). For a
description of the DM registers, refer to the ST7
ICC Protocol Reference Manual.
Figure 1. General Block Diagram
Int.
1% RC
1MHz
PLL
8MHz -> 32MHz
12-Bit
Auto-Reload
TIMER 2
PLL x 8
or PLL X4
CLKIN
8-Bit
LITE TIMER 2
/2
OSC1
OSC2
Ext.
OSC
1MHz
to
16MHz
Internal
CLOCK
VDD
VSS
RESET
POWER
SUPPLY
CONTROL
8-BIT CORE
ALU
PORT B
ADDRESS AND DATA BUS
LVD
PORT A
PA7:0
(8 bits)
PB6:0
(7 bits)
ADC
+ OpAmp
SPI
Debug Module
PROGRAM
MEMORY
(8K Bytes)
DATA EEPROM
(256 Bytes)
RAM
(384 Bytes)
WATCHDOG
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ST7LITE2
2 PIN DESCRIPTION
Figure 2. 20-Pin SO Package Pinout
VSS
1
20
OSC1/CLKIN
VDD
RESET
2
19
3
18
OSC2
PA0 (HS)/LTIC
SS/AIN0/PB0
4
SCK/AIN1/PB1
5
MISO/AIN2/PB2
6
15
PA3 (HS)/ATPWM1
MOSI/AIN3/PB3
7
14
PA4 (HS)/ATPWM2
CLKIN/AIN4/PB4
8
13
AIN5/PB5
AIN6/PB6
9
12
PA5 (HS)/ATPWM3/ICCDATA
PA6/MCO/ICCCLK/BREAK
10
11
PA7(HS)
ei0
ei3
ei2
ei1
17
PA1 (HS)/ATIC
16
PA2 (HS)/ATPWM0
(HS) 20mA high sink capability
eix associated external interrupt vector
Figure 3. 20-Pin DIP Package Pinout
MISO/AIN2/PB2
1
ei3
ei3
20
SCK/AIN1/PB1
MOSI/AIN3/PB3
CLKIN/AIN4/PB4
2
19
3
18
SS/AIN0/PB0
RESET
AIN5/PB5
4
17
VDD
AIN6/PB6
5
16
VSS
PA7(HS)
6
15
OSC1/CLKIN
ei2
MCO/ICCCLK/BREAK/PA6
7
14
OSC2
ATPWM3/ICCDATA/PA5(HS)
8
13
ATPWM2/PA4(HS)
ATPWM1/PA3(HS)
9
12
PA0(HS)/LTIC
PA1(HS)/ATIC
11
PA2(HS)/ATPWM0
10
ei1
ei0
ei0
(HS) 20mA high sink capability
eix associated external interrupt vector
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ST7LITE2
PIN DESCRIPTION (Cont’d)
Legend / Abbreviations for Table 1:
Type:
I = input, O = output, S = supply
In/Output level: CT= CMOS 0.3VDD/0.7VDD with input trigger
Output level:
HS = 20mA high sink (on N-buffer only)
Port and control configuration:
– Input:
float = floating, wpu = weak pull-up, int = interrupt, ana = analog
– Output:
OD = open drain, PP = push-pull
The RESET configuration of each pin is shown in bold which is valid as long as the device is in reset state.
Table 1. Device Pin Description
Port / Control
PP
OD
Output
ana
int
wpu
Input
float
Output
Pin Name
Input
Level
Type
DIP20
SO20
Pin No.
Main
Function
(after reset)
Alternate Function
1
16 VSS
S
Ground
2
17 VDD
S
Main power supply
3
18 RESET
I/O CT
4
19 PB0/AIN0/SS
I/O
X
CT
X
X
X
X
X
ei3
Top priority non maskable interrupt (active
low)
ADC Analog Input 0 or SPI
Slave Select (active low)
Caution: No negative current
Port B0
injection allowed on this pin.
For details, refer to section
13.2.2 on page 92
ADC Analog Input 1 or SPI Serial Clock
Caution: No negative current
Port B1
injection allowed on this pin.
For details, refer to section
13.2.2 on page 92
ADC Analog Input 2 or SPI
Port B2
Master In/ Slave Out Data
ADC Analog Input 3 or SPI
Port B3
Master Out / Slave In Data
ADC Analog Input 4 or ExterPort B4
nal clock input
5
20 PB1/AIN1/SCK
I/O
CT
X
X
X
X
6
1
PB2/AIN2/MISO
I/O
CT
X
X
X
X
7
2
PB3/AIN3/MOSI
I/O
CT
X
X
X
X
8
3
PB4/AIN4/CLKIN I/O
CT
X
X
X
X
9
4
PB5/AIN5
I/O
CT
X
X
X
X
Port B5
ADC Analog Input 5
10
5
PB6/AIN6
I/O
CT
X
X
X
X
Port B6
ADC Analog Input 6
11
6
PA7
I/O CT HS
X
X
Port A7
X
ei2
ei1
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ST7LITE2
Port / Control
PP
OD
Output
ana
int
wpu
Input
float
Output
Type
DIP20
SO20
Pin Name
Input
Level
Pin No.
Main
Function
(after reset)
Alternate Function
Main Clock Output or In Circuit
Communication Clock or External BREAK
12
7
PA6 /MCO/
ICCCLK/BREAK
I/O
13
8
PA5 /ATPWM3/
ICCDATA
I/O CT HS
X
CT
X
ei1
X
X
Port A6
X
X
Port A5
ei1
14
9
PA4/ATPWM2
I/O CT HS
X
X
X
Port A4
Auto-Reload Timer PWM2
15
10 PA3/ATPWM1
I/O CT HS
X
X
X
Port A3
Auto-Reload Timer PWM1
16
11 PA2/ATPWM0
I/O CT HS
X
X
X
Port A2
Auto-Reload Timer PWM0
ei0
17
12 PA1/ATIC
I/O CT HS
X
X
X
Port A1
Auto-Reload Timer Input Capture
18
13 PA0/LTIC
I/O CT HS
X
X
X
Port A0
Lite Timer Input Capture
19
14 OSC2
O
Resonator oscillator inverter output
20
15 OSC1/CLKIN
I
Resonator oscillator inverter input or External clock input
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1
Caution: During normal operation this pin must be pulledup, internally or externally (external pull-up of 10k mandatory in noisy environment). This
is to avoid entering ICC mode
unexpectedly during a reset.
In the application, even if the
pin is configured as output,
any reset will put it back in input pull-up
Auto-Reload Timer PWM3 or
In Circuit Communication Data
ST7LITE2
3 REGISTER & MEMORY MAP
As shown in Figure 4, the MCU is capable of addressing 64K bytes of memories and I/O registers.
The available memory locations consist of 128
bytes of register locations, 384 bytes of RAM, 256
bytes of data EEPROM and 8 Kbytes of user program memory. The RAM space includes up to 128
bytes for the stack from 180h to 1FFh.
The highest address bytes contain the user reset
and interrupt vectors.
The Flash memory contains two sectors (see Figure 4) mapped in the upper part of the ST7 ad-
dressing space so the reset and interrupt vectors
are located in Sector 0 (F000h-FFFFh).
The size of Flash Sector 0 and other device options are configurable by Option byte (refer to section 15.1 on page 122).
IMPORTANT: Memory locations marked as “Reserved” must never be accessed. Accessing a reseved area can have unpredictable effects on the
device.
Figure 4. Memory Map
0080h
Short Addressing
RAM (zero page)
0000h
007Fh
0080h
HW Registers
(see Table 2)
00FFh
0100h
16-bit Addressing
RAM
RAM
(384 Bytes)
017Fh
0180h
Reserved
01FFh
01FFh
0200h
128 Bytes Stack
0FFFh
1000h
10FFh
1100h
1000h
Data EEPROM
(256 Bytes)
1001h
Reserved
DFFFh
E000h
E000h
Flash Memory
(8K)
FFDFh
FFE0h
FFFFh
8K FLASH
PROGRAM MEMORY
FBFFh
FC00h
FFFFh
Interrupt & Reset Vectors
(see Table 5)
RCCR0
RCCR1
see section 7.1 on page 23
7 Kbytes
SECTOR 1
1 Kbyte
SECTOR 0
FFDEh
FFDFh
RCCR0
RCCR1
see section 7.1 on page 23
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1
ST7LITE2
Table 2. Hardware Register Map
Address
Block
Register Label
0000h
0001h
0002h
Port A
PADR
PADDR
PAOR
Port A Data Register
Port A Data Direction Register
Port A Option Register
FFh1)
00h
40h
R/W
R/W
R/W
0003h
0004h
0005h
Port B
PBDR
PBDDR
PBOR
Port B Data Register
Port B Data Direction Register
Port B Option Register
FFh 1)
00h
00h
R/W
R/W
R/W2)
0006h
0007h
0008h
0009h
000Ah
000Bh
000Ch
000Dh
000Eh
000Fh
0010h
0011h
0012h
0013h
0014h
0015h
0016h
0017h
0018h
0019h
001Ah
001Bh
001Ch
001Dh
001Eh
001Fh
0020h
0021h
0022h
Reset Status
Remarks
Reserved Area (2 bytes)
LITE
TIMER 2
AUTORELOAD
TIMER 2
LTCSR2
LTARR
LTCNTR
LTCSR1
LTICR
Lite Timer Control/Status Register 2
Lite Timer Auto-reload Register
Lite Timer Counter Register
Lite Timer Control/Status Register 1
Lite Timer Input Capture Register
00h
00h
00h
0X00 0000h
00h
R/W
R/W
Read Only
R/W
Read Only
ATCSR
CNTRH
CNTRL
ATRH
ATRL
PWMCR
PWM0CSR
PWM1CSR
PWM2CSR
PWM3CSR
DCR0H
DCR0L
DCR1H
DCR1L
DCR2H
DCR2L
DCR3H
DCR3L
ATICRH
ATICRL
TRANCR
BREAKCR
Timer Control/Status Register
Counter Register High
Counter Register Low
Auto-Reload Register High
Auto-Reload Register Low
PWM Output Control Register
PWM 0 Control/Status Register
PWM 1 Control/Status Register
PWM 2 Control/Status Register
PWM 3 Control/Status Register
PWM 0 Duty Cycle Register High
PWM 0 Duty Cycle Register Low
PWM 1 Duty Cycle Register High
PWM 1 Duty Cycle Register Low
PWM 2 Duty Cycle Register High
PWM 2 Duty Cycle Register Low
PWM 3 Duty Cycle Register High
PWM 3 Duty Cycle Register Low
Input Capture Register High
Input Capture Register Low
Transfer Control Register
Break Control Register
0X00 0000h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
01h
00h
R/W
Read Only
Read Only
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Read Only
Read Only
R/W
R/W
0023h to
002Dh
Reserved area (11 bytes)
002Eh
WDG
WDGCR
Watchdog Control Register
7Fh
R/W
0002Fh
FLASH
FCSR
Flash Control/Status Register
00h
R/W
00030h
EEPROM
EECSR
Data EEPROM Control/Status Register
00h
R/W
0031h
0032h
0033h
SPI
SPIDR
SPICR
SPICSR
SPI Data I/O Register
SPI Control Register
SPI Control Status Register
xxh
0xh
00h
R/W
R/W
R/W
0034h
0035h
0036h
ADC
ADCCSR
ADCDRH
ADCDRL
A/D Control Status Register
A/D Data Register High
A/D Amplifier Control/Data Low Register
00h
xxh
0xh
R/W
Read Only
R/W
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1
Register Name
ST7LITE2
Address
Block
0037h
ITC
0038h
MCC
0039h
003Ah
Clock and
Reset
Register Label
004Bh
004Ch
004Dh
004Eh
004Fh
0050h
0051h to
007Fh
Remarks
External Interrupt Control Register
00h
R/W
MCCSR
Main Clock Control/Status Register
00h
R/W
RCCR
SICSR
RC oscillator Control Register
System Integrity Control/Status Register
FFh
0000 0XX0h
R/W
R/W
0Ch
R/W
Reserved area (1 byte)
ITC
EISR
003Dh to
0048h
0049h
004Ah
Reset Status
EICR
003Bh
003Ch
Register Name
External Interrupt Selection Register
Reserved area (12 bytes)
AWU
AWUPR
AWUCSR
AWU Prescaler Register
AWU Control/Status Register
FFh
00h
R/W
R/W
DM3)
DMCR
DMSR
DMBK1H
DMBK1L
DMBK2H
DMBK2L
DM Control Register
DM Status Register
DM Breakpoint Register 1 High
DM Breakpoint Register 1 Low
DM Breakpoint Register 2 High
DM Breakpoint Register 2 Low
00h
00h
00h
00h
00h
00h
R/W
R/W
R/W
R/W
R/W
R/W
Reserved area (47 bytes)
Legend: x=undefined, R/W=read/write
Notes:
1. The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the I/O pins are returned instead of the DR register contents.
2. The bits associated with unavailable pins must always keep their reset value.
3. For a description of the Debug Module registers, see ICC reference manual.
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ST7LITE2
4 FLASH PROGRAM MEMORY
4.1 Introduction
The ST7 single voltage extended Flash (XFlash) is
a non-volatile memory that can be electrically
erased and programmed either on a byte-by-byte
basis or up to 32 bytes in parallel.
The XFlash devices can be programmed off-board
(plugged in a programming tool) or on-board using
In-Circuit Programming or In-Application Programming.
The array matrix organisation allows each sector
to be erased and reprogrammed without affecting
other sectors.
4.2 Main Features
■
■
■
■
■
ICP (In-Circuit Programming)
IAP (In-Application Programming)
ICT (In-Circuit Testing) for downloading and
executing user application test patterns in RAM
Sector 0 size configurable by option byte
Read-out and write protection
4.3 PROGRAMMING MODES
The ST7 can be programmed in three different
ways:
– Insertion in a programming tool. In this mode,
FLASH sectors 0 and 1, option byte row and
data EEPROM (if present) can be programmed or erased.
– In-Circuit Programming. In this mode, FLASH
sectors 0 and 1, option byte row and data
EEPROM (if present) can be programmed or
erased without removing the device from the
application board.
– In-Application Programming. In this mode,
sector 1 and data EEPROM (if present) can
be programmed or erased without removing
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1
the device from the application board and
while the application is running.
4.3.1 In-Circuit Programming (ICP)
ICP uses a protocol called ICC (In-Circuit Communication) which allows an ST7 plugged on a printed circuit board (PCB) to communicate with an external programming device connected via cable.
ICP is performed in three steps:
Switch the ST7 to ICC mode (In-Circuit Communications). This is done by driving a specific signal
sequence on the ICCCLK/DATA pins while the
RESET pin is pulled low. When the ST7 enters
ICC mode, it fetches a specific RESET vector
which points to the ST7 System Memory containing the ICC protocol routine. This routine enables
the ST7 to receive bytes from the ICC interface.
– Download ICP Driver code in RAM from the
ICCDATA pin
– Execute ICP Driver code in RAM to program
the FLASH memory
Depending on the ICP Driver code downloaded in
RAM, FLASH memory programming can be fully
customized (number of bytes to program, program
locations, or selection of the serial communication
interface for downloading).
4.3.2 In Application Programming (IAP)
This mode uses an IAP Driver program previously
programmed in Sector 0 by the user (in ICP
mode).
This mode is fully controlled by user software. This
allows it to be adapted to the user application, (user-defined strategy for entering programming
mode, choice of communications protocol used to
fetch the data to be stored etc.).
IAP mode can be used to program any memory areas except Sector 0, which is write/erase protected to allow recovery in case errors occur during
the programming operation.
ST7LITE2
FLASH PROGRAM MEMORY (Cont’d)
4.4 ICC interface
A schottky diode can be used to isolate the application RESET circuit in this case. When using a
classical RC network with R>1K or a reset management IC with open drain output and pull-up resistor>1K, no additional components are needed.
In all cases the user must ensure that no external
reset is generated by the application during the
ICC session.
3. The use of Pin 7 of the ICC connector depends
on the Programming Tool architecture. This pin
must be connected when using most ST Programming Tools (it is used to monitor the application
power supply). Please refer to the Programming
Tool manual.
4. Pin 9 has to be connected to the CLKIN/PB4 pin
of the ST7 when the clock is not available in the
application or if the selected clock option is not
programmed in the option byte. ST7 devices with
multi-oscillator capability need to have OSC1 and
OSC2 grounded in this case.
5. With any programming tool, while the ICP option
is disabled, the external clock has to be provided
on PB4.
Caution: During normal operation the ICCCLK pin
must be pulled- up, internally or externally (external pull-up of 10k mandatory in noisy environment). This is to avoid entering ICC mode unexpectedly during a reset. In the application, even if
the pin is configured as output, any reset will put it
back in input pull-up.
ICP needs a minimum of 4 and up to 6 pins to be
connected to the programming tool. These pins
are:
– RESET: device reset
– VSS: device power supply ground
– ICCCLK: ICC output serial clock pin
– ICCDATA: ICC input serial data pin
– CLKIN/PB4: main clock input for external
source
– VDD: application board power supply (optional, see Note 3)
Notes:
1. If the ICCCLK or ICCDATA pins are only used
as outputs in the application, no signal isolation is
necessary. As soon as the Programming Tool is
plugged to the board, even if an ICC session is not
in progress, the ICCCLK and ICCDATA pins are
not available for the application. If they are used as
inputs by the application, isolation such as a serial
resistor has to be implemented in case another device forces the signal. Refer to the Programming
Tool documentation for recommended resistor values.
2. During the ICP session, the programming tool
must control the RESET pin. This can lead to conflicts between the programming tool and the application reset circuit if it drives more than 5mA at
high level (push pull output or pull-up resistor<1K).
Figure 5. Typical ICC Interface
PROGRAMMING TOOL
ICC CONNECTOR
ICC Cable
ICC CONNECTOR
HE10 CONNECTOR TYPE
(See Note 3)
OPTIONAL
(See Note 4)
9
7
5
3
1
10
8
6
4
2
APPLICATION BOARD
APPLICATION
RESET SOURCE
See Note 2
APPLICATION
POWER SUPPLY
ICCDATA
ICCCLK
ST7
RESET
CLKIN/PB4
(See Note 5)
VDD
See Note 1 and Caution APPLICATION
I/O
13/133
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ST7LITE2
FLASH PROGRAM MEMORY (Cont’d)
4.5 Memory Protection
There are two different types of memory protection: Read Out Protection and Write/Erase Protection which can be applied individually.
4.5.1 Read-out Protection
Read-out protection, when selected provides a
protection against program memory content extraction and against write access to Flash memory. Even if no protection can be considered as totally unbreakable, the feature provides a very high
level of protection for a general purpose microcontroller. Both program and data E2 memory are protected.
In flash devices, this protection is removed by reprogramming the option. In this case, both program and data E2 memory are automatically
erased and the device can be reprogrammed.
Read-out protection selection depends on the device type:
– In Flash devices it is enabled and removed
through the FMP_R bit in the option byte.
– In ROM devices it is enabled by mask option
specified in the Option List.
4.5.2 Flash Write/Erase Protection
Write/erase protection, when set, makes it impossible to both overwrite and erase program memory. It does not apply to E2 data. Its purpose is to
provide advanced security to applications and prevent any change being made to the memory content.
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Warning: Once set, Write/erase protection can
never be removed. A write-protected flash device
is no longer reprogrammable.
Write/erase protection is enabled through the
FMP_W bit in the option byte.
4.6 Related Documentation
For details on Flash programming and ICC protocol, refer to the ST7 Flash Programming Reference Manual and to the ST7 ICC Protocol Reference Manual.
4.7 Register Description
FLASH CONTROL/STATUS REGISTER (FCSR)
Read/Write
Reset Value: 000 0000 (00h)
1st RASS Key: 0101 0110 (56h)
2nd RASS Key: 1010 1110 (AEh)
7
0
0
0
0
0
0
OPT
LAT
PGM
Note: This register is reserved for programming
using ICP, IAP or other programming methods. It
controls the XFlash programming and erasing operations.
When an EPB or another programming tool is
used (in socket or ICP mode), the RASS keys are
sent automatically.
ST7LITE2
5 DATA EEPROM
5.1 INTRODUCTION
5.2 MAIN FEATURES
The Electrically Erasable Programmable Read
Only Memory can be used as a non volatile backup for storing data. Using the EEPROM requires a
basic access protocol described in this chapter.
■
■
■
■
■
■
Up to 32 Bytes programmed in the same cycle
EEPROM mono-voltage (charge pump)
Chained erase and programming cycles
Internal control of the global programming cycle
duration
WAIT mode management
Read-out protection
Figure 6. EEPROM Block Diagram
HIGH VOLTAGE
PUMP
EECSR
0
0
0
ADDRESS
DECODER
0
0
4
0
E2LAT E2PGM
EEPROM
ROW
MEMORY MATRIX
DECODER
(1 ROW = 32 x 8 BITS)
128
4
128
DATA
32 x 8 BITS
MULTIPLEXER
DATA LATCHES
4
ADDRESS BUS
DATA BUS
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ST7LITE2
DATA EEPROM (Cont’d)
5.3 MEMORY ACCESS
The Data EEPROM memory read/write access
modes are controlled by the E2LAT bit of the EEPROM Control/Status register (EECSR). The flowchart in Figure 7 describes these different memory
access modes.
Read Operation (E2LAT=0)
The EEPROM can be read as a normal ROM location when the E2LAT bit of the EECSR register is
cleared.
On this device, Data EEPROM can also be used to
execute machine code. Take care not to write to
the Data EEPROM while executing from it. This
would result in an unexpected code being executed.
Write Operation (E2LAT=1)
To access the write mode, the E2LAT bit has to be
set by software (the E2PGM bit remains cleared).
When a write access to the EEPROM area occurs,
the value is latched inside the 32 data latches according to its address.
When PGM bit is set by the software, all the previous bytes written in the data latches (up to 32) are
programmed in the EEPROM cells. The effective
high address (row) is determined by the last EEPROM write sequence. To avoid wrong programming, the user must take care that all the bytes
written between two programming sequences
have the same high address: only the five Least
Significant Bits of the address can change.
At the end of the programming cycle, the PGM and
LAT bits are cleared simultaneously.
Note: Care should be taken during the programming cycle. Writing to the same memory location
will over-program the memory (logical AND between the two write access data result) because
the data latches are only cleared at the end of the
programming cycle and by the falling edge of the
E2LAT bit.
It is not possible to read the latched data.
This note is illustrated by the Figure 9.
Figure 7. Data EEPROM Programming Flowchart
READ MODE
E2LAT=0
E2PGM=0
READ BYTES
IN EEPROM AREA
WRITE MODE
E2LAT=1
E2PGM=0
WRITE UP TO 32 BYTES
IN EEPROM AREA
(with the same 11 MSB of the address)
START PROGRAMMING CYCLE
E2LAT=1
E2PGM=1 (set by software)
0
CLEARED BY HARDWARE
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E2LAT
1
ST7LITE2
DATA EEPROM (Cont’d)
Figure 8. Data E2PROM Write Operation
⇓ Row / Byte ⇒
ROW
DEFINITION
0
1
2
3
...
30 31
Physical Address
0
00h...1Fh
1
20h...3Fh
...
Nx20h...Nx20h+1Fh
N
Read operation impossible
Byte 1
Byte 2
Byte 32
Read operation possible
Programming cycle
PHASE 1
PHASE 2
Writing data latches
Waiting E2PGM and E2LAT to fall
E2LAT bit
Set by USER application
Cleared by hardware
E2PGM bit
Note: If a programming cycle is interrupted (by a reset action), the integrity of the data in memory is not
guaranteed.
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ST7LITE2
DATA EEPROM (Cont’d)
5.4 POWER SAVING MODES
5.5 ACCESS ERROR HANDLING
Wait mode
The DATA EEPROM can enter WAIT mode on execution of the WFI instruction of the microcontroller or when the microcontroller enters Active-HALT
mode.The DATA EEPROM will immediately enter
this mode if there is no programming in progress,
otherwise the DATA EEPROM will finish the cycle
and then enter WAIT mode.
If a read access occurs while E2LAT=1, then the
data bus will not be driven.
If a write access occurs while E2LAT=0, then the
data on the bus will not be latched.
If a programming cycle is interrupted (by a RESET
action), the memory data will not be guaranteed.
Active-Halt mode
Refer to Wait mode.
Halt mode
The DATA EEPROM immediately enters HALT
mode if the microcontroller executes the HALT instruction. Therefore the EEPROM will stop the
function in progress, and data may be corrupted.
5.6 Data EEPROM Read-out Protection
The read-out protection is enabled through an option bit (see section 15.1 on page 122).
When this option is selected, the programs and
data stored in the EEPROM memory are protected
against read-out (including a re-write protection).
In Flash devices, when this protection is removed
by reprogramming the Option Byte, the entire Program memory and EEPROM is first automatically
erased.
Note: Both Program Memory and data EEPROM
are protected using the same option bit.
Figure 9. Data EEPROM programming cycle
READ OPERATION NOT POSSIBLE
READ OPERATION POSSIBLE
INTERNAL
PROGRAMMING
VOLTAGE
ERASE CYCLE
WRITE OF
DATA LATCHES
WRITE CYCLE
tPROG
LAT
PGM
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ST7LITE2
DATA EEPROM (Cont’d)
5.7 REGISTER DESCRIPTION
EEPROM CONTROL/STATUS REGISTER (EECSR)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
0
0
0
0
0
0
E2LAT E2PGM
Bit 0 = E2PGM Programming control and status
This bit is set by software to begin the programming
cycle. At the end of the programming cycle, this bit
is cleared by hardware.
0: Programming finished or not yet started
1: Programming cycle is in progress
Note: if the E2PGM bit is cleared during the programming cycle, the memory data is not guaranteed
Bits 7:2 = Reserved, forced by hardware to 0.
Bit 1 = E2LAT Latch Access Transfer
This bit is set by software. It is cleared by hardware at the end of the programming cycle. It can
only be cleared by software if the E2PGM bit is
cleared.
0: Read mode
1: Write mode
Table 3. DATA EEPROM Register Map and Reset Values
Address
(Hex.)
0030h
Register
Label
7
6
5
4
3
2
1
0
0
0
0
0
0
0
E2LAT
0
E2PGM
0
EECSR
Reset Value
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ST7LITE2
6 CENTRAL PROCESSING UNIT
6.1 INTRODUCTION
This CPU has a full 8-bit architecture and contains
six internal registers allowing efficient 8-bit data
manipulation.
6.2 MAIN FEATURES
■
■
■
■
■
■
■
■
63 basic instructions
Fast 8-bit by 8-bit multiply
17 main addressing modes
Two 8-bit index registers
16-bit stack pointer
Low power modes
Maskable hardware interrupts
Non-maskable software interrupt
6.3 CPU REGISTERS
The 6 CPU registers shown in Figure 10 are not
present in the memory mapping and are accessed
by specific instructions.
Accumulator (A)
The Accumulator is an 8-bit general purpose register used to hold operands and the results of the
arithmetic and logic calculations and to manipulate
data.
Index Registers (X and Y)
In indexed addressing modes, these 8-bit registers
are used to create either effective addresses or
temporary storage areas for data manipulation.
(The Cross-Assembler generates a precede instruction (PRE) to indicate that the following instruction refers to the Y register.)
The Y register is not affected by the interrupt automatic procedures (not pushed to and popped from
the stack).
Program Counter (PC)
The program counter is a 16-bit register containing
the address of the next instruction to be executed
by the CPU. It is made of two 8-bit registers PCL
(Program Counter Low which is the LSB) and PCH
(Program Counter High which is the MSB).
Figure 10. CPU Registers
7
0
ACCUMULATOR
RESET VALUE = XXh
7
0
X INDEX REGISTER
RESET VALUE = XXh
7
0
Y INDEX REGISTER
RESET VALUE = XXh
15
PCH
8 7
PCL
0
PROGRAM COUNTER
RESET VALUE = RESET VECTOR @ FFFEh-FFFFh
7
1 1 1 H I
0
N Z C
CONDITION CODE REGISTER
RESET VALUE = 1 1 1 X 1 X X X
15
8 7
0
STACK POINTER
RESET VALUE = STACK HIGHER ADDRESS
X = Undefined Value
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ST7LITE2
CPU REGISTERS (Cont’d)
CONDITION CODE REGISTER (CC)
Read/Write
Reset Value: 111x1xxx
7
1
0
1
1
H
I
N
Z
because the I bit is set by hardware at the start of
the routine and reset by the IRET instruction at the
end of the routine. If the I bit is cleared by software
in the interrupt routine, pending interrupts are
serviced regardless of the priority level of the current interrupt routine.
C
The 8-bit Condition Code register contains the interrupt mask and four flags representative of the
result of the instruction just executed. This register
can also be handled by the PUSH and POP instructions.
These bits can be individually tested and/or controlled by specific instructions.
Bit 4 = H Half carry.
This bit is set by hardware when a carry occurs between bits 3 and 4 of the ALU during an ADD or
ADC instruction. It is reset by hardware during the
same instructions.
0: No half carry has occurred.
1: A half carry has occurred.
This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD arithmetic subroutines.
Bit 2 = N Negative.
This bit is set and cleared by hardware. It is representative of the result sign of the last arithmetic,
logical or data manipulation. It is a copy of the 7th
bit of the result.
0: The result of the last operation is positive or null.
1: The result of the last operation is negative
(i.e. the most significant bit is a logic 1).
This bit is accessed by the JRMI and JRPL instructions.
Bit 1 = Z Zero.
This bit is set and cleared by hardware. This bit indicates that the result of the last arithmetic, logical
or data manipulation is zero.
0: The result of the last operation is different from
zero.
1: The result of the last operation is zero.
This bit is accessed by the JREQ and JRNE test
instructions.
Bit 3 = I Interrupt mask.
This bit is set by hardware when entering in interrupt or by software to disable all interrupts except
the TRAP software interrupt. This bit is cleared by
software.
0: Interrupts are enabled.
1: Interrupts are disabled.
This bit is controlled by the RIM, SIM and IRET instructions and is tested by the JRM and JRNM instructions.
Note: Interrupts requested while I is set are
latched and can be processed when I is cleared.
By default an interrupt routine is not interruptible
Bit 0 = C Carry/borrow.
This bit is set and cleared by hardware and software. It indicates an overflow or an underflow has
occurred during the last arithmetic operation.
0: No overflow or underflow has occurred.
1: An overflow or underflow has occurred.
This bit is driven by the SCF and RCF instructions
and tested by the JRC and JRNC instructions. It is
also affected by the “bit test and branch”, shift and
rotate instructions.
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ST7LITE2
CPU REGISTERS (Cont’d)
STACK POINTER (SP)
Read/Write
Reset Value: 01FFh
15
0
8
0
0
0
0
0
0
7
1
1
0
SP6
SP5
SP4
SP3
SP2
SP1
SP0
The Stack Pointer is a 16-bit register which is always pointing to the next free location in the stack.
It is then decremented after data has been pushed
onto the stack and incremented before data is
popped from the stack (see Figure 11).
Since the stack is 128 bytes deep, the 9 most significant bits are forced by hardware. Following an
MCU Reset, or after a Reset Stack Pointer instruction (RSP), the Stack Pointer contains its reset value (the SP6 to SP0 bits are set) which is the stack
higher address.
The least significant byte of the Stack Pointer
(called S) can be directly accessed by a LD instruction.
Note: When the lower limit is exceeded, the Stack
Pointer wraps around to the stack upper limit, without indicating the stack overflow. The previously
stored information is then overwritten and therefore lost. The stack also wraps in case of an underflow.
The stack is used to save the return address during a subroutine call and the CPU context during
an interrupt. The user may also directly manipulate
the stack by means of the PUSH and POP instructions. In the case of an interrupt, the PCL is stored
at the first location pointed to by the SP. Then the
other registers are stored in the next locations as
shown in Figure 11.
– When an interrupt is received, the SP is decremented and the context is pushed on the stack.
– On return from interrupt, the SP is incremented
and the context is popped from the stack.
A subroutine call occupies two locations and an interrupt five locations in the stack area.
Figure 11. Stack Manipulation Example
CALL
Subroutine
PUSH Y
Interrupt
Event
POP Y
RET
or RSP
IRET
@ 0180h
SP
SP
CC
A
1
CC
A
X
X
X
PCH
PCH
PCL
PCL
PCL
PCH
PCH
PCH
PCH
PCH
PCL
PCL
PCL
PCL
PCL
Stack Higher Address = 01FFh
Stack Lower Address = 0180h
22/133
SP
PCH
SP
@ 01FFh
Y
CC
A
SP
SP
ST7LITE2
7 SUPPLY, RESET AND CLOCK MANAGEMENT
The device includes a range of utility features for
securing the application in critical situations (for
example in case of a power brown-out), and reducing the number of external components.
Main features
■
Clock Management
– 1 MHz internal RC oscillator (enabled by option byte, available on ST7LITE25 and
ST7LITE29 devices only)
– 1 to 16 MHz or 32kHz External crystal/ceramic
resonator (selected by option byte)
– External Clock Input (enabled by option byte)
– PLL for multiplying the frequency by 8 or 4
(enabled by option byte)
– For clock ART counter only: PLL32 for multiplying the 8 MHz frequency by 4 (enabled by
option byte). The 8 MHz input frequency is
mandatory and can be obtained in the following ways:
–1 MHz RC + PLLx8
–16 MHz external clock (internally divided
by 2)
–2 MHz. external clock (internally divided by
2) + PLLx8
–Crystal oscillator with 16 MHz output frequency (internally divided by 2)
■
Reset Sequence Manager (RSM)
■
System Integrity Management (SI)
– Main supply Low voltage detection (LVD) with
reset generation (enabled by option byte)
– Auxiliary Voltage detector (AVD) with interrupt
capability for monitoring the main supply (enabled by option byte)
7.1 INTERNAL RC OSCILLATOR ADJUSTMENT
The device contains an internal RC oscillator with
an accuracy of 1% for a given device, temperature
and voltage range (4.5V-5.5V). It must be calibrated to obtain the frequency required in the application. This is done by software writing a calibration
value in the RCCR (RC Control Register).
Whenever the microcontroller is reset, the RCCR
returns to its default value (FFh), i.e. each time the
device is reset, the calibration value must be loaded in the RCCR. Predefined calibration values are
stored in EEPROM for 3 and 5V VDD supply voltages at 25°C, as shown in the following table.
RCCR
Conditions
VDD=5V
RCCR0 TA=25°C
fRC=1MHz
VDD=3V
RCCR1 TA=25°C
fRC=700KHz
ST7LITE29
ST7LITE25
Address
Address
1000h
and FFDEh
FFDEh
1001h
and FFDFh
FFDFh
Note:
– See “ELECTRICAL CHARACTERISTICS” on
page 91. for more information on the frequency
and accuracy of the RC oscillator.
– To improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically 100nF, between the VDD and
VSS pins as close as possible to the ST7 device.
– These two bytes are systematically programmed
by ST, including on FASTROM devices. Consequently, customers intending to use FASTROM
service must not use these two bytes.
– RCCR0 and RCCR1 calibration values will be
erased if the read-out protection bit is reset after
it has been set. See “Read-out Protection” on
page 14.
Caution: If the voltage or temperature conditions
change in the application, the frequency may need
to be recalibrated.
Refer to application note AN1324 for information
on how to calibrate the RC frequency using an external reference signal.
7.2 PHASE LOCKED LOOP
The PLL can be used to multiply a 1MHz frequency from the RC oscillator or the external clock by 4
or 8 to obtain fOSC of 4 or 8 MHz. The PLL is enabled and the multiplication factor of 4 or 8 is selected by 2 option bits.
– The x4 PLL is intended for operation with VDD in
the 2.4V to 3.3V range
– The x8 PLL is intended for operation with VDD in
the 3.3V to 5.5V range
Refer to Section 15.1 for the option byte description.
If the PLL is disabled and the RC oscillator is enabled, then fOSC = 1MHz.
If both the RC oscillator and the PLL are disabled,
fOSC is driven by the external clock.
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1
ST7LITE2
PHASE LOCKED LOOP (Cont’d)
Figure 12. PLL Output Frequency Timing
Diagram
LOCKED bit set
4/8 x
input
freq.
tSTAB
7.3 REGISTER DESCRIPTION
MAIN CLOCK CONTROL/STATUS REGISTER
(MCCSR)
Read / Write
Reset Value: 0000 0000 (00h)
7
Output freq.
0
0
0
0
0
0
0
MCO
SMS
tLOCK
Bits 7:2 = Reserved, must be kept cleared.
tSTARTUP
t
When the PLL is started, after reset or wakeup
from Halt mode or AWUFH mode, it outputs the
clock after a delay of tSTARTUP.
When the PLL output signal reaches the operating
frequency, the LOCKED bit in the SICSCR register
is set. Full PLL accuracy (ACCPLL) is reached after
a stabilization time of tSTAB (see Figure 12 and
13.3.4 Internal RC Oscillator and PLL)
Refer to section 7.6.4 on page 33 for a description
of the LOCKED bit in the SICSR register.
Bit 1 = MCO Main Clock Out enable
This bit is read/write by software and cleared by
hardware after a reset. This bit allows to enable
the MCO output clock.
0: MCO clock disabled, I/O port free for general
purpose I/O.
1: MCO clock enabled.
Bit 0 = SMS Slow Mode select
This bit is read/write by software and cleared by
hardware after a reset. This bit selects the input
clock fOSC or fOSC/32.
0: Normal mode (fCPU = fOSC
1: Slow mode (fCPU = fOSC/32)
RC CONTROL REGISTER (RCCR)
Read / Write
Reset Value: 1111 1111 (FFh)
7
0
CR70 CR60 CR50 CR40 CR30 CR20 CR10 CR0
Bits 7:0 = CR[7:0] RC Oscillator Frequency Adjustment Bits
These bits must be written immediately after reset
to adjust the RC oscillator frequency and to obtain
an accuracy of 1%. The application can store the
correct value for each voltage range in EEPROM
and write it to this register at start-up.
00h = maximum available frequency
FFh = lowest available frequency
Note: To tune the oscillator, write a series of different values in the register until the correct frequency is reached. The fastest method is to use a dichotomy starting with 80h.
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1
ST7LITE2
Figure 13. Clock Management Block Diagram
CR7
CR6
CR5
CR4
CR3
CR2
CR1
CR0
fCPU
Tunable
1% RC Oscillator
RCCR
PLL
8MHz -> 32MHz
OSC,PLLOFF,
OSCRANGE[2:0]
Option bits
12-BIT
AT TIMER 2
RC OSC
PLLx4x8
CLKIN
CLKIN
CLKIN
CLKIN
/OSC1
OSC2
OSC
1-16 MHZ
or 32kHz
PLL 1MHz -> 8MHz
PLL 1MHz -> 4MHz
/2
DIVIDER
OSC
fOSC
CLKIN/2
CLKIN/2
OSC/2
/2
DIVIDER
OSC,PLLOFF,
OSCRANGE[2:0]
Option bits
8-BIT
LITE TIMER 2 COUNTER
fOSC
/32 DIVIDER
fOSC/32
fOSC
1
0
fLTIMER
(1ms timebase @ 8 MHz fOSC)
fCPU
TO CPU AND
PERIPHERALS
MCO SMS MCCSR
fCPU
MCO
25/133
1
ST7LITE2
7.4 MULTI-OSCILLATOR (MO)
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1
External Clock
Hardware Configuration
Crystal/Ceramic Resonators
External Clock Source
In this external clock mode, a clock signal (square,
sinus or triangle) with ~50% duty cycle has to drive
the OSC1 pin while the OSC2 pin is tied to ground.
Note: when the Multi-Oscillator is not used, PB4 is
selected by default as external clock.
Crystal/Ceramic Oscillators
This family of oscillators has the advantage of producing a very accurate rate on the main clock of
the ST7. The selection within a list of 4 oscillators
with different frequency ranges has to be done by
option byte in order to reduce consumption (refer
to section 15.1 on page 122 for more details on the
frequency ranges). In this mode of the multi-oscillator, the resonator and the load capacitors have
to be placed as close as possible to the oscillator
pins in order to minimize output distortion and
start-up stabilization time. The loading capacitance values must be adjusted according to the
selected oscillator.
These oscillators are not stopped during the
RESET phase to avoid losing time in the oscillator
start-up phase.
Internal RC Oscillator
In this mode, the tunable 1%RC oscillator is used
as main clock source. The two oscillator pins have
to be tied to ground.
Table 4. ST7 Clock Sources
Internal RC Oscillator or
External Clock on PB4
The main clock of the ST7 can be generated by
four different source types coming from the multioscillator block (1 to 16MHz or 32kHz):
■ an external source
■ 5 crystal or ceramic resonator oscillators
■ an internal high frequency RC oscillator
Each oscillator is optimized for a given frequency
range in terms of consumption and is selectable
through the option byte. The associated hardware
configurations are shown in Table 4. Refer to the
electrical characteristics section for more details.
ST7
OSC1
OSC2
EXTERNAL
SOURCE
ST7
OSC1
CL1
OSC2
LOAD
CAPACITORS
ST7
OSC1
OSC2
CL2
ST7LITE2
7.5 RESET SEQUENCE MANAGER (RSM)
7.5.1 Introduction
The reset sequence manager includes three RESET sources as shown in Figure 15:
■ External RESET source pulse
■ Internal LVD RESET (Low Voltage Detection)
■ Internal WATCHDOG RESET
Note: A reset can also be triggered following the
detection of an illegal opcode or prebyte code. Refer to section 12.2.1 on page 88 for further details.
These sources act on the RESET pin and it is always kept low during the delay phase.
The RESET service routine vector is fixed at addresses FFFEh-FFFFh in the ST7 memory map.
The basic RESET sequence consists of 3 phases
as shown in Figure 14:
■ Active Phase depending on the RESET source
■ 256 or 4096 CPU clock cycle delay (see table
below)
■ RESET vector fetch
The 256 or 4096 CPU clock cycle delay allows the
oscillator to stabilise and ensures that recovery
has taken place from the Reset state. The shorter
or longer clock cycle delay is automatically selected depending on the clock source chosen by option byte:
Clock Source
Internal RC Oscillator
External clock (connected to CLKIN pin)
External Crystal/Ceramic Oscillator
(connected to OSC1/OSC2 pins)
The RESET vector fetch phase duration is 2 clock
cycles.
If the PLL is enabled by option byte, it outputs the
clock after an additional delay of tSTARTUP (see
Figure 12).
Figure 14. RESET Sequence Phases
RESET
Active Phase
INTERNAL RESET
256 or 4096 CLOCK CYCLES
FETCH
VECTOR
7.5.2 Asynchronous External RESET pin
The RESET pin is both an input and an open-drain
output with integrated RON weak pull-up resistor.
This pull-up has no fixed value but varies in accordance with the input voltage. It can be pulled
low by external circuitry to reset the device. See
Electrical Characteristic section for more details.
A RESET signal originating from an external
source must have a duration of at least th(RSTL)in in
order to be recognized (see Figure 16). This detection is asynchronous and therefore the MCU
can enter reset state even in HALT mode.
CPU clock
cycle delay
256
256
4096
Figure 15. Reset Block Diagram
VDD
RON
RESET
INTERNAL
RESET
Filter
PULSE
GENERATOR
WATCHDOG RESET
ILLEGAL OPCODE RESET 1)
LVD RESET
Note 1: See “Illegal Opcode Reset” on page 88. for more details on illegal opcode reset conditions.
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1
ST7LITE2
RESET SEQUENCE MANAGER (Cont’d)
The RESET pin is an asynchronous signal which
plays a major role in EMS performance. In a noisy
environment, it is recommended to follow the
guidelines mentioned in the electrical characteristics section.
7.5.3 External Power-On RESET
If the LVD is disabled by option byte, to start up the
microcontroller correctly, the user must ensure by
means of an external reset circuit that the reset
signal is held low until VDD is over the minimum
level specified for the selected fOSC frequency.
A proper reset signal for a slow rising VDD supply
can generally be provided by an external RC network connected to the RESET pin.
7.5.4 Internal Low Voltage Detector (LVD)
RESET
Two different RESET sequences caused by the internal LVD circuitry can be distinguished:
■ Power-On RESET
■ Voltage Drop RESET
The device RESET pin acts as an output that is
pulled low when VDD<VIT+ (rising edge) or
VDD<VIT- (falling edge) as shown in Figure 16.
The LVD filters spikes on VDD larger than tg(VDD) to
avoid parasitic resets.
7.5.5 Internal Watchdog RESET
The RESET sequence generated by a internal
Watchdog counter overflow is shown in Figure 16.
Starting from the Watchdog counter underflow, the
device RESET pin acts as an output that is pulled
low during at least tw(RSTL)out.
Figure 16. RESET Sequences
VDD
VIT+(LVD)
VIT-(LVD)
LVD
RESET
RUN
EXTERNAL
RESET
RUN
ACTIVE PHASE
ACTIVE
PHASE
WATCHDOG
RESET
RUN
ACTIVE
PHASE
RUN
tw(RSTL)out
th(RSTL)in
EXTERNAL
RESET
SOURCE
RESET PIN
WATCHDOG
RESET
WATCHDOG UNDERFLOW
INTERNAL RESET (256 or 4096 TCPU)
VECTOR FETCH
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1
ST7LITE2
7.6 SYSTEM INTEGRITY MANAGEMENT (SI)
The System Integrity Management block contains
the Low voltage Detector (LVD) and Auxiliary Voltage Detector (AVD) functions. It is managed by
the SICSR register.
Note: A reset can also be triggered following the
detection of an illegal opcode or prebyte code. Refer to section 12.2.1 on page 88 for further details.
7.6.1 Low Voltage Detector (LVD)
The Low Voltage Detector function (LVD) generates a static reset when the VDD supply voltage is
below a VIT-(LVD) reference value. This means that
it secures the power-up as well as the power-down
keeping the ST7 in reset.
The VIT-(LVD) reference value for a voltage drop is
lower than the VIT+(LVD) reference value for poweron in order to avoid a parasitic reset when the
MCU starts running and sinks current on the supply (hysteresis).
The LVD Reset circuitry generates a reset when
VDD is below:
– VIT+(LVD)when VDD is rising
– VIT-(LVD) when VDD is falling
The LVD function is illustrated in Figure 17.
The voltage threshold can be configured by option
byte to be low, medium or high.
Provided the minimum VDD value (guaranteed for
the oscillator frequency) is above VIT-(LVD), the
MCU can only be in two modes:
– under full software control
– in static safe reset
In these conditions, secure operation is always ensured for the application without the need for external reset hardware.
During a Low Voltage Detector Reset, the RESET
pin is held low, thus permitting the MCU to reset
other devices.
Notes:
The LVD allows the device to be used without any
external RESET circuitry.
The LVD is an optional function which can be selected by option byte.
Use of LVD with capacitive power supply: with this
type of power supply, if power cuts occur in the application, it is recommended to pull VDD down to
0V to ensure optimum restart conditions. Refer to
circuit example in Figure 84 on page 112 and note
4.
It is recommended to make sure that the VDD supply voltage rises monotonously when the device is
exiting from Reset, to ensure the application functions properly.
Figure 17. Low Voltage Detector vs Reset
VDD
Vhys
VIT+(LVD)
VIT-(LVD)
RESET
29/133
1
ST7LITE2
Figure 18. Reset and Supply Management Block Diagram
WATCHDOG
STATUS FLAG
TIMER (WDG)
SYSTEM INTEGRITY MANAGEMENT
RESET SEQUENCE
RESET
MANAGER
(RSM)
AVD Interrupt Request
SICSR
0
0
0
WDGRF LOCKED LVDRF AVDF AVDIE
LOW VOLTAGE
VSS
DETECTOR
VDD
(LVD)
AUXILIARY VOLTAGE
DETECTOR
(AVD)
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1
ST7LITE2
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
7.6.2 Auxiliary Voltage Detector (AVD)
The Voltage Detector function (AVD) is based on
an analog comparison between a VIT-(AVD) and
VIT+(AVD) reference value and the VDD main supply voltage (VAVD). The VIT-(AVD) reference value
for falling voltage is lower than the VIT+(AVD) reference value for rising voltage in order to avoid parasitic detection (hysteresis).
The output of the AVD comparator is directly readable by the application software through a real
time status bit (AVDF) in the SICSR register. This
bit is read only.
Caution: The AVD functions only if the LVD is en-
abled through the option byte.
7.6.2.1 Monitoring the VDD Main Supply
The AVD voltage threshold value is relative to the
selected LVD threshold configured by option byte
(see section 15.1 on page 122).
If the AVD interrupt is enabled, an interrupt is generated when the voltage crosses the VIT+(LVD) or
VIT-(AVD) threshold (AVDF bit is set).
In the case of a drop in voltage, the AVD interrupt
acts as an early warning, allowing software to shut
down safely before the LVD resets the microcontroller. See Figure 19.
Figure 19. Using the AVD to Monitor VDD
VDD
Early Warning Interrupt
(Power has dropped, MCU not
not yet in reset)
Vhyst
VIT+(AVD)
VIT-(AVD)
VIT+(LVD)
VIT-(LVD)
AVDF bit
0
1
RESET
1
0
AVD INTERRUPT
REQUEST
IF AVDIE bit = 1
INTERRUPT Cleared by
reset
INTERRUPT Cleared by
hardware
LVD RESET
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1
ST7LITE2
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
7.6.3 Low Power Modes
Mode
WAIT
HALT
Description
No effect on SI. AVD interrupts cause the
device to exit from Wait mode.
The SICSR register is frozen.
The AVD remains active.
7.6.3.1 Interrupts
The AVD interrupt event generates an interrupt if
the corresponding Enable Control Bit (AVDIE) is
32/133
1
set and the interrupt mask in the CC register is reset (RIM instruction).
Interrupt Event
AVD event
Enable
Event
Control
Flag
Bit
Exit
from
Wait
Exit
from
Halt
AVDF
Yes
No
AVDIE
ST7LITE2
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
7.6.4 Register Description
SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR)
Read/Write
Bit 2 = LVDRF LVD reset flag
This bit indicates that the last Reset was generatReset Value: 0000 0xx0 (0xh)
ed by the LVD block. It is set by hardware (LVD reset) and cleared by software (by reading). When
7
0
the LVD is disabled by OPTION BYTE, the LVDRF
bit value is undefined.
WDG
0
0
0
RF
LOCKED LVDRF AVDF AVDIE
Bit 7:5 = Reserved, must be kept cleared.
Bit 4 = WDGRF Watchdog reset flag
This bit indicates that the last Reset was generated by the Watchdog peripheral. It is set by hardware (watchdog reset) and cleared by software
(writing zero) or an LVD Reset (to ensure a stable
cleared state of the WDGRF flag when CPU
starts).
Combined with the LVDRF flag information, the
flag description is given by the following table.
RESET Sources
LVDRF
WDGRF
External RESET pin
Watchdog
LVD
0
0
1
0
1
X
Bit 3 = LOCKED PLL Locked Flag
This bit is set and cleared by hardware. It is set automatically when the PLL reaches its operating frequency.
0: PLL not locked
1: PLL locked
Bit 1 = AVDF Voltage Detector flag
This read-only bit is set and cleared by hardware.
If the AVDIE bit is set, an interrupt request is generated when the AVDF bit is set. Refer to Figure
19 and to Section 7.6.2.1 for additional details.
0: VDD over AVD threshold
1: VDD under AVD threshold
Bit 0 = AVDIE Voltage Detector interrupt enable
This bit is set and cleared by software. It enables
an interrupt to be generated when the AVDF flag is
set. The pending interrupt information is automatically cleared when software enters the AVD interrupt routine.
0: AVD interrupt disabled
1: AVD interrupt enabled
Application notes
The LVDRF flag is not cleared when another RESET type occurs (external or watchdog), the
LVDRF flag remains set to keep trace of the original failure.
In this case, a watchdog reset can be detected by
software while an external reset can not.
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ST7LITE2
8 INTERRUPTS
The ST7 core may be interrupted by one of two different methods: maskable hardware interrupts as
listed in the Interrupt Mapping Table and a nonmaskable software interrupt (TRAP). The Interrupt
processing flowchart is shown in Figure 20.
The maskable interrupts must be enabled by
clearing the I bit in order to be serviced. However,
disabled interrupts may be latched and processed
when they are enabled (see external interrupts
subsection).
Note: After reset, all interrupts are disabled.
When an interrupt has to be serviced:
– Normal processing is suspended at the end of
the current instruction execution.
– The PC, X, A and CC registers are saved onto
the stack.
– The I bit of the CC register is set to prevent additional interrupts.
– The PC is then loaded with the interrupt vector of
the interrupt to service and the first instruction of
the interrupt service routine is fetched (refer to
the Interrupt Mapping Table for vector addresses).
The interrupt service routine should finish with the
IRET instruction which causes the contents of the
saved registers to be recovered from the stack.
Note: As a consequence of the IRET instruction,
the I bit will be cleared and the main program will
resume.
Priority Management
By default, a servicing interrupt cannot be interrupted because the I bit is set by hardware entering in interrupt routine.
In the case when several interrupts are simultaneously pending, an hardware priority defines which
one will be serviced first (see the Interrupt Mapping Table).
Interrupts and Low Power Mode
All interrupts allow the processor to leave the
WAIT low power mode. Only external and specifically mentioned interrupts allow the processor to
leave the HALT low power mode (refer to the “Exit
from HALT“ column in the Interrupt Mapping Table).
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8.1 NON MASKABLE SOFTWARE INTERRUPT
This interrupt is entered when the TRAP instruction is executed regardless of the state of the I bit.
It will be serviced according to the flowchart on
Figure 20.
8.2 EXTERNAL INTERRUPTS
External interrupt vectors can be loaded into the
PC register if the corresponding external interrupt
occurred and if the I bit is cleared. These interrupts
allow the processor to leave the Halt low power
mode.
The external interrupt polarity is selected through
the miscellaneous register or interrupt register (if
available).
An external interrupt triggered on edge will be
latched and the interrupt request automatically
cleared upon entering the interrupt service routine.
Caution: The type of sensitivity defined in the Miscellaneous or Interrupt register (if available) applies to the ei source. In case of a NANDed source
(as described on the I/O ports section), a low level
on an I/O pin configured as input with interrupt,
masks the interrupt request even in case of risingedge sensitivity.
8.3 PERIPHERAL INTERRUPTS
Different peripheral interrupt flags in the status
register are able to cause an interrupt when they
are active if both:
– The I bit of the CC register is cleared.
– The corresponding enable bit is set in the control
register.
If any of these two conditions is false, the interrupt
is latched and thus remains pending.
Clearing an interrupt request is done by:
– Writing “0” to the corresponding bit in the status
register or
– Access to the status register while the flag is set
followed by a read or write of an associated register.
Note: the clearing sequence resets the internal
latch. A pending interrupt (i.e. waiting for being enabled) will therefore be lost if the clear sequence is
executed.
ST7LITE2
INTERRUPTS (Cont’d)
Figure 20. Interrupt Processing Flowchart
FROM RESET
I BIT SET?
N
N
Y
INTERRUPT
PENDING?
Y
FETCH NEXT INSTRUCTION
N
IRET?
Y
STACK PC, X, A, CC
SET I BIT
LOAD PC FROM INTERRUPT VECTOR
EXECUTE INSTRUCTION
RESTORE PC, X, A, CC FROM STACK
THIS CLEARS I BIT BY DEFAULT
Table 5. Interrupt Mapping
N°
Source
Block
RESET
Description
Reset
TRAP
Software Interrupt
0
AWU
Auto Wake Up Interrupt
1
ei0
External Interrupt 0
2
ei1
External Interrupt 1
3
ei2
External Interrupt 2
ei3
External Interrupt 3
4
5
LITE TIMER LITE TIMER RTC2 interrupt
6
7
8
10
12
13
N/A
Exit
Exit
Priority
from
from
Order HALT or ACTIVE
AWUFH -HALT
Highest
Priority
AWUCSR
yes
yes
AT TIMER
LITE TIMER
SPI
AVD interrupt
yes1)
FFFAh-FFFBh
FFF8h-FFF9h
N/A
yes
no
FFF6h-FFF7h
FFF4h-FFF5h
FFF2h-FFF3h
LTCSR2
no
FFF0h-FFF1h
FFEEh-FFEFh
SICSR
AT TIMER Overflow Interrupt
ATCSR
LITE TIMER Input Capture Interrupt
LITE TIMER RTC1 Interrupt
SPI Peripheral Interrupts
FFFEh-FFFFh
FFFCh-FFFDh
FFECh-FFEDh
no
AT TIMER Output Compare Interrupt PWMxCSR
or Input Capture Interrupt
or ATCSR
Not usedNot used
Address
Vector
no
Not used
SI
9
11
Register
Label
no
FFEAh-FFEBh
yes
FFE8h-FFE9h
LTCSR
no
FFE6h-FFE7h
LTCSR
yes
FFE4h-FFE5h
SPICSR
Lowest
Priority
yes
no
FFE2h-FFE3h
FFE0h-FFE1h
Note 1: This interrupt exits the MCU from “Auto Wake-up from Halt” mode only.
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ST7LITE2
INTERRUPTS (Cont’d)
EXTERNAL INTERRUPT CONTROL REGISTER
(EICR)
Read/Write
Reset Value: 0000 0000 (00h)
7
IS31
IS30
IS21
IS20
IS11
IS10
IS01
0
7
IS00
ei31
Bit 7:6 = IS3[1:0] ei3 sensitivity
These bits define the interrupt sensitivity for ei3
(Port B0) according to Table 6.
Bit 5:4 = IS2[1:0] ei2 sensitivity
These bits define the interrupt sensitivity for ei2
(Port B3) according to Table 6.
Bit 3:2 = IS1[1:0] ei1 sensitivity
These bits define the interrupt sensitivity for ei1
(Port A7) according to Table 6.
Bit 1:0 = IS0[1:0] ei0 sensitivity
These bits define the interrupt sensitivity for ei0
(Port A0) according to Table 6.
Notes:
1.These 8 bits can be written only when the I bit in
the CC register is set.
2. Changing the sensitivity of a particular external
interrupt clears this pending interrupt. This can be
used to clear unwanted pending interrupts. Refer
to section “External Interrupt Function” on
page 46.
Table 6. Interrupt Sensitivity Bits
ISx1 ISx0
0
Falling edge & low level
0
1
Rising edge only
1
0
Falling edge only
1
1
Rising and falling edge
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1
0
ei30
ei21
ei20
ei11
ei10
ei01
ei00
Bit 7:6 = ei3[1:0] ei3 pin selection
These bits are written by software. They select the
Port B I/O pin used for the ei3 external interrupt according to the table below.
External Interrupt I/O pin selection
ei31
ei30
I/O Pin
0
0
PB0 1)
0
1
PB1
1
0
PB2
Note:
1. Reset State
Bits 5:4 = ei2[1:0] ei2 pin selection
These bits are written by software. They select the
Port B I/O pin used for the ei2 external interrupt according to the table below.
External Interrupt I/O pin selection
ei21
ei20
I/O Pin
0
0
PB3 1)
0
1
PB4 2)
1
0
PB5
1
1
PB6
External Interrupt Sensitivity
0
.
EXTERNAL INTERRUPT SELECTION REGISTER (EISR)
Read/Write
Reset Value: 0000 1100 (0Ch)
Notes:
1. Reset State
2. PB4 cannot be used as an external interrupt in
HALT mode.
ST7LITE2
INTERRUPTS (Cont’d)
Bit 3:2 = ei1[1:0] ei1 pin selection
These bits are written by software. They select the
Port A I/O pin used for the ei1 external interrupt according to the table below.
External Interrupt I/O pin selection
ei11
ei10
I/O Pin
0
0
PA4
0
1
PA5
1
0
PA6
1
1
PA7*
* Reset State
Port A I/O pin used for the ei0 external interrupt according to the table below.
External Interrupt I/O pin selection
ei01
ei00
I/O Pin
0
0
PA0 *
0
1
PA1
1
0
PA2
1
1
PA3
* Reset State
Bits 1:0 = Reserved.
Bits 1:0 = ei0[1:0] ei0 pin selection
These bits are written by software. They select the
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ST7LITE2
9 POWER SAVING MODES
9.1 INTRODUCTION
9.2 SLOW MODE
To give a large measure of flexibility to the application in terms of power consumption, five main power saving modes are implemented in the ST7 (see
Figure 21):
■ Slow
■ Wait (and Slow-Wait)
■ Active Halt
■ Auto Wake up From Halt (AWUFH)
■ Halt
After a RESET the normal operating mode is selected by default (RUN mode). This mode drives
the device (CPU and embedded peripherals) by
means of a master clock which is based on the
main oscillator frequency divided or multiplied by 2
(fOSC2).
From RUN mode, the different power saving
modes may be selected by setting the relevant
register bits or by calling the specific ST7 software
instruction whose action depends on the oscillator
status.
This mode has two targets:
– To reduce power consumption by decreasing the
internal clock in the device,
– To adapt the internal clock frequency (fCPU) to
the available supply voltage.
SLOW mode is controlled by the SMS bit in the
MCCSR register which enables or disables Slow
mode.
In this mode, the oscillator frequency is divided by
32. The CPU and peripherals are clocked at this
lower frequency.
Note: SLOW-WAIT mode is activated when entering WAIT mode while the device is already in
SLOW mode.
Figure 22. SLOW Mode Clock Transition
fOSC/32
fOSC
fCPU
Figure 21. Power Saving Mode Transitions
fOSC
High
SMS
RUN
NORMAL RUN MODE
REQUEST
SLOW
WAIT
SLOW WAIT
ACTIVE HALT
AUTO WAKE UP FROM HALT
HALT
Low
POWER CONSUMPTION
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ST7LITE2
POWER SAVING MODES (Cont’d)
9.3 WAIT MODE
WAIT mode places the MCU in a low power consumption mode by stopping the CPU.
This power saving mode is selected by calling the
‘WFI’ instruction.
All peripherals remain active. During WAIT mode,
the I bit of the CC register is cleared, to enable all
interrupts. All other registers and memory remain
unchanged. The MCU remains in WAIT mode until
an interrupt or RESET occurs, whereupon the Program Counter branches to the starting address of
the interrupt or Reset service routine.
The MCU will remain in WAIT mode until a Reset
or an Interrupt occurs, causing it to wake up.
Refer to Figure 23.
Figure 23. WAIT Mode Flow-chart
WFI INSTRUCTION
OSCILLATOR
PERIPHERALS
CPU
I BIT
ON
ON
OFF
0
N
RESET
Y
N
INTERRUPT
Y
OSCILLATOR
PERIPHERALS
CPU
I BIT
ON
OFF
ON
0
256 OR 4096 CPU CLOCK
CYCLE DELAY
OSCILLATOR
PERIPHERALS
CPU
I BIT
ON
ON
ON
X 1)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Note:
1. Before servicing an interrupt, the CC register is
pushed on the stack. The I bit of the CC register is
set during the interrupt routine and cleared when
the CC register is popped.
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ST7LITE2
POWER SAVING MODES (Cont’d)
9.4 HALT MODE
Figure 25. HALT Mode Flow-chart
The HALT mode is the lowest power consumption
mode of the MCU. It is entered by executing the
‘HALT’ instruction when ACTIVE-HALT is disabled
(see section 9.5 on page 41 for more details) and
when the AWUEN bit in the AWUCSR register is
cleared.
The MCU can exit HALT mode on reception of either a specific interrupt (see Table 5, “Interrupt
Mapping,” on page 35) or a RESET. When exiting
HALT mode by means of a RESET or an interrupt,
the oscillator is immediately turned on and the 256
or 4096 CPU cycle delay is used to stabilize the
oscillator. After the start up delay, the CPU
resumes operation by servicing the interrupt or by
fetching the reset vector which woke it up (see Figure 25).
When entering HALT mode, the I bit in the CC register is forced to 0 to enable interrupts. Therefore,
if an interrupt is pending, the MCU wakes up immediately.
In HALT mode, the main oscillator is turned off
causing all internal processing to be stopped, including the operation of the on-chip peripherals.
All peripherals are not clocked except the ones
which get their clock supply from another clock
generator (such as an external or auxiliary oscillator).
The compatibility of Watchdog operation with
HALT mode is configured by the “WDGHALT” option bit of the option byte. The HALT instruction
when executed while the Watchdog system is enabled, can generate a Watchdog RESET (see section 15.1 on page 122 for more details).
HALT
256 OR 4096 CPU
CYCLE DELAY
HALT
INSTRUCTION
[Active Halt disabled]
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1
ENABLE
WDGHALT 1)
WATCHDOG
DISABLE
0
1
WATCHDOG
RESET
OSCILLATOR
OFF
PERIPHERALS 2) OFF
CPU
OFF
I BIT
0
N
N
RESET
Y
INTERRUPT 3)
Y
OSCILLATOR
PERIPHERALS
CPU
I BIT
ON
OFF
ON
X 4)
256 OR 4096 CPU CLOCK
CYCLE DELAY5)
OSCILLATOR
PERIPHERALS
CPU
I BIT
ON
ON
ON
X 4)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Figure 24. HALT Timing Overview
RUN
HALT INSTRUCTION
(Active Halt disabled)
(AWUCSR.AWUEN=0)
RUN
RESET
OR
INTERRUPT
FETCH
VECTOR
Notes:
1. WDGHALT is an option bit. See option byte section for more details.
2. Peripheral clocked with an external clock source
can still be active.
3. Only some specific interrupts can exit the MCU
from HALT mode (such as external interrupt). Refer to Table 5 Interrupt Mapping for more details.
4. Before servicing an interrupt, the CC register is
pushed on the stack. The I bit of the CC register is
set during the interrupt routine and cleared whenthe CC register is popped.
5. If the PLL is enabled by option byte, it outputs
the clock after a delay of tSTARTUP (see Figure 12).
ST7LITE2
POWER SAVING MODES (Cont’d)
9.4.1 Halt Mode Recommendations
– Make sure that an external event is available to
wake up the microcontroller from Halt mode.
– When using an external interrupt to wake up the
microcontroller, reinitialize the corresponding I/O
as “Input Pull-up with Interrupt” before executing
the HALT instruction. The main reason for this is
that the I/O may be wrongly configured due to external interference or by an unforeseen logical
condition.
– For the same reason, reinitialize the level sensitiveness of each external interrupt as a precautionary measure.
– The opcode for the HALT instruction is 0x8E. To
avoid an unexpected HALT instruction due to a
program counter failure, it is advised to clear all
occurrences of the data value 0x8E from memory. For example, avoid defining a constant in program memory with the value 0x8E.
– As the HALT instruction clears the interrupt mask
in the CC register to allow interrupts, the user
may choose to clear all pending interrupt bits before executing the HALT instruction. This avoids
entering other peripheral interrupt routines after
executing the external interrupt routine corresponding to the wake-up event (reset or external
interrupt).
9.5 ACTIVE-HALT MODE
ACTIVE-HALT mode is the lowest power consumption mode of the MCU with a real time clock
available. It is entered by executing the ‘HALT’ instruction. The decision to enter either in ACTIVEHALT or HALT mode is given by the LTCSR/ATCSR register status as shown in the following table:
ATCSR
LTCSR1
ATCSR ATCSR
OVFIE
TB1IE bit
CK1 bit CK0 bit
bit
0
x
x
0
0
0
x
x
1
x
x
x
x
1
0
1
Meaning
ACTIVE-HALT
mode disabled
ACTIVE-HALT
mode enabled
The MCU can exit ACTIVE-HALT mode on reception of a specific interrupt (see Table 5, “Interrupt
Mapping,” on page 35) or a RESET.
– When exiting ACTIVE-HALT mode by means of
a RESET, a 256 or 4096 CPU cycle delay occurs. After the start up delay, the CPU resumes
operation by fetching the reset vector which
woke it up (see Figure 27).
– When exiting ACTIVE-HALT mode by means of
an interrupt, the CPU immediately resumes operation by servicing the interrupt vector which woke
it up (see Figure 27).
When entering ACTIVE-HALT mode, the I bit in
the CC register is cleared to enable interrupts.
Therefore, if an interrupt is pending, the MCU
wakes up immediately (see Note 3).
In ACTIVE-HALT mode, only the main oscillator
and the selected timer counter (LT/AT) are running
to keep a wake-up time base. All other peripherals
are not clocked except those which get their clock
supply from another clock generator (such as external or auxiliary oscillator).
Note: As soon as ACTIVE-HALT is enabled, executing a HALT instruction while the Watchdog is
active does not generate a RESET.
This means that the device cannot spend more
than a defined delay in this power saving mode.
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ST7LITE2
POWER SAVING MODES (Cont’d)
Figure 26. ACTIVE-HALT Timing Overview
RUN
ACTIVE 256 OR 4096 CPU
HALT
CYCLE DELAY 1)
HALT
INSTRUCTION
[Active Halt Enabled]
RESET
OR
INTERRUPT
RUN
FETCH
VECTOR
Figure 27. ACTIVE-HALT Mode Flow-chart
HALT INSTRUCTION
(Active Halt enabled)
(AWUCSR.AWUEN=0)
OSCILLATOR
ON
PERIPHERALS 2) OFF
CPU
OFF
I BIT
0
9.6 AUTO WAKE UP FROM HALT MODE
Auto Wake Up From Halt (AWUFH) mode is similar to Halt mode with the addition of a specific internal RC oscillator for wake-up (Auto Wake Up
from Halt Oscillator). Compared to ACTIVE-HALT
mode, AWUFH has lower power consumption (the
main clock is not kept running, but there is no accurate realtime clock available.
It is entered by executing the HALT instruction
when the AWUEN bit in the AWUCSR register has
been set.
Figure 28. AWUFH Mode Block Diagram
AWU RC
oscillator
fAWU_RC
N
to Timer input capture
RESET
N
Y
INTERRUPT 3)
Y
OSCILLATOR
ON
PERIPHERALS 2) OFF
CPU
ON
I BIT
X 4)
256 OR 4096 CPU CLOCK
CYCLE DELAY
OSCILLATOR
PERIPHERALS
CPU
I BIT
ON
ON
ON
X 4)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Notes:
1. This delay occurs only if the MCU exits ACTIVEHALT mode by means of a RESET.
2. Peripherals clocked with an external clock
source can still be active.
3. Only the RTC1 interrupt and some specific interrupts can exit the MCU from ACTIVE-HALT mode.
Refer to Table 5, “Interrupt Mapping,” on page 35
for more details.
4. Before servicing an interrupt, the CC register is
pushed on the stack. The I bit of the CC register is
set during the interrupt routine and cleared when
the CC register is popped.
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1
/64
divider
AWUFH
prescaler/1 .. 255
AWUFH
interrupt
(ei0 source)
As soon as HALT mode is entered, and if the
AWUEN bit has been set in the AWUCSR register,
the AWU RC oscillator provides a clock signal
(fAWU_RC). Its frequency is divided by a fixed divider and a programmable prescaler controlled by the
AWUPR register. The output of this prescaler provides the delay time. When the delay has elapsed
the AWUF flag is set by hardware and an interrupt
wakes-up the MCU from Halt mode. At the same
time the main oscillator is immediately turned on
and a 256 or 4096 cycle delay is used to stabilize
it. After this start-up delay, the CPU resumes operation by servicing the AWUFH interrupt. The AWU
flag and its associated interrupt are cleared by
software reading the AWUCSR register.
To compensate for any frequency dispersion of
the AWU RC oscillator, it can be calibrated by
measuring the clock frequency fAWU_RC and then
calculating the right prescaler value. Measurement
mode is enabled by setting the AWUM bit in the
AWUCSR register in Run mode. This connects
fAWU_RC to the input capture of the 12-bit Auto-Reload timer, allowing the fAWU_RC to be measured
using the main oscillator clock as a reference timebase.
ST7LITE2
POWER SAVING MODES (Cont’d)
Similarities with Halt mode
The following AWUFH mode behaviour is the
same as normal Halt mode:
– The MCU can exit AWUFH mode by means of
any interrupt with exit from Halt capability or a reset (see Section 9.4 HALT MODE).
– When entering AWUFH mode, the I bit in the CC
register is forced to 0 to enable interrupts. Therefore, if an interrupt is pending, the MCU wakes
up immediately.
– In AWUFH mode, the main oscillator is turned off
causing all internal processing to be stopped, including the operation of the on-chip peripherals.
None of the peripherals are clocked except those
which get their clock supply from another clock
generator (such as an external or auxiliary oscillator like the AWU oscillator).
– The compatibility of Watchdog operation with
AWUFH mode is configured by the WDGHALT
option bit in the option byte. Depending on this
setting, the HALT instruction when executed
while the Watchdog system is enabled, can generate a Watchdog RESET.
Figure 29. AWUF Halt Timing Diagram
tAWU
RUN MODE
HALT MODE
256 OR 4096 tCPU
RUN MODE
fCPU
fAWU_RC
Clear
by software
AWUFH interrupt
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ST7LITE2
POWER SAVING MODES (Cont’d)
Figure 30. AWUFH Mode Flow-chart
HALT INSTRUCTION
(Active-Halt disabled)
(AWUCSR.AWUEN=1)
ENABLE
WDGHALT 1)
WATCHDOG
0
DISABLE
1
WATCHDOG
RESET
AWU RC OSC
ON
MAIN OSC
OFF
PERIPHERALS 2) OFF
CPU
OFF
I[1:0] BITS
10
N
RESET
N
Y
INTERRUPT 3)
Y
AWU RC OSC
OFF
MAIN OSC
ON
PERIPHERALS OFF
CPU
ON
I[1:0] BITS
XX 4)
256 OR 4096 CPU CLOCK
CYCLE DELAY5)
AWU RC OSC
OFF
MAIN OSC
ON
PERIPHERALS ON
CPU
ON
I[1:0] BITS
XX 4)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
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1
Notes:
1. WDGHALT is an option bit. See option byte section for more details.
2. Peripheral clocked with an external clock source
can still be active.
3. Only an AWUFH interrupt and some specific interrupts can exit the MCU from HALT mode (such
as external interrupt). Refer to Table 5, “Interrupt
Mapping,” on page 35 for more details.
4. Before servicing an interrupt, the CC register is
pushed on the stack. The I[1:0] bits of the CC register are set to the current software priority level of
the interrupt routine and recovered when the CC
register is popped.
5. If the PLL is enabled by option byte, it outputs
the clock after an additional delay of tSTARTUP (see
Figure 12).
ST7LITE2
POWER SAVING MODES (Cont’d)
9.6.0.1 Register description
AWUFH CONTROL/STATUS REGISTER
(AWUCSR)
Read/Write
Reset Value: 0000 0000 (00h)
AWUFH PRESCALER REGISTER (AWUPR)
Read/Write
Reset Value: 1111 1111 (FFh)
7
7
0
0
0
0
0
0
AWU AWU AWU
F
M
EN
0
AWU AWU AWU AWU AWU AWU AWU AWU
PR7 PR6 PR5 PR4 PR3 PR2 PR1 PR0
Bits 7:0= AWUPR[7:0] Auto Wake Up Prescaler
These 8 bits define the AWUPR Dividing factor (as
explained below:
Bits 7:3 = Reserved.
Bit 2 = AWUF Auto Wake Up Flag
This bit is set by hardware when the AWU module
generates an interrupt and cleared by software on
reading AWUCSR. Writing to this bit does not
change its value.
0: No AWU interrupt occurred
1: AWU interrupt occurred
Bit 1= AWUM Auto Wake Up Measurement
This bit enables the AWU RC oscillator and connects its output to the inputcapture of the 12-bit
Auto-Reload timer. This allows the timer to be
used to measure the AWU RC oscillator dispersion and then compensate this dispersion by providing the right value in the AWUPRE register.
0: Measurement disabled
1: Measurement enabled
Bit 0 = AWUEN Auto Wake Up From Halt Enabled
This bit enables the Auto Wake Up From Halt feature: once HALT mode is entered, the AWUFH
wakes up the microcontroller after a time delay dependent on the AWU prescaler value. It is set and
cleared by software.
0: AWUFH (Auto Wake Up From Halt) mode disabled
1: AWUFH (Auto Wake Up From Halt) mode enabled
AWUPR[7:0]
Dividing factor
00h
Forbidden
01h
1
...
...
FEh
254
FFh
255
In AWU mode, the period that the MCU stays in
Halt Mode (tAWU in Figure 29 on page 43) is defined by
t
AWU
1
= 64 × AWUPR × -------------------------- + t
RCSTRT
f
AWURC
This prescaler register can be programmed to
modify the time that the MCU stays in Halt mode
before waking up automatically.
Note: If 00h is written to AWUPR, depending on
the product, an interrupt is generated immediately
after a HALT instruction, or the AWUPR remains
inchanged. l
Table 7. AWU Register Map and Reset Values
Address
(Hex.)
0049h
004Ah
Register
Label
7
6
5
4
3
2
1
0
AWUPR
AWUPR7 AWUPR6 AWUPR5 AWUPR4 AWUPR3 AWUPR2 AWUPR1 AWUPR0
Reset Value
1
1
1
1
1
1
1
1
AWUCSR
0
0
0
0
0
AWUF
AWUM
AWUEN
Reset Value
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ST7LITE2
10 I/O PORTS
10.1 INTRODUCTION
The I/O ports allow data transfer. An I/O port can
contain up to 8 pins. Each pin can be programmed
independently either as a digital input or digital
output. In addition, specific pins may have several
other functions. These functions can include external interrupt, alternate signal input/output for onchip peripherals or analog input.
10.2 FUNCTIONAL DESCRIPTION
A Data Register (DR) and a Data Direction Register (DDR) are always associated with each port.
The Option Register (OR), which allows input/output options, may or may not be implemented. The
following description takes into account the OR
register. Refer to the Port Configuration table for
device specific information.
An I/O pin is programmed using the corresponding
bits in the DDR, DR and OR registers: bit x corresponding to pin x of the port.
Figure 31 shows the generic I/O block diagram.
10.2.1 Input Modes
Clearing the DDRx bit selects input mode. In this
mode, reading its DR bit returns the digital value
from that I/O pin.
If an OR bit is available, different input modes can
be configured by software: floating or pull-up. Refer to I/O Port Implementation section for configuration.
Notes:
1. Writing to the DR modifies the latch value but
does not change the state of the input pin.
2. Do not use read/modify/write instructions
(BSET/BRES) to modify the DR register.
10.2.1.1 External Interrupt Function
Depending on the device, setting the ORx bit while
in input mode can configure an I/O as an input with
interrupt. In this configuration, a signal edge or level input on the I/O generates an interrupt request
via the corresponding interrupt vector (eix).
Falling or rising edge sensitivity is programmed independently for each interrupt vector. The External Interrupt Control Register (EICR) or the Miscellaneous Register controls this sensitivity, depending on the device.
Each external interrupt vector is linked to a dedicated group of I/O port pins (see pinout description
in section 2 on page 6 and interrupt section).
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If several I/O interrupt pins on the same interrupt
vector are selected simultaneously, they are logically combined. For this reason if one of the interrupt pins is tied low, it may mask the others.
External interrupts are hardware interrupts. Fetching the corresponding interrupt vector automatically clears the request latch. Changing the sensitivity
of a particular external interrupt clears this pending
interrupt. This can be used to clear unwanted
pending interrupts.
Spurious interrupts
When enabling/disabling an external interrupt by
setting/resetting the related OR register bit, a spurious interrupt is generated if the pin level is low
and its edge sensitivity includes falling/rising edge.
This is due to the edge detector input which is
switched to '1' when the external interrupt is disabled by the OR register.
To avoid this unwanted interrupt, a "safe" edge
sensitivity (rising edge for enabling and falling
edge for disabling) has to be selected before
changing the OR register bit and configuring the
appropriate sensitivity again.
Caution: In case a pin level change occurs during
these operations (asynchronous signal input), as
interrupts are generated according to the current
sensitivity, it is advised to disable all interrupts before and to reenable them after the complete previous sequence in order to avoid an external interrupt occurring on the unwanted edge.
This corresponds to the following steps:
1. To enable an external interrupt:
– set the interrupt mask with the SIM instruction
(in cases where a pin level change could occur)
– select rising edge
– enable the external interrupt through the OR
register
– select the desired sensitivity if different from
rising edge
– reset the interrupt mask with the RIM instruction (in cases where a pin level change could
occur)
2. To disable an external interrupt:
– set the interrupt mask with the SIM instruction
SIM (in cases where a pin level change could
occur)
– select falling edge
ST7LITE2
– disable the external interrupt through the OR
register
– select rising edge
– reset the interrupt mask with the RIM instruction (in cases where a pin level change could
occur)
10.2.2 Output Modes
Setting the DDRx bit selects output mode. Writing
to the DR bits applies a digital value to the I/O
through the latch. Reading the DR bits returns the
previously stored value.
If an OR bit is available, different output modes
can be selected by software: push-pull or opendrain. Refer to I/O Port Implementation section for
configuration.
DR Value and Output Pin Status
DR
Push-Pull
Open-Drain
0
1
VOL
VOH
VOL
Floating
10.2.3 Alternate Functions
Many ST7s I/Os have one or more alternate functions. These may include output signals from, or
input signals to, on-chip peripherals. The Device
Pin Description table describes which peripheral
signals can be input/output to which ports.
A signal coming from an on-chip peripheral can be
output on an I/O. To do this, enable the on-chip
peripheral as an output (enable bit in the peripheral’s control register). The peripheral configures the
I/O as an output and takes priority over standard I/
O programming. The I/O’s state is readable by addressing the corresponding I/O data register.
Configuring an I/O as floating enables alternate
function input. It is not recommended to configure
an I/O as pull-up as this will increase current consumption. Before using an I/O as an alternate input, configure it without interrupt. Otherwise spurious interrupts can occur.
Configure an I/O as input floating for an on-chip
peripheral signal which can be input and output.
Caution:
I/Os which can be configured as both an analog
and digital alternate function need special attention. The user must control the peripherals so that
the signals do not arrive at the same time on the
same pin. If an external clock is used, only the
clock alternate function should be employed on
that I/O pin and not the other alternate function.
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ST7LITE2
I/O PORTS (Cont’d)
Figure 31. I/O Port General Block Diagram
ALTERNATE
OUTPUT
REGISTER
ACCESS
From on-chip peripheral
1
VDD
0
P-BUFFER
(see table below)
ALTERNATE
ENABLE
BIT
PULL-UP
(see table below)
DR
VDD
DDR
PULL-UP
CONDITION
DATA BUS
OR
PAD
If implemented
OR SEL
N-BUFFER
DIODES
(see table below)
DDR SEL
DR SEL
ANALOG
INPUT
CMOS
SCHMITT
TRIGGER
1
0
EXTERNAL
INTERRUPT
REQUEST (eix)
ALTERNATE
INPUT
Combinational
Logic
SENSITIVITY
SELECTION
To on-chip peripheral
FROM
OTHER
BITS Note: Refer to the Port Configuration
table for device specific information.
Table 8. I/O Port Mode Options
Configuration Mode
Input
Output
Floating with/without Interrupt
Pull-up with/without Interrupt
Push-pull
Open Drain (logic level)
True Open Drain
Legend: NI - not implemented
Off - implemented not activated
On - implemented and activated
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Pull-Up
P-Buffer
Off
On
Off
Off
NI
On
Off
NI
Diodes
to VDD
On
to VSS
On
NI (see note)
Note: The diode to VDD is not implemented in the
true open drain pads. A local protection between
the pad and VOL is implemented to protect the device against positive stress.
ST7LITE2
I/O PORTS (Cont’d)
Table 9. I/O configurations
Hardware Configuration
VDD
RPU
DR REGISTER ACCESS
NOTE 3
PULL-UP
CONDITION
DR
REGISTER
PAD
W
DATA BUS
INPUT 1)
R
ALTERNATE INPUT
To on-chip peripheral
FROM
OTHER
PINS
EXTERNAL INTERRUPT
SOURCE (eix)
INTERRUPT COMBINATIONAL POLARITY
LOGIC SELECTION
CONDITION
PUSH-PULL OUTPUT 2)
OPEN-DRAIN OUTPUT 2)
ANALOG INPUT
VDD
NOTE 3
DR REGISTER ACCESS
RPU
PAD
DR
REGISTER
VDD
R/W
DATA BUS
DR REGISTER ACCESS
NOTE 3
RPU
PAD
DR
REGISTER
ALTERNATE
ENABLE
BIT
R/W
DATA BUS
ALTERNATE
OUTPUT
From on-chip peripheral
Notes:
1. When the I/O port is in input configuration and the associated alternate function is enabled as an output,
reading the DR register will read the alternate function output status.
2. When the I/O port is in output configuration and the associated alternate function is enabled as an input,
the alternate function reads the pin status given by the DR register content.
3. For true open drain, these elements are not implemented.
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ST7LITE2
I/O PORTS (Cont’d)
Analog alternate function
Configure the I/O as floating input to use an ADC
input. The analog multiplexer (controlled by the
ADC registers) switches the analog voltage
present on the selected pin to the common analog
rail, connected to the ADC input.
Analog Recommendations
Do not change the voltage level or loading on any
I/O while conversion is in progress. Do not have
clocking pins located close to a selected analog
pin.
WARNING: The analog input voltage level must
be within the limits stated in the absolute maximum ratings.
10.3 I/O PORT IMPLEMENTATION
The hardware implementation on each I/O port depends on the settings in the DDR and OR registers
and specific I/O port features such as ADC input or
open drain.
Switching these I/O ports from one state to another should be done in a sequence that prevents unwanted side effects. Recommended safe transitions are illustrated in Figure 32. Other transitions
are potentially risky and should be avoided, since
they may present unwanted side-effects such as
spurious interrupt generation.
Figure 32. Interrupt I/O Port State Transitions
01
00
10
11
INPUT
floating/pull-up
interrupt
INPUT
floating
(reset state)
OUTPUT
open-drain
OUTPUT
push-pull
XX
10.4 UNUSED I/O PINS
Unused I/O pins must be connected to fixed voltage levels. Refer to Section 13.8.
10.5 LOW POWER MODES
Mode
WAIT
HALT
Description
No effect on I/O ports. External interrupts
cause the device to exit from WAIT mode.
No effect on I/O ports. External interrupts
cause the device to exit from HALT mode.
10.6 INTERRUPTS
The external interrupt event generates an interrupt
if the corresponding configuration is selected with
DDR and OR registers and if the I bit in the CC
register is cleared (RIM instruction).
Interrupt Event
External interrupt on
selected external
event
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1
= DDR, OR
Enable
Event
Control
Flag
Bit
-
DDRx
ORx
Exit
from
Wait
Exit
from
Halt
Yes
Yes
ST7LITE2
I/O PORTS (Cont’d)
10.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION
The I/O port register configurations are summarised as follows.
Interrupt Ports
Ports where the external interrupt capability is
selected using the EISR register
Standard Ports
MODE
floating input
pull-up interrupt input
open drain output
push-pull output
PA7:0, PB6:0
MODE
floating input
pull-up input
open drain output
push-pull output
DDR
0
0
1
1
OR
0
1
0
1
DDR
0
0
1
1
OR
0
1
0
1
Table 10. Port Configuration (Standard ports)
Port
Input
Pin name
Output
OR = 0
OR = 1
OR = 0
OR = 1
pull-up
pull-up
open drain
push-pull
open drain
push-pull
Port A
PA7:0
floating
Port B
PB6:0
floating
Note: On ports where the external interrupt capability is selected using the EISR register, the configuration will be as follows:
Port
Input
Pin name
Output
OR = 0
OR = 1
OR = 0
OR = 1
pull-up interrupt
pull-up interrupt
open drain
push-pull
open drain
push-pull
Port A
PA7:0
floating
Port B
PB6:0
floating
Table 11. I/O Port Register Map and Reset Values
Address
(Hex.)
0000h
0001h
0002h
0003h
0004h
0005h
Register
Label
PADR
Reset Value
PADDR
Reset Value
PAOR
Reset Value
PBDR
Reset Value
PBDDR
Reset Value
PBOR
Reset Value
7
6
5
4
3
2
1
1
1
1
1
1
1
0
0
0
0
0
0
MSB
1
LSB
MSB
0
1
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
LSB
MSB
0
0
LSB
MSB
0
0
LSB
MSB
1
1
LSB
MSB
0
0
0
LSB
0
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ST7LITE2
11 ON-CHIP PERIPHERALS
11.1 WATCHDOG TIMER (WDG)
11.1.1 Introduction
The Watchdog timer is used to detect the occurrence of a software fault, usually generated by external interference or by unforeseen logical conditions, which causes the application program to
abandon its normal sequence. The Watchdog circuit generates an MCU reset on expiry of a programmed time period, unless the program refreshes the counter’s contents before the T6 bit becomes cleared.
11.1.2 Main Features
■ Programmable free-running downcounter (64
increments of 16000 CPU cycles)
■ Programmable reset
■ Reset (if watchdog activated) when the T6 bit
reaches zero
■
■
Optional
reset
on
HALT
instruction
(configurable by option byte)
Hardware Watchdog selectable by option byte
11.1.3 Functional Description
The counter value stored in the CR register (bits
T[6:0]), is decremented every 16000 machine cycles, and the length of the timeout period can be
programmed by the user in 64 increments.
If the watchdog is activated (the WDGA bit is set)
and when the 7-bit timer (bits T[6:0]) rolls over
from 40h to 3Fh (T6 becomes cleared), it initiates
a reset cycle pulling low the reset pin for typically
30µs.
Figure 33. Watchdog Block Diagram
RESET
WATCHDOG CONTROL REGISTER (CR)
WDGA
T6
T5
T4
T3
T2
7-BIT DOWNCOUNTER
fCPU
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1
CLOCK DIVIDER
÷16000
T1
T0
ST7LITE2
WATCHDOG TIMER (Cont’d)
The application program must write in the CR register at regular intervals during normal operation to
prevent an MCU reset. This downcounter is freerunning: it counts down even if the watchdog is
disabled. The value to be stored in the CR register
must be between FFh and C0h (see Table 12
.Watchdog Timing):
– The WDGA bit is set (watchdog enabled)
– The T6 bit is set to prevent generating an immediate reset
– The T[5:0] bits contain the number of increments
which represents the time delay before the
watchdog produces a reset.
Following a reset, the watchdog is disabled. Once
activated it cannot be disabled, except by a reset.
The T6 bit can be used to generate a software reset (the WDGA bit is set and the T6 bit is cleared).
If the watchdog is activated, the HALT instruction
will generate a Reset.
Table 12.Watchdog Timing
fCPU = 8MHz
WDG
Counter
Code
min
[ms]
Notes:
1. The timing variation shown in Table 12 is due to
the unknown status of the prescaler when writing
to the CR register.
2. The number of CPU clock cycles applied during
the RESET phase (256 or 4096) must be taken
into account in addition to these timings.
11.1.4 Hardware Watchdog Option
If Hardware Watchdog is selected by option byte,
the watchdog is always active and the WDGA bit in
the CR is not used.
Refer to the Option Byte description in section 15
on page 122.
11.1.4.1 Using Halt Mode with the WDG
(WDGHALT option)
If Halt mode with Watchdog is enabled by option
byte (No watchdog reset on HALT instruction), it is
recommended before executing the HALT instruction to refresh the WDG counter, to avoid an unexpected WDG reset immediately after waking up
the microcontroller. Same behavior in active-halt
mode.
max
[ms]
C0h
1
2
FFh
127
128
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ST7LITE2
WATCHDOG TIMER (Cont’d)
11.1.5 Interrupts
None.
When WDGA = 1, the watchdog can generate a
reset.
0: Watchdog disabled
1: Watchdog enabled
Note: This bit is not used if the hardware watchdog option is enabled by option byte.
11.1.6 Register Description
CONTROL REGISTER (CR)
Read/Write
Reset Value: 0111 1111 (7Fh)
7
WDGA
Bits 6:0 = T[6:0] 7-bit timer (MSB to LSB).
These bits contain the decremented value. A reset
is produced when it rolls over from 40h to 3Fh (T6
becomes cleared).
0
T6
T5
T4
T3
T2
T1
T0
Bit 7 = WDGA Activation bit.
This bit is set by software and only cleared by
hardware after a reset.
Table 13. Watchdog Timer Register Map and Reset Values
Address
(Hex.)
002Eh
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Register
Label
7
6
5
4
3
2
1
0
WDGCR
Reset Value
WDGA
0
T6
1
T5
1
T4
1
T3
1
T2
1
T1
1
T0
1
ST7LITE2
11.2 12-BIT AUTORELOAD TIMER 2 (AT2)
11.2.1 Introduction
■
The 12-bit Autoreload Timer can be used for general-purpose timing functions. It is based on a freerunning 12-bit upcounter with an input capture register and four PWM output channels. There are 6
external pins:
– Four PWM outputs
– ATIC pin for the Input Capture function
– BREAK pin for forcing a break condition on the
PWM outputs
11.2.2 Main Features
■ 12-bit upcounter with 12-bit autoreload register
(ATR)
■
■
■
Maskable overflow interrupt
Generation of four independent PWMx signals
Frequency 2KHz-4MHz (@ 8 MHz fCPU)
– Programmable duty-cycles
– Polarity control
– Programmable output modes
– Maskable Compare interrupt
Input Capture
– 12-bit input capture register (ATICR)
– Triggered by rising and falling edges
– Maskable IC interrupt
Figure 34. Block Diagram
ATIC
12-BIT INPUT CAPTURE REGISTER
IC INTERRUPT
ATICR
REQUEST
OVF INTERRUPT
REQUEST
ATCSR
0
ICF
fLTIMER
(1 ms
timebase
@ 8MHz)
ICIE
CK1
CK0
OVF OVFIE CMPIE
CMP
INTERRUPT
REQUEST
CMPF0
CMPF1
CMPF2
CMPF3
fCOUNTER
fCPU
12-BIT UPCOUNTER
CNTR
32 MHz
12-BIT AUTORELOAD REGISTER
ATR
DCR0L
Preload
Preload
on OVF Event
IF TRAN=1
12-BIT DUTY CYCLE VALUE (shadow)
CMPFx bit
COMPPARE
OPx bit
fPWM POLARITY
OUTPUT CONTROL
DCR0H
PWM GENERATION
OEx bit
PWMx
4 PWM Channels
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ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
11.2.3 Functional Description
PWM Mode
This mode allows up to four Pulse Width Modulated signals to be generated on the PWMx output
pins. The PWMx output signals can be enabled or
disabled using the OEx bits in the PWMCR register.
PWM Frequency and Duty Cycle
The four PWM signals have the same frequency
(fPWM) which is controlled by the counter period
and the ATR register value.
fPWM = fCOUNTER / (4096 - ATR)
Following the above formula,
– If fCOUNTER is 32 MHz, the maximum value of
fPWM is 8 MHz (ATR register value = 4092), the
minimum value is 8 KHz (ATR register value = 0)
– If fCOUNTER is 4 Mhz, the maximum value of fPWM
is 2 MHz (ATR register value = 4094),the minimum value is 1 KHz (ATR register value = 0).
Note: The maximum value of ATR is 4094 because it must be lower than the DCR value which
must be 4095 in this case.
At reset, the counter starts counting from 0.
When a upcounter overflow occurs (OVF event),
the preloaded Duty cycle values are transferred to
the Duty Cycle registers and the PWMx signals
are set to a high level. When the upcounter matches the DCRx value the PWMx signals are set to a
low level. To obtain a signal on a PWMx pin, the
contents of the corresponding DCRx register must
be greater than the contents of the ATR register.
The polarity bits can be used to invert any of the
four output signals. The inversion is synchronized
with the counter overflow if the TRAN bit in the
TRANCR register is set (reset value). See Figure
35.
Figure 35. PWM Inversion Diagram
inverter
PWMx
PWMx
PIN
PWMxCSR Register
OPx
TRAN
DFF
TRANCR Register
counter
overflow
The maximum available resolution for the PWMx
duty cycle is:
Resolution = 1 / (4096 - ATR)
Note: To get the maximum resolution (1/4096), the
ATR register must be 0. With this maximum resolution, 0% and 100% can be obtained by changing
the polarity.
Figure 36. PWM Function
COUNTER
4095
DUTY CYCLE
REGISTER
(DCRx)
AUTO-RELOAD
REGISTER
(ATR)
PWMx OUTPUT
000
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1
WITH OE=1
AND OPx=0
WITH OE=1
AND OPx=1
t
ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
Figure 37. PWM Signal from 0% to 100% Duty Cycle
fCOUNTER
ATR= FFDh
PWMx OUTPUT
WITH OEx=1
AND OPx=1
PWMx OUTPUT
WITH OEx=1
AND OPx=0
COUNTER
FFDh
FFEh
FFFh
FFDh
FFEh
FFFh
FFDh
FFEh
DCRx=000h
DCRx=FFDh
DCRx=FFEh
DCRx=000h
t
Output Compare Mode
To use this function, load a 12-bit value in the
DCRxH and DCRxL registers.
When the 12-bit upcounter (CNTR) reaches the
value stored in the DCRxH and DCRxL registers,
the CMPF bit in the PWMxCSR register is set and
an interrupt request is generated if the CMPIE bit
is set.
Note: The output compare function is only available for DCRx values other than 0 (reset value).
Break Function
The break function is used to perform an emergency shutdown of the power converter.
The break function is activated by the external
BREAK pin (active low). In order to use the
BREAK pin it must be previously enabled by software setting the BPEN bit in the BREAKCR register.
When a low level is detected on the BREAK pin,
the BA bit is set and the break function is activated.
Software can set the BA bit to activate the break
function without using the BREAK pin.
When the break function is activated (BA bit =1):
– The break pattern (PWM[3:0] bits in the BREAKCR) is forced directly on the PWMx output pins
(after the inverter).
– The 12-bit PWM counter is set to its reset value.
– The ARR, DCRx and the corresponding shadow
registers are set to their reset values.
– The PWMCR register is reset.
When the break function is deactivated after applying the break (BA bit goes from 1 to 0 by software):
– The control of PWM outputs is transferred to the
port registers.
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ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
Figure 38. Block Diagram of Break Function
BREAK pin (Active Low)
BREAKCR Register
BA
BPEN
PWM3 PWM2 PWM1 PWM0
PWM0
1
PWM1
PWM2
PWM0
PWM1
PWM3
PWM2
0
PWM3
(Inverters)
When BA is set:
PWM counter -> Reset value
ARR & DCRx -> Reset value
PWM Mode -> Reset value
Note:
The BREAK pin value is latched by the BA bit.
11.2.3.1 Input Capture
The 12-bit ATICR register is used to latch the value of the 12-bit free running upcounter after a rising or falling edge is detected on the ATIC pin.
When an input capture occurs, the ICF bit is set
and the ATICR register contains the value of the
free running upcounter. An IC interrupt is generated if the ICIE bit is set. The ICF bit is reset by reading the ATICR register when the ICF bit is set. The
ATICR is a read only register and always contains
the free running upcounter value which corresponds to the most recent input capture. Any further input capture is inhibited while the ICF bit is
set.
Figure 39. Input Capture Timing Diagram
fCOUNTER
COUNTER
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
ATIC PIN
INTERRUPT
ATICR READ
INTERRUPT
ICF FLAG
ICR REGISTER
xxh
04h
09h
t
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ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
11.2.4 Low Power Modes
Mode
Description
The input frequency is divided
SLOW
by 32
WAIT
No effect on AT timer
AT timer halted except if CK0=1,
ACTIVE-HALT
CK1=0 and OVFIE=1
HALT
AT timer halted
The OVF event is mapped on a separate vector
(see Interrupts chapter).
They generate an interrupt if the enable bit is set in
the ATCSR register and the interrupt mask in the
CC register is reset (RIM instruction).
Note 2: Only if CK0=1 and CK1=0 (fCOUNTER =
fLTIMER)
11.2.5 Interrupts
Interrupt
Event1)
Overflow
Event
IC Event
CMP Event
Enable Exit
Event
Control from
Flag
Wait
Bit
OVF
OVIE
ICF
ICIE
CMPF0 CMPIE
Exit
Exit
from
from
ActiveHalt
Halt
Yes
No
Yes2)
Yes
Yes
No
No
No
No
Note 1: The CMP and IC events are connected to
the same interrupt vector.
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ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
11.2.6 Register Description
Bit 2 = OVF Overflow Flag.
This bit is set by hardware and cleared by software
by reading the TCSR register. It indicates the transition of the counter from FFFh to ATR value.
0: No counter overflow occurred
1: Counter overflow occurred
TIMER CONTROL STATUS REGISTER
(ATCSR)
Read / Write
Reset Value: 0x00 0000 (x0h)
7
6
0
ICF
0
ICIE
CK1
CK0
OVF
OVFIE CMPIE
Bit 7 = Reserved.
Bit 6 = ICF Input Capture Flag.
This bit is set by hardware and cleared by software
by reading the ATICR register (a read access to
ATICRH or ATICRL will clear this flag). Writing to
this bit does not change the bit value.
0: No input capture
1: An input capture has occurred
15
Bits 4:3 = CK[1:0] Counter Clock Selection.
These bits are set and cleared by software and
cleared by hardware after a reset. They select the
clock frequency of the counter.
CK1
CK0
OFF
0
0
fLTIMER (1 ms timebase @ 8 MHz) 1)
0
1
fCPU
1
0
32 MHz 2)
1
1
Note 1: PWM mode and Output Compare modes
are not available at this frequency.
Note 2: ATICR counter may return inaccurate results when read. It is therefore not recommended
to use Input Capture mode at this frequency.
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Bit 0 = CMPIE Compare Interrupt Enable.
This bit is read/write by software and cleared by
hardware after a reset. It can be used to mask the
interrupt generated when the CMPF bit is set.
0: CMPF interrupt disabled.
1: CMPF interrupt enabled.
COUNTER REGISTER HIGH (CNTRH)
Read only
Reset Value: 0000 0000 (000h)
Bit 5 = ICIE IC Interrupt Enable.
This bit is set and cleared by software.
0: Input capture interrupt disabled
1: Input capture interrupt enabled
Counter Clock Selection
Bit 1 = OVFIE Overflow Interrupt Enable.
This bit is read/write by software and cleared by
hardware after a reset.
0: OVF interrupt disabled.
1: OVF interrupt enabled.
0
8
0
0
0
CNTR CNTR
CNTR9 CNTR8
11
10
COUNTER REGISTER LOW (CNTRL)
Read only
Reset Value: 0000 0000 (000h)
7
0
CNTR7 CNTR6 CNTR5 CNTR4 CNTR3 CNTR2 CNTR1 CNTR0
Bits 15:12 = Reserved.
Bits 11:0 = CNTR[11:0] Counter Value.
This 12-bit register is read by software and cleared
by hardware after a reset. The counter is incremented continuously as soon as a counter clok is
selected. To obtain the 12-bit value, software
should read the counter value in two consecutive
read operations, LSB first. When a counter overflow occurs, the counter restarts from the value
specified in the ATR register.
ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
AUTORELOAD REGISTER (ATRH)
Read / Write
Reset Value: 0000 0000 (00h)
PWMx CONTROL STATUS REGISTER
(PWMxCSR)
Read / Write
Reset Value: 0000 0000 (00h)
15
0
8
0
0
0
ATR11 ATR10 ATR9
AUTORELOAD REGISTER (ATRL)
Read / Write
Reset Value: 0000 0000 (00h)
0
ATR6
ATR5
ATR4
ATR3
ATR2
ATR1
ATR0
Bits 11:0 = ATR[11:0] Autoreload Register.
This is a 12-bit register which is written by software. The ATR register value is automatically
loaded into the upcounter when an overflow occurs. The register value is used to set the PWM
frequency.
PWM OUTPUT CONTROL REGISTER
(PWMCR)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
0
OE3
0
OE2
0
OE1
6
0
0
0
0
0
0
0
OPx
CMPFx
Bits 7:2= Reserved, must be kept cleared.
7
ATR7
7
ATR8
0
OE0
Bits 7:0 = OE[3:0] PWMx output enable.
These bits are set and cleared by software and
cleared by hardware after a reset.
0: PWM mode disabled. PWMx output alternate
function disabled: I/O pin free for general purpose I/O after an overflow event.
1: PWM mode enabled
Bit 1 = OPx PWMx Output Polarity.
This bit is read/write by software and cleared by
hardware after a reset. This bit selects the polarity
of the PWM signal.
0: The PWM signal is not inverted.
1: The PWM signal is inverted.
Bit 0 = CMPFx PWMx Compare Flag.
This bit is set by hardware and cleared by software
by reading the PWMxCSR register. It indicates
that the upcounter value matches the DCRx register value.
0: Upcounter value does not match DCR value.
1: Upcounter value matches DCR value.
BREAK CONTROL REGISTER (BREAKCR)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
0
0
BA
BPEN
PWM3
PWM2
PWM1
PWM0
Bits 7:6 = Reserved. Forced by hardware to 0.
Bit 5 = BA Break Active.
This bit is read/write by software, cleared by hardware after reset and set by hardware when the
BREAK pin is low. It activates/deactivates the
Break function.
0: Break not active
1: Break active
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ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
Bit 4 = BPEN Break Pin Enable.
This bit is read/write by software and cleared by
hardware after Reset.
0: Break pin disabled
1: Break pin enabled
Bits 3:0 = PWM[3:0] Break Pattern.
These bits are read/write by software and cleared
by hardware after a reset. They are used to force
the four PWMx output signals into a stable state
when the Break function is active.
PWMx DUTY CYCLE REGISTER HIGH (DCRxH)
Read / Write
Reset Value: 0000 0000 (00h)
15
INPUT CAPTURE REGISTER HIGH (ATICRH)
Read only
Reset Value: 0000 0000 (00h)
15
0
8
0
0
0
ICR11 ICR10
ICR9
ICR8
INPUT CAPTURE REGISTER LOW (ATICRL)
Read only
Reset Value: 0000 0000 (00h)
7
ICR7
0
ICR6
ICR5
ICR4
ICR3
ICR2
ICR1
ICR0
8
Bits 15:12 = Reserved.
0
0
0
0
DCR11 DCR10 DCR9 DCR8
PWMx DUTY CYCLE REGISTER LOW (DCRxL)
Read / Write
Reset Value: 0000 0000 (00h)
7
DCR7 DCR6 DCR5 DCR4 DCR3
0
DCR2
DCR1 DCR0
Bits 11:0 = ICR[11:0] Input Capture Data.
This is a 12-bit register which is readable by software and cleared by hardware after a reset. The
ATICR register contains captured the value of the
12-bit CNTR register when a rising or falling edge
occurs on the ATIC pin. Capture will only be performed when the ICF flag is cleared.
TRANSFER CONTROL REGISTER (TRANCR)
Read/Write
Reset Value: 0000 0001 (01h)
7
0
Bits 15:12 = Reserved.
Bits 11:0 = DCR[11:0] PWMx Duty Cycle Value
This 12-bit value is written by software. It definesthe duty cycle of the corresponding PWM output
signal (see Figure 36).
In PWM mode (OEx=1 in the PWMCR register)
the DCR[11:0] bits define the duty cycle of the
PWMx output signal (see Figure 36). In Output
Compare mode, they define the value to be compared with the 12-bit upcounter value.
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0
0
0
0
0
0
0
TRAN
Bits 7:1 Reserved. Forced by hardware to 0.
Bit 0 = TRAN Transfer enable
This bit is read/write by software, cleared by hardware after each completed transfer and set by
hardware after reset.
It allows the value of the DCRx registers to be
transferred to the DCRx shadow registers after the
next overflow event.
The OPx bits are transferred to the shadow OPx
bits in the same way.
ST7LITE2
12-BIT AUTORELOAD TIMER (Cont’d)
Table 14. Register Map and Reset Values
Address
Register
Label
7
6
5
4
3
2
1
0
0D
ATCSR
Reset Value
0
ICF
0
ICIE
0
CK1
0
CK0
0
OVF
0
OVFIE
0
CMPIE
0
0E
CNTRH
Reset Value
0
0
0
0
CNTR11
0
CNTR10
0
CNTR9
0
CNTR8
0
0F
CNTRL
Reset Value
CNTR7
0
CNTR8
0
CNTR7
0
CNTR6
0
CNTR3
0
CNTR2
0
CNTR1
0
CNTR0
0
10
ATRH
Reset Value
0
0
0
0
ATR11
0
ATR10
0
ATR9
0
ATR8
0
11
ATRL
Reset Value
ATR7
0
ATR6
0
ATR5
0
ATR4
0
ATR3
0
ATR2
0
ATR1
0
ATR0
0
12
PWMCR
Reset Value
0
OE3
0
0
OE2
0
0
OE1
0
0
OE0
0
13
PWM0CSR
Reset Value
0
0
0
0
0
0
OP0
0
CMPF0
0
14
PWM1CSR
Reset Value
0
0
0
0
0
0
OP1
0
CMPF1
0
15
PWM2CSR
Reset Value
0
0
0
0
0
0
OP2
0
CMPF2
0
16
PWM3CSR
Reset Value
0
0
0
0
0
0
OP3
0
CMPF3
0
17
DCR0H
Reset Value
0
0
0
0
DCR11
0
DCR10
0
DCR9
0
DCR8
0
18
DCR0L
Reset Value
DCR7
0
DCR6
0
DCR5
0
DCR4
0
DCR3
0
DCR2
0
DCR1
0
DCR0
0
19
DCR1H
Reset Value
0
0
0
0
DCR11
0
DCR10
0
DCR9
0
DCR8
0
1A
DCR1L
Reset Value
DCR7
0
DCR6
0
DCR5
0
DCR4
0
DCR3
0
DCR2
0
DCR1
0
DCR0
0
1B
DCR2H
Reset Value
0
0
0
0
DCR11
0
DCR10
0
DCR9
0
DCR8
0
1C
DCR2L
Reset Value
DCR7
0
DCR6
0
DCR5
0
DCR4
0
DCR3
0
DCR2
0
DCR1
0
DCR0
0
1D
DCR3H
Reset Value
0
0
0
0
DCR11
0
DCR10
0
DCR9
0
DCR8
0
1E
DCR3L
Reset Value
DCR7
0
DCR6
0
DCR5
0
DCR4
0
DCR3
0
DCR2
0
DCR1
0
DCR0
0
1F
ATICRH
Reset Value
0
0
0
0
ICR11
0
ICR10
0
ICR9
0
ICR8
0
20
ATICRL
Reset Value
ICR7
0
ICR6
0
ICR5
0
ICR4
0
ICR3
0
ICR2
0
ICR1
0
ICR0
0
(Hex.)
63/133
1
ST7LITE2
Address
Register
Label
7
6
5
4
3
2
1
0
21
TRANCR
Reset Value
0
0
0
0
0
0
0
TRAN
1
22
BREAKCR
Reset Value
0
0
BA
0
BPEN
0
PWM3
0
PWM2
0
PWM1
0
PWM0
0
(Hex.)
64/133
1
ST7LITE2
11.3 LITE TIMER 2 (LT2)
11.3.1 Introduction
The Lite Timer can be used for general-purpose
timing functions. It is based on two free-running 8bit upcounters, an 8-bit input capture register.
■
11.3.2 Main Features
■ Realtime Clock
– One 8-bit upcounter 1 ms or 2 ms timebase
period (@ 8 MHz fOSC)
– One 8-bit upcounter with autoreload and programmable timebase period from 4µs to
1.024ms in 4µs increments (@ 8 MHz fOSC)
– 2 Maskable timebase interrupts
Input Capture
– 8-bit input capture register (LTICR)
– Maskable interrupt with wakeup from Halt
Mode capability
Figure 40. Lite Timer 2 Block Diagram
fOSC/32
LTTB2
LTCNTR
Interrupt request
LTCSR2
8-bit TIMEBASE
COUNTER 2
0
0
0
0
0
0
TB2IE TB2F
8
LTARR
fLTIMER
8-bit AUTORELOAD
REGISTER
/2
8-bit TIMEBASE
COUNTER 1
fLTIMER
8
To 12-bit AT TImer
1
0 Timebase
1 or 2 ms
(@ 8MHz
fOSC)
LTICR
LTIC
8-bit
INPUT CAPTURE
REGISTER
LTCSR1
ICIE
ICF
TB
TB1IE TB1F
LTTB1 INTERRUPT REQUEST
LTIC INTERRUPT REQUEST
65/133
1
ST7LITE2
LITE TIMER (Cont’d)
11.3.3 Functional Description
11.3.3.1 Timebase Counter 1
An interrupt is generated if the ICIE bit is set. The
ICF bit is cleared by reading the LTICR register.
The 8-bit value of Counter 1 cannot be read or
written by software. After an MCU reset, it starts
incrementing from 0 at a frequency of fOSC/32. An
overflow event occurs when the counter rolls over
from F9h to 00h. If fOSC = 8 MHz, then the time period between two counter overflow events is 1 ms.
This period can be doubled by setting the TB bit in
the LTCSR1 register.
When Counter 1 overflows, the TB1F bit is set by
hardware and an interrupt request is generated if
the TB1IE bit is set. The TB1F bit is cleared by
software reading the LTCSR1 register.
11.3.3.2 Input Capture
The 8-bit input capture register is used to latch the
free-running upcounter (Counter 1) 1 after a rising
or falling edge is detected on the LTIC pin. When
an input capture occurs, the ICF bit is set and the
LTICR1 register contains the MSB of Counter 1.
The LTICR is a read-only register and always contains the data from the last input capture. Input
capture is inhibited if the ICF bit is set.
11.3.3.3 Timebase Counter 2
Counter 2 is an 8-bit autoreload upcounter. It can
be read by accessing the LTCNTR register. After
an MCU reset, it increments at a frequency of
fOSC/32 starting from the value stored in the
LTARR register. A counter overflow event occurs
when the counter rolls over from FFh to the
LTARR reload value. Software can write a new
value at anytime in the LTARR register, this value
will be automatically loaded in the counter when
the next overflow occurs.
When Counter 2 overflows, the TB2F bit in the
LTCSR2 register is set by hardware and an interrupt request is generated if the TB2IE bit is set.
The TB2F bit is cleared by software reading the
LTCSR2 register.
Figure 41. Input Capture Timing Diagram.
4µs
(@ 8MHz fOSC)
fCPU
fOSC/32
8-bit COUNTER 1
01h
02h
03h
04h
05h
06h
07h
CLEARED
BY S/W
READING
LTIC REGISTER
LTIC PIN
ICF FLAG
LTICR REGISTER
xxh
04h
07h
t
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ST7LITE2
LITE TIMER (Cont’d)
11.3.4 Low Power Modes
11.3.6 Register Description
Mode
Description
No effect on Lite timer
SLOW
(this peripheral is driven directly
by fOSC/32)
WAIT
No effect on Lite timer
ACTIVE-HALT No effect on Lite timer
HALT
Lite timer stops counting
11.3.5 Interrupts
Interrupt
Event
7
0
0
0
0
0
0
0
TB2IE
TB2F
Bits 7:2 = Reserved, must be kept cleared.
Exit
from
Wait
Exit
from
Active
Halt
Exit
from
Halt
TB1IE
Yes
Yes
No
TB2IE
Yes
No
No
ICIE
Yes
No
No
Enable
Event
Control
Flag
Bit
Timebase 1
TB1F
Event
Timebase 2
TB2F
Event
IC Event
ICF
LITE TIMER CONTROL/STATUS REGISTER 2
(LTCSR2)
Read / Write
Reset Value: 0000 0000 (00h)
Note: The TBxF and ICF interrupt events are connected to separate interrupt vectors (see Interrupts chapter).
They generate an interrupt if the enable bit is set in
the LTCSR1 or LTCSR2 register and the interrupt
mask in the CC register is reset (RIM instruction).
Bit 1 = TB2IE Timebase 2 Interrupt enable.
This bit is set and cleared by software.
0: Timebase (TB2) interrupt disabled
1: Timebase (TB2) interrupt enabled
Bit 0 = TB2F Timebase 2 Interrupt Flag.
This bit is set by hardware and cleared by software
reading the LTCSR register. Writing to this bit has
no effect.
0: No Counter 2 overflow
1: A Counter 2 overflow has occurred
LITE
TIMER
AUTORELOAD
(LTARR)
Read / Write
Reset Value: 0000 0000 (00h)
REGISTER
7
AR7
0
AR7
AR7
AR7
AR3
AR2
AR1
AR0
Bits 7:0 = AR[7:0] Counter 2 Reload Value.
These bits register is read/write by software. The
LTARR value is automatically loaded into Counter
2 (LTCNTR) when an overflow occurs.
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1
ST7LITE2
LITE TIMER (Cont’d)
LITE TIMER COUNTER 2 (LTCNTR)
Read only
Reset Value: 0000 0000 (00h)
7
CNT7
0
CNT7
CNT7
CNT7
CNT3
CNT2
CNT1
CNT0
Bits 7:0 = CNT[7:0] Counter 2 Reload Value.
This register is read by software. The LTARR value is automatically loaded into Counter 2 (LTCNTR) when an overflow occurs.
LITE TIMER CONTROL/STATUS REGISTER
(LTCSR1)
Read / Write
Reset Value: 0x00 0000 (x0h)
7
Bit 5 = TB Timebase period selection.
This bit is set and cleared by software.
0: Timebase period = tOSC * 8000 (1ms @ 8 MHz)
1: Timebase period = tOSC * 16000 (2ms @ 8
MHz)
Bit 4 = TB1IE Timebase Interrupt enable.
This bit is set and cleared by software.
0: Timebase (TB1) interrupt disabled
1: Timebase (TB1) interrupt enabled
Bit 3 = TB1F Timebase Interrupt Flag.
This bit is set by hardware and cleared by software
reading the LTCSR register. Writing to this bit has
no effect.
0: No counter overflow
1: A counter overflow has occurred
0
Bits 2:0 = Reserved
ICIE
ICF
TB
TB1IE
TB1F
-
-
-
Bit 7 = ICIE Interrupt Enable.
This bit is set and cleared by software.
0: Input Capture (IC) interrupt disabled
1: Input Capture (IC) interrupt enabled
LITE TIMER INPUT CAPTURE REGISTER
(LTICR)
Read only
Reset Value: 0000 0000 (00h)
7
ICR7
Bit 6 = ICF Input Capture Flag.
This bit is set by hardware and cleared by software
by reading the LTICR register. Writing to this bit
does not change the bit value.
0: No input capture
1: An input capture has occurred
Note: After an MCU reset, software must initialise
the ICF bit by reading the LTICR register
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1
0
ICR6
ICR5
ICR4
ICR3
ICR2
ICR1
ICR0
Bits 7:0 = ICR[7:0] Input Capture Value
These bits are read by software and cleared by
hardware after a reset. If the ICF bit in the LTCSR
is cleared, the value of the 8-bit up-counter will be
captured when a rising or falling edge occurs on
the LTIC pin.
ST7LITE2
LITE TIMER (Cont’d)
Table 15. Lite Timer Register Map and Reset Values
Address
Register
Label
7
6
5
4
3
2
1
0
08
LTCSR2
Reset Value
0
0
0
0
0
0
TB2IE
0
TB2F
0
09
LTARR
Reset Value
AR7
0
AR6
0
AR5
0
AR4
0
AR3
0
AR2
0
AR1
0
AR0
0
0A
LTCNTR
Reset Value
CNT7
0
CNT6
0
CNT5
0
CNT4
0
CNT3
0
CNT2
0
CNT1
0
CNT0
0
0B
LTCSR1
Reset Value
ICIE
0
ICF
x
TB
0
TB1IE
0
TB1F
0
0
0
0
0C
LTICR
Reset Value
ICR7
0
ICR6
0
ICR5
0
ICR4
0
ICR3
0
ICR2
0
ICR1
0
ICR0
0
(Hex.)
69/133
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ST7LITE2
11.4 SERIAL PERIPHERAL INTERFACE (SPI)
11.4.1 Introduction
The Serial Peripheral Interface (SPI) allows fullduplex, synchronous, serial communication with
external devices. An SPI system may consist of a
master and one or more slaves or a system in
which devices may be either masters or slaves.
11.4.2 Main Features
■ Full duplex synchronous transfers (on 3 lines)
■ Simplex synchronous transfers (on 2 lines)
■ Master or slave operation
■ Six master mode frequencies (fCPU/4 max.)
■ fCPU/2 max. slave mode frequency (see note)
■ SS Management by software or hardware
■ Programmable clock polarity and phase
■ End of transfer interrupt flag
■ Write collision, Master Mode Fault and Overrun
flags
Note: In slave mode, continuous transmission is
not possible at maximum frequency due to the
software overhead for clearing status flags and to
initiate the next transmission sequence.
11.4.3 General Description
Figure 42 shows the serial peripheral interface
(SPI) block diagram. There are 3 registers:
– SPI Control Register (SPICR)
– SPI Control/Status Register (SPICSR)
– SPI Data Register (SPIDR)
The SPI is connected to external devices through
3 pins:
– MISO: Master In / Slave Out data
– MOSI: Master Out / Slave In data
– SCK: Serial Clock out by SPI masters and input by SPI slaves
– SS: Slave select:
This input signal acts as a ‘chip select’ to let
the SPI master communicate with slaves individually and to avoid contention on the data
lines. Slave SS inputs can be driven by standard I/O ports on the master Device.
Figure 42. Serial Peripheral Interface Block Diagram
SPIDR
Data/Address Bus
Read
Interrupt
request
Read Buffer
MOSI
MISO
8-Bit Shift Register
SPICSR
7
SPIF WCOL OVR MODF
SOD
bit
SS
SPI
STATE
CONTROL
7
SPIE
MASTER
CONTROL
SERIAL CLOCK
GENERATOR
70/133
1
SOD SSM
SSI
Write
SCK
SS
0
0
1
0
SPICR
0
SPE SPR2 MSTR CPOL CPHA SPR1 SPR0
ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.1 Functional Description
A basic example of interconnections between a
single master and a single slave is illustrated in
Figure 43.
The MOSI pins are connected together and the
MISO pins are connected together. In this way
data is transferred serially between master and
slave (most significant bit first).
The communication is always initiated by the master. When the master device transmits data to a
slave device via MOSI pin, the slave device re-
sponds by sending data to the master device via
the MISO pin. This implies full duplex communication with both data out and data in synchronized
with the same clock signal (which is provided by
the master device via the SCK pin).
To use a single data line, the MISO and MOSI pins
must be connected at each node ( in this case only
simplex communication is possible).
Four possible data/clock timing relationships may
be chosen (see Figure 46) but master and slave
must be programmed with the same timing mode.
Figure 43. Single Master/ Single Slave Application
SLAVE
MASTER
MSBit
LSBit
8-BIT SHIFT REGISTER
SPI
CLOCK
GENERATOR
MSBit
MISO
MISO
MOSI
MOSI
SCK
SS
LSBit
8-BIT SHIFT REGISTER
SCK
+5V
SS
Not used if SS is managed
by software
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ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.2 Slave Select Management
As an alternative to using the SS pin to control the
Slave Select signal, the application can choose to
manage the Slave Select signal by software. This
is configured by the SSM bit in the SPICSR register (see Figure 45)
In software management, the external SS pin is
free for other application uses and the internal SS
signal level is driven by writing to the SSI bit in the
SPICSR register.
In Master mode:
SS internal must be held high continuously.
In Slave Mode:
There are two cases depending on the data/clock
timing relationship (see Figure 44):
If CPHA=1 (data latched on 2nd clock edge):
– SS internal must be held low during the entire
transmission. This implies that in single slave
applications the SS pin either can be tied to
VSS, or made free for standard I/O by managing the SS function by software (SSM= 1 and
SSI=0 in the in the SPICSR register)
If CPHA=0 (data latched on 1st clock edge):
– SS internal must be held low during byte
transmission and pulled high between each
byte to allow the slave to write to the shift register. If SS is not pulled high, a Write Collision
error will occur when the slave writes to the
shift register (see Section 11.4.5.3).
Figure 44. Generic SS Timing Diagram
MOSI/MISO
Byte 1
Byte 2
Master SS
Slave SS
(if CPHA=0)
Slave SS
(if CPHA=1)
Figure 45. Hardware/Software Slave Select Management
SSM bit
72/133
1
SSI bit
1
SS external pin
0
SS internal
Byte 3
ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.3 Master Mode Operation
In master mode, the serial clock is output on the
SCK pin. The clock frequency, polarity and phase
are configured by software (refer to the description
of the SPICSR register).
Note: The idle state of SCK must correspond to
the polarity selected in the SPICSR register (by
pulling up SCK if CPOL=1 or pulling down SCK if
CPOL=0).
How to operate the SPI in master mode
To operate the SPI in master mode, perform the
following steps in order (if the SPICSR register is
not written first, the SPICR register setting (MSTR
bit ) may be not taken into account):
1. Write to the SPICR register:
– Select the clock frequency by configuring the
SPR[2:0] bits.
– Select the clock polarity and clock phase by
configuring the CPOL and CPHA bits. Figure
46 shows the four possible configurations.
Note: The slave must have the same CPOL
and CPHA settings as the master.
2. Write to the SPICSR register:
– Either set the SSM bit and set the SSI bit or
clear the SSM bit and tie the SS pin high for
the complete byte transmit sequence.
3. Write to the SPICR register:
– Set the MSTR and SPE bits
Note: MSTR and SPE bits remain set only if
SS is high.
Important note: if the SPICSR register is not written first, the SPICR register setting (MSTR bit)
may be not taken into account.
The transmit sequence begins when software
writes a byte in the SPIDR register.
11.4.3.4 Master Mode Transmit Sequence
When software writes to the SPIDR register, the
data byte is loaded into the 8-bit shift register and
then shifted out serially to the MOSI pin most significant bit first.
When data transfer is complete:
– The SPIF bit is set by hardware
– An interrupt request is generated if the SPIE
bit is set and the interrupt mask in the CCR
register is cleared.
Clearing the SPIF bit is performed by the following
software sequence:
1. An access to the SPICSR register while the
SPIF bit is set
2. A read to the SPIDR register.
Note: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR register is read.
11.4.3.5 Slave Mode Operation
In slave mode, the serial clock is received on the
SCK pin from the master device.
To operate the SPI in slave mode:
1. Write to the SPICSR register to perform the following actions:
– Select the clock polarity and clock phase by
configuring the CPOL and CPHA bits (see
Figure 46).
Note: The slave must have the same CPOL
and CPHA settings as the master.
– Manage the SS pin as described in Section
11.4.3.2 and Figure 44. If CPHA=1 SS must
be held low continuously. If CPHA=0 SS must
be held low during byte transmission and
pulled up between each byte to let the slave
write in the shift register.
2. Write to the SPICR register to clear the MSTR
bit and set the SPE bit to enable the SPI I/O
functions.
11.4.3.6 Slave Mode Transmit Sequence
When software writes to the SPIDR register, the
data byte is loaded into the 8-bit shift register and
then shifted out serially to the MISO pin most significant bit first.
The transmit sequence begins when the slave device receives the clock signal and the most significant bit of the data on its MOSI pin.
When data transfer is complete:
– The SPIF bit is set by hardware
– An interrupt request is generated if SPIE bit is
set and interrupt mask in the CCR register is
cleared.
Clearing the SPIF bit is performed by the following
software sequence:
1. An access to the SPICSR register while the
SPIF bit is set.
2. A write or a read to the SPIDR register.
Notes: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR register is read.
The SPIF bit can be cleared during a second
transmission; however, it must be cleared before
the second SPIF bit in order to prevent an Overrun
condition (see Section 11.4.5.2).
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ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.4 Clock Phase and Clock Polarity
Four possible timing relationships may be chosen
by software, using the CPOL and CPHA bits (See
Figure 46).
Note: The idle state of SCK must correspond to
the polarity selected in the SPICSR register (by
pulling up SCK if CPOL=1 or pulling down SCK if
CPOL=0).
The combination of the CPOL clock polarity and
CPHA (clock phase) bits selects the data capture
clock edge
Figure 46, shows an SPI transfer with the four
combinations of the CPHA and CPOL bits. The diagram may be interpreted as a master or slave
timing diagram where the SCK pin, the MISO pin,
the MOSI pin are directly connected between the
master and the slave device.
Note: If CPOL is changed at the communication
byte boundaries, the SPI must be disabled by resetting the SPE bit.
Figure 46. Data Clock Timing Diagram
CPHA =1
SCK
(CPOL = 1)
SCK
(CPOL = 0)
MISO
(from master)
MOSI
(from slave)
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
SS
(to slave)
CAPTURE STROBE
CPHA =0
SCK
(CPOL = 1)
SCK
(CPOL = 0)
MISO
(from master)
MOSI
(from slave)
MSBit
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
SS
(to slave)
CAPTURE STROBE
Note: This figure should not be used as a replacement for parametric information.
Refer to the Electrical Characteristics chapter.
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ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.5 Error Flags
11.4.5.1 Master Mode Fault (MODF)
Master mode fault occurs when the master device
has its SS pin pulled low.
When a Master mode fault occurs:
– The MODF bit is set and an SPI interrupt request is generated if the SPIE bit is set.
– The SPE bit is reset. This blocks all output
from the Device and disables the SPI peripheral.
– The MSTR bit is reset, thus forcing the Device
into slave mode.
Clearing the MODF bit is done through a software
sequence:
1. A read access to the SPICSR register while the
MODF bit is set.
2. A write to the SPICR register.
Notes: To avoid any conflicts in an application
with multiple slaves, the SS pin must be pulled
high during the MODF bit clearing sequence. The
SPE and MSTR bits may be restored to their original state during or after this clearing sequence.
Hardware does not allow the user to set the SPE
and MSTR bits while the MODF bit is set except in
the MODF bit clearing sequence.
In a slave device, the MODF bit can not be set, but
in a multi master configuration the Device can be in
slave mode with the MODF bit set.
The MODF bit indicates that there might have
been a multi-master conflict and allows software to
handle this using an interrupt routine and either
perform to a reset or return to an application default state.
11.4.5.2 Overrun Condition (OVR)
An overrun condition occurs, when the master device has sent a data byte and the slave device has
not cleared the SPIF bit issued from the previously
transmitted byte.
When an Overrun occurs:
– The OVR bit is set and an interrupt request is
generated if the SPIE bit is set.
In this case, the receiver buffer contains the byte
sent after the SPIF bit was last cleared. A read to
the SPIDR register returns this byte. All other
bytes are lost.
The OVR bit is cleared by reading the SPICSR
register.
11.4.5.3 Write Collision Error (WCOL)
A write collision occurs when the software tries to
write to the SPIDR register while a data transfer is
taking place with an external device. When this
happens, the transfer continues uninterrupted;
and the software write will be unsuccessful.
Write collisions can occur both in master and slave
mode. See also Section 11.4.3.2 Slave Select
Management.
Note: a "read collision" will never occur since the
received data byte is placed in a buffer in which
access is always synchronous with the CPU operation.
The WCOL bit in the SPICSR register is set if a
write collision occurs.
No SPI interrupt is generated when the WCOL bit
is set (the WCOL bit is a status flag only).
Clearing the WCOL bit is done through a software
sequence (see Figure 47).
Figure 47. Clearing the WCOL bit (Write Collision Flag) Software Sequence
Clearing sequence after SPIF = 1 (end of a data byte transfer)
1st Step
Read SPICSR
RESULT
2nd Step
Read SPIDR
SPIF =0
WCOL=0
Clearing sequence before SPIF = 1 (during a data byte transfer)
1st Step
Read SPICSR
RESULT
2nd Step
Read SPIDR
WCOL=0
Note: Writing to the SPIDR register instead of reading it does not
reset the WCOL bit
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ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.5.4 Single Master and Multimaster
Configurations
There are two types of SPI systems:
– Single Master System
– Multimaster System
Single Master System
A typical single master system may be configured,
using a device as the master and four devices as
slaves (see Figure 48).
The master device selects the individual slave devices by using four pins of a parallel port to control
the four SS pins of the slave devices.
The SS pins are pulled high during reset since the
master device ports will be forced to be inputs at
that time, thus disabling the slave devices.
Note: To prevent a bus conflict on the MISO line
the master allows only one active slave device
during a transmission.
For more security, the slave device may respond
to the master with the received data byte. Then the
master will receive the previous byte back from the
slave device if all MISO and MOSI pins are connected and the slave has not written to its SPIDR
register.
Other transmission security methods can use
ports for handshake lines or data bytes with command fields.
Multi-Master System
A multi-master system may also be configured by
the user. Transfer of master control could be implemented using a handshake method through the
I/O ports or by an exchange of code messages
through the serial peripheral interface system.
The multi-master system is principally handled by
the MSTR bit in the SPICR register and the MODF
bit in the SPICSR register.
Figure 48. Single Master / Multiple Slave Configuration
SS
SCK
Slave
Device
SS
SCK
Slave
Device
SS
SCK
Slave
Device
SS
SCK
Slave
Device
MOSI MISO
MOSI MISO
MOSI MISO
MOSI MISO
SCK
Master
Device
5V
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SS
Ports
MOSI MISO
ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.6 Low Power Modes
Mode
WAIT
HALT
Description
No effect on SPI.
SPI interrupt events cause the Device to exit
from WAIT mode.
SPI registers are frozen.
In HALT mode, the SPI is inactive. SPI operation resumes when the Device is woken up
by an interrupt with “exit from HALT mode”
capability. The data received is subsequently
read from the SPIDR register when the software is running (interrupt vector fetching). If
several data are received before the wakeup event, then an overrun error is generated.
This error can be detected after the fetch of
the interrupt routine that woke up the Device.
11.4.6.1 Using the SPI to wake-up the Device
from Halt mode
In slave configuration, the SPI is able to wake-up
the Device from HALT mode through a SPIF interrupt. The data received is subsequently read from
the SPIDR register when the software is running
(interrupt vector fetch). If multiple data transfers
have been performed before software clears the
SPIF bit, then the OVR bit is set by hardware.
Note: When waking up from Halt mode, if the SPI
remains in Slave mode, it is recommended to perform an extra communications cycle to bring the
SPI from Halt mode state to normal state. If the
SPI exits from Slave mode, it returns to normal
state immediately.
Caution: The SPI can wake-up the Device from
Halt mode only if the Slave Select signal (external
SS pin or the SSI bit in the SPICSR register) is low
when the Device enters Halt mode. So if Slave selection is configured as external (see Section
11.4.3.2), make sure the master drives a low level
on the SS pin when the slave enters Halt mode.
11.4.7 Interrupts
Interrupt Event
Event
Flag
SPI End of TransSPIF
fer Event
Master Mode
MODF
Fault Event
Overrun Error
OVR
Enable
Control
Bit
SPIE
Exit
from
Wait
Exit
from
Halt
Yes
Yes
Yes
No
Yes
No
Note: The SPI interrupt events are connected to
the same interrupt vector (see Interrupts chapter).
They generate an interrupt if the corresponding
Enable Control Bit is set and the interrupt mask in
the CC register is reset (RIM instruction).
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ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.8 Register Description
CONTROL REGISTER (SPICR)
Read/Write
Reset Value: 0000 xxxx (0xh)
7
SPIE
0
SPE
SPR2
MSTR
CPOL
CPHA
SPR1
SPR0
Bit 7 = SPIE Serial Peripheral Interrupt Enable.
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SPI interrupt is generated whenever an End
of Transfer event, Master Mode Fault or Overrun error occurs (SPIF=1, MODF=1 or OVR=1
in the SPICSR register)
Bit 6 = SPE Serial Peripheral Output Enable.
This bit is set and cleared by software. It is also
cleared by hardware when, in master mode, SS=0
(see Section 11.4.5.1 Master Mode Fault
(MODF)). The SPE bit is cleared by reset, so the
SPI peripheral is not initially connected to the external pins.
0: I/O pins free for general purpose I/O
1: SPI I/O pin alternate functions enabled
Bit 5 = SPR2 Divider Enable.
This bit is set and cleared by software and is
cleared by reset. It is used with the SPR[1:0] bits to
set the baud rate. Refer to Table 16 SPI Master
mode SCK Frequency.
0: Divider by 2 enabled
1: Divider by 2 disabled
Note: This bit has no effect in slave mode.
Bit 4 = MSTR Master Mode.
This bit is set and cleared by software. It is also
cleared by hardware when, in master mode, SS=0
(see Section 11.4.5.1 Master Mode Fault
(MODF)).
0: Slave mode
1: Master mode. The function of the SCK pin
changes from an input to an output and the functions of the MISO and MOSI pins are reversed.
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Bit 3 = CPOL Clock Polarity.
This bit is set and cleared by software. This bit determines the idle state of the serial Clock. The
CPOL bit affects both the master and slave
modes.
0: SCK pin has a low level idle state
1: SCK pin has a high level idle state
Note: If CPOL is changed at the communication
byte boundaries, the SPI must be disabled by resetting the SPE bit.
Bit 2 = CPHA Clock Phase.
This bit is set and cleared by software.
0: The first clock transition is the first data capture
edge.
1: The second clock transition is the first capture
edge.
Note: The slave must have the same CPOL and
CPHA settings as the master.
Bits 1:0 = SPR[1:0] Serial Clock Frequency.
These bits are set and cleared by software. Used
with the SPR2 bit, they select the baud rate of the
SPI serial clock SCK output by the SPI in master
mode.
Note: These 2 bits have no effect in slave mode.
Table 16. SPI Master mode SCK Frequency
Serial Clock
SPR2
SPR1
SPR0
fCPU/4
1
0
0
fCPU/8
0
0
0
fCPU/16
0
0
1
fCPU/32
1
1
0
fCPU/64
0
1
0
fCPU/128
0
1
1
ST7LITE2
SERIAL PERIPHERAL INTERFACE (Cont’d)
CONTROL/STATUS REGISTER (SPICSR)
Read/Write (some bits Read Only)
Reset Value: 0000 0000 (00h)
7
SPIF
0
WCOL
OVR
MODF
-
SOD
SSM
SSI
Bit 7 = SPIF Serial Peripheral Data Transfer Flag
(Read only).
This bit is set by hardware when a transfer has
been completed. An interrupt is generated if
SPIE=1 in the SPICR register. It is cleared by a
software sequence (an access to the SPICSR
register followed by a write or a read to the
SPIDR register).
0: Data transfer is in progress or the flag has been
cleared.
1: Data transfer between the Device and an external device has been completed.
Note: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR register is read.
Bit 6 = WCOL Write Collision status (Read only).
This bit is set by hardware when a write to the
SPIDR register is done during a transmit sequence. It is cleared by a software sequence (see
Figure 47).
0: No write collision occurred
1: A write collision has been detected
Bit 5 = OVR SPI Overrun error (Read only).
This bit is set by hardware when the byte currently
being received in the shift register is ready to be
transferred into the SPIDR register while SPIF = 1
(See Section 11.4.5.2). An interrupt is generated if
SPIE = 1 in the SPICR register. The OVR bit is
cleared by software reading the SPICSR register.
0: No overrun error
1: Overrun error detected
Bit 4 = MODF Mode Fault flag (Read only).
This bit is set by hardware when the SS pin is
pulled low in master mode (see Section 11.4.5.1
Master Mode Fault (MODF)). An SPI interrupt can
be generated if SPIE=1 in the SPICR register. This
bit is cleared by a software sequence (An access
to the SPICSR register while MODF=1 followed by
a write to the SPICR register).
0: No master mode fault detected
1: A fault in master mode has been detected
Bit 3 = Reserved, must be kept cleared.
Bit 2 = SOD SPI Output Disable.
This bit is set and cleared by software. When set, it
disables the alternate function of the SPI output
(MOSI in master mode / MISO in slave mode)
0: SPI output enabled (if SPE=1)
1: SPI output disabled
Bit 1 = SSM SS Management.
This bit is set and cleared by software. When set, it
disables the alternate function of the SPI SS pin
and uses the SSI bit value instead. See Section
11.4.3.2 Slave Select Management.
0: Hardware management (SS managed by external pin)
1: Software management (internal SS signal controlled by SSI bit. External SS pin free for general-purpose I/O)
Bit 0 = SSI SS Internal Mode.
This bit is set and cleared by software. It acts as a
‘chip select’ by controlling the level of the SS slave
select signal when the SSM bit is set.
0 : Slave selected
1 : Slave deselected
DATA I/O REGISTER (SPIDR)
Read/Write
Reset Value: Undefined
7
D7
0
D6
D5
D4
D3
D2
D1
D0
The SPIDR register is used to transmit and receive
data on the serial bus. In a master device, a write
to this register will initiate transmission/reception
of another byte.
Notes: During the last clock cycle the SPIF bit is
set, a copy of the received data byte in the shift
register is moved to a buffer. When the user reads
the serial peripheral data I/O register, the buffer is
actually being read.
While the SPIF bit is set, all writes to the SPIDR
register are inhibited until the SPICSR register is
read.
Warning: A write to the SPIDR register places
data directly into the shift register for transmission.
A read to the SPIDR register returns the value located in the buffer and not the content of the shift
register (see Figure 42).
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ST7LITE2
Table 17. SPI Register Map and Reset Values
Address
Register
Label
7
6
5
4
3
2
1
0
0031h
SPIDR
Reset Value
MSB
x
x
x
x
x
x
x
LSB
x
0032h
SPICR
Reset Value
SPIE
0
SPE
0
SPR2
0
MSTR
0
CPOL
x
CPHA
x
SPR1
x
SPR0
x
0033h
SPICSR
Reset Value
SPIF
0
WCOL
0
OVR
0
MODF
0
0
SOD
0
SSM
0
SSI
0
(Hex.)
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ST7LITE2
11.5 10-BIT A/D CONVERTER (ADC)
11.5.1 Introduction
The on-chip Analog to Digital Converter (ADC) peripheral is a 10-bit, successive approximation converter with internal sample and hold circuitry. This
peripheral has up to 7 multiplexed analog input
channels (refer to device pin out description) that
allow the peripheral to convert the analog voltage
levels from up to 7 different sources.
The result of the conversion is stored in a 10-bit
Data Register. The A/D converter is controlled
through a Control/Status Register.
Data register (DR) which contains the results
Conversion complete status flag
■ On/off bit (to reduce consumption)
The block diagram is shown in Figure 49.
■
■
11.5.3 Functional Description
11.5.3.1 Analog Power Supply
VDDA and VSSA are the high and low level reference voltage pins. In some devices (refer to device
pin out description) they are internally connected
to the VDD and VSS pins.
Conversion accuracy may therefore be impacted
by voltage drops and noise in the event of heavily
loaded or badly decoupled power supply lines.
11.5.2 Main Features
■ 10-bit conversion
■ Up to 7 channels with multiplexed input
■ Linear successive approximation
Figure 49. ADC Block Diagram
fCPU
DIV 4
DIV 2
1
fADC
0
0
1
EOC SPEED ADON
SLOW
bit
0
0
CH2
CH1
ADCCSR
CH0
3
AIN0
HOLD CONTROL
AIN1
ANALOG
MUX
x 1 or
x8
RADC
ANALOG TO DIGITAL
CONVERTER
CADC
AINx
AMPSEL
bit
ADCDRH
D9
D8
ADCDRL
D7
D6
0
D5
0
D4
0
D3
D2
AMP
AMP
SLOW
CAL
SEL
D1
D0
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ST7LITE2
10-BIT A/D CONVERTER (ADC) (Cont’d)
11.5.3.2 Input Voltage Amplifier
The input voltage can be amplified by a factor of 8
by enabling the AMPSEL bit in the ADCDRL register.
When the amplifier is enabled, the input range is
0V to VDD/8.
For example, if VDD = 5V, then the ADC can convert voltages in the range 0V to 430mV with an
ideal resolution of 0.6mV (equivalent to 13-bit resolution with reference to a VSS to VDD range).
For more details, refer to the Electrical characteristics section.
Note: The amplifier is switched on by the ADON
bit in the ADCCSR register, so no additional startup time is required when the amplifier is selected
by the AMPSEL bit.
11.5.3.3 Digital A/D Conversion Result
The conversion is monotonic, meaning that the result never decreases if the analog input does not
and never increases if the analog input does not.
If the input voltage (VAIN) is greater than VDDA
(high-level voltage reference) then the conversion
result is FFh in the ADCDRH register and 03h in
the ADCDRL register (without overflow indication).
If the input voltage (VAIN) is lower than VSSA (lowlevel voltage reference) then the conversion result
in the ADCDRH and ADCDRL registers is 00 00h.
The A/D converter is linear and the digital result of
the conversion is stored in the ADCDRH and ADCDRL registers. The accuracy of the conversion is
described in the Electrical Characteristics Section.
RAIN is the maximum recommended impedance
for an analog input signal. If the impedance is too
high, this will result in a loss of accuracy due to
leakage and sampling not being completed in the
alloted time.
11.5.3.4 A/D Conversion
The analog input ports must be configured as input, no pull-up, no interrupt. Refer to the «I/O
ports» chapter. Using these pins as analog inputs
does not affect the ability of the port to be read as
a logic input.
In the ADCCSR register:
– Select the CS[2:0] bits to assign the analog
channel to convert.
ADC Conversion mode
In the ADCCSR register:
Set the ADON bit to enable the A/D converter and
to start the conversion. From this time on, the
ADC performs a continuous conversion of the
selected channel.
When a conversion is complete:
– The EOC bit is set by hardware.
– The result is in the ADCDR registers.
A read to the ADCDRH resets the EOC bit.
To read the 10 bits, perform the following steps:
1. Poll EOC bit
2. Read ADCDRL
3. Read ADCDRH. This clears EOC automatically.
To read only 8 bits, perform the following steps:
1. Poll EOC bit
2. Read ADCDRH. This clears EOC automatically.
11.5.4 Low Power Modes
Note: The A/D converter may be disabled by resetting the ADON bit. This feature allows reduced
power consumption when no conversion is needed and between single shot conversions.
Mode
WAIT
HALT
Description
No effect on A/D Converter
A/D Converter disabled.
After wakeup from Halt mode, the A/D
Converter requires a stabilization time
tSTAB (see Electrical Characteristics)
before accurate conversions can be
performed.
11.5.5 Interrupts
None.
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ST7LITE2
10-BIT A/D CONVERTER (ADC) (Cont’d)
11.5.6 Register Description
DATA REGISTER HIGH (ADCDRH)
Read Only
Reset Value: xxxx xxxx (xxh)
CONTROL/STATUS REGISTER (ADCCSR)
Read/Write (Except bit 7 read only)
Reset Value: 0000 0000 (00h)
7
EOC SPEED ADON
0
CH3
CH2
CH1
0
7
CH0
D9
Bit 7 = EOC End of Conversion
This bit is set by hardware. It is cleared by software reading the ADCDRH register.
0: Conversion is not complete
1: Conversion complete
Bit 6 = SPEED ADC clock selection
This bit is set and cleared by software. It is used
together with the SLOW bit to configure the ADC
clock speed. Refer to the table in the SLOW bit description.
Bit 5 = ADON A/D Converter on
This bit is set and cleared by software.
0: A/D converter and amplifier are switched off
1: A/D converter and amplifier are switched on
Bits 4:3 = Reserved. Must be kept cleared.
Bits 2:0 = CH[2:0] Channel Selection
These bits are set and cleared by software. They
select the analog input to convert.
Channel Pin*
CH2
CH1
CH0
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
*The number of channels is device dependent. Refer to
the device pinout description.
0
D8
D7
D6
D5
D4
D3
D2
Bits 7:0 = D[9:2] MSB of Analog Converted Value
AMP CONTROL/DATA REGISTER LOW (ADCDRL)
Read/Write
Reset Value: 0000 00xx (0xh)
7
0
0
0
0
AMP
CAL
SLOW
AMPSEL
D1
D0
Bits 7:5 = Reserved. Forced by hardware to 0.
Bit 4 = AMPCAL Amplifier Calibration Bit
This bit is set and cleared by software. User is suggested to use this bit to calibrate the ADC when
amplifier is ON. Setting this bit internally connects
amplifier input to 0v. Hence, corresponding ADC
output can be used in software to eliminate amplifier-offset error.
0: Calibration off
1: Calibration on (The input voltage of the amp is
set to 0V)
Note: It is advised to use this bit to calibrate the
ADC when the amplifier is ON. Setting this bit internally connects the amplifier input to 0v. Hence,
the corresponding ADC output can be used in software to eliminate an amplifier-offset error.
Bit 3 = SLOW Slow mode
This bit is set and cleared by software. It is used
together with the SPEED bit to configure the ADC
clock speed as shown on the table below.
fADC
fCPU/2
fCPU
fCPU/4
SLOW SPEED
0
0
1
0
1
x
This bit is set and cleared by software.
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ST7LITE2
Bit 2 = AMPSEL Amplifier Selection Bit
0: Amplifier is not selected
1: Amplifier is selected
Bits 1:0 = D[1:0] LSB of Analog Converted Value
Note: When AMPSEL=1 it is mandatory that fADC
be less than or equal to 2 MHz.
Table 18. ADC Register Map and Reset Values
Address
(Hex.)
7
6
5
4
3
2
1
0
0034h
ADCCSR
Reset Value
EOC
0
SPEED
0
ADON
0
0
0
0
0
CH2
0
CH1
0
CH0
0
0035h
ADCDRH
Reset Value
D9
x
D8
x
D7
x
D6
x
D5
x
D4
x
D3
x
D2
x
0036h
ADCDRL
Reset Value
0
0
0
0
0
0
AMPCAL
0
SLOW
0
AMPSEL
0
D1
x
D0
x
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Register
Label
ST7LITE2
12 INSTRUCTION SET
12.1 ST7 ADDRESSING MODES
The ST7 Core features 17 different addressing
modes which can be classified in seven main
groups:
Addressing Mode
Example
Inherent
nop
Immediate
ld A,#$55
Direct
ld A,$55
Indexed
ld A,($55,X)
Indirect
ld A,([$55],X)
Relative
jrne loop
Bit operation
bset
byte,#5
The ST7 Instruction set is designed to minimize
the number of bytes required per instruction: To do
so, most of the addressing modes may be subdivided in two submodes called long and short:
– Long addressing mode is more powerful because it can use the full 64 Kbyte address space,
however it uses more bytes and more CPU cycles.
– Short addressing mode is less powerful because
it can generally only access page zero (0000h 00FFh range), but the instruction size is more
compact, and faster. All memory to memory instructions use short addressing modes only
(CLR, CPL, NEG, BSET, BRES, BTJT, BTJF,
INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP)
The ST7 Assembler optimizes the use of long and
short addressing modes.
Table 19. ST7 Addressing Mode Overview
Mode
Syntax
Pointer
Address
(Hex.)
Destination/
Source
Pointer
Size
(Hex.)
Length
(Bytes)
Inherent
nop
+0
Immediate
ld A,#$55
+1
Short
Direct
ld A,$10
00..FF
+1
Long
Direct
ld A,$1000
0000..FFFF
+2
No Offset
Direct
Indexed
ld A,(X)
00..FF
+ 0 (with X register)
+ 1 (with Y register)
Short
Direct
Indexed
ld A,($10,X)
00..1FE
+1
Long
Direct
Indexed
Short
Indirect
ld A,($1000,X)
0000..FFFF
ld A,[$10]
00..FF
+2
00..FF
byte
+2
Long
Indirect
ld A,[$10.w]
0000..FFFF
00..FF
word
+2
Short
Indirect
Indexed
ld A,([$10],X)
00..1FE
00..FF
byte
+2
Long
Indirect
Indexed
ld A,([$10.w],X)
0000..FFFF
00..FF
word
+2
byte
+2
1)
+1
Relative
Direct
jrne loop
PC-128/PC+127
Relative
Indirect
jrne [$10]
PC-128/PC+1271) 00..FF
Bit
Direct
bset $10,#7
00..FF
Bit
Indirect
bset [$10],#7
00..FF
Bit
Direct
btjt $10,#7,skip
00..FF
Relative
+1
00..FF
byte
+2
+2
Bit
Indirect Relative btjt [$10],#7,skip 00..FF
00..FF
byte
+3
Note:
1. At the time the instruction is executed, the Program Counter (PC) points to the instruction following JRxx.
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ST7LITE2
ST7 ADDRESSING MODES (Cont’d)
12.1.1 Inherent
All Inherent instructions consist of a single byte.
The opcode fully specifies all the required information for the CPU to process the operation.
Inherent Instruction
Function
NOP
No operation
TRAP
S/W Interrupt
WFI
Wait For Interrupt (Low Power
Mode)
HALT
Halt Oscillator (Lowest Power
Mode)
RET
Subroutine Return
IRET
Interrupt Subroutine Return
SIM
Set Interrupt Mask
RIM
Reset Interrupt Mask
SCF
Set Carry Flag
RCF
Reset Carry Flag
RSP
Reset Stack Pointer
LD
Load
CLR
Clear
PUSH/POP
Push/Pop to/from the stack
INC/DEC
Increment/Decrement
TNZ
Test Negative or Zero
CPL, NEG
1 or 2 Complement
MUL
Byte Multiplication
SLL, SRL, SRA, RLC,
RRC
Shift and Rotate Operations
SWAP
Swap Nibbles
12.1.2 Immediate
Immediate instructions have 2 bytes, the first byte
contains the opcode, the second byte contains the
operand value.
Immediate Instruction
Function
LD
Load
CP
Compare
BCP
Bit Compare
AND, OR, XOR
Logical Operations
ADC, ADD, SUB, SBC
Arithmetic Operations
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12.1.3 Direct
In Direct instructions, the operands are referenced
by their memory address.
The direct addressing mode consists of two submodes:
Direct (short)
The address is a byte, thus requires only 1 byte after the opcode, but only allows 00 - FF addressing
space.
Direct (long)
The address is a word, thus allowing 64 Kbyte addressing space, but requires 2 bytes after the opcode.
12.1.4 Indexed (No Offset, Short, Long)
In this mode, the operand is referenced by its
memory address, which is defined by the unsigned
addition of an index register (X or Y) with an offset.
The indirect addressing mode consists of three
submodes:
Indexed (No Offset)
There is no offset (no extra byte after the opcode),
and allows 00 - FF addressing space.
Indexed (Short)
The offset is a byte, thus requires only 1 byte after
the opcode and allows 00 - 1FE addressing space.
Indexed (long)
The offset is a word, thus allowing 64 Kbyte addressing space and requires 2 bytes after the opcode.
12.1.5 Indirect (Short, Long)
The required data byte to do the operation is found
by its memory address, located in memory (pointer).
The pointer address follows the opcode. The indirect addressing mode consists of two submodes:
Indirect (short)
The pointer address is a byte, the pointer size is a
byte, thus allowing 00 - FF addressing space, and
requires 1 byte after the opcode.
Indirect (long)
The pointer address is a byte, the pointer size is a
word, thus allowing 64 Kbyte addressing space,
and requires 1 byte after the opcode.
ST7LITE2
ST7 ADDRESSING MODES (Cont’d)
12.1.6 Indirect Indexed (Short, Long)
This is a combination of indirect and short indexed
addressing modes. The operand is referenced by
its memory address, which is defined by the unsigned addition of an index register value (X or Y)
with a pointer value located in memory. The pointer address follows the opcode.
The indirect indexed addressing mode consists of
two submodes:
Indirect Indexed (Short)
The pointer address is a byte, the pointer size is a
byte, thus allowing 00 - 1FE addressing space,
and requires 1 byte after the opcode.
Indirect Indexed (Long)
The pointer address is a byte, the pointer size is a
word, thus allowing 64 Kbyte addressing space,
and requires 1 byte after the opcode.
12.1.7 Relative Mode (Direct, Indirect)
This addressing mode is used to modify the PC
register value by adding an 8-bit signed offset to it.
Available Relative Direct/
Indirect Instructions
Function
JRxx
Conditional Jump
CALLR
Call Relative
The relative addressing mode consists of two submodes:
Relative (Direct)
The offset follows the opcode.
Relative (Indirect)
The offset is defined in memory, of which the address follows the opcode.
Table 20. Instructions Supporting Direct,
Indexed, Indirect and Indirect Indexed
Addressing Modes
Long and Short
Instructions
Function
LD
Load
CP
Compare
AND, OR, XOR
Logical Operations
ADC, ADD, SUB, SBC
Arithmetic Addition/subtraction operations
BCP
Bit Compare
Short Instructions Only
Function
CLR
Clear
INC, DEC
Increment/Decrement
TNZ
Test Negative or Zero
CPL, NEG
1 or 2 Complement
BSET, BRES
Bit Operations
BTJT, BTJF
Bit Test and Jump Operations
SLL, SRL, SRA, RLC,
RRC
Shift and Rotate Operations
SWAP
Swap Nibbles
CALL, JP
Call or Jump subroutine
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ST7LITE2
12.2 INSTRUCTION GROUPS
The ST7 family devices use an Instruction Set
consisting of 63 instructions. The instructions may
be subdivided into 13 main groups as illustrated in
the following table:
Load and Transfer
LD
CLR
Stack operation
PUSH
POP
Increment/Decrement
INC
DEC
Compare and Tests
CP
TNZ
BCP
Logical operations
AND
OR
XOR
CPL
NEG
Bit Operation
BSET
BRES
Conditional Bit Test and Branch
BTJT
BTJF
Arithmetic operations
ADC
ADD
SUB
SBC
MUL
Shift and Rotates
SLL
SRL
SRA
RLC
RRC
SWAP
SLA
Unconditional Jump or Call
JRA
JRT
JRF
JP
CALL
CALLR
NOP
Conditional Branch
JRxx
Interruption management
TRAP
WFI
HALT
IRET
Condition Code Flag modification
SIM
RIM
SCF
RCF
Using a prebyte
The instructions are described with 1 to 4 bytes.
In order to extend the number of available opcodes for an 8-bit CPU (256 opcodes), three different prebyte opcodes are defined. These prebytes
modify the meaning of the instruction they precede.
The whole instruction becomes:
PC-2 End of previous instruction
PC-1 Prebyte
PC
Opcode
PC+1 Additional word (0 to 2) according to the
number of bytes required to compute the
effective address
These prebytes enable instruction in Y as well as
indirect addressing modes to be implemented.
They precede the opcode of the instruction in X or
the instruction using direct addressing mode. The
prebytes are:
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1
RSP
RET
PDY 90 Replace an X based instruction using
immediate, direct, indexed, or inherent
addressing mode by a Y one.
PIX 92 Replace an instruction using direct, direct bit or direct relative addressing
mode to an instruction using the corresponding indirect addressing mode.
It also changes an instruction using X
indexed addressing mode to an instruction using indirect X indexed addressing
mode.
PIY 91 Replace an instruction using X indirect
indexed addressing mode by a Y one.
12.2.1 Illegal Opcode Reset
In order to provide enhanced robustness to the device against unexpected behavior, a system of illegal opcode detection is implemented. If a code to
be executed does not correspond to any opcode
or prebyte value, a reset is generated. This, combined with the Watchdog, allows the detection and
recovery from an unexpected fault or interference.
Note: A valid prebyte associated with a valid opcode forming an unauthorized combination does
not generate a reset.
ST7LITE2
INSTRUCTION GROUPS (Cont’d)
Mnemo
Description
Function/Example
Dst
Src
H
I
N
Z
C
ADC
Add with Carry
A=A+M+C
A
M
H
N
Z
C
ADD
Addition
A=A+M
A
M
H
N
Z
C
AND
Logical And
A=A.M
A
M
N
Z
BCP
Bit compare A, Memory
tst (A . M)
A
M
N
Z
BRES
Bit Reset
bres Byte, #3
M
BSET
Bit Set
bset Byte, #3
M
BTJF
Jump if bit is false (0)
btjf Byte, #3, Jmp1
M
C
BTJT
Jump if bit is true (1)
btjt Byte, #3, Jmp1
M
C
CALL
Call subroutine
CALLR
Call subroutine relative
CLR
Clear
CP
Arithmetic Compare
tst(Reg - M)
reg
CPL
One Complement
A = FFH-A
DEC
Decrement
dec Y
reg, M
HALT
Halt
IRET
Interrupt routine return
Pop CC, A, X, PC
INC
Increment
inc X
JP
Absolute Jump
jp [TBL.w]
JRA
Jump relative always
JRT
Jump relative
JRF
Never jump
JRIH
Jump if ext. interrupt = 1
0
1
N
Z
C
reg, M
N
Z
1
reg, M
N
Z
N
Z
N
Z
M
0
H
reg, M
I
C
jrf *
JRIL
Jump if ext. interrupt = 0
JRH
Jump if H = 1
H=1?
JRNH
Jump if H = 0
H=0?
JRM
Jump if I = 1
I=1?
JRNM
Jump if I = 0
I=0?
JRMI
Jump if N = 1 (minus)
N=1?
JRPL
Jump if N = 0 (plus)
N=0?
JREQ
Jump if Z = 1 (equal)
Z=1?
JRNE
Jump if Z = 0 (not equal)
Z=0?
JRC
Jump if C = 1
C=1?
JRNC
Jump if C = 0
C=0?
JRULT
Jump if C = 1
Unsigned <
JRUGE
Jump if C = 0
Jmp if unsigned >=
JRUGT
Jump if (C + Z = 0)
Unsigned >
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ST7LITE2
INSTRUCTION GROUPS (Cont’d)
Mnemo
Description
Function/Example
Dst
Src
JRULE
Jump if (C + Z = 1)
Unsigned <=
LD
Load
dst <= src
reg, M
M, reg
MUL
Multiply
X,A = X * A
A, X, Y
X, Y, A
NEG
Negate (2's compl)
neg $10
reg, M
NOP
No Operation
OR
OR operation
A=A+M
A
M
POP
Pop from the Stack
pop reg
reg
M
pop CC
CC
M
M
reg, CC
H
I
N
Z
N
Z
0
H
C
0
I
N
Z
N
Z
N
Z
C
C
PUSH
Push onto the Stack
push Y
RCF
Reset carry flag
C=0
RET
Subroutine Return
RIM
Enable Interrupts
I=0
RLC
Rotate left true C
C <= Dst <= C
reg, M
N
Z
C
RRC
Rotate right true C
C => Dst => C
reg, M
N
Z
C
RSP
Reset Stack Pointer
S = Max allowed
SBC
Subtract with Carry
A=A-M-C
N
Z
C
SCF
Set carry flag
C=1
SIM
Disable Interrupts
I=1
SLA
Shift left Arithmetic
C <= Dst <= 0
reg, M
N
Z
C
SLL
Shift left Logic
C <= Dst <= 0
reg, M
N
Z
C
SRL
Shift right Logic
0 => Dst => C
reg, M
0
Z
C
SRA
Shift right Arithmetic
Dst7 => Dst => C
reg, M
N
Z
C
SUB
Subtraction
A=A-M
A
N
Z
C
SWAP
SWAP nibbles
Dst[7..4] <=> Dst[3..0] reg, M
N
Z
TNZ
Test for Neg & Zero
tnz lbl1
N
Z
TRAP
S/W trap
S/W interrupt
WFI
Wait for Interrupt
XOR
Exclusive OR
N
Z
90/133
1
0
0
A
M
1
1
M
1
0
A = A XOR M
A
M
ST7LITE2
13 ELECTRICAL CHARACTERISTICS
13.1 PARAMETER CONDITIONS
Unless otherwise specified, all voltages are referred to VSS.
13.1.1 Minimum and Maximum values
Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and
frequencies by tests in production on 100% of the
devices with an ambient temperature at TA=25°C
and TA=TAmax (given by the selected temperature
range).
Data based on characterization results, design
simulation and/or technology characteristics are
indicated in the table footnotes and are not tested
in production. Based on characterization, the minimum and maximum values refer to sample tests
and represent the mean value plus or minus three
times the standard deviation (mean±3Σ).
13.1.2 Typical values
Unless otherwise specified, typical data are based
on TA=25°C, VDD=5V (for the 4.5V≤VDD≤5.5V
voltage range) and VDD=3.3V (for the 3V≤VDD≤4V
voltage range). They are given only as design
guidelines and are not tested.
13.1.3 Typical curves
Unless otherwise specified, all typical curves are
given only as design guidelines and are not tested.
13.1.4 Loading capacitor
The loading conditions used for pin parameter
measurement are shown in Figure 50.
13.1.5 Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 51.
Figure 51. Pin input voltage
ST7 PIN
VIN
Figure 50. Pin loading conditions
ST7 PIN
CL
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ST7LITE2
13.2 ABSOLUTE MAXIMUM RATINGS
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device under these condi13.2.1 Voltage Characteristics
Symbol
VDD - VSS
VIN
VESD(HBM)
tions is not implied. Exposure to maximum rating
conditions for extended periods may affect device
reliability.
Ratings
Maximum value
Supply voltage
7.0
Input voltage on any pin 1) & 2)
VSS-0.3 to VDD+0.3
Electrostatic discharge voltage (Human Body Model)
see section 13.7.3 on
page 105
Unit
V
V
13.2.2 Current Characteristics
Symbol
IVDD
IVSS
Ratings
Maximum value
Total current into VDD power lines (source)
3)
100
Total current out of VSS ground lines (sink)
3)
100
Output current sunk by any standard I/O and control pin
IIO
IINJ(PIN) 2) & 4)
50
Output current source by any I/Os and control pin
- 25
Injected current on RESET pin
±5
Injected current on OSC1 and OSC2 pins
±5
Injected current on PB0 and PB1 pins 5)
+5
Injected current on any other pin
ΣIINJ(PIN) 2)
25
Output current sunk by any high sink I/O pin
6)
Total injected current (sum of all I/O and control pins) 6)
Unit
mA
±5
± 20
13.2.3 Thermal Characteristics
Symbol
TSTG
TJ
Ratings
Storage temperature range
Value
Unit
-65 to +150
°C
Maximum junction temperature (see Table 21, “THERMAL CHARACTERISTICS,” on
page 120)
Notes:
1. Directly connecting the I/O pins to VDD or VSS could damage the device if an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter). To guarantee safe operation, this connection has to be
done through a pull-up or pull-down resistor (typical: 10kΩ for I/Os). Unused I/O pins must be tied in the same way to VDD
or VSS according to their reset configuration.
2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be
respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN>VDD
while a negative injection is induced by VIN<VSS. For true open-drain pads, there is no positive injection current, and the
corresponding VIN maximum must always be respected
3. All power (VDD) and ground (VSS) lines must always be connected to the external supply.
4. Negative injection disturbs the analog performance of the device. In particular, it induces leakage currents throughout
the device including the analog inputs. To avoid undesirable effects on the analog functions, care must be taken:
- Analog input pins must have a negative injection less than 0.8 mA (assuming that the impedance of the analog voltage
is lower than the specified limits)
- Pure digital pins must have a negative injection less than 1.6mA. In addition, it is recommended to inject the current as
far as possible from the analog input pins.
5. No negative current injection allowed on PB0 and PB1 pins.
6. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the positive
and negative injected currents (instantaneous values). These results are based on characterisation with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
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ST7LITE2
13.3 OPERATING CONDITIONS
13.3.1 General operating conditions
TA = -40 to +85°C unless otherwise specified.
Symbol
Parameter
VDD
Supply voltage
fCPU
CPU clock frequency
Conditions
Min
Max
fCPU = 4 MHz. max.,
2.4
5.5
fCPU = 8 MHz. max.
3.3
5.5
3.3V≤ VDD≤5.5V
up to 8
2.4V≤VDD<3.3V
up to 4
Unit
V
MHz
Figure 52. fCPU Maximum operating frequency versus VDD supply voltage
FUNCTIONALITY
GUARANTEED
IN THIS AREA
(UNLESS OTHERWISE
STATED IN THE
TABLES OF
PARAMETRIC DATA)
fCPU [MHz]
8
FUNCTIONALITY
NOT GUARANTEED
IN THIS AREA
4
2
SUPPLY VOLTAGE [V]
0
2.0
2.4 2.7
3.3
3.5
4.0
4.5
5.0
5.5
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ST7LITE2
13.3.2 Operating conditions with Low Voltage Detector (LVD)
TA = -40 to 85°C, unless otherwise specified
Symbol
Parameter
Conditions
Min
1)
Typ
Max
Reset release threshold
(VDD rise)
High Threshold
Med. Threshold
Low Threshold
4.00
3.40 1)
2.65 1)
4.25
3.60
2.90
4.50
3.80
3.15
VIT-(LVD)
Reset generation threshold
(VDD fall)
High Threshold
Med. Threshold
Low Threshold
3.80
3.20
2.40
4.05
3.40
2.70
4.30 1)
3.65 1)
2.901)
VIT+(LVD)-VIT-(LVD)
VIT+(LVD)
Vhys
LVD voltage threshold hysteresis
VtPOR
VDD rise time rate 2)3)
tg(VDD)
Filtered glitch delay on VDD
IDD(LVD)
LVD/AVD current consumption
200
20
Not detected by the LVD
Unit
V
mV
20000
µs/V
150
ns
µA
220
Notes:
1. Not tested in production.
2. Not tested in production. The VDD rise time rate condition is needed to insure a correct device power-on and LVD reset.
When the VDD slope is outside these values, the LVD may not ensure a proper reset of the MCU.
3. Use of LVD with capacitive power supply: with this type of power supply, if power cuts occur in the application, it is
recommended to pull VDD down to 0V to ensure optimum restart conditions. Refer to circuit example in Figure 84 on
page 112 and note 4.
13.3.3 Auxiliary Voltage Detector (AVD) Thresholds
TA = -40 to 85°C, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
4.401)
3.901)
3.201)
4.70
4.10
3.40
5.00
4.30
3.60
4.30
3.70
2.90
4.60
3.90
3.20
4.901)
4.101)
3.401)
Unit
VIT+(AVD)
1=>0 AVDF flag toggle threshold
(VDD rise)
High Threshold
Med. Threshold
Low Threshold
VIT-(AVD)
0=>1 AVDF flag toggle threshold
(VDD fall)
High Threshold
Med. Threshold
Low Threshold
Vhys
AVD voltage threshold hysteresis
VIT+(AVD)-VIT-(AVD)
150
mV
∆VIT-
Voltage drop between AVD flag set
and LVD reset activation
VDD fall
0.45
V
V
Note:
1. Not tested in production.
13.3.4 Internal RC Oscillator and PLL
The ST7 internal clock can be supplied by an internal RC oscillator and PLL (selectable by option byte).
Symbol
Parameter
Conditions
Min
Typ
Max
VDD(RC)
Internal RC Oscillator operating voltage
2.4
5.5
VDD(x4PLL)
x4 PLL operating voltage
2.4
3.3
VDD(x8PLL)
x8 PLL operating voltage
3.3
5.5
tSTARTUP
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1
PLL Startup time
60
Unit
V
PLL
input
clock
(fPLL)
cycles
ST7LITE2
OPERATING CONDITIONS (Cont’d)
The RC oscillator and PLL characteristics are temperature-dependent and are grouped in four tables.
13.3.4.1 RC oscillator and PLL characteristics (tested for TA = -40 to +85°C) @ VDD = 4.5 to 5.5V
Symbol
Parameter
Conditions
fRC 1)
Internal RC oscillator fre- RCCR = FF (reset value), TA=25°C,VDD=5V
quency 1)
RCCR = RCCR03 ), TA=25°C,VDD=5V
ACCRC
Accuracy of Internal RC
oscillator with
RCCR=RCCR03)
Min
Typ
Max
760
Unit
kHz
1000
TA=25°C, VDD=4.5 to 5.5V
-1
+1
%
TA=-40 to +85°C, VDD=5V
-5
+2
%
-22)
+22)
%
TA=0 to +85°C, VDD=4.5 to 5.5V
IDD(RC)
RC oscillator current conTA=25°C, VDD=5V
sumption
tsu(RC)
RC oscillator setup time
µA
9702)
103)
TA=25°C, VDD=5V
2)
µs
fPLL
x8 PLL input clock
tLOCK
PLL Lock time6)
2
ms
tSTAB
PLL Stabilization time6)
4
ms
%
ACCPLL
x8 PLL Accuracy
tw(JIT)
PLL jitter period
JITPLL
PLL jitter (∆fCPU/fCPU)
IDD(PLL)
1
MHz
fRC = 1MHz@TA=25°C, VDD=4.5 to 5.5V
0.15)
fRC = 1MHz@TA=-40 to +85°C, VDD=5V
0.15)
%
fRC = 1MHz
1254)
µs
14)
%
6002)
µA
PLL current consumption TA=25°C
Notes:
1. If the RC oscillator clock is selected, to improve clock stability and frequency accuracy, it is recommended to place a
decoupling capacitor, typically 100nF, between the VDD and VSS pins as close as possible to the ST7 device.
2. Data based on characterization results, not tested in production
3. See “INTERNAL RC OSCILLATOR ADJUSTMENT” on page 23
4. Guaranteed by design.
5. Averaged over a 4ms period. After the LOCKED bit is set, a period of tSTAB is required to reach ACCPLL accuracy.
6. After the LOCKED bit is set ACCPLL is max. 10% until tSTAB has elapsed. See Figure 12 on page 24.
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ST7LITE2
OPERATING CONDITIONS (Cont’d)
13.3.4.2 RC oscillator and PLL characteristics (tested for TA = -40 to +85°C) @ VDD = 2.7 to 3.3V
Symbol
Parameter
Conditions
fRC 1)
Internal RC oscillator fre- RCCR = FF (reset value), TA=25°C, VDD= 3.0V
quency 1)
RCCR=RCCR13) ,TA=25°C,VDD= 3V
ACCRC
Accuracy of Internal RC TA=25°C,VDD=3V
oscillator when calibrated TA=25°C,VDD=2.7 t 3.3V
with RCCR=RCCR12)3)
TA=-40 to +85°C,VDD=3V
IDD(RC)
RC oscillator current conTA=25°C,VDD=3V
sumption
tsu(RC)
RC oscillator setup time
fPLL
x4 PLL input clock
tLOCK
PLL Lock time6)
tSTAB
PLL Stabilization
Min
Typ
Unit
kHz
700
-2
+2
%
-25
+25
%
15
%
-15
µA
7002)
103)
TA=25°C,VDD=3V
time6)
Max
560
µs
0.72)
MHz
2
ms
4
ms
fRC = 1MHz@TA=25°C,VDD=2.7 to 3.3V
0.15)
%
fRC = 1MHz@TA=40 to +85°C,VDD= 3V
0.15)
%
fRC = 1MHz
1254)
µs
ACCPLL
x4 PLL Accuracy
tw(JIT)
PLL jitter period
JITPLL
PLL jitter (∆fCPU/fCPU)
IDD(PLL)
PLL current consumption TA=25°C
14)
%
1902)
µA
Notes:
1. If the RC oscillator clock is selected, to improve clock stability and frequency accuracy, it is recommended to place a
decoupling capacitor, typically 100nF, between the VDD and VSS pins as close as possible to the ST7 device.
2. Data based on characterization results, not tested in production
3. See “INTERNAL RC OSCILLATOR ADJUSTMENT” on page 23.
4. Guaranteed by design.
5. Averaged over a 4ms period. After the LOCKED bit is set, a period of tSTAB is required to reach ACCPLL accuracy
6. After the LOCKED bit is set ACCPLL is max. 10% until tSTAB has elapsed. See Figure 12 on page 24.
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ST7LITE2
OPERATING CONDITIONS (Cont’d)
Figure 53. RC Osc Freq vs VDD @ TA=25°C
(Calibrated with RCCR1: 3V @ 25°C)
Figure 54. RC Osc Freq vs VDD
(Calibrated with RCCR0: 5V@ 25°C)
0.90
Output Freq. (MHz)
Output Freq (MHz)
1.00
0.80
0.70
0.60
0.50
2.4
2.6
2.8
3
3.2
3.4
3.6
3.8
1.10
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
4
-45°
0°
25°
90°
105°
130°
2.5
3
3.5
4
4.5
5
5.5
6
Vdd (V)
VDD (V)
Figure 55. Typical RC oscillator Accuracy vs
temperature @ VDD=5V
(Calibrated with RCCR0: 5V @ 25°C)
Figure 56. RC Osc Freq vs VDD and RCCR Value
1.80
Output Freq. (MHz)
1.60
2
(*)
RC Accuracy
1
0
(*)
-1
-2
-3
-4
-5
( )
*
-45
0
25
Temperature (°C)
(*) tested in production
85
125
1.40
1.20
1.00
rccr=00h
0.80
rccr=64h
0.60
rccr=80h
0.40
rccr=C0h
0.20
rccr=FFh
0.00
2.4
2.7
3
3.3 3.75
4
4.5
5
5.5
6
Vdd (V)
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ST7LITE2
OPERATING CONDITIONS (Cont’d)
Figure 57. PLL ∆fCPU/fCPU versus time
∆fCPU/fCPU
Max
t
0
Min
tw(JIT)
Figure 58. PLLx4 Output vs CLKIN frequency
tw(JIT)
Figure 59. PLLx8 Output vs CLKIN frequency
7.00
5.00
3.3
4.00
3
2.7
3.00
2.00
Output Frequency (MHz)
Output Frequency (MHz)
11.00
6.00
9.00
7.00
5.5
5
5.00
4.5
4
3.00
1.00
1.00
1
1.5
2
2.5
0.85
3
1
1.5
2
2.5
External Input Clock Frequency (MHz)
External Input Clock Frequency (MHz)
Note: fOSC = fCLKIN/2*PLL4
0.9
Note: fOSC = fCLKIN/2*PLL8
13.3.4.3 32MHz PLL
TA = -40 to 85°C, unless otherwise specified
Symbol
Parameter
VDD
Voltage 1)
fPLL32
Frequency 1)
fINPUT
Input Frequency
Note 1: 32 MHz is guaranteed within this voltage range.
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1
Min
Typ
Max
4.5
5
5.5
32
7
8
Unit
V
MHz
9
MHz
ST7LITE2
13.4 SUPPLY CURRENT CHARACTERISTICS
The following current consumption specified for
vice consumption, the two current values must be
the ST7 functional operating modes over temperaadded (except for HALT mode for which the clock
ture range does not take into account the clock
is stopped).
source current consumption. To get the total de13.4.1 Supply Current
TA = -40 to +85°C unless otherwise specified, VDD=5.5V
Symbol
Parameter
Conditions
Typ
External Clock, fCPU=1MHz 1)
Supply current in RUN mode
Max
Internal RC, fCPU=1MHz
2.2
fCPU=8MHz 1)
7.5
External Clock, fCPU=1MHz 2)
0.8
Internal RC, fCPU=1MHz
fCPU=8MHz 2)
1.8
3.7
6
Supply current in SLOW mode
fCPU=250kHz 3)
1.6
2.5
Supply current in SLOW WAIT mode
fCPU=250kHz 4)
-40°C≤TA≤+85°C
1.6
1
2.5
10
TA= +125°C
15
50
TA= +25°C
20
30
Supply current in WAIT mode
IDD
Supply current in HALT mode 5)
Supply current in AWUFH mode 6)7)
Unit
1
12
mA
µA
Notes:
1. CPU running with memory access, all I/O pins in input mode with a static value at VDD or VSS (no load), all peripherals
in reset state; clock input (CLKIN) driven by external square wave, LVD disabled.
2. All I/O pins in input mode with a static value at VDD or VSS (no load), all peripherals in reset state; clock input (CLKIN)
driven by external square wave, LVD disabled.
3. SLOW mode selected with fCPU based on fOSC divided by 32. All I/O pins in input mode with a static value at VDD or
VSS (no load), all peripherals in reset state; clock input (CLKIN) driven by external square wave, LVD disabled.
4. SLOW-WAIT mode selected with fCPU based on fOSC divided by 32. All I/O pins in input mode with a static value at
VDD or VSS (no load), all peripherals in reset state; clock input (CLKIN) driven by external square wave, LVD disabled.
5. All I/O pins in output mode with a static value at VSS (no load), LVD disabled. Data based on characterization results,
tested in production at VDD max and fCPU max.
6. All I/O pins in input mode with a static value at VDD or VSS (no load). Data tested in production at VDD max. and fCPU
max.
7. This consumption refers to the Halt period only and not the associated run period which is software dependent.
Figure 60. Typical IDD in RUN vs. fCPU
Figure 61. Typical IDD in SLOW vs. fCPU
1.6
9.0
8.0
8Mhz
4Mhz
1Mhz
6.0
1.4
1.2
Idd (mA)
Idd (mA)
7.0
5.0
4.0
3.0
2.0
250Khz
125Khz
62.5Hz
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.0
2.0
2.5
3.0
3.5
4.0
Vdd (V)
4.5
5.0
5.5
6.0
2
2.5
3
3.5
4
4.5
5
5.5
6
Vdd (V)
99/133
1
ST7LITE2
SUPPLY CURRENT CHARACTERISITCS (Cont’d)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Figure 64. Typical IDD in AWUFH mode
at TA=25°C
8Mhz
0.035
4Mhz
fawu_rc ~125 KHz
0.030
1MHz
0.025
Idd(mA)
Idd (mA)
Figure 62. Typical IDD in WAIT vs. fCPU
0.020
0.015
0.010
0.005
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.000
6.0
2.0
2.5
3.0
3.5
Vdd (V)
Figure 63. Typical IDD in SLOW-WAIT vs. fCPU
1.4
4.5
5.0
5.5
6.0
Figure 65. Typical IDD vs. Temperature
at VDD = 5V and fCPU = 8MHz
250KHz
1.2
8.0
125KHz
TB
D
1.0
Idd (mA)
4.0
Vdd(V)
62.5Khz
0.8
0.6
0.4
25°
-45°
90°
130°
7.0
0.2
6.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Vdd (V)
Idd (mA)
0.0
5.0
4.0
3.0
2.0
2.4
2.8
3.2
3.6
4
4.4
Vdd (V)
4.8
5.2
5.6
13.4.2 On-chip peripherals
Symbol
Parameter
IDD(AT)
12-bit Auto-Reload Timer supply current 1)
IDD(SPI)
SPI supply current 2)
IDD(ADC)
ADC supply current when converting 3)
Conditions
Typ
fCPU=4MHz
VDD=3.0V
300
fCPU=8MHz
VDD=5.0V
1000
fCPU=4MHz
VDD=3.0V
50
fCPU=8MHz
VDD=5.0V
300
fADC=4MHz
VDD=3.0V
250
VDD=5.0V
1100
Unit
µA
Notes:
1. Data based on a differential IDD measurement between reset configuration (timer stopped) and a timer running in PWM
mode at fcpu=8MHz.
2. Data based on a differential IDD measurement between reset configuration and a permanent SPI master communication (data sent equal to 55h).
3. Data based on a differential IDD measurement between reset configuration and continuous A/D conversions with amplifier off.
100/133
1
ST7LITE2
13.5 CLOCK AND TIMING CHARACTERISTICS
Subject to general operating conditions for VDD, fOSC, and TA.
13.5.1 General Timings
Symbol
tc(INST)
tv(IT)
Parameter 1)
Instruction cycle time
Interrupt reaction time
tv(IT) = ∆tc(INST) + 10
Conditions
fCPU=8MHz
3)
fCPU=8MHz
Min
Typ 2)
Max
Unit
2
3
12
tCPU
250
375
1500
ns
10
22
tCPU
1.25
2.75
µs
Notes:
1. Guaranteed by Design. Not tested in production.
2. Data based on typical application software.
3. Time measured between interrupt event and interrupt vector fetch. Dtc(INST) is the number of tCPU cycles needed to finish the current instruction execution.
13.5.2 Auto Wakeup from Halt Oscillator (AWU)
Symbol
Parameter 1)
fAWU
AWU Oscillator Frequency
tRCSRT
AWU Oscillator startup time
Conditions
Min
Typ
Max
Unit
50
125
250
kHz
50
µs
Note:
1. Guaranteed by Design.
101/133
1
ST7LITE2
CLOCK AND TIMING CHARACTERISTICS (Cont’d)
13.5.3 Crystal and Ceramic Resonator Oscillators
The ST7 internal clock can be supplied with eight
different Crystal/Ceramic resonator oscillators. All
the information given in this paragraph are based
on characterization results with specified typical
external components. In the application, the resonator and the load capacitors have to be placed as
Symbol
Parameter
Conditions
fCrOSC
Crystal Oscillator Frequency 1)
CL1
Recommended load capacitance versus equivalent serial resistance of the
crystal or ceramic resonator (RS)
CL2
Supplier
fCrOSC
[MHz]
2
Murata
4
8
16
close as possible to the oscillator pins in order to
minimize output distortion and start-up stabilization time. Refer to the crystal/ceramic resonator
manufacturer for more details (frequency, package, accuracy...).
Min
Reference
CL1 4)
[pF]
CL2 4)
[pF]
SMD
CSTCC2M00G56-R0
(47)
(47)
Type
Max
Unit
16
MHz
See table below
Typical Ceramic Resonators2)
3)
Typ
2
pF
Rd Supply Voltage Temperature
[Ω]
Range [V]
Range [°C]
0
SMD
CSTCR4M00G53-R0
(15)
(15)
0
LEAD
CSTLS4M00G53-B0
(15)
(15)
0
SMD
CSTCE8M00G52-R0
(10)
(10)
0
LEAD
CSTLS8M00G53-B0
(15)
(15)
0
2.4V to 5.5V
-40 to 85
SMD
CSTCE16M0V51-R0
(5)
(5)
0
LEAD
CSTLS16M0X53-B0
(15)
(15)
0
3.3V to 5.5V
4.5V to 5.5V
LEAD
CSALS16M0X55-B0
7
7
1.5k
3.8V to 5.5V
Notes:
1. When PLL is used, please refer to the PLL characteristics chapter and to “SUPPLY, RESET AND CLOCK MANAGEMENT” on page 23 chapter (fCrOSC min. is 8 Mhz with PLL).
2. Resonator characteristics given by the ceramic resonator manufacturer. For more information on these resonators,
please consult www.murata.com
3. SMD = -R0: Plastic tape package (∅ =180mm) .
LEAD = -B0: Bulk
4. () means load capacitor built in resonator
Figure 66. Typical application with a crystal or ceramic resonator
WHEN RESONATOR WITH
INTEGRATED CAPACITORS
i2
fOSC
CL1
OSC1
RESONATOR
CL2
OSC2
Rd
102/133
ST7LITE2
ST7LITE2
13.6 MEMORY CHARACTERISTICS
TA = -40°C to 85°C, unless otherwise specified
13.6.1 RAM and Hardware Registers
Symbol
VRM
Parameter
Data retention mode 1)
Conditions
HALT mode (or RESET)
Min
Typ
Max
1.6
Unit
V
13.6.2 FLASH Program Memory
Symbol
VDD
tprog
Parameter
Min
Programming time for 1~32 bytes 2)
TA=−40 to +85°C
Programming time for 1.5 kBytes
TA=+25°C
4)
tRET
Data retention
Write erase cycles
Supply current
Typ
2.4
Operating voltage for Flash write/erase
NRW
IDD
Conditions
TA=+55°C
3)
Max
Unit
5.5
V
5
10
ms
0.24
0.48
s
20
years
TA=+25°C
10K7)
Read / Write / Erase
modes
fCPU = 8MHz, VDD = 5.5V
No Read/No Write Mode
Power down mode / HALT
cycles
0
2.66)
mA
100
0.1
µA
µA
13.6.3 EEPROM Data Memory
Symbol
Parameter
Conditions
VDD
Operating voltage for EEPROM
write/erase
tprog
Programming time for 1~32 bytes
TA=−40 to +85°C
Data retention 4)
TA=+55°C 3)
Write erase cycles
TA=+25°C
tret
NRW
Min
Typ
2.4
5
Max
Unit
5.5
V
10
ms
20
years
300K7)
cycles
Notes:
1. Minimum VDD supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware registers (only in HALT mode). Guaranteed by construction, not tested in production.
2. Up to 32 bytes can be programmed at a time.
3. The data retention time increases when the TA decreases.
4. Data based on reliability test results and monitored in production.
5. Data based on characterization results, not tested in production.
6. Guaranteed by Design. Not tested in production.
7. Design target value pending full product characterization.
103/133
ST7LITE2
13.7 EMC CHARACTERISTICS
Susceptibility tests are performed on a sample basis during product characterization.
13.7.1 Functional EMS (Electro Magnetic
Susceptibility)
Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events
until a failure occurs (indicated by the LEDs).
■ ESD: Electro-Static Discharge (positive and
negative) is applied on all pins of the device until
a functional disturbance occurs. This test
conforms with the IEC 1000-4-2 standard.
■ FTB: A Burst of Fast Transient voltage (positive
and negative) is applied to VDD and VSS through
a 100pF capacitor, until a functional disturbance
occurs. This test conforms with the IEC 1000-44 standard.
A device reset allows normal operations to be resumed. The test results are given in the table below based on the EMS levels and classes defined
in application note AN1709.
13.7.1.1 Designing hardened software to avoid
noise problems
EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It
Symbol
should be noted that good EMC performance is
highly dependent on the user application and the
software in particular.
Therefore it is recommended that the user applies
EMC software optimization and prequalification
tests in relation with the EMC level requested for
his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
– Corrupted program counter
– Unexpected reset
– Critical Data corruption (control registers...)
Prequalification trials:
Most of the common failures (unexpected reset
and program counter corruption) can be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1 second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behaviour
is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015).
Parameter
Level/
Class
Conditions
VFESD
Voltage limits to be applied on any I/O pin to induce a VDD=5V, TA=+25°C, fOSC=8MHz
functional disturbance
conforms to IEC 1000-4-2
3B
VFFTB
Fast transient voltage burst limits to be applied
V =5V, TA=+25°C, fOSC=8MHz
through 100pF on VDD and VDD pins to induce a func- DD
conforms to IEC 1000-4-4
tional disturbance
3B
13.7.2 Electro Magnetic Interference (EMI)
Based on a simple application running on the
product (toggling 2 LEDs through the I/O ports),
the product is monitored in terms of emission. This
emission test is in line with the norm SAE J 1752/
3 which specifies the board and the loading of
each pin.
Symbol
Parameter
Conditions
Monitored
Frequency Band
0.1MHz to 30MHz
SEMI
Peak level
VDD=5V, TA=+25°C,
30MHz to 130MHz
SO20 package,
conforming to SAE J 1752/3 130MHz to 1GHz
SAE EMI Level
Note:
1. Data based on characterization results, not tested in production.
104/133
Max vs. [fOSC/fCPU]
8/4MHz
16/8MHz
9
17
31
36
25
27
3.5
4
Unit
dBµV
-
ST7LITE2
EMC CHARACTERISTICS (Cont’d)
13.7.3 Absolute Maximum Ratings (Electrical
Sensitivity)
Based on three different tests (ESD, LU and DLU)
using specific measurement methods, the product
is stressed in order to determine its performance in
terms of electrical sensitivity. For more details, refer to the application note AN1181.
13.7.3.1 Electro-Static Discharge (ESD)
Electro-Static Discharges (a positive then a negative pulse separated by 1 second) are applied to
the pins of each sample according to each pin
combination. The sample size depends on the
number of supply pins in the device (3 parts*(n+1)
supply pin). This test conforms to the JESD22A114A/A115A standard.
Absolute Maximum Ratings
Symbol
VESD(HBM)
Ratings
Electro-static discharge voltage
(Human Body Model)
Conditions
TA=+25°C
Maximum value 1) Unit
4000
V
Note:
1. Data based on characterization results, not tested in production.
13.7.3.2 Static and Dynamic Latch-Up
■ LU: 3 complementary static tests are required
on 10 parts to assess the latch-up performance.
A supply overvoltage (applied to each power
supply pin) and a current injection (applied to
each input, output and configurable I/O pin) are
performed on each sample. This test conforms
to the EIA/JESD 78 IC latch-up standard. For
more details, refer to the application note
AN1181.
■
DLU: Electro-Static Discharges (one positive
then one negative test) are applied to each pin
of 3 samples when the micro is running to
assess the latch-up performance in dynamic
mode. Power supplies are set to the typical
values, the oscillator is connected as near as
possible to the pins of the micro and the
component is put in reset mode. This test
conforms to the IEC1000-4-2 and SAEJ1752/3
standards. For more details, refer to the
application note AN1181.
Electrical Sensitivities
Symbol
LU
DLU
Parameter
Conditions
Class 1)
Static latch-up class
TA=+25°C
A
Dynamic latch-up class
VDD=5.5V, fOSC=4MHz, TA=+25°C
A
Note:
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the
JEDEC criteria (international standard).
105/133
ST7LITE2
13.8 I/O PORT PIN CHARACTERISTICS
13.8.1 General Characteristics
Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
VIL
Input low level voltage
VSS - 0.3
0.3xVDD
VIH
Input high level voltage
0.7xVDD
VDD + 0.3
Vhys
Schmitt trigger voltage
hysteresis 1)
IL
Input leakage current
VSS≤VIN≤VDD
IS
Static current consumption induced
by each floating input pin2)
Floating input mode
RPU
Weak pull-up equivalent resistor3)
VIN=V VDD=5V
VDD=3V
SS
CIO
400
Unit
V
mV
±1
µA
400
50
120
160
I/O pin capacitance
5
tf(IO)out
Output high to low level fall time 1)
25
tr(IO)out
Output low to high level rise time 1)
tw(IT)in
External interrupt pulse time 4)
CL=50pF
Between 10% and 90%
25
1
250
kΩ
pF
ns
tCPU
Notes:
1. Data based on characterization results, not tested in production.
2. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for
example or an external pull-up or pull-down resistor (see Figure 67). Static peak current value taken at a fixed VIN value,
based on design simulation and technology characteristics, not tested in production. This value depends on VDD and temperature values.
3. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics described in Figure 68).
4. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external
interrupt source.
Figure 67. Two typical applications with unused I/O Pin
VDD
ST7XXX
10kΩ
10kΩ
UNUSED I/O PORT
UNUSED I/O PORT
ST7XXX
Caution: During normal operation the ICCCLK pin must be pulled-up, internally or externally
(external pull-up of 10k mandatory in noisy environment. This is to avoid entering ICC mode unexpectedly during a reset.
Note: I/O can be left unconnected if it is configured as output (0 or 1) by the software. This has the advantage of greater EMC
robustness and lower cost.
Figure 68. Typical IPU vs. VDD with VIN=VSS
90
Ta=1 40°C
80
Ta=9 5°C
70
Ta=2 5°C
Ta=-45 °C
Ipu(uA)
60
50
TO BE CHARACTERIZED
40
30
20
10
0
2
106/133
2.5
3
3.5
4
4.5
Vdd(V)
5
5.5
6
ST7LITE2
I/O PORT PIN CHARACTERISTICS (Cont’d)
13.8.2 Output Driving Current
Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Symbol
Parameter
Conditions
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
(see Figure 72)
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
(see Figure 74)
IIO=+5mA TA≤85°C
TA≥85°C
1.0
1.2
IIO=+2mA TA≤85°C
TA≥85°C
0.4
0.5
IIO=+20mA, TA≤85°C
TA≥85°C
1.3
1.5
IIO=+8mA TA≤85°C
TA≥85°C
0.75
0.85
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
VOL 1)3) (see Figure 70)
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
Output high level voltage for an I/O pin
VOH 2)3) when 4 pins are sourced at same time
(see Figure 77)
VDD=3.3V
IIO=-2mA
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
VOL 1)3) (see Figure 71)
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
VOH 2)3)
Max
Unit
IIO=-5mA, TA≤85°C VDD-1.5
TA≥85°C VDD-1.6
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
(see Figure 80)
VDD=2.7V
VOH 2)
VDD=5V
VOL 1)
Min
TA≤85°C VDD-0.8
TA≥85°C VDD-1.0
IIO=+2mA TA≤85°C
TA≥85°C
0.5
0.6
IIO=+8mA TA≤85°C
TA≥85°C
0.5
0.6
IIO=-2mA
TA≤85°C VDD-0.8
TA≥85°C VDD-1.0
IIO=+2mA TA≤85°C
TA≥85°C
0.6
0.7
IIO=+8mA TA≤85°C
TA≥85°C
0.6
0.7
IIO=-2mA
V
TA≤85°C VDD-0.9
TA≥85°C VDD-1.0
Notes:
1. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVSS.
2. The IIO current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of
IIO (I/O ports and control pins) must not exceed IVDD.
3. Not tested in production, based on characterization results.
Figure 70. Typical VOL at VDD=2.7V (standard)
0.70
0.60
0.60
0.50
0.50
-45
0°C
0.40
0.30
TO BE CHARACTERIZED
25°C
90°C
130°C
0.20
VOL at VDD=2.7V
VOL at VDD=2.4V
Figure 69. Typical VOL at VDD=2.4V (standard)
0.40
-45°C
0°C
25°C
90°C
130°C
0.30
0.20
0.10
0.10
0.00
0.00
0.01
1
lio (mA)
2
0.01
1
2
lio (mA)
107/133
ST7LITE2
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 71. Typical VOL at VDD=3.3V (standard)
Figure 72. Typical VOL at VDD=5V (standard)
0.70
0.80
0.60
VOL at VDD=5V
VOL at VDD=3.3V
0.70
0.50
-45°C
0°C
25°C
90°C
130°C
0.40
0.30
0.20
0.60
-45°C
0°C
25°C
90°C
130°C
0.50
0.40
0.30
0.20
0.10
0.00
0.10
0.01
1
2
3
4
5
lio (mA)
0.00
0.01
1
2
3
lio (mA)
Figure 73. Typical VOL at VDD=2.4V (high-sink)
Figure 75. Typical VOL at VDD=3V (high-sink)
1.00
1.20
0.90
VOL at VDD=2.4V (HS)
0.70
-45
0°C
25°C
90°C
130°C
0.60
0.50
0.40
0.30
0.20
Vol (V) at VDD=3V (HS)
1.00
0.80
0.80
-45
0°C
0.60
25°C
90°C
0.40
130°C
0.20
0.10
0.00
0.00
6
7
8
9
6
10
lio (mA)
2. 50
2. 00
-45
0°C
1. 50
25°C
1. 00
90°C
0. 50
130°C
0. 00
7
8
9
10
15
l i o (mA )
108/133
20
8
9
lio (mA)
Figure 74. Typical VOL at VDD=5V (high-sink)
6
7
25
30
35
40
10
15
ST7LITE2
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 78. Typical VDD-VOH at VDD=3V
Figure 76. Typical VDD-VOH at VDD=2.4V
1.60
1.60
1.40
1.20
-45°C
0°C
25°C
90°C
130°C
1.00
0.80
0.60
VDD-VOH at VDD=3V
VDD-VOH at VDD=2.4V
1.40
0.40
1.20
-45°C
0°C
25°C
90°C
130°C
1.00
0.80
0.60
0.40
0.20
0.20
0.00
0.00
-0.01
-1
-0.01
-2
-1
-3
Figure 79. Typical VDD-VOH at VDD=4V
Figure 77. Typical VDD-VOH at VDD=2.7V
1.20
2.50
1.00
2.00
0.80
-45°C
0°C
25°C
90°C
130°C
0.60
0.40
VDD-VOH at VDD=4V
VDD-VOH at VDD=2.7V
-2
lio (mA)
lio (mA)
-45°C
0°C
25°C
90°C
130°C
1.50
1.00
0.50
0.20
0.00
0.00
-0.01
-1
-0.01
-2
-1
-2
-3
-4
-5
lio (mA)
lio(mA)
Figure 80. Typical VDD-VOH at VDD=5V
2.00
VDD-VOH at VDD=5V
1.80
1.60
1.40
1.20
1.00
TO BE CHARACTERIZED
0.80
0.60
-45°C
0°C
25°C
90°C
130°C
0.40
0.20
0.00
-0.01
-1
-2
-3
-4
-5
lio (mA)
109/133
ST7LITE2
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 81. Typical VOL vs. VDD (standard I/Os)
0.70
0.06
0.50
-45
0.40
0°C
25°C
0.30
90°C
130°C
0.20
Vol (V) at lio=0.01mA
Vol (V) at lio=2mA
0.60
0.10
0.00
0.05
-45
0.04
0°C
0.03
25°C
90°C
0.02
130°C
0.01
0.00
2.4
2.7
3.3
5
2.4
2.7
VDD (V)
3.3
5
VDD (V)
Figure 82. Typical VOL vs. VDD (high-sink I/Os)
1.00
0.60
0.50
-45
0.40
0°C
25°C
0.30
90°C
130°C
0.20
0.10
VOL vs VDD (HS) at lio=20mA
VOL vs VDD (HS) at lio=8mA
0.70
0.90
0.80
0.70
-45
0.60
0°C
0.50
25°C
0.40
90°C
0.30
0.20
130°C
0.10
0.00
0.00
2.4
3
2.4
5
3
5
VDD (V)
VDD (V)
Figure 83. Typical VDD-VOH vs. VDD
1.80
1.10
VDD-VOH at lio=-5mA
1.60
1.50
-45°C
0°C
25°C
90°C
130°C
1.40
1.30
1.20
1.10
1.00
VDD-VOH (V) at lio=-2mA
1.70
1.00
0.90
-45°C
0.80
0°C
25°C
0.70
90°C
130°C
0.60
0.50
0.90
0.40
0.80
4
5
VDD
110/133
2.4
2.7
3
VDD (V)
4
5
ST7LITE2
13.9 CONTROL PIN CHARACTERISTICS
13.9.1 Asynchronous RESET Pin
TA = -40°C to 85°C, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIL
Input low level voltage
VSS - 0.3
0.3xVDD
VIH
Input high level voltage
0.7xVDD
VDD + 0.3
Vhys
Schmitt trigger voltage hysteresis 1)
VOL
RON
Output low level voltage
2)
Pull-up equivalent resistor 3) 1)
tw(RSTL)out Generated reset pulse duration
th(RSTL)in
External reset pulse hold time 4)
tg(RSTL)in
Filtered glitch duration
2
VDD=5V
V
IIO=+5mA TA≤85°C
TA≥85°C
0.5
1.0
1.2
IIO=+2mA TA≤85°C
TA≥85°C
0.2
0.4
0.5
VDD=5V
20
40
80
VDD=3V.
40
70
120
Internal reset sources
30
V
V
kΩ
µs
µs
20
200
ns
Notes:
1. Data based on characterization results, not tested in production.
2. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVSS.
3. The RON pull-up equivalent resistor is based on a resistive transistor. Specified for voltages on RESET pin between
VILmax and VDD
4. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on
RESET pin with a duration below th(RSTL)in can be ignored.
111/133
ST7LITE2
CONTROL PIN CHARACTERISTICS (Cont’d)
Figure 84. RESET pin protection when LVD is enabled.1)2)3)4)
VDD
Required
Optional
(note 3)
ST72XXX
RON
EXTERNAL
RESET
INTERNAL
RESET
Filter
0.01µF
1MΩ
PULSE
GENERATOR
WATCHDOG
ILLEGAL OPCODE 5)
LVD RESET
Figure 85. RESET pin protection when LVD is disabled.1)
VDD
ST72XXX
RON
USER
EXTERNAL
RESET
CIRCUIT
INTERNAL
RESET
Filter
0.01µF
PULSE
GENERATOR
WATCHDOG
ILLEGAL OPCODE 5)
Required
Note 1:
– The reset network protects the device against parasitic resets.
– The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the
device can be damaged when the ST7 generates an internal reset (LVD or watchdog).
– Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go
below the VIL max. level specified in section 13.9.1 on page 111. Otherwise the reset will not be taken into account
internally.
– Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must ensure that the current sunk on the RESET pin is less than the absolute maximum value specified for IINJ(RESET) in
section 13.2.2 on page 92.
Note 2: When the LVD is enabled, it is recommended not to connect a pull-up resistor or capacitor. A 10nF pull-down
capacitor is required to filter noise on the reset line.
Note 3: In case a capacitive power supply is used, it is recommended to connect a 1MΩ pull-down resistor to the RESET
pin to discharge any residual voltage induced by the capacitive effect of the power supply (this will add 5µA to the power
consumption of the MCU).
Note 4: Tips when using the LVD:
– 1. Check that all recommendations related to ICCCLK and reset circuit have been applied (see caution in Table 1
on page 7 and notes above)
– 2. Check that the power supply is properly decoupled (100nF + 10µF close to the MCU). Refer to AN1709 and
AN2017. If this cannot be done, it is recommended to put a 100nF + 1MΩ pull-down on the RESET pin.
– 3. The capacitors connected on the RESET pin and also the power supply are key to avoid any start-up marginality.
In most cases, steps 1 and 2 above are sufficient for a robust solution. Otherwise: replace 10nF pull-down on the
RESET pin with a 5µF to 20µF capacitor.”
Note 5: Please refer to “Illegal Opcode Reset” on page 88 for more details on illegal opcode reset conditions.
112/133
ST7LITE2
13.10 COMMUNICATION INTERFACE CHARACTERISTICS
13.10.1 SPI - Serial Peripheral Interface
Subject to general operating conditions for VDD,
fOSC, and TA unless otherwise specified.
Symbol
fSCK =
1/tc(SCK)
tr(SCK)
tf(SCK)
tsu(SS) 1)
Parameter
Refer to I/O port characteristics for more details on
the input/output alternate function characteristics
(SS, SCK, MOSI, MISO).
Conditions
SPI clock frequency
Min
Max
Master
fCPU=8MHz
fCPU/128 =
0.0625
fCPU/4 =
2
Slave
fCPU=8MHz
0
fCPU/2 =
4
SPI clock rise and fall time
Slave
(4 x TCPU) +150
SS hold time
Slave
120
SCK high and low time
Master
Slave
100
90
tsu(MI)
tsu(SI)
Data input setup time
Master
Slave
100
100
th(MI)
th(SI)
Data input hold time
Master
Slave
100
100
ta(SO)
Data output access time
Slave
0
tdis(SO)
Data output disable time
Slave
th(SS)
tw(SCKH)
tw(SCKL)
tv(SO)
Data output valid time
th(SO)
Data output hold time
tv(MO)
Data output valid time
th(MO)
Data output hold time
MHz
see I/O port pin description
SS setup time 4)
1)
Unit
ns
120
240
120
Slave (after enable edge)
0
120
Master (after enable edge)
0
Figure 86. SPI Slave Timing Diagram with CPHA=0 3)
SS INPUT
SCK INPUT
tsu(SS)
tc(SCK)
th(SS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
ta(SO)
MISO OUTPUT
tw(SCKH)
tw(SCKL)
MSB OUT
see note 2
tsu(SI)
MOSI INPUT
tv(SO)
th(SO)
BIT6 OUT
tdis(SO)
tr(SCK)
tf(SCK)
LSB OUT
see
note 2
th(SI)
MSB IN
BIT1 IN
LSB IN
Notes:
1. Data based on design simulation and/or characterisation results, not tested in production.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has
its alternate function capability released. In this case, the pin status depends on the I/O port configuration.
3. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
4. Depends on fCPU. For example, if fCPU = 8MHz, then TCPU = 1/ fCPU = 125ns and tSU(SS) = 550ns
113/133
ST7LITE2
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)
Figure 87. SPI Slave Timing Diagram with CPHA=1 1)
SS INPUT
SCK INPUT
tsu(SS)
tc(SCK)
th(SS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
tw(SCKH)
tw(SCKL)
ta(SO)
MISO OUTPUT
see
note 2
tv(SO)
th(SO)
MSB OUT
HZ
tsu(SI)
BIT6 OUT
LSB OUT
see
note 2
th(SI)
MSB IN
MOSI INPUT
tdis(SO)
tr(SCK)
tf(SCK)
BIT1 IN
LSB IN
Figure 88. SPI Master Timing Diagram 1)
SS INPUT
tc(SCK)
SCK INPUT
CPHA=0
CPOL=0
CPHA=0
CPOL=1
CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(SCKH)
tw(SCKL)
tsu(MI)
MISO INPUT
MOSI OUTPUT
th(MI)
MSB IN
tv(MO)
see note 2
tr(SCK)
tf(SCK)
BIT6 IN
LSB IN
th(MO)
MSB OUT
BIT6 OUT
LSB OUT
see note 2
Notes:
1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has
its alternate function capability released. In this case, the pin status depends of the I/O port configuration.
114/133
ST7LITE2
13.11 10-BIT ADC CHARACTERISTICS
Subject to general operating condition for VDD, fOSC, and TA unless otherwise specified.
Symbol
fADC
VAIN
Parameter
Conditions
Conversion voltage range
2)
RAIN
External input resistor
Internal sample and hold capacitor
IADC
VSSA
- Sample capacitor loading time
- Hold conversion time
Max
Unit
4
MHz
VDDA
V
10 3)
kΩ
6
0
Stabilization time after ADC enable
Conversion time (Sample+Hold)
tADC
Typ 1)
ADC clock frequency
CADC
tSTAB
Min
pF
4)
µs
3.5
fCPU=8MHz, fADC=4MHz
4
10
1/fADC
Analog Part
1
Digital Part
0.2
mA
Figure 89. Typical Application with ADC
VDD
VT
0.6V
RAIN
AINx
10-Bit A/D
Conversion
VAIN
CAIN
VT
0.6V
IL
±1µA
CADC
6pF
ST72XXX
Notes:
1. Unless otherwise specified, typical data are based on TA=25°C and VDD-VSS=5V. They are given only as design guidelines and are not tested.
2. When VDDA and VSSA pins are not available on the pinout, the ADC refers to VDD and VSS.
3. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10kΩ). Data
based on characterization results, not tested in production.
4. The stabilization time of the AD converter is masked by the fi
rst tLOAD. The first conversion after the enable is then always valid.
115/133
ST7LITE2
ADC CHARACTERISTICS (Cont’d)
ADC Accuracy with VDD=5.0V
Symbol
Parameter
Conditions
|ET|
Total unadjusted error
|EO|
Offset error 2)
|EG|
Gain Error 2)
|ED|
2)
fCPU=8MHz, fADC=4MHz 1), VDD=5.0V
Differential linearity error
|EL|
Integral linearity error
2)
2)
Typ
Max 1)
3
6
1.5
5
2
4.5
2.5
4.5
2.5
4.5
Unit
LSB
Notes:
1. Data based on characterization results over the whole temperature range, not tested in production.
2. Injecting negative current on any of the analog input pins significantly reduces the accuracy of any conversion being
performed on any analog input.
Analog pins can be protected against negative injection by adding a Schottky diode (pin to ground). Injecting negative
current on digital input pins degrades ADC accuracy especially if performed on a pin close to the analog input pins.
Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 13.8 does not affect the ADC
accuracy.
Figure 90. ADC Accuracy Characteristics with amplifier disabled
Digital Result ADCDR
EG
1023
1022
1LSB
1021
IDEAL
V
–V
DD
SS
= --------------------------------
1024
(2)
ET
(3)
7
(1)
6
5
EO
4
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
EL
3
ED
2
ET=Total Unadjusted Error: maximum deviation
between the actual and the ideal transfer curves.
EO=Offset Error: deviation between the first actual
transition and the first ideal one.
EG=Gain Error: deviation between the last ideal
transition and the last actual one.
ED=Differential Linearity Error: maximum deviation
between actual steps and the ideal one.
EL=Integral Linearity Error: maximum deviation
between any actual transition and the end point
correlation line.
1 LSBIDEAL
1
Vin (LSBIDEAL)
0
1
VSS
116/133
2
3
4
5
6
7
1021 1022 1023 1024
VDD
ST7LITE2
ADC CHARACTERISTICS (Cont’d)
Figure 91. ADC Accuracy Characteristics with amplifier enabled
Digital Result ADCDR
EG
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
704
1LSB
IDEAL
V
–V
DD
SS
= --------------------------------
1024
(2)
ET
ET=Total Unadjusted Error: maximum deviation
between the actual and the ideal transfer curves.
EO=Offset Error: deviation between the first actual
transition and the first ideal one.
EG=Gain Error: deviation between the last ideal
transition and the last actual one.
ED=Differential Linearity Error: maximum deviation
between actual steps and the ideal one.
EL=Integral Linearity Error: maximum deviation
between any actual transition and the end point
correlation line.
(3)
(1)
EO
EL
ED
1 LSBIDEAL
108
Vin (LSBIDEAL)
0
1
VSS
2
3
4
5
6
7
701 702 703 704
62.5mV
430mV
Vin (OPAMP)
Note: When the AMPSEL bit in the ADCDRL register is set, it is mandatory that fADC be less than or equal
to 2 MHz. (if fCPU=8MHz. then SPEED=0, SLOW=1).
Vout (ADC input)
Vmax
Noise
Vmin
0V
430mV
Vin
(OPAMP input)
117/133
ST7LITE2
ADC CHARACTERISTICS (Cont’d)
Symbol
VDD(AMP)
Parameter
Conditions
Amplifier operating voltage
Min
350
VDD=5V
0
500
Amplifier output offset voltage5)
VDD=5V
VSTEP
Step size for monotonicity3)
VDD=3.6V
3.5
VDD=5V
4.89
Linearity
Output Voltage Response
Vmin
Output Linearity Min Voltage
200
mV
mV
8
VINmax = 430mV,
VDD=5V
3.65
3.94
200
Notes:
1. Data based on characterization results over the whole temperature range, not tested in production.
2. For precise conversion results it is recommended to calibrate the amplifier at the following two points:
– offset at VINmin = 0V
– gain at full scale (for example VIN=430mV)
3. Monotonicity guaranteed if VIN increases or decreases in steps of min. 5mV.
4. Please refer to the Application Note AN1830 for details of TE% vs Vin.
5. Refer to the offset variation in temperature below
13.11.1 Amplifier output offset variation
The offset is quite sensitive to temperature variations. In order to ensure a good reliability in measurements, the offset must be recalibrated periodically i.e. during power on or whenever the device
is reset depending on the customer application
and during temperature variation. The table below
gives the typical offset variation over temperature:
Typical Offset Variation (LSB)
-45
-20
+25
+90
-12
-7
+13
118/133
mV
Linear
Gain2)
Amplified Analog input
V
5.5
0
VOFFSET
Output Linearity Max Voltage
Unit
3.6
Amplifier input voltage4)
Vmax
Max
VDD=3.6V
VIN
Gain factor
Typ
UNIT
°C
LSB
V
mV
ST7LITE2
14 PACKAGE CHARACTERISTICS
14.1 PACKAGE MECHANICAL DATA
Figure 92. 20-Pin Plastic Small Outline Package, 300-mil Width
D
Dim.
h x 45×
L
A1
A
c
mm
Min
Typ
inches
Max
Min
Typ
Max
A
2.35
2.65 0.093
0.104
A1
0.10
0.30 0.004
0.012
B
0.33
0.51 0.013
0.020
C
0.23
0.32 0.009
0.013
D
12.60
13.00 0.496
0.512
E
7.40
7.60 0.291
0.299
a
e
B
e
E H
1.27
0.050
H
10.00
10.65 0.394
0.419
h
0.25
0.75 0.010
0.030
α
0°
L
0.40
8°
0°
8°
1.27 0.016
0.050
Number of Pins
N
20
Figure 93. 20-Pin Plastic Dual In-Line Package, 300-mil Width
Dim.
A2
A
mm
Min
Typ
A
A1
b
eB
D1
b2
e
D
20
11
10
Min
Typ
5.33
Max
0.210
A1
0.38
A2
2.92
3.30
4.95 0.115 0.130 0.195
0.015
b
0.36
0.46
0.56 0.014 0.018 0.022
b2
1.14
1.52
1.78 0.045 0.060 0.070
c
0.20
0.25
0.36 0.008 0.010 0.014
D
24.89 26.16 26.92 0.980 1.030 1.060
D1
0.13
e
E1
1
c
L
inches
Max
0.005
2.54
eB
0.100
10.92
0.430
E1
6.10
6.35
7.11 0.240 0.250 0.280
L
2.92
3.30
3.81 0.115 0.130 0.150
Number of Pins
N
20
119/133
ST7LITE2
PACKAGE CHARACTERISTICS (Cont’d)
Table 21. THERMAL CHARACTERISTICS
Symbol
Ratings
SO20
DIP20
Value
Unit
125
63
°C/W
RthJA
Package thermal resistance
(junction to ambient)
TJmax
Maximum junction temperature 1)
150
°C
PDmax
Power dissipation 2)
500
mW
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the
chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application.
120/133
ST7LITE2
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been converted to lead-free technology, named ECOPACKTM.
TM packages are qualified according
■ ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
■ Detailed information on the STMicroelectronics
ECOPACKTM transition program is available on
www.st.com/stonline/leadfree/, with specific
technical Application notes covering the main
technical aspects related to lead-free
conversion (AN2033, AN2034, AN2035,
AN2036).
Backward and forward compatibility:
The main difference between Pb and Pb-free soldering process is the temperature range.
– ECOPACKTM TQFP, SDIP and SO packages
are fully compatible with Lead (Pb) containing
soldering process (see application note AN2034)
– TQFP, SDIP and SO Pb-packages are compatible with Lead-free soldering process, nevertheless it's the customer's duty to verify that the Pbpackages maximum temperature (mentioned on
the Inner box label) is compatible with their Leadfree soldering temperature.
Table 22. Soldering Compatibility (wave and reflow soldering process)
Package
SDIP & PDIP
TQFP and SO
Plating material devices
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
Pb solder paste
Yes
Yes
Pb-free solder paste
Yes *
Yes *
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
121/133
ST7LITE2
15 DEVICE CONFIGURATION
Each device is available for production in user programmable versions (FLASH) as well as in factory
coded versions (FASTROM).
ST7FLITE2 devices are FLASH versions.
ST7PLITE2 devices are Factory Advanced Service Technique ROM (FASTROM) versions: they
are factory programmed FLASH devices.
ST7FLITE2 devices are shipped to customers with
a default program memory content (FFh), while
FASTROM factory coded parts contain the code
supplied by the customer. This implies that FLASH
devices have to be configured by the customer using the Option Bytes while the FASTROM devices
are factory configured.
OSCRANGE
External
on OSC1
Clock source:
on PB4
CLKIN
Reserved
OPT7 = Reserved, must always be 1.
OSCRANGE
Typ.
frequency
range with
Resonator
1~2MHz
0
0
0
MP
2~4MHz
0
0
1
MS
4~8MHz
0
1
0
HS
8~16MHz
0
1
1
VLP 32.768kHz
1
0
0
Res.
Default
Value
122/133
1
1
1
1
1
1
1
0
SEC0
0.5k
0
0
1k
0
1
2k
1
0
4k
1
1
OPTION BYTE 1
7
0
FMP FMP PLL PLL
SEC1 SEC0
R
W
x4x8 OFF
1
1
OPT0 = FMP_W FLASH write protection
This option indicates if the FLASH program memory is write protected.
Warning: When this option is selected, the program memory (and the option bit itself) can never
be erased or programmed again.
0: Write protection off
1: Write protection on
0
1
1
SEC1
OPTION BYTE 0
7
OSCRANGE
2:0
0
OPT1 = FMP_R Read-out protection
Readout protection, when selected provides a protection against program memory content extraction and against write access to Flash memory.
Erasing the option bytes when the FMP_R option
is selected will cause the whole memory to be
erased first and the device can be reprogrammed.
Refer to the ST7 Flash Programming Reference
Manual and section 4.5 on page 14 for more details
0: Read-out protection off
1: Read-out protection on
OPT6:4 = OSCRANGE[2:0] Oscillator range
When the internal RC oscillator is not selected
(Option OSC=1), these option bits select the range
of the resonator oscillator current source or the external clock source.
LP
1
Sector 0 Size
OPTION BYTE 0
0
0
OPT3:2 = SEC[1:0] Sector 0 size definition
These option bits indicate the size of sector 0 according to the following table.
The two option bytes allow the hardware configuration of the microcontroller to be selected.
The option bytes can be accessed only in programming mode (for example using a standard
ST7 programming tool).
1
1
Note: When the internal RC oscillator is selected,
the OSCRANGE option bits must be kept at their
default value in order to select the 256 clock cycle
delay (see Section 7.5).
15.1 OPTION BYTES
2
2
1
0
0
1
1
PLL32
WDG WDG
OSC LVD1 LVD0
OFF
SW HALT
1
0
1
1
1
1
ST7LITE2
OPTION BYTES (Cont’d)
OPT3:2 = LVD[1:0] Low voltage detection selection
These option bits enable the LVD block with a selected threshold as shown in Table 23.
OPTION BYTE 1
OPT7 = PLLx4x8 PLL Factor selection.
0: PLLx4
1: PLLx8
Table 23. LVD Threshold Configuration
Configuration
OPT6 = PLLOFF PLL disable.
0: PLL enabled
1: PLL disabled (by-passed)
OPT5 = PLL32OFF 32MHz PLL disable.
0: PLL32 enabled
1: PLL32 disabled (by-passed)
OPT4 = OSC RC Oscillator selection
0: RC oscillator on
1: RC oscillator off
Notes:
1. 1% RC oscillator available on ST7LITE25 and
ST7LITE29 devices only
2. If the RC oscillator is selected, then to improve
clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically
100nF, between the VDD and VSS pins as close as
possible to the ST7 device.
LVD1 LVD0
LVD Off
1
1
Highest Voltage Threshold (∼4.1V)
1
0
Medium Voltage Threshold (∼3.5V)
0
1
Lowest Voltage Threshold (∼2.8V)
0
0
OPT1 = WDG SW Hardware or Software
Watchdog
This option bit selects the watchdog type.
0: Hardware (watchdog always enabled)
1: Software (watchdog to be enabled by software)
OPT0 = WDG HALT Watchdog Reset on Halt
This option bit determines if a RESET is generated
when entering HALT mode while the Watchdog is
active.
0: No Reset generation when entering Halt mode
1: Reset generation when entering Halt mode
Table 24. List of valid option combinations
VDD range
Operating conditions
Clock Source
Internal RC 1%1)
2.4V - 3.3V
External clock or oscillator
(depending on OPT6:4 selection)
Internal RC 1% 1)
3.3V - 5.5V
External clock or oscillator
(depending on OPT6:4 selection)
PLL
off
x4
x8
off
x4
x8
off
x4
x8
off
x4
x8
Typ fCPU
0.7MHz @3V
2.8MHz @3V
0-4MHz
4MHz
1MHz @5V
8MHz @5V
0-8MHz
8 MHz
OSC
0
0
1
1
0
0
1
1
Option Bits
PLLOFF
PLLx4x8
1
1
0
0
1
1
0
0
1
1
0
1
1
1
0
1
Note 1: Configuration available on ST7LITE25 and ST7LITE29 devices only
Note: see Clock Management Block diagram in Figure 13
123/133
ST7LITE2
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE
Customer code is made up of the FASTROM contents and the list of the selected options (if any).
The FASTROM contents are to be sent on diskette, or by electronic means, with the S19 hexadecimal file generated by the development tool. All
unused bytes must be set to FFh. The selected options are communicated to STMicroelectronics us-
ing the correctly completed OPTION LIST appended on page 125.
Refer to application note AN1635 for information
on the counter listing returned by ST after code
has been transferred.
The STMicroelectronics Sales Organization will be
pleased to provide detailed information on contractual points.
Table 25. Supported part numbers
Part Number
Program
Memory
(Bytes)
RAM
(Bytes)
ST7FLITE20F2B6
ST7FLITE25F2M6
8K FLASH
384
ST7FLITE29F2B6
ST7PLITE20F2B6
8K FASTROM
384
ST7PLITE29F2B6
ST7PLITE29F2M6
Contact ST sales office for product availability
124/133
SO20
-40°C to 85°C
256
DIP20
SO20
DIP20
SO20
DIP20
-
ST7PLITE20F2M6
ST7PLITE25F2M6
-
Package
DIP20
256
ST7FLITE29F2M6
ST7PLITE25F2B6
Temp.
Range
-
ST7FLITE20F2M6
ST7FLITE25F2B6
Data
EEPROM
(Bytes)
SO20
-40°C to 85°C
DIP20
SO20
DIP20
SO20
ST7LITE2
ST7LITE2 FASTROM MICROCONTROLLER OPTION LIST
Customer
Address
..........................................................................
..........................................................................
..........................................................................
Contact
..........................................................................
Phone No
..........................................................................
Reference/FASTROM Code*: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
*FASTROM code name is assigned by STMicroelectronics.
FASTROM code must be sent in .S19 format. .Hex extension cannot be processed.
Device Type/Memory Size/Package (check only one option):
--------------------------------- | ----------------------------------------- |
FASTROM DEVICE:
8K
--------------------------------- | ----------------------------------------- |
SO20:
|
[ ] ST7PLITE20F2M6
|
|
[ ] ST7PLITE25F2M6
|
|
[ ] ST7PLITE29F2M6
|
DIP20:
|
[ ] ST7PLITE20F2B6
|
|
[ ] ST7PLITE25F2B6
|
|
[ ] ST7PLITE29F2B6
|
Warning: Addresses 1000h, 1001h, FFDEh and FFDFh are reserved areas for ST to program RCCR0 and
RCCR1 (see section 7.1 on page 23).
Conditioning (do not specify for DIP package):
[ ] Tape & Reel
[ ] Tube
Special Marking:
[ ] No
[ ] Yes "_ _ _ _ _ _ _ _ "
Authorized characters are letters, digits, '.', '-', '/' and spaces only.
Maximum character count:
DIP20/S020 (8 char. max) : _ _ _ _ _ _ _ _
Watchdog Selection:
[ ] Software Activation
[ ] Hardware Activation
Watchdog Reset on Halt:
[ ] Reset
[ ] No Reset
LVD Reset
[ ] Disabled
[ ] Enabled
[ ] Highest threshold
[ ] Medium threshold
[ ] Lowest threshold
Sector 0 size:
[ ] 0.5K
[ ] 1K
Readout Protection:
FLASH write Protection:
[ ] Disabled
[ ] Disabled
[ ] Enabled
[ ] Enabled
Clock Source Selection:
[ ] Resonator:
[ ] VLP: Very Low power resonator (32 to 100 kHz)
[ ] LP: Low power resonator (1 to 2 MHz)
[ ] MP: Medium power resonator (2 to 4 MHz)
[ ] MS: Medium speed resonator (4 to 8 MHz)
[ ] HS: High speed resonator (8 to 16 MHz)
[ ] External Clock:
[ ] On OSC1
[ ] On PB4
[ ] Internal RC Oscillator (ST7PLITE25 and ST7PLITE29 only)
PLL
[ ] Disabled
[ ] PLLx4
PLL32
[ ] Disabled
[ ] Enabled
[ ] 2K
[ ] 4K
[ ] PLLx8
Comments : . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Operating Range in the application: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Notes
..........................................................................
Date:
..........................................................................
Signature:
..........................................................................
Important note: Not all configurations are available. See Table 24 on page 123 for authorized option byte
combinations.
125/133
ST7LITE2
15.3 DEVELOPMENT TOOLS
STMicroelectronics offers a range of hardware
and software development tools for the ST7 microcontroller family. Full details of tools available for
the ST7 from third party manufacturers can be obtained from the STMicroelectronics Internet site:
http//www.st.com.
Tools from these manufacturers include C compliers, evaluation tools, emulators and programmers.
Emulators
Two types of emulators are available from ST for
the ST7LITE2 family:
■ ST7 DVP3 entry-level emulator offers a flexible
and modular debugging and programming
solution. SO20 packages need a specific
connection kit (refer to Table 26)
■ ST7 EMU3 high-end emulator is delivered with
everything (probes, TEB, adapters etc.) needed
to start emulating the ST7LITE2. To configure it
to emulate other ST7 subfamily devices, the
active probe for the ST7EMU3 can be changed
and the ST7EMU3 probe is designed for easy
interchange of TEBs (Target Emulation Board).
See Table 26.
In-circuit Debugging Kit
Two configurations are available from ST:
■ ST7FLIT2-IND/USB:
Low-cost
In-Circuit
Debugging kit from Softec Microsystems.
Includes STX-InDART/USB board (USB port)
and a specific demo board for ST7FLITE29
(DIP16) (A promotion package of 15 STFLIT2IND/USB can be ordered with the following
order code: STFLIT2-IND/15)
■ STxF-INDART/USB (A promotion package of
15 STxF-INDART/USB can be ordered with the
following order code: STxF-INDART)
Flash Programming tools
■ ST7-STICK ST7 In-circuit Communication Kit, a
complete software/hardware package for
programming ST7 Flash devices. It connects to
a host PC parallel port and to the target board or
socket board via ST7 ICC connector.
■ ICC Socket Boards provide an easy to use and
flexible means of programming ST7 Flash
devices. They can be connected to any tool that
supports the ST7 ICC interface, such as ST7
EMU3, ST7-DVP3, inDART, ST7-STICK, or
many third-party development tools.
Evaluation boards
One evaluation tool is available from ST:
■ ST7FLIT2-COS/COM: STReal time starter kit
from Cosmic software
Table 26. STMicroelectronics Development Tools
Emulation
Supported
Products
ST7FLITE20
ST7FLITE25
ST7FLITE29
ST7 DVP3 Series
Programming
ST7 EMU3 series
Emulator
Connection kit
Emulator
Active Probe &
T.E.B.
ICC Socket Board
ST7MDT10-DVP3
ST7MDT10-20/
DVP
ST7MDT10-EMU3
ST7MDT10-TEB
ST7SB10/123 1)
Note 1: Add suffix /EU, /UK, /US for the power supply of your region.
126/133
ST7LITE2
15.4 ST7 APPLICATION NOTES
Table 27. ST7 Application Notes
IDENTIFICATION DESCRIPTION
APPLICATION EXAMPLES
AN1658
SERIAL NUMBERING IMPLEMENTATION
AN1720
MANAGING THE READ-OUT PROTECTION IN FLASH MICROCONTROLLERS
AN1755
A HIGH RESOLUTION/PRECISION THERMOMETER USING ST7 AND NE555
AN1756
CHOOSING A DALI IMPLEMENTATION STRATEGY WITH ST7DALI
A HIGH PRECISION, LOW COST, SINGLE SUPPLY ADC FOR POSITIVE AND NEGATIVE INAN1812
PUT VOLTAGES
EXAMPLE DRIVERS
AN 969
SCI COMMUNICATION BETWEEN ST7 AND PC
AN 970
SPI COMMUNICATION BETWEEN ST7 AND EEPROM
AN 971
I²C COMMUNICATION BETWEEN ST7 AND M24CXX EEPROM
AN 972
ST7 SOFTWARE SPI MASTER COMMUNICATION
AN 973
SCI SOFTWARE COMMUNICATION WITH A PC USING ST72251 16-BIT TIMER
AN 974
REAL TIME CLOCK WITH ST7 TIMER OUTPUT COMPARE
AN 976
DRIVING A BUZZER THROUGH ST7 TIMER PWM FUNCTION
AN 979
DRIVING AN ANALOG KEYBOARD WITH THE ST7 ADC
AN 980
ST7 KEYPAD DECODING TECHNIQUES, IMPLEMENTING WAKE-UP ON KEYSTROKE
AN1017
USING THE ST7 UNIVERSAL SERIAL BUS MICROCONTROLLER
AN1041
USING ST7 PWM SIGNAL TO GENERATE ANALOG OUTPUT (SINUSOÏD)
AN1042
ST7 ROUTINE FOR I²C SLAVE MODE MANAGEMENT
AN1044
MULTIPLE INTERRUPT SOURCES MANAGEMENT FOR ST7 MCUS
AN1045
ST7 S/W IMPLEMENTATION OF I²C BUS MASTER
AN1046
UART EMULATION SOFTWARE
AN1047
MANAGING RECEPTION ERRORS WITH THE ST7 SCI PERIPHERALS
AN1048
ST7 SOFTWARE LCD DRIVER
AN1078
PWM DUTY CYCLE SWITCH IMPLEMENTING TRUE 0% & 100% DUTY CYCLE
AN1082
DESCRIPTION OF THE ST72141 MOTOR CONTROL PERIPHERALS REGISTERS
AN1083
ST72141 BLDC MOTOR CONTROL SOFTWARE AND FLOWCHART EXAMPLE
AN1105
ST7 PCAN PERIPHERAL DRIVER
AN1129
PWM MANAGEMENT FOR BLDC MOTOR DRIVES USING THE ST72141
AN INTRODUCTION TO SENSORLESS BRUSHLESS DC MOTOR DRIVE APPLICATIONS
AN1130
WITH THE ST72141
AN1148
USING THE ST7263 FOR DESIGNING A USB MOUSE
AN1149
HANDLING SUSPEND MODE ON A USB MOUSE
AN1180
USING THE ST7263 KIT TO IMPLEMENT A USB GAME PAD
AN1276
BLDC MOTOR START ROUTINE FOR THE ST72141 MICROCONTROLLER
AN1321
USING THE ST72141 MOTOR CONTROL MCU IN SENSOR MODE
AN1325
USING THE ST7 USB LOW-SPEED FIRMWARE V4.X
AN1445
EMULATED 16 BIT SLAVE SPI
AN1475
DEVELOPING AN ST7265X MASS STORAGE APPLICATION
AN1504
STARTING A PWM SIGNAL DIRECTLY AT HIGH LEVEL USING THE ST7 16-BIT TIMER
AN1602
16-BIT TIMING OPERATIONS USING ST7262 OR ST7263B ST7 USB MCUS
AN1633
DEVICE FIRMWARE UPGRADE (DFU) IMPLEMENTATION IN ST7 NON-USB APPLICATIONS
AN1712
GENERATING A HIGH RESOLUTION SINEWAVE USING ST7 PWMART
AN1713
SMBUS SLAVE DRIVER FOR ST7 I2C PERIPHERALS
AN1753
SOFTWARE UART USING 12-BIT ART
127/133
ST7LITE2
Table 27. ST7 Application Notes
IDENTIFICATION DESCRIPTION
AN1947
ST7MC PMAC SINE WAVE MOTOR CONTROL SOFTWARE LIBRARY
GENERAL PURPOSE
AN1476
LOW COST POWER SUPPLY FOR HOME APPLIANCES
AN1526
ST7FLITE0 QUICK REFERENCE NOTE
AN1709
EMC DESIGN FOR ST MICROCONTROLLERS
AN1752
ST72324 QUICK REFERENCE NOTE
PRODUCT EVALUATION
AN 910
PERFORMANCE BENCHMARKING
AN 990
ST7 BENEFITS VERSUS INDUSTRY STANDARD
AN1077
OVERVIEW OF ENHANCED CAN CONTROLLERS FOR ST7 AND ST9 MCUS
AN1086
U435 CAN-DO SOLUTIONS FOR CAR MULTIPLEXING
AN1103
IMPROVED B-EMF DETECTION FOR LOW SPEED, LOW VOLTAGE WITH ST72141
AN1150
BENCHMARK ST72 VS PC16
AN1151
PERFORMANCE COMPARISON BETWEEN ST72254 & PC16F876
AN1278
LIN (LOCAL INTERCONNECT NETWORK) SOLUTIONS
PRODUCT MIGRATION
AN1131
MIGRATING APPLICATIONS FROM ST72511/311/214/124 TO ST72521/321/324
AN1322
MIGRATING AN APPLICATION FROM ST7263 REV.B TO ST7263B
AN1365
GUIDELINES FOR MIGRATING ST72C254 APPLICATIONS TO ST72F264
AN1604
HOW TO USE ST7MDT1-TRAIN WITH ST72F264
AN2200
GUIDELINES FOR MIGRATING ST7LITE1X APPLICATIONS TO ST7FLITE1XB
PRODUCT OPTIMIZATION
AN 982
USING ST7 WITH CERAMIC RESONATOR
AN1014
HOW TO MINIMIZE THE ST7 POWER CONSUMPTION
AN1015
SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE
AN1040
MONITORING THE VBUS SIGNAL FOR USB SELF-POWERED DEVICES
AN1070
ST7 CHECKSUM SELF-CHECKING CAPABILITY
AN1181
ELECTROSTATIC DISCHARGE SENSITIVE MEASUREMENT
AN1324
CALIBRATING THE RC OSCILLATOR OF THE ST7FLITE0 MCU USING THE MAINS
AN1502
EMULATED DATA EEPROM WITH ST7 HDFLASH MEMORY
AN1529
EXTENDING THE CURRENT & VOLTAGE CAPABILITY ON THE ST7265 VDDF SUPPLY
ACCURATE TIMEBASE FOR LOW-COST ST7 APPLICATIONS WITH INTERNAL RC OSCILLAAN1530
TOR
AN1605
USING AN ACTIVE RC TO WAKEUP THE ST7LITE0 FROM POWER SAVING MODE
AN1636
UNDERSTANDING AND MINIMIZING ADC CONVERSION ERRORS
AN1828
PIR (PASSIVE INFRARED) DETECTOR USING THE ST7FLITE05/09/SUPERLITE
AN1946
SENSORLESS BLDC MOTOR CONTROL AND BEMF SAMPLING METHODS WITH ST7MC
AN1953
PFC FOR ST7MC STARTER KIT
AN1971
ST7LITE0 MICROCONTROLLED BALLAST
PROGRAMMING AND TOOLS
AN 978
ST7 VISUAL DEVELOP SOFTWARE KEY DEBUGGING FEATURES
AN 983
KEY FEATURES OF THE COSMIC ST7 C-COMPILER PACKAGE
AN 985
EXECUTING CODE IN ST7 RAM
AN 986
USING THE INDIRECT ADDRESSING MODE WITH ST7
AN 987
ST7 SERIAL TEST CONTROLLER PROGRAMMING
AN 988
STARTING WITH ST7 ASSEMBLY TOOL CHAIN
AN 989
GETTING STARTED WITH THE ST7 HIWARE C TOOLCHAIN
128/133
ST7LITE2
Table 27. ST7 Application Notes
IDENTIFICATION
AN1039
AN1064
AN1071
AN1106
DESCRIPTION
ST7 MATH UTILITY ROUTINES
WRITING OPTIMIZED HIWARE C LANGUAGE FOR ST7
HALF DUPLEX USB-TO-SERIAL BRIDGE USING THE ST72611 USB MICROCONTROLLER
TRANSLATING ASSEMBLY CODE FROM HC05 TO ST7
PROGRAMMING ST7 FLASH MICROCONTROLLERS IN REMOTE ISP MODE (IN-SITU PROAN1179
GRAMMING)
AN1446
USING THE ST72521 EMULATOR TO DEBUG A ST72324 TARGET APPLICATION
AN1477
EMULATED DATA EEPROM WITH XFLASH MEMORY
AN1478
PORTING AN ST7 PANTA PROJECT TO CODEWARRIOR IDE
AN1527
DEVELOPING A USB SMARTCARD READER WITH ST7SCR
AN1575
ON-BOARD PROGRAMMING METHODS FOR XFLASH AND HDFLASH ST7 MCUS
AN1576
IN-APPLICATION PROGRAMMING (IAP) DRIVERS FOR ST7 HDFLASH OR XFLASH MCUS
AN1577
DEVICE FIRMWARE UPGRADE (DFU) IMPLEMENTATION FOR ST7 USB APPLICATIONS
AN1601
SOFTWARE IMPLEMENTATION FOR ST7DALI-EVAL
AN1603
USING THE ST7 USB DEVICE FIRMWARE UPGRADE DEVELOPMENT KIT (DFU-DK)
AN1635
ST7 CUSTOMER ROM CODE RELEASE INFORMATION
AN1754
DATA LOGGING PROGRAM FOR TESTING ST7 APPLICATIONS VIA ICC
AN1796
FIELD UPDATES FOR FLASH BASED ST7 APPLICATIONS USING A PC COMM PORT
AN1900
HARDWARE IMPLEMENTATION FOR ST7DALI-EVAL
AN1904
ST7MC THREE-PHASE AC INDUCTION MOTOR CONTROL SOFTWARE LIBRARY
AN1905
ST7MC THREE-PHASE BLDC MOTOR CONTROL SOFTWARE LIBRARY
SYSTEM OPTIMIZATION
AN1711
SOFTWARE TECHNIQUES FOR COMPENSATING ST7 ADC ERRORS
AN1827
IMPLEMENTATION OF SIGMA-DELTA ADC WITH ST7FLITE05/09
AN2009
PWM MANAGEMENT FOR 3-PHASE BLDC MOTOR DRIVES USING THE ST7FMC
AN2030
BACK EMF DETECTION DURING PWM ON TIME BY ST7MC
129/133
ST7LITE2
16 IMPORTANT NOTES
16.1 EXECUTION OF BTJX INSTRUCTION
When testing the address $FF with the "BTJT" or
"BTJF" instructions, the CPU may perform an incorrect operation when the relative jump is negative and performs an address page change.
To avoid this issue, including when using a C compiler, it is recommended to never use address
$00FF as a variable (using the linker parameter for
example).
16.2 ADC CONVERSION SPURIOUS RESULTS
Spurious conversions occur with a rate lower than
50 per million. Such conversions happen when the
measured voltage is just between 2 consecutive
digital values.
Workaround
A software filter should be implemented to remove
erratic conversion results whenever they may
cause unwanted consequences.
16.3 A/ D CONVERTER ACCURACY FOR FIRST
CONVERSION
When the ADC is enabled after being powered
down (for example when waking up from HALT,
ACTIVE-HALT or setting the ADON bit in the ADCCSR register), the first conversion (8-bit or 10bit) accuracy does not meet the accuracy specified
in the datasheet.
Workaround
In order to have the accuracy specified in the datasheet, the first conversion after a ADC switch-on
has to be ignored.
Injecting a negative current on digital input pins
degrades ADC accuracy especially if performed
on a pin close to ADC channel in use.
16.5
CLEARING
ACTIVE
INTERRUPTS
OUTSIDE INTERRUPT ROUTINE
When an active interrupt request occurs at the
same time as the related flag or interrupt mask is
being cleared, the CC register may be corrupted.
Concurrent interrupt context
The symptom does not occur when the interrupts
are handled normally, i.e. when:
– The interrupt request is cleared (flag reset or interrupt mask) within its own interrupt routine
– The interrupt request is cleared (flag reset or interrupt mask) within any interrupt routine
– The interrupt request is cleared (flag reset or interrupt mask) in any part of the code while this interrupt is disabled
If these conditions are not met, the symptom can
be avoided by implementing the following sequence:
Perform SIM and RIM operation before and after
resetting an active interrupt request
Ex:
SIM
reset flag or interrupt mask
RIM
16.6 USING PB4 AS EXTERNAL INTERRUPT
PB4 cannot be used as an external interrupt in
HALT mode because the port pin PB4 is not active
in this mode.
16.4 NEGATIVE INJECTION IMPACT ON ADC
ACCURACY
Injecting a negative current on an analog input
pins significantly reduces the accuracy of the AD
Converter. Whenever necessary, the negative injection should be prevented by the addition of a
Schottky diode between the concerned I/Os and
ground.
130/133
16.7 TIMEBASE 2 INTERRUPT IN SLOW MODE
Timebase 2 interrupt is not available in slow mode.
ST7LITE2
17 REVISION HISTORY
Table 28. Revision History
Date
30-August2004
Revision
3
Description of Changes
Updated Figure 62. Typical IDD in WAIT vs. fCPU with correct data
Added data for Fcpu @ 1MHz into Section 13.4.1 Supply Current table.
EnabledProgramming Capability for EMU3, Table 26
Reset delay in section 11.1.3 on page 53 changed to 30µs
Altered note 1 for section 13.2.3 on page 94 removing references to RESET
Removed sentence relating to an effective change only after overflow for CK[1:0], page 61
MOD00 replaced by 0Ex in Figure 37 on page 58
Added Note 2 related to Exit from Active Halt, section 11.2.5 on page 60
Changed section 11.4.2 on page 71
Changed section 11.4.3.3 on page 74
Added illegal opcode detection to page 1, section 7.6 on page 30, section 12 on page 87
Clarification of Flash read-out protection, section 4.5.1 on page 14
Added note 4 and description relating to Total Percentage in Error and Amplifier Output Offset
Variation to the ADC Characteristics subsection and table, page 120
Added note 5 and description relating to Offset Variation in Temperature to ADC Characteristics subsection and table, page 120
fPLL value of 1MHz quoted as Typical instead of a Minimum in section 13.3.4.1 on page 97
Updated fSCK in section 13.10.1 on page 115 to fCPU/4 and fCPU/2
CorrectedfCPU in SLOW and SLOW WAIT modes in section 13.4.1 on page 101
Max values updated for ADC Accuracy, page 118
Socket Board development kit details added in Table 27 on page 126
Notes indicating that PB4 cannot be used as an external interrupt in HALT mode, section 16.6
on page 132 and Section 8.3 PERIPHERAL INTERRUPTS
-Removed “optional” referring to VDD in Figure 5 on page 13
-Changed FMP_R option bit description in section 15.1 on page 124
-Added “CLEARING ACTIVE INTERRUPTS OUTSIDE INTERRUPT ROUTINE” on page 132
131/133
ST7LITE2
Date
07-Jul-06
132/133
Revision
Description of Changes
4
Added 300K read/write cycles for EEPROM on first page
Updated section 4.4 on page 13 and modified note 5 and Figure 5
Added note 2 in “EXTERNAL INTERRUPT CONTROL REGISTER (EICR)” on page 36 and
changed “External Interrupt Function” on page 46
Modified read operation section in “MEMORY ACCESS” on page 16
Added note to section 7.1 on page 23
Modified one note in section 7.1 on page 23
Modified Table 4, “ST7 Clock Sources,” on page 26
Added note on illegal opcode reset to section 7.5.1 on page 27
Added note to section 7.6.1 on page 29
Changed note below Figure 8 on page 17 and the last paragraph of “ACCESS ERROR HANDLING” on page 18
In section 11.2.6 on page 60, modified description of OE bits in the PWMCR register (added
“after an overflow event”).
Added important note to section 11.4.3.3 on page 73
Changed section 13.3.1 on page 93 (fOSC or fCLKIN replaced by fCPU and frequency values
changed accordingly)
Added note 1 and modified note 3 in section 13.3.4.1 on page 95 and section 13.3.4.2 on page
96 and changed table titles
Added “Crystal and Ceramic Resonator Oscillators” on page 102
Changed IS value and note 2 in section 13.8.1 on page 106
Updated section 14.2 on page 121
Added note to Figure 67 on page 106
Changed notes 1 and 2 to Table 21, “THERMAL CHARACTERISTICS,” on page 120 and added RthJA value for DIP20 package
Changed Figure 84, Figure 85 on page 112 (and notes) and removed EMC protection circuitry
in Figure 85 on page 112 (device works correctly without these components)
Added note 2 to opt 4 (option byte 2) in section 15.1 on page 122
Modified section 14.2 on page 121
Changed section 15.3 on page 126
Added section 16.7 on page 130
Changed LTICR reset value in Table 2, “Hardware Register Map,” on page 10
Modified “caution” in section 8.2 on page 34
Replaced bit1 by bit2 for AWUF bit in AWUCSR description in section 9.6.0.1 on page 45
Modified section 10.2.1.1 on page 46
Changed order of Section 11.3.3.2 and section 11.3.3.3 on page 66 and removed two paragraphs before section 11.3.4 on page 67
Added note 3 to section 13.3.2 on page 94
Modified section 13.10 on page 113: changed th(MO) and tv(MO), as well as tsu(SS) and th (SS)
values and added note 4. The change made to tsu(SS) and th (SS) values applies from silicon
rev B of this product.
Changed tw(JIT) value in section 13.3.4.1 on page 95 and section 13.3.4.2 on page 96
Added note to section 13.5.2 on page 101
Changed LTCSR2 reset value in section 11.3.6 on page 67
Modified Figure 84 and Figure 85 on page 112
Added note 1 to the max column in table “ADC Accuracy with VDD=5.0V” on page 116 and
modified the content of this note.
ST7LITE2
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
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