TClamp3302N Low Capacitance TVS for Ethernet and Telecom Interfaces PROTECTION PRODUCTS - TransClampΤΜ Description Features Transient protection for high-speed data lines to A TransClampΤΜ is a low capacitance TVS array designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and Lightning. These devices integrate low capacitance, surge-rated compensation diodes with a high power transient voltage suppressor (TVS). The compensation diodes are arranged in a bridge pattern allowing the device to be connected in common mode and/or differential mode. This allows the designer maximum flexibility and reduces parts count. The capacitance of the device is limited to 12pF maximum from line-to-line to ensure correct signal transmission on high-speed lines. These devices may be used to meet Telcordia GR-1089CORE short-haul (intra-building) surge requirements and will withstand a minimum 100 A surge for a 2/10µs pulse. The TClampTM3302N is in a 10-pin, RoHS/WEEE compliant, SLP2626P10 package. It measures 2.6 x 2.6 x 0.60mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They are particularly well suited for applications where board space is at a premium such as integrated connectors/ magnetics and carrier class Ethernet equipment. Bellcore 1089 (Intra-Building) 100A (2/10µs) IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) L5, 95A (8/20µs) Low capacitance (12pF line-to-line) Low operating voltages (3.3V) Low clamping voltage Small SLP Package saves board space Solid-state technology Mechanical Characteristics SLP2626P10 10L package RoHS/WEEE Compliant Nominal Dimensions: 2.6 x 2.6 x 0.60 mm Lead Pitch: 0.5mm Molding compound flammability rating: UL 94V-0 Marking: Marking Code Packaging: Tape and Reel Applications Circuit Diagram 10/100/1000 Ethernet T3/E3 Integrated Magnetics Carrier Class Equipment Customer Premise Equipment Package Configuration 2.60 1 2 LINE 1 CL (1, 2, 3) CL 2.60 Center Tab 0.50 BSC 0.60 LINE 2 (8, 9, 10) 10 Pin SLP package (Bottom Side View) Nominal Dimensions in mm Revision 01/17/2008 1 www.semtech.com TClamp3302N PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 2/10µs) Ppk 2500 Watts Peak Pulse Current (tp = 2/10µs) IPP 120 A Peak Pulse Current (tp = 8/20µs) IPP 95 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD 30 30 kV TJ -40 to +85 °C TSTG -55 to +150 °C Operating Temperature Storage Temperature Electrical Characteristics (T=25oC unless otherwise specified) TClamp3302N Parameter Symbol Conditions VRWM T=25°C to 85°C Punch-Through Voltage VPT IPT = 2µA T=25°C 3.5 V Snap-Back Voltage VSB ISB = 50mA 2.8 V Reverse Leakage Current IR VRWM = 3.3V, T=25°C 1 µA Clamping Voltage VC IPP = 100A, tp = 2/10µs Line-to-Ground 22 V Clamping Voltage VC IPP = 100A, tp = 2/10µs Line-to-Line 25 V Junction Capacitance Cj Between I/O pins and Gn d VR = 0V, f = 1MHz 25 pF Between I/O pins VR = 0V, f = 1MHz 12 pF Reverse Stand-Of f Voltage 2008 Semtech Corp. 2 Minimum Typical Maximum Units 3.3 V www.semtech.com TClamp3302N PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 100 110 % of Rated Power or IPP Peak Pulse Power - PPP (kW) 100 10 1 90 80 70 60 50 40 30 20 10 0 0.1 0.1 1 10 100 0 1000 25 Normalized Junction Capacitance vs. Reverse Voltage (Line-to-Line) 75 100 125 150 Normalized Junction Capacitance vs. Reverse Voltage (Line-to-Ground) 1.5 1.5 f = 1 MHz 1.4 1.4 1.3 CJ (VR) / CJ (VR=0) 1.3 CJ (VR) / CJ (VR=0) 50 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) 1.2 1.1 1 0.9 0.8 1.2 1.1 1 0.9 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0 0.5 1 1.5 2 2.5 Reverse Voltage - VR (V) 3 3.5 f = 1 MHz 0 Clamping Voltage vs. Peak Pulse Current 0.5 1 1.5 2 2.5 Reverse Voltage - VR (V) 3 3.5 Normalized Junction Capacitance vs. Temperature 24 1.4 22 1.2 Line - to - Line 18 1 Cj (T) /Cj (25oC) Clamping Voltage - V C (V) 20 16 14 12 Line - to - Ground 10 8 0.8 0.6 0.4 6 Waveform Parameters: tr = 2µs td = 10µs 4 2 0.2 0 0 0 10 20 30 40 50 60 70 80 90 100 0 110 2008 Semtech Corp. 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 Temperature - Ta ( C ) Peak Pulse Current - IPP (A) 3 www.semtech.com TClamp3302N PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) Analog Crosstalk (Each Line) CH1 S21 LOG 20 dB /REF 0 dB 1: -16.912 dB 900 MHz 2: -10.401 dB 1.8 GHz 3: -8.2212 dB 2.5 GHz 0 dB 4: -3.21 dB 259 MHZ 4 -6 dB 3 -12 dB 2 -18 dB 1 -24 dB -30 dB -36 dB 1 MHz 10 MHz 100 MHz START . 030 MHz 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz ESD Clamping (+8kV per IEC 61000-4-2) ESD Clamping (-8kV per IEC 61000-4-2) Note: Data is taken with a 10x attenuator 2008 Semtech Corp. STOP 3000. 000000 MHz Note: Data is taken with a 10x attenuator 4 www.semtech.com TClamp3302N PROTECTION PRODUCTS Applications Information Circuit Diagram Device Connection Options for Protection of Two High-Speed Data Lines LINE 1 These devices are designed to protect two high-speed data lines (one differential pair) from transient overvoltages which result from lightning and ESD. They can be configured to protect in differential (Line-to-Line) and common (Line-to-Ground) mode. Data line inputs/ outputs are connected at pins 1, 2 and 3, and 8, 9 and 10 as shown. For proper operation, pins 1 - 3 must be connected together and pins 8 - 10 must be connected together. Pins 4, 5, 6, and 7 may be left unconnected. For differential operation, the center tab is also left not connected. For common mode operation, the center tab is connected to ground. The ground connection should be made directly to a ground plane on the board for best results. The use of multiple vias is recommended for reduced ground loop inductance. (1, 2, 3) Center Tab LINE 2 (8, 9, 10) Pin Conf iguration (T op Side Vie w) Configuration (Top View) Short-Haul/Intrabuilding Immunity Requirements for Ethernet-based Systems 1 2 The accelerating demand for bandwidth-hungry services such as Voice over IP, Metropolitan Area Networks (MAN), Ethernet over telecommunications backplanes, and broadband to the home are driving the deployment of high-reliability carrier and enterprise class Ethernet-based systems. These systems require the robust protection of external ports from transient voltage events such as lightning, electrostatic discharge, and cable discharge events. Each new generation of Ethernet deployment yields higherdensity boards that demand protection solutions that occupy less board space. The Telcordia Technologies (Bellcore) GR-1089-CORE specification defines a set of requirements for lightning and AC power cross immunity for intrabuilding equipment. The lightning tests are applied as metallic (lineto-line) or longitudinal (line-to-ground) waveforms. The waveforms are defined with a rise time of 2µs and a decay time of 10µs with a short circuit current of 100A. One surge of positive and one of negative polarity are applied. To pass the test, the equipment must continue to operate after the test. If a 2/10µs generator is unavailable, then a 8/20µs waveform may be applied with additional series resistance (6Ω metallic, 12Ω longitudinal). 2008 Semtech Corp. 3 4 5 5 GND 10 9 8 7 6 Pin Identification 1, 2, 3 Line 1 in/out 8, 9, 10 Line 2 in/out 4, 5, 6, 7 N o Connect Center Tab Ground www.semtech.com TClamp3302N PROTECTION PRODUCTS Typical Applications Rs TClamp3302N Rs Rs MagJack TClamp3302N Rs Rs TClamp3302N Rs Rs TClamp3302N Rs Note: Rs = 2 Ohm, 1% tolerance Schematic Diagram for Telcordia GR-1089 Intra-Building Protection Gigabit Ethernet with Magjack Rs TClamp3302N TClamp3302N 1 2 1 2 Rs TClamp3302N TClamp3302N 1 2 1 2 Rs TClamp3302N TClamp3302N 1 2 1 2 Rs TClamp3302N TClamp3302N 1 2 1 2 Rs Note: Rs = 2 Ohm, 1% tolerance Layout Diagram for Telcordia GR- 1089 Intra-Building Protection Gigabit Ethernet 2008 Semtech Corp. 6 www.semtech.com TClamp3302N PROTECTION PRODUCTS Applications Information - Spice Model TClamp3302N Spice Model & Parameters D2 D3 D1 D2 D3 TClamp3302N Spice Model TClamp3302N Spice Parameters 2008 Semtech Corp. Parameter Unit D1 (T VS) D2 (LCR D) D3 (LCR D) IS Amp 1.4E-11 1.001E-20 1.001E-20 BV Volt 3.3 150 150 VJ Volt 8 0.59 0.59 RS Ohm 0.04 0.075 0.05 IB V Amp 1E-3 1E-3 1E-3 CJO Farad 400e-12 11.0E-12 11.0E-12 TT sec 2.541E-9 2.541E-9 2.541E-9 M -- 0.256 0.01 0.01 N -- 1.1 1.1 1.1 EG eV 1.11 1.11 1.11 7 www.semtech.com TClamp3302N PROTECTION PRODUCTS Outline Drawing - SLP2626P10 A B D DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C A2 C A1 D1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .024 .026 0.50 0.60 0.65 .000 .001 .002 0.00 0.03 0.05 (.007) (0.17) .007 .010 .012 0.20 0.25 0.30 .098 .102 .106 2.50 2.60 2.70 .079 .085 .089 2.00 2.15 2.25 .098 .102 .106 2.50 2.60 2.70 .044 .050 .054 1.11 1.26 1.36 .020 BSC 0.50 BSC .011 .014 .016 0.30 0.35 0.40 10 10 .003 0.08 .004 0.10 C 1 2 L E/2 CL E1 LxN e N bxN D/2 bbb C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP2626P10 X P Z F G (C) DIM B C F G P X Y Z DIMENSIONS INCHES MILLIMETERS .081 2.05 .100 2.50 .050 1.26 .073 1.85 .020 0.50 .012 0.30 .025 0.65 .124 3.15 Y B NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2008 Semtech Corp. 8 www.semtech.com TClamp3302N PROTECTION PRODUCTS Marking Ordering Information 3302N YYWW Part Number Qty per Reel Reel Size TClamp3302N.TCT 3,000 7 Inch Note: Lead finish is lead-free NiPdAu TransClamp and TClamp are marks of Semtech Corporation YY = year WW = Week Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 2.77 +/-0.10 mm B0 K0 2.77 +/-0.10 mm Tape Width B, (Max) D 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm 0.80 +/-0.10 mm D1 E 1.0 mm ±0.05 1.750±.10 mm F K (MAX) P P0 P2 T(MAX) 3.5±0.05 mm 2.4 mm 4.0±0.1 mm 4.0±0.1 mm 2.0±0.05 mm 0.4 mm W 8.0 mm + 0.3 mm - 0.1 mm Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2008 Semtech Corp. 9 www.semtech.com