ETC TD8208

深圳市鑫远志电子有限公司　电话：０７５５－８２７２７７７２　８２５１８７１１
General Description Features TD8208 is a high efficiency, current‐mode control Boost DC to DC regulator with an integrated 120mΩ RDS(ON) N‐channel MOSFET. The fixed 1MHz switching frequency and internal compensation reduce external component count and save the PCB space. The build‐in internal soft start circuitry minimizes the inrush current at start‐up. z
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TD8 208
Wide input range:2‐6V 1MHz switching frequency Minimum on time: 100ns typical Minimum off time: 100ns typical Max output voltage: 6V Low RDS(0N): 120mΩ RoHS Compliant and Halogen Free Compact package: SOT23‐6 Applications z
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Cell Phone and Smart Phone PDA, PMP, MP3 Digital Camera Package Types SOT23­6 Figure 1. Package Types of TD8208 1
深圳市鑫远志电子有限公司　电话：０７５５－８２７２７７７２　８２５１８７１１
TD8 208
Pin Configurations Figure 2 Pin Configuration of TD8208(Top View) Pin Description Pin Name
Description
1
LX
Inductor node. Connect an inductor between IN pin and LX pin. 2
GDN
GND 3
FB
Feedback pin. Connect a resistor R1 between VOUT and FB, and a resistor R2 between FB and GND to program the output voltage: VOUT=0.6V*(R1/R2+1) 4
EN
Enable control. High to turn on the part. Don’t leave it floated. 5
IN
Power Input pin. 6
NC
Pin Number
Ordering Information TD8208 □
□ Circuit Type Packing:
Blank：Tube
R:Type and Reel
BLANK
SOT23-6
2
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TD8 208
Function Block Figure 3 Function Block Diagram of TD8208 3
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TD8 208
Absolute Maximum Ratings EN, VDD, LX‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐7V FB‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐3.6V Power Dissipation, PD @ TA = 25°C, SOT23‐6 ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 0.6W Package Thermal Resistance (Note 2) SOT23‐6, θJA ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 200°C/W SOT23‐6, θJC ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 130°C/W Junction Temperature Range ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 125°C Lead Temperature (Soldering, 10 sec.) ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 260°C Storage Temperature Range ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ ‐65°C to 150°C Recommended Operating Conditions VDD pin‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 2V to 6V FB‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 0V to 1V Junction Temperature Range ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ ‐40°C to 125°C Ambient Temperature Range ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ ‐40°C to 85°C 4
TD8 208
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Electrical Characteristics (VIN = 3.3V, VOUT=5V, IOUT=100mA, TA = 25°C unless otherwise specified)
Parameters
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Input Voltage Range VIN 2 6 V Quiescent Current IQ VFB=0.66V 200 µ A Low Side Main FET Rds(on) 120 mΩ Main FET Current ILIM1 3 A Switching Frequency Fsw 0.8 1 1.2 MHz Feedback Reference VREF 0.588 0.6 0.612 V IN UVLO Rising VIN,UVLO 1.9 V Thermal Shutdown TSD 150 °C 5
TD8 208
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Typical Performance Characteristics 6
TD8 208
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7
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TD8 208
8
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TD8 208
Typical Application Circuit 9
TD8 208
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Function Description Because of the high integration in the TD8208 IC, the application circuit based on this regulator IC is rather simple. Only input capacitor CIN, output capacitor COUT, inductor L and feedback resistors (R1 and R2) need to be selected for the targeted applications specifications. Feedback resistor dividers R1 and R2: Choose R1 and R2 to program the proper output voltage. To minimize the power consumption under light loads, it is desirable to choose large resistance values for both R1 and R2. A value of between 10k and 1M is recommended for both resistors. If R1=200k is chosen, then R2 can be calculated to be: Output capacitor COUT: The output capacitor is selected to handle the output ripple noise requirements. Both steady state ripple and transient requirements must be taken into consideration when selecting this capacitor. For the best performance, it is recommended to use X5R or better grade ceramic capacitor with 25V rating and more than two pcs 10uF capacitor. Input capacitor CIN: The ripple current through input capacitor is calculated as: To minimize the potential noise problem, place a typical X5R or better grade ceramic capacitor really close to the VDD and GND pins. Care should be taken to minimize the loop area formed by CIN, and VDD/GND pins. In this case a 22uF low ESR ceramic capacitor is recommended. Boost inductor L: There are several considerations in choosing this inductor. 1) Choose the inductance to provide the desired ripple current. It is suggested to choose the ripple current to be about 40% of the maximum average input current. The inductance is calculated as: where FSW is the switching frequency and IOUT,MAX is the maximum load current. The TD8208 regulator IC is quite tolerant of different ripple current amplitude. Consequently, the final choice of inductance can be slightly off the calculation value without significantly impacting the performance. 2) The saturation current rating of the inductor must be selected to be greater than the peak inductor current under full load conditions. 3) The DCR of the inductor and the core loss at the switching frequency must be low enough to achieve the desired efficiency requirement. It is desirable to choose an inductor with DCR<50mohm to achieve a good overall efficiency. Enable Operation Pulling the EN pin low (<0.4V) will shut down the device. During the shut down mode, the TD8208 shut down current drops to lower than 1uA, Driving the EN pin high (>2.0V) will turn on the IC again. Diode Selection Schottky diode is a good choice for high efficiency operation because of its low forward voltage drop and fast reverse recovery. The current rating of the diode must meet following:
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The schottky diode reverse breakdown voltage should be larger than the output voltage. Layout Design: The layout design of TD8208 regulator is relatively simple. For the best efficiency and minimum noise problems, we should place the following components close to the IC: CIN, L, R1 and R2. 1) It is desirable to maximize the PCB copper area connecting to GND pin to achieve the best thermal and noise performance. If the board space allowed, a ground plane is highly desirable. 2) CIN must be close to Pins IN and GND. The loop area formed by CIN and GND must be minimized. TD8 208
3) The PCB copper area associated with LX pin must be minimized to avoid the potential noise problem. 4) The components R1 and R2, and the trace connecting to the FB pin must NOT be adjacent to the LX net on the PCB layout to avoid the noise problem. 5) If the system chip interfacing with the EN pin has a high impedance state at shutdown mode and the IN pin is connected directly to a power source such as a Li‐Ion battery, it is desirable to add a pull down 1Mohm resistor between the EN and GND pins to prevent the noise from falsely turning on the regulator at shutdown mode. 11
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TD8 208
Package Information SOT23­6 Package Outline Dimensions 12