INTEGRATED CIRCUITS DATA SHEET TDA3681 Multiple voltage regulator with switch and ignition buffer Product specification Supersedes data of 2001 Aug 24 2002 Apr 10 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer FEATURES • ESD protection on all pins General • Thermal protections TDA3681 • Load dump protection • Extremely low noise behaviour and good stability with very small output capacitors • Foldback current limit protection for regulators 1, 2, 3 and 4 • Second supply pin for regulators 3 and 4 to reduce power dissipation (e.g. via a DC-to-DC converter) • Delayed second current limit protection for the power switch (at short-circuit) • Three VP-state controlled regulators (regulators 1, 3 and 4) and a power switch • The regulator outputs and the power switch are DC short-circuit safe to ground and supply (VP). • Regulator 2, reset and ignition buffer operational during load dump and thermal shutdown • Combined control pin for switching regulators 1 and 3 GENERAL DESCRIPTION • Separate control pins for switching regulator 4 and the power switch The TDA3681 is a multiple output voltage regulator with a power switch and an ignition buffer. It is intended for use in car radios with or without a microcontroller. The TDA3681 contains the following: • Supply voltage range from −18 to +50 V • Low quiescent current in standby mode (when regulators 1, 3 and 4 and power switch are switched off and ignition input is low) • Four fixed voltage regulators with a foldback current protection (regulators 1, 2, 3 and 4). Regulator 2, which is intended to supply a microcontroller, also operates during load dump and thermal shutdown • Hold output for low VP (regulators 1, 3 and 4 and power switch off) • Regulators 3 and 4 have a second supply pin that can be connected to a lower supply voltage (>6.5 V) to reduce the power dissipation • Hold output when one of regulators 1 and 3 and/or 4 is out of regulation • Hold output for foldback mode of power switch and regulators 1, 3 and 4 • A power switch with protection, operated by a control input • Hold output for load dump and temperature protection • Reset and hold outputs that can be used to interface with the microcontroller; the reset signal can be used to call up the microcontroller • Reset (push-pull output stage) for regulator 2 and hold output (open-collector output) • Adjustable reset delay time • Both supply pins can withstand load dump pulses and negative supply voltages • High supply voltage ripple rejection • Regulator 2, which is in regulation at a backup voltage above 6.5 V • Backup capacitor for regulator 2 • One independent ignition buffer (active HIGH). • A provision for the use of a reserve supply capacitor that will hold enough energy for regulator 2 (5 V continuous) to allow a microcontroller to prepare for loss of voltage Protections • Reverse polarity safe (down to −18 V without high reverse current) • An ignition input Schmitt trigger with push-pull output stage. • Able to withstand voltages up to 18 V at the outputs (supply line may be short-circuited) ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA3681J DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3 TDA3681JR DBS17P plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) SOT475-1 TDA3681TH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 2002 Apr 10 2 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VP1 supply voltage 1 operating reverse polarity non-operating regulator 2 on VP2 9.5 14.4 18 V − − 18 V 4 14.4 50 V jump start t ≤ 10 minutes − − 30 V load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − − 50 V 6.5 14.4 18 V supply voltage 2 operating reverse polarity non-operating regulator 2 on jump start load dump protection Iq(tot) total quiescent supply current Tj junction temperature t ≤ 10 minutes − − 18 V 0 − 50 V − − 30 V t ≤ 50 ms; tr ≥ 2.5 ms − − 50 V standby mode − 110 150 µA − − 150 °C Voltage regulators Vo(REG1) output voltage of regulator 1 1 mA ≤ IREG1 ≤ 600 mA; VP = 14.4 V 8.0 8.5 9.0 V Vo(REG2) output voltage of regulator 2 1 mA ≤ IREG2 ≤ 300 mA; VP = 14.4 V 4.75 5.0 5.25 V Vo(REG3) output voltage of regulator 3 1 mA ≤ IREG3 ≤ 1400 mA; VP = 14.4 V 4.75 5.0 5.25 V Vo(REG4) output voltage of regulator 4 1 mA ≤ IREG4 ≤ 1 A; VP = 14.4 V 3.14 3.3 3.46 V ISW = 1 A; VP1 = 13.5 V − 0.45 0.65 V ISW = 1.8 A; VP1 = 13.5 V − 1.0 1.8 V 3 − − A Power switch Vdrop(SW) IM(SW) 2002 Apr 10 drop-out voltage peak current 3 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 BLOCK DIAGRAMS handbook, full pagewidth VP1 ENSW (14.4 V) 17 11 POWER SWITCH 16 (14 V/ 3 A) SW TEMPERATURE LOAD DUMP PROTECTION & (14 V/ 14 100 mA) BACKUP SWITCH BU BACKUP CONTROL 15 REGULATOR 2 VP2 (5 V/ 300 mA) REG2 3 (3.3 V/ 4 1 A) REGULATOR 4 & REG4 9 EN4 2 REGULATOR 3 & (5 V/ 1400 mA) REG3 TDA3681J TDA3681JR (8.5 V/ 1 600 mA) REGULATOR 1 & REG1 10 EN1/3 12 + OR & 7 CRES IGNITION BUFFER 6 13 GND Fig.1 Block diagram of TDA3681J and TDA3681JR. 2002 Apr 10 RES 8 5 IGNIN HOLD 4 MGL902 IGNOUT Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 handbook, full pagewidth VP1 ENSW (14.4 V) 14 8 POWER SWITCH 16 (14 V/ 3 A) SW TEMPERATURE LOAD DUMP PROTECTION & (14 V/ 13 100 mA) BACKUP SWITCH BU BACKUP CONTROL 12 REGULATOR 2 VP2 (5 V/ 300 mA) REG2 20 (3.3 V/ 1 1 A) REGULATOR 4 & REG4 6 EN4 HEATTAB n.c. n.c. 11 15 18 19 REGULATOR 3 & (5 V/ 1400 mA) REG3 TDA3681TH (8.5 V/ 17 600 mA) REGULATOR 1 & REG1 7 EN1/3 9 + OR & 4 CRES IGNITION BUFFER 3 10 GND Fig.2 Block diagram of TDA3681TH. 2002 Apr 10 RES 5 2 IGNIN HOLD 5 MGU353 IGNOUT Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 PINNING Pin description of TDA3681J and TDA3681JR SYMBOL PIN handbook, halfpage DESCRIPTION REG1 1 REG3 2 VP2 3 regulator 4 output REG4 4 5 ignition input IGNIN 5 IGNOUT 6 ignition output (active HIGH) IGNOUT 6 RES 7 reset output (active LOW) RES 7 CRES 8 reset delay capacitor CRES 8 EN4 9 enable input for regulator 4 EN4 9 EN1/3 10 enable input for regulators 1 and 3 ENSW 11 enable input for power switch HOLD 12 hold output (active LOW) ENSW 11 GND 13 ground HOLD 12 BU 14 backup switch output REG2 15 regulator 2 output SW 16 power switch output VP1 17 supply voltage heat tab − heat tab; it is strongly recommended to connect the heat tab to ground REG1 1 regulator 1 output REG3 2 regulator 3 output VP2 3 second supply voltage REG4 4 IGNIN EN1/3 10 GND 13 BU 14 REG2 15 SW 16 VP1 17 MGL903 Fig.3 2002 Apr 10 TDA3681J TDA3681JR 6 Pin configuration for TDA3681J and TDA3681JR. Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 Pin description of TDA3681TH SYMBOL PIN DESCRIPTION REG4 1 regulator 4 output IGNIN 2 ignition input IGNOUT 3 ignition output (active HIGH) RES 4 reset output (active LOW) CRES 5 reset delay capacitor EN4 6 enable input for regulator 4 EN1/3 7 enable input for regulators 1 and 3 ENSW 8 enable input for power switch HOLD 9 hold output (active LOW) GND 10 ground HEATTAB 11 heat tab connection; note 1 REG2 12 regulator 2 output BU 13 backup switch output VP1 14 supply voltage n.c. 15 not connected SW 16 power switch output REG1 17 regulator 1 output n.c. 18 not connected REG3 19 regulator 3 output VP2 20 second supply voltage handbook, halfpage 1 REG4 REG3 19 2 IGNIN n.c. 18 3 IGNOUT REG1 17 4 RES 5 CRES n.c. 15 6 EN4 VP1 14 7 EN1/3 BU 13 8 ENSW REG2 12 9 HOLD SW 16 TDA3681TH 10 GND HEATTAB 11 MGU329 Fig.4 Pin configuration for TDA3681TH. Note 1. The pin is used for final test purposes. In the application it should be connected directly to ground. 2002 Apr 10 VP2 20 7 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer FUNCTIONAL DESCRIPTION Therefore, regulator 1 is the most critical regulator with respect to an out of regulation condition caused by a low battery voltage. The TDA3681 is a multiple output voltage regulator with a power switch, intended for use in car radios with or without a microcontroller. Because of the low voltage operation of the car radio, low voltage drop regulators are used. The hold function includes hysteresis to avoid oscillations when the regulator voltage crosses the hold threshold level. The hold output also becomes active when the power switch is in foldback protection mode, see Fig.8. The block diagram of the hold function is illustrated in Fig.5. Regulator 2 is in regulation when the backup voltage exceeds 6.5 V for the first time. When regulator 2 is switched on and its output voltage is within its voltage range, the reset output is disabled to release the microcontroller. The reset delay time before release can be extended by an external capacitor (CRES). This start-up feature is included to secure a smooth start-up of the microcontroller at first connection, without uncontrolled switching of regulator 2 during the start-up sequence. All output pins are fully protected. The regulators are protected against load dump (regulators 1, 3 and 4 switch off at supply voltages >18 V) and short-circuit (foldback current protection). The power switch contains a current protection. However, this protection is delayed at short-circuit by the reset delay capacitor (it should be noted that this is the second function of the reset delay capacitor CRES). During this time, the output current is limited to a peak value of at least 3 A (after a delay, the power switch can deliver 1.8 A continuous if VP ≤ 18 V). The charge on the backup capacitor can be used to supply regulator 2 for a short period when the external supply voltage drops to 0 V (the time depends on the value of the backup capacitor). The output stages of all switchable regulators have an extremely low noise behaviour and good stability, even for small values of the output capacitors. In a normal situation, the voltage on the reset delay capacitor is approximately 3.5 V (depending on the temperature). The power switch output is approximately VP − 0.4 V. At operating temperature, the power switch can deliver at least 3 A. At high temperature, the switch can deliver approximately 2 A. When both regulator 2 and the supply voltages (VP1 and VP2 > 4.5 V) are available, regulators 1 and 3 can be operated by means of one enable input. Regulator 4 and the power switch have a separate enable input. During an overload condition or a short circuit (VSW < VP − 3.7 V), the voltage on the reset delay capacitor rises 0.6 V above the voltage of regulator 2. This rise time depends on the capacitor connected to pin CRES. During this time, the power switch can deliver more than 3 A. When regulator 2 is out of regulation and generates a reset, the power switch can only deliver 2 A and will immediately go into foldback protection. Pin HOLD is normally HIGH but is active LOW. Pin HOLD is connected to an open-collector NPN transistor and must have an external pull-up resistor to operate. The hold output is controlled by a low voltage detection circuit which, when activated, pulls the hold output LOW (enabled). The hold outputs of the regulators are connected to an OR gate inside the IC so that the hold circuit is activated when one or more regulators (1, 3 or 4) are out of regulation for any reason. Each regulator enable input controls its own hold triggering circuit, so that if a regulator is disabled or switched off, the hold circuit for that regulator is disabled. At supply voltages >17 V, the power switch is clamped at 16 V maximum (to avoid externally connected circuits being damaged by an overvoltage) and the power switch will switch off at load dump. Interfacing with the microcontroller (simple full or semi on/off logic applications) can be realized with an independent ignition Schmitt trigger and ignition output buffer (push-pull output). The hold circuit is also controlled by the temperature and load dump protection. Activating the temperature or load dump protection causes a hold (LOW) during the time that the protection is activated. When all regulators are switched off, the hold output is controlled by the battery line VP1, temperature protection and load dump protection. The timing diagrams are illustrated in Figs 6 and 7. The second supply voltage VP2 is used for the switchable regulators 3 and 4. This input can be connected to a lower supply voltage of ≥6 V to reduce the power dissipation of the TDA3681. A DC-to-DC converter could be used for this purpose. The hold circuit is enabled at low battery voltages. This indicates that it is not possible to get regulator 1 into regulation when switching it on: regulator 1 has the highest output voltage (8.5 V) of all switchable regulators. 2002 Apr 10 TDA3681 8 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer handbook, full pagewidth VP1 TDA3681 low battery detector internal voltage reference 1 internal voltage reference 2 TDA3681 output stage REG1 enable output of regulation detector EN1/3 REGULATOR 1 output stage REG3 enable output of regulation detector & OR REGULATOR 3 output stage REG4 OR HOLD enable output of regulation detector EN4 REGULATOR 4 buffer TEMPERATURE PROTECTION LOAD DUMP POWER SWITCH FOLDBACK MODE MGL904 Fig.5 Block diagram of the hold circuit. 2002 Apr 10 9 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 load dump handbook, full pagewidth VP1 VBU regulator 2 6.5 V 5.4 V 5.0 V 0V reset delay capacitor reset 5.0 V 3.0 V 0V 5.0 V Back-up Schmitt trigger and reset behaviour load dump VP1 = VP2 50 V ignition input 0V −100 V ignition output 5.0 V 0V Enable Schmitt trigger ignition >22 V VP1 = VP2 enable regulator 4 >1.8 V <1.3 V >1.8 V enable regulator 1/3 <1.3 V regulator 1 and 3 regulator 4 temperature active protection 150 °C passive HOLD HIGH LOW Hold behaviour Fig.6 Timing diagram of ignition Schmitt triggers and hold circuit. 2002 Apr 10 10 MGL905 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 load dump handbook, full pagewidth 18 V VP1 = VP2 8.9 V 7.0 V 4.0 V ≥1.8 V enable regulator 1/3 1.3 V 8.5 V regulator 1 0V 5.0 V regulator 3 0V >1.8 V enable regulator 4 <1.3 V 3.3 V regulator 4 0V VP and enable Schmitt trigger load dump 16.9 V VP 7.0 V 4.0 V enable power switch >1.8 V <1.3 V 16 V power switch output 0V Power switch behaviour Fig.7 Timing diagram of regulators and power switch. 2002 Apr 10 11 MGL906 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP1 PARAMETER CONDITIONS MAX. UNIT supply voltage 1 operating VP2 MIN. − 18 V reverse polarity non-operating − 18 V jump start t ≤ 10 minutes − 30 V load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − 50 V supply voltage 2 − 18 V reverse polarity non-operating − 18 V jump start t ≤ 10 minutes − 30 V load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − 50 V − 62 W non-operating −55 +150 °C operating Ptot total power dissipation Tstg storage temperature Tamb ambient temperature operating −40 +85 °C Tj junction temperature operating −40 +150 °C THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth(j-c) thermal resistance from junction to case Rth(j-a) thermal resistance from junction to ambient CONDITIONS VALUE UNIT 2 K/W 50 K/W in free air QUALITY SPECIFICATION In accordance with “General Quality Specification For Integrated Circuits (SNW-FQ-611D)”. 2002 Apr 10 12 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 CHARACTERISTICS VP = VP1 =VP2 = 14.4 V; Tamb = 25 °C; measured in test circuits of Figs 10 and 11; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VP1 supply voltage 1 operating VP2 9.5 14.4 18 V reverse polarity non-operating − − 18 V regulator 2 on note 1 4 14.4 50 V jump start t ≤ 10 minutes − − 30 V load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − − 50 V 6.5 14.4 18 V supply voltage 2 operating reverse polarity non-operating regulator 2 on − − 18 V 0 − 50 V jump start t ≤ 10 minutes − − 30 V load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − − 50 V Vbat(loaddump) battery overvoltage shutdown VP1 and/or VP2 18 20 22 V Iq(tot) VP = 12.4 V; note 2 − 105 145 µA VP = 14.4 V; note 2 − 110 150 µA 6.5 7.0 7.5 V total quiescent supply current Schmitt trigger for power supply (regulators 1, 3 and 4) Vth(r) rising threshold voltage VP1 rising Vth(f) falling threshold voltage VP1 falling Vhys hysteresis voltage 4.0 4.5 5.0 V − 2.5 − V Schmitt trigger for enable input (regulators 1, 3, 4 and power switch) Vth(r) rising threshold voltage 1.4 1.8 2.4 V Vth(f) falling threshold voltage 0.9 1.3 1.9 V Vhys hysteresis voltage IREG = ISW = 1 mA − 0.5 − V ILI input leakage current VEN = 5 V 1 5 20 µA Reset trigger level of regulator 2 Vth(r) rising threshold voltage VP1 rising; IREG1 = 50 mA; note 3 4.43 VREG2 − 0.15 VREG2 − 0.1 V Vth(f) falling threshold voltage VP1 falling; IREG1 = 50 mA; note 3 4.4 VREG2 − 0.25 VREG2 − 0.13 V Schmitt triggers for hold circuit output Vth(r)(REG1) rising threshold voltage of regulator 1 VP1 rising; note 3 − VREG1 − 0.15 VREG1 − 0.075 V Vth(f)(REG1) falling threshold voltage of regulator 1 VP1 falling; note 3 7.67 VREG1 − 0.35 − V Vhys(REG1) hysteresis voltage due to regulator 1 − 0.2 − V 2002 Apr 10 13 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer SYMBOL PARAMETER CONDITIONS TDA3681 MIN. TYP. MAX. UNIT Vth(r)(REG3) rising threshold voltage of regulator 3 VP2 rising; note 3 − VREG3 − 0.15 VREG3 − 0.075 V Vth(f)(REG3) falling threshold voltage of regulator 3 VP2 falling; note 3 4.3 VREG3 − 0.35 − V Vhys(REG3) hysteresis voltage due to regulator 3 − 0.2 − V Vth(r)(REG4) rising threshold voltage of regulator 4 VP2 rising; note 3 − VREG4 − 0.15 VREG4 − 0.075 V Vth(f)(REG4) falling threshold voltage of regulator 4 VP2 falling; note 3 2.7 VREG4 − 0.3 − V Vhys(REG4) hysteresis voltage due to regulator 4 − 0.15 − V Vth(r)(VP) rising threshold voltage of supply voltage VEN = 0 V 9.1 9.7 10.3 V Vth(f)(VP) falling threshold voltage of supply voltage VEN = 0 V 9.0 9.4 9.8 V Vhys(VP) hysteresis voltage of supply voltage VEN = 0 V − 0.3 − V Reset and hold buffer Isink(L) LOW-level sink current VRES ≤ 0.8 V; VHOLD ≤ 0.8 V 2 − − mA ILO output leakage current VP2 = 14.4 V; VHOLD = 5 V − 0.1 5 µA Isource(H) HIGH-level source current VP2 = 14.4 V; VRES = 5 V 240 400 900 µA tr rise time note 4 − 7 50 µs tf fall time note 4 − 1 50 µs Ich reset delay capacitor charge current VCRES = 0 V 2 4 8 µA Idch reset delay capacitor discharge current VCRES = 3 V; VP1 = VP2 = 4.3 V 1.0 1.6 − mA Vth(r)(RES) rising voltage threshold reset signal 2.5 3.0 3.5 V Vth(f)(RES) falling voltage threshold reset signal 1.0 1.2 1.4 V td(RES) delay reset signal CRES = 47 nF; note 5 20 35 70 ms td(SW) delay power switch foldback protection CRES = 47 nF; note 6 8 17.6 40 ms Reset delay Regulator 1 (IREG1 = 5 mA; unless otherwise specified) Vo(off) output voltage off Vo(REG1) output voltage − 1 400 mV 1 mA ≤ IREG1 ≤ 600 mA 8.0 8.5 9.0 V 9.5 V ≤ VP1 ≤ 18 V 8.0 8.5 9.0 V ∆Vline line regulation 9.5 V ≤ VP1 ≤ 18 V − 2 75 mV ∆Vload load regulation 1 mA ≤ IREG1 ≤ 600 mA − 20 85 mV 2002 Apr 10 14 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer SYMBOL PARAMETER CONDITIONS TDA3681 MIN. TYP. MAX. UNIT Iq quiescent current IREG1 = 600 mA − 25 60 mA SVRR supply voltage ripple rejection fi = 3 kHz; Vi = 2 V (p-p) 60 70 − dB Vdrop(REG1) drop-out voltage IREG1 = 550 mA; VP1 = 8.55 V; − note 7 0.4 0.7 V Im(REG1) current limit VREG1 > 7 V; note 8 0.65 1.2 − A Isc(REG1) short-circuit current RL ≤ 0.5 Ω; note 9 250 800 − mA 0.5 mA ≤ IREG2 ≤ 300 mA 4.75 5.0 5.25 V 7 V ≤ VP1 ≤ 18 V 4.75 5.0 5.25 V 18 V ≤ VP1 ≤ 50 V; IREG2 ≤ 150 mA 4.75 5.0 5.25 V 6 V ≤ VP1 ≤ 18 V − 2 50 mV 6 V ≤ VP1 ≤ 50 V − 15 75 mV 1 mA ≤ IREG2 ≤ 150 mA − 20 50 mV 1 mA ≤ IREG2 ≤ 300 mA − − 100 mV 50 55 − dB Regulator 2 (IREG2 = 5 mA; unless otherwise specified) Vo(REG2) output voltage ∆Vline line regulation ∆Vload load regulation SVRR supply voltage ripple rejection fi = 3 kHz; Vi = 2 V (p-p) Vdrop(REG2) drop-out voltage IREG2 = 100 mA; VP1 = 4.75 V; − note 7 0.4 0.6 V IREG2 = 200 mA; VP1 = 5.75 V; − note 7 0.8 1.2 V IREG2 = 100 mA; VBU = 4.75 V; − note 10 0.2 0.5 V IREG2 = 200 mA; VBU = 5.75 V; − note 10 0.8 1.0 V Im(REG2) current limit VREG2 > 4.5 V; note 8 0.32 0.37 − A Isc(REG2) short-circuit current RL ≤ 0.5 Ω; note 9 95 120 − mA − 1 400 mV 4.75 5.0 5.25 V Regulator 3 (IREG3 = 5 mA; unless otherwise specified) Vo(off) output voltage off Vo(REG3) output voltage 7 V ≤ VP1 and/or VP2 ≤ 18 V 4.75 5.0 5.25 V ∆Vline line regulation 7 V ≤ VP1 and/or VP2 ≤ 18 V − 2 50 mV ∆Vload load regulation 1 mA ≤ IREG3 ≤ 1400 mA − 20 150 mV 1 mA ≤ IREG3 ≤ 1400 mA Iq quiescent current IREG3 = 1400 mA − 19 45 mA SVRR supply voltage ripple rejection fi = 3 kHz; Vi = 2 V (p-p) 60 70 − dB Vdrop(REG3) drop-out voltage IREG3 = 1400 mA ; VP2 = 6 V; note 7 − 1 1.5 V Im(REG3) current limit VREG3 > 4.5 V; note 8 1.5 1.7 − A Isc(REG3) short-circuit current RL ≤ 0.5 Ω; note 9 430 750 − mA 2002 Apr 10 15 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer SYMBOL PARAMETER CONDITIONS TDA3681 MIN. TYP. MAX. UNIT Regulator 4 (IREG4 = 5 mA; unless otherwise specified) Vo(off) output voltage off Vo(REG4) output voltage − 1 400 mV 1 mA ≤ IREG4 ≤ 1 A 3.14 3.3 3.46 V 6.5 V ≤ VP1 and/or VP2 ≤ 18 V 3.14 3.3 3.46 V ∆Vline line regulation 6.5 V ≤ VP1 and/or VP2 ≤ 18 V − 2 50 mV ∆Vload load regulation 1 mA ≤ IREG4 ≤ 1 A − 20 50 mV Iq quiescent current IREG4 = 1 A − 15 40 mA SVRR supply voltage ripple rejection fi = 3 kHz; Vi = 2 V (p-p) 60 70 − dB Vdrop(REG4) drop-out voltage IREG4 = 1 A; VP2 = 5 V; note 7 − 1.7 2.4 V Im(REG4) current limit VREG4 > 3.0 V; note 8 1.1 1.5 − A Isc(REG4) short-circuit current RL ≤ 0.5 Ω; note 9 470 750 − mA drop-out voltage ISW = 1 A; VP1 = 13.5 V; note 11 − 0.45 0.65 V ISW = 1.8 A; VP1 = 13.5 V; note 11 − 1.0 1.8 V Power switch Vdrop(SW) IDC(SW) continuous current VP1 = 16 V; VSW = 13.5 V 1.8 2.0 − A Vclamp(SW) clamping voltage VP1 ≥ 17 V; 1 mA < ISW < 1.8 A 13.5 15.0 16.0 V IM(SW) peak current VP1 < 17 V; notes 6, 12 and 13 3 − − A Vfb(SW) flyback voltage behaviour ISW = −100 mA − VP1 + 3 22 V Isc(SW) short-circuit current VP1 = 14.4 V; VSW < 1.2 V; note 13 0.5 1.7 − A 0.3 0.35 − A Backup switch IDC(BU) continuous current VBU > 5 V Vclamp(BU) clamping voltage VP1 ≥ 16.7 V; IREG2 = 100 mA − − 16 V Ir(BU) reverse current VP1 = 0 V; VBU = 12.4 V − − 900 µA Schmitt trigger for enable ignition input Vth(r)(IGNIN) rising threshold voltage of ignition input VP1 > 3.5 V 1.9 2.2 2.5 V Vth(f)(IGNIN) falling threshold voltage of ignition input VP1 > 3.5 V 1.7 2.0 2.3 V Vhys(IGNIN) hysteresis voltage VP > 3.5 V 0.1 0.2 0.5 V ILI input leakage current VIGNIN = 5 V − − 1.0 µA Ii(clamp) input clamp current VIGNIN > 50 V − − 50 mA VIH(clamp) HIGH-level input clamping voltage VP1 − 50 V 2002 Apr 10 16 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer SYMBOL VIL(clamp) PARAMETER CONDITIONS LOW-level input clamping voltage TDA3681 MIN. TYP. MAX. UNIT −0.6 − 0 V Ignition buffer VOL LOW-level output voltage IIGNOUT = 0 mA 0 0.2 0.8 V VOH HIGH-level output voltage 4.5 5.0 5.25 V IOL LOW-level output current VIGNOUT ≤ 0.8 V 0.45 0.8 − mA IOH HIGH-level output current VIGNOUT ≥ 4.5 V −0.45 −2.0 − mA ILO output leakage current (source) VIGNOUT = 5 V; VIGNIN = 0 V − − 1.0 µA tPLH LOW-to-HIGH propagation time VIGNIN rising from 1.7 to 2.5 V − − 500 µs tPHL HIGH-to-LOW propagation time VIGNIN falling from 2.5 to 1.7 V − − 500 µs IIGNOUT = 0 mA Temperature protection Tj(sd) junction temperature for shutdown 150 160 170 °C Tj(hold) junction temperature for hold trigger 150 160 170 °C Notes 1. Minimum operating voltage, only if VP1 has exceeded 6.5 V. 2. The total quiescent current is measured in the standby mode. Therefore, the enable inputs of regulators 1, 3, 4 and the power switch are grounded and RL(REG2) = ∞ ; see Figs 10 and 11. 3. The voltage of the regulator drops as a result of a VP1 drop for regulators 1 and 2. Regulators 3 and 4 drop as a result of VP2 drop. 4. The rise and fall times are measured with a 10 kΩ pull-up resistor and a 50 pF load capacitor. C 3 5. The delay time depends on the value of the reset delay capacitor: t d(RES) = ------ × V C(th) = C × ( 750 × 10 ) [ s ] I ch C 3 6. The delay time depends on the value of the reset delay capacitor: t d(SW) = ------ × V C(th) = C × ( 375 × 10 ) [ s ] I ch 7. The drop-out voltage of regulators 1 and 2 is measured between pins VP1 and REGn. The drop-out voltage of regulators 3 and 4 is measured between pins VP2 and REGn. 8. At current limit, Im(REGn) is held constant (see Fig.8). 9. The foldback current protection limits the dissipated power at short-circuit (see Fig.8). 10. The drop-out voltage is measured between pins BU and REG2. 11. The drop-out voltage of the power switch is measured between pins VP1 and SW. 12. The maximum output current of the power switch is limited to 1.8 A when the supply voltage exceeds 18 V. 13. At short-circuit, Isc(SW) of the power switch is held constant to a lower value than the continuous current after a delay of at least 10 ms. 2002 Apr 10 17 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer handbook, halfpage TDA3681 handbook, halfpage MGL907 8.5 V Vo(REG2) MGL908 5.0 V Vo(REG1) Im(REG2) Isc(REG2) IREG2 Isc(REG1) Im(REG1) IREG1 a. Regulator 1. b. Regulator 2. handbook, halfpage handbook, halfpage Vo(REG3) Vo(REG4) MGL909 5.0 V MGL910 3.3 V Isc(REG3) Im(REG3) Im(REG4) Isc(REG4) IREG3 IREG4 c. Regulator 3. d. Regulator 4. Fig.8 Foldback current protection of the regulators. handbook, full pagewidth MGR931 VSW VP − 3.3 V delayed generates hold not delayed 2VBE >1.8 A 1A >3 A ISW Fig.9 Current protection of the power switch. 2002 Apr 10 18 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 TEST AND APPLICATION INFORMATION Test information handbook, full pagewidth power switch output supply voltage 1 16 17 VP1 C1 220 nF C2 10 µF (1) enable input power switch 15 11 regulator 2 output enable input regulator 1/3 10 1 regulator 1 output RL(REG2) 5 kΩ 8.5 V C4 10 µF VEN1/3 regulator 3 output enable input regulator 4 9 RL(REG1) 10 kΩ 5V 2 C5 10 µF VEN4 TDA3681J TDA3681JR supply voltage 2 4 regulator 4 output C7 220 nF (1) reset delay capacitor R6 10 kΩ 3.3 V hold output 14 ignition input (3) C9 50 pF (3) C12 50 pF 12 ignition output 5 6 MGL911 13 ground (1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability. (2) A minimum capacitor of 1 µF for backup supply is required for stability. (3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs. Fig.10 Test circuit of TDA3681J and TDA3681JR. 2002 Apr 10 5 kΩ R3 10 kΩ C10 100 µF C11 1 nF RL(REG4) 7 backup (2) 5 kΩ reset output 8 C8 47 nF VBU RL(REG3) C6 10 µF 3 VIGNIN 12 kΩ 5V C3 10 µF VENSW VP2 RL(SW) 19 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer handbook, full pagewidth power switch output supply voltage 1 16 14 VP1 C1 220 nF TDA3681 C2 10 µF (1) enable input power switch 12 8 regulator 2 output enable input regulator 1/3 7 17 regulator 1 output RL(REG2) 5 kΩ 8.5 V C4 10 µF VEN1/3 regulator 3 output enable input regulator 4 6 RL(REG1) 10 kΩ 5V 19 C5 10 µF VEN4 TDA3681TH supply voltage 2 1 regulator 4 output C7 220 nF (1) reset delay capacitor R6 10 kΩ hold output 13 RL(REG4) 5 kΩ ignition input (3) C9 50 pF (3) C12 50 pF R3 10 kΩ 9 C10 100 µF C11 1 nF 3.3 V 4 backup (2) 5 kΩ reset output 5 C8 47 nF VBU RL(REG3) C6 10 µF 20 VIGNIN 12 kΩ 5V C3 10 µF VENSW VP2 RL(SW) ignition output 2 3 11 heat tab MGU355 10 ground (1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability. (2) A minimum capacitor of 1 µF for backup supply is required for stability. (3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs. Fig.11 Test circuit of TDA3681TH. 2002 Apr 10 20 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer The output capacitors can be selected by using the graphs given in Figs 12 and 13. When an electrolytic capacitor is used, its temperature behaviour can cause oscillations at a low temperature. The two examples below show how an output capacitor value is selected. Application information NOISE Table 1 Noise figures NOISE FIGURE (µV)(1) REGULATOR Co = 10 µF Co = 47 µF Co = 100 µF 1 170 110 110 2 440 240 190 3 120 100 80 4 85 70 55 Example 1 Regulators 1, 3 and 4 are stabilized with an electrolytic output capacitor of 220 µF (ESR = 0.15 Ω). At Tamb = −30 °C, the capacitor value is decreased to 73 µF and the ESR is increased to 1.1 Ω. The regulator remains stable at Tamb = −30 °C (see Fig.12). Note Example 2 1. Measured at a bandwidth of 30 kHz. Regulator 2 is stabilized with a 10 µF electrolytic capacitor (ESR = 3 Ω). At Tamb = −30 °C, the capacitor value is decreased to 3 µF and the ESR is increased to 23.1 Ω. As can be seen from Fig.13, the regulator will be unstable at Tamb = −30 °C. The noise on the supply line depends on the value of the supply capacitor and is caused by a current noise (the output noise of the regulators is translated to a current noise by the output capacitors). The noise is minimal when a high frequency capacitor of 220 nF in parallel with an electrolytic capacitor of 100 µF is connected directly to the supply pins VP1, VP2 and GND. Solution To avoid problems with stability at low temperatures, the use of tantalum capacitors is recommended. Use a tantalum capacitor of 10 µF or a larger electrolytic capacitor. STABILITY The regulators are stabilized by the externally connected output capacitors. handbook, halfpage MGL912 handbook, halfpage 20 TDA3681 MGL913 14 ESR (Ω) 12 ESR (Ω) 15 maximum ESR 10 8 maximum ESR 10 stable region 6 4 5 stable region 2 minimum ESR 0 0 0.1 1 10 C (µF) −2 100 0.22 Fig.12 Curve for selecting the value of the output capacitor for regulators 1, 3 and 4. 2002 Apr 10 1 10 C (µF) 100 Fig.13 Curve for selecting the value of the output capacitor for regulator 2. 21 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L c Q 1 v M 17 e1 Z e e2 m w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 e1 e2 1.27 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 8.4 7.0 2.4 1.6 4.3 2.1 1.8 0.6 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-12-16 99-12-17 SOT243-3 2002 Apr 10 EUROPEAN PROJECTION 22 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 DBS17P: plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) SOT475-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L 1 Q 17 e1 Z bp e c w M 0 5 v M e2 m 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 e1 e2 1.27 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.4 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-05-20 99-12-17 SOT475-1 2002 Apr 10 EUROPEAN PROJECTION 23 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 E D A x X c E2 y HE v M A D1 D2 10 1 pin 1 index Q A A2 E1 (A3) A4 θ Lp detail X 20 11 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.12 0.53 0.32 16.0 13.0 −0.02 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1.27 14.5 13.9 1.1 0.8 1.7 1.5 bp c D(2) v w x y 0.25 0.25 0.03 0.07 Z θ 2.5 2.0 8° 0° Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 98-02-25 99-11-12 SOT418-2 2002 Apr 10 EUROPEAN PROJECTION 24 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Through-hole mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Surface mount packages Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2002 Apr 10 TDA3681 25 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2002 Apr 10 26 Philips Semiconductors Product specification Multiple voltage regulator with switch and ignition buffer TDA3681 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2002 Apr 10 27 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA74 © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753503/05/pp28 Date of release: 2002 Apr 10 Document order number: 9397 750 09266