INTEGRATED CIRCUITS DATA SHEET TDA3616 Multiple voltage regulator with battery detection Objective specification Supersedes data of 1998 Jul 22 File under Integrated Circuits, IC01 2000 Jan 14 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 FEATURES GENERAL DESCRIPTION General The TDA3616 is a low power voltage regulator. It contains the following: • One VP-state controlled regulator • One fixed voltage regulator with a foldback current protection, intended to supply a microprocessor, that also operates during load dump • Battery detection circuit • Regulator, reset and battery outputs operate during load dump • A provision for use of a reserve supply capacitor that will hold enough energy for the regulator to allow a microcontroller to prepare for loss of supply voltage • Supply voltage range from −18 to +50 V • Low quiescent current (battery detection switched off) • Reset signals which can be used to interface with the microprocessor • High ripple rejection • Dual reset output • A supply pin that can withstand load dump pulses and negative supply voltages • Backup circuit • Adjustable reset delay timer. • Defined start-up behaviour; regulator will be switched on at a supply voltage higher than 7.5 V and off when the output voltage of the regulator drops below 2.4 V. Protections • Reverse polarity safe (down to −18 V without high reverse current) • Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) • ESD protected on all pins • Load dump protection • Foldback current limit protection for regulator • The regulator output is DC short-circuited safe to ground and VP. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP Iq supply voltage operating regulator on 5.6 14.4 25 V jump start t ≤ 10 minutes − − 30 V load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − − 50 V quiescent supply current standby mode − 95 125 µA standby mode; Tamb = 25 °C − 95 120 µA 0.5 mA ≤ IREG ≤ 150 mA; 7 V ≤ VP ≤ 18 V; Tamb = 25 °C 4.8 5.0 5.2 V 0.5 mA ≤ IREG ≤ 150 mA; 7 V ≤ VP ≤ 18 V 4.75 5.0 5.25 V IREG = 30 mA; 18 V ≤ VP ≤ 50 V; load dump 4.75 5.0 5.25 V IREG = 150 mA; VP = 5 V; Tamb = 25 °C − 0.6 1.0 V Regulator Vo Vdrop 2000 Jan 14 output voltage drop-out voltage 2 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 ORDERING INFORMATION TYPE NUMBER TDA3616T TDA3616SF PACKAGE NAME DESCRIPTION SO20 SIL9MP VERSION plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 plastic single in-line medium power package with fin; 9 leads SOT110-1 BLOCK DIAGRAM handbook, full pagewidth VP (14.4 V) 17 (4) (5) 18 BACKUP SWITCH LOAD DUMP PROTECTION (3) 16 REGULATOR BU REG REFERENCE n.c. 7 i.c. 4 VC 3.1 kΩ 2, 3, 8, 9, 12, 13, 19 1, 10, 11, 20 (1) 14 RES2 & 47 kΩ 6 (8) 3.1 kΩ (2) 15 RES1 TDA3616T REG VI(bat) 4 (6) BATTERY BUFFER (7) 5 7 (9) MGL933 GND The pin numbers given in parenthesis refer to the TDA3616SF version. Fig.1 Block diagram. 2000 Jan 14 3 VO(bat) Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 PINNING PIN SYMBOL DESCRIPTION SOT163-1 SOT110-1 i.c. 1, 10, 11, and 20 − interconnected; heat spreader; note 1 n.c. 2, 3, 8, 9, 12, 13 and 19 − not connected; heat spreader VI(bat) 4 6 battery input voltage VO(bat) 5 7 battery detection output voltage VC 6 8 reset delay capacitor GND 7 9 ground (0 V) RES2 14 1 reset 2 output RES1 15 2 reset 1 output REG 16 3 regulator output VP 17 4 supply voltage BU 18 5 backup Note 1. The i.c. pins are connected to each other by the leadframe and can be kept floating or can be connected to ground. handbook, halfpage i.c. 1 20 i.c. n.c. 2 19 n.c. n.c. 3 18 BU VI(bat) 4 17 VP VO(bat) 5 VC 6 handbook, halfpage 16 REG TDA3616T 15 RES1 14 RES2 GND 7 n.c. 8 13 n.c. n.c. 9 12 n.c. i.c. 10 RES2 1 RES1 2 REG 3 VP 4 BU 5 TDA3616SF VI(bat) 6 VO(bat) 7 VC 8 GND 9 11 i.c. MGL930 MGR093 The i.c. and n.c. pins can be connected to a heat spreader. Fig.2 Pin configuration (SOT163-1). 2000 Jan 14 Fig.3 Pin configuration (SOT110-1). 4 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection FUNCTIONAL DESCRIPTION TDA3616 The charge of the backup capacitor can be used to supply the regulator and logic circuits for a short period of time when the supply falls to 0 V (the time depends on the value of the storage capacitor). The regulator is switched off at a backup voltage of approximately 2.7 V. From this time onwards, the backup charge will only be used for maintaining reset functions. Due to this, the reset outputs will remain LOW until the output of the regulator is dropped to 0 V. The TDA3616 (see Fig.1) is a voltage regulator intended to supply a microprocessor (e.g. in car radio applications). Because of low-voltage operation of the application, a low-voltage drop regulator is used. This regulator will switch-on when the backup voltage (see Section “Backup circuit”) exceeds 7.5 V for the first time and will switch-off again when the output voltage of the regulator drops below 2.4 V. When the regulator is switched on, the RES1 and RES2 outputs (RES2 can only be HIGH when RES1 is HIGH) will go HIGH after a fixed delay time (fixed by an external delay capacitor) to generate a reset to the microprocessor. All output pins are fully protected. The regulator is protected against load dump and short-circuit (foldback current protection). At load dump, the battery detection circuit will remain operating. Interfacing with the microprocessor can be accomplished by means of a battery Schmitt trigger and output buffer (simple full/semi on/off logic applications). The battery output will go HIGH when the battery input voltage exceeds the high threshold level. Pin RES1 will go HIGH via an internal pull-up resistor of 3.1 kΩ, and is used to initialize the microprocessor. Pin RES2 is used to indicate that the regulator output voltage is within its voltage range. This start-up feature is built-in to secure a smooth start-up of the microprocessor at first connection, without uncontrolled switching of the regulator during the start-up sequence. The timing diagrams are shown in Fig.4. handbook, full pagewidth VP 18 V VBU 4.75 V regulator 2.4 V reset 2 reset 1 reset delay capacitor 2V 2V 2.05 V battery input 1.95 V battery output MGR095 Fig.4 Timing diagrams. 2000 Jan 14 5 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP PARAMETER CONDITIONS MIN. MAX. UNIT supply voltage − operating regulator on 25 V jump start t ≤ 10 minutes − 30 V load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − 50 V Vrp reverse polarity voltage non-operating − −18 V VI(bat)p positive pulse voltage at battery input VP = 14.4 V; RI = 5 kΩ − 50 V VI(bat)n negative pulse voltage at battery input VP = 14.4 V; RI = 10 kΩ; Cl = 1 nF − −100 V Ptot total power dissipation VP = 12.4 V − 2.5 W Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature operating −40 +105 °C Tj junction temperature operating −40 +150 °C THERMAL CHARACTERISTICS SYMBOL Rth(j-p) Rth(j-a) PARAMETER CONDITIONS VALUE UNIT TDA3616T 20 K/W TDA3616SF 12 K/W thermal resistance from junction to pin/tab thermal resistance from junction to ambient TDA3616T 10 cm2 2-sided copper area connected to pins 50 K/W TDA3616SF in free air 50 K/W QUALITY SPECIFICATION Quality specification in accordance with “SNW-FQ-611E”. 2000 Jan 14 6 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 CHARACTERISTICS VP = 14.4 V; IREG = 0.5 mA; −40 °C < Tamb < +105 °C; measurements taken in test circuit of Fig.7; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP Iq supply voltage operating jump start load dump protection quiescent supply current regulator on; note 1 5.6 14.4 25 V t ≤ 10 minutes t ≤ 50 ms; tr ≥ 2.5 ms VP = 12.4 V; Tamb = 25 °C; note 2 VP = 12.4 V; note 2 VP = 14.4 V; note 2 VP = 50 V; load dump − − − − − − − − 95 95 100 5 30 50 120 125 − 20 V V µA µA µA mA RL(REG) = 1 kΩ IREG = 5 mA IREG = 30 mA 6.2 2.1 − − 7.5 2.4 2.25 5.1 8.1 2.7 − − V V V V 2.1 2.1 2.0 2.0 0.1 2.2 2.25 2.1 2.15 − V V V V V Schmitt trigger for regulator and reset 1 Vth(r) Vth(f) rising threshold voltage falling threshold voltage Vhys hysteresis voltage Schmitt trigger for battery detection Vth(r) rising threshold voltage Tamb = 25 °C Vth(f) falling threshold voltage Tamb = 25 °C Vhys hysteresis voltage 2.0 2.0 1.9 1.9 − rising threshold voltage falling threshold voltage note 3 note 3 4.55 4.5 4.8 4.75 5.05 5.0 V V hysteresis voltage voltage tracking with VREG Isink = 0 mA; note 4 − −65 0.05 0 − +65 V mV LOW-level sink current VRES ≤ 0.5 V; note 3 2 15 − mA internal pull-up resistance Tamb = 25 °C 2.2 1.9 3.1 3.1 4.0 4.6 kΩ kΩ internal pull-up resistance rising threshold voltage delay time Tamb = 25 °C; note 5 Cd = 100 nF; note 6; see Fig.9 − 1.4 − 47 2.0 2.6 − 2.8 − kΩ V ms VOH IOL LOW-level output voltage HIGH-level output voltage LOW-level output current II = 0 mA Io = 5 µA; note 7 VOL ≤ 0.5 V 0 − 0.2 0.05 5.0 0.5 0.5 5.2 − V V mA IOH HIGH-level output current VOH ≥ 4 V; see Fig.6 1 12 − mA Schmitt trigger for reset 2 Vth(r) Vth(f) Vhys ∆Vtrack Reset 1 and reset 2 buffers Isink(L) Rpu(int) Reset delay Rpu(int) Vth(r) td Battery buffer VOL 2000 Jan 14 7 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection SYMBOL PARAMETER CONDITIONS TDA3616 MIN. TYP. MAX. UNIT Regulator (IREG = 5 mA; unless otherwise specified) Vo Io ∆VLN ∆VL output voltage output current line voltage regulation load voltage regulation SVRR Vdrop supply voltage ripple rejection drop-out voltage Il Isc current limit short-circuit current 0.5 mA ≤ IREG ≤ 150 mA; 7 V ≤ VP ≤ 18 V; Tamb = 25 °C 0.5 mA ≤ IREG ≤ 150 mA; 7 V ≤ VP ≤ 18 V IREG = 30 mA; 18 V ≤ VP ≤ 50 V; load dump VP > 25 V; load dump 7 V ≤ VP ≤ 18 V 0.5 mA ≤ IREG ≤ 150 mA; Tamb = 25 °C 0.5 mA ≤ IREG ≤ 150 mA fi = 200 Hz; Vi = 2 V (p-p); Io = 5 mA IREG = 150 mA; VP = 5 V; Tamb = 25 °C; note 8 IREG = 150 mA; VP = 5.5 V; note 8 VREG > 4.5 V; VP > 10 V; note 9 RL(REG) ≤ 0.5 Ω; Tamb = 25 °C; note 10 4.8 5.0 5.2 V 4.75 5.0 5.25 V 4.75 5.0 5.25 V − − − − 3 − 100 50 70 mA mV mV − 55 − − 60 0.6 85 − 1.0 mV dB V − 0.25 40 0.9 0.6 80 1.2 1 − V A mA Backup switch IDC Ir DC continuous current VBU > 5 V; note 11 0.1 0.2 − A reverse current VP = 0 V; VBU = 12.4 V − − 200 µA Notes 1. Minimum operating voltage, only if VP has exceeded 7.5 V. 2. The quiescent current is measured in standby mode. Therefore, the battery input is connected to a low voltage source and RL(REG) = ∞. 3. The voltage of the regulator sinks as a result of a supply voltage drop. 4. Only one band gap circuit is used as a reference for both regulator and Schmitt trigger for reset. Due to this a tracking exists between the reset Schmitt trigger levels and the output voltage of the regulator. 5. The temperature coefficient of the internal resistor is 0.2%/K. V REG 6. The delay time can be calculated with the following formula: t d = R pu ( int ) × C d × ln ----------------------------------- ( V REG – V thr ) 7. The battery output voltage will be equal or less than the output voltage of the regulator. 8. The drop-out voltage of the regulator is measured between VP and VREG. 9. At current limit, Il is held constant (behaviour according to dashed line in Fig.5). 10. The foldback current protection limits the dissipated power at short-circuit (see Fig.5). 11. The backup switch can deliver an additional current of 100 mA, guaranteed when the regulator is loaded with nominal loads (IREG ≤ 150 mA). 2000 Jan 14 8 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 handbook, halfpage MGL434 5.0 V VREG 1V ≥50 mA Isc Il IREG Fig.5 Foldback current protection. MGL932 16 handbook, halfpage IO(bat) (mA) 12 8 4 0 3.25 3.75 4.25 4.75 5.25 VO(bat)(V) Tamb = 27° C. Fig.6 Battery buffer HIGH-level output current as a function of VO(bat). 2000 Jan 14 9 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 TEST AND APPLICATION INFORMATION Test information handbook, full pagewidth VP 16 17 regulator output CL 10 µF CP VP 10 µF(1) VC 15 6 (2) RL(REG) 10 kΩ reset 1 output RL(RES1) 1 kΩ TDA3616T RI VI(bat) 10 kΩ battery input voltage 4 14 18 5 reset 2 output CI 1 nF back-up capacitor CBU battery output voltage 7 ≥150 nF GND MGR097 (1) Capacitor not required for stability. (2) RL(REG) = 0.5 Ω at short-circuit. Fig.7 Test circuit for TDA3616T. 2000 Jan 14 10 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 Application information STABILITY NOISE The regulator is stabilized by the output capacitor CL. The value of the output capacitor can be selected using the diagram shown in Fig.8. The following two examples show the effects of the stabilization circuit using different values for the output capacitor. The noise at the output of the regulator depends on the bandwidth of the regulator, which can be adjusted by the output capacitor CL. Table 1 shows the noise figures. The noise on the supply line depends on the value of the supply capacitor CP and is caused by a current noise (the output noise of the regulator is translated into a current noise by the output capacitor). When a high frequency capacitor of 220 nF (with an electrolytic capacitor of 100 µF connected in parallel) is connected directly between pins VP and GND the noise is minimized. Table 1 Remark: The behaviour of ESR as a function of the temperature must be known. Example 1 The regulator is stabilized using an electrolytic output capacitor of 68 µF (ESR = 0.5 Ω). At Tamb = −40 °C the capacitor value is decreased to 22 µF and the ESR is increased to 3.5 Ω. The regulator will remain stable at a temperature of Tamb = −40 °C. Noise figures NOISE FIGURE (µV)(1) IO (mA) CL = 10 µF CL = 47 µF CL = 100 µF 0.5 58 50 45 50 250 200 180 Example 2 The regulator is stabilized using an electrolytic output capacitor of 10 µF (ESR = 3.3 Ω). At Tamb = −40 °C the capacitor value is decreased to 3 µF and the ESR is increased to 23.1 Ω. The regulator will be unstable at a temperature of Tamb = −40 °C. This can be solved by using a tantalum capacitor of 10 µF. Note 1. Measured at a bandwidth of 10 Hz to 100 kHz. handbook, full pagewidth MBK118 8 ESR (Ω) 6 (1) 4 stable region 2 (2) 0 0.68 1 10 100 output capacitor (µF) 1000 (1) Maximum Equivalent Series Resistance (ESR). (2) Minimum ESR. Fig.8 Curve for selecting the value of the output capacitor. 2000 Jan 14 11 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 It is possible to reduce the total thermal resistance from 120 K/W to 50 K/W). APPLICATION CIRCUIT In Fig.9 the total quiescent current equals Iq + IRdivider. The specified quiescent current equals Iq. When the supply voltage is connected, the regulator will switch-on when the supply voltage exceeds 7.5 V. With a timing capacitor connected to pin VC the reset can be delayed (the timer starts at the same moment as the regulator is switched on). Backup circuit The backup function is used for supplying the regulator and logic circuits (reset 1 and 2) when the supply voltage is disconnected. For stability a minimum capacitor value of 150 nF is needed. Forced reset can be accomplished by short-circuiting the timer capacitor by using the push-button switch. When the push-button is released again, the timer restarts (only when the regulator is on) causing a second reset on both RES1 and RES2. With a supply voltage of 14.4 V the backup capacitor will be fully charged until approximately 14.2 V. At the moment the supply voltage is lower than the voltage on pin BU the backup switch will be opened (this backup switch acts like an ideal diode) and the charge of the backup capacitor is used for supplying the regulator and the logic circuits. The backup capacitor is mainly discharged by the load of the regulator. After a certain period of time the regulator output will be disabled and the backup capacitor will only be discharged by the quiescent current of the IC itself. The maximum output current of the regulator equals: 150 – T amb 150 – T amb I O ( max ) = ------------------------------------------------------- = ---------------------------------- [mA] R th(j-a) × ( V P – V REG ) 50 × ( V P – 5 ) When Tamb = 85 °C and VP = 16 V, the maximum output current equals 118 mA. At lower ambient temperature (Tamb < 0) the maximum output current equals 250 mA. In combination with the battery detection Schmitt trigger, an early warning can be given to the microprocessor to indicate that the battery voltage has dropped down to an unacceptable low value, causing the microcontroller to run on backup charge. The early warning level can be programmed with resistors R1 and R2; see Fig.9. For successful operation of the IC (maximum output current capability), special attention has to be paid to the copper area required as heatsink (connected to pins 1, 10, 11 and 20), the thermal capacity of the heatsink and its ability to transfer heat to the external environment. handbook, full pagewidth choke coil 2200 µF on/off (closed = on) VP 17 (4) 8 V detector R1 360 kΩ CL 10 µF TDA3616T (2) 15 VC REG 4 (6) R2 100 kΩ forced reset 18 (5) (3) 16 VI(bat) CBU 1000 µF (minimum value of 150 nF needed for stability) BU 6 (8) (1) 14 Cd 7 (9) (7) 5 RES1 RES2 VO(bat) MGL931 The pin numbers given in parenthesis refer to the TDA3616SF version. Fig.9 Typical application. 2000 Jan 14 12 used for 8 V detector Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 2000 Jan 14 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 13 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 2000 Jan 14 EUROPEAN PROJECTION 14 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE • For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2000 Jan 14 TDA3616 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 15 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection TDA3616 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Jan 14 16 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection NOTES 2000 Jan 14 17 TDA3616 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection NOTES 2000 Jan 14 18 TDA3616 Philips Semiconductors Objective specification Multiple voltage regulator with battery detection NOTES 2000 Jan 14 19 TDA3616 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 69 © Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545002/25/02/pp20 Date of release: 2000 Jan 14 Document order number: 9397 750 06579