INTEGRATED CIRCUITS DATA SHEET TJA1050 High speed CAN transceiver Product specification Supersedes data of 2002 May 16 2003 Oct 22 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 FEATURES GENERAL DESCRIPTION • Fully compatible with the “ISO 11898” standard The TJA1050 is the interface between the Controller Area Network (CAN) protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. • High speed (up to 1 Mbaud) • Very low ElectroMagnetic Emission (EME) • Differential receiver with wide common-mode range for high ElectroMagnetic Immunity (EMI) The TJA1050 is the third Philips high-speed CAN transceiver after the PCA82C250 and the PCA82C251. The most important differences are: • An unpowered node does not disturb the bus lines • Transmit Data (TXD) dominant time-out function • Silent mode in which the transmitter is disabled • Much lower electromagnetic emission due to optimal matching of the output signals CANH and CANL • Bus pins protected against transients in an automotive environment • Improved behaviour in case of an unpowered node • Input levels compatible with 3.3 V and 5 V devices • No standby mode. • Thermally protected This makes the TJA1050 eminently suitable for use in nodes that are in a power-down situation in partially powered networks. • Short-circuit proof to battery and to ground • At least 110 nodes can be connected. QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage CONDITIONS MIN. MAX. UNIT 4.75 5.25 V VCANH DC voltage at pin CANH 0 < VCC < 5.25 V; no time limit −27 +40 V VCANL DC voltage at pin CANL 0 < VCC < 5.25 V; no time limit −27 +40 V Vi(dif)(bus) differential bus input voltage dominant 1.5 3 V tPD(TXD-RXD) propagation delay TXD to RXD VS = 0 V; see Fig.7 Tvj virtual junction temperature − 250 ns −40 +150 °C ORDERING INFORMATION TYPE NUMBER PACKAGE NAME TJA1050T SO8 TJA1050U − 2003 Oct 22 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm bare die; die dimensions 1700 × 1280 × 380 µm 2 VERSION SOT96-1 − Philips Semiconductors Product specification High speed CAN transceiver TJA1050 BLOCK DIAGRAM VCC handbook, full pagewidth S 3 8 30 µA VCC GND TEMPERATURE PROTECTION 200 µA TXD TXD DOMINANT TIME-OUT TIMER 1 DRIVER 7 VCC RXD CANH 25 kΩ 4 RECEIVER 0.5VCC 25 kΩ GND GND CANL 6 Vref 5 REFERENCE VOLTAGE TJA1050 2 MGS374 GND Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION TXD 1 transmit data input; reads in data from the CAN controller to the bus line drivers GND 2 ground VCC 3 supply voltage RXD 4 receive data output; reads out data from the bus lines to the CAN controller Vref 5 reference voltage output CANL 6 LOW-level CAN bus line CANH 7 HIGH-level CAN bus line S 8 select input for high-speed mode or silent mode 2003 Oct 22 handbook, halfpage TXD 1 8 S GND 2 7 CANH TJA1050T VCC 3 6 CANL RXD 4 5 Vref MGS375 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 Control pin S allows two operating modes to be selected: high-speed mode or silent mode. FUNCTIONAL DESCRIPTION The TJA1050 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for high-speed automotive applications using baud rates from 60 kbaud up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the “ISO 11898” standard. The high-speed mode is the normal operating mode and is selected by connecting pin S to ground. It is the default mode if pin S is not connected. However, to ensure EMI performance in applications using only the high-speed mode, it is recommended that pin S is connected to ground. In the silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to VCC and can be used to prevent network communication from being blocked, due to a CAN controller which is out of control. A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative supply voltage, although power dissipation increases during this fault condition. A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 165 °C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TXD goes HIGH. The thermal protection circuit is particularly needed when a bus line short-circuits. A ‘TXD dominant time-out’ timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. If the duration of the LOW-level on pin TXD exceeds the internal timer value, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TXD. The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Fig.4). Table 1 Function table of the CAN transceiver; X = don’t care VCC TXD S CANH CANL BUS STATE RXD 4.75 V to 5.25 V LOW LOW (or floating) HIGH LOW dominant LOW 4.75 V to 5.25 V X HIGH 0.5VCC 0.5VCC recessive HIGH 4.75 V to 5.25 V HIGH (or floating) X 0.5VCC 0.5VCC recessive HIGH <2 V (not powered) X X 0 V < VCANH < VCC 0 V < VCANL < VCC recessive X 2 V < VCC < 4.75 V >2 V X 0 V < VCANH < VCC 0 V < VCANL < VCC recessive X 2003 Oct 22 4 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND (pin 2). Positive currents flow into the IC. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT −0.3 +6 V 0 < VCC < 5.25 V; no time limit −27 +40 V 0 < VCC < 5.25 V; no time limit −27 +40 V DC voltage at pin TXD −0.3 VCC + 0.3 V VRXD DC voltage at pin RXD −0.3 VCC + 0.3 V Vref DC voltage at pin Vref −0.3 VCC + 0.3 V VS DC voltage at pin S −0.3 VCC + 0.3 V Vtrt(CANH) transient voltage at pin CANH note 1 −200 +200 V Vtrt(CANL) transient voltage at pin CANL note 1 −200 +200 V Vesd electrostatic discharge voltage at all pins note 2 −4000 +4000 V −200 +200 V −55 +150 °C −40 +150 °C VCC supply voltage VCANH DC voltage at pin CANH VCANL DC voltage at pin CANL VTXD note 3 Tstg storage temperature Tvj virtual junction temperature note 4 Notes 1. The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b (see Fig.4). 2. Human body model: C = 100 pF and R = 1.5 kΩ. 3. Machine model: C = 200 pF, R = 10 Ω and L = 0.75 µH. 4. In accordance with “IEC 60747-1”. An alternative definition of Tvj is: Tvj = Tamb + P × Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). THERMAL CHARACTERISTICS According to IEC 60747-1. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(vj-a) thermal resistance from junction to ambient in SO8 package in free air 145 K/W Rth(vj-s) thermal resistance from junction to substrate of bare die in free air 50 K/W QUALITY SPECIFICATION Quality specification “SNW-FQ-611 part D” is applicable. 2003 Oct 22 5 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 CHARACTERISTICS VCC = 4.75 V to 5.25 V; Tvj = −40 °C to +150 °C; RL = 60 Ω unless specified otherwise; all voltages are referenced to GND (pin 2); positive currents flow into the IC; see notes 1 and 2. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pin VCC) ICC supply current dominant; VTXD = 0 V 25 50 75 mA recessive; VTXD = VCC 2.5 5 10 mA Transmitter data input (pin TXD) VIH HIGH-level input voltage output recessive 2.0 − VCC + 0.3 V VIL LOW-level input voltage output dominant −0.3 − +0.8 V IIH HIGH-level input current VTXD = VCC −5 0 +5 µA IIL LOW-level input current VTXD = 0 V −100 −200 −300 µA Ci input capacitance not tested − 5 10 pF silent mode 2.0 − VCC + 0.3 V Mode select input (pin S) VIH HIGH-level input voltage VIL LOW-level input voltage high-speed mode −0.3 − +0.8 V IIH HIGH-level input current VS = 2 V 20 30 50 µA IIL LOW-level input current VS = 0.8 V 15 30 45 µA Receiver data output (pin RXD) IOH HIGH-level output current VRXD = 0.7VCC −2 −6 −15 mA IOL LOW-level output current VRXD = 0.45 V 2 8.5 20 mA −50 µA < IVref < +50 µA 0.45VCC 0.5VCC 0.55VCC V Reference voltage output (pin Vref) Vref reference output voltage Bus lines (pins CANH and CANL) Vo(reces)(CANH) recessive bus voltage at pin CANH VTXD = VCC; no load 2.0 2.5 3.0 V Vo(reces)(CANL) recessive bus voltage at pin CANL VTXD = VCC; no load 2.0 2.5 3.0 V Io(reces)(CANH) recessive output current at pin CANH −27 V < VCANH < +32 V; −2.0 0 V < VCC < 5.25 V − +2.5 mA Io(reces)(CANL) recessive output current at pin CANL −27 V < VCANL < +32 V; 0 V < VCC < 5.25 V −2.0 − +2.5 mA Vo(dom)(CANH) dominant output voltage at pin CANH VTXD = 0 V 3.0 3.6 4.25 V Vo(dom)(CANL) dominant output voltage at pin CANL VTXD = 0 V 0.5 1.4 1.75 V Vi(dif)(bus) differential bus input voltage (VCANH − VCANL) VTXD = 0 V; dominant; 42.5 Ω < RL < 60 Ω 1.5 2.25 3.0 V VTXD = VCC; recessive; no load −50 0 +50 mV 2003 Oct 22 6 Philips Semiconductors Product specification High speed CAN transceiver SYMBOL PARAMETER TJA1050 CONDITIONS MIN. TYP. MAX. UNIT Io(sc)(CANH) short-circuit output current at VCANH = 0 V; VTXD = 0 V −45 pin CANH −70 −95 mA Io(sc)(CANL) short-circuit output current at VCANL = 36 V; pin CANL VTXD = 0 V 45 70 100 mA Vi(dif)(th) differential receiver threshold −12 V < VCANL < +12 V; 0.5 voltage −12 V < VCANH < +12 V; see Fig.5 0.7 0.9 V Vi(dif)(hys) differential receiver input voltage hysteresis −12 V < VCANL < +12 V; 50 −12 V < VCANH < +12 V; see Fig.5 70 100 mV Ri(cm)(CANH) common mode input resistance at pin CANH 15 25 35 kΩ Ri(cm)(CANL) common mode input resistance at pin CANL 15 25 35 kΩ Ri(cm)(m) matching between pin CANH and pin CANL common mode input resistance −3 0 +3 % Ri(dif) differential input resistance 25 50 75 kΩ Ci(CANH) input capacitance at pin CANH VTXD = VCC; not tested − 7.5 20 pF Ci(CANL) input capacitance at pin CANL VTXD = VCC; not tested − 7.5 20 pF Ci(dif) differential input capacitance VTXD = VCC; not tested − 3.75 10 pF ILI(CANH) input leakage current at pin CANH VCC = 0 V; VCANH = 5 V 100 170 250 µA ILI(CANL) input leakage current at pin CANL VCC = 0 V; VCANL = 5 V 100 170 250 µA 155 165 180 °C VCANH = VCANL Thermal shutdown Tj(sd) shutdown junction temperature Timing characteristics (see Figs.6 and 7) td(TXD-BUSon) delay TXD to bus active VS = 0 V 25 55 110 ns td(TXD-BUSoff) delay TXD to bus inactive VS = 0 V 25 60 95 ns td(BUSon-RXD) delay bus active to RXD VS = 0 V 20 50 110 ns td(BUSoff-RXD) delay bus inactive to RXD VS = 0 V 45 95 155 ns tdom(TXD) TXD dominant time for time-out VTXD = 0 V 250 450 750 µs Notes 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at 125 °C ambient temperature for dies on wafer level and in addition to this 100 % tested at 25 °C ambient temperature for cased products, unless specified otherwise. 2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground. 2003 Oct 22 7 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 APPLICATION AND TEST INFORMATION handbook, full pagewidth +5 V 47 nF 100 nF 60 Ω 60 Ω VCC 3 TXD TX0 1 7 SJA1000 Vref CAN CONTROLLER 5 CAN BUS LINE TJA1050 6 RXD RX0 CANH CANL 4 2 8 GND S 60 Ω 60 Ω MICROCONTROLLER 47 nF MGS380 Fig.3 Application information. handbook, full pagewidth +5 V 100 nF VCC TXD Vref RXD 3 1 5 7 1 nF TRANSIENT GENERATOR TJA1050 6 4 2 15 pF CANH CANL 1 nF 8 GND MGS379 S The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b. Fig.4 Test circuit for automotive transients. 2003 Oct 22 8 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 handbook, full pagewidth MGS378 VRXD HIGH LOW hysteresis 0.5 0.9 Vi(dif)(bus) (V) Fig.5 Hysteresis of the receiver. +5 V handbook, halfpage 100 nF VCC TXD Vref RXD 3 1 5 7 RL 60 Ω TJA1050 6 4 2 15 pF CANH CL 100 pF CANL 8 GND S MGS376 Fig.6 Test circuit for timing characteristics. 2003 Oct 22 9 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 HIGH handbook, full pagewidth TXD LOW CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus)(1) 0.5 V recessive (BUS off) HIGH RXD 0.7VCC 0.3VCC LOW t d(TXD-BUSon) t d(TXD-BUSoff) t d(BUSon-RXD) t d(BUSoff-RXD) t PD(TXD-RXD) t PD(TXD-RXD) MGS377 (1) Vi(dif)(bus) = VCANH − VCANL. Fig.7 Timing diagram for AC characteristics. handbook, full pagewidth TX CANL 6.2 kΩ TJA1050 CANH 6.2 kΩ 30 Ω 10 nF ACTIVE PROBE 30 Ω SPECTRUMANALYZER 47 nF GND test PCB MGT229 Fig.8 Basic test set-up (with split termination) for electromagnetic emission measurement (see Figs 9 and 10). 2003 Oct 22 10 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 MGT231 80 handbook, full pagewidth A (dBµV) 60 40 20 0 0 10 20 30 40 f (MHz) 50 Data rate of 500 kbits/s. Fig.9 Typical electromagnetic emission up to 50 MHz (peak amplitude measurement). MGT233 80 handbook, full pagewidth A (dBµV) 60 40 20 0 0 2 4 6 8 f (MHz) 10 Data rate of 500 kbits/s. Fig.10 Typical electromagnetic emission up to 10 MHz (peak amplitude measurement and envelope on peak amplitudes). 2003 Oct 22 11 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 handbook, full pagewidth TX TJA1050 CANL 30 Ω CANH 30 Ω 4.7 nF RF VOLTMETER AND POWER AMPLIFIER 50 Ω RX RF SIGNAL GENERATOR TJA1050 GND test PCB MGT230 Fig.11 Basic test set-up for electromagnetic immunity measurement (see Fig.12). MGT232 30 handbook, full pagewidth VRF(rms) (V) max RF voltage reached with no errors 20 10 0 10−1 1 10 Data rate of 500 kbits/s. Fig.12 Typical electromagnetic immunity. 2003 Oct 22 12 102 f (MHz) 103 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 BONDING PAD LOCATIONS COORDINATES(1) SYMBOL PAD x y 103 103 TXD 1 GND 2 740 85 VCC 3 886.5 111 RXD 4 1371.5 111 Vref 5 1394 1094 CANL 6 998 1115 CANH 7 538.5 1115 S 8 103 7 6 5 TJA1050U test pad x 0 1 0 y 1097 Note 2 3 4 MGS381 The backside of the bare die must be connected to ground. 1. All x/y coordinates represent the position of the centre of each pad (in µm) with respect to the lefthand bottom corner of the top aluminium layer (see Fig.13). 2003 Oct 22 8 handbook, halfpage Fig.13 Bonding pad locations. 13 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 inches 0.010 0.057 0.069 0.004 0.049 0.05 0.244 0.039 0.028 0.041 0.228 0.016 0.024 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2003 Oct 22 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 14 o 8 0o Philips Semiconductors Product specification High speed CAN transceiver TJA1050 If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. • below 220 °C (SnPb process) or below 245 °C (Pb-free process) Manual soldering – for all BGA and SSOP-T packages Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2003 Oct 22 15 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA not suitable suitable(4) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(5), SO, SOJ suitable REFLOW(2) suitable suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable PMFP(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Hot bar or manual soldering is suitable for PMFP packages. REVISION HISTORY REV 4 DATE 20031013 CPCN − DESCRIPTION Product specification (9397 750 12157) Modification: • Added recommendation to connect unused pin S to ground • Added Chapter REVISION HISTORY 3 20020516 2003 Oct 22 − Product specification (9397 750 09778) 16 Philips Semiconductors Product specification High speed CAN transceiver TJA1050 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 22 17 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R16/04/pp18 Date of release: 2003 Oct 22 Document order number: 9397 750 12157