INTEGRATED CIRCUITS DATA SHEET PCA82C251 CAN transceiver for 24 V systems Product specification Supersedes data of 1997 Mar 14 File under Integrated Circuits, IC18 2000 Jan 13 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 FEATURES GENERAL DESCRIPTION • Fully compatible with the “ISO 11898-24 V” standard The PCA82C251 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for applications (up to 1 Mbaud) in trucks and buses. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. • Slope control to reduce RFI • Thermally protected • Short-circuit proof to battery and ground in 24 V powered systems • Low-current standby mode • An unpowered node does not disturb the bus lines • At least 110 nodes can be connected • High speed (up to 1 Mbaud) • High immunity against electromagnetic interference. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage ICC supply current 1/tbit maximum transmission speed VCAN CANH, CANL input/output voltage Vdiff differential bus voltage 1.5 3.0 V Tamb ambient temperature −40 +125 °C 4.5 5.5 V standby mode − 275 µA non-return-to-zero 1 − Mbaud −36 +36 V ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION CODE PCA82C251 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 PCA82C251T SO8 plastic small outline package; 8 leads body width 3.9 mm SOT96-1 PCA82C251U − 2000 Jan 13 bare die; 2840 × 1780 × 380 µm 2 − Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 BLOCK DIAGRAM VCC handbook, full pagewidth 3 1 PROTECTION TXD DRIVER 8 SLOPE/ STANDBY Rs 7 4 CANH RXD CANL 6 RECEIVER Vref 5 REFERENCE VOLTAGE PCA82C251 2 MBG613 GND Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION TXD 1 transmit data input GND 2 ground VCC 3 supply voltage RXD 4 receive data output Vref 5 reference voltage output CANL 6 LOW-level CAN voltage input/output CANH 7 HIGH-level CAN voltage input/output Rs 8 slope resistor input 2000 Jan 13 handbook, halfpage TXD 1 GND 2 8 Rs 7 CANH PCA82C251 VCC 3 6 CANL RXD 4 5 Vref MBG612 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 FUNCTIONAL DESCRIPTION Pin 8 (Rs) allows three different modes of operation to be selected: high-speed, slope control or standby. The PCA82C251 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for applications up to 1 Mbaud in trucks and buses. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the “ISO 11898-24 V” standard. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The high-speed mode is selected by connecting pin 8 to ground. A current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. Although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. The slope control mode allows the use of an unshielded twisted pair or a parallel pair of wires as bus lines. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If the junction temperature exceeds a value of approximately 160 °C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the IC will remain operating. The thermal protection is particularly needed when a bus line is short-circuited. If a HIGH level is applied to pin 8, the circuit enters a low current standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slower in standby mode, the first message will be lost at higher bit rates. The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment. Table 1 Truth table of the CAN transceiver VCC TXD CANH CANL BUS STATE RXD 4.5 to 5.5 V 0 HIGH LOW dominant 0 4.5 to 5.5 V 1 (or floating) floating floating recessive 1(2) 4.5 < VCC < 5.5 V X(1) floating if VRs > 0.75VCC floating if VRs > 0.75VCC floating 1(2) 0 < VCC < 4.5 V floating floating floating floating X(1) Notes 1. X = don’t care. 2. If another bus node is transmitting a dominant bit, then RXD is logic 0. Table 2 Pin Rs summary CONDITION FORCED AT PIN Rs MODE RESULTING VOLTAGE OR CURRENT AT PIN Rs VRs > 0.75VCC standby −IRs < 10 µA 10 µA < −IRs < 200 µA slope control 0.4VCC < VRs < 0.6VCC VRs < 0.3VCC high-speed −IRs < 500 µA 2000 Jan 13 4 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2; positive input current. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.3 +7.0 Vn DC voltage at pins 1, 4, 5 and 8 −0.3 VCC + 0.3 V V6 DC voltage at pin 6 (CANL) 0 V < VCC < 5.5 V; TXD HIGH or floating −36 +36 V 0 V < VCC < 5.5 V; no time limit; note 1 −36 +36 V 0 V < VCC < 5.5 V; no time limit; note 2 −36 +36 V 0 V < VCC < 5.5 V; no time limit −36 V V7 DC voltage at pin 7 (CANH) +36 V Vtr transient voltage on pins 6 and 7 see Fig.8 −200 +200 V Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +125 °C Tvj virtual junction temperature note 3 −40 +150 °C Vesd electrostatic discharge voltage note 4 −2500 +2500 V note 5 −250 +250 V Notes 1. TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/µs for voltages above +30 V. 2. Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW. 3. In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd × Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). 4. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2500 V. 5. Classification B: machine model; C = 200 pF; R = 0 Ω; V = ±250 V. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE UNIT PCA82C251 100 K/W PCA82C251T 160 K/W thermal resistance from junction to ambient QUALITY SPECIFICATION According to “SNW-FQ-611 part E”. 2000 Jan 13 5 in free air Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 CHARACTERISTICS VCC = 4.5 to 5.5 V; Tamb = −40 to + 125 °C; RL = 60 Ω; I8 > −10 µA; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25 °C. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply I3 supply current dominant; V1 = 1 V; VCC < 5.1 V − − 78 mA dominant; V1 = 1 V; VCC < 5.25 V − − 80 mA dominant; V1 = 1 V; VCC < 5.5 V − − 85 mA recessive; V1 = 4 V; R8 = 47 kΩ − − 10 mA standby; note 1 − − 275 µA DC bus transmitter VIH HIGH-level input voltage output recessive 0.7VCC − VCC + 0.3 V VIL LOW-level input voltage output dominant −0.3 − 0.3VCC V IIH HIGH-level input current V1 = 4 V −200 − +30 µA IIL LOW-level input current V1 = 1 V −100 − −600 µA V6, 7 recessive bus voltage V1 = 4 V; no load 2.0 − 3.0 V ILO off-state output leakage current −2 V< (V6, V7) < 7 V −2 − +2 mA −5 V< (V6, V7) < 36 V −10 − +10 mA V7 CANH output voltage V1 = 1 V; VCC = 4.75 to 5.5 V 3.0 − 4.5 V V1 = 1 V; VCC = 4.5 to 4.75 V 2.75 − 4.5 V V6 CANL output voltage V1 = 1 V 0.5 − 2.0 V ∆V6,7 difference between output voltage at pins 6 and 7 V1 = 1 V 1.5 − 3.0 V V1 = 1 V; RL = 45 Ω 1.5 − − V V1 = 4 V; no load −500 − +50 mV Isc7 Isc6 short-circuit CANH current short-circuit CANL current V7 = −5 V − − −200 mA V7 = −36 V − −100 − mA V6 = 36 V − − 200 mA DC bus receiver [V1 = 4 V; pins 6 and 7 externally driven; −2 V < (V6, V7) < 7 V; unless otherwise specified] Vdiff(r) Vdiff(d) Vdiff(hys) 2000 Jan 13 differential input voltage (recessive) differential input voltage (dominant) −1.0 − +0.5 V −7 V < (V6, V7) < 12 V; note 2 −1.0 − +0.4 V 0.9 − 5.0 V −7 V < (V6, V7) < 12 V; not standby mode 1.0 − 5.0 V standby mode 0.97 − 5.0 V standby mode; VCC = 4.5 to 5.10 V 0.91 − 5.0 V − 150 − mV note 2 differential input hysteresis see Fig.5 6 Philips Semiconductors Product specification CAN transceiver for 24 V systems SYMBOL PARAMETER PCA82C251 CONDITIONS MIN. TYP. MAX. UNIT VOH HIGH-level output voltage (pin 4) I4 = −100 µA 0.8VCC − VCC VOL LOW-level output voltage (pin 4) I4 = 1 mA 0 − 0.2VCC V I4 = 10 mA 0 − 1.5 V V Ri CANH, CANL input resistance 5 − 25 kΩ Rdiff differential input resistance 20 − 100 kΩ V8 = 1 V; I5 < 50 µA 0.45VCC − 0.55VCC V V8 = 4 V; I5 < 5 µA 0.4VCC − 0.6VCC V 1 µs Reference output Vref reference output voltage Timing (RL = 60 Ω; CL = 100 pF; unless otherwise specified. See Figs 3 and 4) tbit minimum bit time R8 = 0 Ω − − tonTXD delay TXD to bus active R8 = 0 Ω − − 50 ns toffTXD delay TXD to bus inactive R8 = 0 Ω − 40 80 ns tonRXD delay TXD to receiver active R8 = 0 Ω − 55 120 ns toffRXD delay TXD to receiver inactive R8 = 0 Ω; Tamb < +85 °C; VCC = 4.5 to 5.1 V − 80 150 ns R8 = 0 Ω; VCC = 4.5 to 5.1 V − 80 170 ns R8 = 0 Ω; Tamb < +85 °C − 90 170 ns R8 = 0 Ω − 90 190 ns R8 = 47 kΩ − 290 400 ns tonRXD delay TXD to receiver active R8 = 47 kΩ − 440 550 ns SR CANH, CANL slew rate R8 = 47 kΩ − 7 − V/µs tWAKE wake-up time from standby see Fig.6 (via pin 8) − − 20 µs tdRXDL bus dominant to RXD LOW V8 = 4 V; see Fig.7 − − 3 µs Standby/slope control (pin 8) Vstb input voltage for standby mode 0.75VCC − − V Islope slope control mode current −10 − −200 µA Vslope slope control mode voltage 0.4VCC − 0.6VCC V Notes 1. I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC; Tamb < 90 °C. 2. This is valid for the receiver in all modes: high-speed, slope control and standby. 2000 Jan 13 7 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 TEST AND APPLICATION INFORMATION 100 nF handbook, full pagewidth +5 V VCC TXD Vref RXD 3 1 7 60 Ω PCA82C251 5 6 4 2 CANH 100 pF CANL 8 GND Rs 30 pF MBG614 Fig.3 Test circuit for dynamic characteristics. VCC handbook, full pagewidth VTXD 0V 0.9 V Vdiff 0.5 V 0.7VCC VRXD 0.3VCC toffTXD tonTXD toffRXD tonRXD Fig.4 Timing diagram for dynamic characteristics. 2000 Jan 13 8 MBG615 Philips Semiconductors Product specification CAN transceiver for 24 V systems handbook, full pagewidth PCA82C251 MBG616 VRXD HIGH LOW hysteresis 0.5 0.9 Vdiff (V) Fig.5 Hysteresis. VCC handbook, full pagewidth VRs 0V VRXD tWAKE MBG617 VTXD = 1 V. Fig.6 Timing diagram for wake up from standby. 1.5 V handbook, full pagewidth Vdiff 0V VRXD tdRXDL VRs = 4 V; VTXD = 4 V. Fig.7 Timing diagram for bus dominant to RXD low. 2000 Jan 13 9 MBG618 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 100 nF handbook, full pagewidth +5 V VCC TXD Vref RXD 3 1 7 6 4 2 CANL 8 GND SCHAFFNER GENERATOR 60 Ω PCA82C251 5 500 pF CANH 500 pF MBG619 Rs 47 kΩ The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b. Fig.8 Test circuit for automotive transients. handbook, full pagewidth P8xC592 CAN-CONTROLLER CTX0 CRX0 CRX1 PX,Y Rext TXD RXD Vref +5 V Rs VCC PCA82C251 CAN-TRANSCEIVER CANH 120 Ω 100 nF GND CANL CAN BUS LINE 120 Ω MBG620 (1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation, dominant = LOW). (2) If no slope control is desired: Rext = 0. Fig.9 Application of the PCA82C251 CAN Transceiver. 2000 Jan 13 10 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 BONDING PAD LOCATIONS COORDINATES(1) SYMBOL PAD TXD 1 x y 196 137 GND 2 1080 137 VCC 3 1567 137 RXD 4 2644 137 Vref 5 2644 1644 CANL 6 1490 1644 CANH 7 748 1644 Rs 8 200 1610 Note Vref 8 CANL Rs handbook, full pagewidth CANH 1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of the die (x/y = 0). 7 6 5 1.78 mm 3 4 VCC RXD 0 2 GND 0 1 TXD x PCA82C251U y 2.84 mm Fig.10 Bonding pad locations. 2000 Jan 13 11 MGL944 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC EIAJ SOT97-1 050G01 MO-001 SC-504-8 2000 Jan 13 12 EUROPEAN PROJECTION ISSUE DATE 95-02-04 99-12-27 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2000 Jan 13 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 13 o 8 0o Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE • For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2000 Jan 13 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 14 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Jan 13 15 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2000 Jan 13 16 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 NOTES 2000 Jan 13 17 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 NOTES 2000 Jan 13 18 Philips Semiconductors Product specification CAN transceiver for 24 V systems PCA82C251 NOTES 2000 Jan 13 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 69 © Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 285002/03/pp20 Date of release: 2000 Jan 13 Document order number: 9397 750 06611