High Voltage Chip Resistors HVC Series • • • • • Continuous voltages up to 3KV Resistance Values from 100KW to 100MW Tolerances of ±0.5% to ±10% Sn/Pb or Matte Sn wrap-around terminations Standard chip sizes available from 1206 to 2512 • Robust thick film construction Electrical Data Characteristic 1206 2010 2512 1000V 2000V 3000V -25 ppm/V Max. -15 ppm/V Max. -5 ppm/V Max. -15 ppm/V Typ. -5 ppm/V Typ. -1.5 ppm/V Typ. Maximum Rated Voltage1 Voltage Coefficient of Resistance 100KW to 10M (±0.5% ,±1%, ±2% ,±5%, ±10%) 2 Resistance Range (Tolerance) Power @ 70°C 10MW to 100MW (±5%, ±10%) 300mW Operating Temperature Thermal Impedance 500mW 1000mW -55°C to +155°C 200°C/W TCR Termination 80°C/W 70°C/W ±100ppm/°C Wrap-around Sn/Pb or matte Sn with leach resistant Ni barrier Notes: 1. Voltage Limited to √PxR 2. ±0.5% in 2512 package only Environmental Data Maximum ∆R Typical ∆R Load life at rated power (1000 hours @ 70°C) 0.50% 0.25% Overload (6.25 X rated power for 2 seconds) 0.50% 0.10% High temperature storage (1000 hours @ 155°C) 0.50% 0.20% Moisture resistance 0.50% 0.25% Thermal shock 0.25% 0.05% Resistance to soldering heat 0.25% 0.05% Test General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TTelectronics plc PWC Series Issue July 2008 High Voltage Chip Resistors Physical Data L (mm) W (mm) T max (mm) A (mm) C (mm) Weight (grams) 1206 3.2±0.2 1.6±0.2 0.6 0.5±0.2 0.5±0.2 0.010 2010 5.3±0.2 2.5±0.2 0.7 0.5±0.2 0.5±0.2 0.035 2512 6.6±0.2 3.2±0.2 0.7 0.5±0.2 0.5±0.2 0.055 L W C T A Maximum Continuous Voltage Power Derating Data 10000 % Of Rated P ower Voltage (Volts) 100 2512 2010 1206 1000 50 10 100 0.1 1 10 100 25° Resistance (Megohms) Construction: Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around terminations have an electroplated nickel barrier and tin-lead solder or matte-tin finish, ensuring excellent `leach´ resistance properties and solderability. Wrap around terminations ensure reliable contact. This robust construction enables the resistor to be mounted on one side of a printed circuit board and a wire-leaded component applied on the opposite side. Marking: Components are not marked. Reels are marked with type, value, tolerance, date code and quantity. Solvent resistance: The body protection is resistance to all normal industrial cleaning solvents suitable for printed circuits. PCB Layout Recommendation: Avoid running conducting traces between the HVC mounting pads, as this would compromise the rated voltage. Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com 70° 155° Temperature in °C Ordering Data Prefix TKC - HVC 2512LF - 3M30 - F Chip Type HVC Size and Termination 1206 = Sn/Pb solder termination 1206LF = 100% Tin (pb-free) termination 2010 = Sn/Pb solder termination 2010LF = 100% Tin (pb-free) termination 2512 = Sn/Pb solder termination 2512LF = 100% Tin (pb-free) termination Resistance Value 4 digit code: 100K=100,000 ohms, 1M20=1,200,000 ohms Tolerance Code K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5% For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. PWC Series Issue July 2008