SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 D Low Power Consumption D Wide Common-Mode and Differential D D D D Voltage Ranges D Low Input Bias and Offset Currents D Output Short-Circuit Protection D Low Total Harmonic High Input Impedance . . . JFET-Input Stage Latch-Up-Free Operation High Slew Rate . . . 13 V/µs Typ Common-Mode Input Voltage Range Includes VCC+ Distortion . . . 0.003% Typ description/ordering information The TL08x JFET-input operational amplifier family is designed to offer a wider selection than any previously developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset adjustment and external compensation options are available within the TL08x family. The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized for operation from −40°C to 85°C. The Q-suffix devices are characterized for operation from −40°C to 125°C. The M-suffix devices are characterized for operation over the full military temperature range of −55°C to 125°C. ORDERING INFORMATION TJ VIOmax AT 255C PDIP (P) PDIP (N) SOIC (D) 0°C to 70°C ORDERABLE PART NUMBER PACKAGE† 15 mV SOP (PS) SOP (NS) TSSOP (PW) TOP-SIDE MARKING Tube of 50 TL081CP TL081CP Tube of 50 TL082CP TL082CP Tube of 25 TL084CN TL084CN Tube of 75 TL081CD Reel of 2500 TL081CDR Tube of 75 TL082CD Reel of 2500 TL082CDR Tube of 50 TL084CD Reel of 2500 TL084CDR Reel of 2000 TL081CPSR T081 Reel of 2000 TL082CPSR T082 Reel of 2000 TL084CNSR TL084 Tube of 150 TL082CPW Reel of 2000 TL082CPWR Tube of 90 TL084CPW Reel of 2000 TL084CPWR TL081C TL082C TL084C T082 T084 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* &)$#!" #&(! ! 0101 (( &%!%" % !%"!%) $(%"" !+%-"% !%)* (( !+% &)$#!" &)$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 description/ordering information (continued) ORDERING INFORMATION TJ VIOmax AT 255C PACKAGE† TL081ACP TL081ACP Tube of 50 TL082ACP TL082ACP Tube of 25 TL084ACN TL084ACN Tube of 75 TL081ACD Reel of 2500 TL081ACDR Tube of 75 TL082ACD Reel of 2500 TL082ACDR Tube of 50 TL084ACD Reel of 2500 TL084ACDR SOP (PS) Reel of 2000 TL082ACPSR T082A SOP (NS) Reel of 2000 TL084ACNSR TL084A Tube of 50 TL081BCP TL081BCP Tube of 50 TL082BCP TL082BCP Tube of 25 TL084BCN TL084BCN Tube of 75 TL081BCD Reel of 2500 TL081BCDR Tube of 75 TL082BCD Reel of 2500 TL082BCDR Tube of 50 TL084BCD Reel of 2500 TL084BCDR Tube of 50 TL081IP TL081IP Tube of 50 TL082IP TL082IP Tube of 25 TL084IN TL081IN Tube of 75 TL081ID Reel of 2500 TL081IDR Tube of 75 TL082ID Reel of 2500 TL082IDR Tube of 50 TL084ID Reel of 2500 TL084IDR Reel of 2000 TL082IPWR Tube of 50 TL084QD Reel of 2500 TL084QDR CDIP (J) Tube of 25 TL084MJ TL084MJ LCCC (FK) Reel of 55 TL084FK TL084FK CDIP (JG) Tube of 50 TL082MJG TL082MJG PDIP (N) 0°C to 70°C SOIC (D) PDIP (P) PDIP (N) 3 mV SOIC (D) PDIP (P) PDIP (N) −40°C to 85°C 6 mV SOIC (D) TSSOP (PW) −40°C to 125°C 9 mV 9 mV −55°C to 125°C 6 mV TOP-SIDE MARKING Tube of 50 PDIP (P) 6 mV ORDERABLE PART NUMBER SOIC (D) 081AC 082AC TL084AC 081BC 082BC TL084BC TL081I TL082I TL084I Z082 TL084QD LCCC (FK) Tube of 55 TL082MFK TL082MFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 TL081, TL081A, TL081B D, P, OR PS PACKAGE (TOP VIEW) OFFSET N1 IN − IN + VCC − 1 8 2 7 3 6 4 5 TL084, TL084A, TL084B D, J, N, NS, OR PW PACKAGE (TOP VIEW) TL082, TL082A, TL082B D, JG, P, PS, OR PW PACKAGE (TOP VIEW) NC VCC + OUT OFFSET N2 1OUT 1IN − 1IN + VCC − 1 8 2 7 3 6 4 5 VCC + 2OUT 2IN − 2IN + 1OUT 1IN − 1IN + VCC + 2IN + 2IN − 2OUT NC − No internal connection 14 2 13 3 12 4 11 5 10 6 9 7 8 4OUT 4IN − 4IN + VCC − 3IN + 3IN − 3OUT TL084M . . . FK PACKAGE (TOP VIEW) 1IN − 1OUT NC 4OUT 4IN − NC 1OUT NC VCC+ NC TL082M . . . FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN − NC 1IN + NC VCC + NC 2IN + 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4IN + NC VCC − NC 3IN + 2IN − 2OUT NC 3OUT 3IN − NC VCC − NC 2IN + NC NC 1IN − NC 1IN + NC 1 NC − No internal connection NC − No internal connection symbols TL081 TL082 (EACH AMPLIFIER) TL084 (EACH AMPLIFIER) OFFSET N1 IN + + IN − − OUT IN + + IN − − OUT OFFSET N2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 schematic (each amplifier) VCC + IN + 64 Ω IN − OUT 128 Ω 64 Ω C1 1080 Ω 1080 Ω VCC − OFFSET N2 OFFSET N1 TL081 Only Component values shown are nominal. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† TL08_C TL08_AC TL08_BC TL08_I TL084Q TL08_M UNIT Supply voltage, VCC + (see Note 1) 18 18 18 18 V Supply voltage VCC − (see Note 1) −18 −18 −18 −18 V Differential input voltage, VID (see Note 2) ± 30 ± 30 ± 30 ± 30 V V ± 15 ± 15 ± 15 ± 15 Unlimited Unlimited Unlimited Unlimited 0 to 70 − 40 to 85 D package (8-pin) 97 97 D package (14-pin) 86 86 N package (14-pin) 76 76 NS package (14-pin) 80 P package (8-pin) 85 85 PS package (8-pin) 95 95 PW package (8-pin) 149 Input voltage, VI (see Notes 1 and 3) Duration of output short circuit (see Note 4) Continuous total power dissipation See Dissipation Rating Table Operating free-air temperature range, TA Package thermal impedance, θJA (see Notes 5 and 6) PW package (14-pin) Operating virtual junction temperature 113 113 150 150 − 40 to 125 − 55 to 125 °C °C/W 150 150 °C Case temperature for 60 seconds, TC FK package 260 °C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds J or JG package 300 °C Storage temperature range, Tstg − 65 to 150 − 65 to 150 − 65 to 150 − 65 to 150 °C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC + and VCC − . 2. Differential voltages are at IN+ with respect to IN −. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. 5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING D (14 pin) 680 mW FK J JG DERATING FACTOR DERATE ABOVE TA TA = 70°C POWER RATING TA = 85°C POWER RATING TA = 125°C POWER RATING 7.6 mW/°C 60°C 604 mW 490 mW 186 mW 680 mW 11.0 mW/°C 88°C 680 mW 680 mW 273 mW 680 mW 11.0 mW/° C 88°C 680 mW 680 mW 273 mW 680 mW 8.4 mW/°C 69°C 672 mW 546 mW 210 mW POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 6 VO = 0 VO = 0 VO = 0 Temperature coefficient of input offset voltage Input offset current ‡ Input bias current ‡ α VIO IIO IIB POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 25°C Common-mode rejection ratio CMRR VO = 0, No load VCC = ± 15 V to ± 9 V, VO = 0, RS = 50 Ω VIC = VICRmin, RS = 50 Ω VO = 0, 25°C 25°C Full range 25°C Full range ± 12 70 70 15 25 ± 10 2 1.4 86 86 80 75 1.4 86 86 3 200 ± 12 ± 13.5 1012 25 50 ± 10 ± 12 ± 12 ± 11 −12 to 15 30 5 18 3 TYP 3 2.8 10 400 MIN 1012 200 ± 12 ± 13.5 ± 11 ± 12 −12 to 15 30 200 20 15 MAX TL081AC TL082AC TL084AC 2.8 7 200 2 100 7.5 6 MAX 80 75 25 50 ± 10 ± 12 ± 12 ± 11 MIN 1.4 86 86 1012 3 200 ± 12 ± 13.5 −12 to 15 30 5 18 2 TYP TLO81BC TL082BC TL084BC 2.8 7 200 2 100 5 3 MAX 80 75 25 50 ± 10 ± 12 ± 12 ± 11 MIN 1.4 86 86 1012 3 200 ± 12 ± 13.5 −12 to 15 30 5 18 3 TYP TL081I TL082I TL084I 2.8 20 200 10 100 9 6 MAX mA dB dB Ω MHz V/mV V V nA pA nA pA µV/°C mV UNIT VO1/ VO2 Crosstalk attenuation AVD = 100 25°C 120 120 120 120 dB † All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Full range for TA is 0°C to 70°C for TL08_C, TL08_AC, TL08_BC and − 40°C to 85°C for TL08_I. ‡ Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques must be used that maintain the junction temperature as close to the ambient temperature as possible. ICC Supply-voltage rejection ratio (∆ VCC± /∆ VIO) Supply current (per amplifier) 25°C Input resistance ri kSVR 25°C Unity-gain bandwidth B1 VO = ± 10 V, VO = ± 10 V, RL ≥ 2 kΩ Large-signal differential voltage amplification AVD RL ≥ 2 kΩ RL ≥ 10 kΩ VOM 25°C Maximum peak output voltage swing 25°C Full range 25°C Full range 5 25°C 3 TYP 18 MIN TL081C TL082C TL084C Full range Full range Common-mode input voltage range RL ≥ 2 kΩ RS = 50 Ω RS = 50 Ω 25°C VICR RL = 10 kΩ VO = 0 Input offset voltage TEST CONDITIONS VIO PARAMETER TA† electrical characteristics, VCC± = ±15 V (unless otherwise noted) 22222 2 2 322 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 electrical characteristics, VCC ± = ± 15 V (unless otherwise noted) PARAMETER TEST CONDITIONS† TA TL081M, TL082M TL084Q, TL084M MIN MIN 25°C TYP MAX 3 6 VIO Input offset voltage VO = 0, RS = 50 Ω Full range αVIO Temperature coefficient of input offset voltage VO = 0 RS = 50 Ω Full range 18 Input offset current‡ 25°C 5 IIO VO = 0 125°C IIB Input bias current‡ VO = 0 125°C VICR Common-mode input voltage range VOM Maximum peak output voltage swing AVD B1 ri CMRR kSVR ICC Large-signal differential voltage amplification RL ≥ 10 kΩ 100 5 200 30 50 ± 11 − 12 to 15 ± 11 − 12 to 15 25°C ± 12 ± 13.5 ± 12 ± 13.5 ± 12 ± 10 ± 12 200 25 200 25°C 25 VO = ± 10 V, RL ≥ 2 kΩ Full range 15 100 pA 20 nA 200 pA 50 nA V V ± 12 RL ≥ 2 kΩ mV µV/°C ± 12 ± 10 VO = ± 10 V, UNIT 9 18 20 30 MAX 15 25°C Full range RL ≥ 2 kΩ 3 9 25°C RL = 10 kΩ TYP V/mV Unity-gain bandwidth 25°C Input resistance 25°C 15 3 1012 3 1012 MHz Ω Common-mode rejection ratio VIC = VICRmin, VO = 0, RS = 50 Ω 25°C 80 86 80 86 dB Supply-voltage rejection ratio (∆VCC ± /∆VIO) Supply current (per amplifier) VCC = ± 15 V to ± 9 V, VO = 0, RS = 50 Ω 25°C 80 86 80 86 dB VO = 0, 25°C No load 1.4 2.8 1.4 2.8 mA VO1/ VO2 Crosstalk attenuation AVD = 100 25°C 120 120 dB † All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. ‡ Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible. operating characteristics, VCC± = ± 15 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS VI = 10 V, RL = 2 kΩ, CL = 100 pF, VI = 10 V, TA = − 55 55°C C to 125 125°C, C, RL = 2 kΩ, See Figure 1 CL = 100 pF, Overshoot factor VI = 20 mV, RL = 2 kΩ, CL = 100 pF, Vn Equivalent input noise voltage RS = 20 Ω In Equivalent input noise current RS = 20 Ω, f = 1 kHz THD Total harmonic distortion VIrms = 6 V, f = 1 kHz AVD = 1, SR Slew rate at unity gain tr Rise time See Figure 1 TYP 8∗ 13 See Figure 1 f = 10 Hz to 10 kHz RL ≥ 2 kΩ, MAX UNIT V/µs 5∗ f = 1 kHz RS ≤ 1 kΩ, MIN 0.05 µs 20 % 18 nV/√Hz 4 µV 0.01 pA/√Hz 0.003 % ∗On products compliant to MIL-PRF-38535, this parameter is not production tested. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 operating characteristics, VCC± = ± 15 V, TA = 25°C PARAMETER TEST CONDITIONS SR Slew rate at unity gain tr Rise time VI = 10 V, RL = 2 kΩ, Overshoot factor VI = 20 mV, RL = 2 kΩ, Vn Equivalent input noise voltage RS = 20 Ω In Equivalent input noise current RS = 20 Ω, f = 1 kHz THD Total harmonic distortion VIrms = 6 V, f = 1 kHz AVD = 1, MIN CL = 100 pF, CL = 100 pF, See Figure 1 8 See Figure 1 f = 1 kHz f = 10 Hz to 10 kHz TYP MAX UNIT V/ µs 13 0.05 µs 20 % 18 nV/√Hz µV 4 RS ≤ 1 kΩ, RL ≥ 2 kΩ, 0.01 pA/√Hz 0.003 % PARAMETER MEASUREMENT INFORMATION 10 kΩ − 1 kΩ − OUT VI + VI OUT CL = 100 pF RL = 2 kΩ + CL = 100 pF RL Figure 1 Figure 2 100 kΩ TL081 − IN − C2 OUT + IN + C1 500 pF N2 N1 − IN − 100 kΩ N1 OUT + 1.5 kΩ VCC − Figure 3 8 Figure 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS Table of Graphs FIGURE VOM AVD Maximum peak output voltage vs Frequency vs Free-air temperature vs Load resistance vs Supply voltage 5, 6, 7 8 9 10 Large-signal differential voltage amplification vs Free-air temperature vs Frequency 11 12 Differential voltage amplification vs Frequency with feed-forward compensation 13 PD Total power dissipation vs Free-air temperature 14 ICC Supply current vs Free-air temperature vs Supply voltage 15 16 IIB Input bias current vs Free-air temperature 17 Large-signal pulse response vs Time 18 VO CMRR Output voltage vs Elapsed time 19 Common-mode rejection ratio vs Free-air temperature 20 Vn THD Equivalent input noise voltage vs Frequency 21 Total harmonic distortion vs Frequency 22 MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY ± 15 VCC ± = ± 15 V RL = 10 kΩ TA = 25°C See Figure 2 ± 12.5 ± 10 VCC ± = ± 10 V ± 7.5 ±5 VCC ± = ± 5 V ± 2.5 0 100 VOM − Maximum Peak Output Voltage − V VOM − Maximum Peak Output Voltage − V ± 15 RL = 2 kΩ TA = 25°C See Figure 2 VCC ± = ± 15 V ± 12.5 ± 10 VCC ± = ± 10 V ± 7.5 ±5 VCC ± = ± 5 V ± 2.5 0 1k 10 k 100 k 1M 10 M 100 f − Frequency − Hz 1k 10 k 100 k 1M 10 M f − Frequency − Hz Figure 5 Figure 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS† MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY MAXIMUM PEAK OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE ± 12.5 TA = 25°C ± 10 TA = − 55°C ± 7.5 ±5 TA = 125°C ± 2.5 0 10 k ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ± 15 VCC ± = ± 15 V RL = 2 kΩ See Figure 2 VOM − Maximum Peak Output Voltage − V VOM − Maximum Peak Output Voltage − V ± 15 40 k 100 k 400 k 1M 4M RL = 10 kW ± 12.5 RL = 2 kW ± 10 ± 7.5 ±5 ± 2.5 VCC ± = ± 15 V See Figure 2 0 − 75 − 50 10 M − 25 Figure 7 75 100 ± 10 ± 7.5 ±5 ± 2.5 RL = 10 kΩ TA = 25°C ± 12.5 ± 10 ± 7.5 ±5 ± 2.5 0 0.2 0.4 0.7 1 2 4 7 10 0 2 4 6 8 10 12 14 | VCC ± | − Supply Voltage − V RL − Load Resistance − kΩ Figure 10 Figure 9 † Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. 10 125 ± 15 VCC ± = ± 15 V TA = 25°C See Figure 2 VOM − Maximum Peak Output Voltage − V VOM − Maximum Peak Output Voltage − V 50 MAXIMUM PEAK OUTPUT VOLTAGE vs SUPPLY VOLTAGE ± 15 0 0.1 25 Figure 8 MAXIMUM PEAK OUTPUT VOLTAGE vs LOAD RESISTANCE ± 12.5 0 TA − Free-Air Temperature − °C f − Frequency − Hz POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 16 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS† LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREE-AIR TEMPERATURE 1000 700 AVD − Large-Signal Differential Voltage Amplification − V/mV 400 200 100 70 40 20 10 7 4 VCC ± = ± 15 V VO = ± 10 V RL = 2 kΩ 2 1 −75 −50 −25 0 25 50 75 100 125 TA − Free-Air Temperature − °C Figure 11 LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREQUENCY 106 VCC ± = ± 5 V to ± 15 V RL = 10 kΩ TA = 25°C 104 Differential Voltage Amplification (left scale) 103 102 0° 45 ° Phase Shift AVD − Large-Signal Differential Voltage Amplification − V/mV 105 90 ° Phase Shift (right scale) 101 135 ° 1 1 10 100 1k 10 k 100 k 1M 180 ° 10 M f − Frequency − Hz Figure 12 † Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS† DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREQUENCY WITH FEED-FORWARD COMPENSATION TOTAL POWER DISSIPATION vs FREE-AIR TEMPERATURE 250 VCC ± = ± 15 V C2 = 3 pF TA = 25°C See Figure 3 105 104 103 102 10 VCC ± = ± 15 V No Signal No Load 225 PD − Total Power Dissipation − mW AVD − Differential Voltage Amplification − V/mV 106 200 175 TL084, TL085 150 125 100 TL082, TL083 75 TL081 50 25 1 100 1k 10 k 100 k 1M 0 −75 10 M −50 −25 f − Frequency With Feed-Forward Compensation − Hz SUPPLY CURRENT PER AMPLIFIER vs FREE-AIR TEMPERATURE 50 75 100 125 SUPPLY CURRENT vs SUPPLY VOLTAGE 2.0 2.0 VCC ± = ± 15 V No Signal No Load 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 TA = 25°C No Signal No Load 1.8 I CC ± − Supply Current − mA I CC ± − Supply Current − mA 25 Figure 14 Figure 13 0 −75 0 TA − Free-Air Temperature − °C 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 −50 −25 0 25 50 75 100 125 0 0 2 TA − Free-Air Temperature − °C 4 6 8 10 12 14 | VCC ± | − Supply Voltage − V Figure 16 Figure 15 † Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 16 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS† INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE 6 100 VCC ± = ± 15 V RL = 2 k Ω CL = 100 pF TA = 25°C Input and Output Voltages − V I IB − Input Bias Current − nA V CC ± = ± 15 V 10 1 0.1 4 Output 2 0 −2 Input −4 0.01 − 50 −6 − 25 0 25 50 75 100 125 0 0.5 TA − Free-Air Temperature − °C CMRR − Common-Mode Rejection Ratio − dB 89 VO − Output Voltage − mV 24 20 VCC ± = ± 15 V RL = 2 k Ω CL = 100 pF TA = 25°C See Figure 1 4 0 −4 0 0.2 0.4 2.5 3 3.5 COMMON-MODE REJECTION RATIO vs FREE-AIR TEMPERATURE 28 8 2 Figure 18 OUTPUT VOLTAGE vs ELAPSED TIME 12 1.5 t − Time − µ s Figure 17 16 1 0.6 0.8 1.0 1.2 VCC ± = ± 15 V RL = 10 kΩ 88 87 86 85 84 83 − 75 − 50 t − Elapsed Time − µ s − 25 0 25 50 75 100 125 TA − Free-Air Temperature − °C Figure 20 Figure 19 † Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS† EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY TOTAL HARMONIC DISTORTION vs FREQUENCY 1 VCC ± = ± 15 V AVD = 10 RS = 20 Ω TA = 25°C 40 30 20 10 0.1 0.04 0.01 0.004 0.001 0 40 10 100 400 1 k 4 k 10 k VCC ± = ± 15 V AVD = 1 VI(RMS) = 6 V TA = 25°C 0.4 THD − Total Harmonic Distortion − % Vn − Equilvalent Input Noise Voltage − nV/ Hz 50 40 k 100 k 10 400 1k 4k 10 k 40 k 100 k f − Frequency − Hz f − Frequency − Hz Figure 22 Figure 21 † Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. APPLICATION INFORMATION RF = 100 kΩ VCC + − Output − TL081 + CF = 3.3 µF Input R1 R2 C3 TL081 + 15 V 3.3 kΩ Output VCC − 1 kΩ −15 V R1 = R2 = 2(R3) = 1.5 MΩ R3 3.3 kΩ f= C1 9.1 kΩ 1 2π RF CF Figure 23 14 C2 C1 = C2 = C3 = 110 pF 2 1 fo = = 1 kHz 2π R1 C1 Figure 24 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 APPLICATION INFORMATION VCC + 1 MΩ − TL084 VCC + Output A + + 1 µF TL084 VCC + − Input − TL084 100 kΩ 100 kΩ 100 µF Output B + 100 kΩ VCC + VCC + 100 kΩ − TL084 Output C + Figure 25. Audio-Distribution Amplifier 6 sin ωt 1N4148 − 15 V 18 pF 18 pF 1 kΩ 18 kΩ (see Note A) VCC + 1/2 TL082 + 88.4 kΩ VCC+ − − 88.4 kΩ 1/2 TL082 VCC − 6 cos ωt + 18 pF VCC − 1 kΩ 15 V 1N4148 88.4 kΩ 18 kΩ (see Note A) NOTE A: These resistor values may be adjusted for a symmetrical output. Figure 26. 100-KHz Quadrature Oscillator POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15 SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004 APPLICATION INFORMATION 16 kΩ 16 kΩ 220 pF 220 pF VCC + 43 kΩ 43 kΩ 1/4 TL084 VCC + VCC + 43 kΩ 1/4 TL084 1/4 TL084 + + + 1.5 kΩ + − 1/4 TL084 220 pF VCC + − Input 220 pF 30 kΩ − 43 kΩ 43 kΩ 30 kΩ 1.5 kΩ VCC − − 43 kΩ VCC − VCC − VCC − Output A Output A Output B 2 kHz/div Second-Order Bandpass Filter fo = 100 kHz, Q = 30, GAIN = 4 2 kHz/div Cascaded Bandpass Filter fo = 100 kHz, Q = 69, GAIN = 16 Figure 27. Positive-Feedback Bandpass Filter 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Output B PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9851501Q2A ACTIVE LCCC FK 20 1 TBD 5962-9851501QPA ACTIVE CDIP JG 8 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK 20 1 TBD 5962-9851503QCA ACTIVE CDIP J 14 1 TBD A42 TL081ACD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081ACDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081ACDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081ACDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG 8 TBD Call TI TL081ACP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081ACPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081BCD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081BCDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081BCDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081BCDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081BCDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081BCDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081BCPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 POST-PLATE N / A for Pkg Type N / A for Pkg Type Call TI PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL081CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CPSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW 8 TBD Call TI TL081ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL081MFKB OBSOLETE LCCC FK 20 TBD Call TI Call TI TL081MJG OBSOLETE CDIP JG 8 TBD Call TI Call TI TL081MJGB OBSOLETE CDIP JG 8 TBD Call TI Call TI TL082ACD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL082ACPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL082ACPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACPSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082ACPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 Lead/Ball Finish MSL Peak Temp (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL082BCD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082BCDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082BCDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082BCDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082BCDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082BCDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082BCP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL082BCPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL082CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG 8 TL082CP ACTIVE PDIP P 8 TL082CPE4 ACTIVE PDIP P 8 TL082CPSR ACTIVE SO PS 8 TL082CPSRG4 ACTIVE SO PS TL082CPW ACTIVE TSSOP TL082CPWE4 ACTIVE TL082CPWG4 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TBD Call TI 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW 8 TL082CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 3 Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL082ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG 8 TL082IP ACTIVE PDIP P 8 TL082IPE4 ACTIVE PDIP P 8 TL082IPWR ACTIVE TSSOP PW 8 TL082IPWRE4 ACTIVE TSSOP PW TL082IPWRG4 ACTIVE TSSOP Lead/Ball Finish MSL Peak Temp (3) TBD Call TI 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK 20 TL082MFKB ACTIVE LCCC FK 20 1 TBD TBD TL082MJG ACTIVE CDIP JG 8 1 TBD TL082MJGB ACTIVE CDIP JG 8 1 TL084ACD ACTIVE SOIC D 14 50 TL084ACDE4 ACTIVE SOIC D 14 50 TL084ACDG4 ACTIVE SOIC D 14 50 TL084ACDR ACTIVE SOIC D TL084ACDRE4 ACTIVE SOIC TL084ACDRG4 ACTIVE TL084ACN Call TI Call TI Call TI POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL084ACNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL084ACNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084ACNSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084ACNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084BCD ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 4 Green (RoHS & no Sb/Br) PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL084BCDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084BCDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084BCDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084BCDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084BCDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084BCN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL084BCNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL084CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CJ OBSOLETE CDIP J 14 TL084CN ACTIVE PDIP N 14 TL084CNE4 ACTIVE PDIP N 14 TL084CNSLE OBSOLETE SO NS 14 TL084CNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW 14 TL084CPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084CPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084ID ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TBD TBD 50 Addendum-Page 5 Green (RoHS & no Sb/Br) Call TI Call TI Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL084IDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084IDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) TL084IJ OBSOLETE CDIP J 14 TBD Call TI TL084IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Call TI N / A for Pkg Type TL084INE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL084MFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TL084MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TL084MJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type TL084MJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type TL084QD ACTIVE SOIC D 14 50 TBD CU NIPDAU Level-1-220C-UNLIM TL084QDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL084QDR ACTIVE SOIC D 14 2500 TBD CU NIPDAU Level-1-220C-UNLIM TL084QDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 6 PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2009 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M : • Automotive: TL082-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TL081ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL081BCDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL081CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL081CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TL081IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082ACPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TL082BCDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TL082CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TL082IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL082IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TL084ACDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL084ACDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-Mar-2008 Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TL084ACNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 TL084BCDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL084CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL084CNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 TL084CPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 TL084IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL081ACDR SOIC D 8 2500 340.5 338.1 20.6 TL081BCDR SOIC D 8 2500 340.5 338.1 20.6 TL081CDR SOIC D 8 2500 340.5 338.1 20.6 TL081CPSR SO PS 8 2000 346.0 346.0 33.0 TL081IDR SOIC D 8 2500 340.5 338.1 20.6 TL082ACDR SOIC D 8 2500 340.5 338.1 20.6 TL082ACDR SOIC D 8 2500 346.0 346.0 29.0 TL082ACPSR SO PS 8 2000 346.0 346.0 33.0 TL082BCDR SOIC D 8 2500 340.5 338.1 20.6 TL082CDR SOIC D 8 2500 346.0 346.0 29.0 TL082CDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL082CPSR SO PS 8 2000 346.0 346.0 33.0 TL082CPWR TSSOP PW 8 2000 346.0 346.0 29.0 TL082IDR SOIC D 8 2500 346.0 346.0 29.0 TL082IDR SOIC D 8 2500 340.5 338.1 20.6 TL082IPWR TSSOP PW 8 2000 346.0 346.0 29.0 TL084ACDR SOIC D 14 2500 346.0 346.0 33.0 TL084ACDR SOIC D 14 2500 333.2 345.9 28.6 TL084ACNSR SO NS 14 2000 346.0 346.0 33.0 TL084BCDR SOIC D 14 2500 333.2 345.9 28.6 TL084CDR SOIC D 14 2500 333.2 345.9 28.6 TL084CNSR SO NS 14 2000 346.0 346.0 33.0 TL084CPWR TSSOP PW 14 2000 346.0 346.0 29.0 TL084IDR SOIC D 14 2500 333.2 345.9 28.6 Pack Materials-Page 3 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated