ETC TM54S816T-6G

晶揚科技股份有限公司
Taiwan Micropaq Corporation
承 認 書
SPECIFICATION FOR APPROVAL
TM54S816T-6G
新竹縣新竹工業區文化路 4 號
No.4 Wenhua Rd. HsinChu Industrial Park
HuKou , Taiwan, R.O.C.
TEL:886-3-597-9402 ˙ FAX:886-3-597-0775
http://www.tmc.com.tw
TMC
TM54S816T-6G
Description
The TM54S816T is organized as 4-bank x 2097152-word x 16-bit(8Mx16),
fabricated with high performance CMOS technology. Synchronous design
allows precise cycle control with the use of system clock I/O transactions are
possible on every clock cycle. Range of operating frequencies, programmable
burst length and programmable latencies allow the same device to be useful
for a variety of high bandwidth, high performance memory system applications.
Features
„ Package: 400-mil 54-pin TSOP(II)
„ JEDEC PC133/PC100 compatible
„ Single 3.3V Power Supply
„ LVTTL Signal Compatible
„ Byte control(DQML and DQMU)
„ Auto and Self Refresh
„ 64ms refresh period (4K Refresh)
„ 12-Row x 9-Column organization
„ 4-Bank operation controlled by BA1,BA0
„ Pin36 and 40 are “No Connected”
„ Fully synchronous operation referenced
to clock rising edge
„ Programmable
- CAS Latency (3 or 2 clocks)
- Burst Length (1,2,4, 8 & full page)
- Burst type (Sequential & Interleave)
„ Burst read/write and burst read/single
write operations capability
Frequency vs. AC Parameter
Symbol
Parameter
fCK3
fCK2
tCK3
tAC3
tCK2
tAC2
trcd
Max. operating frequency @CL=3
Max. operating frequency @CL=2
Min. clock cycle time @CL=3
Max. access time from CLK @CL=3
- 6G
166
133
6.0
5.0
- 7G
143
133
7.0
5.4
- 75G
133
100
7.5
5.4
Unit
Mhz
Mhz
ns
ns
Min. clock cycle time @CL=2
Max. access time from CLK @CL=2
Min. row to column delay
7.5
5.4
15
7.5
5.4
18
10
6.0
18
ns
ns
ns
For reference only.
2
TMC Rev: 1.1
TMC
TM54S816T-6G
Pin Description
Pin Name
CLK
CKE
/CS
/RAS
/CAS
/WE
DQ0~DQ15
Function
Master Clock
Clock Enable
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Data I/O
For reference only.
Pin Name
DQML/DQMU
A0-11
BA1,BA0
Vdd
VddQ
Vss/VssQ
NC
3
Function
Output Disable(Write Mask)
Address Input
Bank Address
Power Supply
Power Supply for Output
Ground
No Connection
TMC Rev: 1.1
TMC
TM54S816T-6G
Pin Function
Pin
Pin Function
CLK
Active on the positive going edge to sample all
inputs.
/CS
Chip select
Disables or enables device operation by
masking or enabling all inputs except
CLK,CKE and DQML/DQMU.
CKE
Clock enable
Masks system clock to freeze operation from
the next clock cycle. CKE should be enabled at
least one cycle prior to new command. Disable
input buffers for power down in standby.
A0~A11
Address input
Row/column addresses are multiplexed on the
same pins. Row address:A0~A11, Column
address:A0~A7
BA1,BA0
Bank address
Selects bank to be activated during row address
latch time. Selects bank for read/write during
column address latch time.
/RAS
Row address strobe
Latches row addresses on the positive going
edge of the CLK with /RAS low. Enables rows
access & pre-charge.
/CAS
Column address strobe Latches column addresses on the positive going
edge of the CLK with /CAS low. Enables
column access.
/WE
Write enable
Enables write operation and row pre-charge.
Latches data in starting from /CAS,/WE active.
DQMU/DQML Data I/O mask
Makes data output Hi-Z, Tshz after the clock
and masks the output. Blocks data input when
DQML/DQMU active.
DQ0~15
Data input/output
Data inputs/outputs are multiplexed on the
same pins.
Vdd/Vss
Power supply/ground Power and ground for the input buffers and the
core logic.
VddQ/VssQ
Data output power /
Isolated power supply and ground for the
ground
output buffers to provide improved noise
immunity.
For reference only.
Name
System clock
4
TMC Rev: 1.1
TMC
TM54S816T-6G
NC/RFU
No connection /
This pin is recommended to be left no
reserved for future use connection on the device.
Absolute maximum ratings
Parameter
Symbol
Ratings
Unit
Voltage on any pin relative to Vss
VIN, VOUT
-0.5 to 4.6
V
Voltage supply relative to Vss
Vdd,VddQ
-0.5 to 4.6
V
Operating temperature
Topr
0 to +70
℃
Power dissipation
PD
1
W
Output Shorted current
IOS
50
mA
DC OPERATING CONDITIONS
Recommended operating conditions(Referenced to Vss=0V,TA=0℃ to 70℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Power Supply Voltage
Vdd, VddQ
3.0
3.3
3.6
V
Input Logic High Voltage
VIH
2.0
Vdd
V
Input Logic Low Voltage
VIL
-0.3
0.8
V
Output Logic High Voltage
VOH
2.4
V
Output Logic Low Voltage
VOL
0.4
V
μA
Input/Output Leakage Current
IIL, IOL
-5
5
DC Characteristics
(Recommended operating condition TA = 0℃ to 70℃, unless otherwise noted.)
Parameter
Operating Current
(One bank active)
Pre-charge Standby Current in
Power Down Mode
Pre-charge Standby Current in
Non-Power Down Mode
Symbol
-6G
120
Limits
-7G
-75G
110
100
ICC2P
Burst length=1, CL=3,
tRC = tRC(min), tCK = tCK(min)
CKE <VIL(max), tCK = 15ns
ICC2PS
CKE & CLK<VIL(max)
2
ICC2N
/CS =CKE >VIH(min),
tCK = 15ns
/CS=CKE >VIH(min),
CLK< VIL(max)
CKE<VIL(max), tCK =15ns
25
ICC1
ICC2NS
Active Standby Current in Power I P
CC3
Down Mode
For reference only.
Test Conditions
5
2
Unit
mA
mA
mA
15
7
TMC Rev: 1.1
mA
TMC
TM54S816T-6G
ICC3PS
CKE & CLK<VIL(max)
5
35
160
150
140
mA
160
150
140
mA
Operating Current (Burst)
ICC4
/CS=CKE>VIH(min),
tCK =15ns
/CS=CKE>VIH(min),
CLK < VIL(max )
BL=4,CL=3,All Banks Active
Auto Refresh Current
ICC5
CBR Command, tCK = tCK(min)
Self Refresh Current
ICC6
CKE < 0.2V
Active Standby Current in Non- ICC3N
Power Down Mode
ICC3NS
mA
30
2
mA
AC Characteristics
Recommended operating conditions(Vdd=VddQ=3.3V,Vss=0V,TA= 0 to 70℃)
-6G
fCK3
fCK2
tCK3
tCK2
tAC3
tAC2
tCH
tCL
tIS
tIH
tOH
tT
tRCD
tRC
tRAS
tRP
tRRD
tREF
-75G
Unit
Min
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
-7G
Parameter
Symbol
Clock Frequency,CL=3
Clock Frequency,CL=2
Clock Cycle Time,CL=3
Clock Cycle Time,CL=2
Clock Access Time,CL=3
Clock Access Time,CL=2
Clock High Pulse Width
Clock Low Pulse Width
Input Setup time(all inputs)
Input Hold time(all inputs)
Data-out Hold time
Transition time of clock
Row to Column delay
Row Cycle time
Row active time
Row Pre-charge time
Row active to active delay
Refresh time
For reference only.
Max
166
133
6.0
7.5
Min
7.0
7.5
5.0
5.4
2.5
2.5
1.5
0.8
1.5
1.0
15
60
42
15
12
64
6
Max
143
133
10
Min
Max
133
100
7.5
10
5.4
5.4
2.5
2.5
1.5
0.8
1.8
1.0
18
63
42
18
14
64
10
5.4
6.0
2.5
2.5
1.5
0.8
1.8
1.0
18
63
42
18
14
64
TMC Rev: 1.1
10
Mhz
Mhz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
TMC
For reference only.
TM54S416T
7
SDRAM
TMC
Rev:1.1