TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 1 Digital Media System-on-Chip (DMSoC) 1.1 TMS320DM335 Features • • • • High-Performance Digital Media System-on-Chip – 135-, 216-MHz ARM926EJ-S™ Clock Rate – Fully Software-Compatible With ARM™ – Extended Temperature 135- and 216-MHz Devices are Available ARM926EJ-S Core – Support for 32-Bit and 16-Bit (Thumb Mode) Instruction Sets – DSP Instruction Extensions and Single Cycle MAC – ARM® Jazelle® Technology – EmbeddedICE-RT™ Logic for Real-Time Debug ARM9 Memory Architecture – 16K-Byte Instruction Cache – 8K-Byte Data Cache – 32K-Byte RAM – 8K-Byte ROM – Little Endian Video Processing Subsystem – Front End Provides: • Hardware IPIPE for Real-Time Image Processing • Up to 14-bit CCD/CMOS Digital Interface • 16-/8-bit Generic YcBcR-4:2 Interface (BT.601) • 10-/8-bit CCIR6565/BT655 Interface • Up to 75-MHz Pixel Clock • Histogram Module • Resize Engine – Resize Images From 1/16x to 8x – Separate Horizontal/Vertical Control – Two Simultaneous Output Paths – Back End Provides: • Hardware On-Screen Display (OSD) • Composite NTSC/PAL video encoder output • 8-/16-bit YCC and Up to 18-Bit RGB666 Digital Output • BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface • Supports digital HDTV (720p/1080i) output for connection to external encoder • • • • • • • • • • • • • • • • • • External Memory Interfaces (EMIFs) – DDR2 and mDDR SDRAM 16-bit wide EMIF With 256 MByte Address Space (1.8-V I/O) – Asynchronous16-/8-bit Wide EMIF (AEMIF) • Flash Memory Interfaces – NAND (8-/16-bit Wide Data) – OneNAND(16-bit Wide Data) Flash Card Interfaces – Two Multimedia Card (MMC) / Secure Digital (SD/SDIO) – SmartMedia Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels) USB Port with Integrated 2.0 High-Speed PHY that Supports – USB 2.0 Full and High-Speed Device – USB 2.0 Low, Full, and High-Speed Host Three 64-Bit General-Purpose Timers (each configurable as two 32-bit timers) One 64-Bit Watch Dog Timer Three UARTs (One fast UART with RTS and CTS Flow Control) Three Serial Port Interfaces (SPI) each with two Chip-Selects One Master/Slave Inter-Integrated Circuit (I2C) Bus® Two Audio Serial Port (ASP) – I2S and TDM I2S – AC97 Audio Codec Interface – S/PDIF via Software – Standard Voice Codec Interface (AIC12) – SPI Protocol (Master Mode Only) Four Pulse Width Modulator (PWM) Outputs Four RTO (Real Time Out) Outputs Up to 104 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions) On-Chip ARM ROM Bootloader (RBL) to Boot From NAND Flash, MMC/SD, or UART Configurable Power-Saving Modes Crystal or External Clock Input (typically 24 MHz or 36 MHz) Flexible PLL Clock Generators Debug Interface Support – IEEE-1149.1 (JTAG) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document. 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Copyright © 2008–2009, Texas Instruments Incorporated TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 Boundary-Scan-Compatible – ETB™ (Embedded Trace Buffer™) with 4K-Bytes Trace Buffer memory – Device Revision ID Readable by ARM 2 Digital Media System-on-Chip (DMSoC) www.ti.com • • • 337-Pin Ball Grid Array (BGA) Package (ZCE Suffix), 0.65-mm Ball Pitch 90nm Process Technology 3.3-V and 1.8-V I/O, 1.3-V Internal Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 1.2 Description The DM335 processor is a low-cost, low-power processor providing advanced graphical user interface for display applications that do not require video compression and decompression. Coupled with a video processing subsystem (VPSS) that provides 720p display, the DM335 processor is powered by a 135/216 MHz ARM926EJ-S core so developers can create feature rich graphical user interfaces allowing customers to interact with their portable, electronic devices such as video-enabled universal remote controls, Internet radio, e-books, video doorbells and digital telescopes. The new DM335 is packed with the same peripherals as its predecessor, the TMS320DM355 device, including high speed USB 2.0 on-the-go, external memory interface (EMIF), mobile DDR/DDR2, two SDIO ports, three UART Ports, two Audio Serial Ports, three SPI Ports, and SLC/MCL NAND Flash memory support. These peripherals help customers create DM355 processor-based designs that add video and audio excitement to a wide range of today's static user-interface applications while keeping silicon costs and power consumption low. The new digital media processor is completely scalable with the DM355 processor and Digital Video Evaluation Board (DVEVM), allowing customers to utilize their same code for their new DM335 processor focused designs. The new DM335 device delivers a sophisticated suite of capabilities allowing for flexible image capture and display. Through its user interface technology, such as a four-level on-screen display, developers are able to create picture-within-picture and video-within-video as well as innovative graphic user interfaces. This is especially important for portable products that require the use of button or touch screen, such as portable karaoke, video surveillance and electronic gaming applications. Additional advanced capture and imaging technologies include support for CCD/CMOS image sensors, resize capability and video stabilization. The 1280-by-960-pixel digital LCD connection runs on a 75-MHz pixel clock and supports TV composite output for increased expandability. This highly integrated device is packaged in a 13 x 13 mm, 337 pin , 0.65 mm pitch BGA package. The DM335 processor core is an ARM926EJ-S RISC processor. The ARM926EJ-S is a 32-bit processor core that performs 32-bit and 16-bit instructions and processes 32-bit, 16-bit, and 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously. The ARM core incorporates: • A coprocessor 15 (CP15) and protection module • Data and program Memory Management Units (MMUs) with table look-aside buffers. • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The DM335 device has a Video Processing Subsystem (VPSS) with two configurable video/imaging peripherals: • A Video Processing Front-End (VPFE) • A Video Processing Back-End (VPBE) The VPFE port provides an interface for CCD/CMOS imager modules and video decoders. The VPBE provides hardware On Screen Display (OSD) support and composite NTSC/PAL and digital LCD output. The DM335 peripheral set includes: • An inter-integrated circuit (I2C) Bus interface • Two audio serial ports (ASP) • Three 64-bit general-purpose timers each configurable as two independent 32-bit timers • A 64-bit watchdog timer • Up to 104-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals • Three UARTs with hardware handshaking support on one UART • Three serial port Interfaces (SPI) • Four pulse width modulator (PWM) peripherals • Four real time out (RTO) outputs Submit Documentation Feedback Digital Media System-on-Chip (DMSoC) 3 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 • • • • www.ti.com Two Multi-Media Card / Secure Digital (MMC/SD/SDIO) interfaces Wireless interfaces (Bluetooth, WLAN, WUSB) through SDIO A USB 2.0 full and high-speed device and host interface Two external memory interfaces: – An asynchronous external memory interface (AEMIF) for slower memories/peripherals such as NAND and OneNAND, – A high speed synchronous memory interface for DDR2/mDDR. For software development support the DM335 has a complete set of ARM development tools which include: C compilers, assembly optimizers to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution. 1.3 Functional Block Diagram CCDC CCD C CCD/ CMOS Module Digital RGB/YUV 10b DAC Vide Video Encod Encoder o er VPBE VPSS Enhanced Enhanced DMA 64 channels channels 3PCC /TC (100 MHz er c Composite video IPIPE H3A 3A VPFE Buffer Logic The below figure shows the functional block diagram of the DM335 device. OS OSD DDR DDR controller MH DL DLL/ PHY 16 bit DDR2/mDDR 16 z) D DMA / DMA/Data Data and configuration bus bus and configuration ARM ARM INTC ARM ARM926EJ-S_Z8 USB 2.0 USB2.0 PHY Nand / Nand/SM/ Async/One Nand (AEMIF) ASP (2x) z) cach l-cache I-16KB 16 eK B cach B D-cache D- 8K 8KB e RA RAM 32KB 32MK BB RO ROM 8MK 8KB MMC/SD (x2) Speaker microphone SPI I/F (x3) UART (x3) I2C Timer/ WDT (x4 - 64) GIO Clocks PWM (x4) RTO 64bit DMA/Data Bus 32bit Configuration Bus JTA JTAG I/F JTAG CLOCK CLOCK ctrl PLL PLLs Peripherals 24 MHz 27 MHz or 36 MHz (optional) Figure 1-1. Functional Block Diagram 4 Digital Media System-on-Chip (DMSoC) Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Contents 1 2 Digital Media System-on-Chip (DMSoC) ............ 1 1.1 TMS320DM335 Features ............................. 1 1.2 Description ............................................ 3 1.3 Functional Block Diagram ............................ 4 Device Overview ......................................... 6 2.1 Device Characteristics ................................ 6 2.2 Memory Map Summary ............................... 7 2.3 Pin Assignments ...................................... 9 2.4 Pin Functions ........................................ 13 .............................................. 2.6 Device Support ...................................... Detailed Device Description.......................... 3.1 ARM Subsystem Overview .......................... 3.2 ARM926EJ-S RISC CPU............................ 3.3 Memory Mapping .................................... 3.4 ARM Interrupt Controller (AINTC) ................... 3.5 Device Clocking ..................................... 3.6 PLL Controller (PLLC) ............................... 3.7 Power and Sleep Controller (PSC) .................. 3.8 System Control Module ............................. 3.9 Pin Multiplexing...................................... 3.10 Device Reset ........................................ 3.11 Default Device Configurations....................... 3.12 Device Boot Modes ................................. 3.13 Power Management ................................. 3.14 64-Bit Crossbar Architecture ........................ Device Operating Conditions ........................ 2.5 3 4 4.1 Pin List 5 Recommended Operating Conditions ............... 91 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted) ............ 92 DM335 Peripheral Information and Electrical Specifications ........................................... 93 5.1 5.2 Parameter Information Device-Specific Information 93 Recommended Clock and Control Signal Transition Behavior ............................................. 95 5.3 Power Supplies ...................................... 95 36 5.4 Reset ................................................ 97 55 5.5 Oscillators and Clocks............................... 98 59 5.6 General-Purpose Input/Output (GPIO)............. 103 59 5.7 External Memory Interface (EMIF) ................. 105 60 5.8 MMC/SD 62 5.9 Video Processing Sub-System (VPSS) Overview . 114 63 5.10 5.11 USB 2.0 ............................................ 126 Universal Asynchronous Receiver/Transmitter (UART) ............................................. 128 76 5.12 Serial Port Interface (SPI).......................... 130 76 5.13 Inter-Integrated Circuit (I2C) ....................... 133 77 5.14 Audio Serial Port (ASP) ............................ 136 78 5.15 Timer ............................................... 144 79 5.16 Pulse Width Modulator (PWM)..................... 145 82 5.17 Real Time Out (RTO) .............................. 147 84 5.18 IEEE 1149.1 JTAG 65 72 86 90 Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise Noted) .......................... 90 Submit Documentation Feedback 4.2 4.3 6 7 ........................................... ................................ 112 148 Revision History (Revision B) ...................... 151 Mechanical Data....................................... 152 7.1 Thermal Data for ZCE ............................. 152 7.1.1 Packaging Information............................. 152 Contents 5 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 2 Device Overview 2.1 Device Characteristics Table 2-1 provides an overview of the DMSoC. The table shows significant features of the device, including the peripherals, capacity of on-chip RAM, ARM operating frequency, the package type with pin count, etc. Table 2-1. Characteristics of the Processor HARDWARE FEATURES DDR2 / mDDR (16-bit bus width) Asynchronous EMIF (AEMIF) Asynchronous (8/16-bit bus width) RAM, Flash (NAND, OneNAND) Flash Card Interfaces Peripherals Not all peripherals pins are available at the same time (For more detail, see the Device Configuration section). 64 independent DMA channels Eight EDMA channels Timers Three 64-Bit General Purpose (each configurable as two separate 32-bit timers) One 64-Bit Watch Dog UART Three (one with RTS and CTS flow control) SPI Three (each supports two slave devices) I2C One (Master/Slave) Audio Serial Port [ASP] Two ASP General-Purpose Input/Output Port Up to 104 Configurable Video Ports USB 2.0 On-Chip CPU Memory Organization JTAG BSDL_ID JTAGID register (address location: 0x01C4 0028) CPU Frequency (Maximum) MHz Core (V) I/O (V) PLL Options Reference frequency options Configurable PLL controller BGA Package 13 x 13 mm Process Technology Product Status (1) (1) 6 Two MMC/SD One SmartMedia/xD EDMA Pulse width modulator (PWM) Voltage DM335 DDR2 / mDDR Memory Controller Four outputs One Input (VPFE) One Output (VPBE) High, Full Speed Device High, Full, Low Speed Host ARM 16-KB I-cache, 8-KB D-cache, 32-KB RAM, 8-KB ROM 0x0B73B01F ARM 135, 216 MHz 1.3 V 3.3 V, 1.8 V 24 MHz (typical), 36 MHz PLL bypass, programmable PLL 337-Pin BGA (ZCE) 90 nm Product Preview (PP), Advance Information (AI), or Production Data (PD) PD PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 2.2 Memory Map Summary Table 2-3 shows the memory map address ranges of the device. Table 2-3 depicts the expanded map of the Configuration Space (0x01C0 0000 through 0x01FF FFFF). The device has multiple on-chip memories associated with its processor and various subsystems. To help simplify software development a unified memory map is used where possible to maintain a consistent view of device resources across all bus masters. The bus masters are the ARM, EDMA, USB, and VPSS. Table 2-2. DM335 Memory Map Start Address End Address Size (Bytes) ARM Mem Map EDMA Mem Map USB Mem Map 0x0000 0000 0x0000 3FFF 16K ARM RAM0 (Instruction) 0x0000 4000 0x0000 7FFF 16K ARM RAM1 (Instruction) Reserved Reserved 0x0000 8000 0x0000 FFFF 32K ARM ROM (Instruction) - only 8K used 0x0001 0000 0x0001 3FFF 16K 0x0001 4000 0x0001 7FFF 16K ARM RAM0 (Data) ARM RAM0 ARM RAM0 ARM RAM1 (Data) ARM RAM1 0x0001 8000 0x0001 FFFF ARM RAM1 32K ARM ROM (Data) - only 8K used ARM ROM ARM ROM 0x0002 0000 0x0010 0000 0x000F FFFF 896K Reserved 0x01BB FFFF 26M 0x01BC 0000 0x01BC 0FFF 4K 0x01BC 1000 0x01BC 17FF 2K ARM ETB Reg 0x01BC 1800 0x01BC 18FF 256 ARM IceCrusher 0x01BC 1900 0x01BC FFFF 59136 Reserved 0x01BD 0000 0x01BF FFFF 192K 0x01C0 0000 0x01FF FFFF 4M 0x0200 0000 0x09FF FFFF 128M 0x0A00 0000 0x11EF FFFF 127M - 16K 0x11F0 0000 0x11F1 FFFF 128K 0x11F2 0000 0x1FFF FFFF 141M-64K 0x2000 0000 0x2000 7FFF 32K 0x2000 8000 0x41FF FFFF 544M-32K 0x4200 0000 0x49FF FFFF 128M 0x4A00 0000 0x7FFF FFFF 864M 0x8000 0000 0x8FFF FFFF 0x9000 0000 0xFFFF FFFF VPSS Mem Map ARM ETB Mem Reserved Reserved CFG Bus Peripherals CFG Bus Peripherals Reserved ASYNC EMIF (Data) ASYNC EMIF (Data) Reserved Reserved DDR EMIF Control Regs DDR EMIF Control Regs Reserved Reserved Reserved 256M DDR EMIF DDR EMIF DDR EMIF DDR EMIF 1792M Reserved Reserved Reserved Reserved Reserved Table 2-3. DM335 ARM Configuration Bus Access to Peripherals Address Accessibility Region Start End Size ARM EDMA EDMA CC 0x01C0 0000 0x01C0 FFFF 64K √ √ EDMA TC0 0x01C1 0000 0x01C1 03FF 1K √ √ EDMA TC1 0x01C1 0400 0x01C1 07FF 1K √ √ Reserved 0x01C1 0800 0x01C1 9FFF 38K √ √ Reserved 0x01C1 A000 0x01C1 FFFF 24K √ √ UART0 0x01C2 0000 0x01C2 03FF 1K √ √ Submit Documentation Feedback Device Overview 7 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-3. DM335 ARM Configuration Bus Access to Peripherals (continued) Address 8 Accessibility UART1 0x01C2 0400 0x01C2 07FF 1K √ √ Timer4/5 0x01C2 0800 0x01C2 0BFF 1K √ √ Real-time out 0x01C2 0C00 0x01C2 0FFF 1K √ √ I2C 0x01C2 1000 0x01C2 13FF 1K √ √ Timer0/1 0x01C2 1400 0x01C2 17FF 1K √ √ Timer2/3 0x01C2 1800 0x01C2 1BFF 1K √ √ WatchDog Timer 0x01C2 1C00 0x01C2 1FFF 1K √ √ PWM0 0x01C2 2000 0x01C2 23FF 1K √ √ PWM1 0x01C2 2400 0x01C2 27FF 1K √ √ PWM2 0x01C2 2800 0x01C2 2BFF 1K √ √ PWM3 0x01C2 2C00 0x01C2 2FFF 1K √ √ System Module 0x01C4 0000 0x01C4 07FF 2K √ √ PLL Controller 0 0x01C4 0800 0x01C4 0BFF 1K √ √ PLL Controller 1 0x01C4 0C00 0x01C4 0FFF 1K √ √ Power/Sleep Controller 0x01C4 1000 0x01C4 1FFF 4K √ √ Reserved 0x01C4 2000 0x01C4 7FFF 24K √ √ ARM Interrupt Controller 0x01C4 8000 0x01C4 83FF 1K √ √ Reserved 0x01C4 8400 0x01C6 3FFF 111K √ √ USB OTG 2.0 Regs / RAM 0x01C6 4000 0x01C6 5FFF 8K √ √ SPI0 0x01C6 6000 0x01C6 67FF 2K √ √ SPI1 0x01C6 6800 0x01C6 6FFF 2K √ √ GPIO 0x01C6 7000 0x01C6 77FF 2K √ √ SPI2 0x01C6 7800 0x01C6 FFFF 2K √ √ VPSS Subsystem 0x01C7 0000 0x01C7 FFFF 64K √ √ VPSS Clock Control 0x01C7 0000 0x01C7 007F 128 √ √ Hardware 3A 0x01C7 0080 0x01C7 00FF 128 √ √ Image Pipe (IPIPE) Interface 0x01C7 0100 0x01C7 01FF 256 √ √ On Screen Display 0x01C7 0200 0x01C7 02FF 256 √ √ Reserved 0x01C7 0300 0x01C7 03FF 256 √ √ Video Encoder 0x01C7 0400 0x01C7 05FF 512 √ √ CCD Controller 0x01C7 0600 0x01C7 07FF 256 √ √ VPSS Buffer Logic 0x01C7 0800 0x01C7 08FF 256 √ √ Reserved 0x01C7 0900 0x01C7 09FF 256 √ √ Image Pipe (IPIPE) 0x01C7 1000 0x01C7 3FFF 12K √ √ Reserved 0x01C7 4000 0x01CD FFFF 432K √ √ Multimedia / SD 1 0x01E0 0000 0x01E0 1FFF 8K √ √ ASP0 0x01E0 2000 0x01E0 3FFF 8K √ √ ASP1 0x01E0 4000 0x01E0 5FFF 8K √ √ UART2 0x01E0 6000 0x01E0 63FF 1K √ √ Reserved 0x01E0 6400 0x01E0 FFFF 39K √ √ ASYNC EMIF Control 0x01E1 0000 0x01E1 0FFF 4K √ √ Multimedia / SD 0 0x01E1 1000 0x01E1 FFFF 60K √ √ Reserved 0x01E2 0000 0x01FF FFFF 1792K √ √ ASYNC EMIF Data (CE0) 0x0200 0000 0x03FF FFFF 32M √ √ ASYNC EMIF Data (CE1) 0x0400 0000 0x05FF FFFF 32M √ √ Reserved 0x0600 0000 0x09FF FFFF 64M √ √ Reserved 0x0A00 0000 0x0BFF FFFF 32M √ √ Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-3. DM335 ARM Configuration Bus Access to Peripherals (continued) Address Reserved 0x0C00 0000 Accessibility 0x0FFF FFFF √ 64M √ 2.3 Pin Assignments Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in the smallest possible package. Pin multiplexing is controlled using a combination of hardware configuration at device reset and software programmable register settings. 2.3.1 Pin Map (Bottom View) Figure 2-1 through Figure 2-4 show the pin assignments in four quadrants (A, B, C, and D). Note that micro-vias are not required. Contact your TI representative for routing recommendations. J RSV01 VSS CIN0 CIN3 CIN2 VSS VREF VDDA33_USB VSSA_PLL2 H VSS VSS VCLK FIELD LCD_OE VSS VDDA13_USB NC VDDA_PLL2 G VFB VSS EXTCLK VSYNC CVDD VDD VSS F TVOUT IBIAS COUT1 COUT0 HSYNC VDD_VOUT VDD_VOUT VDD_VOUT VDD E IOUT VSS COUT3 COUT2 USB_VBUS VSS_USB EMU1 EMU0 TDO D VSS COUT6 COUT4 USB_ID VSS_USB TMS TDI C COUT5 COUT7 YOUT7 CVDD USB_DRV VBUS VDDD13_USB USB_R1 VSS_USB_REF TRST B YOUT0 YOUT3 YOUT4 YOUT5 VSS VDDA33_USB_ VSS_USB VSS MXO1 A CVDD YOUT1 YOUT2 YOUT6 VSS USB_DM USB_DP VSS MXI1 1 2 3 4 5 6 7 8 9 PLL Figure 2-1. Pin Map [Quadrant A] Submit Documentation Feedback Device Overview 9 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 1 2 3 4 5 6 7 8 9 W VSS DDR_A02 DDR_A03 DDR_A05 DDR_A08 DDR_A09 DDR_A11 DDR_CLK DDR_CLK V VSS DDR_A00 DDR_A01 DDR_A04 DDR_A07 DDR_A10 DDR_A12 DDR_BA[2] DDR_CAS U VSS VSS VSS VSS DDR_A06 DDR_A13 DDR_BA[1] DDR_BA[0] VSS T MXO2 VSS PCLK VSS DDR_RAS DDR_CS DDR_ZN R MXI2 VSS YIN3 CAM_VD CAM_WEN_ FIELD VSS CVDD CVDD VDD_DDR P VSS_MX2 YIN1 YIN4 YIN2 YIN0 VDD_VIN VDD_VIN VDD_VIN VDD_DDR N VSS RSV05 CIN7 CAM_HD CVDD VSS VSS M RSV04 RSV06 CIN5 YIN6 YIN5 VSS VSS VSS VDD_DDR L RSV03 VSS CIN1 CIN4 YIN7 VDD VDDA18V_DAC VSS_DAC VSS K RSV02 RSV07 VSS CIN6 CVDD VDD VSS Figure 2-2. Pin Map [Quadrant B] 10 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 10 11 12 13 14 15 16 17 18 19 DDR_WE DDR_DQ01 DDR_DQ05 DDR_DQ07 DDR_DQ10 DDR_DQ11 DDR_DQ13 DDR_DQ15 DDR_ DQGATE0 CVDD W DDR_CKE DDR_DQ00 DDR_DQS[0] DDR_DQ06 DDR_DQ09 DDR_DQS[1] DDR_DQ14 DDR_ DQGATE1 VSS EM_A13 V DDR_VREF DDR_DQ02 DDR_DQ04 DDR_DQ08 VSS DDR_DQM[1] DDR_DQ12 VSS UART0_RXD EM_A12 U DDR_DQ03 DDR_DQM[0] VDD_DDR VSS CVDD UART0_TXD EM_A08 T VDDA33_DDRDLL VSSA_DLL VDD_DDR I2C_SDA I2C_SCL UART1_RXD EM_A11 UART1_TXD EM_A10 EM_A05 R VDD_DDR VDD_DDR VDD_DDR VDD_DDR VDD_DDR EM_A04 EM_A07 EM_A09 EM_A06 EM_BA1 P VDD VDD VSS EM_A02 EM_A01 EM_A03 EM_BA0 N VDD VDD VDD VDD VSS EM_D13 EM_A00 VSS EM_D15 EM_D14 M VSS CVDD CVDD VDD VSS EM_D04 EM_D08 EM_D11 EM_D12 EM_D10 L VSS CVDD CVDD VSS VDD EM_D06 EM_D09 EM_D07 K Figure 2-3. Pin Map [Quadrant C] Submit Documentation Feedback Device Overview 11 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com VSS CVDD CVDD CVDD VSS EM_WE EM_CE0 EM_D01 EM_D03 EM_D05 J CVDD VSS VSSA_PLL1 CVDD VSS ASP0_DX EM_ADV CVDD EM_D00 EM_D02 H CVDD VDDA_PLL1 VDD GIO003 ASP0_FSX EM_WAIT EM_CE1 G VDD VDD VDD VDD VDD GIO002 ASP0_FSR ASP0_CLKR ASP0_CLKX EM_OE F TCK RTCK SPI1_SDO SPI1_ SDENA[0] GIO001 VSS ASP1_FSX ASP1_FSR ASP0_DR EM_CLK E RESET CLKOUT1 MMCSD0_ DATA1 GIO005 ASP1_CLKS ASP1_CLKR ASP1_CLKX D VSS_MX1 CLKOUT3 SPI0_SCLK SPI1_SCLK GIO000 GIO007 ASP1_DX ASP1_DR C VSS SPI0_SDO SPI0_ SDENA[0] MMCSD0_ DATA2 MMCSD0_ DATA0 MMCSD1_ DATA1 MMCSD1_ DATA3 GIO004 GIO006 CVDD B CVDD CLKOUT2 SPI0_SDI SPI1_SDI MMCSD0_ DATA3 MMCSD0_ CLK MMCSD1_ DATA2 MMCSD1_ CMD MMCSD1_ DATA0 VSS A 10 11 12 13 14 15 16 17 18 19 MMCSD0_CMD MMCSD1_CLK Figure 2-4. Pin Map [Quadrant D] 12 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 2.4 Pin Functions The pin functions tables (Table 2-4 through Table 2-22) identify the external signal names, the associated pin (ball) numbers along with the mechanical package designator, the pin type, whether the pin has any internal pullup or pulldown resistors, and a functional pin description. For more detailed information on device configuration, peripheral selection, multiplexed/shared pins, and debugging considerations, see Section 3. For the list of all pin in chronological order see Section 2.5 2.4.1 Image Data Input - Video Processing Front End The CCD Controller module in the Video Processing Front End has an external signal interface for image data input. It supports YUV (YC) inputs as well as Bayer RGB and complementary input signals (I.e., image data input). The definition of the CCD controller data input signals depend on the input mode selected. • In 16-bit YCbCr mode, the Cb and Cr signals are multiplexed on the Cl signals and the order is configurable (i.e., Cb first or Cr first). • In 8-bit YCbCr mode, the Y, Cb, and Cr signals are multiplexed and not only is the order selectable, but also the half of the bus used. Table 2-4. CCD Controller Signals for Each Input Mode PIN NAME CCD 16-BIT YCbCr 8-BIT YCbCr Cl7 Cb7,Cr7 Y7,Cb7,Cr7 Cl6 Cb6,Cr6 Y6,Cb6,Cr6 Cl5 CCD13 Cb5,Cr5 Y5,Cb5,Cr5 Cl4 CCD12 Cb4,Cr4 Y4,Cb4,Cr4 Cl3 CCD11 Cb3,Cr3 Y3,Cb3,Cr3 Cl2 CCD10 Cb2,Cr2 Y2,Cb2,Cr2 Cl1 CCD9 Cb1,Cr1 Y1,Cb1,Cr1 Cl0 CCD8 Cb0,Cr0 Y0,Cb0,Cr0 Yl7 CCD7 Y7 Y7,Cb7,Cr7 Yl6 CCD6 Y6 Y6,Cb6,Cr6 Yl5 CCD5 Y5 Y5,Cb5,Cr5 Yl4 CCD4 Y4 Y4,Cb4,Cr4 Yl3 CCD3 Y3 Y3,Cb3,Cr3 Yl2 CCD2 Y2 Y2,Cb2,Cr2 Yl1 CCD1 Y1 Y1,Cb1,Cr1 Yl0 CCD0 Y0 Y0,Cb0,Cr0 Submit Documentation Feedback Device Overview 13 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-5. CCD Controller/Video Input Terminal Functions TERMINAL NAME NO. CIN7/ GIO101/ SPI2_SCLK CIN6/ GIO100/ SPI2_SDO CIN5/ GIO099/ SPI2_SDEN A[0] CIN4/ GIO098/ SPI2_SDEN A[1] CIN3/ GIO097/ CIN2/ GIO096/ CIN1/ GIO095/ CIN0/ GIO094/ YIN7/ GIO093 YIN6/ GIO092 (1) (2) (3) 14 N3 K5 M3 L4 J4 J5 L3 J3 L5 M4 TYPE (1) I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z OTHER (2) (3) DESCRIPTION PD VDD_VIN Standard CCD/CMOS input: NOT USED • YCC 16-bit: Time multiplexed between chroma: CB/SR[07] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[07] SPI: SPI2 Clock GIO: GIO[101] PD VDD_VIN Standard CCD/CMOS input: NOT USED • YCC 16-bit: Time multiplexed between chroma: CB/SR[06] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[06] SPI: SPI2 Data Out GIO: GIO[100] PD VDD_VIN Standard CCD/CMOS input: Raw[13] • YCC 16-bit: Time multiplexed between chroma: CB/SR[05] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[05] SPI: SPI2 Chip Select GIO: GIO[099] PD VDD_VIN Standard CCD/CMOS input: Raw[12] • YCC 16-bit: Time multiplexed between chroma: CB/SR[04] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[04] SPI: SPI2 Data In GIO: GIO[098] PD VDD_VIN Standard CCD/CMOS input(AFE): Raw[11] • YCC 16-bit: Time multiplexed between chroma: CB/SR[03] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[03] GIO: GIO[097] PD VDD_VIN Standard CCD/CMOS input: Raw[10] • YCC 16-bit: Time multiplexed between chroma: CB/SR[02] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[02] GIO: GIO[097] PD VDD_VIN Standard CCD/CMOS input: Raw[09] • YCC 16-bit: Time multiplexed between chroma: CB/SR[01] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[01] GIO: GIO[095] PD VDD_VIN Standard CCD/CMOS input: Raw[08] • YCC 16-bit: Time multiplexed between chroma: CB/SR[00] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[00] GIO: GIO[094] PD VDD_VIN Standard CCD/CMOS input: Raw[07] • YCC 16-bit: Time multiplexed between chroma: Y[07] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[07] GIO: GIO[093] PD VDD_VIN Standard CCD/CMOS input: Raw[06] • YCC 16-bit: Time multiplexed between chroma: Y[06] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[06] GIO: GIO[092] I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. PD = internal pull-down, PU = internal pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-5. CCD Controller/Video Input Terminal Functions (continued) TERMINAL NAME NO. YIN5/ GIO091 M5 YIN4/ GIO090 P3 YIN3/ GIO089 R3 YIN2/ GIO088 P4 YIN1/ GIO087 P2 TYPE (1) I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z YIN0/ GIO086 P5 I/O/Z CAM_HD/ GIO085 N5 I/O/Z CAM_VD GIO084 R4 I/O/Z OTHER (2) (3) DESCRIPTION PD VDD_VIN Standard CCD/CMOS input: Raw[05] • YCC 16-bit: Time multiplexed between chroma: Y[05] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[05] GIO: GIO[091] PD VDD_VIN Standard CCD/CMOS input: Raw[04] • YCC 16-bit: Time multiplexed between chroma: Y[04] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[04] GIO: GIO[090] PD VDD_VIN Standard CCD/CMOS input: Raw[03] • YCC 16-bit: Time multiplexed between chroma: Y[03] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[03] GIO: GIO[089] PD VDD_VIN Standard CCD/CMOS input: Raw[02] • YCC 16-bit: Time multiplexed between chroma: Y[02] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[02] GIO: GIO[088] PD VDD_VIN Standard CCD/CMOS input: Raw[01] • YCC 16-bit: Time multiplexed between chroma: Y[01] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[01] GIO: GIO[087] PD VDD_VIN Standard CCD/CMOS input: Raw[00] • YCC 16-bit: Time multiplexed between chroma: Y[00] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[00] GIO: GIO[086] PD VDD_VIN PD VDD_VIN Horizontal synchronization signal that can be either an input (slave mode) or an output (master mode). Tells the CCDC when a new line starts. GIO: GIO[085] Vertical synchronization signal that can be either an input (slave mode) or an output (master mode). Tells the CCDC when a new frame starts. GIO: GIO[084] CAM_WEN _FIELD\ GIO083 R5 I/O/Z PD VDD_VIN Write enable input signal is used by external device (AFE/TG) to gate the DDR output of the CCDC module. Alternately, the field identification input signal is used by external device (AFE/TG) to indicate which of two frames is input to the CCDC module for sensors with interlaced output. CCDC handles 1- or 2-field sensors in hardware. GIO: GIO[083] PCLK/ GIO082 T3 I/O/Z PD VDD_VIN Pixel clock input (strobe for lines C17 through Y10) GIO: GIO[0082] 2.4.2 Image Data Output - Video Processing Back End (VPBE) The Video Encoder/Digital LCD interface module in the video processing back end has an external signal interface for digital image data output as described in Table 2-7 and Table 2-8. The digital image data output signals support multiple functions / interfaces, depending on the display mode selected. The following table describes these modes. Parallel RGB mode with more than RGB565 signals requires enabling pin multiplexing to support (i.e., for RGB666 mode). Submit Documentation Feedback Device Overview 15 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-6. Signals for VPBE Display Modes 16 PIN NAME YCC16 YCC8/ REC656 PRGB SRGB HSYNC GIO073 HSYNC HSYNC HSYNC HSYNC VSYNC GIO072 VSYNC VSYNC VSYNC VSYNC LCD_OE GIO071 As needed As needed As needed As needed FIELD GIO070 R2 PWM3C As needed As needed As needed As needed EXTCLK GIO069 B2 PWM3D As needed As needed As needed As needed VCLK GIO068 VCLK VCLK VCLK VCLK YOUT7 Y7 Y7,Cb7,Cr7 R7 Data7 YOUT6 Y6 Y6,Cb6,Cr6 R6 Data6 YOUT5 Y5 Y5,Cb5,Cr5 R5 Data5 YOUT4 Y4 Y4,Cb4,Cr4 R4 Data4 YOUT3 Y3 Y3,Cb3,Cr3 R3 Data3 YOUT2 Y2 Y2,Cb2,Cr2 G7 Data2 YOUT1 Y1 Y1,Cb1,Cr1 G6 Data1 YOUT0 Y0 Y0,Cb0,Cr0 G5 Data0 COUT7 GIO081 PWM0 C7 LCD_AC G4 LCD_AC COUT6 GIO080 PWM1 C6 LCD_OE G3 LCD_OE COUT5 GIO079 PWM2A RTO0 C5 BRIGHT G2 BRIGHT COUT4 GIO078 PWM2B RTO1 C4 PWM B7 PWM COUT3 GIO077 PWM2C RTO2 C3 CSYNC B6 CSYNC COUT2 GIO076 PWM2D RTO3 C2 - B5 - COUT1 GIO075 PWM3A C1 - B4 - COUT0 GIO074 PWM3B C0 - B3 - Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-7. Digital Video Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) C3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function A4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function YOUT5-R5 B4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function YOUT4-R4 B3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function YOUT3-R3 B2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function YOUT2-G7 A3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function YOUT1-G6 A2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function YOUT0-G5 B1 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function COUT7G4/GIO081 /PWM0 C2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[081] PWM0 COUT6-G3 /GIO080 /PWM1 D2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[080] PWM1 COUT5-G2 / GIO079 / PWM2A / RTO0 C1 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[079] PWM2A RTO0 COUT4-B7 / GIO078 / PWM2B / RTO1 D3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[078] PWM2B RTO1 COUT3-B6 / GIO077 / PWM2C / RTO2 E3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[077] PWM2C RTO2 COUT2-B5 / GIO076 / PWM2D / RTO3 E4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[076] PWM2D RTO3 COUT1-B4 / GIO075 / PWM3A F3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[075] PWM3A COUT0-B3 / GIO074 / PWM3B F4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[074] PWM3B HSYNC / GIO073 F5 I/O/Z PD VDD_VOUT Video Encoder: Horizontal Sync GIO: GIO[073] VSYNC / GIO072 G5 I/O/Z PD VDD_VOUT Video Encoder: Vertical Sync GIO: GIO[072] FIELD / GIO070 / R2 / PWM3C H4 I/O/Z VDD_VOUT Video Encoder: Field identifier for interlaced display formats GIO: GIO[070] Digital Video Out: R2 PWM3C NAME NO. YOUT7-R7 YOUT6-R6 EXTCLK / GIO069 / B2 / PWM3D G3 I/O/Z VCLK / GIO068 H3 I/O/Z (1) (2) (3) (4) PD VDD_VOUT VDD_VOUT DESCRIPTION (4) Video Encoder: External clock input, used if clock rates > 27 MHz are needed, e.g. 74.25 MHz for HDTV digital output GIO: GIO[069] Digital Video Out: B2 PWM3D Video Encoder: Video Output Clock GIO: GIO[068] I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) To reduce EMI and reflections, depending on the trace length, approximately 22 Ω to 50 Ω damping resistors are recommend on the following outputs placed near the DM335: YOUT(0-7),COUT(0-7), HSYNC,VSYNC,LCD_OE,FIELD,EXTCLK,VCLK. The trace lengths should be minimized. Submit Documentation Feedback Device Overview 17 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-8. Analog Video Terminal Functions TERMINAL TYPE (1) OTHER (2) DESCRIPTION NAME NO. VREF J7 A I/O/Z Video DAC: Reference voltage output (0.45V, 0.1uF to GND). When the DAC is not used, the VREF signal should be connected to VSS. IOUT E1 A I/O/Z Video DAC: Pre video buffer DAC output (1000 ohm to VFB). When the DAC is not used, the IOUT signal should be connected to VSS. IBIAS F2 A I/O/Z Video DAC: External resistor (2550 Ohms to GND) connection for current bias configuration. When the DAC is not used, the IBIAS signal should be connected to VSS. VFB G1 A I/O/Z Video DAC: Pre video buffer DAC output (1000 Ohms to IOUT, 1070 Ohms to TVOUT). When the DAC is not used, the VFB signal should be connected to VSS. TVOUT F1 A I/O/Z VDDA18_DAC L7 PWR Video DAC: Analog 1.8V power. When the DAC is not used, the VDDA18_DAC signal should be connected to VSS. VSSA_DAC L8 GND Video DAC: Analog 1.8V ground. When the DAC is not used, the VSSA_DAC signal should be connected to VSS. (1) (2) V Video DAC: Analog Composite NTSC/PAL output (SeeFigure 5-31 andFigure 5-32 for circuit connection). When the DAC is not used, the TVOUT signal should be left as a No Connect or connected to VSS. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) 2.4.3 Asynchronous External Memory Interface (AEMIF) The Asynchronous External Memory Interface (AEMIF) signals support AEMIF, NAND, and OneNAND. Table 2-9. Asynchronous EMIF/NAND/OneNAND Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) V19 I/O/Z PD VDD Async EMIF: Address bus bit[13] GIO: GIO[67] System: BTSEL[1:0] sampled at power-on-reset to determine boot method. Used to drive boot status LED signal (active low) in ROM boot modes. EM_A12/ GIO066/ BTSEL[0] U19 I/O/Z PD VDD Async EMIF: Address bus bit[12] GIO: GIO[66] System: BTSEL[1:0] sampled at power-on-reset to determine boot method. EM_A11/ GIO065/ AECFG[3] R16 I/O/Z PU VDD Async EMIF: Address bus bit[11] GIO: GIO[65] AECFG[3:0] sampled at power-on-reset to AECFG configuration. AECFG[3] sets default for PinMux2_EM_D15_8: AEMIF default bus width (16 or 8 bits) I/O/Z PU VDD Async EMIF: Address bus bit[10] GIO: GIO[64] AECFG[3:0] sampled at power-on-reset to AECFG configuration. AECFG[2:1] sets default for PinMux2_EM_BA0: AEMIF EM_BA0 definition (EM_BA0, EM_A14, GIO[054], rsvd) I/O/Z PD VDD Async EMIF: Address bus bit[09] GIO: GIO[63] AECFG[3:0] sampled at power-on-reset to AECFG configuration. AECFG[2:1] sets default for PinMux2_EM_BA0: AEMIF EM_BA0 definition (EM_BA0, EM_A14, GIO[054], rsvd) NAME NO. EM_A13/ GIO067/ BTSEL[1] EM_A10/ GIO064/ AECFG[2] EM_A09/ GIO063/ AECFG[1] R18 P17 DESCRIPTION EM_A08/ GIO062/ AECFG[0] T19 I/O/Z PD VDD Async EMIF: Address bus bit[08] GIO: GIO[62] AECFG[0] sets default for: • PinMux2_EM_A0_BA1: AEMIF address width (OneNAND or NAND) • PinMux2_EM_A13_3: AEMIF address width (OneNAND or NAND) EM_A07/ GIO061 P16 I/O/Z VDD Async EMIF: Address bus bit[07] GIO: GIO[61] (1) (2) (3) 18 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-9. Asynchronous EMIF/NAND/OneNAND Terminal Functions (continued) TERMINAL TYPE (1) OTHER (2) (3) P18 I/O/Z VDD Async EMIF: Address bus bit[06] GIO: GIO[60] EM_A05/ GIO059 R19 I/O/Z VDD Async EMIF: Address bus bit[05] GIO: GIO[59] EM_A04/ GIO058 P15 I/O/Z VDD Async EMIF: Address bus bit[04] GIO: GIO[58] EM_A03/ GIO057 N18 I/O/Z VDD Async EMIF: Address bus bit[03] GIO: GIO[57] EM_A02/ N15 I/O/Z VDD Async EMIF: Address bus bit[02] NAND/SM/xD: CLE - Command latch enable output EM_A01/ N17 I/O/Z VDD Async EMIF: Address bus bit[01] NAND/SM/xD: ALE - Address latch enable output EM_A00/ GIO056 M16 I/O/Z VDD Async EMIF: Address bus bit[00] GIO: GIO[56] VDD Async EMIF: Bank address 1 signal - 16-bit address: • In 16-bit mode, lowest address bit. • In 8-bit mode, second lowest address bit. GIO: GIO[055] NAME NO. EM_A06/ GIO060 EM_BA1/ GIO055 P19 I/O/Z DESCRIPTION EM_BA0/ GIO054 EM_A14 N19 I/O/Z VDD Async EMIF: Bank address 0 signal - 8-bit address: • In 8-bit mode, lowest address bit. or can be used as an extra address line (bit14) when using 16-bit memories. GIO: GIO[054] EM_D15/ GIO053 M18 I/O/Z VDD Async EMIF: Data bus bit 15 GIO: GIO[053] EM_D14/ GIO052 M19 I/O/Z VDD Async EMIF: Data bus bit 14 GIO: GIO[052] EM_D13/ GIO051 M15 I/O/Z VDD Async EMIF: Data bus bit 13 GIO: GIO[051] EM_D12/ GIO050 L18 I/O/Z VDD Async EMIF: Data bus bit 12 GIO: GIO[050] EM_D11/ GIO049 L17 I/O/Z VDD Async EMIF: Data bus bit 11 GIO: GIO[049] EM_D10/ GIO048 L19 I/O/Z VDD Async EMIF: Data bus bit 10 GIO: GIO[048] EM_D09/ GIO047 K18 I/O/Z VDD Async EMIF: Data bus bit 09 GIO: GIO[047] EM_D08/ GIO046 L16 I/O/Z VDD Async EMIF: Data bus bit 08 GIO: GIO[046] EM_D07/ GIO045 K19 I/O/Z VDD Async EMIF: Data bus bit 07 GIO: GIO[045] EM_D06/ GIO044 K17 I/O/Z VDD Async EMIF: Data bus bit 06 GIO: GIO[044] EM_D05/ GIO043 J19 I/O/Z VDD Async EMIF: Data bus bit 05 GIO: GIO[043] EM_D04/ GIO042 L15 I/O/Z VDD Async EMIF: Data bus bit 04 GIO: GIO[042] EM_D03/ GIO041 J18 I/O/Z VDD Async EMIF: Data bus bit 03 GIO: GIO[041] EM_D02/ GIO040 H19 I/O/Z VDD Async EMIF: Data bus bit 02 GIO: GIO[040] EM_D01/ GIO039 J17 I/O/Z VDD Async EMIF: Data bus bit 01 GIO: GIO[039] EM_D00/ GIO038 H18 I/O/Z VDD Async EMIF: Data bus bit 00 GIO: GIO[038] Submit Documentation Feedback Device Overview 19 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-9. Asynchronous EMIF/NAND/OneNAND Terminal Functions (continued) TERMINAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION EM_CE0/ GIO037 J16 I/O/Z VDD Async EMIF: Lowest numbered chip select. Can be programmed to be used for standard asynchronous memories (example: flash), OneNAND, or NAND memory. Used for the default boot and ROM boot modes. GIO: GIO[037] EM_CE1/ GIO036 G19 I/O/Z VDD Async EMIF: Second chip select. Can be programmed to be used for standard asynchronous memories(example: flash), OneNAND, or NAND memory. GIO: GIO[036] EM_WE/ GIO035 J15 I/O/Z VDD Async EMIF: Write Enable NAND/SM/xD: WE (Write Enable) output GIO: GIO[035] EM_OE/ GIO034 F19 I/O/Z VDD Async EMIF: Output Enable NAND/SM/xD: RE (Read Enable) output GIO: GIO[034] EM_WAIT/ GIO033 G18 I/O/Z VDD Async EMIF: Async WAIT NAND/SM/xD: RDY/ BSY input GIO: GIO[033] EM_ADV/ GIO032 H16 I/O/Z VDD OneNAND: Address valid detect for OneNAND interface GIO: GIO[032] EM_CLK/ GIO031 E19 I/O/Z VDD OneNAND: Clock for OneNAND flash interface GIO: GIO[031] 2.4.4 DDR Memory Interface The DDR EMIF supports DDR2 and mobile DDR. Table 2-10. DDR Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) DESCRIPTION W9 I/O/Z VDD_DDR DDR Data Clock DDR_CLK W8 I/O/Z VDD_DDR DDR Complementary Data Clock DDR_RAS T6 I/O/Z VDD_DDR DDR Row Address Strobe DDR_CAS V9 I/O/Z VDD_DDR DDR Column Address Strobe DDR_WE W10 I/O/Z VDD_DDR DDR Write Enable DDR_CS T8 I/O/Z VDD_DDR DDR Chip Select DDR_CKE V10 I/O/Z VDD_DDR DDR Clock Enable DDR_DQM[1] U15 I/O/Z VDD_DDR DDR_DQM[0] T12 I/O/Z VDD_DDR Data mask outputs: • DDR_DQM[1] - For DDR_DQ[15:8] • DDR_DQM[0] - For DDR_DQ[7:0] DDR_DQS[1] V15 I/O/Z VDD_DDR DDR_DQS[0] V12 I/O/Z VDD_DDR DDR_BA[2] V8 I/O/Z VDD_DDR Bank select outputs. Two are required for 1Gb DDR2 memories. DDR_BA[1] U7 I/O/Z VDD_DDR Bank select outputs. Two are required for 1Gb DDR2 memories. DDR_BA[0] U8 I/O/Z VDD_DDR Bank select outputs. Two are required for 1Gb DDR2 memories. DDR_A13 U6 I/O/Z VDD_DDR DDR Address Bus bit 13 DDR_A12 V7 I/O/Z VDD_DDR DDR Address Bus bit 12 DDR_A11 W7 I/O/Z VDD_DDR DDR Address Bus bit 11 DDR_A10 V6 I/O/Z VDD_DDR DDR Address Bus bit 10 NAME NO. DDR_CLK (1) (2) (3) 20 Data strobe input/outputs for each byte of the 16-bit data bus used to synchronize the data transfers. Output to DDR when writing and inputs when reading. • DDR_DQS[1] - For DDR_DQ[15:8] • DDR_DQS[0] - For DDR_DQ[7:0] I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-10. DDR Terminal Functions (continued) TERMINAL TYPE (1) OTHER (2) (3) W6 I/O/Z VDD_DDR DDR Address Bus bit 09 DDR_A08 W5 I/O/Z VDD_DDR DDR Address Bus bit 08 DDR_A07 V5 I/O/Z VDD_DDR DDR Address Bus bit 07 DDR_A06 U5 I/O/Z VDD_DDR DDR Address Bus bit 06 DDR_A05 W4 I/O/Z VDD_DDR DDR Address Bus bit 05 DDR_A04 V4 I/O/Z VDD_DDR DDR Address Bus bit 04 DDR_A03 W3 I/O/Z VDD_DDR DDR Address Bus bit 03 DDR_A02 W2 I/O/Z VDD_DDR DDR Address Bus bit 02 DDR_A01 V3 I/O/Z VDD_DDR DDR Address Bus bit 01 DDR_A00 V2 I/O/Z VDD_DDR DDR Address Bus bit 00 W17 I/O/Z VDD_DDR DDR Data Bus bit 15 DDR_DQ14 V16 I/O/Z VDD_DDR DDR Data Bus bit 14 DDR_DQ13 W16 I/O/Z VDD_DDR DDR Data Bus bit 13 DDR_DQ12 U16 I/O/Z VDD_DDR DDR Data Bus bit 12 DDR_DQ11 W15 I/O/Z VDD_DDR DDR Data Bus bit 11 DDR_DQ10 W14 I/O/Z VDD_DDR DDR Data Bus bit 10 DDR_DQ09 V14 I/O/Z VDD_DDR DDR Data Bus bit 09 DDR_DQ08 U13 I/O/Z VDD_DDR DDR Data Bus bit 08 DDR_DQ07 W13 I/O/Z VDD_DDR DDR Data Bus bit 07 DDR_DQ06 V13 I/O/Z VDD_DDR DDR Data Bus bit 06 DDR_DQ05 W12 I/O/Z VDD_DDR DDR Data Bus bit 05 DDR_DQ04 U12 I/O/Z VDD_DDR DDR Data Bus bit 04 DDR_DQ03 T11 I/O/Z VDD_DDR DDR Data Bus bit 03 DDR_DQ02 U11 I/O/Z VDD_DDR DDR Data Bus bit 02 DDR_DQ01 W11 I/O/Z VDD_DDR DDR Data Bus bit 01 DDR_DQ00 V11 I/O/Z VDD_DDR DDR Data Bus bit 00 DDR_ DQGATE0 W18 I/O/Z VDD_DDR DDR: Loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE1 with same constraints as used for DDR clock and data. DDR_ DQGATE1 V17 I/O/Z VDD_DDR DDR: Loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE0 with same constraints as used for DDR clock and data. DDR_VREF U10 I/O/Z VDD_DDR DDR: Voltage input for the SSTL_18 I/O buffers. Note even in the case of mDDR an external resistor divider connected to this pin is necessary. VSSA_DLL R11 I/O/Z VDD_DDR DDR: Ground for the DDR DLL VDDA33_DDRDL R10 I/O/Z VDD_DDR DDR: Power (3.3 V) for the DDR DLL T9 I/O/Z VDD_DDR DDR: Reference output for drive strength calibration of N and P channel outputs. Tie to ground via 50 ohm resistor @ 0.5% tolerance. NAME NO. DDR_A09 DDR_DQ15 L DDR_ZN Submit Documentation Feedback DESCRIPTION Device Overview 21 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 2.4.5 www.ti.com GPIO The General Purpose I/O signals provide generic I/O to external devices. Most of the GIO signals are multiplexed with other functions. Table 2-11. GPIO Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) C16 I/O/Z VDD GIO:GIO[000] is sampled at reset and stored in the GIO0_RESET bit of the BOOTCFG register. Active low during MMC/SD boot (can be used as MMC/SD power control). Can be used as external clock input for Timer 3. GIO001 E14 I/O/Z VDD GIO: GIO[001] Can be used as external clock input for Timer 3. GIO002 F15 I/O/Z VDD GIO: GIO[002] Can be used as external clock input for Timer 3. GIO003 G15 I/O/Z VDD GIO: GIO[003] Can be used as external clock input for Timer 3. GIO004 B17 I/O/Z VDD GIO: GIO[004] GIO005 D15 I/O/Z VDD GIO: GIO[005] GIO006 B18 I/O/Z VDD GIO: GIO[006] GIO007 / SPI0_SDE NA[1] C17 I/O/Z VDD GIO: GIO[007] SPI0: Chip Select 1 SPI1_SD O/ GIO008 E12 I/O/Z VDD SPI1: Data Out GIO: GIO[008] SPI1_SDI / GIO009 / SPI1_SDE NA[1] A13 I/O/Z VDD SPI1: Data In -OR- SPI1: Chip Select 1 GIO: GIO[009] SPI1_SCL K/ GIO010 C13 I/O/Z VDD SPI1: Clock GIO: GIO[010] SPI1_SDE NA[0] / GIO011 E13 I/O/Z VDD SPI1: Chip Select 0 GIO: GIO[011] UART1_T XD / GIO012 R17 I/O/Z VDD UART1: Transmit Data GIO: GIO[012] UART1_R XD / GIO013 R15 I/O/Z VDD UART1: Receive Data GIO: GIO[013] I2C_SCL / GIO014 R14 I/O/Z VDD I2C: Serial Clock GIO: GIO[014] I2C_SDA / GIO015 R13 I/O/Z VDD I2C: Serial Data GIO: GIO[015] CLKOUT3 / GIO016 C11 I/O/Z VDD CLKOUT: Output Clock 3 GIO: GIO[016] CLKOUT2 / GIO017 A11 I/O/Z VDD CLKOUT: Output Clock 2 GIO: GIO[017] CLKOUT1 / GIO018 D12 I/O/Z VDD CLKOUT: Output Clock 1 GIO: GIO[018] MMCSD1 _DATA0 / GIO019 / UART2_T XD A18 I/O/Z VDD MMCSD1: DATA0 GIO: GIO[019] UART2: Transmit Data NAME NO. GIO000 (1) (2) (3) 22 DESCRIPTION I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-11. GPIO Terminal Functions (continued) TERMINAL TYPE (1) OTHER (2) (3) B15 I/O/Z VDD MMCSD1: DATA1 GIO: GIO[020] UART2: Receive Data MMCSD1 _DATA2 / GIO021 / UART2_C TS A16 I/O/Z VDD MMCSD1: DATA2 GIO: GIO[021] UART2: CTS MMCSD1 _DATA3 / GIO022 / UART2_R TS B16 I/O/Z VDD MMCSD1: DATA3 GIO: GIO[022] UART2: RTS MMCSD1 _CMD / GIO023 A17 I/O/Z VDD MMCSD1: Command GIO: GIO[023] MMCSD1 _CLK / GIO024 C15 I/O/Z VDD MMCSD1: Clock GIO: GIO[024] ASP0_FS R/ GIO025 F16 I/O/Z VDD ASP0: Receive Frame Synch GIO: GIO[025] ASP0_CL KR / GIO026 F17 I/O/Z VDD ASP0: Receive Clock GIO: GIO[026] ASP0_DR / GIO027 E18 I/O/Z VDD ASP0: Receive Data GIO: GIO[027] ASP0_FS X/ GIO028 G17 I/O/Z VDD ASP0: Transmit Frame Synch GIO: GIO[028] ASP0_CL KX / GIO029 F18 I/O/Z VDD ASP0: Transmit Clock GIO: GIO[029] ASP0_DX / GIO030 H15 I/O/Z VDD ASP0: Transmit Data GIO: GIO[030] EM_CLK / GIO031 E19 I/O/Z VDD OneNAND: Clock signal for OneNAND flash interface GIO: GIO[031] EM_ADV / GIO032 H16 I/O/Z PD VDD OneNAND: Address Valid Detect for OneNAND interface GIO: GIO[032] EM_WAIT / GIO033 G18 I/O/Z PU VDD Async EMIF: Async WAIT NAND/SM/xD: RDY/_BSY input GIO: GIO[033] EM_OE / GIO034 F19 I/O/Z VDD Async EMIF: Output Enable NAND/SM/xD: RE (Read Enable) output GIO: GIO[034] EM_WE / GIO035 J15 I/O/Z VDD Async EMIF: Write Enable NAND/SM/xD: WE (Write Enable) output GIO: GIO[035] EM_CE1 / GIO036 G19 I/O/Z VDD Async EMIF: Second Chip Select., Can be programmed to be used for standard asynchronous memories (example: flash), OneNand or NAND memory. GIO: GIO[036] NAME NO. MMCSD1 _DATA1 / GIO020 / UART2_R XD DESCRIPTION EM_CE0 / GIO037 J16 I/O/Z VDD Async EMIF: Lowest numbered Chip Select. Can be programmed to be used for standard asynchronous memories (example: flash), OneNand or NAND memory. Used for the default boot and ROM boot modes. GIO: GIO[037] EM_D00 / GIO038 H18 I/O/Z VDD Async EMIF: Data Bus bit[00] GIO: GIO[038] Submit Documentation Feedback Device Overview 23 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-11. GPIO Terminal Functions (continued) TERMINAL TYPE (1) OTHER (2) (3) J17 I/O/Z VDD Async EMIF: Data Bus bit[01] GIO: GIO[039] EM_D02 / GIO040 H19 I/O/Z VDD Async EMIF: Data Bus bit[02] GIO: GIO[040] EM_D03 / GIO041 J18 I/O/Z VDD Async EMIF: Data Bus bit[03] GIO: GIO[041] EM_D04 / GIO042 L15 I/O/Z VDD Async EMIF: Data Bus bit[04] GIO: GIO[042] EM_D05 / GIO043 J19 I/O/Z VDD Async EMIF: Data Bus bit[05] GIO: GIO[043] EM_D06 / GIO044 K17 I/O/Z VDD Async EMIF: Data Bus bit[06] GIO: GIO[044] EM_D07 / GIO045 K19 I/O/Z VDD Async EMIF: Data Bus bit[07] GIO: GIO[045] EM_D08 / GIO046 L16 I/O/Z VDD Async EMIF: Data Bus bit[08] GIO: GIO[046] EM_D09 / GIO047 K18 I/O/Z VDD Async EMIF: Data Bus bit[09] GIO: GIO[047] EM_D10 / GIO048 L19 I/O/Z VDD Async EMIF: Data Bus bit[10] GIO: GIO[048] EM_D11 / GIO049 L17 I/O/Z VDD Async EMIF: Data Bus bit[11] GIO: GIO[049] EM_D12 / GIO050 L18 I/O/Z VDD Async EMIF: Data Bus bit[12] GIO: GIO[050] EM_D13 / GIO051 M15 I/O/Z VDD Async EMIF: Data Bus bit[13] GIO: GIO[051] EM_D14 / GIO052 M19 I/O/Z VDD Async EMIF: Data Bus bit[14] GIO: GIO[052] EM_D15 / GIO053 M18 I/O/Z VDD Async EMIF: Data Bus bit[15] GIO: GIO[053] EM_BA0 / GIO054 / EM_A14 N19 I/O/Z VDD Async EMIF: Bank Address 0 signal = 8-bit address. In 8-bit mode, lowest address bit. Or, can be used as an extra Address line (bit[14] when using 16-bit memories. GIO: GIO[054] EM_BA1 / GIO055 P19 I/O/Z VDD Async EMIF: Bank Address 1 signal = 16-bit address. In 16-bit mode, lowest address bit. In 8-bit mode, second lowest address bit GIO: GIO[055] EM_A00 / GIO056 M16 I/O/Z VDD Async EMIF: Address Bus bit[00] Note that the EM_A0 is always a 32-bit address GIO: GIO[056] EM_A03 / GIO057 N18 I/O/Z VDD Async EMIF: Address Bus bit[03] GIO: GIO[057] EM_A04 / GIO058 P15 I/O/Z VDD Async EMIF: Address Bus bit[04] GIO: GIO[058] EM_A05 / GIO059 R19 I/O/Z VDD Async EMIF: Address Bus bit[05] GIO: GIO[059] EM_A06 / GIO060 P18 I/O/Z VDD Async EMIF: Address Bus bit[06] GIO: GIO[060] EM_A07 / GIO061 P16 I/O/Z VDD Async EMIF: Address Bus bit[07] GIO: GIO[061] - Used by ROM Bootloader to provide progress status via LED EM_A08 / GIO062 / AECFG[0] T19 I/O/Z PU VDD Async EMIF: Address Bus bit[08] GIO: GIO[062] AECFG[0] sets default for - PinMux2.EM_A0_BA1: AEMIF Address Width (OneNAND or NAND) - PinMux2.EM_A13_3: AEMIF Address Width (OneNAND or NAND) NAME NO. EM_D01 / GIO039 24 Device Overview DESCRIPTION Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-11. GPIO Terminal Functions (continued) TERMINAL NAME EM_A09 / GIO063 / AECFG[1] EM_A10 / GIO064 / AECFG[2] NO. P17 R18 TYPE (1) OTHER (2) (3) I/O/Z PD VDD Async EMIF: Address Bus bit[09] GIO: GIO[063] System: AECFG[3:0] sampled at Power-on-Reset to set AEMIF Configuration AECFG[2:1] sets default for PinMux2.EM_BA0: AEMIF EM_BA0 Definition (EM_BA0, EM_A14, GIO[054], rsvd) I/O/Z PU VDD Async EMIF: Address Bus bit[10] GIO: GIO[064] System: AECFG[3:0] sampled at Power-on-Reset to set AEMIF Configuration AECFG[2:1] sets default for PinMux2.EM_BA0: AEMIF EM_BA0 Definition (EM_BA0, EM_A14, GIO[054], rsvd) Async EMIF: Address Bus bit[11] GIO: GIO[065] System: AECFG[3:0] sampled at Power-on-Reset to set AEMIF Configuration AECFG[3] sets default for PinMux2.EM_D15_8: AEMIF Default Bus Width (16 or 8 bits) DESCRIPTION EM_A11 / GIO065 / AECFG[3] R16 I/O/Z PU VDD EM_A12 / GIO066 / BTSEL[0] U19 I/O/Z PD VDD Async EMIF: Address Bus bit[12] GIO: GIO[066] System: BTSEL[1:0] sampled at Power-on-Reset to determine Boot method Async EMIF: Address Bus bit[13] GIO: GIO[067] System: BTSEL[1:0] sampled at Power-on-Reset to determine Boot method Used to drive Boot Status LED signal (active low) in ROM boot modes EM_A13 / GIO067 / BTSEL[1] V19 I/O/Z PD VDD VCLK / GIO068 H3 I/O/Z VDD_VOUT Video Encoder: Video Output Clock GIO: GIO[068] EXTCLK / GIO069 / B2 / PWM3D G3 I/O/Z PD VDD_VOUT Video Encoder: External clock input, used if clock rates > 27 MHz are needed, e.g. 74.25 MHz for HDTV digital output GIO: GIO[069] Digital Video Out: B2 PWM3D FIELD / GIO070 / R2 / PWM3C H4 I/O/Z VDD_VOUT Video Encoder: Field identifier for interlaced display formats GIO: GIO[070] Digital Video Out: R2 PWM3C VSYNC / GIO072 G5 I/O/Z PD VDD_VOUT Video Encoder: Vertical Sync GIO: GIO[072] HSYNC / GIO073 F5 I/O/Z PD VDD_VOUT Video Encoder: Horizontal Sync GIO: GIO[073] COUT0B3 / GIO074 / PWM3B F4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[074] PWM3B COUT1B4 / GIO075 / PWM3A F3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[075] PWM3A COUT2B5 / GIO076 / PWM2D / RTO3 E4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[076] PWM2D RTO3 COUT3B6 / GIO077 / PWM2C / RTO2 E3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[077] PWM2C RTO2 COUT4B7 / GIO078 / PWM2B / RTO1 D3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[078] PWM2B RTO1 Submit Documentation Feedback Device Overview 25 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-11. GPIO Terminal Functions (continued) TERMINAL TYPE (1) OTHER (2) (3) C1 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[079] PWM2A RTO0 COUT6G3 / GIO080 / PWM1 D2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[080] PWM1 COUT7G4 / GIO081 / PWM0 C2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[081] PWM0 PCLK / GIO082 T3 I/O/Z PD VDD_VIN Pixel clock input (strobe for lines CI7 through YI0) GIO: GIO[082] NAME NO. COUT5G2 / GIO079 / PWM2A / RTO0 DESCRIPTION CAM_WE N_FIELD / GIO083 R5 I/O/Z PD VDD_VIN Write enable input signal is used by external device (AFE/TG) to gate the DDR output of the CCDC module. Alternately, the field identification input signal is used by external device (AFE/TG) to indicate the which of two frames is input to the CCDC module for sensors with interlaced output. CCDC handles 1- or 2-field sensors in hardware. GIO: GIO[083] CAM_VD / GIO084 R4 I/O/Z PD VDD_VIN Vertical synchronization signal that can be either an input (slave mode) or an output (master mode). Tells the CCDC when a new frame starts. GIO: GIO[084] CAM_HD / GIO085 N5 I/O/Z YIN0 / GIO086 YIN1 / GIO087 YIN2 / GIO088 YIN3 / GIO089 YIN4 / GIO090 P5 P2 P4 R3 P3 I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z YIN5 / GIO091 M5 I/O/Z YIN6 / GIO092 M4 I/O/Z YIN7 / GIO093 L5 I/O/Z 26 Device Overview PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN Horizontal synchronization signal that can be either an input (slave mode) or an output (master mode). Tells the CCDC when a new line starts. GIO: GIO[085] Standard CCD/CMOS input: raw[00] YCC 16-bit: time multiplexed between luma: Y[00] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[00] GIO: GIO[086] Standard CCD/CMOS input: raw[01] YCC 16-bit: time multiplexed between luma: Y[01] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[01] GIO: GIO[087] Standard CCD/CMOS input: raw[02] YCC 16-bit: time multiplexed between luma: Y[02] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[02] GIO: GIO[088] Standard CCD/CMOS input: raw[03] YCC 16-bit: time multiplexed between luma: Y[03] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[03] GIO: GIO[089] Standard CCD/CMOS input: raw[04] YCC 16-bit: time multiplexed between luma: Y[04] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[04] GIO: GIO[090] Standard CCD/CMOS input: raw[05] YCC 16-bit: time multiplexed between luma: Y[05] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[05] GIO: GIO[091] Standard CCD/CMOS input: raw[06] YCC 16-bit: time multiplexed between luma: Y[06] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[06] GIO: GIO[092] Standard CCD/CMOS input: raw[07] YCC 16-bit: time multiplexed between luma: Y[07] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[07] GIO: GIO[093] Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-11. GPIO Terminal Functions (continued) TERMINAL NAME CIN0 / GIO094 CIN1 / GIO095 CIN2 / GIO096 CIN3 / GIO097 CIN4 / GIO098 / SPI2_SDI / SPI2_SDE NA[1] CIN5 / GIO099 / SPI2_SDE NA[0] CIN6 / GIO100 / SPI2_SD O NO. J3 L3 J5 J4 L4 M3 K5 TYPE (1) I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z I/O/Z OTHER (2) (3) PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN PD VDD_VIN DESCRIPTION Standard CCD/CMOS input: raw[08] YCC 16-bit: time multiplexed between chroma: CB/CR[00] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[00] GIO: GIO[094] Standard CCD/CMOS input: raw[09] YCC 16-bit: time multiplexed between chroma: CB/CR[01] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[01] GIO: GIO[095] Standard CCD/CMOS input: raw[10] YCC 16-bit: time multiplexed between chroma: CB/CR[02] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[02] GIO: GIO[096] Standard CCD/CMOS input: raw[11] YCC 16-bit: time multiplexed between chroma: CB/CR[03] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[03] GIO: GIO[097] Standard CCD/CMOS input: raw[12] YCC 16-bit: time multiplexed between chroma: CB/CR[04] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[04] SPI: SPI2 Data In -OR- SPI2 Chip select 1. GIO: GIO[098] Standard CCD/CMOS input: raw[13] YCC 16-bit: time multiplexed between chroma: CB/CR[05] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[05] SPI: SPI2 Chip Select 0. GIO: GIO[99] Standard CCD/CMOS input: NOT USED YCC 16-bit: time multiplexed between chroma: CB/CR[06] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[06] SPI: SPI2 Data Out GIO: GIO[100] Standard CCD/CMOS input: NOT USED YCC 16-bit: time multiplexed between chroma: CB/CR[07] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[07] SPI: SPI2 Clock GIO: GIO[101] CIN7 / GIO101 / SPI2_SCL K N3 I/O/Z SPI0_SDI / GIO102 A12 I/O/Z VDD SPI0: Data In GIO: GIO[102] SPI0_SDE NA[0] / GIO103 B12 I/O/Z VDD SPI0: Chip Select 0 GIO: GIO[103] Submit Documentation Feedback PD VDD_VIN Device Overview 27 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 2.4.6 www.ti.com Multi-Media Card/Secure Digital (MMC/SD) Interfaces The DM335 includes two Multi-Media Card/Secure Digital card interfaces that are compatible with the MMC/SD and SDIO protocol. Table 2-12. MMC/SD Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) DESCRIPTION A15 I/O/Z VDD MMCSD0: Clock MMCSD0_ CMD C14 I/O/Z VDD MMCSD0: Command MMCSD0_ DATA0 B14 I/O/Z VDD MMCSD0: DATA0 MMCSD0_ DATA1 D14 I/O/Z VDD MMCSD0: DATA1 MMCSD0_ DATA2 B13 I/O/Z VDD MMCSD0: DATA2 MMCSD0_ DATA3 A14 I/O/Z VDD MMCSD0: DATA3 MMCSD1_ CLK/ GIO024 C15 I/O/Z VDD MMCSD1: Clock GIO: GIO[024] MMCSD1_ CMD/ GIO023 A17 I/O/Z VDD MMCSD1: Command GIO: GIO[023] MMCSD1_ DATA0/ GIO019/ UART2_T XD A18 I/O/Z VDD MMCSD1: DATA0 GIO: GIO[019] UART2: Transmit data MMCSD1_ DATA1/ GIO020/ UART2_R XD B15 I/O/Z VDD MMCSD1: DATA1 GIO: GIO[020] UART2: Receive data MMCSD1_ DATA2/ GIO021/ UART2_C TS A16 I/O/Z VDD MMCSD1: DATA2 GIO: GIO[021] UART2: CTS MMCSD1_ DATA3/ GIO022/ UART2_R TS B16 I/O/Z VDD MMCSD1: DATA3 GIO: GIO[022] UART2: RTS NAME NO. MMCSD0_ CLK (1) (2) (3) 28 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 2.4.7 SPRS528B – JULY 2008 – REVISED JANUARY 2009 Universal Serial Bus (USB) Interface The Universal Serial Bus (USB) interface supports the USB2.0 High-Speed protocol and includes dual-role Host/Slave support. However, no charge pump is included. Table 2-13. USB Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) DESCRIPTION A7 A I/O/Z VDDA33_USB USB D+ (differential signal pair). When USB is not used, this signal should be connected to VSS_USB. USB_DM A6 A I/O/Z VDDA33_USB USB D- (differential signal pair). When USB is not used, this signal should be connected to VSS_USB. USB_R1 C7 A I/O/Z USB reference current output Connect to VSS_USB_REF via 10K ohm , 1% resistor placed as close to the device as possible. When USB is not used, this signal should be connected to VSS_USB. A I/O/Z USB operating mode identification pin For Device mode operation only, pull up this pin to VDD with a 1.5K ohm resistor. For Host mode operation only, pull down this pin to ground (VSS) with a 1.5K ohm resistor. If using an OTG or mini-USB connector, this pin will be set properly via the cable/connector configuration. When USB is not used, this signal should be connected to VSS_USB. NAME NO. USB_DP USB_ID D5 VDDA33_USB USB_VBUS E5 A I/O/Z VDD For host or device mode operation, tie the VBUS/USB power signal to the USB connector. When used in OTG mode operation, tie VBUS to the external charge pump and to the VBUS signal on the USB connector. When the USB is not used, tie VBUS to VSS_USB. USB_DRVVBUS C5 O/Z VDD Digital output to control external 5 V supply When USB is not used, this signal should be left as a No Connect. VSS_USB_REF C8 GND VDD USB Ground Reference Connect directly to ground and to USB_R1 via 10K ohm, 1% resistor placed as close to the device as possible. VDDA33_USB J8 PWR VDD Analog 3.3 V power USBPHY When USB is not used, this signal should be connected to VSS_USB. VDDA33_USB_PLL B6 PWR VDD Common mode 3.3 V power for USB PHY (PLL) When USB is not used, this signal should be connected to VSS_USB. VDDA13_USB H7 PWR VDD Analog 1.3 V power for USB PHY When USB is not used, this signal should be connected to VSS_USB. VDDD13_USB C6 PWR VDD Digital 1.3 V power for USB PHY When USB is not used, this signal should be connected to VSS_USB. (1) (2) (3) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3 , Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) 2.4.8 Audio Interfaces The DM335 includes two Audio Serial Ports (ASP ports), which are backward compatible with other TI ASP serial ports and provide I2S audio interface. One interface is multiplexed with GIO signals. Table 2-14. ASP Terminal Functions TERMINAL NAME NO. ASP0_CL KR/ GIO026 F17 (1) (2) (3) TYPE (1) OTHER (2) (3) I/O/Z VDD DESCRIPTION ASP0: Receive Clock GIO: GIO[026] I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Submit Documentation Feedback Device Overview 29 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-14. ASP Terminal Functions (continued) TERMINAL TYPE (1) OTHER (2) (3) F18 I/O/Z VDD ASP0: Transmit Clock GIO: GIO[029] ASP0_DR / GIO027 E18 I/O/Z VDD ASP0: Receive DataF GIO: GIO[027] ASP0_DX / GIO030 H15 I/O/Z VDD ASP0: Transmit Data GIO: GIO[030] ASP0_FS R/ GIO025 F16 I/O/Z VDD ASP0: Receive Frame Synch GIO: GIO[025] ASP0_FS X/ GIO028 G17 I/O/Z VDD ASP0: Transmit Frame SynchGIO: GIO[028] ASP1_CL KR D18 I/O/Z VDD ASP1: Receive Clock ASP1_CL KS D17 I/Z VDD ASP1: Master Clock ASP1_CL KX D19 I/O/Z VDD ASP1: Transmit Clock ASP1_DR C19 I/O/Z VDD ASP1: Receive Data ASP1_DX C18 I/O/Z VDD ASP1: Transmit Data ASP1_FS R E17 I/O/Z VDD ASP1: Receive Frame Synch ASP1_FS X E16 I/O/Z VDD ASP1: Transmit Frame Sync NAME NO. ASP0_CL KX / GIO029 2.4.9 DESCRIPTION UART Interface TheDM335 includes three UART ports. These ports are multiplexed with GIO and other signals. Table 2-15. UART Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) U18 I VDD UART0: Receive data. Used for UART boot mode UART0_TXD T18 O VDD UART0: Transmit data. Used for UART boot mode UART1_RXD/ GIO013 R15 I/O/Z VDD UART1: Receive data. GIO: GIO013 UART1_TXD/ GIO012 R17 I/O/Z VDD UART1: Transmit data. GIO: GIO012 MMCSD1_DA TA2/ GIO021/ UART2_CTS A16 I/O/Z VDD MMCSD1: DATA2 GIO: GIO021 UART2: CTS MMCSD1_DA TA3/ GIO022/ UART2_RTS B16 I/O/Z VDD MMCSD1: DATA3 GIO: GIO022 UART2: RTS MMCSD1_DA TA1/ GIO020/ UART2_RXD B15 I/O/Z VDD MMCSD1: DATA1 GIO: GIO020 UART2: RXD NAME NO. UART0_RXD (1) (2) (3) 30 DESCRIPTION I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-15. UART Terminal Functions (continued) TERMINAL NAME NO. MMCSD1_DA TA0/ GIO019/ UART2_TXD A18 TYPE (1) OTHER (2) (3) I/O/Z VDD DESCRIPTION MMCSD1: DATA0 GIO: GIO019 UART2: TXD 2.4.10 I2C Interface The DM335 includes an I2C two-wire serial interface for control of external peripherals. This interface is multiplexed with GIO signals. Table 2-16. I2C Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) DESCRIPTION R13 I/O/Z VDD I2C: Serial data GIO: GIO015 R14 I/O/Z VDD I2C: Serial clock GIO: GIO014 NAME NO. I2C_SDA/ GIO015 I2C_SCL/ GIO014 (1) (2) (3) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) 2.4.11 Serial Interface The DM335 includes three independent serial ports. These interfaces are multiplexed with GIO and other signals. Table 2-17. SPI Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) DESCRIPTION NAME NO. SPI0_SCLK C12 I/O/Z VDD SPI0: Clock SPI0_SDENA[0]/ GIO103 B12 I/O/Z VDD SPI0: Chip select 0 GIO: GIO[103] GIO007 SPI0_SDENA[1] C17 I/O/Z VDD GIO: GIO[007] SPI0: Chip select 1 SPI0_SDI/ GIO102 A12 I/O/Z VDD SPI0: Data in GIO: GIO[102] SPI0_SDO B11 I/O/Z VDD SPI0: Data out SPI1_SCLK/ GIO010 C13 I/O/Z VDD SPI1: Clock GIO: GIO[010] SPI1_SDENA[0]/ GIO011 E13 I/O/Z VDD SPI1: Chip select 0 GIO: GIO[011] - Active low during MMC/SD boot (can be used as MMC/SD power control) SPI1_SDI/ GIO009/ SPI1_SDENA[1] A13 I/O/Z VDD SPI1: Data in or SPI1: Chip select 1 GIO: GIO[09] SPI1_SDO/ GIO008 E12 I/O/Z VDD SPI1: Data out GIO: GIO[008] (1) (2) (3) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Submit Documentation Feedback Device Overview 31 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-17. SPI Terminal Functions (continued) TERMINAL NAME NO. CIN7/ GIO101/ SPI2_SCLK N3 CIN5/ GIO099/ SPI2_SDENA[0] M3 CIN4/ GIO098/ SPI2_SDI/ SPI2_SDENA[1] L4 CIN6/ GIO100/ SPI2_SDO/ K5 TYPE (1) I/O/Z I/O/Z I/O/Z I/O/Z OTHER (2) (3) DESCRIPTION PD VDD_VIN Standard CCD/CMOS input: Not used • YCC 16-bit: time multiplexed between chroma. CB/CR[07] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[07] SPI: SPI2 clock GIO: GIO[101] PD VDD_VIN Standard CCD/CMOS input: Raw[13] • YCC 16-bit: time multiplexed between chroma. CB/CR[05] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[07] SPI: SPI2 chip select 0 GIO: GIO[099] PD VDD_VIN Standard CCD/CMOS input: Raw[12] • YCC 16-bit: time multiplexed between chroma. CB/CR[04] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[04] SPI: SPI2 Data in -OR- SPI2 Chip select 1 GIO: GIO[0998] PD VDD_VIN Standard CCD/CMOS input: Not used • YCC 16-bit: time multiplexed between chroma. CB/CR[06] • YCC 8-bit (which allows for two simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[06] SPI: SPI2 Data out GIO: GIO[100] 2.4.12 Clock Interface The DM335 provides interface with the system clocks. Table 2-18. Clocks Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) D12 I/O/Z VDD CLKOUT: Output Clock 1 GIO: GIO[018] CLKOUT2 / GIO017 A11 I/O/Z VDD CLKOUT: Output Clock 2 GIO: GIO[017] CLKOUT3 / GIO016 C11 I/O/Z VDD CLKOUT: Output Clock 3 GIO: GIO[016] MXI1 A9 I VDD Crystal input for system oscillator (24 MHz or 36 MHz) MXO1 B9 O VDD Output for system oscillator (24 MHz or 36 MHz). When the MX02 is not used, the MX02 signal can be left open. NAME NO. CLKOUT1 / GIO018 DESCRIPTION MXI2 R1 I VDD Crystal input for video oscillator (27 MHz) Optional, use only if 27MHz derived from MXI1 and PLL does not provide sufficient performance for Video DAC. When the MXI2 is not used and powered down, the MXI2 signal should be left as a No Connect MXO2 T1 O VDD Output for video oscillator (27 MHz) Optional, use only if 27MHz derived from MXI1 and PLL does not provide sufficient performance for Video DAC When the MXO2 is not used and powered down, the MXO2 signal should be left as a No Connect. (1) (2) (3) 32 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 2.4.13 Real Time Output (RTO) Interface The DM335 provides Real Time Output (RTO) interface. Table 2-19. RTO Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) C1 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[079] PWM2A RTO0 COUT4B7 / GIO078 / PWM2B / RTO1 D3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[078] PWM2B RTO1 COUT3B6 / GIO077 / PWM2C / RTO2 E3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[077] PWM2C RTO2 COUT2B5 / GIO076 / PWM2D / RTO3 E4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[076] PWM2D RTO3 NAME NO. COUT5G2 / GIO079 / PWM2A / RTO0 (1) (2) (3) DESCRIPTION I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) 2.4.14 Pulse Width Modulator (PWM) Interface The DM335 provides Pulse Width Modulator (PWM) interface. Table 2-20. PWM Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) C2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[081] PWM0 COUT6G3 / GIO080 / PWM1 D2 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[080] PWM1 COUT5G2 / GIO079 / PWM2A / RTO0 C1 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[079] PWM2A RTO0 COUT4B7 / GIO078 / PWM2B / RTO1 D3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[078] PWM2B RTO1 NAME NO. COUT7G4 / GIO081 / PWM0 (1) (2) (3) DESCRIPTION I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Submit Documentation Feedback Device Overview 33 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-20. PWM Terminal Functions (continued) TERMINAL TYPE (1) OTHER (2) (3) E3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[077] PWM2C RTO2 COUT2B5 / GIO076 / PWM2D / RTO3 E4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[076] PWM2D RTO3 COUT1B4 / GIO075 / PWM3A F3 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[075] PWM3A COUT0B3 / GIO074 / PWM3B F4 I/O/Z VDD_VOUT Digital Video Out: VENC settings determine function GIO: GIO[074] PWM3B FIELD / GIO070 / R2 / PWM3C H4 I/O/Z VDD_VOUT Video Encoder: Field identifier for interlaced display formats GIO: GIO[070] Digital Video Out: R2 PWM3C EXTCLK / GIO069 / B2 / PWM3D G3 I/O/Z NAME NO. COUT3B6 / GIO077 / PWM2C / RTO2 PD VDD_VOUT DESCRIPTION Video Encoder: External clock input, used if clock rates > 27 MHz are needed, e.g. 74.25 MHz for HDTV digital output GIO: GIO[069] Digital Video Out: B2 PWM3D 2.4.15 System Configuration Interface The DM335 provides interfaces for system configuration and boot load. Table 2-21. System/Boot Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) V19 I/O/Z PD VDD Async EMIF: Address bus bit 13 GIO: GIO[067] System: BTSEL[1:0] sampled at power-on-reset to determine boot method. Used to drive boot status LED signal (active low) in ROM boot modes. U19 I/O/Z PD VDD Async EMIF: Address bus bit 12 GIO: GIO[066] System: BTSEL[1:0] sampled at power-on-reset to determine boot method. I/O/Z PU VDD Async EMIF: Address bus bit 11 GIO: GIO[065] System: AECFG[3:0] sampled a power-on-reset to set AEMIF configuration. AECFG[3] sets default fo PinMux2.EM_D15_8. AEMIF default bus width (16 or 8 bits). I/O/Z PU VDD Async EMIF: Address bus bit 10 GIO: GIO[064] System: AECFG[3:0] sampled a power-on-reset to set AEMIF configuration. AECFG[2:1] sets default fo PinMux2.EM_BA0. AEMIF EM_BA0 definition: (EM,_BA0, EM_A14, GIO[054], rsvd) PD VDD Async EMIF: Address bus bit 09 GIO: GIO[063] System: AECFG[3:0] sampled a power-on-reset to set AEMIF configuration. AECFG[2:1] sets default fo PinMux2.EM_BA0. AEMIF EM_BA0 definition: (EM,_BA0, EM_A14, GIO[054], rsvd) NAME NO. EM_A13/ GIO067/ BTSEL[1] EM_A12/ GIO066/ BTSEL[0] EM_A11/ GIO065/ AECFG[3] EM_A10/ GIO064/ AECFG[2] EM_A09/ GIO063/ AECFG[1] (1) (2) (3) 34 R16 R18 P17 I/O/Z DESCRIPTION I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-21. System/Boot Terminal Functions (continued) TERMINAL NAME NO. EM_A08/ GIO062/ AECFG[0] T19 TYPE (1) I/O/Z OTHER (2) (3) PD VDD DESCRIPTION Async EMIF: Address bus bit 08 GIO: GIO[062] System: AECFG[0] sets default for: • PinMux2.EM_A0_BA1 - AEMIF address width (OneNAND, or NAND) • PinMux2.EM_A13_3 - AEMIF address width (OneNAND, or NAND) 2.4.16 Emulation The emulation interface allow software and hardware debugging. Table 2-22. Emulation Terminal Functions TERMINAL TYPE (1) OTHER (2) (3) E10 I VDD JTAG test clock input TDI D9 I PU VDD JTAG test data input TDO E9 O VDD JTAG test data output TMS D8 I PU VDD JTAG test mode select TRST C9 I PD VDD JTAG test logic reset (active low) RTCK E11 O VDD JTAG test clock output EMU0 E8 I/O/Z PU VDD JTAG emulation 0 I/O EMU[1:0] = 00 - Force Debug Scan chain (ARM and ARM ETB TAPs connected) EMU[1:0] = 11 - Normal Scan chain (ICEpick only) EMU1 E7 I/O/Z PU VDD JTAG emulation 1 I/O EMU[1:0] = 00 - Force Debug Scan chain (ARM and ARM ETB TAPs connected) EMU[1:0] = 11 - Normal Scan chain (ICEpick only) NAME NO. TCK (1) (2) (3) DESCRIPTION I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) Submit Documentation Feedback Device Overview 35 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 2.5 Pin List Table 2-23 provides a complete pin description list in pin number order. Table 2-23. DM335 Pin Descriptions Name BGA ID CIN7 / GIO101 / SPI2_SCLK N3 Type Group (1) I/O CCDC / GIO / SPI2 Power Supply (2) VDD_VIN Description (4) PU Reset PD (3) State PD in Mux Control Standard CCD/CMOS input: NOT USED YCC 16-bit: time multiplexed between chroma: CB/CR[07] PINMUX0[1:0].CIN_ 7 YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[07] SPI: SPI2 Clock GIO: GIO[101] CIN6 / GIO100 / SPI2_SDO K5 I/O CCDC / GIO / SPI2 VDD_VIN PD in Standard CCD/CMOS input: NOT USED YCC 16-bit: time multiplexed between chroma: CB/CR[06] PINMUX0[3:2].CIN_ 6 YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[06] SPI: SPI2 Data Out GIO: GIO[100] CIN5 / GIO099 / SPI2_SDENA[0] M3 I/O CCDC / GIO / SPI2 VDD_VIN PD in Standard CCD/CMOS input: raw[13] PINMUX0[5:4].CIN_ 5 YCC 16-bit: time multiplexed between chroma: CB/CR[05] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[05] SPI: SPI2 Chip Select 0 GIO: GIO[99] CIN4 / GIO098 / SPI2_SDI / SPI2_SDENA[1] L4 I/O CCDC / GIO / SPI2 / SPI2 VDD_VIN PD in Standard CCD/CMOS input: raw[12] PINMUX0[7:6].CIN_ 4 YCC 16-bit: time multiplexed between chroma: CB/CR[04] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[04] SPI: SPI2 Data In -OR- SPI2 Chip select 1 GIO: GIO[098] (1) (2) (3) (4) 36 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal. Specifies the operating I/O supply voltage for each signal. See Section 5.3, Power Supplies for more detail. PD = pull-down, PU = pull-up. (To pull up a signal to the opposite supply rail, a 1 kΩ resistor should be used.) To reduce EMI and reflections, depending on the trace length, approximately 22 Ω to 50 Ω damping resistors are recommend on the following outputs placed near the DM335: YOUT(0-7),COUT(0-7), HSYNC,VSYNC,LCD_OE,FIELD,EXTCLK,VCLK. The trace lengths should be minimized. Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name CIN3 / GIO097 BGA ID J4 Type Group (1) I/O CCDC / GIO Power Supply (2) VDD_VIN Description (4) PU Reset PD (3) State PD in Mux Control Standard CCD/CMOS input: raw[11] PINMUX0[8].CIN_32 YCC 16-bit: time multiplexed between chroma: CB/CR[03] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[03] GIO: GIO[097] CIN2 / GIO096 J5 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[10] PINMUX0[8].CIN_32 YCC 16-bit: time multiplexed between chroma: CB/CR[02] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[02] GIO: GIO[096] CIN1 / GIO095 L3 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[09] PINMUX0[9].CIN_10 YCC 16-bit: time multiplexed between chroma: CB/CR[01] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[01] GIO: GIO[095] CIN0 / GIO094 J3 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[08] PINMUX0[9].CIN_10 YCC 16-bit: time multiplexed between chroma: CB/CR[00] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the upper channel. Y/CB/CR[00] GIO: GIO[094] YIN7 / GIO093 L5 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[07] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[07] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[07] GIO: GIO[093] YIN6 / GIO092 M4 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[06] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[06] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[06] GIO: GIO[092] Submit Documentation Feedback Device Overview 37 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name YIN5 / GIO091 BGA ID M5 Type Group (1) I/O CCDC / GIO Power Supply (2) VDD_VIN Description (4) PU Reset PD (3) State PD in Mux Control Standard CCD/CMOS input: raw[05] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[05] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[05] GIO: GIO[091] YIN4 / GIO090 P3 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[04] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[04] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[04] GIO: GIO[090] YIN3 / GIO089 R3 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[03] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[03] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[03] GIO: GIO[089] YIN2 / GIO088 P4 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[02] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[02] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[02] GIO: GIO[088] YIN1 / GIO087 P2 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[01] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[01] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[01] GIO: GIO[087] YIN0 / GIO086 P5 I/O CCDC / GIO VDD_VIN PD in Standard CCD/CMOS input: raw[00] PINMUX0[10].YIN_7 0 YCC 16-bit: time multiplexed between luma: Y[00] YCC 08-bit (which allows for 2 simultaneous decoder inputs), it is time multiplexed between luma and chroma of the lower channel. Y/CB/CR[00] GIO: GIO[086] 38 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name CAM_HD / GIO085 BGA ID N5 Type Group (1) I/O CCDC / GIO Power Supply (2) VDD_VIN Description (4) PU Reset PD (3) State PD in Mux Control Horizontal synchronization signal that can be PINMUX0[11].CAM_ either an input (slave mode) or an output HD (master mode). Tells the CCDC when a new line starts. GIO: GIO[085] CAM_VD / GIO084 R4 I/O CCDC / GIO VDD_VIN PD in CAM_WEN_FIE LD / GIO083 R5 I/O CCDC / GIO VDD_VIN PD in Vertical synchronization signal that can be either an input (slave mode) or an output (master mode). Tells the CCDC when a new frame starts. PINMUX0[12].CAM_ VD GIO: GIO[084] Write enable input signal is used by external device (AFE/TG) to gate the DDR output of the CCDC module. PINMUX0[13].CAM_ WEN Alternately, the field identification input signal is used by external device (AFE/TG) to indicate the which of two frames is input to the CCDC module for sensors with interlaced output. CCDC handles 1- or 2-field sensors in hardware. plus GIO: GIO[083] CCDC.MODE[7].CC DMD & CCDC.MODE[5].SW EN PCLK / GIO082 T3 I/O CCDC / GIO VDD_VIN PD in Pixel clock input (strobe for lines CI7 through PINMUX0[14].PCLK YI0) YOUT7-R7 C3 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) YOUT6-R6 A4 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) YOUT5-R5 B4 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) YOUT4-R4 B3 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) YOUT3-R3 B2 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) YOUT2-G7 A3 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) YOUT1-G6 A2 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) YOUT0-G5 B1 I/O VENC VDD_VOUT in Digital Video Out: VENC settings determine function (4) COUT7-G4 / GIO081 / PWM0 C2 I/O VENC / GIO / PWM0 VDD_VOUT in Digital Video Out: VENC settings determine function GIO: GIO[082] PINMUX1[1:0].COU T_7 GIO: GIO[081] PWM0 COUT6-G3 / GIO080 / PWM1 D2 I/O VENC / GIO / PWM1 VDD_VOUT in Digital Video Out: VENC settings determine function PINMUX1[3:2].COU T_6 GIO: GIO[080] PWM1 (4) Submit Documentation Feedback Device Overview 39 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name BGA ID COUT5-G2 / GIO079 / PWM2A / RTO0 C1 Type Group (1) I/O VENC / GIO / PWM2 / RTO Power Supply (2) Description (4) PU Reset PD (3) State VDD_VOUT in Mux Control Digital Video Out: VENC settings determine function PINMUX1[5:4].COU T_5 GIO: GIO[079] PWM2A RTO0 (4) COUT4-B7 / GIO078 / PWM2B / RTO1 D3 I/O VENC / GIO / PWM2 / RTO VDD_VOUT in Digital Video Out: VENC settings determine function PINMUX1[7:6].COU T_4 GIO: GIO[078] PWM2B RTO1 (4) COUT3-B6 / GIO077 / PWM2C / RTO2 E3 I/O VENC / GIO / PWM2 / RTO VDD_VOUT in Digital Video Out: VENC settings determine function PINMUX1[9:8].COU T_3 GIO: GIO[077] PWM2C RTO2 (4) COUT2-B5 / GIO076 / PWM2D / RTO3 E4 I/O VENC / GIO / PWM2 / RTO VDD_VOUT in Digital Video Out: VENC settings determine function PINMUX1[11:10].CO UT_2 GIO: GIO[076] PWM2D RTO3 (4) COUT1-B4 / GIO075 / PWM3A F3 I/O VENC / GIO / PWM3 VDD_VOUT in Digital Video Out: VENC settings determine function PINMUX1[13:12].CO UT_1 GIO: GIO[075] PWM3A (4) COUT0-B3 / GIO074 / PWM3B F4 I/O VENC / GIO / PWM3 VDD_VOUT in Digital Video Out: VENC settings determine function PINMUX1[15:14].CO UT_0 GIO: GIO[074] PWM3B (4) HSYNC / GIO073 F5 I/O VENC / GIO VDD_VOUT PD in Video Encoder: Horizontal Sync PINMUX1[16].HVSY NC GIO: GIO[073] (4) VSYNC / GIO072 G5 I/O VENC / GIO VDD_VOUT PD in Video Encoder: Vertical Sync PINMUX1[16].HVSY NC GIO: GIO[072] (4) LCD_OE / GIO071 H5 I/O VENC / GIO VDD_VOUT in Video Encoder: LCD Output Enable or BRIGHT signal PINMUX1[17].DLCD GIO: GIO[071] (4) 40 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name BGA ID FIELD / GIO070 / R2 / PWM3C H4 Type Group (1) I/O VENC / GIO / VENC / PWM3 Power Supply (2) Description (4) PU Reset PD (3) State VDD_VOUT in Mux Control Video Encoder: Field identifier for interlaced display formats PINMUX1[19:18].FI ELD GIO: GIO[070] Digital Video Out: R2 PWM3C (4) EXTCLK / GIO069 / B2 / PWM3D G3 I/O VENC / GIO / VENC / PWM3 VDD_VOUT PD in Video Encoder: External clock input, used if PINMUX1[21:20].EX clock rates > 27 MHz are needed, e.g. 74.25 TCLK MHz for HDTV digital output GIO: GIO[069] Digital Video Out: B2 PWM3D (4) VCLK / GIO068 H3 I/O VENC / GIO VDD_VOUT out L Video Encoder: Video Output Clock PINMUX1[22].VCLK GIO: GIO[068] (4) VREF J7 A I/O Video DAC Video DAC: Reference voltage output (0.45V, 0.1uF to GND) IOUT E1 A I/O Video DAC Video DAC: Pre video buffer DAC output (1000 ohm to VFB) IBIAS F2 A I/O Video DAC Video DAC: External resistor (2550 Ohms to GND) connection for current bias configuration VFB G1 A I/O Video DAC Video DAC: Pre video buffer DAC output (1000 ohm to IOUT, 1070 ohm to TVOUT) TVOUT F1 A I/O Video DAC VDDA18V_DAC L7 PWR Video DAC Video DAC: Analog 1.8V power VSSA_DAC L8 GND Video DAC Video DAC: Analog 1.8V ground DDR_CLK W9 I/O DDR VDD_DDR out L DDR Data Clock DDR_CLK W8 I/O DDR VDD_DDR out H DDR Complementary Data Clock DDR_RAS T6 I/O DDR VDD_DDR out H DDR Row Address Strobe DDR_CAS V9 I/O DDR VDD_DDR out H DDR Column Address Strobe DDR_WE W10 I/O DDR VDD_DDR out H DDR Write Enable (active low) DDR_CS T8 I/O DDR VDD_DDR out H DDR Chip Select (active low) DDR_CKE V10 I/O DDR VDD_DDR out L DDR Clock Enable DDR_DQM[1] U15 I/O DDR VDD_DDR out L Data mask outputs: DDR_DQM1: For DDR_DQ[15:8] DDR_DQM[0] T12 I/O DDR VDD_DDR out L Data mask outputs: DDR_DQM0: For DDR_DQ[7:0] DDR_DQS[1] V15 I/O DDR VDD_DDR in VDDA18_DAC Video DAC: Analog Composite NTSC/PAL output (SeeFigure 5-31 andFigure 5-32 for circuit connection) Data strobe input/outputs for each byte of the 16 bit data bus used to synchronize the data transfers. Output to DDR when writing and inputs when reading. DDR_DQS1: For DDR_DQ[15:8] Submit Documentation Feedback Device Overview 41 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name DDR_DQS[0] BGA ID V12 Type Group (1) I/O DDR Power Supply (2) VDD_DDR PU Reset PD (3) State in Description (4) Mux Control Data strobe input/outputs for each byte of the 16 bit data bus used to synchronize the data transfers. Output to DDR when writing and inputs when reading. DDR_DQS0: For DDR_DQ[7:0] DDR_BA[2] V8 I/O DDR VDD_DDR out L Bank select outputs. Two are required for 1Gb DDR2 memories. DDR_BA[1] U7 I/O DDR VDD_DDR out L Bank select outputs. Two are required for 1Gb DDR2 memories. DDR_BA[0] U8 I/O DDR VDD_DDR out L Bank select outputs. Two are required for 1Gb DDR2 memories. DDR_A13 U6 I/O DDR VDD_DDR out L DDR Address Bus bit 13 DDR_A12 V7 I/O DDR VDD_DDR out L DDR Address Bus bit 12 DDR_A11 W7 I/O DDR VDD_DDR out L DDR Address Bus bit 11 DDR_A10 V6 I/O DDR VDD_DDR out L DDR Address Bus bit 10 DDR_A09 W6 I/O DDR VDD_DDR out L DDR Address Bus bit 09 DDR_A08 W5 I/O DDR VDD_DDR out L DDR Address Bus bit 08 DDR_A07 V5 I/O DDR VDD_DDR out L DDR Address Bus bit 07 DDR_A06 U5 I/O DDR VDD_DDR out L DDR Address Bus bit 06 DDR_A05 W4 I/O DDR VDD_DDR out L DDR Address Bus bit 05 DDR_A04 V4 I/O DDR VDD_DDR out L DDR Address Bus bit 04 DDR_A03 W3 I/O DDR VDD_DDR out L DDR Address Bus bit 03 DDR_A02 W2 I/O DDR VDD_DDR out L DDR Address Bus bit 02 DDR_A01 V3 I/O DDR VDD_DDR out L DDR Address Bus bit 01 DDR_A00 V2 I/O DDR VDD_DDR out L DDR Address Bus bit 00 DDR_DQ15 W17 I/O DDR VDD_DDR in DDR Data Bus bit 15 DDR_DQ14 V16 I/O DDR VDD_DDR in DDR Data Bus bit 14 DDR_DQ13 W16 I/O DDR VDD_DDR in DDR Data Bus bit 13 DDR_DQ12 U16 I/O DDR VDD_DDR in DDR Data Bus bit 12 DDR_DQ11 W15 I/O DDR VDD_DDR in DDR Data Bus bit 11 DDR_DQ10 W14 I/O DDR VDD_DDR in DDR Data Bus bit 10 DDR_DQ09 V14 I/O DDR VDD_DDR in DDR Data Bus bit 09 DDR_DQ08 U13 I/O DDR VDD_DDR in DDR Data Bus bit 08 DDR_DQ07 W13 I/O DDR VDD_DDR in DDR Data Bus bit 07 DDR_DQ06 V13 I/O DDR VDD_DDR in DDR Data Bus bit 06 DDR_DQ05 W12 I/O DDR VDD_DDR in DDR Data Bus bit 05 DDR_DQ04 U12 I/O DDR VDD_DDR in DDR Data Bus bit 04 DDR_DQ03 T11 I/O DDR VDD_DDR in DDR Data Bus bit 03 DDR_DQ02 U11 I/O DDR VDD_DDR in DDR Data Bus bit 02 DDR_DQ01 W11 I/O DDR VDD_DDR in DDR Data Bus bit 01 DDR_DQ00 V11 I/O DDR VDD_DDR in DDR Data Bus bit 00 DDR_ DQGATE0 W18 I/O DDR VDD_DDR DDR: Loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE1 with same constraints as used for DDR clock and data. DDR_ DQGATE1 V17 I/O DDR VDD_DDR DDR: Loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE0 with same constraints as used for DDR clock and data. 42 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name Description (4) BGA ID Type Group Power Supply (2) DDR_VREF U10 PWR DDRI O VDD_DDR DDR: Voltage input for the SSTL_18 IO buffers VSSA_DLL R11 GND DDRD LL VDD_DDR DDR: Ground for the DDR DLL VDDA33_DDRDLL R10 PWR DDRD LL VDD_DDR DDR: Power (3.3 Volts) for the DDR DLL DDR: Reference output for drive strength calibration of N and P channel outputs. Tie to ground via 50 ohm resistor @ 0.5% tolerance. (1) DDR_ZN T9 I/O DDRI O VDD_DDR EM_A13 / GIO067 / BTSEL[1] V19 I/O AEMI F/ GIO / syste m VDD PU Reset PD (3) State PD in L Mux Control Async EMIF: Address Bus bit[13] PINMUX2[0].EM_A1 3_3, GIO: GIO[067] default set by AECFG[0] System: BTSEL[1:0] sampled at Power-on-Reset to determine Boot method (00:NAND, 01:Flash, 10:MMC/SD, 11:UART ) EM_A12 / GIO066 / BTSEL[0] U19 I/O AEMI F/ GIO / syste m VDD PD in L Async EMIF: Address Bus bit[12] PINMUX2[0].EM_A1 3_3, GIO: GIO[066] default set by AECFG[0] System: BTSEL[1:0] sampled at Power-on-Reset to determine Boot method (00:NAND, 01:Flash, 10:MMC/SD, 11:UART) EM_A11 / GIO065 / AECFG[3] R16 I/O AEMI F/ GIO / syste m VDD PU in H Async EMIF: Address Bus bit[11] PINMUX2[0].EM_A1 3_3, GIO: GIO[065] default set by AECFG[0] System: AECFG[3:0] sampled at Power-on-Reset to set AEMIF Configuration AECFG[3] sets default for PinMux2.EM_D15_8: AEMIF Default Bus Width (0:16 or 1:8 bits) EM_A10 / GIO064 / AECFG[2] R18 I/O AEMI F/ GIO / syste m VDD PU in H Async EMIF: Address Bus bit[10] PINMUX2[0].EM_A1 3_3, GIO: GIO[064] default set by AECFG[0] System: AECFG[3:0] sampled at Power-on-Reset to set AEMIF Configuration AECFG[2:1] sets default for PinMux2.EM_BA0: AEMIF EM_BA0 Definition (00: EM_BA0, 01: EM_A14, 10:GIO[054], 11:rsvd) Submit Documentation Feedback Device Overview 43 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name EM_A09 / GIO063 / AECFG[1] BGA ID P17 Type Group (1) I/O AEMI F/ GIO / syste m Power Supply (2) VDD Description (4) PU Reset PD (3) State PD in L Mux Control Async EMIF: Address Bus bit[09] PINMUX2[0].EM_A1 3_3, GIO: GIO[063] default set by AECFG[0] System: AECFG[3:0] sampled at Power-on-Reset to set AEMIF Configuration AECFG[2:1] sets default for PinMux2.EM_BA0: AEMIF EM_BA0 Definition (00: EM_BA0, 01: EM_A14, 10:GIO[054], 11:rsvd) EM_A08 / GIO062 / AECFG[0] T19 I/O AEMI F/ GIO / syste m VDD PU in H Async EMIF: Address Bus bit[08] PINMUX2[0].EM_A1 3_3, GIO: GIO[062] default set by AECFG[0] AECFG[0] sets default for - PinMux2.EM_A0_BA1: AEMIF Address Width (OneNAND or NAND) - PinMux2.EM_A13_3: AEMIF Address Width (OneNAND or NAND) (0:AEMIF address bits, 1:GIO[67:57]) EM_A07 / GIO061 P16 I/O AEMI F/ GIO VDD out L Async EMIF: Address Bus bit[07] PINMUX2[0].EM_A1 3_3, GIO: GIO[061] - Used by ROM Bootloader to default set by provide progress status via LED (active low) AECFG[0] EM_A06 / GIO060 EM_A05 / GIO059 EM_A04 / GIO058 EM_A03 / GIO057 EM_A02 P18 R19 P15 N18 N15 I/O I/O I/O I/O I/O AEMI F/ GIO AEMI F/ GIO AEMI F/ GIO AEMI F/ GIO AEMI F VDD VDD VDD VDD VDD out L out L out L out L out L Async EMIF: Address Bus bit[06] PINMUX2[0].EM_A1 3_3, GIO: GIO[060] default set by AECFG[0] Async EMIF: Address Bus bit[05] PINMUX2[0].EM_A1 3_3, GIO: GIO[059] default set by AECFG[0] Async EMIF: Address Bus bit[04] PINMUX2[0].EM_A1 3_3, GIO: GIO[058] default set by AECFG[0] Async EMIF: Address Bus bit[03] PINMUX2[0].EM_A1 3_3, GIO: GIO[057] default set by AECFG[0] Async EMIF: Address Bus bit[02] NAND/SM/xD: CLE - Command Latch Enable output 44 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name EM_A01 BGA ID N17 Type Group (1) I/O AEMI F Power Supply (2) VDD Description (4) PU Reset PD (3) State out L Mux Control Async EMIF: Address Bus bit[01] NAND/SM/xD: ALE - Address Latch Enable output EM_A00 / GIO056 EM_BA1 / GIO055 M16 P19 I/O I/O AEMI F/ GIO AEMI F/ GIO VDD VDD out L out H Async EMIF: Address Bus bit[00] Note that the EM_A0 is always a 32-bit address PINMUX2[1].EM_A0 _BA1, GIO: GIO[056] default set by AECFG[0] Async EMIF: Bank Address 1 signal = 16-bit address. PINMUX2[1].EM_A0 _BA1, In 16-bit mode, lowest address bit. default set by AECFG[0] In 8-bit mode, second lowest address bit GIO: GIO[055] EM_BA0 / GIO054 / EM_A14 N19 I/O AEMI F/ GIO / EMIF2 .30 VDD out H Async EMIF: Bank Address 0 signal = 8-bit address. PINMUX2[3:2].EM_ BA0, In 8-bit mode, lowest address bit. default set by AECFG[2:1] Or, can be used as an extra Address line (bit[14] when using 16-bit memories. GIO: GIO[054] EM_D15 / GIO053 EM_D14 / GIO052 EM_D13 / GIO051 EM_D12 / GIO050 EM_D11 / GIO049 EM_D10 / GIO048 M18 M19 M15 L18 L17 L19 I/O I/O I/O I/O I/O I/O Submit Documentation Feedback AEMI F/ GIO AEMI F/ GIO AEMI F/ GIO AEMI F/ GIO AEMI F/ GIO AEMI F/ GIO VDD VDD VDD VDD VDD VDD in in in in in in Async EMIF: Data Bus bit[15] PINMUX2[4].EM_D1 5_8, GIO: GIO[053] default set by AECFG[3] Async EMIF: Data Bus bit[14] PINMUX2[4].EM_D1 5_8, GIO: GIO[052] default set by AECFG[3] Async EMIF: Data Bus bit[13] PINMUX2[4].EM_D1 5_8, GIO: GIO[051] default set by AECFG[3] Async EMIF: Data Bus bit[12] PINMUX2[4].EM_D1 5_8, GIO: GIO[050] default set by AECFG[3] Async EMIF: Data Bus bit[11] PINMUX2[4].EM_D1 5_8, GIO: GIO[049] default set by AECFG[3] Async EMIF: Data Bus bit[10] PINMUX2[4].EM_D1 5_8, GIO: GIO[048] default set by AECFG[3] Device Overview 45 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name EM_D09 / GIO047 EM_D08 / GIO046 BGA ID K18 L16 Type Group (1) I/O I/O AEMI F/ GIO AEMI F/ GIO Power Supply (2) VDD VDD Description (4) PU Reset PD (3) State in in EM_D07 / GIO045 K19 I/O AEMI F/ GIO VDD in EM_D06 / GIO044 K17 I/O AEMI F/ GIO VDD in EM_D05 / GIO043 J19 I/O AEMI F/ GIO VDD in EM_D04 / GIO042 L15 I/O AEMI F/ GIO VDD in EM_D03 / GIO041 J18 I/O AEMI F/ GIO VDD in Mux Control Async EMIF: Data Bus bit[09] PINMUX2[4].EM_D1 5_8, GIO: GIO[047] default set by AECFG[3] Async EMIF: Data Bus bit[08] PINMUX2[4].EM_D1 5_8, GIO: GIO[046] default set by AECFG[3] Async EMIF: Data Bus bit[07] PINMUX2[5].EM_D7 _0 GIO: GIO[045] Async EMIF: Data Bus bit[06] PINMUX2[5].EM_D7 _0 GIO: GIO[044] Async EMIF: Data Bus bit[05] PINMUX2[5].EM_D7 _0 GIO: GIO[043] Async EMIF: Data Bus bit[04] PINMUX2[5].EM_D7 _0 GIO: GIO[042] Async EMIF: Data Bus bit[03] PINMUX2[5].EM_D7 _0 GIO: GIO[041] EM_D02 / GIO040 H19 I/O AEMI F/ GIO VDD in Async EMIF: Data Bus bit[02] PINMUX2[5].EM_D7 _0 GIO: GIO[040] EM_D01 / GIO039 J17 I/O AEMI F/ GIO VDD in Async EMIF: Data Bus bit[01] PINMUX2[5].EM_D7 _0 GIO: GIO[039] EM_D00 / GIO038 H18 I/O AEMI F/ GIO VDD in EM_CE0 / GIO037 J16 I/O AEMI F/ GIO VDD out H EM_CE1 / GIO036 G19 I/O AEMI F/ GIO VDD out H Async EMIF: Data Bus bit[00] PINMUX2[5].EM_D7 _0 GIO: GIO[038] Async EMIF: Lowest numbered Chip Select. PINMUX2[6].EM_CE Can be programmed to be used for standard 0 asynchronous memories (example:flash), OneNand or NAND memory. Used for the default boot and ROM boot modes. GIO: GIO[037] Async EMIF: Second Chip Select., Can be programmed to be used for standard asynchronous memories (example: flash), OneNand or NAND memory. PINMUX2[7].EM_CE 1 GIO: GIO[036] 46 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name EM_WE / GIO035 BGA ID J15 Type Group (1) I/O AEMI F/ GIO Power Supply (2) Description (4) PU Reset PD (3) State VDD out H Mux Control Async EMIF: Write Enable PINMUX2[8].EM_W E_OE NAND/SM/xD: WE (Write Enable) output GIO: GIO[035] EM_OE / GIO034 F19 I/O AEMI F/ GIO VDD out H Async EMIF: Output Enable PINMUX2[8].EM_W E_OE NAND/SM/xD: RE (Read Enable) output GIO: GIO[034] EM_WAIT / GIO033 G18 I/O AEMI F/ GIO VDD PU in H Async EMIF: Async WAIT PINMUX2[9].EM_W AIT NAND/SM/xD: RDY/_BSY input GIO: GIO[033] EM_ADV / GIO032 H16 I/O AEMI F/ GIO VDD PD in L OneNAND: Address Valid Detect for OneNAND interface PINMUX2[10].EM_A DV GIO: GIO[032] EM_CLK / GIO031 E19 I/O AEMI F/ GIO VDD out L OneNAND: Clock signal for OneNAND flash interface PINMUX2[11].EM_C LK GIO: GIO[031] ASP0_DX / GIO030 H15 I/O ASP5 120 / GIO VDD in ASP0_CLKX / GIO029 F18 I/O ASP5 120 / GIO VDD in ASP0_FSX / GIO028 G17 I/O ASP5 120 / GIO VDD in ASP0_DR / GIO027 E18 I/O ASP5 120 / GIO VDD in ASP0_CLKR / GIO026 F17 I/O ASP5 120 / GIO VDD in ASP0_FSR / GIO025 F16 I/O ASP5 120 / GIO VDD in MMCSD1_CLK / GIO024 C15 I/O MMC SD / GIO VDD in MMCSD1_CMD / GIO023 A17 I/O MMC SD / GIO VDD in ASP0: Transmit Data PINMUX3[0].GIO30 GIO: GIO[030] ASP0: Transmit Clock PINMUX3[1].GIO29 GIO: GIO[029] ASP0: Transmit Frame Synch PINMUX3[2].GIO28 GIO: GIO[028] ASP0: Receive Data PINMUX3[3].GIO27 GIO: GIO[027] ASP0: Receive Clock PINMUX3[4].GIO26 GIO: GIO[026] ASP0: Receive Frame Synch PINMUX3[5].GIO25 GIO: GIO[025] MMCSD1: Clock PINMUX3[6].GIO24 GIO: GIO[024] MMCSD1: Command PINMUX3[7].GIO23 GIO: GIO[023] Submit Documentation Feedback Device Overview 47 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name BGA ID MMCSD1_DAT A3 / GIO022 / UART2_RTS B16 Type Group (1) I/O MMC SD / GIO / UART 2 Power Supply (2) VDD Description (4) PU Reset PD (3) State in MMCSD1: DATA3 Mux Control PINMUX3[9:8].GIO2 2 GIO: GIO[022] UART2: RTS MMCSD1_DAT A2 / GIO021 / UART2_CTS A16 I/O MMC SD / GIO / UART 2 VDD in MMCSD1: DATA2 PINMUX3[11:10].GI O21 GIO: GIO[021] UART2: CTS MMCSD1_DAT A1 / GIO020 / UART2_RXD B15 I/O MMC SD / GIO / UART 2 VDD in MMCSD1: DATA1 PINMUX3[13:12].GI O20 GIO: GIO[020] UART2: Receive Data MMCSD1_DAT A0 / GIO019 / UART2_TXD A18 I/O MMC SD / GIO / UART 2 VDD in MMCSD1: DATA0 PINMUX3[15:14].GI O19 GIO: GIO[019] UART2: Transmit Data CLKOUT1 / GIO018 D12 I/O Clocks / GIO VDD in CLKOUT: Output Clock 1 PINMUX3[16].GIO1 8 GIO: GIO[018] CLKOUT2 / GIO017 A11 I/O Clocks / GIO VDD in CLKOUT: Output Clock 2 PINMUX3[17].GIO1 7 GIO: GIO[017] CLKOUT3 / GIO016 C11 I/O Clocks / GIO VDD in I2C_SDA / GIO015 R13 I/O I2C / GIO VDD in I2C_SCL / GIO014 R14 I/O I2C / GIO VDD in UART1_RXD / GIO013 R15 I/O UART 1/ GIO VDD in UART1_TXD / GIO012 R17 I/O UART 1/ GIO VDD in SPI1_SDENA[0] / GIO011 E13 I/O SPI1 / GIO VDD in CLKOUT: Output Clock 3 PINMUX3[18].GIO1 6 GIO: GIO[016] I2C: Serial Data PINMUX3[19].GIO1 5 GIO: GIO[015] I2C: Serial Clock PINMUX3[20].GIO1 4 GIO: GIO[014] UART1: Receive Data PINMUX3[21].GIO1 3 GIO: GIO[013] UART1: Transmit Data PINMUX3[22].GIO1 2 GIO: GIO[012] SPI1: Chip Select 0 PINMUX3[23].GIO1 1 GIO: GIO[011] 48 Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name BGA ID Type Group (1) Power Supply (2) Description (4) PU Reset PD (3) State SPI1_SCLK / GIO010 C13 I/O SPI1 / GIO VDD in SPI1_SDI / GIO009 / SPI1_SDENA[1] A13 I/O SPI1 / GIO / SPI1 VDD in SPI1_SDO / GIO008 E12 I/O SPI1 / GIO VDD in GIO007 / SPI0_SDENA[1] C17 I/O GIO debou nce / SPI0 VDD in GIO006 B18 I/O GIO debou nce VDD in GIO: GIO[006] GIO005 D15 I/O GIO debou nce VDD in GIO: GIO[005] GIO004 B17 I/O GIO debou nce VDD in GIO: GIO[004] GIO003 G15 I/O GIO debou nce VDD in GIO: GIO[003] GIO002 F15 I/O GIO debou nce VDD in GIO: GIO[002] GIO001 E14 I/O GIO debou nce VDD in GIO: GIO[001] GIO000 C16 I/O GIO debou nce VDD in GIO: GIO[000] USB_DP A7 A I/O USBP HY VDDA33_USB USB D+ (differential signal pair) USB_DM A6 A I/O USBP HY VDDA33_USB USB D- (differential signal pair) USB_R1 C7 A I/O USBP HY Mux Control SPI1: Clock PINMUX3[24].GIO1 0 GIO: GIO[010] SPI1: Data In -OR- SPI1: Chip Select 1 PINMUX3[26:25].GI O9 GIO: GIO[009] SPI1: Data Out PINMUX3[27].GIO8 GIO: GIO[008] GIO: GIO[007] PINMUX3[28].GIO7 SPI0: Chip Select 1 USB Reference current output Connect to VSS_USB_REF via 10K Ω ±1% resistor placed as close to the device as possible. USB_ID D5 A I/O USBP HY VDDA33_USB USB operating mode identification pin For Device mode operation only, pull up this pin to VDD with a 1.5K ohm resistor. For Host mode operation only, pull down this pin to ground (VSS) with a 1.5K ohm resistor. If using an OTG or mini-USB connector, this pin will be set properly via the cable/connector configuration. Submit Documentation Feedback Device Overview 49 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name USB_VBUS BGA ID Type Group E5 A I/O USBP HY (1) Power Supply (2) Description (4) PU Reset PD (3) State Mux Control For host or device mode operation, tie the VBUS/USB power signal to the USB connector. When used in OTG mode operation, tie VBUS to the external charge pump and to the VBUS signal on the USB connector. When the USB is not used, tie VBUS to VSS_USB. USB_DRVVBU S C5 VSS_USB_REF C8 O USBP HY VDD Digital output to control external 5 V supply GND USBP HY VDD USB Ground Reference Connect directly to ground and to USB_R1 via 10K Ω ±1% resistor placed as close to the device as possible. VDDA33_USB J8 PWR USBP HY VDD Analog 3.3 V power USB PHY (Transceiver) VSS_USB B7 GND USBP HY VDD Analog 3.3 V ground for USB PHY (Transceiver) VDDA33_USB_PLL B6 PWR USBP HY VDD Common mode 3.3 V power for USB PHY (PLL) VSS_USB D6 GND USBP HY VDD Common mode 3.3 V ground for USB PHY (PLL) VDDA13_USB H7 PWR USBP HY VDD Analog 1.3 V power for USB PHY VSS_USB E6 GND USBP HY VDD Analog 1.3 V ground for USB PHY VDDD13_USB C6 PWR USBP HY VDD Digital 1.3 V power for USB PHY MMCSD0_CLK A15 I/O MMC SD0 VDD out L MMCSD0_CMD C14 I/O MMC SD0 VDD MMCSD0_DAT A3 A14 I/O MMC SD0 MMCSD0_DAT A2 B13 I/O MMCSD0_DAT A1 D14 MMCSD0_DAT A0 MMCSD0: Clock PINMUX4[2].MMCS D0_MS in MMCSD0: Command PINMUX4[2].MMCS D0_MS VDD in MMCSD0: DATA3 PINMUX4[2].MMCS D0_MS MMC SD0 VDD in MMCSD0: DATA2 PINMUX4[2].MMCS D0_MS I/O MMC SD0 VDD in MMCSD0: DATA1 PINMUX4[2].MMCS D0_MS B14 I/O MMC SD0 VDD in MMCSD0: DATA0 PINMUX4[2].MMCS D0_MS UART0_RXD U18 I UART 0 VDD in UART0: Receive Data UART0_TXD T18 O UART 0 VDD out H SPI0_SDENA[0] / GIO103 B12 I/O SPI0 / GIO VDD in SPI0_SCLK C12 I/O SPI0 VDD in SPI0: Clock SPI0_SDI / GIO102 A12 I/O SPI0 / GIO VDD in SPI0: Data In SPI0_SDO B11 I/O SPI0 VDD in Used for UART boot mode UART0: Transmit Data Used for UART boot mode SPI0: Enable / Chip Select 0 PINMUX4[0].SPI0_S DENA GIO: GIO[103] PINMUX4[1].SPI0_S DI GIO: GIO[102] 50 Device Overview SPI0: Data Out Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name BGA ID Type Group (1) Power Supply (2) Description (4) PU Reset PD (3) State ASP1_DX C18 I/O ASP5 121 VDD in ASP1: Transmit Data ASP1_CLKX D19 I/O ASP5 121 VDD in ASP1: Transmit Clock ASP1_FSX E16 I/O ASP5 121 VDD in ASP1: Transmit Frame Sync ASP1_DR C19 I/O ASP5 121 VDD in ASP1: Receive Data ASP1_CLKR D18 I/O ASP5 121 VDD in ASP1: Receive Clock ASP1_FSR E17 I/O ASP5 121 VDD in ASP1: Receive Frame Synch ASP1_CLKS D17 I ASP5 121 VDD in ASP1: Master Clock RESET D11 I in Global Chip Reset (active low) A9 I Clocks VDD in Crystal input for system oscillator (24 MHz) MXO1 B9 O Clocks VDD out MXI2 R1 I Clocks VDD in MXO2 T1 O Clocks VDD out MXI1 VDD PU Mux Control Output for system oscillator (24 MHz) Crystal input for video oscillator (27 MHz). This crystal is not required VDD Output for video oscillator (27 MHz). This crystal is not required. VDD TCK E10 I EMUL ATIO N VDD PU in JTAG test clock input TDI D9 I EMUL ATIO N VDD PU in JTAG test data input TDO E9 O EMUL ATIO N VDD TMS D8 I EMUL ATIO N VDD TRST C9 I EMUL ATIO N VDD RTCK E11 O EMUL ATIO N VDD EMU0 E8 I/O EMUL ATIO N VDD EMUL ATIO N VDD out L JTAG test data output PU in JTAG test mode select PD in JTAG test logic reset (active low) PU out L JTAG test clock output in JTAG emulation 0 I/O VDD VDD EMU1 E7 I/O PU in JTAG emulation 1 I/O EMU[1:0] = 00 - Force Debug Scan chain (ARM and ARM ETB TAPs connected) EMU[1:0] = 11 - Normal Scan chain (ICEpick only) RSV01 J1 A I/O/Z Reserved. This signal should be left as a No Connect or connected to VSS. RSV02 K1 A I/O/Z Reserved. This signal should be left as a No Connect or connected to VSS. RSV03 L1 A I/O/Z Reserved. This signal should be left as a No Connect or connected to VSS. Submit Documentation Feedback Device Overview 51 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name BGA ID Type Group (1) Power Supply (2) Description (4) PU Reset PD (3) State Mux Control RSV04 M1 A I/O/Z Reserved. This signal should be left as a No Connect or connected to VSS. RSV05 N2 A I/O/Z Reserved. This signal should be connected to VSS. RSV06 M2 PWR Reserved. This signal should be connected to VSS. RSV07 K2 GND Reserved. This signal should be connected to VSS. NC H8 VDD_VIN P6 PWR Power for Digital Video Input IO (3.3 V) VDD_VIN P7 PWR Power for Digital Video Input IO (3.3 V) VDD_VIN P8 PWR Power for Digital Video Input IO (3.3 V) VDD_VOUT F6 PWR Power for Digital Video Output IO (3.3 V) VDD_VOUT F7 PWR Power for Digital Video Output IO (3.3 V) VDD_VOUT F8 PWR Power for Digital Video Output IO (3.3 V) VDD_DDR M9 PWR Power for DDR I/O (1.8 V) VDD_DDR P9 PWR Power for DDR I/O (1.8 V) VDD_DDR P10 PWR Power for DDR I/O (1.8 V) VDD_DDR P11 PWR Power for DDR I/O (1.8 V) VDD_DDR P12 PWR Power for DDR I/O (1.8 V) VDD_DDR P13 PWR Power for DDR I/O (1.8 V) VDD_DDR P14 PWR Power for DDR I/O (1.8 V) VDD_DDR R9 PWR Power for DDR I/O (1.8 V) VDD_DDR R12 PWR Power for DDR I/O (1.8 V) VDD_DDR T14 PWR Power for DDR I/O (1.8 V) VDDA_PLL1 G12 PWR Analog Power for PLL1 (1.3 V) VDDA_PLL2 H9 PWR Analog Power for PLL2 (1.3 V) CVDD A1 PWR Core power (1.3 V) CVDD A10 PWR Core power (1.3 V) CVDD B19 PWR Core power (1.3 V) CVDD C4 PWR Core power (1.3 V) CVDD G6 PWR Core power (1.3 V) CVDD G11 PWR Core power (1.3 V) CVDD H10 PWR Core power (1.3 V) CVDD H13 PWR Core power (1.3 V) CVDD H17 PWR Core power (1.3 V) CVDD J11 PWR Core power (1.3 V) CVDD J12 PWR Core power (1.3 V) CVDD J13 PWR Core power (1.3 V) CVDD K6 PWR Core power (1.3 V) CVDD K11 PWR Core power (1.3 V) CVDD K12 PWR Core power (1.3 V) CVDD L11 PWR Core power (1.3 V) CVDD L12 PWR Core power (1.3 V) CVDD N6 PWR Core power (1.3 V) CVDD R7 PWR Core power (1.3 V) CVDD R8 PWR Core power (1.3 V) CVDD T17 PWR Core power (1.3 V) 52 Device Overview No connect Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 2-23. DM335 Pin Descriptions (continued) Name Type Group W19 PWR Core power (1.3 V) VDD F9 PWR Power for Digital IO (3.3 V) VDD F10 PWR Power for Digital IO (3.3 V) VDD F11 PWR Power for Digital IO (3.3 V) VDD F12 PWR Power for Digital IO (3.3 V) VDD F13 PWR Power for Digital IO (3.3 V) VDD F14 PWR Power for Digital IO (3.3 V) VDD G8 PWR Power for Digital IO (3.3 V) VDD G14 PWR Power for Digital IO (3.3 V) VDD K8 PWR Power for Digital IO (3.3 V) VDD K15 PWR Power for Digital IO (3.3 V) VDD L6 PWR Power for Digital IO (3.3 V) VDD L13 PWR Power for Digital IO (3.3 V) VDD M10 PWR Power for Digital IO (3.3 V) VDD M11 PWR Power for Digital IO (3.3 V) VDD M12 PWR Power for Digital IO (3.3 V) VDD M13 PWR Power for Digital IO (3.3 V) VDD N11 PWR Power for Digital IO (3.3 V) VDD N12 PWR Power for Digital IO (3.3 V) VSS_MX1 C10 GND System oscillator (24 MHz) - ground VSS_MX2 P1 GND Video oscillator (27 MHz) - ground VSSA_PLL1 H12 GND Analog Ground for PLL1 VSSA_PLL2 J9 GND Analog Ground for PLL2 VSS A5 GND Digital ground VSS A8 GND Digital ground VSS A19 GND Digital ground VSS B5 GND Digital ground VSS B8 GND Digital ground VSS B10 GND Digital ground VSS D1 GND Digital ground VSS E2 GND Digital ground VSS E15 GND Digital ground VSS G2 GND Digital ground VSS G9 GND Digital ground VSS H1 GND Digital ground VSS H2 GND Digital ground VSS H6 GND Digital ground VSS H11 GND Digital ground VSS H14 GND Digital ground VSS J2 GND Digital ground VSS J6 GND Digital ground VSS J10 GND Digital ground VSS J14 GND Digital ground VSS K3 GND Digital ground VSS K9 GND Digital ground VSS K10 GND Digital ground CVDD (1) Submit Documentation Feedback Power Supply (2) Description (4) BGA ID PU Reset PD (3) State Mux Control Device Overview 53 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 2-23. DM335 Pin Descriptions (continued) Name Type Group VSS K14 GND Digital ground VSS L2 GND Digital ground VSS L9 GND Digital ground VSS L10 GND Digital ground VSS L14 GND Digital ground VSS M6 GND Digital ground VSS M7 GND Digital ground VSS M8 GND Digital ground VSS M14 GND Digital ground VSS M17 GND Digital ground VSS N1 GND Digital ground VSS N8 GND Digital ground VSS N9 GND Digital ground VSS N14 GND Digital ground VSS R2 GND Digital ground VSS R6 GND Digital ground VSS T2 GND Digital ground VSS T5 GND Digital ground VSS T15 GND Digital ground VSS U1 GND Digital ground VSS U2 GND Digital ground VSS U3 GND Digital ground VSS U4 GND Digital ground VSS U9 GND Digital ground VSS U14 GND Digital ground VSS U17 GND Digital ground VSS V1 GND Digital ground VSS V18 GND Digital ground VSS W1 GND Digital ground 54 Device Overview (1) Power Supply (2) Description (4) BGA ID PU Reset PD (3) State Mux Control Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 2.6 Device Support 2.6.1 Development Tools TI offers an extensive line of development tools for DM335 systems, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tools support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE). The following products support development of DM335 based applications: Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Hardware Development Tools: Extended Development System (XDS™) Emulator (supports TMS320DM335 DMSoC multiprocessor system debug) EVM (Evaluation Module) For a complete listing of development-support tools for the TMS320DM335 DMSoC platform, visit the Texas Instruments web site on the Worldwide Web at http://www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. 2.6.2 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (e.g., ). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS). Device development evolutionary flow: TMX Experimental device that is not necessarily representative of the final device's electrical specifications. TMP Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification. TMS Fully-qualified production device. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully qualified development-support product. TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate is undefined. Only qualified production devices are to be used in production. Submit Documentation Feedback Device Overview 55 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZCE), the temperature range (for example, "Blank" is the commercial temperature range), and the device speed range in megahertz (for example, 202 is 202.5 MHz). The following figure provides a legend for reading the complete device name for any DM335 DMSoC platform member. TMS 320 DM335 ( ) ZCE ( ) ( ) SPEED GRADE 135 MHz 216 MHz PREFIX TMX = Experimental device TMS = Qualified device TEMPERATURE RANGE (DEFAULT: 0°C TO 85°C) Blank = 0°C to 85°C, commercial temperature A = -40°C to 100°C, extended temperature DEVICE FAMILY 320 = TMS320 DSPfamily PACKAGE TYPE(A) ZCE = 337-pin plastic BGA, with Pb-free soldered balls DEVICE(B) DM335 SILICON REVISION Blank = Initial Silicon1.1 A. BGA = Ball Grid Array B. Figure 2-5. Device Nomenclature 2.6.3 Device Documentation 2.6.3.1 Related Documentation From Texas Instruments The following documents describe the TMS320DM335 Digital Media System-on-Chip (DMSoC). Copies of these documents are available on the internet at www.ti.com. 56 SPRS528 TMS320DM335 Digital Media System-on-Chip (DMSoC) Data Manual This document describes the overall TMS320DM335 system, including device architecture and features, memory map, pin descriptions, timing characteristics and requirements, device mechanicals, etc. SPRZ287 TMS320DM335 DMSoC Silicon Errata Describes the known exceptions to the functional specifications for the TMS320DM335 DMSoC. SPRUFX7 TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide This document describes the ARM Subsystem in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The ARM subsystem is designed to give the ARM926EJ-S (ARM9) master control of the device. In general, the ARM is responsible for configuration and control of the device; including the components of the ARM Subsystem, the peripherals, and the external memories. SPRUFZ1 TMS320DM335 Digital Media System-on-Chip (DMSoC) Asynchronous External Memory Interface (EMIF) Reference Guide This document describes the asynchronous external memory interface (EMIF) in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The EMIF supports a glueless interface to a variety of external devices. SPRUFY9 TMS320DM335 Digital Media System-on-Chip (DMSoC) Universal Serial Bus (USB) Controller Reference Guide This document describes the universal serial bus (USB) controller in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The USB controller supports data throughput rates up to 480 Mbps. It provides a mechanism for data transfer between USB devices and also supports host negotiation. SPRUFZ3 TMS320DM335 Digital Media System-on-Chip (DMSoC) Audio Serial Port (ASP) Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Reference Guide This document describes the operation of the audio serial port (ASP) audio interface in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The primary audio modes that are supported by the ASP are the AC97 and IIS modes. In addition to the primary audio modes, the ASP supports general serial port receive and transmit operation, but is not intended to be used as a high-speed interface. SPRUFY1 TMS320DM335 Digital Media System-on-Chip (DMSoC) Serial Peripheral Interface (SPI) Reference Guide This document describes the serial peripheral interface (SPI) in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed length (1 to 16 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The SPI is normally used for communication between the DMSoC and external peripherals. Typical applications include an interface to external I/O or peripheral expansion via devices such as shift registers, display drivers, SPI EPROMs and analog-to-digital converters. SPRUFY2 TMS320DM335 Digital Media System-on-Chip (DMSoC) Universal Asynchronous Receiver/Transmitter (UART) Reference Guide This document describes the universal asynchronous receiver/transmitter (UART) peripheral in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The UART peripheral performs serial-to-parallel conversion on data received from a peripheral device, and parallel-to-serial conversion on data received from the CPU. SPRUFY3 TMS320DM335 Digital Media System-on-Chip (DMSoC) Inter-Integrated Circuit (I2C) Peripheral Reference Guide This document describes the inter-integrated circuit (I2C) peripheral in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The I2C peripheral provides an interface between the DMSoC and other devices compliant with the I2C-bus specification and connected by way of an I2C-bus. External components attached to this 2-wire serial bus can transmit and receive up to 8-bit wide data to and from the DMSoC through the I2C peripheral. This document assumes the reader is familiar with the I2C-bus specification. SPRUFY5 TMS320DM335 Digital Media System-on-Chip (DMSoC) Multimedia Card (MMC)/Secure Digital (SD) Card Controller Reference Guide This document describes the multimedia card (MMC)/secure digital (SD) card controller in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The MMC/SD card is used in a number of applications to provide removable data storage. The MMC/SD controller provides an interface to external MMC and SD cards. The communication between the MMC/SD controller and MMC/SD card(s) is performed by the MMC/SD protocol. SPRUFZ20 TMS320DM335 Digital Media System-on-Chip (DMSoC) Enhanced Direct Memory Access (EDMA) Controller Reference Guide This document describes the operation of the enhanced direct memory access (EDMA3) controller in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The EDMA controller's primary purpose is to service user-programmed data transfers between two memory-mapped slave endpoints on the DMSoC. SPRUFY0 TMS320DM335 Digital Media System-on-Chip (DMSoC) 64-bit Timer Reference Guide This document describes the operation of the software-programmable 64-bit timers in the TMS320DM335 Digital Media System-on-Chip (DMSoC). Timer 0, Timer 1, and Timer 3 are used as general-purpose (GP) timers and can be programmed in 64-bit mode, dual 32-bit unchained mode, or dual 32-bit chained mode; Timer 2 is used only as a watchdog timer. The GP timer modes can be used to generate periodic interrupts or enhanced direct memory access (EDMA) synchronization events and Real Time Output (RTO) events (Timer 3 only). The watchdog timer mode is used to provide a recovery mechanism for the device in the event of a fault condition, such as a non-exiting code loop. SPRUFY8 TMS320DM335 Digital Media System-on-Chip (DMSoC) General-Purpose Input/Output (GPIO) Reference Guide This document describes the general-purpose input/output (GPIO) Submit Documentation Feedback Device Overview 57 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com peripheral in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The GPIO peripheral provides dedicated general-purpose pins that can be configured as either inputs or outputs. When configured as an input, you can detect the state of the input by reading the state of an internal register. When configured as an output, you can write to an internal register to control the state driven on the output pin. 58 SPRUFY6 TMS320DM335 Digital Media System-on-Chip (DMSoC) Pulse-Width Modulator (PWM) Reference Guide This document describes the pulse-width modulator (PWM) peripheral in the TMS320DM335 Digital Media System-on-Chip (DMSoC). SPRUFZ2 TMS320DM335 Digital Media System-on-Chip (DMSoC) DDR2/Mobile DDR (DDR2/mDDR) Memory Controller Reference Guide This document describes the DDR2/mDDR memory controller in the TMS320DM335 Digital Media System-on-Chip (DMSoC). The DDR2/mDDR memory controller is used to interface with JESD79D-2A standard compliant DDR2 SDRAM and mobile DDR devices. SPRUFX8 TMS320DM335 Digital Media System-on-Chip (DMSoC) Video Processing Front End (VPFE) Reference Guide This document describes the Video Processing Front End (VPFE) in the TMS320DM335 Digital Media System-on-Chip (DMSoC). SPRUFX9 TMS320DM335 Digital Media System-on-Chip (DMSoC) Video Processing Back End (VPBE) Reference Guide This document describes the Video Processing Back End (VPBE) in the TMS320DM335 Digital Media System-on-Chip (DMSoC). SPRUFY7 TMS320DM335 Digital Media System-on-Chip (DMSoC) Real-Time Out (RTO) Controller Reference Guide This document describes the Real Time Out (RTO) controller in the TMS320DM335 Digital Media System-on-Chip (DMSoC). SPRAAL2 Implementing DDR2/mDDR PCB Layout on the TMS320DM335 DMSoC This provides board design recommendations and guidelines for DDR2 and mobile DDR. Device Overview Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 3 Detailed Device Description This section provides a detailed overview of the DM335 device. 3.1 ARM Subsystem Overview The ARM Subsystem contains components required to provide the ARM926EJ-S (ARM) master control of the overall DM335 system, including the components of the ARM Subsystem, the peripherals, and the external memories. The ARM is responsible for handling system functions such as system-level initialization, configuration, user interface, user command execution, connectivity functions, interface and control of the subsystem, etc. The ARM is master and performs these functions because it has a large program memory space and fast context switching capability, and is thus suitable for complex, multi-tasking, and general-purpose control tasks. 3.1.1 Components of the ARM Subsystem The ARM Subsystem in DM335 consists of the following components: • ARM926EJ-S RISC processor, including: – coprocessor 15 (CP15) – MMU – 16KB Instruction cache – 8KB Data cache – Write Buffer – Java accelerator • ARM Internal Memories – 32KB Internal RAM (32-bit wide access) – 8KB Internal ROM (ARM bootloader for non-AEMIF boot options) • Embedded Trace Module and Embedded Trace Buffer (ETM/ETB) • System Control Peripherals – ARM Interrupt Controller – PLL Controller – Power and Sleep Controller – System Control Module The ARM also manages/controls all the device peripherals: • DDR2 / mDDR EMIF Controller • AEMIF Controller, including the OneNAND and NAND flash interface • Enhanced DMA (EDMA) • UART • Timers • Real Time Out (RTO) • Pulse Width Modulator (PWM) • Inter-IC Communication (I2C) • Multi-Media Card/Secure Digital (MMC/SD) • Audio Serial Port (ASP) • Universal Serial Bus Controller (USB) • Serial Port Interface (SPI) • Video Processing Front End (VPFE) – CCD Controller (CCDC) Submit Documentation Feedback Detailed Device Description 59 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 • www.ti.com – Image Pipe (IPIPE) – H3A Engine (Hardware engine for computing Auto-focus, Auto white balance, and Auto exposure) Video Processing Back End (VPBE) – On Screen Display (OSD) – Video Encoder Engine (VENC) Figure 3-1 shows the functional block diagram of the DM335 ARM Subsystem. Master IF ARM Interrupt Controller (AINTC) Master IF Arbiter Arbiter I-AHB D-AHB System Control I-TCM D-TCM Slave 16K I$ CP15 8K D$ MMU Arbiter 8K ROM 16K RAM1 PLLC2 IF 16K RAM0 CFG Bus DMA Bus ARM926EJ-S PLLC1 Power Sleep Controller (PSC) Peripherals ... Figure 3-1. DM335 ARM Subsystem Block Diagram 3.2 ARM926EJ-S RISC CPU The ARM Subsystem integrates the ARM926EJ-S processor. The ARM926EJ-S processor is a member of ARM9 family of general-purpose microprocessors. This processor is targeted at multi-tasking applications where full memory management, high performance, low die size, and low power are all important. The ARM926EJ-S processor supports the 32-bit ARM and 16 bit THUMB instruction sets, enabling the user to trade off between high performance and high code density. Specifically, the ARM926EJ-S processor supports the ARMv5TEJ instruction set, which includes features for efficient execution of Java byte codes, providing Java performance similar to Just in Time (JIT) Java interpreter, but without associated code overhead. The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both hardware and software debug. The ARM926EJ-S processor has a Harvard architecture and provides a complete high performance subsystem, including: • ARM926EJ -S integer core • CP15 system control coprocessor • Memory Management Unit (MMU) • Separate instruction and data Caches • Write buffer • Separate instruction and data Tightly-Coupled Memories (TCMs) [internal RAM] interfaces • Separate instruction and data AHB bus interfaces 60 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com • SPRS528B – JULY 2008 – REVISED JANUARY 2009 Embedded Trace Module and Embedded Trace Buffer (ETM/ETB) For more complete details on the ARM9, refer to the ARM926EJ-S Technical Reference Manual, available at http://www.arm.com 3.2.1 CP15 The ARM926EJ-S system control coprocessor (CP15) is used to configure and control instruction and data caches, Tightly-Coupled Memories (TCMs), Memory Management Unit (MMU), and other ARM subsystem functions. The CP15 registers are programmed using the MRC and MCR ARM instructions, when the ARM in a privileged mode such as supervisor or system mode. 3.2.2 MMU The ARM926EJ-S MMU provides virtual memory features required by operating systems such as Linux, WindowCE, ultron, ThreadX, etc. A single set of two level page tables stored in main memory is used to control the address translation, permission checks and memory region attributes for both data and instruction accesses. The MMU uses a single unified Translation Lookaside Buffer (TLB) to cache the information held in the page tables. The MMU features are: • Standard ARM architecture v4 and v5 MMU mapping sizes, domains and access protection scheme. • Mapping sizes are: – 1MB (sections) – 64KB (large pages) – 4KB (small pages) – 1KB (tiny pages) • Access permissions for large pages and small pages can be specified separately for each quarter of the page (subpage permissions) • Hardware page table walks • Invalidate entire TLB, using CP15 register 8 • Invalidate TLB entry, selected by MVA, using CP15 register 8 • Lockdown of TLB entries, using CP15 register 10 3.2.3 Caches and Write Buffer The size of the Instruction Cache is 16KB, Data cache is 8KB. Additionally, the Caches have the following features: • Virtual index, virtual tag, and addressed using the Modified Virtual Address (MVA) • Four-way set associative, with a cache line length of eight words per line (32-bytes per line) and with two dirty bits in the Dcache • Dcache supports write-through and write-back (or copy back) cache operation, selected by memory region using the C and B bits in the MMU translation tables. • Critical-word first cache refilling • Cache lockdown registers enable control over which cache ways are used for allocation on a line fill, providing a mechanism for both lockdown, and controlling cache corruption • Dcache stores the Physical Address TAG (PA TAG) corresponding to each Dcache entry in the TAG RAM for use during the cache line write-backs, in addition to the Virtual Address TAG stored in the TAG RAM. This means that the MMU is not involved in Dcache write-back operations, removing the possibility of TLB misses related to the write-back address. • Cache maintenance operations provide efficient invalidation of, the entire Dcache or Icache, regions of the Dcache or Icache, and regions of virtual memory. Submit Documentation Feedback Detailed Device Description 61 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com The write buffer is used for all writes to a noncachable bufferable region, write-through region and write misses to a write-back region. A separate buffer is incorporated in the Dcache for holding write-back for cache line evictions or cleaning of dirty cache lines. The main write buffer has 16-word data buffer and a four-address buffer. The Dcache write-back has eight data word entries and a single address entry. 3.2.4 Tightly Coupled Memory (TCM) ARM internal RAM is provided for storing real-time and performance-critical code/data and the Interrupt Vector table. ARM internal ROM boot options include—NAND, UART, and MMC/SD. The RAM and ROM memories interfaced to the ARM926EJ-S via the tightly coupled memory interface that provides for separate instruction and data bus connections. Since the ARM TCM does not allow instructions on the D-TCM bus or data on the I-TCM bus, an arbiter is included so that both data and instructions can be stored in the internal RAM/ROM. The arbiter also allows accesses to the RAM/ROM from extra-ARM sources (e.g., EDMA or other masters). The ARM926EJ-S has built-in DMA support for direct accesses to the ARM internal memory from a non-ARM master. Because of the time-critical nature of the TCM link to the ARM internal memory, all accesses from non-ARM devices are treated as DMA transfers. Instruction and Data accesses are differentiated via accessing different memory map regions, with the instruction region from 0x0000 through 0x7FFF and data from 0x10000 through 0x17FFF. Placing the instruction region at 0x0000 is necessary to allow the ARM Interrupt Vector table to be placed at 0x0000, as required by the ARM architecture. The internal 32-KB RAM is split into two physical banks of 16KB each, which allows simultaneous instruction and data accesses to be accomplished if the code and data are in separate banks. 3.2.5 Advanced High-performance Bus (AHB) The ARM Subsystem uses the AHB port of the ARM926EJ-S to connect the ARM to the configuration bus and the external memories. Arbiters are employed to arbitrate access to the separate D-AHB and I-AHB by the configuration bus and the external memories bus. 3.2.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB) To support real-time trace, the ARM926EJ-S processor provides an interface to enable connection of an Embedded Trace Macrocell (ETM). The ARM926ES-J Subsystem in DM335 also includes the Embedded Trace Buffer (ETB). The ETM consists of two parts: • Trace Port provides real-time trace capability for the ARM9. • Triggering facilities provide trigger resources, which include address and data comparators, counter, and sequencers. The DM335 trace port is not pinned out and is instead only connected to the Embedded Trace Buffer. The ETB has a 4KB buffer memory. ETB enabled debug tools are required to read/interpret the captured trace data. 3.3 Memory Mapping The ARM memory map is shown in Table 2-2 and Table 2-3. This section describes the memories and interfaces within the ARM's memory map. 3.3.1 ARM Internal Memories The ARM has access to the following ARM internal memories: • 32KB ARM Internal RAM on TCM interface, logically separated into two 16KB pages to allow simultaneous access on any given cycle if there are separate accesses for code (I-TCM bus) and data (D-TCM) to the different memory regions. • 8KB ARM Internal ROM 3.3.2 External Memories The ARM has access to the following External memories: 62 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com • • • • 3.3.3 SPRS528B – JULY 2008 – REVISED JANUARY 2009 DDR2 / mDDR Synchronous DRAM Asynchronous EMIF / OneNAND NAND Flash Flash card devices: – MMC/SD – xD – SmartMedia Peripherals The ARM has access to all of the peripherals on the DM335 device. 3.4 ARM Interrupt Controller (AINTC) The DM335 ARM Interrupt Controller (AINTC) has the following features: • Supports up to 64 interrupt channels (16 external channels) • Interrupt mask for each channel • Each interrupt channel can be mapped to a Fast Interrupt Request (FIQ) or to an Interrupt Request (IRQ) type of interrupt. • Hardware prioritization of simultaneous interrupts • Configurable interrupt priority (2 levels of FIQ and 6 levels of IRQ) • Configurable interrupt entry table (FIQ and IRQ priority table entry) to reduce interrupt processing time The ARM core supports two interrupt types: FIQ and IRQ. See the ARM926EJ-S Technical Reference Manual for detailed information about the ARM’s FIQ and IRQ interrupts. Each interrupt channel is mappable to an FIQ or to an IRQ type of interrupt, and each channel can be enabled or disabled. The INTC supports user-configurable interrupt-priority and interrupt entry addresses. Entry addresses minimize the time spent jumping to interrupt service routines (ISRs). When an interrupt occurs, the corresponding highest priority ISR’s address is stored in the INTC’s ENTRY register. The IRQ or FIQ interrupt routine can read the ENTRY register and jump to the corresponding ISR directly. Thus, the ARM does not require a software dispatcher to determine the asserted interrupt. 3.4.1 Interrupt Mapping The AINTC takes up to 64 ARM device interrupts and maps them to either the IRQ or to the FIQ of the ARM. Each interrupt is also assigned one of 8 priority levels (2 for FIQ, 6 for IRQ). For interrupts with the same priority level, the priority is determined by the hardware interrupt number (the lowest number has the highest priority). Table 3-1 shows the connection of device interrupts to the ARM. Table 3-1. AINTC Interrupt Connections (1) (1) Interrupt Number Acronym Source 0 VPSSINT0 VPSS - INT0, Configurable via VPSSBL register: INTSEL 1 VPSSINT1 2 VPSSINT2 3 4 5 Interrupt Number Acronym Source 32 TINT0 Timer 0 - TINT12 VPSS - INT1 33 TINT1 Timer 0 - TINT34 VPSS - INT2 34 TINT2 Timer 1 - TINT12 VPSSINT3 VPSS - INT3 35 TINT3 Timer 1 - TINT34 VPSSINT4 VPSS - INT4 36 PWMINT0 PWM0 VPSSINT5 VPSS - INT5 37 PWMINT1 PWM 1 The total number of interrupts in DM335 exceeds 64, which is the maximum value of the AINTC module. Therefore, several interrupts are multiplexed and you must use the register ARM_INTMUX in the System Control Module to select the interrupt source for multiplexed interrupts. Refer to the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) for more information on the System Control Module register ARM_INTMUX. Submit Documentation Feedback Detailed Device Description 63 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 3-1. AINTC Interrupt Connections (continued) 64 Interrupt Number Acronym Source Interrupt Number Acronym Source 6 VPSSINT6 VPSS - INT6 38 PWMINT2 PWM2 7 8 VPSSINT7 VPSS - INT7 39 I2CINT I2C VPSSINT8 VPSS - INT8 40 UARTINT0 9 UART0 Reserved 41 UARTINT1 UART1 10 Reserved 42 SPINT0-0 SPI0 11 Reserved 43 SPINT0-1 SPI0 12 USBINT USB OTG Collector 44 GPIO0 GPIO 13 RTOINT or TINT4 RTO or Timer 2 - TINT12 SYS.ARM_INTMUX 45 GPIO1 GPIO 14 UARTINT2 or TINT5 UART2 or Timer 2 - TINT34 46 GPIO2 GPIO 15 TINT6 Timer 3 TINT12 47 GPIO3 GPIO 16 CCINT0 EDMA CC Region 0 48 GPIO4 GPIO 17 SPINT1-0 or CCERRINT SPI1 or EDMA CC Error 49 GPIO5 GPIO 18 SPINT1-1 or TCERRINT0 SPI1 or EDMA TC0 Error 50 GPIO6 GPIO 19 SPINT2-0 or TCERRINT1 SPI2 or EDMA TC1 Error 51 GPIO7 GPIO 20 PSCINT PSC - ALLINT 52 GPIO8 GPIO 21 SPINT2-1 SPI2 53 GPIO9 GPIO 22 TINT7 Timer3 - TINT34 54 GPIOBNK0 GPIO 23 SDIOINT0 MMC/SD0 55 GPIOBNK1 GPIO 24 MBXINT0 or MBXINT1 ASP0 or ASP1 56 GPIOBNK2 GPIO 25 MBRINT0 or MBRINT1 ASP0 or ASP1 57 GPIOBNK3 GPIO 26 MMCINT0 MMC/SD0 58 GPIOBNK4 GPIO 27 MMCINT1 MMC/SC1 59 GPIOBNK5 GPIO 28 PWMINT3 PWM3 60 GPIOBNK6 GPIO 29 DDRINT DDR EMIF 61 COMMTX ARMSS 30 AEMIFINT Async EMIF 62 COMMRX ARMSS 31 SDIOINT1 SDIO1 63 EMUINT E2ICE Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 3.5 Device Clocking 3.5.1 Overview The DM335 requires one primary reference clock . The reference clock frequency may be generated either by crystal input or by external oscillator. The reference clock is the clock at the pins named MXI1/MXO1. The reference clock drives two separate PLL controllers (PLLC1 and PLLC2). PLLC1 generates the clocks required by the ARM, VPBE,VPSS, and peripherals. PLL2 generates the clock required by the DDR PHY. A block diagram of DM335's clocking architecture is shown in Figure 3-2. The PLLs are described further in Section 3.6. Submit Documentation Feedback Detailed Device Description 65 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com SYSCLKBP Reference Clock (MXI/MXO) 24 MHz or 36 MHz CLKOUT2 BPDIV (/3) AUXCLK (/1) AUXCLK UART0, 1 SYSCLK1 ARM Subsystem PLLDIV1 (/2) I2C PWMs (x4) Timers (x4) RTO CLKOUT1 PLLDIV2 (/4) PLLDIV3 (/n) PLLDIV4 (/4 or /2) SYSCLK2 USB Phy SYSCLK3 SYSCLK4 60 MHz VPSS Reference Clock (MXI/MXO) (24 MHz or 36 MHz) USB EMIF/NAND PLL Controller 1 MMC/SD (x2) VPFE PCLK SPI (x3) VPBE EXTCLK ASP (x2) GPIO DAC ARM INTC UART2 EDMA PLLDIV1 (/1) SYSCLK1 DDR PHY DDR BPDIV (/8) SYSCLKBP Bus Logic Sys Logic CLKOUT3 PLL Controller 2 PSC IcePick Sequencer Figure 3-2. Device Clocking Block Diagram 66 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 3.5.2 SPRS528B – JULY 2008 – REVISED JANUARY 2009 Supported Clocking Configurations for DM335-135 This section describes the only supported device clocking configurations for DM335-135. The DM335 supports either 24 MHz (typical) or 36 MHz reference clock (crystal or external oscillator input). Configurations are shown for both cases. 3.5.2.1 Supported Clocking Configurations for DM335-135 (24 MHz reference) 3.5.2.1.1 DM335-135 PLL1 (24 MHz reference) All supported clocking configurations for DM335-135 PLL1 with 24 MHz reference clock are shown in Table 3-2. Table 3-2. PLL1 Supported Clocking Configurations for DM335-135 (24 MHz reference) PREDIV PLLM POSTDIV PLL1 VCO ARM (/8 fixed) (m programmable) (/2 or /1 programmable) (MHz) PLLDIV1 (/2 fixed) bypass bypass bypass bypass 8 180 2 270 8 162 2 8 144 2 8 126 8 108 Peripherals SYSCLK1 (MHz) PLLDIV2 (/4 fixed) 2 12 2 135 243 2 216 2 2 189 2 162 VENC VPSS SYSCLK2 (MHz) PLLDIV3 (/n programmable) SYSCLK3 (MHz) PLLDIV4 (/4 or /2 programmable) SYSCLK4 (MHz) 4 6 10 2.4 4 6 4 67.5 10 27 2 135 121.5 4 60.75 9 27 2 121.5 108 4 54 8 27 2 108 2 94.5 4 47.25 7 27 2 94.5 2 81 4 40.5 6 27 2 81 3.5.2.1.2 DM335-135 PLL2 (24 MHz reference) All supported clocking configurations for DM335-135 PLL2 with 24 MHz reference clock are shown in Table 3-3. Table 3-3. PLL2 Supported Clocking Configurations for DM335-135 (24 MHz reference) PREDIV PLLM POSTDIV PLL2 VCO (/n programmable) (m programmable) (/1 fixed) (MHz) PLLDIV1 (/1 fixed) DDR PHY DDR Clock bypass bypass bypass bypass 1 24 12 12 133 1 266 1 266 133 12 100 1 200 1 200 100 15 100 1 160 1 160 80 SYSCLK1 (MHz) DDR_CLK (MHz) 3.5.2.2 Supported Clocking Configurations for DM335-135 (36 MHz reference) 3.5.2.2.1 DM335-135PLL1 (36 MHz reference) All supported clocking configurations for DM335-135 PLL1 with 36 MHz reference clock are shown in Table 3-4. Table 3-4. PLL1 Supported Clocking Configurations DM335-135 (36 MHz reference) PREDIV PLLM /2 or /1 programmable PLL1 VCO ARM coprocessor (/8 fixed) (m programmable) (/2 fixed) (MHz) PLLDIV1 (/2 fixed) bypass bypass bypass bypass 8 120 2 270 8 108 2 8 96 2 Peripherals SYSCLK1 (MHz) PLLDIV2 (/4 fixed) 2 18 2 135 243 2 216 2 VENC VPSS SYSCLK2 (MHz) PLLDIV3 (/n programmable) SYSCLK3 (MHz) PLLDIV4 (/4 or /2 programmable) SYSCLK4 (MHz) 4 9 10 3.6 4 18 4 67.5 10 27 2 135 121.5 4 60.75 9 27 2 121.5 108 4 54 8 27 2 108 3.5.2.2.2 DM335-135 PLL2 (36 MHz reference) All supported clocking configurations for DM335-135 PLL2 with 36 MHz reference clock are shown in Table 3-5. Submit Documentation Feedback Detailed Device Description 67 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 3-5. PLL2 Supported Clocking Configurations for DM335-135 (36 MHz reference) 68 PREDIV PLLM POSTDIV PLL2 VCO (/n programmable) (m programmable) (/1 fixed) (MHz) PLLDIV1 (/1 fixed) bypass bypass bypass bypass 1 36 18 18 133 1 266 1 266 133 27 150 1 200 1 200 100 27 120 1 160 1 160 80 Detailed Device Description DDR PHY DDR Clock SYSCLK1 (MHz) DDR_CLK (MHz) Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 3.5.3 SPRS528B – JULY 2008 – REVISED JANUARY 2009 Supported Clocking Configurations for DM335-216 This section describes the only supported device clocking configurations for DM335-216. The DM335 supports either 24 MHz (typical) or 36 MHz reference clock (crystal or external oscillator input). Configurations are shown for both cases. 3.5.3.1 Supported Clocking Configurations for DM335-216 (24 MHz reference) 3.5.3.1.1 DM335-216 PLL1 (24 MHz reference) All supported clocking configurations for DM335-216 PLL1 with 24 MHz reference clock are shown in Table 3-2. Table 3-6. PLL1 Supported Clocking Configurations for DM335-216 (24 MHz reference) PREDIV PLLM POSTDIV PLL1 VCO ARM (/8 fixed) (m programmable) (/2 or /1 programmable) (MHz) PLLDIV1 (/2 fixed) bypass bypass bypass bypass 8 144 1 432 8 135 1 8 126 1 8 117 8 8 Peripherals SYSCLK1 (MHz) PLLDIV2 (/4 fixed) 2 12 2 216 405 2 378 2 1 351 2 108 1 324 99 1 297 8 180 2 270 8 162 2 243 8 144 2 216 8 126 2 189 8 108 2 162 VENC VPSS SYSCLK2 (MHz) PLLDIV3 (/n programmable) SYSCLK3 (MHz) PLLDIV4 (/4 or /2 programmable) SYSCLK4 (MHz) 4 6 10 2.4 4 6 4 108 16 27 4 108 202.5 4 101.25 15 27 4 101.25 189 4 94.5 14 27 4 94.5 175.5 4 87.75 13 27 4 87.75 2 162 4 81 12 27 4 81 2 148.5 4 74.25 11 27 4 74.25 2 135 4 67.5 10 27 2 135 2 121.5 4 60.75 9 27 2 121.5 2 108 4 54 8 27 2 108 2 94.5 4 47.25 7 27 2 94.5 2 81 4 40.5 6 27 2 81 3.5.3.1.2 DM335-216 PLL2 (24 MHz reference) All supported clocking configurations for DM335-216 PLL2 with 24 MHz reference clock are shown in Table 3-3. Table 3-7. PLL2 Supported Clocking Configurations for DM335-216 (24 MHz reference) PREDIV PLLM POSTDIV PLL2 VCO (/n programmable) (m programmable) (/1 fixed) (MHz) PLLDIV1 (/1 fixed) bypass bypass bypass bypass 1 24 12 8 114 1 342 1 342 171 8 108 1 324 1 324 162 8 102 1 306 1 306 153 8 96 1 288 1 288 144 12 133 1 266 1 266 133 12 100 1 200 1 200 100 15 100 1 160 1 160 80 Submit Documentation Feedback DDR PHY DDR Clock SYSCLK1 (MHz) DDR_CLK (MHz) Detailed Device Description 69 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 3.5.3.2 Supported Clocking Configurations for DM335-216 (36 MHz reference) 3.5.3.2.1 DM335-216 PLL1 (36 MHz reference) All supported clocking configurations for DM335-216 PLL1 with 36 MHz reference clock are shown in Table 3-4. Table 3-8. PLL1 Supported Clocking Configurations DM335-216 (36 MHz reference) PREDIV PLLM POSTDIV PLL1 VCO (/8 fixed) (m programmable) (/2 or /1 programmable) (MHz) PLLDIV1 (/2 fixed) ARM bypass bypass bypass bypass 8 96 1 432 8 180 2 8 168 2 8 156 8 8 Peripherals SYSCLK1 (MHz) PLLDIV2 (/4 fixed) 2 18 2 216 405 2 378 2 2 351 2 144 2 324 132 2 297 8 120 2 270 8 108 2 243 8 96 2 216 VENC VPSS SYSCLK2 (MHz) PLLDIV3 (/n programmable) SYSCLK3 (MHz) PLLDIV4 (/4 or /2 programmable) SYSCLK4 (MHz) 4 9 10 3.6 4 9 4 108 16 27 4 108 202.5 4 101.25 15 27 4 101.25 189 4 94.5 14 27 4 94.5 175.5 4 87.75 13 27 4 87.75 2 162 4 81 12 27 4 81 2 148.5 4 74.25 11 27 4 74.25 2 135 4 67.5 10 27 2 135 2 121.5 4 60.75 9 27 2 121.5 2 108 4 54 8 27 2 108 3.5.3.2.2 DM335-216 PLL2 (36 MHz reference) All supported clocking configurations for DM335-216 PLL2 with 36 MHz reference clock are shown in Table 3-5. Table 3-9. PLL2 Supported Clocking Configurations for DM335-216 (36 MHz reference) PREDIV PLLM POSTDIV PLL2 VCO (/n programmable) (m programmable) (/1 fixed) (MHz) PLLDIV1 (/1 fixed) bypass bypass bypass bypass 1 36 18 12 114 1 342 1 342 171 12 108 1 324 1 324 162 12 102 1 306 1 306 153 12 96 1 288 1 288 144 18 133 1 266 1 266 133 27 150 1 200 1 200 100 27 120 1 160 1 160 80 3.5.4 DDR PHY DDR Clock SYSCLK1 (MHz) DDR_CLK (MHz) Peripheral Clocking Considerations 3.5.4.1 Video Processing Back End Clocking The Video Processing Back End (VPBE) is a sub-module of the Video Processing Subsystem (VPSS). The VPBE is designed to interface with a variety of LCDs and an internal DAC module. There are two asynchronous clock domains in the VPBE: an internal clock domain and an external clock domain. The internal clock domain is driven by the VPSS clock (PLL1 SYSCLK4). The external clock domain is configurable; you can select one of five source: • 24 MHz crystal input at MXI1 • 27 MHz crystal input at MXI2 (optional feature, not typically used) • PLL1 SYSCLK3 • EXTCLK pin (external VPBE clock input pin) • PCLK pin (VPFE pixel clock input pin) See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Video Processing Back End (VPBE) Reference Guide (literature number SPRUFX9) for complete information on VPBE clocking. 70 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 3.5.4.2 USB Clocking The USB Controller is driven by two clocks: an output clock of PLL1 (SYSCLK2) and an output clock of the USB PHY. NOTE For proper USB 2.0 function, SYSCLK2 must be greater than 60 MHz. The USB PHY takes an input clock that is configurable by the USB PHY clock source bits (PHYCLKSRC) in the USB PHY control register (USB_PHY_CTL) in the System Control Module. When a 24 MHz crystal is used at MXI1/MXO1, set PHYCLKSRC to 0. This will present a 24 MHz clock to the USB PHY. When a 36 MHz crystal is used at MXI1/MXO1, set PHYCLKSRC to 1. This will present a 12 MHz clock (36 MHz divided internally by three) to the USB PHY. The USB PHY is capable of accepting only 24 MHz and 12 MHz; thus you must use either a 24 MHz or 36 MHz crystal at MXI1/MXO1. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Universal Serial Bus (USB) Controller Reference Guide (literature number SPRUFY9) for more information. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) for more information on the System Control Module. Submit Documentation Feedback Detailed Device Description 71 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 3.6 PLL Controller (PLLC) This section describes the PLL Controllers for PLL1 and PLL2. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) for more information on the PLL controllers. 3.6.1 PLL Controller Module The DM335 has two PLL controllers that provide clocks to different components of the chip. PLL controller 1 (PLLC1) provides clocks to most of the components of the chip. PLL controller 2 (PLLC2) provides clocks to the DDR PHY. As a module, the PLL controller provides the following: • Glitch-free transitions (on changing PLL settings) • Domain clocks alignment • Clock gating • PLL bypass • PLL power down The various clock outputs given by the PLL controller are as follows: • Domain clocks: SYSCLKn • Bypass domain clock: SYSCLKBP • Auxiliary clock from reference clock: AUXCLK Various dividers that can be used are as follows: • Pre-PLL divider: PREDIV • Post-PLL divider: POSTDIV • SYSCLK divider: PLLDIV1, …, PLLDIVn • SYSCLKBP divider: BPDIV Multipliers supported are as follows: • PLL multiplier control: PLLM 72 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 3.6.2 SPRS528B – JULY 2008 – REVISED JANUARY 2009 PLLC1 PLLC1 provides most of the DM335 clocks. Software controls PLLC1 operation through the PLLC1 registers. The following list, Table 3-10, and Figure 3-3 describe the customizations of PLLC1 in the DM335. • Provides primary DM335 system clock • Software configurable • Accepts clock input or internal oscillator input • PLL pre-divider value is fixed to (/8) • PLL multiplier value is programmable • PLL post-divider • Only SYSCLK[4:1] are used • SYSCLK1 divider value is fixed to (/2) • SYSCLK2 divider value is fixed to (/4) • SYSCLK3 divider value is programmable • SYSCLK4 divider value is programmable to (/4) or (/2) • SYSCLKBP divider value is fixed to (/3) • SYSCLK1 is routed to the ARM Subsystem • SYSCLK2 is routed to peripherals • SYSCLK3 is routed to the VPBE module • SYSCLK4 is routed to the VPSS module • AUXCLK is routed to peripherals with fixed clock domain and also to the output pin CLKOUT1 • SYSCLKBP is routed to the output pin CLKOUT2 Table 3-10. PLLC1 Output Clocks Output Clock Used By PLLDIV Divider Notes SYSCLK1 ARM Subsystem /2 Fixed divider SYSCLK2 Peripherals /4 Fixed divider SYSCLK3 VPBE (VENC module) /n Programmable divider (used to get 27 MHz for VENC) SYSCLK4 VPSS /4 or /2 Programmable divider AUXCLK Peripherals, CLKOUT1 none No divider SYSCLKBP CLKOUT2 /3 Fixed divider Submit Documentation Feedback Detailed Device Description 73 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com CLKMODE PLLEN CLKIN OSCIN 1 Pre-DIV (/8) PLL Post-DIV (/2 or /1) 1 0 PLLDIV1 (/2) SYSCLK1 (ARM ) PLLDIV2 (/4) SYSCLK2 (Peripherals) PLLDIV3 (/3) SYSCLK3 (VPBE) PLLDIV4 (/4 or /2) SYSCLK4 (VPSS) 0 PLLM (Programmable) AUXCLK (Peripherals, CLKOUT1) BPDIV (/3) SYSCLKBP (CLKOUT2) Figure 3-3. PLLC1 Configuration in DM335 74 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 3.6.3 SPRS528B – JULY 2008 – REVISED JANUARY 2009 PLLC2 PLLC2 provides the DDR PHY clock and CLKOUT3. Software controls PLLC2 operation through the PLLC2 registers. The following list, Table 3-11, and Figure 3-4 describe the customizations of PLLC2 in the DM335. • Provides DDR PHY clock and CLKOUT3 • Software configurable • Accepts clock input or internal oscillator input (same input as PLLC1) • PLL pre-divider value is programmable • PLL multiplier value is programmable • PLL post-divider value is fixed to (/1) • Only SYSCLK[1] is used • SYSCLK1 divider value is fixed to (/1) • SYSCLKBP divider value is fixed to (/8) • SYSCLK1 is routed to the DDR PHY • SYSCLKBP is routed to the output pin CLKOUT3 • AUXCLK is not used. Table 3-11. PLLC2 Output Clocks Output Clock Used by PLLDIV Divider Notes SYSCLK1 DDR PHY /1 Fixed divider SYSCLKBP CLKOUT3 /8 Fixed divider CLKMODE PLLEN CLKIN OSCIN 1 0 Pre-DIV (Programmable) PLL Post-DIV (/1) 1 PLLDIV1 (/1) SYSCLK1 (DDR PHY) BPDIV (/8) SYSCLKBP (CLKOUT3) 0 PLLM (Programmable) Figure 3-4. PLLC2 Configuration in DM335 Submit Documentation Feedback Detailed Device Description 75 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 3.7 Power and Sleep Controller (PSC) In the DM335 system, the Power and Sleep Controller (PSC) is responsible for managing transitions of system power on/off, clock on/off, and reset. A block diagram of the PSC is shown in Figure 3-5. Many of the operations of the PSC are transparent to software, such as power-on-reset operations. However, the PSC provides you with an interface to control several important clock and reset operations. The PSC includes the following features: • Manages chip power-on/off, clock on/off, and resets • Provides a software interface to: – Control module clock ON/OFF – Control module resets • Supports IcePick emulation features: power, clock, and reset For more information on the PSC, see the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7). DMSoC PLLC clks ARM arm_clock PSC arm_mreset arm_power Interrupt AINTC Emulation RESET module_clock MODx module_mreset Always on domain VDD module_power Figure 3-5. DM335 Power and Sleep Controller (PSC) 3.8 System Control Module The DM335’s system control module is a system-level module containing status and top-level control logic required by the device. The system control module consists of a miscellaneous set of status and control registers, accessible by the ARM and supporting all of the following system features and operations: • Device identification • Device configuration – Pin multiplexing control – Device boot configuration status • ARM interrupt and EDMA event multiplexing control • Special peripheral status and control – Timer64+ – USB PHY control – VPSS clock and video DAC control and status – DDR VTP control – Clockout circuitry – GIO de-bounce control 76 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com • SPRS528B – JULY 2008 – REVISED JANUARY 2009 Power management – Deep sleep and fast NAND boot control Bandwidth Management – Bus master DMA priority control For more information on the System Control Module refer to the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7). • 3.9 Pin Multiplexing The DM335 makes extensive use of pin multiplexing to accommodate the large number of peripheral functions in the smallest possible package. In order to accomplish this, pin multiplexing is controlled using a combination of hardware configuration (at device reset) and software control. No attempt is made by the DM335 hardware to ensure that the proper pin muxing has been selected for the peripherals or interface mode being used, thus proper pin muxing configuration is the responsibility of the board and software designers. An overview of the pin multiplexing is shown in Table 3-12. Table 3-12. Peripheral Pin Mux Overview Peripheral Muxed With Primary Function Secondary Function Tertiary Function VPFE (video in) GPIO and SPI2 VPFE (video in) SPI2 GPIO VPBE (video out) GPIO, PWM, and RTO VPBE (video out) PWM and RTO GPIO AEMIF GPIO AEMIF GPIO none ASP0 GPIO ASP0 GPIO none MMC/SD1 GPIO and UART2 MMC/SD1 GPIO UART2 CLKOUT GPIO CLKOUT GPIO none I2C GPIO I2C GPIO none UART1 GPIO UART1 GPIO none SPI1 GPIO SPI1 GPIO none SPI0 GPIO SPI0 GPIO none 3.9.1 Hardware Controlled Pin Multiplexing Use the Asynchronous EMIF configuration pins (AECFG[3:0]) for hardware pin mux control. AECFG[3:0] control the partitioning of the AEMIF addresses and GPIOs at reset, which allows you to properly configure the number of AEMIF address pins required by the boot device while unused addresses pins are available as GPIOs. These settings may be changed by software after reset by programming the PinMux2 register The PinMux2 register is in the System Control Module. As shown in Table 3-13, the number of address bits enabled on the AEMIF is selectable from 0 to 16. Pins that are not assigned to another peripheral and not enabled as address signals become GPIOs (except EM_A[2:1]). The enabled address signals are always contiguous from EM_BA[1] upwards; bits cannot be skipped. The exception to this are EM_A[2:1]. These signals (can be used to) represent the ALE and CLE signals for the NAND Flash mode of the AEMIF and are always enabled. Note that EM_A[0] does not represent the lowest AEMIF address bit. DM335 supports only 16-bit and 8-bit data widths for the AEMIF. In 16-bit mode, EM_BA[1] represents the LS address bit (the half-word address) and EM_BA[0] represents the MS address bit (A[14]). In 8-bit mode, EM_BA[1:0] represent the 2 LS address bits. Note that additional selections are available by programming the PinMux2 register in software after boot. Note that AECFG selection of ‘0010’ selects OneNAND interface. The AEMIF needs to operate in the half-rate mode (full_rate = 0) to meet frequency requirements. Software should not change the PINMUX2 register setting to affect the AEMIF rate operation. A soft reset of the AEMIF should be performed any time a rate change is made. Submit Documentation Feedback Detailed Device Description 77 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 3-13. AECFG (Async EMIF Configuration) Pin Mux Coding 1101(NAND) 1100 1010 1000 (8-bit SRAM) 0010 (16-bit SRAM, OneNAND) 0000 GPIO[54] GPIO[54] EM_A[14] EM_BA[0] EM_A[14] EM_BA[0] GPIO[55] EM_BA[1] EM_BA[1] EM_BA[1] EM_BA[1] EM_BA[1] GPIO[56] EM_A[0] EM_A[0] EM_A[0] EM_A[0] EM_A[0] EM_A[1] EM_A[1] EM_A[1] EM_A[1] EM_A[1] EM_A[1] EM_A[2] EM_A[2] EM_A[2] EM_A[2] EM_A[2] EM_A[2] GPIO[57] EM_A[3] EM_A[3] EM_A[3] EM_A[3] EM_A[3] GPIO[58] EM_A[4] EM_A[4] EM_A[4] EM_A[4] EM_A[4] GPIO[59] EM_A[5] EM_A[5] EM_A[5] EM_A[5] EM_A[5] GPIO[60] EM_A[6] EM_A[6] EM_A[6] EM_A[6] EM_A[6] GPIO[61] EM_A[7] EM_A[7] EM_A[7] EM_A[7] EM_A[7] GPIO[62] EM_A[8] EM_A[8] EM_A[8] EM_A[8] EM_A[8] GPIO[63] EM_A[9] EM_A[9] EM_A[9] EM_A[9] EM_A[9] GPIO[64] EM_A[10] EM_A[10] EM_A[10] EM_A[10] EM_A[10] GPIO[65] EM_A[11] EM_A[11] EM_A[11] EM_A[11] EM_A[11] GPIO[66] EM_A[12] EM_A[12] EM_A[12] EM_A[12] EM_A[12] GPIO[67] EM_A[13] EM_A[13] EM_A[13] EM_A[13] EM_A[13] GPIO[46] GPIO[46] GPIO[46] GPIO[46] EM_D[8] EM_D[8] GPIO[47] GPIO[47] GPIO[47] GPIO[47] EM_D[9] EM_D[9] GPIO[48] GPIO[48] GPIO[48] GPIO[48] EM_D[10] EM_D[10] GPIO[49] GPIO[49] GPIO[49] GPIO[49] EM_D[11] EM_D[11] GPIO[50] GPIO[50] GPIO[50] GPIO[50] EM_D[12] EM_D[12] GPIO[51] GPIO[51] GPIO[51] GPIO[51] EM_D[13] EM_D[13] GPIO[52] GPIO[52] GPIO[52] GPIO[52] EM_D[14] EM_D[14] GPIO[53] GPIO[53] GPIO[53] GPIO[53] EM_D[15] EM_D[15] 3.9.2 Software Controlled Pin Multiplexing All pin multiplexing options are configurable by software via pin mux registers that reside in the System Control Module. The PinMux0 Register controls the Video In muxing, PinMux1 register controls Video Out signals, PinMux2 register controls AEMIF signals, PinMux3 registers control the multiplexing of the GIO signals, the PinMux4 register controls the SPI and MMC/SD0 signals. Refer to the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) for complete descriptions of the pin mux registers. 3.10 Device Reset There are five types of reset in DM335. The types of reset differ by how they are initiated and/or by their effect on the chip. Each type is briefly described in Table 3-14. They are further described in the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7). Table 3-14. Reset Types Type Initiator Effect POR (Power-On-Reset) RESET pin low and TRST low Total reset of the chip (cold reset). Resets all modules including memory and emulation. Warm Reset RESET pin low and TRST high (initiated by ARM emulator). Resets all modules including memory, except ARM emulation. Max Reset ARM emulator or Watchdog Timer (WDT). Same effect as warm reset. 78 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 3-14. Reset Types (continued) Type Initiator Effect System Reset ARM emulator Resets all modules except memory and ARM emulation. It is a soft reset that maintains memory contents and does not affect or reset clocks or power states. Module Reset ARM software Resets a specific module. Allows the ARM to independently reset any module. Module reset is intended as a debug tool not as a tool to use in production. 3.11 Default Device Configurations After POR, warm reset, and max reset, the chip is in its default configuration. This section highlights the default configurations associated with PLLs, clocks, ARM boot mode, and AEMIF. NOTE Default configuration is the configuration immediately after POR, warm reset, and max reset and just before the boot process begins. The boot ROM updates the configuration. See Section 3.12 for more information on the boot process. 3.11.1 Device Configuration Pins The device configuration pins are described in Table 3-15. The device configuration pins are latched at reset and allow you to configure all of the following options at reset: • ARM Boot Mode • Asynchronous EMIF pin configuration These pins are described further in the following sections. NOTE The device configuration pins are multiplexed with AEMIF pins. After the device configuration pins are sampled at reset, they automatically change to function as AEMIF pins. Pin multiplexing is described in Section 3.8. Table 3-15. Device Configuration Device Configuration Input Function Sampled Pin Default Setting (by internal pull-up/ pull-down) Device Configuration Affected BTSEL[1:0] Selects ARM boot mode 00 = Boot from ROM (NAND) 01 = Boot from AEMIF 10 = Boot from ROM (MMC/SD) 11 = Boot from ROM (UART) EM_A[13:12] 00 (NAND) If any ROM boot mode is selected, GIO61 is used to indicated boot status. If NAND boot is selected, CE0 is used for NAND. Use AECFG[3:0] to configure AEMIF pins for NAND. If AEMIF boot is selected, CE0 is used for AEMIF device (OneNAND, ROM). Use AECFG[3:0] to configure AEMIF pins for NAND. If MMC/SD boot is selected, MMC/SD0 is used. AECFG[3:0] Selects AEMIF pin configuration EM_A[11:8] 1101 (NAND) Selects the AEMIF pin configuration. Refer to pin-muxing information in Section 3.9.1. Note that AECFG[3:0] affects both AEMIF (BTSEL[1:0]=01) and NAND (BTSEL[1:0]=00) boot modes. Submit Documentation Feedback Detailed Device Description 79 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 3.11.2 PLL Configuration After POR, warm reset, and max reset, the PLLs and clocks are set to their default configurations. The PLLs are in bypass mode and disabled by default. This means that the input reference clock at MXI1 (typically 24 MHz) drives the chip after reset. For more information on device clocking, see Section 3.5 and Section 3.6. The default state of the PLLs is reflected in the default state of the register bits in the PLLC registers. Refer to the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) for PLLC register descriptions. 3.11.3 Power Domain and Module State Configuration Only a subset of modules are enabled after reset by default. Table 3-16 shows which modules are enabled after reset. Table 3-16 as shows that the following modules are enabled depending on the sampled state of the device configuration pins: EDMA (CC and TC0), AEMIF, MMC/SD0, UART0, and Timer0. For example, UART0 is enabled after reset when the device configuration pins (BTSEL[1:0] = 11 Enable UART) select UART boot mode. For more information on module configuration refer to . 80 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 3-16. Module Configuration Default States Module Number Module Name Power Domain Power Domain State Module State 0 VPSS Master AlwaysOn ON SyncRst 1 VPSS Slave AlwaysOn ON 2 EDMA (CC) AlwaysOn ON 3 EDMA (TC0) AlwaysOn ON 4 EDMA (TC1) AlwaysOn ON 5 Timer3 AlwaysOn ON SyncRst 6 SPI1 AlwaysOn ON SyncRst 7 MMC/SD1 AlwaysOn ON SyncRst 8 ASP1 AlwaysOn ON SyncRst 9 USB AlwaysOn ON SyncRst 10 PWM3 AlwaysOn ON SyncRst 11 SPI2 AlwaysOn ON SyncRst 12 RTO AlwaysOn ON SyncRst 13 DDR EMIF AlwaysOn ON 14 AEMIF AlwaysOn ON SyncRst BTSEL[1:0] = 00 – Enable (NAND) BTSEL[1:0] = 01 – Enable (OneNAND) BTSEL[1:0] = 10 – SyncRst (MMC/SD) BTSEL[1:0] = 11 – Enable (UART) SyncRst BTSEL[1:0] = 00 – Enable (NAND) BTSEL[1:0] = 01 – Enable (OneNAND) BTSEL[1:0] = 10 – SyncRst (MMC/SD) BTSEL[1:0] = 11 – Enable (UART) 15 MMC/SD0 AlwaysOn ON BTSEL[1:0] = 00 – SyncRst (NAND) BTSEL[1:0] = 01 – SyncRst (OneNAND) BTSEL[1:0] = 10 – Enable (MMC/SD) BTSEL[1:0] = 11 – SyncRst (UART) 16 Reserved Reserved Reserved Reserved 17 ASP AlwaysOn ON SyncRst 18 I2C AlwaysOn ON SyncRst 19 UART0 AlwaysOn ON BTSEL[1:0] = 00 – SyncRst (NAND) BTSEL[1:0] = 01 – SyncRst (OneNAND) BTSEL[1:0] = 10 – SyncRst (MMC/SD) BTSEL[1:0] = 11 – Enable (UART) 20 UART1 AlwaysOn ON SyncRst 21 UART2 AlwaysOn ON SyncRst 22 SPI0 AlwaysOn ON SyncRst 23 PWM0 AlwaysOn ON SyncRst 24 PWM1 AlwaysOn ON SyncRst 25 PWM2 AlwaysOn ON SyncRst 26 GPIO AlwaysOn ON 27 TIMER0 AlwaysOn ON SyncRst BTSEL[1:0] = 00 – Enable (NAND) BTSEL[1:0] = 01 – Enable (OneNAND) BTSEL[1:0] = 10 – Enable (MMC/SD) BTSEL[1:0] = 11 – Enable (UART) 28 TIMER1 AlwaysOn ON SyncRst 29 TIMER2 AlwaysOn ON Enable 30 System Module AlwaysOn ON Enable 31 ARM AlwaysOn ON Enable Submit Documentation Feedback Detailed Device Description 81 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 3-16. Module Configuration (continued) Default States 32 BUS AlwaysOn ON Enable 33 BUS AlwaysOn ON Enable 34 BUS AlwaysOn ON Enable 35 BUS AlwaysOn ON Enable 36 BUS AlwaysOn ON Enable 37 BUS AlwaysOn ON Enable 38 BUS AlwaysOn ON Enable 39 Reserved Reserved Reserved Reserved 40 VPSS DAC Always On ON SyncRst 3.11.4 ARM Boot Mode Configuration The input pins BTSEL[1:0] determine whether the ARM will boot from its ROM or from the Asynchronous EMIF (AEMIF). When ROM boot is selected (BTSEL[1:0] = 00, 10, or 11), a jump to the start of internal ROM (address 0x0000: 8000) is forced into the first fetched instruction word. The embedded ROM boot loader code (RBL) then performs certain configuration steps, reads the BOOTCFG register to determine the desired boot method, and branches to the appropriate boot routine (i.e., a NAND, MMC/SD, or UART loader routine). If AEMIF boot is selected (BTSEL[1:0] = 01), a jump to the start of AEMIF (address 0x0200: 0000) is forced into the first fetched instruction word. The ARM then continues executing from external asynchronous memory using the default AEMIF timings until modified by software. NOTE For AEMIF boot, the OneNAND must be connected to the first AEMIF chip select space (EM_CE0). Also, the AEMIF does not support direct execution from NAND Flash. Boot modes are further described in Section 3.12. 3.11.5 AEMIF Configuration 3.11.5.1 AEMIF Pin Configuration The input pins AECFG[3:0] determine the AEMIF configuration immediately after reset. Use AECFG[3:0] to properly configure the pins of the AEMIF. Refer to the section on pin multiplexing in Section 3.9. Also, see the TMS320DM335 Digital Media System-on-Chip (DMSoC) Asynchronous External Memory Interface (EMIF) Reference Guide (SPRUFZ1) for more information on the AEMIF. 3.11.5.2 AEMIF Timing Configuration When AEMIF is enabled, the wait state registers are reset to the slowest possible configuration, which is 88 cycles per access (16 cycles of setup, 64 cycles of strobe, and 8 cycles of hold). Thus, with a 24 MHz clock at MXI1, the AEMIF is configured to run at 6 MHz/88 which equals approximately 68 kHz by default. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Asynchronous External Memory Interface (EMIF) Reference Guide (SPRUFZ1) for more information on the AEMIF. 3.12 Device Boot Modes The DM335 ARM can boot from either Async EMIF (AEMIF/OneNand) or from ARM ROM, as determined by the setting of the device configuration pins BTSEL[1:0]. The BTSEL[1:0] pins can define the ROM boot mode further as well. The boot selection pins (BTSEL[1:0]) determine the ARM boot process. After reset (POR, warm reset, or max reset), ARM program execution begins in ARM ROM at 0x0000: 8000, except when BTSEL[1:0] = 01, indicating AEMIF (AEMIF/OneNand) boot. See Section 3.11.1 for information on the boot selection pins. 82 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 3.12.1 Boot Modes Overview DM335’s ARM ROM boot loader (RBL) executes when the BTSEL[1:0] pins indicate a condition other than the normal ARM EMIF boot. • If BTSEL[1:0] = 01 - Asynchronous EMIF (AEMIF) boot. This mode is handled by hardware control and does not involve the ROM. In the case of OneNAND, the user is responsible for putting any necessary boot code in the OneNAND's boot page. This code shall configure the AEMIF module for the OneNAND device. After the AEMIF module is configured, booting will continue immediately after the OneNAND’s boot page with the AEMIF module managing pages thereafter. • The RBL supports 3 distinct boot modes: – BTSEL[1:0] = 00 - ARM NAND Boot – BTSEL[1:0] = 10 - ARM MMC/SD Boot – BTSEL[1:0] = 11 - ARM UART Boot • If NAND boot fails, then MMC/SD mode is tried. • If MMC/SD boot fails, then MMC/SD boot is tried again. • If UART boot fails, then UART boot is tried again. • RBL uses GIO61 to indicate boot status (can use to blink LED): – After reset, GIO61 is initially driven low (e.g LED off) – If NAND boot fails,then GIO61 shall toggle at 4Hz while MMC/SD boot is tried. – If MMC/SD boot fails, then GIO61 shall toggle at 4Hz while MMC/SD boot is retried. – If UART boot fails, then GIO61 shall toggle at 2Hz while UART boot is retried. – When boot is successful, just before program control is given to UBL, GIO61 is driven high (e.g. LED on). – DM335 Timer0 shall be used to accurately toggle GIO61 at 4Hz and 2Hz. • ARM ROM Boot - NAND Mode – No support for a full firmware boot. Instead, copies a second stage user boot loader (UBL) from NAND flash to ARM internal RAM (AIM) and transfers control to the user-defined UBL – Support for NAND with page sizes up to 8192 bytes – Support for magic number error detection and retry (up to 24 times) when loading UBL – Support for up to 30KB UBL (32KB IRAM - ~2KB for RBL stack) – Optional, user-selectable, support for use of DMA and I-cache during RBL execution (i.e.,while loading UBL) – Supports booting from 8-bit NAND devices (16-bit NAND devices are not supported) – Supports 4-bit ECC (1-bit ECC is not supported) – Supports NAND flash that requires chip select to stay low during the tR read time • ARM ROM Boot - MMC/SD Mode – No support for a full firmware boot. Instead, copies a second stage User Boot Loader (UBL) from MMC/SD to ARM Internal RAM (AIM) and transfers control to the user software. – Support for MMC/SD Native protocol (MMC/SD SPI protocol is not supported) – Support for descriptor error detection and retry (up to 24 times) when loading UBL – Support for up to 30KB UBL (32KB - ~2KB for RBL stack) • ARM ROM Boot - UART mode – No support for a full firmware boot. Instead, loads a second stage user boot loader (UBL) via UART to ARM internal RAM (AIM) and transfers control to the user software. – Support for up to 30KB UBL (32KB - ~2KB for RBL stack) The general boot sequence is shown in Figure 3-6. For more information, refer to the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7). Submit Documentation Feedback Detailed Device Description 83 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Reset Boot mode ? Internal ROM Boot mode ? Boot from UART Boot from NAND flash Boot OK ? Yes No No Boot OK ? Boot from MMC/SD Yes No Boot OK ? Yes Invoke OneNAND Invoke loaded Program Figure 3-6. Boot Mode Functional Block Diagram 3.13 Power Management The DM335 is designed for minimal power consumption. There are two components to power consumption: active power and leakage power. Active power is the power consumed to perform work and scales with clock frequency and the amount of computations being performed. Active power can be reduced by controlling the clocks in such a way as to either operate at a clock setting just high enough to complete the required operation in the required timeline or to run at a clock setting until the work is complete and then drastically cut the clocks (e.g. to PLL Bypass mode) until additional work must be performed. Leakage power is due to static current leakage and occurs regardless of the clock rate. Leakage, or standby power, is unavoidable while power is applied and scales roughly with the operating junction temperatures. Leakage power can only be avoided by removing power completely from a device or subsystem. The DM335 includes several power management features which are briefly described in Table 3-17. Refer to the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) for more information on power management. Table 3-17. Power Management Features Power Management Features Description Clock Management Module clock disable 84 Detailed Device Description Module clocks can be disabled to reduce switching power Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 3-17. Power Management Features (continued) Power Management Features Description Module clock frequency scaling Module clock frequency can be scaled to reduce switching power PLL power-down The PLLs can be powered-down when not in use to reduce switching power ARM Sleep Mode ARM Wait-for-Interrupt sleep mode Disable ARM clock to reduce active power System Sleep Modes Deep Sleep mode Stop all device clocks and power down internal oscillators to reduce active power to a minimum. Registers and memory are preserved. I/O Management USB Phy power-down The USB Phy can be powered-down to reduce USB I/O power DAC power-down The DAC's can be powered-down to reduce DAC power DDR self-refresh and power down The DDR / mDDR device can be put into self-refresh and power down states Submit Documentation Feedback Detailed Device Description 85 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 3.14 64-Bit Crossbar Architecture The DM335 uses a 64-bit crossbar architecture to control access between device processors, subsystems and peripherals. It includes an EDMA Controller consisting of a DMA Transfer Controller (TC) and a DMA Channel Controller (CC). The TC provides two DMA channels for transfer between slave peripherals. The CC provides a user and event interface to the EDMA system. It includes up to 64 event channels to which all system synchronization events can be mapped and 8 auto submit “quick” channels (QDMA). In most ways, these channels are identical. A channel refers to a specific ‘event’ that can cause a transfer to be submitted to the TC as a Transfer Request. 3.14.1 Crossbar Connections There are five transfer masters (TCs have separate read and write connections) connected to the crossbar; ARM, the Video Processing Sub-system (VPSS), the master peripherals (USB), and two EDMA transfer controllers. These can be connected to four separate slave ports; ARM, the DDR EMIF, and CFG bus peripherals. Not all masters may connect to all slaves. Connection paths are indicated by √ at intersection points shown in Table 3-18 Table 3-18. Crossbar Connection Matrix Slave Module DMA Master ARM Internal Memory Config Bus Registers and Memory DDR EMIF Memory √ √ √ DMA Master Peripherals (USB) √ √ √ EDMA3TC0 √ √ √ EDMA3TC1 √ √ √ ARM √ VPSS 3.14.2 EDMA Controller The EDMA controller handles all data transfers between memories and the device slave peripherals on the DM335 device. These are summarized as follows: • Transfer to/from on-chip memories – ARM program/data RAM • Transfer to/from external storage – DDR2 / mDDR SDRAM – Asynchronous EMIF – OneNAND flash – NAND flash – Smart Media, SD, MMC, xD media storage • Transfer to/from peripherals – ASP – SPI – I2C – PWM – RTO – GPIO – Timer/WDT – UART – MMC/SD 86 Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 The EDMA Controller consists of two major blocks: the Transfer Controller (TC) and the Channel Controller (CC). The CC is a highly flexible Channel Controller that serves as the user interface and event interface for the EDMA system. The CC supports 64-event channels and 8 QDMA channels. The CC consists of a scalable Parameter RAM (PaRAM) that supports flexible ping-pong, circular buffering, channel-chaining, auto-reloading, and memory protection. The EDMA Channel Controller has the following features: • Fully orthogonal transfer description – Three transfer dimensions – A-synchronized transfers: one dimension serviced per event – AB- synchronized transfers: two dimensions serviced per event – Independent indexes on source and destination – Chaining feature allows 3-D transfer based on single event • Flexible transfer definition – Increment and constant addressing modes – Linking mechanism allows automatic PaRAM set update – Chaining allows multiple transfers to execute with one event • Interrupt generation for: – DMA completion – Error conditions • Debug visibility – Queue watermarking/threshold – Error and status recording to facilitate debug • 64 DMA channels – Event synchronization – Manual synchronization (CPU(s) write to event set register) – Chain synchronization (completion of one transfer chains to next) • 8 QDMA channels – QDMA channels are triggered automatically upon writing to a PaRAM set entry – Support for programmable QDMA channel to PaRAM mapping • 128 PaRAM sets – Each PaRAM set can be used for a DMA channel, QDMA channel, or link set (remaining) • Two transfer controllers/event queues. The system-level priority of these queues is user programmable • 16 event entries per event queue • External events (for example, ASP TX Evt and RX Evt) The EDMA Transfer Controller has the following features: • • • • • • • Two transfer controllers 64-bit wide read and write ports per channel Up to four in-flight transfer requests (TR) Programmable priority level Supports two dimensional transfers with independent indexes on source and destination (EDMA3CC manages the 3rd dimension) Support for increment and constant addressing modes Interrupt and error support Parameter RAM: Each EDMA is specified by an eight word (32-byte) parameter table contained in Parameter RAM (PaRAM) within the CC. DM335 provides 128 PaRAM entries, one for each of the 64 DMA channels and for 64 QDMA / Linked DMA entries. Submit Documentation Feedback Detailed Device Description 87 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com DMA Channels: Can be triggered by: " External events (for example, ASP TX Evt and RX Evt), " Software writing a '1' to the given bit location, or channel, of the Event Set register, or, " Chaining to other DMAs. QDMA: The Quick DMA (QDMA) function is contained within the CC. DM335 implements 8 QDMA channels. Each QDMA channel has a selectable PaRAM entry used to specify the transfer. A QDMA transfer is submitted immediately upon writing of the "trigger" parameter (as opposed to the occurrence of an event as with EDMA). The QDMA parameter RAM may be written by any Config bus master through the Config Bus and by DMAs through the Config Bus bridge. QDMA Channels: Triggered by a configuration bus write to a designated 'QDMA trigger word'. QDMAs allow a minimum number of linear writes (optimized for GEM IDMA feature) to be issued to the CC to force a series of transfers to take place. 3.14.2.1 EDMA Channel Synchronization Events The EDMA supports up to 64 EDMA channels which service peripheral devices and external memory. Table 3-19 lists the source of EDMA synchronization events associated with each of the programmable EDMA channels. For the DM335 device, the association of an event to a channel is fixed; each of the EDMA channels has one specific event associated with it. These specific events are captured in the EDMA event registers (ER, ERH) even if the events are disabled by the EDMA event enable registers (EER, EERH). For more detailed information on the EDMA module and how EDMA events are enabled, captured, processed, linked, chained, and cleared, etc., see the TMS320DM335 Digital Media System-on-Chip (DMSoC) Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature number SPRUFZ20). Table 3-19. DM335 EDMA Channel Synchronization Events (1) (2) (1) (2) 88 EDMA CHANNEL EVENT NAME EVENT DESCRIPTION 0 TIMER3: TINT6 Timer 3 Interrupt (TINT6) Event 1 TIMER3 TINT7 Timer 3 Interrupt (TINT7) Event 2 ASP0: XEVT ASP0 Transmit Event 3 ASP0: REVT ASP0 Receive Event 4 VPSS: EVT1 VPSS Event 1 5 VPSS: EVT2 VPSS Event 2 6 VPSS: EVT3 VPSS Event 3 7 VPSS: EVT4 VPSS Event 4 8 ASP1: XEVT or TIMER2: TINT4 ASP1 Transmit Event or Timer 2 interrupt (TINT4) Event 9 ASP1: REVT or TIMER2: TINT5 ASP1 Receive Event or Timer 2 interrupt (TINT5) Event 10 SPI2: SPI2XEVT SPI2 Transmit Event 11 SPI2: SPI2REVT SPI2 Receive Event 12 Reserved 13 Reserved 14 SPI1: SPI1XEVT 15 SPI1: SPI1REVT SPI1 Transmit Event SPI1 Receive Event 16 SPI0: SPI0XEVT SP0I Transmit Event 17 SPI0: SPI0REVT SPI0 Receive Event 18 UART0: URXEVT0 UART 0 Receive Event In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or intermediate transfer completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320DM335 Digital Media System-on-Chip (DMSoC) Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature number SPRUFZ20). The total number of EDMA events in DM335 exceeds 64, which is the maximum value of the EDMA module. Therefore, several events are multiplexed and you must use the register EDMA_EVTMUX in the System Control Module to select the event source for multiplexed events. Refer to the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) for more information on the System Control Module register EDMA_EVTMUX. Detailed Device Description Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 3-19. DM335 EDMA Channel Synchronization Events (continued) EDMA CHANNEL EVENT NAME EVENT DESCRIPTION 19 UART0: UTXEVT0 UART 0 Transmit Event 20 UART1: URXEVT1 UART 1 Receive Event 21 UART1: UTXEVT1 UART 1 Transmit Event 22 UART2: URXEVT2 UART 2 Receive Event 23 UART2: UTXEVT2 UART 2 Transmit Event 24 Reserved 25 GPIO: GPINT9 GPIO 9 Interrupt Event 26 MMC0RXEVT MMC/SD0 Receive Event 27 MMC0TXEVT MMC/SD0 Transmit Event 28 I2CREVT I2C Receive Event 29 I2CXEVT I2C Transmit Event 30 MMC1RXEVT MMC/SD1 Receive Event 31 MMC1TXEVT MMC/SD1 Transmit Event 32 GPINT0 GPIO 0 Interrupt Event 33 GPINT1 GPIO 1 Interrupt Event 34 GPINT2 GPIO 2 Interrupt Event 35 GPINT3 GPIO 3 Interrupt Event 36 GPINT4 GPIO 4 Interrupt Event 37 GPINT5 GPIO 5 Interrupt Event 38 GPINT6 GPIO 6 Interrupt Event 39 GPINT7 GPIO 7 Interrupt Event 40 GPBNKINT0 GPIO Bank 0 Interrupt Event 41 GPBNKINT1 GPIO Bank 1 Interrupt Event 42 GPBNKINT2 GPIO Bank 2 Interrupt Event 43 GPBNKINT3 GPIO Bank 3 Interrupt Event 44 GPBNKINT4 GPIO Bank 4 Interrupt Event 45 GPBNKINT5 GPIO Bank 5 Interrupt Event 46 GPBNKINT6 GPIO Bank 6 Interrupt Event 47 GPINT8 GPIO 8 Interrupt Event 48 TIMER0: TINT0 Timer 0 Interrupt Event 49 TIMER0: TINT1 Timer 1 Interrupt Event 50 TIMER1: TINT2 Timer 2 Interrupt Event 51 TIMER1: TINT3 Timer 3 Interrupt Event 52 PWM0 PWM 0 Event 53 PWM1 PWM 1 Event 54 PWM2 PWM 2 Event 55 PWM3 PWM 3 Event 56 - 63 Reserved Submit Documentation Feedback Detailed Device Description 89 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 4 Device Operating Conditions 4.1 Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise Noted) (1) (2) All 1.3 V supplies Supply voltage ranges Input voltage ranges -0.5 V to 1.7 V All digital 1.8 V supplies -0.5 V to 2.5 V All analog 1.8 V supplies -0.5 V to 1.89 V All 3.3 V supplies -0.5 V to 4.4 V All 1.8 V I/Os -0.5 V to 2.3 V All 3.3 V I/Os -0.5 V to 3.8 V VBUS Clamp current for input or output (3) Operating case temperature ranges Storage temperature ranges (1) (2) (3) 90 0.0 V to 5.5 V Iclamp -20 mA to 20 mA 0°C to 85 °C Commercial Tc Extended Temperature [A135/A216 devices] Tc Tstg -40C to 100°C -65°C to 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS. Clamp current flows from an input or output pad to a supply rail through a clamp circuit or an intrinsic diode. Positive current results from an applied input or output voltage that is more than 0.5 V higher (more positive) than the supply voltage, VDD/VDDA_PLL1/2/VDD_USB/VDD_DDR for dual-supply macros. Negative current results from an applied voltage that is more than 0.5 V less (more negative) than the VSS voltage.. Device Operating Conditions Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 4.2 Recommended Operating Conditions Supply Voltage Supply Ground Voltage Input High Voltage Input Low DAC (3) Video Buffer (3) USB Temperature (1) (2) (3) (4) MIN NOM MAX UNIT CVDD Supply voltage, Core 1.235 1.3 1.365 V VDDA_PLL1 Supply voltage, PLL1 1.235 1.3 1.365 V VDDA_PLL2 Supply voltage, PLL2 1.235 1.3 1.365 V VDDD13_USB Supply voltage, USB Digital 1.235 1.3 1.365 V VDDA13_USB Supply voltage, USB Analog 1.235 1.3 1.365 V VDDA33_USB Supply voltage, USB Analog 3.135 3.3 3.465 V VDDA33_USB_PLL Supply voltage, USB Common PLL 3.135 3.3 3.465 V VDD_DDR Supply voltage, DDR2 / MDDR 1.71 1.8 1.89 V VDDA33_DDRDLL Supply voltage, DDR DLL Analog 3.135 3.3 3.465 V VDD_VIN Supply voltage, Digital video In 3.135 3.3 3.465 V VDD_VOUT Supply voltage, Digital Video Out 3.135 3.3 3.465 V VDDA18_DAC Supply voltage, DAC Analog 1.71 1.8 1.89 V VDD Supply voltage, I/Os 3.135 3.3 3.465 V VSS Supply ground, Core, USB Digital 0 0 0 V VSSA_PLL1 Supply ground, PLL1 0 0 0 V VSSA_PLL2 Supply ground, PLL2 0 0 0 V VSS_USB Supply ground, USB 0 0 0 V VSSA_DLL Supply ground, DLL 0 0 0 V VSSA_DAC Supply ground, DAC Analog 0 0 0 V VSS_MX1 MXI1 osc ground (1) 0 0 0 V VSS_MX2 MXI2 osc ground (1) 0 0 0 V VIH High-level input voltage (2) 2 VIL Low-level input voltage (2) VREF DAC reference voltage RBIAS DAC full-scale current adjust resistor RLOAD Output resistor 499 Ω CBG Bypass capacitor 0.1 µF ROUT Output resistor (ROUT), between TVOUT and VFB pins 1070 RFB Feedback resistor, between VFB and IOUT pins. 1000 RBIAS DAC full-scale current adjust resistor 2550 Ω CBG Bypass capacitor 0.1 µA USB_VBUS USB external charge pump input R1 USB reference resistor (4) Tc Operating case temperature range V 0.8 V 450 mV 2550 Ω Ω 4.85 5 5.25 V 9.9 10 10.1 kΩ Commercial 0 85 °C Extended [A135/A216 devices] -40 100 °C Oscillator ground must be kept separate from other grounds and connected directly to the crystal load capacitor ground (see Section 5.5.1). These I/O specifications apply to regular 3.3 V I/Os and do not apply to DDR2/mDDR, USB I/Os. DDR2/mDDR I/Os are 1.8 V I/Os and adhere to JESD79-2A standard, USB I/Os adhere to USB2.0 spec. See Section 5.9.2.4. Also, resistors should be E-96 spec line (3 digits with 1% accuracy). Connect USB_R1 to VSS_USB_REF via 10K ohm, 1% resistor placed as close to the device as possible. Submit Documentation Feedback Device Operating Conditions 91 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 4.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted) PARAMETER Voltage Output Current Input/Output Capacitance TEST CONDITIONS MAX VDD=MIN, IOH=MAX VOL Low-level output voltage (2) VDD=MIN, IOL=MAX II Input current for I/O without internal pull-up/pull-down VI = VSS to VDD -1 1 II(pullup) Input current for I/O with internal pull-up (3) (4) VI = VSS to VDD 40 190 II(pulldown) Input current for I/O with internal pull-down (3) (4) VI = VSS to VDD -190 -40 IOH High-level output current -100 IOL Low-level output current 4000 IOZ I/O off-state output current CI Input capacitance 4 CO Output capacitance 4 Resolution Resolution INL Integral non-linearity, best fit DNL Differential non-linearity RLOAD = 499 Ω, Video buffer disabled VOH(VIDBUF) Output high voltage (top of 75% NTSC or PAL colorbar) (5) VOL(VIDBUF) Output low voltage (bottom of sync tip) 2.4 0.6 VO = VDD or VSS; internal pull disabled RLOAD = 499 Ω, Video buffer disabled Video Buffer 92 TYP High-level output voltage Compliance Output compliance range (3) (4) (5) MIN VOH DAC (1) (2) (1) (2) IFS = 1.4 mA, RLOAD = 499 Ω UNIT V µA ±10 pF 10 Bits 1 LSB 0.5 LSB 0 0.700 V 1.55 V 0.470 For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table. These I/O specifications apply to regular 3.3 V I/Os and do not apply to DDR2/mDDR, USB I/Os. DDR2/mDDR I/Os are 1.8 V I/Os and adhere to JESD79-2A standard, USB I/Os adhere to USB2.0 spec. This specification applies only to pins with an internal pullup (PU) or pulldown (PD). See Section 2.4 or Section 2.5 for pin descriptions. To pull up a signal to the opposite supply rail, a 1 kΩ resistor is recommended. 100% color bars are not supported. 100% color bars require 1.2 V peak-to-peak. The video buffer only provides 1.0 V peak-to-peak. Device Operating Conditions Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 5 DM335 Peripheral Information and Electrical Specifications 5.1 Parameter Information Device-Specific Information Tester Pin Electronics 42 Ω Output Under Test 3.5 nH Transmission Line Z0 = 50 Ω (see note) 4.0 pF A. Data Sheet Timing Reference Point Device Pin (see note) 1.85 pF The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from the data sheet timings. Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin. Figure 5-1. Test Load Circuit for AC Timing Measurements The load capacitance value stated is only for characterization and measurement of AC timing signals. This load capacitance value does not indicate the maximum load the device is capable of driving. 5.1.1 Signal Transition Levels All input and output timing parameters are referenced to Vref for both "0" and "1" logic levels. For 3.3 V I/O, Vref = 1.65 V. For 1.8 V I/O, Vref = 0.9 V. Vref Figure 5-2. Input and Output Voltage Reference Levels for AC Timing Measurements All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOLMAX and VOH MIN for output clocks. Vref = VIH MIN (or VOH MIN) Vref = VIL MAX (or VOL MAX) Figure 5-3. Rise and Fall Transition Time Voltage Reference Levels 5.1.2 Timing Parameters and Board Routing Analysis The timing parameter values specified in this data sheet do not include delays by board routings. As a good board design practice, such delays must always be taken into account. Timing values may be Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 93 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing Analysis application report (literature number SPRA839). If needed, external logic hardware such as buffers may be used to compensate any timing differences. 94 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.2 Recommended Clock and Control Signal Transition Behavior All clocks and control signals should transition between VIH and VIL (or between VIL and VIH) in a monotonic manner. 5.3 Power Supplies The power supplies of DM335 are summarized in Table 5-1. Table 5-1. Power Supplies Customer Tolerance Package Board Plane Supply 1.3 V 3.3 V ±5% ±5% 1.3 V 3.3 V Chip Plane Name Description Comments CVDD Core VDD VDDA_PLL1 PLL1 VDDA VDDA_PLL2 PLL2 VDDA VDDD13_USB USB 1.3 V supply VDDA13_USB USB 1.3 V supply VDD IO VDD for LVCMOS VDDSHV VDD IO VDD for MXI/O1 VDDSHV VDD IO VDD for MXI/O2 VDDSHV1 VDD IO VDD for ISB DRVVBUS VDDSHV2 VDDA33_DDRDLL DDR DLL analog VDD VDDA33_USB Analog 3.3 V power USB PHY VDDA33_USB_PLL Common mode 3.3 V power for USB PHY (PLL) VDD IO VDD for peripherals VDD_VIN IO VDD for VideoIN I/F VDD_VOUT IO VDD for VideoOUT I/F 3.3 V ±5% 3.3 V 1.8 V ±5% 1.8 V VDD_DDR 1.8 V ±5% 1.8 V VDDA18 Analog 1.8 V power 1.8 V ±5% 1.8 V VDDA18_DAC Place decoupling caps (0.1µF/10µf) close to chip 0V n/a 0V VSS_MX1 Connect to external crystal capacitor ground 0V n/a 0V VSS_MX2 Connect to external crystal capacitor ground 0V n/a 0V VSS Chip ground USB ESD ground ground VSS 0V n/a 0V VSSA ground Keep separate from digital ground VSS 0V n/a 0V VSSA_PLL1 PLL1 VSSA 0V n/a 0V VSSA_PLL2 PLL2 VSSA 0V n/a 0V VSSA_DLL DLL ground 0V n/a 0V VSS_USB USB ground VSSA13_USB VSSA13_USB VSSA33_USB VSSA33_USB_PLL 0V n/a 0V VSS_USB_REF USB PHY reference ground VSSREF 0V n/a 0V VSSA_DAC DAC ground Keep separate from digital ground VSS DRR ref voltage VDDS divided by 2, through board resistors VBUS Connect to external charge pump VDDS*0.5 5V VDDS*0.5 VREFSSTL 5V Submit Documentation Feedback USB_VBUS DM335 Peripheral Information and Electrical Specifications 95 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.3.1 www.ti.com Power-Supply Sequencing In order to ensure device reliability, the DM335 requires the following power supply power-on and power-off sequences. See table Table 5-1 for a description of DM335 power supplies. Power-On: 1. Power on 1.3 V: CVDD, VDDA_PLL1/2, VDDD13_USB, VDDA13_USB 2. Power on 1.8 V: VDD_DDR, VDDA18_DAC 3. Power on 3.3 V: DVDD, VDDA33_DDRDLL, VDDA33_USB, VDDA33_USB_PLL, VDD_VIN, VDD_VOUT You may power-on the 1.8 V and 3.3 V power supplies simultaneously. Power-Off: 1. Power off 3.3 V: DVDD, VDDA33_DDRDLL, VDDA33_USB, VDDA33_USB_PLL, VDD_VIN, VDD_VOUT 2. Power off 1.8 V: VDD_DDR, VDDA18_DAC 3. Power off 1.3 V: CVDD, VDDA_PLL1/2, VDDD13_USB, VDDA13_USB You may power-off the 1.8 V and 3.3 V power supplies simultaneously. Power-off the 1.8v/3.3V supply before or within 10usec of power-off of the 1.3 V supply. Note that when booting the DM335 from OneNAND, you must ensure that the OneNAND device is ready with valid program instructions before the DM335 attempts to read program instructions from it. In particular, before you release DM335 reset, you must allow time for OneNAND device power to stabilize and for the OneNAND device to complete its internal copy routine. During the internal copy routine, the OneNAND device copies boot code from its internal non-volatile memory to its internal boot memory section. Board designers typically achieve this requirement by design of the system power and reset supervisor circuit. Refer to your OneNAND device datasheet for OneNAND power ramp and stabilization times and for OneNAND boot copy times. 5.3.1.1 Power-Supply Design Considerations Core and I/O supply voltage regulators should be located close to the DM335 to minimize inductance and resistance in the power delivery path. Additionally, when designing for high-performance applications utilizing the DM335 device, the PC board should include separate power planes for core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors. 5.3.1.2 Power-Supply Decoupling In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as possible close to DM335. These caps need to be close to the DM335 power pins, no more than 1.25 cm maximum distance to be effective. Physically smaller caps, such as 0402, are better because of their lower parasitic inductance. Proper capacitance values are also important. Small bypass caps (near 560 pF) should be closest to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a small package) should be next closest. TI recommends no less than 8 small and 8 medium caps per supply be placed immediately next to the BGA vias, using the "interior" BGA space and at least the corners of the "exterior". Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order of 100 µF) should be furthest away, but still as close as possible. Large caps for each supply should be placed outside of the BGA footprint. Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of any component, verification of capacitor availability over the product’s production lifetime should be considered. See also Section 5.5.1 and Section 5.5.2 for additional recommendations on power supplies for the oscillator/PLL supplies. 96 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.4 Reset 5.4.1 Reset Electrical Data/Timing Table 5-2. Timing Requirements for Reset (1) (2) (see Figure 5-4) DM335 NO. (1) (2) MIN MAX UNIT 1 tw(RESET) Active low width of the RESET pulse 12C ns 2 tsu(BOOT) Setup time, boot configuration pins valid before RESET rising edge 12C ns 3 th(BOOT) Hold time, boot configuration pins valid after RESET rising edge 12C ns BTSEL[1:0] and AECFG[4:0] are the boot configuration pins during device reset. C = MXI/CLKIN cycle time in ns. For example, when MXI/CLKIN frequency is 24 MHz use C = 41.6 ns. 1 RESET 2 3 Boot Configuration Pins (BTSEL[1:0], AECFG[3:0]) Figure 5-4. Reset Timing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 97 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 5.5 Oscillators and Clocks DM335 has two oscillator input/output pairs (MXI1/MXO1 and MXI2/MXO2) usable with external crystals or ceramic resonators to provide clock inputs. The optimal frequencies for the crystals are 24 MHz (MXI1/MXO1) and 27 MHz (MXI2/MXO2). Optionally, the oscillator inputs are configurable for use with external clock oscillators. If external clock oscillators are used, to minimize the clock jitter, a single clean power supply should power both the DM335 and the external oscillator circuit and the minimum CLKIN rise and fall times must be observed. The electrical requirements and characteristics are described in this section. The timing parameters for CLKOUT[3:1] are also described in this section. The DM335 has three output clock pins (CLKOUT[3:1]). See Section 3.5 and Section 3.6 for more information on CLKOUT[3:1]. 5.5.1 MXI1 (24-MHz) Oscillator The MXI1 (typically 24 MHz, can also be 36 MHz) oscillator provides the primary reference clock for the DM335 device. The on-chip oscillator requires an external crystal connected across the MXI1 and MXO1 pins, along with two load capacitors, as shown in Figure 5-5. The external crystal load capacitors must be connected only to the oscillator ground pin (VSS_MX1). Do not connect to board ground (VSS). Also, the PLL power pin (VDDA_PLL1) should be connected to the power supply through a ferrite bead, L1 in the example circuit shown in Figure 5-5. MXI1/CLKIN MXO1 VSS_MX1 VDDA_PLL1 VSSA_PLL1 0.1 F C1 Crystal 24 MHz or 36 MHz C2 1 F L1 Figure 5-5. MXI1 (24-MHz) Oscillator The load capacitors, C1 and C2, should be chosen such that the equation is satisfied (typical values are C1 = C2 = 10 pF). CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator pins (MXI1 and MXO1) and to the VSS_MX1 pin. CL 98 C 1C2 (C1 C2) DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-3. Switching Characteristics Over Recommended Operating Conditions for 24-MHz System Oscillator PARAMETER MIN TYP MAX Start-up time (from power up until oscillating at stable frequency) Oscillation frequency 24 or 36 60 Frequency stability ms MHz ESR 5.5.2 UNIT 4 +/-50 Ω ppm MXI2 (27-MHz) Oscillator (optional oscillator) The MXI2 (27 MHz) oscillator provides an optional reference clock for the DM335's VPSS module. The on-chip oscillator requires an external 27-MHz crystal connected across the MXI2 and MXO2 pins, along with two load capacitors, as shown in Figure 5-6. The external crystal load capacitors must be connected only to the 27-MHz oscillator ground pin (VSS_MX2). Do not connect to board ground (VSS). Also, the PLL power pin (VDDA_PLL2) should be connected to the power supply through a ferrite bead, L1 in the example circuit shown in Figure 5-6. MXO2 MXI2 VSS_MX2 VDDA_PLL2 Crystal 27 MHz C1 VSSA_PLL2 0.1 F C2 1 F L1 Figure 5-6. MXI2 (27-MHz) System Oscillator The load capacitors, C1 and C2, should be chosen such that the equation is satisfied (typical values are C1 = C2 = 10 pF). CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator pins (MXI and MXO) and to the VSS_MX2 pin. CL C 1C2 (C1 C2) Table 5-4. Switching Characteristics Over Recommended Operating Conditions for 27-MHz System Oscillator PARAMETER MIN TYP MAX Start-up time (from power up until oscillating at stable frequency) Oscillation frequency ESR Frequency stability Submit Documentation Feedback UNIT 4 27 ms MHz 60 +/-50 Ω ppm DM335 Peripheral Information and Electrical Specifications 99 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.5.3 www.ti.com Clock PLL Electrical Data/Timing (Input and Output Clocks) Table 5-5. Timing Requirements for MXI1/CLKIN1 (1) (2) (see Figure 5-7) DM335 NO . MIN TYP MAX UNIT 1 tc(MXI1) Cycle time, MXI1/CLKIN1 27.7 (3) 41.6 (3) ns 2 tw(MXI1H) Pulse duration, MXI1/CLKIN1 high 0.45C 0.55C ns 3 tw(MXI1L) Pulse duration, MXI1/CLKIN1 low 0.45C 0.55C ns 4 tt(MXI1) Transition time, MXI1/CLKIN1 0.05C ns 5 tJ(MXI1) Period jitter, MXI1/CLKIN1 0.02C ns (1) (2) (3) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN. C = MXI1/CLKIN1 cycle time in ns. For example, when MXI1/CLKIN1 frequency is 24 MHz use C = 41.6 ns. tc(MXI1) = 41.6 ns and tc(MXI1) = 27.7 ns are the only supported cycle times for MXI1/CLKIN1. 1 5 4 2 MXI/CLKIN 3 4 Figure 5-7. MXI1/CLKIN1 Timing Table 5-6. Timing Requirements for MXI2/CLKIN2 (1) (2) (see Figure 5-7) NO. DM335 MIN MAX 37.037 (3) 37.037 (3) ns Pulse duration, MXI2/CLKIN2 high 0.45C 0.55C ns tw(MXI2L) Pulse duration, MXI2/CLKIN2 low 0.45C 0.55C ns tt(MXI2) Transition time, MXI2/CLKIN2 0.05C ns tJ(MXI2) Period jitter, MXI2/CLKIN2 0.02C ns 1 tc(MXI2) Cycle time, MXI2/CLKIN2 2 tw(MXI2H) 3 4 5 (1) (2) (3) UNIT TYP The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN. C = MXI2/CLKIN2 cycle time in ns. For example, when MXI2/CLKIN2 frequency is 27 MHz use C = 37.037 ns. tc(MXI2) = 37.037 ns is the only supported cycle time for MXI2/CLKIN2. 1 5 4 2 MXI/CLKIN 3 4 Figure 5-8. MXI2/CLKIN2 Timing 100 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-7. Switching Characteristics Over Recommended Operating Conditions for CLKOUT1 (1) (2) (see Figure 5-9) NO. DM335 PARAMETER MIN TYP MAX UNI T 1 tC(CLKOUT1) Cycle time, CLKOUT1 tc(MXI1) 2 tw(CLKOUT1H) Pulse duration, CLKOUT1 high 0.45P 0.55P ns ns 3 tw(CLKOUT1L) Pulse duration, CLKOUT1 low 0.45P 0.55P ns 4 tt(CLKOUT1) Transition time, CLKOUT1 0.05P ns 5 td(MXI1H- Delay time, MXI1/CLKIN1 high to CLKOUT1 high 1 8 ns Delay time, MXI1/CLKIN1I low to CLKOUT1 low 1 8 ns CLKOUT1H) td(MXI1L- 6 CLKOUT1L) (1) (2) The reference points for the rise and fall transitions are measured at VOL MAX and VOHMIN. P = 1/CLKOUT1 clock frequency in nanoseconds (ns). For example, when CLKOUT1 frequency is 24 MHz use P = 41.6 ns. 5 6 MXI/CLKIN 2 4 1 CLKOUT1 3 4 Figure 5-9. CLKOUT1 Timing Table 5-8. Switching Characteristics Over Recommended Operating Conditions for CLKOUT2 (1) (2) (see Figure 5-10) NO. DM335 PARAMETER MIN TYP MAX UNIT 1 tC(CLKOUT2) Cycle time, CLKOUT2 2 tw(CLKOUT2H) Pulse duration, CLKOUT2 high tc(MXI1) /3 0.45P 0.55P ns 3 tw(CLKOUT2L) Pulse duration, CLKOUT2 low 0.45P 0.55P ns 4 tt(CLKOUT2) Transition time, CLKOUT2 0.05P ns 5 td(MXI1H- Delay time, MXI1/CLKIN1 high to CLKOUT2 high 1 8 ns Delay time, MXI1/CLKIN1 low to CLKOUT2 low 1 8 ns CLKOUT2H) 6 td(MXI1LCLKOUT2L) (1) (2) The reference points for the rise and fall transitions are measured at VOL MAX and VOHMIN. P = 1/CLKOUT2 clock frequency in nanoseconds (ns). For example, when CLKOUT2 frequency is 8 MHz use P = 125 ns. MXI/CLKIN 5 6 1 2 4 CLKOUT2 3 4 Figure 5-10. CLKOUT2 Timing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 101 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 5-9. Switching Characteristics Over Recommended Operating Conditions for CLKOUT3 (1) (2) (see Figure 5-11) NO. DM335 PARAMETER MIN TYP MAX UNIT 1 tC(CLKOUT3) Cycle time, CLKOUT3 2 tw(CLKOUT3H) Pulse duration, CLKOUT3 high tc(MXI1) /8 0.45P 0.55P ns 3 tw(CLKOUT3L) Pulse duration, CLKOUT3 low 0.45P 0.55P ns 4 tt(CLKOUT3) Transition time, CLKOUT3 0.05P ns 5 td(MXI2H- Delay time, CLKIN/MXI high to CLKOUT3 high 1 8 ns Delay time, CLKIN/MXI low to CLKOUT3 low 1 8 ns CLKOUT3H) 6 td(MXI2LCLKOUT3L) (1) (2) The reference points for the rise and fall transitions are measured at VOL MAX and VOHMIN. P = 1/CLKOUT3 clock frequency in nanoseconds (ns). For example, when CLKOUT3 frequency is 3 MHz use P = 333.3 ns. MXI/CLKIN 1 5 6 4 CLKOUT3 2 3 4 Figure 5-11. CLKOUT3 Timing 102 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.6 General-Purpose Input/Output (GPIO) The GPIO peripheral provides general-purpose pins that can be configured as either inputs or outputs. When configured as an output, a write to an internal register can control the state driven on the output pin. When configured as an input, the state of the input is detectable by reading the state of an internal register. In addition, the GPIO peripheral can produce CPU interrupts and EDMA events in different interrupt/event generation modes. The GPIO peripheral provides generic connections to external devices. The GPIO pins are grouped into banks of 16 pins per bank (i.e., bank 0 consists of GPIO [0:15]). There are a total of 7 GPIO banks in the DM335, because the DM335 has 104 GPIOs. The DM335 GPIO peripheral supports the following: • Up to 104 3.3v GPIO pins, GPIO[103:0] • Interrupts: – Up to 10 unique GPIO[9:0] interrupts from Bank 0 – Up to 7 GPIO (bank aggregated) interrupt signals, one from each of the 7 banks of GPIOs – Interrupts can be triggered by rising and/or falling edge, specified for each interrupt capable GPIO signal • DMA events: – Up to 10 unique GPIO DMA events from Bank 0 – Up to 7 GPIO (bank aggregated) DMA event signals, one from each of the 7 banks of GPIOs • Set/clear functionality: Firmware writes 1 to corresponding bit position(s) to set or to clear GPIO signal(s). This allows multiple firmware processes to toggle GPIO output signals without critical section protection (disable interrupts, program GPIO, re-enable interrupts, to prevent context switching to anther process during GPIO programming). • Separate Input/Output registers • Output register in addition to set/clear so that, if preferred by firmware, some GPIO output signals can be toggled by direct write to the output register(s). • Output register, when read, reflects output drive status. This, in addition to the input register reflecting pin status and open-drain I/O cell, allows wired logic be implemented. For more detailed information on GPIOs, see the TMS320DM335 Digital Media System-on-Chip (DMSoC) General-Purpose Input/Output (GPIO) Reference Guide (literature number SPRUFY8). 5.6.1 GPIO Peripheral Input/Output Electrical Data/Timing Table 5-10. Timing Requirements for GPIO Inputs (see Figure 5-12) DM335 NO. MIN MAX UNIT 1 tw(GPIH) Pulse duration, GPIx high 52 ns 2 tw(GPIL) Pulse duration, GPIx low 52 ns Table 5-11. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see Figure 5-12) NO. (1) PARAMETER DM335 MIN MAX UNIT 3 tw(GPOH) Pulse duration, GPOx high 26 (1) ns 4 tw(GPOL) Pulse duration, GPOx low 26 (1) ns This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the GPIO is dependent upon internal bus activity. Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 103 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 2 1 GPIx 4 3 GPOx Figure 5-12. GPIO Port Timing 5.6.2 GPIO Peripheral External Interrupts Electrical Data/Timing Table 5-12. Timing Requirements for External Interrupts/EDMA Events (1) (see Figure 5-13) DM335 NO. MIN MAX UNIT 1 tw(ILOW) Width of the external interrupt pulse low 52 ns 2 tw(IHIGH) Width of the external interrupt pulse high 52 ns (1) The pulse width given is sufficient to generate an interrupt or an EDMA event. However, if a user wants to have DM335 to recognize the GPIO changes through software polling of the GPIO register, the GPIO duration must be extended to allow DM335 enough time to access the GPIO register through the internal bus. 2 1 EXT_INTx Figure 5-13. GPIO External Interrupt Timing 104 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.7 External Memory Interface (EMIF) DM335 supports several memory and external device interfaces, including: • Asynchronous EMIF (AEMIF) for interfacing to SRAM. – OneNAND flash memories – NAND flash memories • DDR2/mDDR Memory Controller for interfacing to SDRAM. 5.7.1 Asynchronous EMIF (AEMIF) The EMIF supports the following features: • SRAM, etc. on up to 2 asynchronous chip selects addressable up to 64KB each • Supports 8-bit or 16-bit data bus widths • Programmable asynchronous cycle timings • Supports extended wait mode • Supports Select Strobe mode 5.7.1.1 NAND (NAND, SmartMedia, xD) The NAND features of the EMIF are as follows: • NAND flash on up to 2 asynchronous chip selects • 8 and 16-bit data bus widths • Programmable cycle timings • Performs 1-bit and 4-bit ECC calculation • NAND Mode also supports SmartMedia/SSFDC (Solid State Floppy Disk Controller) and xD memory cards 5.7.1.2 OneNAND The OneNAND features supported are as follows. • NAND flash on up to 2 asynchronous chip selects • Only 16-bit data bus widths • Supports asynchronous writes and reads • Supports synchronous reads with continuous linear burst mode (Does not support synchronous reads with wrap burst modes) • Programmable cycle timings for each chip select in asynchronous mode Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 105 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.7.1.3 www.ti.com AEMIF Electrical Data/Timing Table 5-13. Timing Requirements for Asynchronous Memory Cycles for AEMIF Module (1) (see Figure 5-14 and Figure 5-15) DM335 NO . MIN Nom MAX UNIT READS and WRITES 2 tw(EM_WAIT) Pulse duration, EM_WAIT assertion and deassertion 12 tsu(EMDV-EMOEH) 13 14 2E ns Setup time, EM_D[15:0] valid before EM_OE high 5 ns th(EMOEH-EMDIV) Hold time, EM_D[15:0] valid after EM_OE high 0 ns tsu(EMOEL- Setup time EM_WAIT asserted before EM_OE high (2) READS EMWAIT) 4E ns READS (OneNAND Synchronous Burst Read) 30 tsu(EMDV-EMCLKH) Setup time, EM_D[15:0] valid before EM_CLK high 4 ns 31 th(EMCLKH-EMDIV) Hold time, EM_D[15:0] valid after EM_CLK high 4 ns WRITES tsu(EMWEL- 28 EMWAIT) (1) Setup time, EM_WAIT asserted before EM_WE high (2) 4E ns E = PLLC1 SYSCLK2 period in ns. SYSCLK2 is the EMIF peripheral clock. SYSCLK2 is one-fourth the PLLC output clock. For example, when PLLC output clock = 432 MHz, E = 9.259 ns. See Section 3.5 for more information. Setup before end of STROBE phase (if no extended wait states are inserted) by which EM_WAIT must be asserted to add extended wait states. Figure 5-16 and Figure 5-17 describe EMIF transactions that include extended wait states inserted during the STROBE phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where the HOLD phase would begin if there were no extended wait cycles. (2) Table 5-14. Switching Characteristics Over Recommended Operating Conditions for Asynchronous Memory Cycles for AEMIF Module (1) (2) (3) (see Figure 5-14 and Figure 5-15) NO. DM335 PARAMETER MIN Nom MAX UNI T READS and WRITES 1 td(TURNAROUND) Turn around time (TA)*E ns EMIF read cycle time (EW = 0) (RS+RST+RH)*E ns EMIF read cycle time (EW = 1) (RS+RST+RH+(EWC* 16))*E ns Output setup time, EM_CE[1:0] low to EM_OE low (SS = 0) (RS)*E ns Output setup time, EM_CE[1:0] low to EM_OE low (SS = 1) 0 ns Output hold time, EM_OE high to EM_CE[1:0] high (SS = 0) (RH)*E ns Output hold time, EM_OE high to EM_CE[1:0] high (SS = 1) 0 ns READS 3 4 5 (1) (2) (3) 106 tc(EMRCYCLE) tsu(EMCEL-EMOEL) th(EMOEH-EMCEH) TA = Turn around, RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold, MEWC = Maximum external wait cycles. These parameters are programmed via the Asynchronous Bank and Asynchronous Wait Cycle Configuration Registers. These support the following range of values: TA[4-1], RS[16-1], RST[64-1], RH[8-1], WS[16-1], WST[64-1], WH[8-1], and MEW[1-256]. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Asynchronous External Memory Interface (EMIF) Reference Guide (SPRUFZ1) for more information. E = PLLC1 SYSCLK2 period in ns. SYSCLK2 is the EMIF peripheral clock. SYSCLK2 is one-fourth the PLLC output clock. For example, when PLLC output clock = 432 MHz, E = 9.259 ns. See Section 3.5 for more information EWC = external wait cycles determined by EM_WAIT input signal. EWC supports the following range of values EWC[256-1]. Note that the maximum wait time before timeout is specified by bit field MEWC in the Asynchronous Wait Cycle Configuration Register. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Asynchronous External Memory Interface (EMIF) Reference Guide (SPRUFZ1). DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-14. Switching Characteristics Over Recommended Operating Conditions for Asynchronous Memory Cycles for AEMIF Module (see Figure 5-14 and Figure 5-15) (continued) NO. DM335 PARAMETER MIN Nom MAX UNI T 6 tsu(EMBAV-EMOEL) Output setup time, EM_BA[1:0] valid to EM_OE low (RS)*E ns 7 th(EMOEH-EMBAIV) Output hold time, EM_OE high to EM_BA[1:0] invalid (RH)*E ns 8 tsu(EMBAV-EMOEL) Output setup time, EM_A[13:0] valid to EM_OE low (RS)*E ns 9 th(EMOEH-EMAIV) Output hold time, EM_OE high to EM_A[13:0] invalid (RH)*E ns 10 tw(EMOEL) EM_OE active low width (EW = 0) (RST)*E ns EM_OE active low width (EW = 1) (RST+(EWC*16))*E ns 11 td(EMWAITH- 4E ns EMOEH) Delay time from EM_WAIT deasserted to EM_OE high READS (OneNAND Synchronous Burst Read) 32 fc(EM_CLK) Frequency, EM_CLK 1 66 MH z 33 tc(EM_CLK) Cycle time, EM_CLK 15 1000 ns 34 tsu(EM_ADVV- Output setup time, EM_ADV valid before EM_CLK high 5 ns Output hold time, EM_CLK high to EM_ADV invalid 6 ns Output setup time, EM_A[13:0]/EM_BA[1] valid before EM_CLK high 5 ns Output hold time, EM_CLK high to EM_A[13:0]/EM_BA[1] invalid 6 ns EM_AIV) 38 tw(EM_CLKH) Pulse duration, EM_CLK high tc(EM_CLK)/3 ns 39 tw(EM_CLKL) Pulse duration, EM_CLK low tc(EM_CLK)/3 ns EM_CLKH) 35 th(EM_CLKHEM_ADVIV) 36 tsu(EM_AVEM_CLKH) 37 th(EM_CLKH- WRITES 15 tc(EMWCYCLE) 16 tsu(EMCEL-EMWEL) 17 th(EMWEH-EMCEH) EMIF write cycle time (EW = 0) (WS+WST+WH)*E ns EMIF write cycle time (EW = 1) (WS+WST+WH+(EW C*16))*E ns Output setup time, EM_CE[1:0] low to EM_WE low (SS = 0) (WS)*E ns Output setup time, EM_CE[1:0] low to EM_WE low (SS = 1) 0 ns Output hold time, EM_WE high to EM_CE[1:0] high (SS = 0) (WH)*E ns Output hold time, EM_WE high to EM_CE[1:0] high (SS = 1) 0 ns 20 tsu(EMBAV-EMWEL) Output setup time, EM_BA[1:0] valid to EM_WE low (WS)*E ns 21 th(EMWEH-EMBAIV) Output hold time, EM_WE high to EM_BA[1:0] invalid (WH)*E ns 22 tsu(EMAV-EMWEL) Output setup time, EM_A[13:0] valid to EM_WE low (WS)*E ns 23 th(EMWEH-EMAIV) Output hold time, EM_WE high to EM_A[13:0] invalid (WH)*E ns 24 tw(EMWEL) EM_WE active low width (EW = 0) (WST)*E ns EM_WE active low width (EW = 1) (WST+(EWC*16))*E ns 25 td(EMWAITH- 4E ns (WS)*E ns EMWEH) 26 tsu(EMDV-EMWEL) Delay time from EM_WAIT deasserted to EM_WE high Output setup time, EM_D[15:0] valid to EM_WE low Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 107 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 5-14. Switching Characteristics Over Recommended Operating Conditions for Asynchronous Memory Cycles for AEMIF Module (see Figure 5-14 and Figure 5-15) (continued) NO. 27 DM335 PARAMETER th(EMWEH-EMDIV) MIN Nom Output hold time, EM_WE high to EM_D[15:0] invalid MAX (WH)*E UNI T ns 3 1 EM_CE[1:0] EM_BA[1:0] EM_A[13:0] 4 8 5 9 6 7 10 EM_OE 13 12 EM_D[15:0] EM_WE Figure 5-14. Asynchronous Memory Read Timing for EMIF 15 1 EM_CE[1:0] EM_BA[1:0] EM_A[13:0] 16 17 18 19 20 22 24 21 23 EM_WE 27 26 EM_D[15:0] EM_OE Figure 5-15. Asynchronous Memory Write Timing for EMIF 108 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 EM_CE[1:0] SETUP STROBE Extended Due to EM_WAIT STROBE HOLD EM_BA[1:0] EM_A[13:0] EM_D[15:0] 14 EM_OE 2 EM_WAIT Asserted 11 2 Deasserted Figure 5-16. EM_WAIT Read Timing Requirements EM_CE[1:0] SETUP STROBE Extended Due to EM_WAIT STROBE HOLD EM_BA[1:0] EM_A[13:0] EM_D[15:0] 28 25 EM_WE 2 EM_WAIT Asserted 2 Deasserted Figure 5-17. EM_WAIT Write Timing Requirements Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 109 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 33 38 EM_CE[1:0] 39 EM_CLK 34 EM_ADV 35 31 36 EM_BA0, EM_A[13:0], EM_BA1 37 30 Da EM_D[15:0] Da+n+1 Da+1 Da+2 Da+3 Da+4 Da+5 Da+n EM_OE EM_WAIT Figure 5-18. Synchronous OneNAND Flash Read Timing 110 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 5.7.2 SPRS528B – JULY 2008 – REVISED JANUARY 2009 DDR2/mDDR Memory Controller The DDR2 / mDDR Memory Controller is a dedicated interface to DDR2 / mDDR SDRAM. It supports JESD79D-2A standard compliant DDR2 SDRAM devices and compliant Mobile DDR SDRAM devices. DDR2 / mDDR SDRAM plays a key role in a DM335-based system. Such a system is expected to require a significant amount of high-speed external memory for all of the following functions: • Buffering of input image data from sensors or video sources • Intermediate buffering for processing/resizing of image data in the VPFE • Numerous OSD display buffers • Intermediate buffering for large raw Bayer data image files while performing image processing functions • Buffering for intermediate data while performing video encode and decode functions • Storage of executable code for the ARM The DDR2 / mDDR Memory Controller supports the following features: • JESD79D-2A standard compliant DDR2 SDRAM • Mobile DDR SDRAM • 256 MByte memory space • Data bus width 16 bits • CAS latencies: – DDR2: 2, 3, 4, and 5 – mDDR: 2 and 3 • Internal banks: – DDR2: 1, 2, 4, and 8 – mDDR: 1, 2, and 4 • Burst length: 8 • Burst type: sequential • • • • • • • • • • 1 CS signal Page sizes: 256, 512, 1024, and 2048 SDRAM autoinitialization Self-refresh mode Partial array self-refresh (for mDDR) Power down mode Prioritized refresh Programmable refresh rate and backlog counter Programmable timing parameters Little endian For details on the DDR2 Memory Controller, refer to TMS320DM335 Digital Media System-on-Chip (DMSoC) DDR2/Mobile DDR (DDR2/mDDR) Memory Controller Reference Guide (literature number SPRUFZ2). 5.7.2.1 DDR2/mDDR Memory Controller Electrical Data/Timing The Implementing DDR2/mDDR PCB Layout on the TMS320DM335 DMSoC Application Report (literature number SPRAAL2) specifies a complete DDR2 and mDDR interface solution for the DM335 as well as a list of compatible DDR2/mDDR devices. TI has performed the simulation and system characterization to ensure all DDR2 and mDDR interface timings in this solution are met. TI only supports board designs that follow the guidelines outlined in the implementing DDR2/mDDR PCB Layout on the TMS320DM335 DMSoC Application Report (literature number SPRAAL2). Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 111 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 5.8 MMC/SD The DM335 includes two separate MMC/SD Controllers which are compliant with MMC V3.31, Secure Digital Part 1 Physical Layer Specification V1.1 and Secure Digital Input Output (SDIO) V1.0 specifications. The DM335 MMC/SD Controller has following features: • MultiMediaCard (MMC). • Secure Digital (SD) Memory Card. • MMC/SD protocol support. • SDIO protocol support. • Programmable clock frequency. • 256 bit Read/Write FIFO to lower system overhead. • Slave EDMA transfer capability. The DM335 MMC/SD Controller does not support SPI mode. 5.8.1 MMC/SD Electrical Data/Timing Table 5-15. Timing Requirements for MMC/SD Module (see Figure 5-20 and Figure 5-22) DM335 NO. FAST MODE MIN 1 tsu(CMDV-CLKH) Setup time, SD_CMD valid before SD_CLK high 2 th(CLKH-CMDV) Hold time, SD_CMD valid after SD_CLK high 3 tsu(DATV-CLKH) Setup time, SD_DATx valid before SD_CLK high 4 th(CLKH-DATV) Hold time, SD_DATx valid after SD_CLK high (1) STANDARD MODE MAX MIN UNIT MAX 6 5 ns (1) 5 ns 6 5 ns 2.5 5 ns 2.5 For this parameter, you may include margin in your board design so that the toh = 2.5 ns of the MMC/SD device is not degraded at the DM335 input pin. Table 5-16. Switching Characteristics Over Recommended Operating Conditions for MMC/SD Module (see Figure 5-19 through Figure 5-22) DM335 NO. PARAMETER STANDARD MODE FAST MODE UNIT MIN MAX MIN 7 f(CLK) Operating frequency, SD_CLK 0 50 0 8 f(CLK_ID) Identification mode frequency, SD_CLK 0 400 9 tW(CLKL) Pulse width, SD_CLK low 7 10 10 tW(CLKH) Pulse width, SD_CLK high 7 10 11 tr(CLK) Rise time, SD_CLK 3 10 ns 12 tf(CLK) Fall time, SD_CLK 3 10 ns 13 td(CLKL- Delay time, SD_CLK low to SD_CMD transition -7.5 4 -7.5 14 ns td(CLKL-DAT) Delay time, SD_CLK low to SD_DATx transition -7.5 4 -7.5 14 ns 0 MAX 25 MHz 400 KHz ns ns CMD) 14 112 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 10 9 7 SD_CLK 13 13 START SD_CMD 13 XMIT Valid Valid 13 Valid END Figure 5-19. MMC/SD Host Command Timing 9 7 10 SD_CLK 1 2 SD_CMD START XMIT Valid Valid Valid END Figure 5-20. MMC/SD Card Response Timing 10 9 7 SD_CLK 14 14 START SD_DATx 14 D0 D1 14 Dx END Figure 5-21. MMC/SD Host Write Timing 9 10 7 SD_CLK 4 4 3 Start SD_DATx 3 D0 D1 Dx End Figure 5-22. MMC/SD Host Read and Card CRC Status Timing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 113 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 5.9 Video Processing Sub-System (VPSS) Overview The DM335 contains a Video Processing Sub-System (VPSS) that provides an input interface (Video Processing Front End or VPFE) for external imaging peripherals such as image sensors, video decoders, etc.; and an output interface (Video Processing Back End or VPBE) for display devices, such as analog SDTV displays, digital LCD panels, HDTV video encoders, etc. In addition to these peripherals, there is a set of common buffer memory and DMA control to ensure efficient use of the DDR2 burst bandwidth. The shared buffer logic/memory is a unique block that is tailored for seamlessly integrating the VPSS into an image/video processing system. It acts as the primary source or sink to all the VPFE and VPBE modules that are either requesting or transferring data from/to DDR2. In order to efficiently utilize the external DDR2 bandwidth, the shared buffer logic/memory interfaces with the DMA system via a high bandwidth bus (64-bit wide). The shared buffer logic/memory also interfaces with all the VPFE and VPBE modules via a 128-bit wide bus. The shared buffer logic/memory (divided into the read & write buffers and arbitration logic) is capable of performing the following functions. It is imperative that the VPSS utilize DDR2 bandwidth efficiently due to both its large bandwidth requirements and the real-time requirements of the VPSS modules. Because it is possible to configure the VPSS modules in such a way that DDR2 bandwidth is exceeded, a set of user accessible registers is provided to monitor overflows or failures in data transfers. 5.9.1 Video Processing Front-End (VPFE) The VPFE or Video Processing Front-End block is comprised of the CCD Controller (CCDC), Image Pipe (IPIPE), and Hardware 3A Statistic Generator (H3A). These modules are described in the sections that follow. 5.9.1.1 CCD Controller (CCDC) The CCDC is responsible for accepting raw (unprocessed) image/video data from a sensor (CMOS or CCD). In addition, the CCDC can accept YUV video data in numerous formats, typically from so-called video decoder devices. In the case of raw inputs, the CCDC output requires additional image processing to transform the raw input image to the final processed image. This processing can be done either on-the-fly in the Preview Engine hardware ISP or in software on the ARM. In parallel, raw data input to the CCDC can also used for computing various statistics (3A, Histogram) to eventually control the image/video tuning parameters. The CCDC is programmed via control and parameter registers. The following features are supported by the CCDC module. • Support for conventional Bayer pattern. • Generates HD/VD timing signals and field ID to an external timing generator or can synchronize to the external timing generator. • Support for progressive and interlaced sensors (hardware support for up to 2 fields and firmware support for higher number of fields, typically 3-, 4-, and 5-field sensors). • Support for up to 75-MHZ sensor pixel clock if H3A is not used, otherwise the pixel clock must be less than 67.5 MHZ • Support for ITU-R BT.656 standard format, either 8-bit or 16-bit. • Support for YCbCr 422 format, either 8- or 16-bit with discrete HSYNC and VSYNC signals. • Support for up to 14-bit input. • Support for color space conversion • Generates optical black clamping signals. • Support for shutter signal control. • Support for digital clamping and black level compensation. • Fault pixel correction based on a lookup table that contains row and column position of the pixel to be corrected. • Support for program lens shading correction. • Support for 10-bit to 8-bit A-law compression. 114 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com • • • • • SPRS528B – JULY 2008 – REVISED JANUARY 2009 Support for a low-pass filter prior to writing to SDRAM. If this filter is enabled, 2 pixels each in the left and right edges of each line are cropped from the output. Support for generating output to range from 14-bits to 8-bits wide (8-bits wide allows for 50% saving in storage area). Support for down sampling via programmable culling patterns. Ability to control output to the DDR2 via an external write enable signal. Support for up to 32K pixels (image size) in both the horizontal and vertical direction. 5.9.1.2 IPIPE - Image Pipe The hardware Image Pipe (IPIPE) is a programmable hardware image processing module that is responsible for transforming raw (unprocessed) image/video data from a sensor (CMOS or CCD) into YCbCr 422 data that is amenable for compression or display. The IPIPE can also be configured to operate in a resize only mode, which allows YCbCr 422 to be resized without applying the processing of every module in the IPIPE. Typically, the output of the IPIPE is used for both video compression and displaying it on an external display device such as a NTSC/PAL analog encoder or a digital LCD. The IPIPE is programmed via control and parameter registers. The following features are supported by the IPIPE. • The input interface extracts valid raw data from the CCD raw data, and then various modules in IPIPE process the raw CCD data. • The 2D noise filter module reduces impulse noise in the raw data and adjusts the resolution of the input image. • The 2D pre-filter adjusts the resolution of the input image and remove line crawl noise. • The white balance module applies two gain adjustments to the data: a digital gain (total gain) and a white balance gain. • The Color Filter Array (CFA) interpolation module implements CFA interpolation. The output from the CFA interpolation module is always RGB formatted data. • The RGB2RGB blending module applies a 3x3 matrix transform to the RGB data generated by the CFA interpolation module. • The gamma correction module independently applies gamma correction to each RGB component. Gamma is implemented using a piece-wise linear interpolation approach with a 512 entry look up table for each color. • The RGB2YCbCr conversion module applies 3x3 matrix transformation to the RGB data to convert it to YCbCr data. This module also implements offset. • The 4:2:2 conversion module applies the chroma low pass filter and down samples Cb and Cr, so that IPIPE output data is in YCbCr-4:2:2 format. • The 2D edge enhancer module improves image clarity with luminance non-linear filter. This module also has contrast and brightness adjustment functions. • The chroma suppression module reduces faulty-color using luminance (Y) value or high-pass-filtering Y value. The H-resizer and V-resizer modules resize horizontal and vertical image sizes, respectively. • The output interface module transfers data from IPIPE to SDRAM, in the form of YCbCr-422 or RGB (32bit/16bit). • The histogram function can record histograms of up to 4 distinct areas into up to 256 bins. • IPIPE has three different processing paths: – Case 1: The CCD raw data directly leads to IPIPE and stores the YCbCr (or RGB) data to SDRAM. – Case 2: IPIPE reads CCD raw data and stores the Bayer pattern data after white balance to SDRAM. – Case 3: IPIPE reads YCbCr-422 data and apply edge enhance, chroma suppression and Resize to output YCbCr (or RGB) data to SDRAM. Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 115 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 5.9.1.3 Hardware 3A (H3A) The H3A module is designed to support the control loops for Auto Focus, Auto White Balance and Auto Exposure by collecting metrics about the imaging/video data. The metrics are to adjust the various parameters for processing the imaging/video data. There are 2 main blocks in the H3A module: • Auto Focus (AF) engine • Auto Exposure (AE) Auto White Balance (AWB) engine The AF engine extracts and filters the red, green, and blue data from the input image/video data and provides either the accumulation or peaks of the data in a specified region. The specified region is a two-dimensional block of data and is referred to as a "paxel" for the case of AF. The AE/AWB Engine accumulates the values and checks for saturated values in a sub sampling of the video data. In the case of the AE/AWB, the two-dimensional block of data is referred to as a "window". Thus, other than referring them by different names, a paxel and a window are essentially the same thing. However, the number, dimensions, and starting position of the AF paxels and the AE/AWB windows are separately programmable. The following features are supported by the AF engine: • Support for input from DDR2 / mDDR SDRAM (in addition to the CCDC port) • Support for a Peak Mode in a Paxel (a Paxel is defined as a two dimensional block of pixels). • Accumulate the maximum Focus Value of each line in a Paxel • Support for an Accumulation/Sum Mode (instead of Peak mode). • Accumulate Focus Value in a Paxel. • Support for up to 36 Paxels in the horizontal direction and up to 128 Paxels in the vertical direction. The number of horizontal paxels is limited by the memory size (and cost), while the vertical number of paxels is not. Therefore, the number of paxels in horizontal direction is smaller than the number of paxels in vertical direction. • Programmable width and height for the Paxel. All paxels in the frame will be of same size. • Programmable red, green, and blue position within a 2x2 matrix. • Separate horizontal start for paxel and filtering. • Programmable vertical line increments within a paxel. • Parallel IIR filters configured in a dual-biquad configuration with individual coefficients (2 filters with 11 coefficients each). The filters are intended to compute the sharpness/peaks in the frame to focus on. The following features are supported by the AE/AWB engine: • Support for input from DDR2 / mDDR SDRAM (in addition to the CCDC port) • Accumulate clipped pixels along with all non-saturated pixels • Support for up to 36 horizontal windows. • Support for up to 128 vertical windows. • Programmable width and height for the windows. All windows in the frame will be of same size. • Separate vertical start co-ordinate and height for a black row of paxels that is different than the remaining color paxels. • Programmable Horizontal Sampling Points in a window • Programmable Vertical Sampling Points in a window 116 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.9.1.4 VPFE Electrical Data/Timing Table 5-17. Timing Requirements for VPFE PCLK Master/Slave Mode (1) (see Figure 5-23) NO. (1) (2) H3A not used MIN MAX UNIT 13.33 or P (2) 100 ns 2P + 1 100 ns 1 tc(PCLK) Cycle time, PCLK 2 tw(PCLKH) Pulse duration, PCLK high 5.7 ns 3 tw(PCLKL) Pulse duration, PCLK low 5.7 ns 4 tt(PCLK) Transition time, PCLK H3A used 3 ns P = 1/SYSCLK4 in nanoseconds (ns). For example, if the SYSCLK4 frequency is 216 MHz, use P = 4.63 ns. See Section 3.5, Device Clocking, for more information on the supported clock configurations of the DM335. Use whichever value is greater. 2 3 1 PCLK 4 4 Figure 5-23. VPFE PCLK Timing Table 5-18. Timing Requirements for VPFE (CCD) Slave Mode (see Figure 5-24) DM335 NO. MIN MAX UNIT 5 tsu(CCDV-PCLK) Setup time, CCD valid before PCLK edge 3 ns 6 th(PCLK-CCDV) Hold time, CCD valid after PCLK edge 2 ns 7 tsu(HDV-PCLK) Setup time, HD valid before PCLK edge 3 ns 8 th(PCLK-HDV) Hold time, HD valid after PCLK edge 2 ns 9 tsu(VDV-PCLK) Setup time, VD valid before PCLK edge 3 ns 10 th(PCLK-VDV) Hold time, VD valid after PCLK edge 2 ns 11 tsu(CAM_WEN_FIELD Setup time, CAM_WEN_FIELD valid before PCLK edge 3 ns Hold time, C_WEN_FIELD valid after PCLK edge 2 ns V-PCLK) 12 th(CAM_WEN_FIELDV -PCLK) Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 117 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com PCLK (Positive Edge Clocking) PCLK (Negative Edge Clocking) 8, 10 7, 9 HD/VD 11 12 CAM_WEN_FIELD 5 6 CI[7:0]/YI[7:0]/ CCD[13:0] Figure 5-24. VPFE (CCD) Slave Mode Input Data Timing Table 5-19. Timing Requirements for VPFE (CCD) Master Mode (1) (see Figure 5-25) DM335 NO. MIN MAX UNIT 15 tsu(CCDV-PCLK) Setup time, CCD valid before PCLK edge 3 ns 16 th(PCLK-CCDV) Hold time, CCD valid after PCLK edge 2 ns 23 tsu(CAM_WEN_FIELD Setup time, CAM_WEN_FIELD valid before PCLK edge 3 ns Hold time, CAM_WEN_FIELD valid after PCLK edge 2 ns V-PCLK) 24 th(PCLKCAM_WEN_FIELDV) (1) The VPFE may be configured to operate in either positive or negative edge clocking mode. When in positive edge clocking mode the rising edge of PCLK is referenced. When in negative edge clocking mode the falling edge of PCLK is referenced. PCLK (Positive Edge Clocking) PCLK (Positive Edge Clocking) 15 16 CI[7:0]/YI[7:0]/ CCD[13:0] 23 24 CAM_WEN_FIELD Figure 5-25. VPFE (CCD) Master Mode Input Data Timing 118 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-20. Switching Characteristics Over Recommended Operating Conditions for VPFE (CCD) Master Mode (see Figure 5-26) NO. DM335 PARAMETER MIN MAX UNIT 18 td(PCLKL-HDIV) Delay time, PCLK edge to HD invalid 3 11 ns 20 td(PCLKL-VDIV) Delay time, PCLK edge to VD invalid 3 11 ns PCLK (Negative Edge Clocking) PCLK (Positive Edge Clocking) 18 HD 20 VD Figure 5-26. VPFE (CCD) Master Mode Control Output Data Timing 5.9.2 Video Processing Back-End (VPBE) The Video Processing Back-End of VPBE module is comprised of the On Screen Display (OSD) module and the Video Encoder / Digital LCD Controller (VENC/DLCD). 5.9.2.1 On-Screen Display (OSD) The primary function of the OSD module is to gather and blend video data and display/bitmap data and then pass it to the Video Encoder (VENC) in YCbCr format. The video and display data is read from external DDR2/mDDR memory. The OSD is programmed via control and parameter registers. The following are the primary features that are supported by the OSD. • Support for two video windows and two OSD bitmapped windows that can be displayed simultaneously (VIDWIN0/VIDWIN1 and OSDWIN0/OSDWIN1). • Video windows supports YCbCr data in 422 format from external memory, with the ability to interchange the order of the CbCr component in the 32-bit word • OSD bitmap windows support /4/8 bit width index data of color palette • In addition one OSD bitmap window at a time can be configured to one of the following: – YUV422 (same as video data) – RGB format data in 16-bit mode (R=5bit, G=6bit, B=5bit) – 24-bit mode (each R/G/B=8bit) with pixel level blending with video windows • Programmable color palette with the ability to select between a RAM/ROM table with support for 256 colors. • Support for 2 ROM tables, one of which can be selected at a given time • Separate enable/disable control for each window • Programmable width, height, and base starting coordinates for each window • External memory address and offset registers for each window • Support for x2 and x4 zoom in both the horizontal and vertical direction • Pixel-level blending/transparency/blinking attributes can be defined for OSDWIN0 when OSDWIN1 is configured as an attribute window for OSDWIN0. • Support for blinking intervals to the attribute window • Ability to select either field/frame mode for the windows (interlaced/progressive) • An eight step blending process between the bitmap and video windows • Transparency support for the bitmap and video data (when a bitmap pixel is zero, there will be no Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 119 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 • • • • • • www.ti.com blending for that corresponding video pixel) Ability to resize from VGA to NTSC/PAL (640x480 to 720x576) for both the OSD and video windows Horizontal rescaling x1.5 is supported Support for a rectangular cursor window and a programmable background color selection. The width, height, and color of the cursor is selectable The display priority is: Rectangular-Cursor > OSDWIN1 > OSDWIN0 > VIDWIN1 > VIDWIN0 > background color Support for attenuation of the YCbCr values for the REC601 standard. The following restrictions exist in the OSD module. • If the vertical resize filter is enabled for either of the video windows, the maximum horizontal window dimension cannot be greater than 720 currently. This is due to the limitation in the size of the line memory. • It is not possible to use both of the CLUT ROMs at the same time. However, a window can use RAM while another uses ROM. 5.9.2.2 Video Encoder / Digital LCD Controller (VENC/DLCD) The VENC/DLCD consists of three major blocks; a) the video encoder that generates analog video output, b) the digital LCD controller that generates digital RGB/YCbCr data output and timing signals, and c) the timing generator. The video encoder for analog video supports the following features: • Master Clock Input - 27 MHz (x2 Upsampling) • Programmable Timing Generator • SDTV Support – Composite NTSC-M, PAL-B/D/G/H/I – Non-Interlace option – CGMS/WSS – Line 21 Closed Caption Data Encoding – Chroma Low Pass Filter 1.5MHz/3MHz – Programmable SC-H phase • 10-bit Over-Sampling D/A Converter (27MHz) • Internal analog video buffer • Optional 7.5% Pedestal • 16-235/0-255 Input Amplitude Selectable • Programmable Luma Delay • Master/Slave Operation • Internal Color Bar Generation (75%) The digital LCD controller supports the following features: • Programmable DCLK • Programmable Timing Generator • Various Output Format – YCbCr 16bit – YCbCr 8bit – ITU-R BT. 656 – Parallel RGB 16-bit/18-bit – Serial 8-bit RGB • Low Pass Filter for Digital RGB Output • Master/Slave Operation 120 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com • • SPRS528B – JULY 2008 – REVISED JANUARY 2009 Internal Color Bar Generation (100%/75%) YUV/RGB modes support HDTV output (720p/1080i) with 74.25 MHz external clock input 5.9.2.3 VPBE Electrical Data/Timing Table 5-21. Timing Requirements for VPBE CLK Inputs (see Figure 5-27) DM335 NO. (1) MIN MAX 13.33 160 1 tc(PCLK) Cycle time, PCLK (1) 2 tw(PCLKH) Pulse duration, PCLK high 5.7 3 tw(PCLKL) Pulse duration, PCLK low 5.7 4 tt(PCLK) Transition time, PCLK 5 tc(EXTCLK) Cycle time, EXTCLK 6 tw(EXTCLKH) Pulse duration, EXTCLK high 5.7 7 tw(EXTCLKL) Pulse duration, EXTCLK low 5.7 8 tt(EXTCLK) Transition time, EXTCLK UNIT ns ns ns 13.33 3 ns 160 ns ns ns 3 ns For timing specifications relating to PCLK see Table 5-17, Timing Requirements for VPFE PCLK Master/Slave Mode. 3 1 2 PCLK 4 6 5 7 4 EXTCLK 8 8 Figure 5-27. VPBE PCLK and EXTCLK Timing Table 5-22. Timing Requirements for VPBE Control Input With Respect to PCLK and EXTCLK (1) (2) (3) (see Figure 5-28) DM335 NO. (1) (2) (3) MIN MAX UNIT 9 tsu(VCTLV-VCLKIN) Setup time, VCTL valid before VCLKIN edge 2 ns 10 th(VCLKIN-VCTLV) Hold time, VCTL valid after VCLKIN edge 1 ns The VPBE may be configured to operate in either positive or negative edge clocking mode. When in positive edge clocking mode, the rising edge of VCLKIN is referenced. When in negative edge clocking mode, the falling edge of VCLKIN is referenced. VCTL = HSYNC, VSYNC, and FIELD VCLKIN = PCLK or EXTCLK Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 121 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com VCLKIN(A) (Positive Edge Clocking) VCLKIN(A) (Negative Edge Clocking) 10 9 VCTL(B) A. VCLKIN = PCLK or EXTCLK B. VCTL = HSYNC, VSYNC, and FIELD Figure 5-28. VPBE Input Timing With Respect to PCLK and EXTCLK Table 5-23. Switching Characteristics Over Recommended Operating Conditions for VPBE Control and Data Output With Respect to PCLK and EXTCLK (1) (2) (3) (see Figure 5-29) NO. 11 td(VCLKIN-VCTLV) Delay time, VCLKIN edge to VCTL valid 12 td(VCLKIN-VCTLIV) Delay time, VCLKIN edge to VCTL invalid 13 td(VCLKIN-VDATAV) Delay time, VCLKIN edge to VDATA valid 14 td(VCLKIN-VDATAIV) Delay time, VCLKIN edge to VDATA invalid (1) (2) (3) DM335 PARAMETER MIN MAX 13.3 2 UNIT ns ns 13.3 2 ns ns The VPBE may be configured to operate in either positive or negative edge clocking mode. When in positive edge clocking mode, the rising edge of VCLKIN is referenced. When in negative edge clocking mode, the falling edge of VCLKIN is referenced. VCLKIN = PCLK or EXTCLK VCTL = HSYNC, VSYNC, FIELD, and LCD_OE VCLKIN(A) (Positive Edge Clocking) VCLKIN(A) (Negative Edge Clocking) 11 12 13 14 VCTL(B) VDATA(C) A. VCLKIN = PCLK or EXTCLK B. VCTL = HSYNC, VSYNC, FIELD, and LCD_OE C. VDATA = COUT[7:0], YOUT[7:0], R[7:3], G[7:2], and B[7:3] Figure 5-29. VPBE Control and Data Output With Respect to PCLK and EXTCLK 122 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-24. Switching Characteristics Over Recommended Operating Conditions for VPBE Control and Data Output With Respect to VCLK (1) (2) (see Figure 5-30) NO. (1) (2) DM335 PARAMETER MIN MAX 13.33 160 UNIT 17 tc(VCLK) Cycle time, VCLK 18 tw(VCLKH) Pulse duration, VCLK high 5.7 ns 19 tw(VCLKL) Pulse duration, VCLK low 5.7 ns 20 tt(VCLK) Transition time, VCLK 3 ns 21 td(VCLKINH-VCLKH) Delay time, VCLKIN high to VCLK high 2 12 ns 22 td(VCLKINL-VCLKL) Delay time, VCLKIN low to VCLK low 2 12 ns 23 td(VCLK-VCTLV) Delay time, VCLK edge to VCTL valid 4 ns 24 td(VCLK-VCTLIV) Delay time, VCLK edge to VCTL invalid 25 td(VCLK-VDATAV) Delay time, VCLK edge to VDATA valid 26 td(VCLK-VDATAIV) Delay time, VCLK edge to VDATA invalid 0 ns ns 4 0 ns ns The VPBE may be configured to operate in either positive or negative edge clocking mode. When in positive edge clocking mode, the rising edge of VCLK is referenced. When in negative edge clocking mode, the falling edge of VCLK is referenced. VCLKIN = PCLK or EXTCLK. For timing specifications relating to PCLK, see Table 5-17, Timing Requirements for VPFE PCLK Master/Slave Mode. VCLKIN(A) 21 VCLK 19 17 22 18 (Positive Edge Clocking) VCLK (Negative Edge Clocking) 23 24 25 26 20 20 VCTL(B) VDATA(C) A. VCLKIN = PCLK or EXTCLK B. VCTL = HSYNC, VSYNC, FIELD, and LCD_OE C. VDATA = COUT[7:0], YOUT[7:0], R[7:3], G[7:2], and B[7:3] Figure 5-30. VPBE Control and Data Output Timing With Respect to VCLK 5.9.2.4 DAC and Video Buffer Electrical Data/Timing The DAC and video buffer can be configured in a DAC only configuration or in a DAC and video buffer configuration. In the DAC only configuration the internal video buffer is not used and an external video buffer is attached to the DAC. In the DAC and video buffer configuration, the DAC and internal video buffer are both used and a TV cable may be attached directly to the output of the video buffer. See Figure 5-31 and Figure 5-32 for recommenced circuits for each configuration. Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 123 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Video DAC Buffer VREF IBIAS IOUT CBG 0.1 mF RBIAS 2550W RLOAD VFB TVOUT 499W DAC Digital Input DAC Output Current DIN <9:0> Iout [mA] 1.4 mA MSB LSB 0 Example for External Circuit A. Connect IOUT to a high-impedance video buffer device. B. Place capacitors and resistors as close as possible to the DM335. C. Configure the VDAC_CONFIG register in the system control module as follows: DINV = 0, PWD_GBZ = 1, PWD_VBUFZ = 0, ACCUP_EN = X. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) and the TMS320DM335 Digital Media System-on-Chip (DMSoC) Video Processing Back End (VPBE) Reference Guide (literature number SPRUFX9) for more information on VDAC_CONFIG. Figure 5-31. DAC Only Application Example 124 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Video DAC and Buffer VREF CBG 0.1 mF IBIAS IOUT VFB TVOUT TV monitor RBIAS 2550 Ω Rfb = 1000 Ω Rout = 1070 Ω DAC Digital Input Video Buffer Output Voltage DIN <9:0> TVOUT [V] MSB VOH(VIDBUF) LSB VOL(VIDBUF) 0 A. Place capacitors and resistors as close as possible to the DM335. B. You must use the circuit shown in this diagram. Also you must configure the VDAC_CONFIG register in the System Control module as follows: TRESB4R4 = 0x3, TRESB4R2 = 0x8, TRESB4R1 = 0x8, TRIMBITS = 0x34, PWD_BGZ = 1 (power up VREF), SPEED = 1 (faster), TVINT = don't care, PWD_VBUFZ = 1 (power up video buffer), VREFSET = don't care, ACCUP_EN = 0 (no A/C coupling), DINV = 1 (invert). See the TMS320DM335 Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference Guide (literature number SPRUFX7) and the TMS320DM335 Digital Media System-on-Chip (DMSoC) Video Processing Back End (VPBE) Reference Guide (literature number SPRUFX9) for more information on the VDAC_CONFIG register and Video Buffer. C. For proper TVOUT voltage, you must connect the pin TVOUT directly to the TV. No A/C coupling capacitor or termination resistor is necessary on your DM335 board. Also, it is assumed that the TV has no internal A/C coupling capacitor but does have an internal termination resistor, as shown in this diagram. TVOUT voltage will range from VOL(VIDBUF) to VOH(VIDBUF). See Section 4.3 for the voltage specifications. Figure 5-32. DAC With Buffer Circuit Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 125 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.10 www.ti.com USB 2.0 The DM335 USB2.0 peripheral supports the following features: • USB 2.0 peripheral at speeds high speed (HS: 480 Mb/s) and full speed (FS: 12 Mb/s) • USB 2.0 host at speeds HS, FS, and low speed (LS: 1.5 Mb/s) • All transfer modes (control, bulk, interrupt, and isochronous) • Four Transmit (TX) and four Receive (RX) endpoints in addition to endpoint 0 • FIFO RAM – 4K bytes shared by all endpoints. – Programmable FIFO size • Includes a DMA sub-module that supports four TX and four RX channels of CPPI 3.0 DMAs • RNDIS mode for accelerating RNDIS type protocols using short packet termination over USB • USB OTG extensions, i.e. session request protocol (SRP) and host negotiation protocol (HNP) The DM335 USB2.0 peripheral does not support the following features: • On-chip charge pump • High bandwidth ISO mode is not supported (triple buffering) • RNDIS mode acceleration for USB sizes that are not multiples of 64 bytes • Endpoint max USB packet sizes that do not conform to the USB 2.0 spec (for FS/LS: 8, 16, 32, 64, and 1023 are defined; for HS: 64, 128, 512, and 1024 are defined) 5.10.1 USB2.0 Electrical Data/Timing Table 5-25. Switching Characteristics Over Recommended Operating Conditions for USB2.0 (see Figure 5-33) DM335 NO. LOW SPEED 1.5 Mbps PARAMETER HIGH SPEED (1) 480 Mbps FULL SPEED 12 Mbps MIN MAX MIN MAX MIN (2) UNIT MAX 1 tr(D) Rise time, USB_DP and USB_DM signals 75 300 4 20 0.5 ns 2 tf(D) Fall time, USB_DP and USB_DM signals (2) 75 300 4 20 0.5 ns 3 tfrfm Rise/Fall time, matching (3) 80 125 90 111.11 % 4 VCRS Output signal cross-over voltage (2) 1.3 2 1.3 2 V 5 tjr(source)NT Source (Host) Driver jitter, next transition tjr(FUNC)NT Function Driver jitter, next transition tjr(source)PT Source (Host) Driver jitter, paired transition (4) 6 tjr(FUNC)PT Function Driver jitter, paired transition 7 tw(EOPT) Pulse duration, EOP transmitter 8 tw(EOPR) Pulse duration, EOP receiver 9 t(DRATE) Data Rate 10 ZDRV Driver Output Resistance (1) (2) (3) (4) 2 2 ns 25 2 ns 1 1 ns 1 ns 175 ns 10 1250 1500 670 160 82 1.5 – – ns 12 28 49.5 40.5 480 Mb/s 49.5 Ω For more detailed specification information, see the Universal Serial Bus Specification Revision 2.0, Chapter 7. Electrical. Low Speed: CL = 200 pF, Full Speed: CL = 50 pF, High Speed: CL = 50 pF tfrfm = (tr/tf) x 100. [Excluding the first transaction from the Idle state.] tjr = tpx(1) - tpx(0) USB_DM VCRS USB_DP tper − tjr 90% VOH 10% VOL tr tf Figure 5-33. USB2.0 Integrated Transceiver Interface Timing 126 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 USB VSS_USB_REF USB_R1 10 K Ω ±1% Figure 5-34. USB Reference Resistor Routing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 127 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.11 www.ti.com Universal Asynchronous Receiver/Transmitter (UART) The DM335 contains 3 separate UART modules (1 with hardware flow control). These modules performs serial-to-parallel conversion on data received from a peripheral device or modem, and parallel-to-serial conversion on data received from the CPU. Each UART also includes a programmable baud rate generator capable of dividing the 24MHz reference clock by divisors from 1 to 65,535 to produce a 16 x clock driving the internal logic. The UART modules support the following features: • Frequency pre-scale values from 1 to 65,535 to generate appropriate baud rates • 16-byte storage space for both the transmitter and receiver FIFOs • Unique interrupts, one for each UART • Unique EDMA events, both received and transmitted data for each UART • 1, 4, 8, or 14 byte selectable receiver FIFO trigger level for autoflow control and DMA • Programmable auto-rts and auto-cts for autoflow control (supported on UART2) • Programmable serial data formats – 5, 6, 7, or 8-bit characters – Even, odd, or no parity bit generation and detection – 1, 1.5, or 2 stop bit generation • False start bit detection • Line break generation and detection • Internal diagnostic capabilities – Loopback controls for communications link fault isolation – Break, parity, overrun, and framing error simulation • Modem control functions: CTS, RTS (supported on UART2) 5.11.1 UART Electrical Data/Timing Table 5-26. Timing Requirements for UARTx Receive (see Figure 5-35) DM335 NO. 4 5 (1) tw(URXDB) tw(URXSB) Pulse duration, receive data bit (RXDn) Pulse duration, receive start bit UNIT MIN MAX 0.99U (1) 1.05U (1) ns (1) (1) ns 0.99U 1.05U U = UART baud time = 1/programmed baud rate. ote> Table 5-27. Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see Figure 5-35) NO. 1 f(baud) 2 tw(UTXDB) 3 (1) 128 PARAMETER tw(UTXSB) DM335 MIN UART0/1 Maximum programmable baud rate 1.5 UART2 Maximum programmable baud rate Pulse duration, transmit data bit (TXDn) Pulse duration, transmit start bit UNIT MAX 5 MHz U - 2 (1) U + 2 (1) ns (1) U + 2 (1) ns U-2 U = UART baud time = 1/programmed baud rate. DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 3 2 UART_TXDn Start Bit Data Bits 5 4 UART_RXDn Start Bit Data Bits Figure 5-35. UART Transmit/Receive Timing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 129 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.12 www.ti.com Serial Port Interface (SPI) The DM335 contains 3 separate SPI modules. These modules provide a programmable length shift register which allows serial communication with other SPI devices through a 3 or 4 wire interface (Clock, Data In, Data Out, and Enable). The SPI supports the following features: • Master mode operation • 2 chip selects for interfacing to multiple slave SPI devices. • 3 or 4 wire interface (Clock, Data In, Data Out, and Enable) • Unique interrupt for each SPI port • Separate DMA events for SPI Receive and Transmit • 16-bit shift register • Receive buffer register • Programmable character length (2 to 16 bits) • Programmable SPI clock frequency range • 8-bit clock prescaler • Programmable clock phase (delay or no delay) • Programmable clock polarity The SPI modules do not support the following features: • Slave mode. Only Master mode is supported in DM335 (Master mode means that DM335 provides the serial clock). • GPIO mode. GPIO functionality is supported by the GIO modules for those SPI pins that are multiplexed with GPIO signals. 5.12.1 SPI Electrical Data/Timing Table 5-28. Timing Requirements for SPI (All Modes) (1) (see Figure 5-36) DM335 NO. (1) MIN MAX 37.037 ns UNIT 1 tc(CLK) Cycle time, SPI_CLK ns 2 tw(CLKH) Pulse duration, SPI_CLK high (All Master Modes) 0.45*T 0.55*T ns 3 tw(CLKL) Pulse duration, SPI_CLK low (All Master Modes 0.45*T 0.55*T ns T = tc(CLK) = SPI_CLK period is equal to the SPI module clock divided by a configurable divider. 1 2 3 SPIx_CLK (Clock Polarity = 0) SPIx_CLK (Clock Polarity = 1) Figure 5-36. SPI_CLK Timing 130 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 SPI Master Mode Timings (Clock Phase = 0) Table 5-29. Timing Requirements for SPI Master Mode [Clock Phase = 0] (1) (see Figure 5-37) DM335 NO. MIN MAX UNIT 4 tsu(DIV-CLKL) Setup time, SPI_DI (input) valid before SPI_CLK (output) falling edge Clock Polarity = 0 .5P + 3 ns 5 tsu(DIV-CLKH) Setup time, SPI_DI (in put) valid before SPI_CLK (output) rising edge Clock Polarity = 1 .5P + 3 ns 6 th(CLKL-DIV) Hold time, SPI_DI (input) valid after SPI_CLK (output) falling Clock Polarity = 0 edge .5P + 3 ns 7 th(CLKH-DIV) Hold time, SPI_DI (input) valid after SPI_CLK (output) rising edge 2.5P + 3 ns (1) Clock Polarity = 1 P = 1/SYSCLK2 in nanoseconds (ns). For example, if the SYSCLK2 frequency is 216 MHz, use P = 4.63 ns. See Section 3.5, Device Clocking, for more information on the supported clock configurations of the DM335. Table 5-30. Switching Characteristics Over Recommended Operating Conditions for SPI Master Mode [Clock Phase = 0] (see Figure 5-37) NO. (1) (2) DM335 PARAMETER MIN MAX UNIT 8 td(CLKH-DOV) Delay time, SPI_CLK (output) rising edge to SPI_DO (output) transition Clock Polarity = 0 -4 5 ns 9 td(CLKL-DOV) Delay time, SPI_CLK (output) falling edge to SPI_DO (output) transition Clock Polarity = 1 -4 5 ns 10 td(ENL-CLKH/L) Delay time, SPI_EN[1:0] (output) falling edge to first SPI_CLK (output) rising or falling edge 2P (1) (1) ns 11 td(CLKH/L-ENH) Delay time, SPI_CLK (output) rising or falling edge to SPI_EN[1:0] (output) rising edge P+.5C (2 (2) ns ) The delay time can be adjusted using the SPI module register C2TDELAY. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Serial Peripheral Interface (SPI) Reference Guide ( literature number SPRUFY1). The delay time can be adjusted using the SPI module register T2CDELAY. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Serial Peripheral Interface (SPI) Reference Guide ( literature number SPRUFY1). 11 SPI_EN SPI_CLK (Clock Polarity = 0) 10 SPI_CLK (Clock Polarity = 1) 7 6 4 5 SPI_DI (Input) MSB IN 8 SPI_DO (Output) DATA LSB IN 9 MSB OUT DATA LSB OUT Figure 5-37. SPI Master Mode External Timing (Clock Phase = 0) Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 131 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com SPI Master Mode Timings (Clock Phase = 1) Table 5-31. Timing Requirements for SPI Master Mode [Clock Phase = 1] (see Figure 5-38) DM335 NO. MIN MAX UNIT 13 tsu(DIV-CLKL) Setup time, SPI_DI (input) valid before SPI_CLK (output) rising edge Clock Polarity = 0 .5P + 3 ns 14 tsu(DIV-CLKH) Setup time, SPI_DI (in put) valid before SPI_CLK (output) falling edge Clock Polarity = 1 .5P + 3 ns 15 th(CLKL-DIV) Hold time, SPI_DI (input) valid after SPI_CLK (output) rising edge Clock Polarity = 0 .5P + 3 ns 16 th(CLKH-DIV) Hold time, SPI_DI (input) valid after SPI_CLK (output) falling Clock Polarity = 1 edge .5P + 3 ns Table 5-32. Switching Characteristics Over Recommended Operating Conditions for SPI Master Mode [Clock Phase = 1] (see Figure 5-38) NO. DM335 PARAMETER MIN MAX UNIT 17 td(CLKL-DOV) Delay time, SPI_CLK (output) falling edge to SPI_DO (output) transition Clock Polarity = 0 -4 5 ns 18 td(CLKH-DOV) Delay time, SPI_CLK (output) rising edge to SPI_DO (output) transition Clock Polarity = 1 -4 5 ns 19 td(ENL-CLKH/L) Delay time, SPI_EN[1:0] (output) falling edge to first SPI_CLK (output) rising or falling edge 2P+.5C (1) ns 20 td(CLKL/H-DOHz) Delay time, SPI_CLK (output) falling or rising edge to SPI_DO (output) high impedance P (2) (2) ns (1) (2) (1) The delay time can be adjusted using the SPI module register C2TDELAY. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Serial Peripheral Interface (SPI) Reference Guide ( literature number SPRUFY1). The delay time can be adjusted using the SPI module register T2CDELAY. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) Serial Peripheral Interface (SPI) Reference Guide ( literature number SPRUFY1). SPI_EN SPI_CLK (Clock Polarity = 0) 19 SPI_CLK (Clock Polarity = 1) 15 13 SPI_DI (Input) 14 MSB IN 16 DATA 18 17 SPI_DO (Output) MSB OUT LSB IN DATA LSB OUT Figure 5-38. SPI Master Mode External Timing (Clock Phase = 1) 132 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.13 Inter-Integrated Circuit (I2C) The inter-integrated circuit (I2C) module provides an interface between DM335 and other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus) specification version 2.1 and connected by way of an I2C-bus. External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to/from the DM335 through the I2C module. The I2C port supports: • Compatible with Philips I2C Specification Revision 2.1 (January 2000) • Fast Mode up to 400 Kbps (no fail-safe I/O buffers) • Noise Filter to Remove Noise 50 ns or less • Seven- and Ten-Bit Device Addressing Modes • Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality • Events: DMA, Interrupt, or Polling • Slew-Rate Limited Open-Drain Output Buffers For more detailed information on the I2C peripheral, see the TMS320DM335 Digital Media System-on-Chip (DMSoC) Inter-Integrated Circuit (I2C) Peripheral Reference Guide (literature number SPRUFY3). Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 133 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 5.13.1 www.ti.com I2C Electrical Data/Timing 5.13.1.1 Inter-Integrated Circuits (I2C) Timing Table 5-33. Timing Requirements for I2C Timings (1) (see Figure 5-39) DM335 STANDARD MODE NO. MIN FAST MODE MAX MIN UNIT MAX tc(SCL) Cycle time, SCL 10 2.5 µs 2 tsu(SCLH-SDAL) Setup time, SCL high before SDA low (for a repeated START condition) 4.7 0.6 µs 3 th(SCLL-SDAL) Hold time, SCL low after SDA low (for a START and a repeated START condition) 4 0.6 µs 4 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs 5 tw(SCLH) Pulse duration, SCL high 4 0.6 µs (2) 1 6 tsu(SDAV-SCLH) Setup time, SDA valid before SCL high 250 7 th(SDA-SCLL) Hold time, SDA valid after SCL low (For I2C bus devices) 0 (3) 0 (3) 8 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 9 tr(SDA) Rise time, SDA 1000 20 + 0.1Cb (5) 300 ns 10 tr(SCL) Rise time, SCL 1000 20 + 0.1Cb (5) 300 ns 11 tf(SDA) Fall time, SDA 300 20 + 0.1Cb (5) 300 ns 300 (5) 300 12 tf(SCL) Fall time, SCL 13 tsu(SCLH-SDAH) Setup time, SCL high before SDA high (for STOP condition) 14 tw(SP) Pulse duration, spike (must be suppressed) 15 (5) (1) (2) (3) (4) (5) Cb 100 20 + 0.1Cb 4 ns 0.9 (4) µs ns µs 0.6 0 Capacitive load for each bus line µs 400 50 ns 400 pF The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH)≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH)= 1000 + 250 = 1250 ns (according to the Standard-mode I2C-Bus Specification) before the SCL line is released. A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL. The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal. Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed. 11 9 SDA 6 8 14 4 13 5 10 SCL 1 12 3 2 7 3 Stop Start Repeated Start Stop Figure 5-39. I2C Receive Timings 134 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-34. Switching Characteristics for I2C Timings (1) (see Figure 5-40) DM335 NO. STANDARD MODE PARAMETER MIN MIN UNIT MAX tc(SCL) Cycle time, SCL 10 2.5 µs 17 td(SCLH-SDAL) Delay time, SCL high to SDA low (for a repeated START condition) 4.7 0.6 µs 18 td(SDAL-SCLL) Delay time, SDA low to SCL low (for a START and a repeated START condition) 4 0.6 µs 19 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs 20 tw(SCLH) Pulse duration, SCL high 4 0.6 µs 21 td(SDAV-SCLH) Delay time, SDA valid to SCL high 250 100 22 tv(SCLL-SDAV) Valid time, SDA valid after SCL low (For I2C devices) 0 0 23 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 µs 28 td(SCLH-SDAH) Delay time, SCL high to SDA high (for STOP condition) 4 0.6 µs 29 Cp Capacitance for each I2C pin 16 (1) MAX FAST MODE ns 0.9 10 10 µs pF Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed. CAUTION The DM335 I2C pins use a standard ±4-mA LVCMOS buffer, not the slow I/OP buffer defined in the I2C specification. Series resistors may be necessary to reduce noise at the system level. SDA 21 23 19 28 20 SCL 16 18 17 22 18 Stop Start Repeated Start Stop Figure 5-40. I2C Transmit Timings Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 135 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 5.14 Audio Serial Port (ASP) DM335 includes two separate ASP controllers. The primary use for the audio serial port (ASP) is for audio interface purposes. The primary audio modes that are supported by the ASP are the AC97 and IIS modes. In addition to the primary audio modes, the ASP supports general serial port receive and transmit operation, but is not intended to be used as a high-speed interface. The ASP is backward compatible with other TI ASPs. The ASP supports the following features: • Full-duplex communication • Double-buffered data registers, which allow a continuous data stream • Independent framing and clocking for receive and transmit • External shift clock generation or an internal programmable frequency shift clock • Double-buffered data registers, which allow a continuous data stream • Independent framing and clocking for receive and transmit • Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially connected analog-to-digital (A/D) and digital-to-analog (D/A) devices • Direct interface to AC97 compliant devices (the necessary multiphase frame synchronization capability is provided) • Direct interface to IIS compliant devices • Direct interface to SPI protocol in master mode only • A wide selection of data sizes, including 8, 12, 16, 20, 24, and 32 bits • µ-Law and A-Law companding • 8-bit data transfers with the option of LSB or MSB first • Programmable polarity for both frame synchronization and data clocks • Highly programmable internal clock and frame generation For more detailed information on the ASP peripheral, see the TMS320DM335 Digital Media System-on-Chip (DMSoC) Audio Serial Port (ASP) Reference Guide (literature number SPRUFZ3). 136 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 5.14.1 SPRS528B – JULY 2008 – REVISED JANUARY 2009 ASP Electrical Data/Timing 5.14.1.1 Audio Serial Port (ASP) Timing Table 5-35. Timing Requirements for ASP (1) (see Figure 5-41) DM335 NO. (1) (2) (3) (4) MIN MAX UNIT 38.5 or 2P (2) (3) ns CLKS ext 19.25 or P (2) (3) (4) ns CLKR int 21 CLKR ext 6 CLKR int 0 CLKR ext 6 CLKR int 21 CLKR ext 6 CLKR int 0 CLKR ext 6 CLKX int 21 CLKX ext 6 15 tc(CLK) Cycle time, CLK CLK ext 16 OTG(CLKS) Pulse duration, CLKR/X high or CLKR/X low 5 tsu(FRH-CKRL) Setup time, external FSR high before CLKR low 6 th(CKRL-FRH) Hold time, external FSR high after CLKR low 7 tsu(DRV-CKRL) Setup time, DR valid before CLKR low 8 th(CKRL-DRV) Hold time, DR valid after CLKR low 10 tsu(FXH-CKXL) Setup time, external FSX high before CLKX low 11 th(CKXL-FXH) Hold time, external FSX high after CLKX low CLKX int 0 CLKX ext 10 ns ns ns ns ns ns CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted. P = (1/SYSCLK2), where SYSCLK2 is an output clock of PLLC1 (see Section 3.5) . Use which ever value is greater. The ASP does not have a duty cycle specification, just ensure that the minimum pulse duration specification is met. Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 137 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 5-36. Switching Characteristics Over Recommended Operating Conditions for ASP (1) (2) (see Figure 5-41) NO. DM335 PARAMETER MIN MAX CLKR/X int 38.5 or 2P (3) (4) (5) td(CLKS-CLKRX) Delay time, CLKS high to internal CLKR/X CLKR/X int 1 24 3 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X int C - 1 (6) C + 1 (6) 4 td(CKRH-FRV) Delay time, CLKR high to internal FSR valid CLKR int 3 25 CLKR ext 3 25 9 td(CKXH-FXV) Delay time, CLKX high to internal FSX valid CLKX int -4 8 CLKX ext 3 25 12 tdis(CKXHDXHZ) Disable time, DX high impedance following last data bit from CLKX high 2 tc(CKRX) 17 13 14 (1) (2) (3) (4) (5) (6) 138 Cycle time, CLKR/X td(CKXH-DXV) Delay time, CLKX high to DX valid td(FXH-DXV) Delay time, FSX high to DX valid ONLY applies when in data delay 0 (XDATDLY = 00b) mode UNIT ns ns ns ns CLKX int 12 ns CLKX ext 12 ns CLKX int -5 12 ns CLKX ext 3 25 ns FSX int 14 FSX ext 25 ns CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted. Minimum delay times also represent minimum output hold times. Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and AC timing requirements. P = (1/SYSCLK2), where SYSCLK2 is an output clock of PLLC1 (see Section 3.5) . Use which ever value is greater. C = H or L S = sample rate generator input clock = P if CLKSM = 1 (P = 1/SYSCLK2, where SYSCLK2 is an output of PLLC1 (see Section 3.5) ) S = sample rate generator input clock = CLKS if CLKSM = 0 H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even H = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even L = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero CLKGDV should be set appropriately to ensure the ASP bit rate does not exceed the maximum limit (see footnote (3) above). DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 16 15 16 CLKS 2 17 3 3 CLKR 4 4 FSR (int) 5 6 FSR (ext) 7 8 Bit(n-1) DR (n-2) (n-3) 2 17 3 3 CLKX 9 FSX (int) 11 10 FSX (ext) FSX (XDATDLY=00b) 14 13(A) Bit(n-1) 12 DX Bit 0 13(A) (n-2) (n-3) A. Parameter No. 13 applies to the first data bitonly when XDATDLY ≠ 0. Figure 5-41. ASP Timing Table 5-37. ASP as SPI Timing Requirements CLKSTP = 10b, CLKXP = 0 (see Figure 5-42) MASTER NO. MIN M30 tsu(DRV-CKXL) Setup time, DR valid before CLKX low M31 th(CKXL-DRV) Hold time, DR valid after CLKX low MAX UNIT 11 ns 0 ns Table 5-38. ASP as SPI Switching Characteristics (1) (2) CLKSTP = 10b, CLKXP = 0 (see Figure 5-42) NO. M33 (1) (2) (3) (4) MASTER PARAMETER tc(CKX) MIN MAX 38.5 or 2P (1) (3) Cycle time, CLKX UNIT ns (2) T–2 T+3 ns L1 – 2 L1 + 2 ns –2 6 ns L1 – 3 L1 +3 ns M24 td(CKXL-FXH) Delay time, CLKX low to FSX high M25 td(FXL-CKXH) Delay time, FSX low to CLKX high (4) M26 td(CKXH-DXV) Delay time, CLKX high to DX valid M27 tdis(CKXL-DXHZ) Disable time, DX high impedance following last data bit from CLKX low P = (1/SYSCLK2), where SYSCLK2 is an output clock of PLLC1 (see Section 3.5) . T = CLKX period = (1 + CLKGDV) × 2P L1 = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) × 2P when CLKGDV is even Use which ever value is greater. FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 139 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com CLKX M24 M33 M25 FSX M27 DX Bit 0 Bit(n-1) M26 (n-2) Bit(n-1) M31 (n-2) M30 DR Bit 0 (n-3) (n-3) (n-4) (n-4) Figure 5-42. ASP as SPI: CLKSTP = 10b, CLKXP = 0 140 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-39. ASP as SPI Timing Requirements CLKSTP = 11b, CLKXP = 0 MASTER NO. MIN M39 tsu(DRV-CKXH) Setup time, DR valid before CLKX high M40 th(CKXH-DRV) Hold time, DR valid after CLKX high MAX UNIT 11 ns 1 ns Table 5-40. ASP as SPI Switching Characteristics (1) (2) CLKSTP = 11b, CLKXP = 0 (see Figure 5-43) NO. M42 (1) (2) (3) (4) (5) MASTER PARAMETER tc(CKX) MIN MAX 38.5 or 2P (1) (3) Cycle time, CLKX UNIT ns (4) L1 – 2 L1 + 3 ns T–2 T+2 ns M34 td(CKXL-FXH) Delay time, CLKX low to FSX high M35 td(FXL-CKXH) Delay time, FSX low to CLKX high (5) M36 td(CKXL-DXV) Delay time, CLKX low to DX valid –2 6 ns M37 tdis(CKXL-DXHZ) Disable time, DX high impedance following last data bit from CLKX low –3 3 ns M38 td(FXL-DXV) Delay time, FSX low to DX valid H1 – 2 H1 + 10 ns P = (1/SYSCLK2), where SYSCLK2 is an output clock of PLLC1 (see Section 3.5) . T = CLKX period = (1 + CLKGDV) × 2P L1 = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) × 2P when CLKGDV is even H1 = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) × 2P when CLKGDV is even Use which ever value is greater. FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master ASP FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). CLKX M34 M35 M37 M38 M42 FSX DX Bit 0 Bit(n-1) M39 DR Bit 0 M36 (n-2) (n-3) (n-4) M40 Bit(n-1) (n-2) (n-3) (n-4) Figure 5-43. ASP as SPI: CLKSTP = 11b, CLKXP = 0 Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 141 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 5-41. ASP as SPI Timing Requirements CLKSTP = 10b, CLKXP = 1 (see Figure 5-44) MASTER NO. MIN M49 tsu(DRV-CKXH) Setup time, DR valid before CLKX high M50 th(CKXH-DRV) Hold time, DR valid after CLKX high MAX UNIT 11 ns 0 ns Table 5-42. ASP as SPI Switching Characteristics (1) (2) CLKSTP = 10b, CLKXP = 1 (see Figure 5-44) NO. M52 MASTER PARAMETER tc(CKX) MIN 38.5 or 2P (1) (3) Cycle time, CLKX (4) M43 td(CKXH-FXH) Delay time, CLKX high to FSX high M44 td(FXL-CKXL) Delay time, FSX low to CLKX low (5) M45 td(CKXL-DXV) Delay time, CLKX low to DX valid tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from CLKX high M46 (1) (2) (3) (4) (5) MAX UNIT ns T–1 T+3 ns H1 – 2 H1 + 2 ns –2 6 ns H1 – 3 H1 + 3 ns P = (1/SYSCLK2), where SYSCLK2 is an output clock of PLLC1 (see Section 3.5) . T = CLKX period = (1 + CLKGDV) × 2P H1 = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) × 2P when CLKGDV is even Use which ever value is greater. FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master ASP FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). CLKX M43 FSX M44 M52 M46 DX Bit 0 Bit(n-1) M49 DR Bit 0 Bit(n-1) M45 (n-2) (n-3) M50 (n-2) (n-3) (n-4) (n-4) Figure 5-44. ASP as SPI: CLKSTP = 10b, CLKXP = 1 142 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 Table 5-43. ASP as SPI Timing Requirements CLKSTP = 11b, CLKXP = 1 (see Figure 5-45) MASTER NO. MIN M58 tsu(DRV-CKXL) Setup time, DR valid before CLKX low M59 th(CKXL-DRV) Hold time, DR valid after CLKX low MAX UNIT 11 ns 0 ns Table 5-44. ASP as SPI Switching Characteristics (1) (2) CLKSTP = 11b, CLKXP = 1 (see Figure 5-45) NO. M62 (1) (2) (3) (4) (5) MASTER PARAMETER tc(CKX) MIN MAX 38.5 or 2P (3) (3) Cycle time, CLKX (4) M53 td(CKXH-FXH) Delay time, CLKX high to FSX high M54 td(FXL-CKXL) Delay time, FSX low to CLKX low (5) M55 td(CKXL-DXV) M56 M57 UNIT ns H1 – 1 H1 + 3 ns T–2 T+2 ns Delay time, CLKX low to DX valid –2 6 ns tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from CLKX high –3 +3 ns td(FXL-DXV) Delay time, FSX low to DX valid L1 – 1 L1 + 10 ns P = (1/SYSCLK2), where SYSCLK2 is an output clock of PLLC1 (see Section 3.5) . T = CLKX period = (1 + CLKGDV) × 2P L1 = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) × 2P when CLKGDV is even H1 = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) × 2P when CLKGDV is even Use which ever value is greater. FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master ASP FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). CLKX M53 M54 M62 FSX DX M56 Bit 0 M57 Bit(n-1) M58 DR Bit 0 Bit(n-1) M55 (n-2) (n-3) M59 (n-2) (n-3) (n-4) (n-4) Figure 5-45. ASP as SPI: CLKSTP = 11b, CLKXP = 1 Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 143 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 5.15 Timer The DM335 contains four software-programmable timers. Timer 0, Timer 1, and Timer 3 (general-purpose timers) can be programmed in 64-bit mode, dual 32-bit unchained mode, or dual 32-bit chained mode. Timer 3 supports additional features over the other timers: external clock/event input, period reload, output event tied to Real Time Out (RTO) module, external event capture, and timer counter register read reset. Timer 2 is used only as a watchdog timer. Timer 2 is tied to device reset. • 64-bit count-up counter • Timer modes: – 64-bit general-purpose timer mode (Timer 0, 1, 3) – Dual 32-bit general-purpose timer mode (Timer 0, 1, 3) – Watchdog timer mode (Timer 2) • Two possible clock sources: – Internal clock – External clock/event input via timer input pins (Timer 3) • Three possible operation modes: – One-time operation (timer runs for one period then stops) – Continuous operation (timer automatically resets after each period) – Continuous operation with period reload (Timer 3) • Generates interrupts to the ARM CPU • Generates sync event to EDMA • Generates output event to device reset (Timer 2) • Generates output event to Real Timer Out (RTO) module (Timer 3) • External event capture via timer input pins (Timer 3) For more detailed information, see the TMS320DM335 Digital Media System-on-Chip (DMSoC) 64-bit Timer Reference Guide (literature number SPRUFY0). 5.15.1 Timer Electrical Data/Timing Table 5-45. Timing Requirements for Timer Input (1) (2) (3) (see Figure 5-46) DM335 NO. MIN MAX 1 tc(TIN) Cycle time, TIM_IN 2 tw(TINPH) Pulse duration, TIM_IN high 0.45C 0.55C ns 3 tw(TINPL) Pulse duration, TIM_IN low 0.45C 0.55C ns 4 tt(TIN) Transition time, TIM_IN 0.05C ns (1) 4P UNIT ns GPIO000, GPIO001, GPIO002, and GPIO003 can be used as external clock inputs for Timer 3. See the TMS320DM335 Digital Media System-on-Chip (DMSoC) 64-bit Timer Reference Guide (literature number SPRUFY0). P = MXI1/CLKIN cycle time in ns. For example, when MXI1/CLKIN frequency is 24 MHz use P = 41.6 ns. C = TIM_IN cycle time in ns. For example, when TIM_IN frequency is 24 MHz use C = 41.6 ns (2) (3) 1 2 4 3 4 TIM_IN Figure 5-46. Timer Input Timing 144 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 5.16 SPRS528B – JULY 2008 – REVISED JANUARY 2009 Pulse Width Modulator (PWM) The DM335 contains 4 separate Pulse Width Modulator (PWM) modules. The pulse width modulator (PWM) feature is very common in embedded systems. It provides a way to generate a pulse periodic waveform for motor control or can act as a digital-to-analog converter with some external components. This PWM peripheral is basically a timer with a period counter and a first-phase duration comparator, where bit width of the period and first-phase duration are both programmable. The Pulse Width Modulator (PWM) modules support the following features: • 32-bit period counter • 32-bit first-phase duration counter • 8-bit repeat count for one-shot operation. One-shot operation will produce N + 1 periods of the waveform, where N is the repeat counter value. • Configurable to operate in either one-shot or continuous mode • Buffered period and first-phase duration registers • One-shot operation triggerable by hardware events with programmable edge transitions. (low-to-high or high-to-low). • One-shot operation triggerable by the CCD VSYNC output of the video processing subsystem (VPSS), which allows any of the PWM instantiations to be used as a CCD timer. This allows the DM335 module to support the functions provided by the CCD timer feature (generating strobe and shutter signals). • One-shot operation generates N+1 periods of waveform, N being the repeat count register value • Configurable PWM output pin inactive state • Interrupt and EDMA synchronization events 5.16.1 PWM0/1/2/3 Electrical/Timing Data Table 5-46. Switching Characteristics Over Recommended Operating Conditions for PWM0/1/2/3 Outputs (1) (see Figure 5-47 and Figure 5-48) NO. (1) DM335 PARAMETER MIN 1 tw(PWMH) Pulse duration, PWMx high P 2 tw(PWML) Pulse duration, PWMx low P 3 tt(PWM) Transition time, PWMx 4 td(CCDC-PWMV) Delay time, CCDC(VD) trigger event to PWMx valid MAX UNIT ns ns .05P ns 10 ns P = MXI1/CLKIN cycle time in ns. For example, when MXI1/CLKIN frequency is 24 MHz use P = 41.6 ns. 1 2 PWM0/1/2/3 3 3 Figure 5-47. PWM Output Timing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 145 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com VD(CCDC) 4 PWM0 INVALID VALID 4 PWM1 INVALID VALID 4 PWM2 INVALID VALID 4 PWM3 INVALID VALID Figure 5-48. PWM Output Delay Timing 146 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 5.17 SPRS528B – JULY 2008 – REVISED JANUARY 2009 Real Time Out (RTO) The DM335 Real Time Out (RTO) peripheral supports the following features: • Four separate outputs • Trigger on Timer3 event 5.17.1 RTO Electrical/Timing Data Table 5-47. Switching Characteristics Over Recommended Operating Conditions for RTO Outputs (see Figure 5-49 and Figure 5-50) NO. DM335 PARAMETER MIN 1 tw(RTOH) Pulse duration, RTOx high P 2 tw(RTOL) Pulse duration, RTOx low P 3 tt(RTO) Transition time, RTOx 4 td(TIMER3-RTOV) Delay time, Timer 3 (TINT12 or TINT34) trigger event to RTOx valid MAX UNIT ns ns .1P ns 10 ns 1 2 RTO0/1/2/3 3 3 Figure 5-49. RTO Output Timing TINT12/TINT34 (Timer3) 4 RTO0 INVALID VALID 4 RTO1 INVALID VALID 4 RTO2 INVALID VALID 4 RTO3 INVALID VALID Figure 5-50. RTO Output Delay Timing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 147 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 5.18 IEEE 1149.1 JTAG The JTAG (1) interface is used for BSDL testing and emulation of the DM335 device. The DM335 device requires that both TRST and RESET be asserted upon power up to be properly initialized. While RESET initializes the device, TRST initializes the device's emulation logic. Both resets are required for proper operation. While both TRST and RESET need to be asserted upon power up, only RESET needs to be released for the device to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG port interface and device's emulation logic in the reset state. TRST only needs to be released when it is necessary to use a JTAG controller to debug the device or exercise the device's boundary scan functionality. Note: TRST is synchronous and must be clocked by TCK; otherwise, the boundary scan logic may not respond as expected after TRST is asserted. RESET must be released only in order for boundary-scan JTAG to read the variant field of IDCODE correctly. Other boundary-scan instructions work correctly independent of current state of RESET. For maximum reliability, DM335 includes an internal pulldown (PD) on the TRST pin to ensure that TRST will always be asserted upon power up and the device's internal emulation logic will always be properly initialized. JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use of a pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize the device after powerup and externally drive TRST high before attempting any emulation or boundary scan operations. Following the release of RESET, the low-to-high transition of TRST must be "seen" to latch the state of EMU1 and EMU0. The EMU[1:0] pins configure the device for either Boundary Scan mode or Emulation mode. For more detailed information, see the terminal functions section of this data sheet. (1) 148 IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture. DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com 5.18.1 SPRS528B – JULY 2008 – REVISED JANUARY 2009 JTAG Test-Port Electrical Data/Timing Table 5-48. Timing Requirements for JTAG Test Port (see Figure 5-51) DM335 NO. MIN MAX UNIT 1 tc(TCK) Cycle time, TCK 20 ns 2 tw(TCKH) Pulse duration, TCK high 8 ns 3 tw(TCKL) Pulse duration, TCK low 8 ns 4 tsu(TDIV-RTCKH) Setup time, TDI valid before RTCK high 10 ns 5 th(RTCKH-TDIIV) Hold time, TDI valid after RTCK high 9 ns 6 tsu(TMSV-RTCKH) Setup time, TMS valid before RTCK high 2 ns 7 th(RTCKH-TMSIV) Hold time, TMS valid after RTCK high 5 ns 1 2 3 TCK RTCK TDO 5 4 TDI 6 7 TMS Figure 5-51. JTAG Input Timing Submit Documentation Feedback DM335 Peripheral Information and Electrical Specifications 149 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com Table 5-49. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see Figure 5-51) NO. DM335 PARAMETER MIN MAX UNIT 8 tc(RTCK) Cycle time, RTCK 20 9 tw(RTCKH) Pulse duration, RTCK high 10 10 tw(RTCKL) Pulse duration, RTCK low 10 11 tr(all JTAG outputs) Rise time, all JTAG outputs 1.3 ns 12 tf(all JTAG outputs) Fall time, all JTAG outputs 1.3 ns 0.25*tc(RT CK) ns 13 td(RTCKL-TDOV) Delay time, TCK low to TDO valid 0 ns 8 9 10 RTCK 13 TDO Figure 5-52. JTAG Output Timing 150 DM335 Peripheral Information and Electrical Specifications Submit Documentation Feedback TMS320DM335 Digital Media System-on-Chip (DMSoC) www.ti.com SPRS528B – JULY 2008 – REVISED JANUARY 2009 6 Revision History (Revision B) This data sheet revision history highlights the technical changes made to the SPRS528A device-specific data sheet to make it an SPRS528B revision. Scope: Applicable updates to the DM335 device family, specifically relating to the DM335 device, have been incorporated. The A135 and A216 DM335 devices both support extended temperature. ADDS/CHANGES/DELETES Global: • Removed 270-MHz • Added Extended Temperature for 135-MHz devices Submit Documentation Feedback Revision History (Revision B) 151 TMS320DM335 Digital Media System-on-Chip (DMSoC) SPRS528B – JULY 2008 – REVISED JANUARY 2009 www.ti.com 7 Mechanical Data The following table(s) show the thermal resistance characteristics for the PBGA – ZCE mechanical package. Note that micro-vias are not required. Contact your TI representative for routing recommendations. 7.1 Thermal Data for ZCE The following table shows the thermal resistance characteristics for the PBGA – ZCE mechanical package. Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCE] °C/W (1) NO. (1) 1 RΘJC Junction-to-case 7.2 2 RΘJB Junction-to-board 11.4 3 RΘJA Junction-to-free air 27.0 4 PsiJT Junction-to-package top 0.1 5 PsiJB Junction-to-board 11.3 The junction-to-case measurement was conducted in a JEDEC defined 2S2P system and will change based on environment as well as application. For more information, see these three EIA/JEDEC standards: • EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages 7.1.1 Packaging Information The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document. Note that micro-vias are not required for this package. 152 Mechanical Data Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TMS320DM335ZCE135 ACTIVE NFBGA ZCE 337 160 Pb-Free (RoHS) Call TI Level-3-260C-168 HR TMS320DM335ZCE216 ACTIVE NFBGA ZCE 337 1 Pb-Free (RoHS) Call TI Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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