ETC BKMCR-2

Bussmann®
Microtron® Printed Circuit Board Fuses
MCR
.122∑ ≈ .297∑ (3.10mm ≈ 7.54mm)
R
Product Name: MCR (Microtron®)
Characteristics: Fast Acting, Current Limiting
Construction: Solid Matrix
Packaging & Ordering Information:
*All tolerances: ±0.005"
±0.13mm
1
.025"
0.64mm
MCR
(See Table)
Rated Current
Symbol
.01
Package Code
Blank10 in
BK 500 in
TR/ Tape/Reel 2500 units, 52.4mm spacing
TR1/ Tape/Reel 5000 units, 52.4mm spacing
TR6/ Tape/Reel 1000 units, 52.4mm spacing
Radial leaded versions available (.4∑, .6∑ spacing)
.01
.001
100
Product
.1
10
.12"
3.10mm
TIME IN SECONDS
1.13"
28.58mm
.297"
7.54mm
1
1.13"
28.58mm
.1
Dimensional Data
10
AMPERE
RATING
1/16
1/8
Actual Size
1/4
3/8
1/2
3/4
1.0 1.5
2.0 2.5
3.0
4.0 5.0
7.0
10.0
Time-Current Characteristic Curves–Average Melt
(Full Size Curves Available)
CURRENT IN AMPERES
Weight = 2.45 lbs/2500
Time-Current Characteristics:
Rated
CE logo denotes compliance with European Union Low Voltage Directive
(50-1000 VAC, 75-1500 VDC). Refer to BIF document #8002 or contact
Bussmann Application Engineering at 314-527-1270 for more information.
Percent of Rating
Current
100%
250%
0-10A
4 hrs. (min)
5 sec. (max)
Electrical Characteristics
AC
DC
Typical Total Clearing2
I2t (A2sec)
AC
DC
Typical Voltage
Drop Volts at
100% Rated
Current
Agency*
Approvals
JIS
Pre-arcing2
I2t (A2sec)
CSA
Interrupting
Rating1
AC
DC
UR
Current
Rating
Rated
Voltage
AC (Max.)
DC (Max.)
125V
125V
50A
300A
1.1 ≈ 10-6
1.0 ≈ 10-7
1.8 ≈ 10-6
1.5 ≈ 10-7
2.33
• •
125V
125V
50A
300A
4.3 ≈ 10-6
7.1 ≈ 10-7
7.3 ≈ 10-6
8.7 ≈ 10-7
1.52
• •
125V
125V
50A
300A
8.0 ≈ 10-5
1.0 ≈ 10-6
1.2 ≈ 10-4
1.3 ≈ 10-6
.76
• •
125V
125V
50A
300A
9.7 ≈ 10-5
6.7 ≈ 10-6
1.1 ≈ 10-4
8.3 ≈ 10-6
.73
• •
-4
-5
-3
-5
125V
125V
50A
300A
7.4 ≈ 10
5.4 ≈ 10
6.2 ≈ 10
6.8 ≈ 10
.65
• •
125V
125V
50A
300A
1.3 ≈10-3
7.4 ≈ 10-5
7.5 ≈ 10-2
9.2 ≈ 10-5
.55
• •
125V
125V
50A
300A
.01
.01
.02
.01
.24
• • •
125V
125V
50A
300A
.03
.02
.04
.03
.20
• • •
125V
125V
50A
300A
.09
.07
.11
.08
.16
• • •
125V
125V
50A
300A
.19
.14
.25
.17
.15
• • •
125V
125V
50A
300A
.35
.28
.45
.32
.15
• • •
125V
125V
50A
300A
.56
.37
.83
.43
.14
• • •
125V
125V
50A
300A
.96
.67
1.37
.77
.13
• • •
125V
125V
50A
300A
1.82
1.34
2.53
1.51
.11
• • •
60V
90V
50A
300A
1.48
.49
2.02
.58
.10
• •
60V
90V
50A
300A
3.62
1.16
4.41
1.38
.08
• •
UL Recognition STD 248-14, Guide JDYX2, File E19180; CSA Certification, Class 1422-01, File 53787.
JIS (Japanese Industrial Standard) Reg. No. 2221, Authorization No. 32-1516.
1. Interrupting ratings were measured at 100% (⁄Ω¡§ to 5) and 100% (7, 10) power factors on AC, and a time constant less than 1ms. on D.C.
2. I2t was measured at 50 amps 125 VAC, .95PF, (random closing angle) and 300 amps 125 VDC, TC <1ms. for ⁄Ω¡§ through 5 amps and 50 amps 60 VAC, .95PF, (random
closing angle), and 300 amps 90 VDC, TC <1ms. for the 7 and 10 amp fuses.
Note: All values shown above are typical.
⁄Ω¡§
⁄Ω•
⁄Ω¢
‹Ω•
⁄Ω™
‹Ω¢
1
1⁄Ω™
2
2⁄Ω™
3
3⁄Ω™
4
5
7
10
*Approvals:
12-21-98
SB98107
Rev. A
Form No. MCR
Page 1 of 2
BIF Doc #2003
Bussmann®
Microtron® Printed Circuit Board Fuses
MCR
.122∑ ≈ .297∑ (3.10mm ≈ 7.54mm)
R
Typical Voltage Drop (At 25° C Ambient Temperature)
0.25
Voltage Drop
0.2
MCR-1⁄Ω™
MCR-2
MCR-2⁄Ω™
MCR-3
MCR-3⁄Ω™
MCR-5
MCR-10
MCR-4
MCR-7
0.15
0.1
0.05
0
10% 20% 30% 40% 50% 60% 70% 80% 90% 100%
Percent of Rated Curent
Voltage Drop
MCR-1
2
MCR-⁄Ω¡§
1.8
1.6
1.4
1.2
MCR-⁄Ω¢
1
MCR-‹Ω•
0.8
MCR-⁄Ω•
MCR-⁄Ω™
0.6
MCR-‹Ω¢
0.4
0.2
0
10% 20% 30% 40% 50% 60% 70% 80% 90% 100%
Percent of Rated Current
Microtron fuses are designed to meet the following specifications:
Body
High temperature thermoplastic,
flammability rating UL 94 VO.
Electrical Characteristics Carry 100% rated current for 4 hours
minimum. Open at 250% of rated
current in 5 seconds maximum.
Resistance to
Soldering Heat
MIL-STD-202, Method 210, Test
Condition C (260°C).
Salt Spray
MIL-STD-202, Method 101, Test
Condition B.
Shock
MIL-STD-202, Method 213, Test
Condition I, 100G’s for 6 milliseconds.
Element
Solid Matrix, gold or silver element
encapsulated in ceramic.
Solderability
MIL-STD-202, Method 208.
Leads
Tin-plated copper, .64mm (.025∑)
diameter.
Terminal Strength
Lead Bend Test
With a two pound weight attached, 90°
one direction, back to original position,
then 90° opposite direction; fuse will
withstand two cycles.
MIL-STD-202, Method 211, Test
Condition A, will withstand 7 lb. axial pull
test.
Thermal Shock
MIL-STD-202, Method 107, Test
Condition B, -65°C to 125°C.
Thermal Cycle
EIA-STD-RS-186-C, Test Condition A,
-55°C to 85°C.
Vibration
MIL-STD-202, Method 204, Test
Condition C, (55 to 2000 HZ, 10G’s
peak).
Wave Soldering
Maximum reservoir temperature 260°C,
10 second maximum exposure, .125"
from body.
Life Test
2000 hours at 80% rated current,
55°C.
Moisture Resistance
MIL-STD-202, Method 106, 90%
relative humidity at 65°C.
Operating Temperature
-55°C to 125°C with proper fuse
derating.
Packaging
EIA-STD-296-E.
The only controlled copy of this BIF document is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin
is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
12-21-98
SB98107
Rev. A
Form No. MCR
Page 2 of 2
BIF Doc #2003