UBA2035 HF full bridge control IC for HID lighting Rev. 01 — 31 October 2008 Product data sheet 1. General description The UBA2035 is a high voltage monolithic Integrated Circuit (IC) manufactured in a High Voltage Silicon On Insulator (HVSOI) process. This circuit is designed for driving MOSFETs in a full bridge configuration. In addition, it features a disable function, an internal adjustable oscillator and an external clock input function with a high-voltage level shifter for driving the bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal can be passed through a divider before being fed to the output drivers. The UBA2035 is especially suitable for High Intensity Discharge (HID) lamp drivers for projectors and general lighting applications for which a small non-overlap time is required. 2. Features n n n n n n n n n n Full bridge driver circuit Integrated bootstrap diodes 550 V series regulator input to make the internal supply 550 V maximum bridge voltage Accurate bridge disable function Input for start-up delay Adjustable oscillator frequency Selectable frequency divider Predefined bridge position during start-up A fixed non-overlap (< 200 ns) 3. Applications n The UBA2035 can drive (via the power MOSFETs) any kind of load in a full bridge configuration n The circuit is especially designed as a commutator controller for high intensity discharge lamps in projectors and general lighting applications 4. Ordering information Table 1. Ordering information Type number UBA2035TS Package Name Description Version SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 5. Block diagram VSS(CLK) CLK 1 VDD(CLK) 3 2 16 FSL HIGHER LEFT DRIVER 15 GHL 6 HV 17 14 STABILIZER SGND VDD RC 27 LOGIC SIGNAL GENERATOR 9 13 HIGH VOLTAGE LEVEL SHIFTER HIGHER RIGHT DRIVER 28 26 UBA2035TS OSCILLATOR LOWER RIGHT DRIVER ÷2 23 21 SU BD 10 12 LOW VOLTAGE LEVEL SHIFTER LOGIC LOWER LEFT DRIVER 20 SHL FSR GHR SHR GLR PGND GLL 1.29 V bridge disable 11 DD Fig 1. 4, 5, 7, 8, 18, 19, 22, 24, 25 n.c. 014aaa629 Block diagram UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 2 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 6. Pinning information 6.1 Pinning VSS(CLK) 1 28 GHR CLK 2 27 FSR VDD(CLK) 3 26 SHR n.c. 4 25 n.c. n.c. 5 24 n.c. HV 6 23 GLR n.c. 7 n.c. 8 VDD 9 20 GLL SU 10 19 n.c. DD 11 18 n.c. BD 12 17 SHL RC 13 16 FSL SGND 14 15 GHL UBA2035TS 22 n.c. 21 PGND 014aaa630 Fig 2. Pinning diagram 6.2 Pin description Table 2. Symbol Pin description Pin UBA2035TS Description VSS(CLK) 1 negative supply voltage for logic oscillator input CLK 2 oscillator input VDD(CLK) 3 positive supply voltage for logic oscillator input n.c. 4 not connected n.c. 5 not connected HV 6 high voltage supply input for internal series regulator n.c. 7 not connected n.c. 8 not connected VDD 9 internal low voltage supply SU 10 input for start-up delay DD 11 input for divider disable BD 12 input for bridge disable RC 13 RC input for internal oscillator SGND 14 signal ground GHL 15 gate driver output for upper left MOSFET FSL 16 floating supply left SHL 17 source upper left MOSFET n.c. 18 not connected UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 3 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting Table 2. Pin description …continued Symbol Pin UBA2035TS Description n.c. 19 not connected GLL 20 gate driver output for lower left MOSFET PGND 21 power ground n.c. 22 not connected GLR 23 gate driver output for lower right MOSFET n.c. 24 not connected n.c. 25 not connected SHR 26 source upper right MOSFET FSR 27 floating supply right GHR 28 gate driver upper right MOSFET 7. Functional description 7.1 Supply voltage The UBA2035 is powered by a supply voltage applied to pin HV, e.g., the supply voltage of the full bridge. The IC generates its own low supply voltage for its internal circuitry. Therefore an additional low voltage supply is not required. A capacitor has to be connected to pin VDD to obtain a ripple-free internal supply voltage. The circuit can also be powered by a low voltage supply directly applied to pin VDD. In this case pin HV should be connected to pin VDD or pin SGND. The maximum current that the internal series regulator can deliver, is temperature dependent. See Figure 3. 7.2 Start-up With an increasing supply voltage the IC enters the start-up state i.e. the upper power transistors are set in off-state and the lower power transistors are switched on. During the start-up state the bootstrap capacitors are charged. The start-up state is defined until VVDD = Vstartup(VDD) or VHV = Vstartup(HV). The state of the outputs during the start-up phase is overruled by the bridge disable function. 7.3 Oscillation state As soon as the supply voltage on pin VDD exceeds Vstartup(VDD) or the supply voltage on pin HV exceeds Vstartup(HV), the output voltage of the full bridge depends on the control signals on pins CLK, SU, DD and BD. This is listed in Table 3. As soon as the supply voltage on pin VDD becomes lower than VUVLO(VDD) or the supply voltage on pin HV becomes lower than VUVLO(HV), the IC enters the start-up state again. UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 4 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting Table 3. Driver Gate driver output voltages as function of the logical levels at the pins BD, SU, DD and CLK. Device state BD SU DD CLK GHL GHR GLL GLR Start-up state 1 - - - 0 (= VSHL) 0 (= VSHR) 0 (= VPGND) 0 (= VPGND) 0 - - - 0 (= VSHL) 0 (= VSHR) 1 (= VVDD) 1 (= VVDD) 1 - - - 0 (= VSHL) 0 (= VSHR) 0 (= VPGND) 0 (= VPGND) 0 0 - - 0 (= VSHL) 0 (= VSHR) 1 (= VVDD) 1 (= VVDD) 0 1 1 1 0 (= VSHL) 1 (= VFSR) 1 (= VVDD) 0 (= VPGND) 0 1 1 0 1 (= VFSL) 0 (= VSHR) 0 (= VPGND) 1 (= VVDD) 1 0[1] 1→ GHL GHR GLL Oscillation state 0 0[2] GLR [1] If pin DD = 0 the bridge enters the state (oscillation state and pin BD = 0 and pin SU = 1) in the predefined position: VGHL = VFSL, VGLR = VVDD, VGLL = VPGND and VGHR = VSHR. [2] Only if the level of pin CLK changes from logical 1 to 0, the level of outputs GHL, GHR, GLL and GLR changes. If there is no external clock available, the internal oscillator can be used. The design equation for the bridge oscillator frequency is shown in Equation 1. 1 f bridge = --------------------------------------------K osc × R osc × C osc (1) Rosc and Cosc are external components connected to the RC pin (Rosc connected to pin VDD and Cosc connected to pin SGND). In this situation the pins VDD(CLK), CLK, and VSS(CLK) can be connected to SGND. The clock signal, either coming from pin RC or pin CLK, can be divided by two in order to obtain a 50 % duty cycle gate drive signal. This can be achieved by applying a voltage to the DD input lower than VIL(DD) (e.g. connect pin DD to pin SGND). 7.4 Non-overlap time In the full bridge configuration the non-overlap time is defined as the time between turning off the two conducting MOSFETs and turning on the two other MOSFETs. The (very small) non-overlap time is internally fixed to tno, which allows a HID system to operate with a very small phase angle between the load current and the full bridge voltage (pins SHL and SHR). This can be beneficial for HID systems in which the lamp is ignited via a resonance network. 7.5 Start-up delay A simple resistor-capacitor (RC) filter (R between pin VDD and pin SU; C between pin SU and pin SGND) or a control signal from a processor can be used to create a start-up delay. This can be beneficial for those applications in which building up the high voltage takes more time. A start-up delay will ensure that the HID system will not start up before this high voltage has been reached. UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 5 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 7.6 Bridge disable The bridge disable function can be used to switch off all MOSFETs as soon as the voltage on pin BD exceeds the bridge disable voltage VBD. The bridge disable function overrules all the other states. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to signal ground (pin 14); positive currents flow into the chip. The voltage ratings are valid provided other ratings are not violated. Symbol Parameter Conditions Min Max Unit General Tamb ambient temperature −40 +125 °C Tj junction temperature −40 +150 °C Tstg storage temperature −55 +150 °C VVDD voltage on pin VDD 0 14 V VHV voltage on pin HV 0 550 V VSHL voltage on pin SHL with respect to PGND and SGND −3 +550 V VSHR voltage on pin SHR with respect to PGND and SGND −3 +550 V VFSL voltage on pin FSL with respect SHL 0 14 V VFSR voltage on pin FSR with respect SHR 0 14 V VGHL voltage on pin GHL VSHL VFSL V VGHR voltage on pin GHR VSHR VFSR V VGLL voltage on pin GLL VPGND VVDD V VGLR voltage on pin GLR VPGND VVDD V VPGND voltage on pin PGND 0 5 V Voltages VSS(CLK) CLK ground supply voltage −0.9 14 V VDD(CLK) CLK supply voltage with respect to VSS(CLK) 0 14 V VI input voltage pin CLK; with respect to VSS(CLK) 0 14 V pins RC, SU, BD, and DD 0 VVDD V slew rate pins SHL and SHR - 4 V/ns oscillator resistance connected between pins VDD and RC 100 - kΩ electrostatic discharge voltage human body model: HV, VSS(CLK), VDD(CLK),CLK, FSL, FSR, GHL, GHR, SHL, SHR - 900 V other pins SR Currents Rosc ESD VESD - 2 kV machine model; all pins - 200 V charged device model; all pins - 500 V UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 6 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 9. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 100 K/W 10. Characteristics Table 6. Characteristics Tj = 25 °C; all voltages are measured with respect to signal ground (pin 14); currents are positive when flowing into the IC, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit leakage current pin HV; IHV (VHV = 565 V) − IHV (VHV = 500 V) - - 5 µA pin FSL; VFSL = VSHL = VGHL = 564 V - - 5 µA pin FSR; VFSR = VSHR = VGHR = 564 V - - 5 µA VHV = 80 V - 590 825 µA High voltage Ileak Start-up via HV pin II(HV) input current on pin HV Vstartup(HV) start-up voltage on pin HV 11.3 13.2 14.7 V VUVLO(HV) undervoltage lockout voltage on pin HV 8.6 10.7 12.2 V Vhys hysteresis voltage 2 2.5 3 V VVDD voltage on pin VDD 10.5 12 13.5 V VHV = 20 V Start-up via VDD pin II(VDD) input current on pin VDD - 500 800 µA Vstartup(VDD) start-up voltage on pin VDD 8.25 9.0 9.75 V VUVLO(VDD) undervoltage lockout voltage on pin VDD 5.75 6.5 7.25 V Vhys hysteresis voltage 2 2.5 3 V GHR and GHL drivers; VFSL = VFSR = 12 V; VSHL = VSHR = 0 V; IGHL = IGHR = −50 mA - 20 42 Ω GLR and GLL drivers; VVDD = 12 V; VPGND = 0 V; IGLL = IGLR = −50 mA - 20 42 Ω GHR and GHL drivers; VFSL = VFSR = 12 V; VSHL = VSHR = 0 V; IGHL = IGHR = 50 mA - 12 26 Ω GLR and GLL drivers; VVDD = 12 V; VPGND= 0 V; IGLL = IGLR = 50 mA - 12 26 Ω VVDD = 8.25 V gate drivers Ron Roff on-state resistance off-state resistance UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 7 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting Table 6. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to signal ground (pin 14); currents are positive when flowing into the IC, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IO(source) output source current VFSL = VFSR = VVDD = 12 V; VSHL = VSHR = 0 V; VGHL = VGHR = VGLL = VGLR = 8 V - 200 - mA IO(sink) output sink current VFSL = VFSR = VVDD = 12 V; VSHL = VSHR = 0 V; VGHL = VGHR = VGLL = VGLR = 8 V - 200 - mA Vd(bs) bootstrap diode voltage current on diode = 20 mA - 2.3 - V tno non-overlap time - 80 250 ns VUVLO undervoltage lockout voltage high side driver - 4.0 5.5 V IFS current on pin FS VFSL = VFSR = 12 V; VSHL = VSHR = 0 V 2 4 6 µA VIH(DD) HIGH-level input voltage on pin DD VVDD = 12 V 6 4.5 - V VIL(DD) LOW-level input voltage on VVDD = 12 V pin DD - - 3 V II input current VVDD = 12 V - 0 1 µA Vstartup start-up voltage VVDD = 12 V 1 1.3 1.5 V Vhys hysteresis voltage VVDD = 12 V - 100 - mV II input current VVDD = 12 V - 0 1 µA VIH(CLK) HIGH-level input voltage on pin CLK VSS(CLK) = 0 V; VDD(CLK) = 12 V 0.9 1.6 2.7 V Vhys hysteresis voltage VSS(CLK) = 0 V; VDD(CLK) = 12 V - 100 - mV II input current - 0 1 µA fbridge bridge frequency - - 250 kHz DD input SU input CLK input VRC = 0 V supply for CLK IDD(CLK) CLK supply current VSS(CLK) = 0 V; VDD(CLK) = 14 V - 420 625 µA VDD(CLK) CLK supply voltage VSS(CLK) = 0 V 5.75 - 14 V BD input VBD voltage on pin BD 1.23 1.29 1.35 V II input current - 0 1 µA kHz Internal oscillator fosc(int) internal oscillator frequency VCLK = 0 V; VSS(CLK) = 0 V - - 100 Kosc oscillator constant fbridge = 500 Hz 0.89 0.97 1.05 UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 8 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 014aaa631 12 II(pin HV) (µA) 8 (1) (2) 4 (3) 0 0 200 400 600 VHV (V) (1) Temperature = −25 °C (2) Temperature = 25 °C (3) Temperature = 125 °C Fig 3. Typical II (pin HV) when VDD connected to SGND, as function of VHV and temperature UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 9 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 11. Package outline SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm D SOT341-1 E A X c HE y v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.1 0.7 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT341-1 Fig 4. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Package outline SSOP28 (SOT341-1) UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 10 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 12. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes UBA2035_1 20081031 Product data sheet - - UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 11 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] UBA2035_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 31 October 2008 12 of 13 UBA2035 NXP Semiconductors HF Full bridge control IC for HID lighting 15. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4 Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Oscillation state . . . . . . . . . . . . . . . . . . . . . . . . 4 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 5 Start-up delay . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Bridge disable . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 31 October 2008 Document identifier: UBA2035_1