UMA4NT1, UMA6NT1 Preferred Devices Dual Common Emitter Bias Resistor Transistors PNP Silicon Surface Mount Transistors with Monolithic Bias Resistor Network http://onsemi.com The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base–emitter resistor. These digital transistors are designed to replace a single device and its external resistor bias network. The BRT eliminates these individual components by integrating them into a single device. In the UMC2NT1 series, two BRT devices are housed in the SOT–353 package which is ideal for low power surface mount applications where board space is at a premium. • • • • 3 2 1 R1 R1 Q1 Q2 4 5 Simplifies Circuit Design Reduces Board Space Reduces Component Count Available in 8 mm, 7 inch/3000 Unit Tape and Reel MARKING DIAGRAM 5 MAXIMUM RATINGS (TA = 25°C unless otherwise noted, common for Q1 and Q2, – minus sign for Q1 (PNP) omitted) Rating Ux Symbol Value Unit Collector-Base Voltage VCBO 50 Vdc Collector-Emitter Voltage VCEO 50 Vdc IC 100 mAdc RθJA 833 °C/W TJ, Tstg –65 to +150 °C PD *150 mW Collector Current 4 SC–88A/SOT–353 CASE 419A STYLE 7 1 2 3 Ux = Device Marking x = 0 or 1 THERMAL CHARACTERISTICS Thermal Resistance – Junction-to-Ambient (surface mounted) Operating and Storage Temperature Range Total Package Dissipation @ TA = 25°C (Note 1.) ORDERING INFORMATION Device Package Shipping UMA4NT1 SOT–323 3000/Tape & Reel UMA6NT1 SOT–323 3000/Tape & Reel DEVICE MARKING AND RESISTOR VALUES Device UMA4NT1 UMA6NT1 Marking R1 (K) R2 (K) U0 U1 10 47 ∞ ∞ Preferred devices are recommended choices for future use and best overall value. 1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. Semiconductor Components Industries, LLC, 2001 April, 2001 – Rev. 1 1 Publication Order Number: UMA4NT1/D UMA4NT1, UMA6NT1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO – – 100 nAdc Collector-Emitter Cutoff Current (VCB = 50 V, IB = 0) ICEO – – 500 nAdc Emitter-Base Cutoff Current (VEB = 6.0, IC = 5.0 mA) IEBO – – – – 0.9 0.2 mAdc Collector-Base Breakdown Voltage (IC = 10 µA, IE = 0) V(BR)CBO 50 – – Vdc Collector-Emitter Breakdown Voltage (IC = 2.0 mA, IB = 0) V(BR)CEO 50 – – Vdc hFE 160 160 250 250 – – VCE(SAT) – – 0.25 Vdc Output Voltage (on) (VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k) VOL – – 0.2 Vdc Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k) VOH 4.9 – – Vdc R1 7.0 33 10 47 13 61 k OFF CHARACTERISTICS UMA4NT1 UMA6NT1 ON CHARACTERISTICS DC Current Gain (VCE = 10 V, IC = 5.0 mA) UMA4NT1 UMA6NT1 Collector–Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) UMA4NT1 UMA6NT1 PD , POWER DISSIPATION (MILLIWATTS) Input Resistor 250 200 150 100 50 0 –50 RθJA = 833°C/W 0 50 100 TA, AMBIENT TEMPERATURE (°C) Figure 1. Derating Curve http://onsemi.com 2 150 UMA4NT1, UMA6NT1 10 1000 IC/IB = 10 25°C hFE, DC CURRENT GAIN VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS) Typical Electrical Characteristics – UMA4NT1 TA = 75°C 1 –25°C 0.1 –25°C 100 25°C 10 VCE = 10 V 1 0.01 0 10 20 30 40 50 60 IC, COLLECTOR CURRENT (mA) 70 80 1 10 100 IC, COLLECTOR CURRENT (mA) Figure 2. VCE(sat) versus IC 100 IC, COLLECTOR CURRENT (mA) f = 1 MHz IE = 0 mA TA = 25°C 10 8 6 4 2 0 1000 Figure 3. DC Current Gain 12 Cob, CAPACITANCE (pF) TA = 75°C 0 5 10 15 20 25 30 40 35 VR, REVERSE BIAS VOLTAGE (VOLTS) 10 75°C 25°C 0.1 0.01 45 TA = –25°C 1 VO = 5 V 0 Figure 4. Output Capacitance 1 2 3 4 VIN, INPUT VOLTAGE (VOLTS) 5 6 Figure 5. Output Current versus Input Voltage http://onsemi.com 3 UMA4NT1, UMA6NT1 10 1000 IC/IB = 10 25°C 1 hFE, DC CURRENT GAIN VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS) Typical Electrical Characteristics – UMA6NT1 –25°C TA = 75°C 0.1 25°C –25°C 100 VCE = 10 V 10 0.01 0 10 20 30 40 50 IC, COLLECTOR CURRENT (mA) 60 1 10 IC, COLLECTOR CURRENT (mA) Figure 6. VCE(sat) versus IC 100 IC, COLLECTOR CURRENT (mA) f = 1 MHz IE = 0 mA TA = 25°C 10 8 6 4 2 0 100 Figure 7. DC Current Gain 12 Cob, CAPACITANCE (pF) TA = 75°C 0 5 10 15 20 25 30 40 35 VR, REVERSE BIAS VOLTAGE (VOLTS) 75°C 10 1 25°C 0.1 0.01 0.001 45 TA = –25°C VO = 5 V 0 Figure 8. Output Capacitance 1 2 3 4 VIN, INPUT VOLTAGE (VOLTS) Figure 9. Output Current versus Input Voltage http://onsemi.com 4 5 UMA4NT1, UMA6NT1 INFORMATION FOR USING THE SOT–353 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. SOT–353 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.65 mm 0.65 mm 0.4 mm (min) 0.5 mm (min) 1.9 mm SOT–353 POWER DISSIPATION one can calculate the power dissipation of the device which The power dissipation of the SOT–353 is a function of in this case is 150 milliwatts. the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power 150°C – 25°C PD = = 150 milliwatts dissipation. Power dissipation for a surface mount device is 833°C/W determined by TJ(max), the maximum rated junction The 833°C/W for the SOT–353 package assumes the use temperature of the die, RθJA, the thermal resistance from of the recommended footprint on a glass epoxy printed the device junction to ambient; and the operating circuit board to achieve a power dissipation of 150 temperature, TA. Using the values provided on the data milliwatts. There are other alternatives to achieving higher sheet, PD can be calculated as follows: power dissipation from the SOT–353 package. Another TJ(max) – TA alternative would be to use a ceramic substrate or an PD = RθJA aluminum core board such as Thermal Clad. Using a The values for the equation are found in the maximum board material such as Thermal Clad, an aluminum core ratings table on the data sheet. Substituting these values board, the power dissipation can be doubled using the same into the equation for an ambient temperature TA of 25°C, footprint. SOLDERING PRECAUTIONS • The soldering temperature and time should not exceed The melting temperature of solder is higher than the rated 260°C for more than 10 seconds. temperature of the device. When the entire device is heated • When shifting from preheating to soldering, the to a high temperature, failure to complete soldering within maximum temperature gradient should be 5°C or less. a short time could result in device failure. Therefore, the • After soldering has been completed, the device should following items should always be observed in order to be allowed to cool naturally for at least three minutes. minimize the thermal stress to which the devices are Gradual cooling should be used as the use of forced subjected. cooling will increase the temperature gradient and • Always preheat the device. result in latent failure due to mechanical stress. • The delta temperature between the preheat and • Mechanical stress or shock should not be applied soldering should be 100°C or less.* during cooling. • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum * Soldering a device without preheating can cause temperature ratings as shown on the data sheet. When excessive thermal shock and stress which can result in using infrared heating with the reflow soldering damage to the device. method, the difference should be a maximum of 10°C. http://onsemi.com 5 UMA4NT1, UMA6NT1 SOLDER STENCIL GUIDELINES or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass TYPICAL SOLDER HEATING PROFILE The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177–189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 10 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. STEP 1 PREHEAT ZONE 1 RAMP" 200°C 150°C STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SPIKE" SOAK" 205° TO 219°C PEAK AT SOLDER JOINT 170°C 160°C 150°C 140°C 100°C 100°C 50°C STEP 6 STEP 7 VENT COOLING SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES TMAX TIME (3 TO 7 MINUTES TOTAL) Figure 10. Typical Solder Heating Profile http://onsemi.com 6 UMA4NT1, UMA6NT1 PACKAGE DIMENSIONS SC–88A/SOT–353 CASE 419A–01 ISSUE E A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. V 5 DIM A B C D G H J K N S V 4 –B– S 1 2 3 D 5 PL 0.2 (0.008) M B M N J C H K http://onsemi.com 7 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 STYLE 7: PIN 1. 2. 3. 4. 5. BASE 2 EMITTER 1, 2 BASE 1 COLLECTOR 1 COLLECTOR 2 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40 UMA4NT1, UMA6NT1 Thermal Clad is a trademark of the Bergquist Company ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. 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