DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC29L00 Series THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR DESCRIPTION µPC29L00 Series are low dropout regulators which have 100 mA capable for the output current. The variation of output voltage is 3 V, 3.3 V, 4 V and 5 V. FEATURES CONNECTION DIAGRAM • Low dropout voltage. VDIF ≤ 0.3 V (TOP VIEW) • Built-in overcurrent protection circuit. µPC29L00J Series • Built-in thermal shut-down circuit. 1 ORDERING INFORMATION Output Voltage 3V 3.3 V 4V 5V Type Number 3 Package µPC29L03J TO-92 µPC29L03T SOT-89 µPC29L33J TO-92 µPC29L33T SOT-89 µPC29L04J TO-92 µPC29L04T SOT-89 µPC29L05J TO-92 µPC29L05T SOT-89 OUTPUT GND INPUT µPC29L00T Series GND 1 OUTPUT Document No. G10354EJ2V0DS00 (2nd edition) Date Published December 1995 P Printed in Japan 2 2 GND 3 INPUT © 1995 µPC29L00 Series BLOCK DIAGRAM INPUT Reference voltage Error amplifier Drive circuit OUTPUT Thermal shut down Start-up circuit Over-current protection GND 2 µPC29L00 Series ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C, Unless otherwise specified.) PARAMETER SYMBOL Input Voltage VIN Internal Power Dissipation PT RATING UNIT 16 J 700 Note 1 T 400 Note 1 V mW 2000 Note 1, 2 Operating Ambient Temperature Range TA –30 to +85 ˚C Operating Junction Temperature Range TJ –30 to +150 ˚C Storage Temperature Range Tstg –55 to +150 ˚C Thermal Resistance (Junction to Case) Rth(J - C) Thermal Resistance (Junction to Ambient) Rth(J - A) J – T 30 J 180 T 315 ˚C/W ˚C/W 62.5 Note 2 Notes 1. TA ≤ 25 ˚C 2. With the 16 cm2 × 0.7 mm ceramic substrate TYPICAL CONNECTION D1 µ PC29L00 INPUT OUTPUT + CIN CIN COUT D2 : 0.1 to 0.47 µF. COUT : More than 10 µF. D1 : Need for VO > VIN. D2 : Need for VO < GND. RECOMMENDED OPERATING CONDITIONS PARAMETER Input Voltage SYMBOL VIN TYPE NUMBER MIN. TYP. MAX. UNIT V µPC29L03 3.5 9 µPC29L33 3.8 9 µPC29L04 4.5 12 µPC29L05 5.5 12 Output Current IO All 0 40 mA Operating Ambient Temperature Range TA All –30 +85 ˚C Operating Junction Temperature Range TJ All –30 +125 ˚C 3 µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L03 (VIN = 4 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage Line Regulation Load Regulation Quiescent Current TEST CONDITIONS VO REGIN REGL IBIAS MIN. TYP. MAX. 2.88 3.0 3.12 3.5 V ≤ VIN ≤ 9 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 2.85 3.15 4.5 V ≤ VIN ≤ 5.5 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 2.85 3.15 UNIT V 3.5 V ≤ VIN ≤ 12 V 4 50 3.5 V ≤ VIN ≤ 9 V 2 20 1 mA ≤ IO ≤ 100 mA 37 50 1 mA ≤ IO ≤ 40 mA 15 20 IO = 0 1.5 2.0 mA IO = 100 mA 10 20 mA 6 20 mA 1.0 mA mV mV Start-up Current IBIAS(S) IO = 0 mA, before VO regulation Quiescent Current Change ∆IBIAS 4 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz Ripple Rejection R·R f = 120 Hz, 4 V ≤ VIN ≤ 9 V Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 Peak Output Current IOpeak VIN = 5 V 190 mA Short Circuit Current IOshort VIN = 12 V 100 mA Temperature Coefficient of ∆VO/∆T IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C –0.5 mV/˚C Output Voltage 4 SYMBOL 48 25 µVrms 66 dB 0.3 V µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L33 (VIN = 5 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage Line Regulation Load Regulation Quiescent Current SYMBOL TEST CONDITIONS VO REGIN REGL IBIAS MIN. TYP. MAX. 3.17 3.3 3.43 3.8 V ≤ VIN ≤ 10 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 3.14 3.46 4.5 V ≤ VIN ≤ 5.5 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 3.14 3.46 UNIT V 3.8 V ≤ VIN ≤ 12 V 4 50 3.8 V ≤ VIN ≤ 9 V 2 20 1 mA ≤ IO ≤ 100 mA 37 50 1 mA ≤ IO ≤ 40 mA 16 20 IO = 0 1.5 2.0 mA IO = 100 mA 10 20 mA 19 30 mA 1.0 mA mV mV Start-up Current IBIAS(S) IO = 0 mA, before VO regulation Quiescent Current Change ∆IBIAS 4.3 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz Ripple Rejection R·R f = 120 Hz, 4.3 V ≤ VIN ≤ 9 V Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 Peak Output Current IOpeak VIN = 5 V 190 mA Short Circuit Current IOshort VIN = 12 V 100 mA Temperature Coefficient of ∆VO/∆T IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C –0.6 mV/˚C 48 28 µVrms 65 dB 0.3 V Output Voltage 5 µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L04 (VIN = 6 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage TEST CONDITIONS VO MIN. TYP. MAX. 3.84 4.0 4.16 4.5 V ≤ VIN ≤ 12 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 3.80 4.20 VIN = 6 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 3.80 4.20 UNIT V Line Regulation REGIN 4.5 V ≤ VIN ≤ 12 V 4 30 mV Load Regulation REGL 1 mA ≤ IO ≤ 100 mA 33 60 mV 1 mA ≤ IO ≤ 40 mA 14 30 IO = 0 1.6 2.0 mA IO = 100 mA 10 20 mA 20 50 mA 1.0 mA Quiescent Current 6 SYMBOL IBIAS Start-up Current IBIAS(S) IO = 0 mA, before VO regulation Quiescent Current Change ∆IBIAS 4.5 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz Ripple Rejection R·R f = 120 Hz, 5 V ≤ VIN ≤ 10 V Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 Peak Output Current IOpeak VIN = 6 V 220 mA Short Circuit Current IOshort VIN = 12 V 100 mA Temperature Coefficient of Output Voltage ∆VO/∆T IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.2 mV/˚C 47 35 µVrms 65 dB 0.3 V µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L05 (VIN = 6 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage SYMBOL TEST CONDITIONS VO MIN. TYP. MAX. 4.8 5.0 5.2 5.5 V ≤ VIN ≤ 12 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 4.75 5.25 VIN = 6 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 4.75 5.25 UNIT V Line Regulation REGIN 5.5 V ≤ VIN ≤ 12 V 4 30 mV Load Regulation REGL 1 mA ≤ IO ≤ 100 mA 35 80 mV 1 mA ≤ IO ≤ 40 mA 15 30 IO = 0 1.6 2.0 mA IO = 100 mA 10 20 mA 50 90 mA 1.0 mA Quiescent Current IBIAS Start-up Current IBIAS(S) IO = 0 mA, before VO regulation Quiescent Current Change ∆IBIAS 6 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz Ripple Rejection R·R f = 120 Hz, 6 V ≤ VIN ≤ 11 V Dropout Voltage VDIF IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.15 Peak Output Current IOpeak VIN = 7 V 210 mA Short Circuit Current IOshort VIN = 12 V 100 mA Temperature Coefficient of Output Voltage ∆VO/∆T IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 0.2 mV/˚C 46 40 µVrms 62 dB 0.3 V 7 µPC29L00 Series TYPICAL CHARACTERISTICS VO - VIN ( µPC29L03) Pd - TA 5 µ PC29L00T 62.5 ˚C/W (With the 16 cm2 × 0.7 mm ceramic substrate) 1500 TA = 25 ˚C VO - Output Voltage - V Pd - Power Dissipation - mW 2000 1000 700 500 400 85 ˚C µPC29L00J 180 ˚C/W µPC29L00T 4 IO = 0 mA 40 mA 3 100 mA 2 1 315 ˚C/W 0 0 50 100 0 150 4 6 8 10 IBIAS (IBIAS(S)) - VIN ( µ PC29L05) 16 60 TJ = 25 ˚C 50 40 30 IO = 100 mA IO = 40 mA IO = 0 20 10 0 2 4 6 40 30 20 IO = 100 mA 10 0 10 8 TJ = 25 ˚C 50 IO = 40 mA IO = 0 0 2 4 6 10 VDIF - IO 0.5 0.5 IO = 40 mA 0.3 µ PC29L03 0.2 0.1 µ PC29L05 0 50 TJ = 25 ˚C VDIF - Dropout Voltage - V 0.4 0 –20 8 VIN - Input Voltage - V VDIF - TJ VDIF - Dropout Voltage - V 14 IBIAS (IBIAS(S)) - VIN ( µ PC29L03) VIN - Input Voltage - V 100 TJ - Junction Temperature - ˚C 8 12 VIN - Input Voltage - V IBIAS - Quiescent Current - mA IBIAS - Quiescent Current - mA 2 TA - Ambient Temperature - ˚C 60 0 0 150 0.4 0.3 0.2 0.1 0 0 20 40 60 80 IO - Output Current - mA 100 µPC29L00 Series TYPICAL CHARACTERISTICS ∆ VO - TJ ( µ PC29L03) R·R - Ripple Rejection - dB 100 TJ = 25 ˚C ∆VIN = 5 V IO = 40 mA 80 µPC29L03 60 µPC29L05 40 20 0 10 100 1k 10 k ∆ VO - Output Voltage Deviation - mV R·R - f 100 k 50 VIN = 4 V IO = 5 mA 0 –50 –100 0 150 ∆ VO - TJ ( µ PC29L04) 50 ∆ VO - Output Voltage Deviation - mV ∆ VO - Output Voltage Deviation - mV ∆ VO - TJ ( µ PC29L33) VIN = 5 V IO = 5 mA 0 –50 –100 50 100 TJ - Junction Temperature - ˚C f - Frequency - Hz 0 50 100 150 TJ - Junction Temperature - ˚C 50 0 –50 VIN = 6 V IO = 5 mA –100 0 50 100 150 TJ - Junction Temperature - ˚C ∆ VO - Output Voltage Deviation - mV ∆ VO - TJ ( µPC29L05) 50 0 –50 VIN = 6 V IO = 5 mA –100 0 50 100 150 TJ - Junction Temperature - ˚C 9 µPC29L00 Series PACKAGE DIMENSIONS (Unit: mm) µPC29L00J Series 3PIN PLASTIC SIP (TO-92) 10 µPC29L00 Series µPC29L00T Series SOT-89 0.42 ±0.06 0.47 1.5 ±0.06 3.0 4.0±0.25 1.5±0.1 2.5±0.1 0.8 MIN. 4.5±0.1 1.6±0.2 0.42±0.06 0.41+0.03 –0.05 11 µPC29L00 Series RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF THROUGH HOLE MOUNT DEVICE µPC29L00J Series Soldering Process Wave soldering Soldering Conditions Symbol Solder temperature: 260 ˚C or below. Flow Time: 10 seconds or below. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “Semiconductor Device Mounting Manual” (IEI-1207). µPC29L00T Series Soldering Process Soldering Conditions Symbol Infrared ray reflow Peak package’s temperature: 235 ˚C or below. Reflow time: 30 seconds or below (210 ˚C or higher). Number of flow process: 2. Exposure limit Note: None. IR35-00-2 Vapor phase soldering Peak package’s temperature: 215 ˚C or below. Reflow time: 40 seconds or below (200 ˚C or higher). Number of flow process: 2. Exposure limit Note: None. VP15-00-2 Wave soldering Solder temperature: 260 ˚C or below. Flow time: 10 seconds or below. Number of flow process: 1. Exposure limit Note: None. WS60-00-1 Note Exposure limit before soldering after dry-pack package is opened. Remark Storage conditions: 25 ˚C and relative humidity at 65 % or less. Caution Do not apply more than a single process at once, except for “Partial heating method”. REFERENCE Document Name Document No. NEC semiconductor device reliability/quality control system. IEI-1212 Quality grade on NEC semiconductor devices. IEI-1209 Semiconductor device mounting technology manual. IEI-1207 Semiconductor device package manual. IEI-1213 Guide to quality assurance for semiconductor devices. MEI-1202 Semiconductor selection guide. MF-1134 12 µPC29L00 Series [MEMO] 13 µPC29L00 Series No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11