DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC337 3-TERMINAL NEGATIVE ADJUSTABLE REGULATOR The µPC337 is an adjustable 3-terminal negative voltage regulator, which has 1.5 A capable for the output current. The output voltage can be set any value between –1.3 V and –30 V by two external resistors. FEATURES PIN CONFIGURATION (Marking Side) • Output current excess of 1.5 A • On-chip some protection circuit (over current protection, SOA protection and thermal shut down). ORDERING INFORMATION 1 Part Number Package µPC337HF 3-pin plastic SIP (MP-45G) (isolated TO-220) 2 1 : ADJ 2 : INPUT 3 : OUTPUT 3 EQUIVALENT CIRCUIT R3 R41 Q1 ADJ R2 Q2 R1 Q3 R42 R4 Q4 D7 Q8 Q5 Q13 R22 Q12 D4 R23 D5 Q14 R13 R14 Q15 D2 Q18 Q16 Q17 Q21 R21 Q20 R25 D3 D6 Q10 R29 R11 C5 R27 R35 R33 Q30 R37 Q31 R30 Q25 R31 Q26 R10 Q24 Q11 R18 R20 Q29 C4 Q23 Q9 R19 R7 R28 R26 Q22 Q19 Q7 R36 Q28 Q6 R17 R16 R15 R6 D1 R9 R8 C3 C2 R5 R24 OUTPUT C1 Q27 R34 R39 R38 R32 R40 INPUT The information in this document is subject to change without notice. Document No. G13783EJ2V0DS00 (2nd edition) (Previous No. IN-1878) Date Published October 1998 N CP(K) Printed in Japan The mark shows major revised points. © 1986 µPC337 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified.) Parameter Symbol Rating Unit Input-Output Voltage Differential VIN – VO –40 V Total Power Dissipation PT 15Note V Operating Ambient Temperature TA –20 to +85 °C Operating Junction Temperature TJ –20 to +150 °C Storage Temperature T stg –65 to +150 °C Thermal Resistance (junction to case) Rth(J-C) 7 °C/W Thermal Resistance (junction to ambient) Rth(J-A) 65 °C/W Note Internally limited. When operating junction temperature rise up to 150 °C (≤200 °C), the internal circuit shutdown output voltage. Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit V IN – VO –3 –5 –38.7 V Input Voltage VIN –4.3 –40 V Output Voltage VO –1.3 –30 V Output Current IO 0.01 1.5 A Operating Junction Temperature TJ –20 +125 °C Input-Output Voltage Differential 2 µPC337 TYPICAL CONNECTION D2 INPUT µ PC337 VIN OUTPUT VO D1 ADJ CIN 1µ F R1 120 Ω CADJ 10 µ F + CO 4.7 µ F R2 + Remark R1, R2 : Resistor to set the output voltage. VO = (1 + R2 R2 • ) • VREF + IADJ • R2 = ) • VREF • (1 + R1 R1 VO (V) R2 (Ω : TYP.) –1.25 0 –2.5 120 –5.0 360 –12 1032 –24 2184 –30 2760 CIN : Need to stop the oscillation for the long input wiring length. CO : Need to stop the oscillation for the long output wiring length. Improve the transient stability of the output voltage when the lord current is suddently changed. CADJ : Improve the ripple rejection and the oscillate rejection. D1 : Protect against CADJ from output short. D2 : Need for VIN > VO. 3 µPC337 ELECTRICAL CHARACTERISTICS (VIN – VO = –5 V, IO = 0.5 A, 0 °C ≤ TJ ≤ +125 °C, unless otherwise specified.) Parameter Line Regulation Symbol REGIN Conditions MIN. T J = 25 °C, 3 V ≤ | VIN – VO | ≤ 40 VNote 0 °C ≤ TJ ≤ 125 °C, 3 V ≤ | VIN – VO | ≤ 40 VNote Load Regulation Thermal Regulation REGL REGTH TYP. MAX. Unit 0.005 0.04 %/V 0.01 0.07 %/V T J = 25 °C, | VO | ≤ 5 V 30 50 mV 10 mA ≤ IO ≤ 1.5 ANote | VO | ≥ 5 V 0.6 1.0 % 0 °C ≤ TJ ≤ 125 °C, | VO | ≤ 5 V 45 70 mV 10 mA ≤ IO ≤ 1.5 ANote | VO | ≥ 5 V 0.9 1.5 % 0.005 0.04 %/W 60 100 µA 2 5 µA –1.25 –1.30 V T J = 25 °C, | VIN – VO | = 40 V, VO = –10 V, 0 A ≤ IO ≤ 0.25 A, t = 10 ms ADJ pin Output Current IADJ IADJ Change ∆IADJ T J = 25 °C, 3 V ≤ | VIN – V O | ≤ 40 V, 10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W 3 V ≤ | VIN – VO | ≤ 40 V, Reference Voltage VREF –1.20 Temperature Stability of ∆VREF/∆T 0 °C ≤ TJ ≤ 125 °C, IO = 5 mA –0.6 Minimum Load Current IOMIN. | VIN – VO | = 40 V 2.1 10 mA Peak Output Current IOpeak 3 V ≤ | VIN – VO | ≤ 15 V 1.5 2.3 2.9 A T J = 25 °C, | VIN – VO | = 40 V 0.15 0.8 A 0.002 % 60 dB 75 dB 10 mA ≤ IO ≤ 1.5 A, PT ≤ 15 W % VREF Output Noise Voltage Vn T J = 25 °C, 10 HZ ≤ f ≤ 10 kHz R•R T J = 25 °C, ∆VIN = 1 Vr.m.s CADJ = 0 f = 120 Hz, VO = –10 V CADJ = 10 µF (RMS) Ripple Rejection 66 Note Measured at constant junction temperature, using pulse testing with a low duty cycle. PW = 10 ms, Duty Cycle ≤ 2 % 4 µPC337 TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified.) PT vs TA REGL vs TJ 25 2.0 20 REGL - Load Regulation - % PT - Total Power Dissipation - W VIN = –10 V VO = –5 V Infinite heatsink 15 10 With 10°C/W heatsink 5 1.5 1.0 0.5 No heatsink 0 25 50 75 100 0 –25 125 0 25 TA - Operating Ambient Temperature - °C IOpeak vs VDIF TJ = –20 °C +125 °C –10 –20 –30 –40 –1.26 –1.25 –1.24 –1.23 –25 25 50 75 100 TJ - Operating Junction Temperature - °C R . R vs VO IOMIN. vs VDIF 125 4 VIN = –15 V VO = –10 V IO = 0.5 A CIN = 1 µ F CO = 4.7 µ F CADJ = 10 µ F 70 60 CADJ = 0 50 40 30 20 IOMIN. - Minimum Load Current - mA R . R - Ripple Rejection - dB 0 VDIF - Input - Output Voltage Differential - V 90 80 125 VIN –VO = –5 V IO = 10 mA 1.0 0 100 VREF vs TJ +25 °C 2.0 75 –1.27 VREF - Reference Voltage - V IOpeak - Peak Output Current - A 3.0 50 TJ - Operating Junction Temperature - °C 3 TJ = –20 °C 2 TJ = +125 °C 1 TJ = +25 °C 10 10 100 1k f - Frequency - Hz 10 k 100 k 0 –10 –20 –30 –40 VDIF - Input - Output Voltage Differential - V 5 µPC337 PACKAGE DRAWING 3PIN PLASTIC SIP (MP-45G) A N E P B I L M D 1 2 3 K Y V J H U Z C F G M NOTE Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A B 10.0±0.2 7.0±0.2 C 1.50±0.2 D E 17.0±0.3 φ 3.3±0.2 F 0.75±0.10 G 0.25 H 2.54 (T.P.) I 5.0±0.3 J K 2.46±0.2 5.0±0.2 L 8.5±0.2 M 8.5±0.2 N 4.5±0.2 P U V 2.8±0.2 2.4±0.5 0.65±0.10 Y Z 8.9±0.7 1.30±0.2 P3HF-254B-4 6 µPC337 RECOMMENDED SOLDERING CONDITIONS When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Type of Through-hole Devices µPC337HF: 3-pin plastic SIP (MP-45G) Process Conditions Wave soldering (only to leads) Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Partial heating method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E NEC IC PACKAGE MANUAL (CD-ROM) C13388E GUIDE TO QUALITY ASSURANCE FOR SEMICONDUCTOR DEVICES MEI-1202 SEMICONDUCTORS SELECTION GUIDE X10679E NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM IEI-1212 –THREE TERMINAL REGULATOR 7 µPC337 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2