uPSD3212A, uPSD3212C uPSD3212CV Flash Programmable System Devices with 8032 MCU with USB and Programmable Logic FEATURES SUMMARY ■ ■ ■ ■ ■ FAST 8-BIT 8032 MCU – 40MHz at 5.0V, 24MHz at 3.3V – Core, 12-clocks per instruction DUAL FLASH MEMORIES WITH MEMORY MANAGEMENT – Place either memory into 8032 program address space or data address space – READ-while-WRITE operation for InApplication Programming and EEPROM emulation – Single voltage program and erase – 100K minimum erase cycles, 15-year retention CLOCK, RESET, AND SUPPLY MANAGEMENT – SRAM is Battery Backup capable – Normal, Idle, and Power Down Modes – Power-on and Low Voltage reset supervisor – Programmable Watchdog Timer PROGRAMMABLE LOGIC, GENERAL PURPOSE – 16 macrocells – Implements state machines, glue-logic, and so forth COMMUNICATION INTERFACES – I2C Master/Slave bus controller – Two UARTs with independent baud rate – Six I/O ports with up to 46 I/O pins – 8032 Address/Data bus available on TQFP80 package – 5 PWM outputs, 8-bit resolution – USB v1.1, low-speed 1.5Mbps, 3 endpoints (uPSD3212A only) December 2004 Figure 1. Packages TQFP52 (T) 52-lead, Thin, Quad, Flat TQFP80 (U) 80-lead, Thin, Quad, Flat ■ ■ ■ ■ JTAG IN-SYSTEM PROGRAMMING – Program the entire device in as little as 10 seconds A/D CONVERTER – Four channels, 8-bit resolution, 10µs TIMERS AND INTERRUPTS – Three 8032 standard 16-bit timers – 10 Interrupt sources with two external interrupt pins Single Supply Voltage – 4.5 to 5.5V – 3.0 to 3.6V 1/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 1. Device Summary Part Number Max 1st 2nd SRAM Clock Flash Flash GPIO (bytes) (MHz) (bytes) (bytes) USB 8032 Bus VCC (V) Pkg. Temp. uPSD3212C-40T6 40 64K 16K 2K 37 No No 4.5-5.5 TQFP52 –40°C to 85°C uPSD3212CV-24T6 24 64K 16K 2K 37 No No 3.0-3.6 TQFP52 –40°C to 85°C uPSD3212C-40U6 40 64K 16K 2K 46 No Yes 4.5-5.5 TQFP80 –40°C to 85°C uPSD3212CV-24U6 24 64K 16K 2K 46 No Yes 3.0-3.6 TQFP80 –40°C to 85°C uPSD3212A-40T6 40 64K 16K 2K 37 Yes No 4.5-5.5 TQFP52 –40°C to 85°C uPSD3212A-40U6 40 64K 16K 2K 46 Yes Yes 4.5-5.5 TQFP80 –40°C to 85°C 2/163 uPSD3212A, uPSD3212C, uPSD3212CV TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 52-PIN PACKAGE I/O PORT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 ARCHITECTURE OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Data memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 XRAM-PSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Arithmetic Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Logical Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Data Transfers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Boolean Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Relative Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Jump Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Machine Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 uPSD3200 HARDWARE DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 MCU MODULE DISCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Special Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 INTERRUPT SYSTEM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 External Int0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer 0 and 1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . Timer 2 Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2C Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Int1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USART Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt Priority Structure . . . . . . . . . . . . . . . . . . . . . . . . . Interrupts Enable Structure . . . . . . . . . . . . . . . . . . . . . . . . How Interrupts are Handled . . . . . . . . . . . . . . . . . . . . . . . . ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ....... ....... ....... ....... ....... ....... ....... ....... ....... ....... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... . . . . 34 . . . . 34 . . . . 34 . . . . 34 . . . . 34 . . . . 34 . . . . 36 . . . . 36 . . . . 36 . . . . 38 POWER-SAVING MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Idle Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Power Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3/163 uPSD3212A, uPSD3212C, uPSD3212CV Idle Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 I/O PORTS (MCU Module) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 PORT Type and Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 OSCILLATOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 SUPERVISORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 External Reset . . . . . . . . . . . . . . . Low VDD Voltage Reset . . . . . . . . Watchdog Timer Overflow . . . . . USB Reset . . . . . . . . . . . . . . . . . . ....... ....... ....... ....... ...... ...... ...... ...... ....... ....... ....... ....... ...... ...... ...... ...... ....... ....... ....... ....... ...... ...... ...... ...... ...... ...... ...... ...... . . . . 45 . . . . 45 . . . . 45 . . . . 45 WATCHDOG TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 TIMER/COUNTERS (TIMER 0, TIMER 1 AND TIMER 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Timer 0 and Timer 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Timer 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 STANDARD SERIAL INTERFACE (UART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Multiprocessor Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Serial Port Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 ANALOG-TO-DIGITAL CONVERTOR (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 ADC Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 PULSE WIDTH MODULATION (PWM). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 4-channel PWM Unit (PWM 0-3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Programmable Period 8-bit PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 PWM 4 Channel Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 I2C INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Serial Status Register (S2STA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Data Shift Register (S2DAT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Address Register (S2ADR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 USB HARDWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 USB related registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Receiver Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 External USB Pull-Up Resistor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 PSD MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 4/163 uPSD3212A, uPSD3212C, uPSD3212CV In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 PSD MODULE REGISTER DESCRIPTION AND ADDRESS OFFSET . . . . . . . . . . . . . . . . . . . . . . . . 92 PSD MODULE DETAILED OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 MEMORY BLOCKS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Primary Flash Memory and Secondary Flash memory Description . . . . . . . . . . . . . . . . . . . . . 93 Memory Block Select Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Power-down Instruction and Power-up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Programming Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Erasing Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Specific Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Sector Select and SRAM Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Page Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 The Turbo Bit in PSD MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Decode PLD (DPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Output Macrocell (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Product Term Allocator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 I/O PORTS (PSD MODULE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 General Port Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 MCU I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 PLD I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Address Out Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Peripheral I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 JTAG In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Ports A and B – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Port C – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Port D – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 POWER MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 PLD Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 5/163 uPSD3212A, uPSD3212C, uPSD3212CV PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Input Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 RESET TIMING AND DEVICE STATUS AT RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Warm RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 I/O Pin, Register and PLD Status at RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . 127 Standard JTAG Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 JTAG Extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Security and Flash memory Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 AC/DC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Functional EMS (Electromagnetic Susceptibility) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Designing Hardened Software To Avoid Noise Problems . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Absolute Maximum Ratings (Electrical Sensitivity) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 6/163 uPSD3212A, uPSD3212C, uPSD3212CV SUMMARY DESCRIPTION The uPSD321x Series combines a fast 8051based microcontroller with a flexible memory structure, programmable logic, and a rich peripheral mix including USB, to form an ideal embedded controller. At its core is an industry-standard 8032 MCU operating up to 40MHz. A JTAG serial interface is used for In-System Programming (ISP) in as little as 10 seconds, perfect for manufacturing and lab development. The USB 1.1 low-speed interface has one Control Endpoint and two Interrupt endpoints suitable for HID class drivers. The 8032 core is coupled to Programmable System Device (PSD) architecture to optimize the 8032 memory structure, offering two independent banks of Flash memory that can be placed at virtually any address within 8032 program or data address space, and easily paged beyond 64K bytes using on-chip programmable decode logic. Dual Flash memory banks provide a robust solution for remote product updates in the field through In-Application Programming (IAP). Dual Flash banks also support EEPROM emulation, eliminating the need for external EEPROM chips. General purpose programmable logic (PLD) is included to build an endless variety of glue-logic, saving external logic devices. The PLD is configured using the software development tool, PSDsoft Express, available from the web at www.st.com/psm, at no charge. The uPSD321x also includes supervisor functions such as a programmable watchdog timer and lowvoltage reset. Figure 2. Block Diagram uPSD321x (3) 16-bit Timer/ Counters P3.0:7 1st Flash Memory: 64K Bytes 8032 MCU Core (2) External Interrupts Programmable Decode and Page Logic I2C 2nd Flash Memory: 16K Bytes SRAM: 2K Bytes (8) GPIO, Port 3 P1.0:7 (8) GPIO, Port 1 (4) 8-bit ADC SYSTEM BUS UART0 General Purpose Programmable Logic, 16 Macrocells (8) GPIO, Port A (80-pin only) PA0:7 (8) GPIO, Port B PB0:7 (2) GPIO, Port D PD1:2 (4) GPIO, Port C PC0:7 UART1 P4.0:7 USB+, USB– JTAG ISP (5) 8-bit PWM 8032 Address/Data/Control Bus (80-pin device only) (8) GPIO, Port 4 Supervisor: Watchdog and Low-Voltage Reset USB v1.1 VCC, VDD, GND, Reset, Crystal In MCU Bus Dedicated Pins AI10428b 7/163 uPSD3212A, uPSD3212C, uPSD3212CV 40 P1.6/ADC2 41 P1.7/ADC3 42 PB7 43 PB6 44 RESET_ 45 GND 46 VREF 47 PB5 48 PB4 49 PB3 50 PB2 51 PB1 52 PB0 Figure 3. TQFP52 Connections PD1/CLKIN 1 39 P1.5/ADC1 PC7 2 38 P1.4/ADC0 JTAG TDO 3 37 P1.3/TXD1 JTAG TDI 4 USB–(1) 5 36 P1.2/RXD1 35 P1.1/T2X PC4/TERR_ 6 34 P1.0/T2 USB+ 7 VCC 8 33 VCC 32 XTAL2 GND 9 31 XTAL1 PC3/TSTAT 10 30 P3.7/SCL1 PC2/VSTBY 11 JTAG TCK 12 29 P3.6/SDA1 28 P3.5/T1 JTAG TMS 13 P3.3/EXINT1 26 P3.2/EXINT0 25 P3.1/TXD 24 P3.0/RXD 23 P4.0 22 P4.1 21 GND 19 P4.2 20 P4.3/PWM0 18 P4.4/PWM1 17 P4.5/PWM2 16 P4.6/PWM3 15 P4.7/PWM4 14 27 P3.4/T0 AI07423c Note: 1. Pull-up resistor required on pin 5 (2kΩ for 3V devices, 7.5kΩ for 5V devices). 8/163 uPSD3212A, uPSD3212C, uPSD3212CV 61 P1.6/ADC2 62 WR_ 63 PSEN_ 64 P1.7/ADC3 65 RD_ 66 PB7 67 PB6 68 RESET_ 70 VREF 69 GND 72 PB5 71 NC(2) 73 PB4 74 PB3 75 P3.0/RXD0 76 PB2 77 P3.1/TXD0 78 PB1 79 P3.2/EXINT0 80 PB0 Figure 4. TQFP80 Connections PD2 1 60 P1.5/ADC1 P3.3 /EXINT1 2 59 P1.4/ADC0 PD1/CLKIN 3 58 P1.3/TXD1 ALE 4 57 A11 PC7 5 56 P1.2/RXD1 JTAG/TDO 6 55 A10 JTAG/TDI 7 USB–(1) 8 54 P1.1/TX2 53 A9 PC4/TERR_ 9 52 P1.0/T2 USB+ 10 NC(2) 11 51 A8 VCC 12 50 VCC 49 XTAL2 GND 13 48 XTAL1 PC3/TSTAT 14 47 AD7 PC2/VSTBY 15 JTAG TCK 16 NC(2) 17 46 P3.7/SCL1 P4.7/PWM4 18 43 AD5 P4.6/PWM3 19 42 P3.5/T1 45 AD6 44 P3.6/SDA1 JTAG TMS 20 P3.4/T0 40 AD3 39 AD2 38 AD1 37 AD0 36 PA0 35 PA1 34 P4.0 33 PA2 32 P4.1 31 P4.2 30 PA3 28 GND 29 P4.3/PWM0 27 PA4 26 P4.4/PWM1 25 PA5 24 P4.5/PWM2 23 PA6 22 PA7 21 41 AD4 AI07424c Note: 1. Pull-up resistor required on pin 8 (2kΩ for 3V devices, 7.5kΩ for 5V devices). 2. NC = Not Connected. 9/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 2. 80-Pin Package Pin Description Function Signal Name Pin No. AD0 36 I/O External Bus Multiplexed Address/Data bus A1/D1 AD1 37 I/O Multiplexed Address/Data bus A0/D0 AD2 38 I/O Multiplexed Address/Data bus A2/D2 AD3 39 I/O Multiplexed Address/Data bus A3/D3 AD4 41 I/O Multiplexed Address/Data bus A4/D4 AD5 43 I/O Multiplexed Address/Data bus A5/D5 AD6 45 I/O Multiplexed Address/Data bus A6/D6 AD7 47 I/O Multiplexed Address/Data bus A7/D7 P1.0 T2 52 I/O General I/O port pin Timer 2 Count input P1.1 TX2 54 I/O General I/O port pin Timer 2 Trigger input P1.2 RxD1 56 I/O General I/O port pin 2nd UART Receive P1.3 TxD1 58 I/O General I/O port pin 2nd UART Transmit P1.4 ADC0 59 I/O General I/O port pin ADC Channel 0 input P1.5 ADC1 60 I/O General I/O port pin ADC Channel 1 input P1.6 ADC2 61 I/O General I/O port pin ADC Channel 2 input P1.7 ADC3 64 I/O General I/O port pin ADC Channel 3 input A8 51 O External Bus, Address A8 A9 53 O External Bus, Address A9 A10 55 O External Bus, Address A10 A11 57 O External Bus, Address A11 P3.0 RxD0 75 I/O General I/O port pin UART Receive P3.1 TxD0 77 I/O General I/O port pin UART Transmit P3.2 EXINT0 79 I/O General I/O port pin Interrupt 0 input / Timer 0 gate control P3.3 EXINT1 2 I/O General I/O port pin Interrupt 1 input / Timer 1 gate control P3.4 T0 40 I/O General I/O port pin Counter 0 input P3.5 T1 42 I/O General I/O port pin Counter 1 input P3.6 SDA1 44 I/O General I/O port pin I2C Bus serial data I/O P3.7 SCL1 46 I/O General I/O port pin I2C Bus clock I/O P4.0 33 I/O General I/O port pin P4.1 31 I/O General I/O port pin P4.2 30 I/O General I/O port pin 27 I/O General I/O port pin Port Pin P4.3 10/163 PWM0 In/Out Basic Alternate 8-bit Pulse Width Modulation output 0 uPSD3212A, uPSD3212C, uPSD3212CV Function Signal Name Pin No. P4.4 PWM1 25 I/O General I/O port pin 8-bit Pulse Width Modulation output 1 P4.5 PWM2 23 I/O General I/O port pin 8-bit Pulse Width Modulation output 2 P4.6 PWM3 19 I/O General I/O port pin 8-bit Pulse Width Modulation output 3 P4.7 PWM4 18 I/O General I/O port pin Programmable 8-bit Pulse Width modulation output 4 USB– 8 I/O Pull-up resistor required (2kΩ for 3V devices, 7.5kΩ for 5V devices) VREF 70 O Reference Voltage input for ADC RD_ 65 O READ signal, external bus WR_ 62 O WRITE signal, external bus PSEN_ 63 O PSEN signal, external bus ALE 4 O Address Latch signal, external bus RESET_ 68 I Active low RESET input XTAL1 48 I Oscillator input pin for system clock XTAL2 49 O Oscillator output pin for system clock PA0 35 I/O General I/O port pin PA1 34 I/O General I/O port pin PA2 32 I/O General I/O port pin PA3 28 I/O General I/O port pin PA4 26 I/O General I/O port pin PA5 24 I/O General I/O port pin PA6 22 I/O General I/O port pin PA7 21 I/O General I/O port pin PB0 80 I/O General I/O port pin PB1 78 I/O General I/O port pin PB2 76 I/O General I/O port pin PB3 74 I/O General I/O port pin PB4 73 I/O General I/O port pin PB5 72 I/O General I/O port pin PB6 67 I/O General I/O port pin PB7 66 I/O General I/O port pin Port Pin In/Out Basic Alternate 1. 2. 3. 4. 1. 2. 3. PLD Macro-cell outputs PLD inputs Latched Address Out (A0A7) Peripheral I/O Mode PLD Macro-cell outputs PLD inputs Latched Address Out (A0A7) 11/163 uPSD3212A, uPSD3212C, uPSD3212CV Function Signal Name Pin No. JTAG TMS 20 I JTAG pin JTAG TCK 16 I JTAG pin PC2 VSTBY 15 I/O General I/O port pin PC3 TSTAT 14 I/O General I/O port pin PC4 TERR_ 9 I/O General I/O port pin 4. JTAG TDI 7 I JTAG pin 5. JTAG TDO 6 O JTAG pin 5 I/O General I/O port pin 3 I/O General I/O port pin 1. 2. PLD I/O Clock input to PLD and APD PD2 1 I/O General I/O port pin 1. 2. PLD I/O Chip select to PSD Module Vcc 12 Vcc 50 GND 13 GND 29 GND 69 Port Pin PC7 PD1 CLKIN USB+ In/Out Basic Alternate 1. 2. 3. PLD Macro-cell outputs PLD inputs SRAM stand by voltage input (VSTBY) SRAM battery-on indicator (PC4) JTAG pins are dedicated pins 10 NC 11 NC 17 NC 71 52-PIN PACKAGE I/O PORT The 52-pin package members of the uPSD321x Devices have the same port pins as those of the 80-pin package except: – Port 0 (P0.0-P0.7, external address/data bus AD0-AD7) – Port 2 (P2.0-P2.3, external address bus A8A11) 12/163 – – – Port A (PA0-PA7) Port D (PD2) Bus control signal (RD,WR,PSEN,ALE) Pin 5 requires a pull-up resistor (2kΩ for 3V devices, 7.5kΩ for 5V devices) for all devices. uPSD3212A, uPSD3212C, uPSD3212CV ARCHITECTURE OVERVIEW Memory Organization The uPSD321x Devices’s standard 8032 Core has separate 64KB address spaces for Program memory and Data Memory. Program memory is where the 8032 executes instructions from. Data memory is used to hold data variables. Flash memory can be mapped in either program or data space. The Flash memory consists of two flash memory blocks: the main Flash (512Kbit) and the Secondary Flash (128Kbit). Except during flash memory programming or update, Flash memory can only be read, not written to. A Page Register is used to access memory beyond the 64K bytes address space. Refer to the PSD Module for details on mapping of the Flash memory. The 8032 core has two types of data memory (internal and external) that can be read and written. The internal SRAM consists of 256 bytes, and includes the stack area. The SFR (Special Function Registers) occupies the upper 128 bytes of the internal SRAM, the registers can be accessed by Direct addressing only. Another 2K bytes resides in the PSD Module that can be mapped to any address space defined by the user. Figure 5. Memory Map and Address Space MAIN FLASH EXT. RAM INT. RAM SFR Indirect Addressing Direct Addressing FF SECONDARY FLASH 64KB 7F 16KB 2KB Indirect or Direct Addressing 0 Flash Memory Space Internal RAM Space (256 Bytes) External RAM Space (MOVX) AI07425 13/163 uPSD3212A, uPSD3212C, uPSD3212CV Registers The 8032 has several registers; these are the Program Counter (PC), Accumulator (A), B Register (B), the Stack Pointer (SP), the Program Status Word (PSW), General purpose registers (R0 to R7), and DPTR (Data Pointer register). Accumulator. The Accumulator is the 8-bit general purpose register, used for data operation such as transfer, temporary saving, and conditional tests. The Accumulator can be used as a 16-bit register with B Register as shown in Figure 6. B Register. The B Register is the 8-bit general purpose register, used for an arithmetic operation such as multiply, division with the Accumulator (see Figure 7). Stack Pointer. The Stack Pointer Register is 8 bits wide. It is incremented before data is stored during PUSH and CALL executions. While the stack may reside anywhere in on-chip RAM, the Stack Pointer is initialized to 07h after reset. This causes the stack to begin at location 08h (see Figure 8). Program Counter. The Program Counter is a 16bit wide which consists of two 8-bit registers, PCH and PCL. This counter indicates the address of the next instruction to be executed. In RESET state, the program counter has reset routine address (PCH:00h, PCL:00h). Program Status Word. The Program Status Word (PSW) contains several bits that reflect the current state of the CPU and select Internal RAM (00h to 1Fh: Bank0 to Bank3). The PSW is described in Figure 9., page 15. It contains the Carry Flag, the Auxiliary Carry Flag, the Half Carry (for BCD operation), the general purpose flag, the Register Bank Select Flags, the Overflow Flag, and Parity Flag. [Carry Flag, CY]. This flag stores any carry or not borrow from the ALU of CPU after an arithmetic operation and is also changed by the Shift Instruction or Rotate Instruction. [Auxiliary Carry Flag, AC]. After operation, this is set when there is a carry from Bit 3 of ALU or there is no borrow from Bit 4 of ALU. [Register Bank Select Flags, RS0, RS1]. This flags select one of four bank(00~07H:bank0, 08~0Fh:bank1, 10~17h:bank2, 17~1Fh:bank3) in Internal RAM. [Overflow Flag, OV]. This flag is set to '1' when an overflow occurs as the result of an arithmetic operation involving signs. An overflow occurs when the result of an addition or subtraction exceeds +127 (7Fh) or -128 (80h). The CLRV instruction clears the overflow flag. There is no set instruction. When the BIT instruction is executed, Bit 6 of memory is copied to this flag. 14/163 [Parity Flag, P]. This flag reflects on number of Accumulator’s “1.” If the number of Accumulator’s 1 is odd, P=0. otherwise, P=1. The sum of adding Accumulator’s 1 to P is always even. R0~R7. General purpose 8-bit registers that are locked in the lower portion of internal data area. Data Pointer Register. Data Pointer Register is 16-bit wide which consists of two-8bit registers, DPH and DPL. This register is used as a data pointer for the data transmission with external data memory in the PSD Module. Figure 6. 8032 MCU Registers A Accumulator B B Register Stack Pointer SP PCH PCL Program Counter PSW Program Status Word General Purpose Register (Bank0-3) Data Pointer Register R0-R7 DPTR(DPH) DPTR(DPL) AI06636 Figure 7. Configuration of BA 16-bit Registers B B A A Two 8-bit Registers can be used as a "BA" 16-bit Registers AI06637 Figure 8. Stack Pointer Stack Area (30h-FFh) Bit 15 Bit 8 Bit 7 00h Hardware Fixed Bit 0 SP 00h-FFh SP (Stack Pointer) could be in 00h-FFh AI06638 uPSD3212A, uPSD3212C, uPSD3212CV Figure 9. PSW (Program Status Word) Register MSB PSW CY AC FO RS1 RS0 OV LSB P Reset Value 00h Parity Flag Carry Flag Auxillary Carry Flag Bit not assigned General Purpose Flag Overflow Flag Register Bank Select Flags (to select Bank0-3) AI06639 Program Memory The program memory consists of two Flash memory: 64KByte Main Flash and 16KByte of Secondary Flash. The Flash memory can be mapped to any address space as defined by the user in the PSDsoft Tool. It can also be mapped to Data memory space during Flash memory update or programming. After reset, the CPU begins execution from location 0000h. As shown in Figure 10, each interrupt is assigned a fixed location in Program Memory. The interrupt causes the CPU to jump to that location, where it commences execution of the service routine. External Interrupt 0, for example, is assigned to location 0003h. If External Interrupt 0 is going to be used, its service routine must begin at location 0003h. If the interrupt is not going to be used, its service location is available as general purpose Program Memory. The interrupt service locations are spaced at 8byte intervals: 0003h for External Interrupt 0, 000Bh for Timer 0, 0013h for External Interrupt 1, 001Bh for Timer 1 and so forth. If an interrupt service routine is short enough (as is often the case in control applications), it can reside entirely within that 8-byte interval (see Figure 10). Longer service routines can use a jump instruction to skip over subsequent interrupt locations, if other interrupts are in use. Data memory The internal data memory is divided into four physically separated blocks: 256 bytes of internal RAM, 128 bytes of Special Function Registers (SFRs) areas and 2K bytes (XRAM-PSD) in the PSD Module. RAM Four register banks, each 8 registers wide, occupy locations 0 through 31 in the lower RAM area. Only one of these banks may be enabled at a time. The next 16 bytes, locations 32 through 47, contain 128 directly addressable bit locations. The stack depth is only limited by the available internal RAM space of 256 bytes. XRAM-PSD The 2K bytes of XRAM-PSD resides in the PSD Module and can be mapped to any address space through the DPLD (Decoding PLD) as defined by the user in PSDsoft Development tool. The XRAMPSD has a battery backup feature that allow the data to be retained in the event of a power lost. The battery is connected to the Port C PC2 pin. This pin must be configured in PSDSoft to be battery back-up. Figure 10. Interrupt Location of Program Memory Interrupt Location • • • • • 008Bh • • • • 0013h 8 Bytes 000Bh 0003h Reset 0000h AI06640 15/163 uPSD3212A, uPSD3212C, uPSD3212CV SFR The SFRs can only be addressed directly in the address range from 80h to FFh. Table 15., page 28 gives an overview of the Special Function Registers. Sixteen address in the SFRs space are both-byte and bit-addressable. The bitaddressable SFRs are those whose address ends in 0h and 8h. The bit addresses in this area are 80h to FFh. Table 3. RAM Address Byte Address (in Hexadecimal) Byte Address (in Decimal) ↓ ↓ FFh 255 30h 48 msb Bit Address (Hex) lsb 2Fh 7F 7E 7D 7C 7B 7A 79 78 47 2Eh 77 76 75 74 73 72 71 70 46 2Dh 6F 6E 6D 6C 6B 6A 69 68 45 2Ch 67 66 65 64 63 62 61 60 44 2Bh 5F 5E 5D 5C 5B 5A 59 58 43 2Ah 57 56 55 54 53 52 51 50 42 29h 4F 4E 4D 4C 4B 4A 49 48 41 28h 47 46 45 44 43 42 41 40 40 27h 3F 3E 3D 3C 3B 3A 39 38 39 26h 37 36 35 34 33 32 31 30 38 25h 2F 2E 2D 2C 2B 2A 29 28 37 24h 27 26 25 24 23 22 21 20 36 23h 1F 1E 1D 1C 1B 1A 19 18 35 22h 17 16 15 14 13 12 11 10 34 21h 0F 0E 0D 0C 0B 0A 09 08 33 20h 07 06 05 04 03 02 01 00 32 1Fh Register Bank 3 24 17h 23 Register Bank 2 10h Figure 11. Direct Addressing Program Memory 3Eh 04 A AI06641 (2) Indirect addressing. In indirect addressing the instruction specifies a register which contains the address of the operand. Both internal and external RAM can be indirectly addressed. The address register for 8-bit addresses can be R0 or R1 of the selected register bank, or the Stack Pointer. The address register for 16-bit addresses can only be the 16-bit “data pointer” register, DPTR. Example: mov @R1, #40 H ;[R1] <-----40H Figure 12. Indirect Addressing Program Memory 55h 40h R1 55 16 0Fh 15 Register Bank 1 08h 8 07h 7 Register Bank 0 16/163 (1) Direct addressing. In a direct addressing the operand is specified by an 8-bit address field in the instruction. Only internal Data RAM and SFRs (80~FFH RAM) can be directly addressed. Example: mov A, 3EH ;A <----- RAM[3E] 31 18h 00h Addressing Modes The addressing modes in uPSD321x Devices instruction set are as follows ■ Direct addressing ■ Indirect addressing ■ Register addressing ■ Register-specific addressing ■ Immediate constants addressing ■ Indexed addressing 0 AI06642 uPSD3212A, uPSD3212C, uPSD3212CV (3) Register addressing. The register banks, containing registers R0 through R7, can be accessed by certain instructions which carry a 3-bit register specification within the opcode of the instruction. Instructions that access the registers this way are code efficient, since this mode eliminates an address byte. When the instruction is executed, one of four banks is selected at execution time by the two bank select bits in the PSW. Example: mov PSW, #0001000B ; select Bank0 mov A, #30H mov R1, A (4) Register-specific addressing. Some instructions are specific to a certain register. For example, some instructions always operate on the Accumulator, or Data Pointer, etc., so no address byte is needed to point it. The opcode itself does that. (5) Immediate constants addressing. The value of a constant can follow the opcode in Program memory. Example: mov A, #10H. (6) Indexed addressing. Only Program memory can be accessed with indexed addressing, and it can only be read. This addressing mode is intended for reading look-up tables in Program memory. A 16-bit base register (either DPTR or PC) points to the base of the table, and the Accumulator is set up with the table entry number. The address of the table entry in Program memory is formed by adding the Accumulator data to the base pointer (see Figure 13). Example: movc A, @A+DPTR Figure 13. Indexed Addressing ACC 3Ah DPTR 1E73h Arithmetic Instructions The arithmetic instructions is listed in Table 4., page 18. The table indicates the addressing modes that can be used with each instruction to access the <byte> operand. For example, the ADD A, <byte> instruction can be written as: ADD a, 7FH (direct addressing) ADD A, @R0 (indirect addressing) ADD a, R7 (register addressing) ADD A, #127 (immediate constant) Note: Any byte in the internal Data Memory space can be incremented without going through the Accumulator. One of the INC instructions operates on the 16-bit Data Pointer. The Data Pointer is used to generate 16-bit addresses for external memory, so being able to increment it in one 16-bit operations is a useful feature. The MUL AB instruction multiplies the Accumulator by the data in the B register and puts the 16-bit product into the concatenated B and Accumulator registers. The DIV AB instruction divides the Accumulator by the data in the B register and leaves the 8-bit quotient in the Accumulator, and the 8-bit remainder in the B register. In shift operations, dividing a number by 2n shifts its “n” bits to the right. Using DIV AB to perform the division completes the shift in 4?s and leaves the B register holding the bits that were shifted out. The DAA instruction is for BCD arithmetic operations. In BCD arithmetic, ADD and ADDC instructions should always be followed by a DAA operation, to ensure that the result is also in BCD. Note: DAA will not convert a binary number to BCD. The DAA operation produces a meaningful result only as the second step in the addition of two BCD bytes. Program Memory 3Eh AI06643 17/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 4. Arithmetic Instructions Addressing Modes Mnemonic Operation Dir. Ind. Reg. Imm ADD A,<byte> A = A + <byte> X X X X ADDC A,<byte> A = A + <byte> + C X X X X SUBB A,<byte> A = A – <byte> – C X X X X INC A=A+1 INC <byte> <byte> = <byte> + 1 INC DPTR DPTR = DPTR + 1 Data Pointer only DEC A=A–1 Accumulator only DEC <byte> <byte> = <byte> – 1 MUL AB B:A = B x A Accumulator and B only DIV AB A = Int[ A / B ] B = Mod[ A / B ] Accumulator and B only DA A Decimal Adjust Accumulator only Logical Instructions Table 5., page 19 shows list of uPSD321x Devices logical instructions. The instructions that perform Boolean operations (AND, OR, Exclusive OR, NOT) on bytes perform the operation on a bitby-bit basis. That is, if the Accumulator contains 00110101B and byte contains 01010011B, then: ANL A, <byte> will leave the Accumulator holding 00010001B. The addressing modes that can be used to access the <byte> operand are listed in Table 5. The ANL A, <byte> instruction may take any of the forms: ANL A,7FH(direct addressing) ANL A, @R1 (indirect addressing) ANL A,R6 (register addressing) ANL A,#53H (immediate constant) Note: Boolean operations can be performed on any byte in the internal Data Memory space without going through the Accumulator. The XRL <byte>, #data instruction, for example, offers a quick and easy way to invert port bits, as in XRL P1, #0FFH. 18/163 Accumulator only X X X X X X If the operation is in response to an interrupt, not using the Accumulator saves the time and effort to push it onto the stack in the service routine. The Rotate instructions (RL A, RLC A, etc.) shift the Accumulator 1 bit to the left or right. For a left rotation, the MSB rolls into the LSB position. For a right rotation, the LSB rolls into the MSB position. The SWAP A instruction interchanges the high and low nibbles within the Accumulator. This is a useful operation in BCD manipulations. For example, if the Accumulator contains a binary number which is known to be less than 100, it can be quickly converted to BCD by the following code: MOVE B,#10 DIV AB SWAP A ADD A,B Dividing the number by 10 leaves the tens digit in the low nibble of the Accumulator, and the ones digit in the B register. The SWAP and ADD instructions move the tens digit to the high nibble of the Accumulator, and the ones digit to the low nibble. uPSD3212A, uPSD3212C, uPSD3212CV Table 5. Logical Instructions Addressing Modes Mnemonic Operation Dir. Ind. Reg. Imm X X X X X X X X X ANL A,<byte> A = A .AND. <byte> X ANL <byte>,A A = <byte> .AND. A X ANL <byte>,#data A = <byte> .AND. #data X ORL A,<byte> A = A .OR. <byte> X ORL <byte>,A A = <byte> .OR. A X ORL <byte>,#data A = <byte> .OR. #data X XRL A,<byte> A = A .XOR. <byte> X XRL <byte>,A A = <byte> .XOR. A X XRL <byte>,#data A = <byte> .XOR. #data X CRL A A = 00h Accumulator only CPL A A = .NOT. A Accumulator only RL A Rotate A Left 1 bit Accumulator only RLC A Rotate A Left through Carry Accumulator only RR A Rotate A Right 1 bit Accumulator only RRC A Rotate A Right through Carry Accumulator only SWAP A Swap Nibbles in A Accumulator only 19/163 uPSD3212A, uPSD3212C, uPSD3212CV Data Transfers Internal RAM. Table 6 shows the menu of instructions that are available for moving data around within the internal memory spaces, and the addressing modes that can be used with each one. The MOV <dest>, <src> instruction allows data to be transferred between any two internal RAM or SFR locations without going through the Accumulator. Remember, the Upper 128 bytes of data RAM can be accessed only by indirect addressing, and SFR space only by direct addressing. Note: In uPSD321x Devices, the stack resides in on-chip RAM, and grows upwards. The PUSH instruction first increments the Stack Pointer (SP), then copies the byte into the stack. PUSH and POP use only direct addressing to identify the byte being saved or restored, but the stack itself is accessed by indirect addressing using the SP register. This means the stack can go into the Upper 128 bytes of RAM, if they are implemented, but not into SFR space. The Data Transfer instructions include a 16-bit MOV that can be used to initialize the Data Pointer (DPTR) for look-up tables in Program Memory. The XCH A, <byte> instruction causes the Accumulator and ad-dressed byte to exchange data. The XCHD A, @Ri instruction is similar, but only the low nibbles are involved in the exchange. To see how XCH and XCHD can be used to facilitate data manipulations, consider first the problem of shifting and 8-digit BCD number two digits to the right. Table 8., page 21 shows how this can be done using XCH instructions. To aid in understanding how the code works, the contents of the registers that are holding the BCD number and the content of the Accumulator are shown alongside each instruction to indicate their status after the instruction has been executed. After the routine has been executed, the Accumulator contains the two digits that were shifted out on the right. Doing the routine with direct MOVs uses 14 code bytes. The same operation with XCHs uses only 9 bytes and executes almost twice as fast. To right-shift by an odd number of digits, a one-digit must be executed. Table 9., page 21 shows a sample of code that will rightshift a BCD number one digit, using the XCHD instruction. Again, the contents of the registers holding the number and of the accumulator are shown alongside each instruction. Table 6. Data Transfer Instructions that Access Internal Data Memory Space Addressing Modes Mnemonic Operation Dir. Ind. Reg. Imm X MOV A,<src> A = <src> X X X MOV <dest>,A <dest> = A X X X MOV <dest>,<src> <dest> = <src> X X X MOV DPTR,#data16 DPTR = 16-bit immediate constant PUSH <src> INC SP; MOV “@SP”,<src> X POP <dest> MOV <dest>,”@SP”; DEC SP X XCH A,<byte> Exchange contents of A and <byte> X XCHD A,@Ri Exchange low nibbles of A and @Ri 20/163 X X X X X uPSD3212A, uPSD3212C, uPSD3212CV First, pointers R1 and R0 are set up to point to the two bytes containing the last four BCD digits. Then a loop is executed which leaves the last byte, location 2EH, holding the last two digits of the shifted number. The pointers are decremented, and the loop is repeated for location 2DH. The CJNE instruction (Compare and Jump if Not equal) is a loop control that will be described later. The loop executed from LOOP to CJNE for R1 = 2EH, 2DH, 2CH, and 2BH. At that point the digit that was originally shifted out on the right has propagated to location 2AH. Since that location should be left with 0s, the lost digit is moved to the Accumulator. Table 7. Shifting a BCD Number Two Digits to the Right (using direct MOVs: 14 bytes) 2A 2B 2C 2D 2E ACC MOV A,2Eh 00 12 34 56 78 78 MOV 2Eh,2Dh 00 12 34 56 56 78 MOV 2Dh,2Ch 00 12 34 34 56 78 MOV 2Ch,2Bh 00 12 12 34 56 78 MOV 2Bh,#0 00 00 12 34 56 78 Table 8. Shifting a BCD Number Two Digits to the Right (using direct XCHs: 9 bytes) 2A 2B 2C 2D 2E ACC CLR A 00 12 34 56 78 00 XCH A,2Bh 00 00 34 56 78 12 XCH A,2Ch 00 00 12 56 78 34 XCH A,2Dh 00 00 12 34 78 56 XCH A,2Eh 00 00 12 34 56 78 Table 9. Shifting a BCD Number One Digit to the Right 2A 2B 2C 2D 2E ACC MOV R1,#2Eh 00 12 34 56 78 xx MOV R0,#2Dh 00 12 34 56 78 xx ; loop for R1 = 2Eh LOOP: MOV A,@R1 00 12 34 56 78 78 XCHD A,@R0 00 12 34 58 78 76 SWAP A 00 12 34 58 78 67 MOV @R1,A 00 12 34 58 67 67 DEC R1 00 12 34 58 67 67 DEC R0 00 12 34 58 67 67 CNJE R1,#2Ah,LOOP 00 12 34 58 67 67 ; loop for R1 = 2Dh 00 12 38 45 67 45 ; loop for R1 = 2Ch 00 18 23 45 67 23 ; loop for R1 = 2Bh 08 01 23 45 67 01 CLR A 08 01 23 45 67 00 XCH A,2Ah 00 01 23 45 67 08 21/163 uPSD3212A, uPSD3212C, uPSD3212CV External RAM. Table 10 shows a list of the Data Transfer instructions that access external Data Memory. Only indirect addressing can be used. The choice is whether to use a one-byte address, @Ri, where Ri can be either R0 or R1 of the selected register bank, or a two-byte address, @DTPR. Note: In all external Data RAM accesses, the Accumulator is always either the destination or source of the data. Lookup Tables. Table 11 shows the two instructions that are available for reading lookup tables in Program Memory. Since these instructions access only Program Memory, the lookup tables can only be read, not updated. The mnemonic is MOVC for “move constant.” The first MOVC instruction in Table 11 can accommodate a table of up to 256 entries numbered 0 through 255. The number of the desired entry is loaded into the Accumulator, and the Data Pointer is set up to point to the beginning of the table. Then: MOVC A, @A+DPTR copies the desired table entry into the Accumulator. The other MOVC instruction works the same way, except the Program Counter (PC) is used as the table base, and the table is accessed through a subroutine. First the number of the desired en-try is loaded into the Accumulator, and the subroutine is called: MOV A , ENTRY NUMBER CALL TABLE The subroutine “TABLE” would look like this: TABLE: MOVC A , @A+PC RET The table itself immediately follows the RET (return) instruction is Program Memory. This type of table can have up to 255 entries, numbered 1 through 255. Number 0 cannot be used, because at the time the MOVC instruction is executed, the PC contains the address of the RET instruction. An entry numbered 0 would be the RET opcode itself. Table 10. Data Transfer Instruction that Access External Data Memory Space Address Width Mnemonic Operation 8 bits MOVX A,@Ri READ external RAM @Ri 8 bits MOVX @Ri,A WRITE external RAM @Ri 16 bits MOVX A,@DPTR READ external RAM @DPTR 16 bits MOVX @DPTR,a WRITE external RAM @DPTR Table 11. Lookup Table READ Instruction 22/163 Mnemonic Operation MOVC A,@A+DPTR READ program memory at (A+DPTR) MOVC A,@A+PC READ program memory at (A+PC) uPSD3212A, uPSD3212C, uPSD3212CV Boolean Instructions The uPSD321x Devices contain a complete Boolean (single-bit) processor. One page of the internal RAM contains 128 addressable bits, and the SFR space can support up to 128 addressable bits as well. All of the port lines are bit-addressable, and each one can be treated as a separate singlebit port. The instructions that access these bits are not just conditional branches, but a complete menu of move, set, clear, complement, OR and AND instructions. These kinds of bit operations are not easily obtained in other architectures with any amount of byte-oriented software. The instruction set for the Boolean processor is shown in Table 12. All bits accesses are by direct addressing. Bit addresses 00h through 7Fh are in the Lower 128, and bit addresses 80h through FFh are in SFR space. Note how easily an internal flag can be moved to a port pin: MOV C,FLAG MOV P1.0,C In this example, FLAG is the name of any addressable bit in the Lower 128 or SFR space. An I/O line (the LSB of Port 1, in this case) is set or cleared depending on whether the Flag Bit is '1' or '0.' The Carry Bit in the PSW is used as the single-bit Accumulator of the Boolean processor. Bit instructions that refer to the Carry Bit as C assemble as Carry-specific instructions (CLR C, etc.). The Carry Bit also has a direct address, since it resides in the PSW register, which is bit-addressable. Note: The Boolean instruction set includes ANL and ORL operations, but not the XRL (Exclusive OR) operation. An XRL operation is simple to implement in software. Suppose, for example, it is required to form the Exclusive OR of two bits: C = bit 1 .XRL. bit2 The software to do that could be as follows: MOV C , bit1 JNB bit2, OVER CPL C OVER: (continue) First, Bit 1 is moved to the Carry. If bit2 = 0, then C now contains the correct result. That is, Bit 1 .XRL. bit2 = bit1 if bit2 = 0. On the other hand, if bit2 = 1, C now contains the complement of the correct result. It need only be inverted (CPL C) to complete the operation. This code uses the JNB instruction, one of a series of bit-test instructions which execute a jump if the addressed bit is set (JC, JB, JBC) or if the addressed bit is not set (JNC, JNB). In the above case, Bit 2 is being tested, and if bit2 = 0, the CPL C instruction is jumped over. JBC executes the jump if the addressed bit is set, and also clears the bit. Thus a flag can be tested and cleared in one operation. All the PSW bits are directly addressable, so the Parity Bit, or the general-purpose flags, for example, are also available to the bit-test instructions. Relative Offset The destination address for these jumps is specified to the assembler by a label or by an actual address in Program memory. How-ever, the destination address assembles to a relative offset byte. This is a signed (two’s complement) offset byte which is added to the PC in two’s complement arithmetic if the jump is executed. The range of the jump is therefore -128 to +127 Program Memory bytes relative to the first byte following the instruction. Table 12. Boolean Instructions Mnemonic Operation ANL C,bit C = A .AND. bit ANL C,/bit C = C .AND. .NOT. bit ORL C,bit C = A .OR. bit ORL C,/bit C = C .OR. .NOT. bit MOV C,bit C = bit MOV bit,C bit = C CLR C C=0 CLR bit bit = 0 SETB C C=1 SETB bit bit = 1 CPL C C = .NOT. C CPL bit bit = .NOT. bit JC rel Jump if C =1 JNC rel Jump if C = 0 JB bit,rel Jump if bit =1 JNB bit,rel Jump if bit = 0 JBC bit,rel Jump if bit = 1; CLR bit 23/163 uPSD3212A, uPSD3212C, uPSD3212CV Jump Instructions Table 13 shows the list of unconditional jump instructions. The table lists a single “JMP add” instruction, but in fact there are three SJMP, LJMP, and AJMP, which differ in the format of the destination address. JMP is a generic mnemonic which can be used if the programmer does not care which way the jump is en-coded. The SJMP instruction encodes the destination address as a relative offset, as described above. The instruction is 2 bytes long, consisting of the opcode and the relative offset byte. The jump distance is limited to a range of -128 to +127 bytes relative to the instruction following the SJMP. The LJMP instruction encodes the destination address as a 16-bit constant. The instruction is 3 bytes long, consisting of the opcode and two address bytes. The destination address can be anywhere in the 64K Program Memory space. The AJMP instruction encodes the destination address as an 11-bit constant. The instruction is 2 bytes long, consisting of the opcode, which itself contains 3 of the 11 address bits, followed by another byte containing the low 8 bits of the destination address. When the instruction is executed, these 11 bits are simply substituted for the low 11 bits in the PC. The high 5 bits stay the same. Hence the destination has to be within the same 2K block as the instruction following the AJMP. In all cases the programmer specifies the destination address to the assembler in the same way: as a label or as a 16-bit constant. The assembler will put the destination address into the correct format for the given instruction. If the format required by the instruction will not support the distance to the specified destination address, a “Destination out of range” message is written into the List file. The JMP @A+DPTR instruction supports case jumps. The destination address is computed at execution time as the sum of the 16-bit DPTR register and the Accumulator. Typically. DPTR is set up with the address of a jump table. In a 5-way branch, for ex-ample, an integer 0 through 4 is loaded into the Accumulator. The code to be executed might be as follows: MOV DPTR,#JUMP TABLE MOV A,INDEX_NUMBER RL A JMP @A+DPTR 24/163 The RL A instruction converts the index number (0 through 4) to an even number on the range 0 through 8, because each entry in the jump table is 2 bytes long: JUMP TABLE: AJMP CASE 0 AJMP CASE 1 AJMP CASE 2 AJMP CASE 3 AJMP CASE 4 Table 13 shows a single “CALL addr” instruction, but there are two of them, LCALL and ACALL, which differ in the format in which the subroutine address is given to the CPU. CALL is a generic mnemonic which can be used if the programmer does not care which way the address is encoded. The LCALL instruction uses the 16-bit address format, and the subroutine can be anywhere in the 64K Program Memory space. The ACALL instruction uses the 11-bit format, and the subroutine must be in the same 2K block as the instruction following the ACALL. In any case, the programmer specifies the subroutine address to the assembler in the same way: as a label or as a 16-bit constant. The assembler will put the address into the correct format for the given instructions. Subroutines should end with a RET instruction, which returns execution to the instruction following the CALL. RETI is used to return from an interrupt service routine. The only difference between RET and RETI is that RETI tells the interrupt control system that the interrupt in progress is done. If there is no interrupt in progress at the time RETI is executed, then the RETI is functionally identical to RET. Table 13. Unconditional Jump Instructions Mnemonic Operation JMP addr Jump to addr JMP @A+DPTR Jump to A+DPTR CALL addr Call Subroutine at addr RET Return from subroutine RETI Return from Interrupt NOP No operation uPSD3212A, uPSD3212C, uPSD3212CV Table 14 shows the list of conditional jumps available to the uPSD321x Devices user. All of these jumps specify the destination address by the relative offset method, and so are limited to a jump distance of -128 to +127 bytes from the instruction following the conditional jump instruction. Important to note, however, the user specifies to the assembler the actual destination address the same way as the other jumps: as a label or a 16-bit constant. There is no Zero Bit in the PSW. The JZ and JNZ instructions test the Accumulator data for that condition. The DJNZ instruction (Decrement and Jump if Not Zero) is for loop control. To execute a loop N times, load a counter byte with N and terminate the loop with a DJNZ to the beginning of the loop, as shown below for N = 10: MOV COUNTER,#10 LOOP: (begin loop) • • • (end loop) DJNZ COUNTER, LOOP (continue) The CJNE instruction (Compare and Jump if Not Equal) can also be used for loop control as in Table 9., page 21. Two bytes are specified in the operand field of the instruction. The jump is executed only if the two bytes are not equal. In the example of Table 9., page 21 Shifting a BCD Number One Digits to the Right, the two bytes were data in R1 and the constant 2Ah. The initial data in R1 was 2Eh. Every time the loop was executed, R1 was decremented, and the looping was to continue until the R1 data reached 2Ah. Another application of this instruction is in “greater than, less than” comparisons. The two bytes in the operand field are taken as unsigned integers. If the first is less than the second, then the Carry Bit is set (1). If the first is greater than or equal to the second, then the Carry Bit is cleared. Machine Cycles A machine cycle consists of a sequence of six states, numbered S1 through S6. Each state time lasts for two oscillator periods. Thus, a machine cycle takes 12 oscillator periods or 1µs if the oscillator frequency is 12MHz. Refer to Figure 14., page 26. Each state is divided into a Phase 1 half and a Phase 2 half. State Sequence in uPSD321x Devices shows that retrieve/execute sequences in states and phases for various kinds of instructions. Normally two program retrievals are generated during each machine cycle, even if the instruction being executed does not require it. If the instruction being executed does not need more code bytes, the CPU simply ignores the extra retrieval, and the Program Counter is not incremented. Execution of a one-cycle instruction (Figure 14., page 26) begins during State 1 of the machine cycle, when the opcode is latched into the Instruction Register. A second retrieve occurs during S4 of the same machine cycle. Execution is complete at the end of State 6 of this machine cycle. The MOVX instructions take two machine cycles to execute. No program retrieval is generated during the second cycle of a MOVX instruction. This is the only time program retrievals are skipped. The retrieve/execute sequence for MOVX instruction is shown in Figure 14., page 26 (d). Table 14. Conditional Jump Instructions Addressing Modes Mnemonic Operation Dir. Ind. Reg. JZ rel Jump if A = 0 Accumulator only JNZ rel Jump if A ≠ 0 Accumulator only DJNZ <byte>,rel Decrement and jump if not zero X CJNE A,<byte>,rel Jump if A ≠ <byte> X CJNE <byte>,#data,rel Jump if <byte> ≠ #data Imm X X X X 25/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 14. State Sequence in uPSD321x Devices Osc. (XTAL2) S1 S2 S3 S4 S5 S6 S1 S2 S3 S4 S5 S6 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 Read next opcode and discard Read opcode S1 S2 S3 S4 S5 Read next opcode S6 a. 1-Byte, 1-Cycle Instruction, e.g. INC A S1 S2 Read next opcode Read 2nd Byte Read opcode S3 S4 S5 S6 b. 2-Byte, 1-Cycle Instruction, e.g. ADD A, adrs Read next opcode and discard Read opcode S1 S2 S3 S4 S5 Read next opcode and discard Read next opcode and discard S6 S1 S2 S3 S4 S5 Read next opcode S6 c. 1-Byte, 2-Cycle Instruction, e.g. INC DPTR S1 S2 S3 d. 1-Byte, 2-Cycle MOVX Instruction S4 S5 Read next opcode No ALE S6 Addr No Fetch No Fetch Read next opcode and discard Read opcode (MOVX) S1 S2 S3 S4 S5 S6 Data Access External Memory AI06822 26/163 uPSD3212A, uPSD3212C, uPSD3212CV uPSD3200 HARDWARE DESCRIPTION The uPSD321x Devices has a modular architecture with two main functional modules: the MCU Module and the PSD Module. The MCU Module consists of a standard 8032 core, peripherals and other system supporting functions. The PSD Module provides configurable Program and Data memories to the 8032 CPU core. In addition, it has its own set of I/O ports and a PLD with 16 macrocells for general logic implementation. Ports A,B,C, and D are general purpose programmable I/O ports that have a port architecture which is different from Ports 0-4 in the MCU Module. The PSD Module communicates with the CPU Core through the internal address, data bus (A0A15, D0-D7) and control signals (RD_, WR_, PSEN_ , ALE, RESET_). The user defines the Decoding PLD in the PSDsoft Development Tool and can map the resources in the PSD Module to any program or data address space. Figure 15. uPSD321x Devices Functional Modules Port 1, Timers and 2nd UART and ADC Port 3, UART, Intr, Timers,I2C Port 3 Port 1 8032 Core 2 UARTs Interrupt Dedicated USB Pins Port 4 PWM I2C 3 Timer / Counters 256 Byte SRAM 4 Channel ADC PWM 5 Channels USB & Transceiver Reset Logic LVD & WDT MCU MODULE Port 0, 2 Ext. Bus 8032 Internal Bus A0-A15 RD,PSEN WR,ALE D0-D7 Reset PSD MODULE Page Register Decode PLD 512Kb Main Flash 128Kb Secondary Flash 16Kb SRAM Bus Interface PSD Internal Bus JTAG ISP CPLD - 16 MACROCELLS Port C, JTAG, PLD I/O and GPIO Port A & B, PLD I/O and GPIO Port D GPIO VCC, GND, XTAL Dedicated Pins AI07426b 27/163 uPSD3212A, uPSD3212C, uPSD3212CV MCU MODULE DISCRIPTION This section provides a detail description of the MCU Module system functions and Peripherals, including: ■ Special Function Registers ■ Timers/Counter ■ Interrupts ■ PWM ■ Supervisory Function (LVD and Watchdog) ■ USART ■ Power Saving Modes ■ I2C Bus ■ On-chip Oscillator ■ ADC ■ I/O Ports Special Function Registers A map of the on-chip memory area called the Special Function Register (SFR) space is shown in Table 15. Note: In the SFRs not all of the addresses are occupied. Unoccupied addresses are not implemented on the chip. READ accesses to these addresses will in general return random data, and WRITE accesses will have no effect. User software should write '0s' to these unimplemented locations. Table 15. SFR Memory Map F8 FF F0 B(1) E8 UISTA(1) UIEN E0 ACC(1) USCL F7 UCON0 UCON1 D8 UCON2 S2CON USTA S2STA UADR UDR0 EF UDT1 UDT0 E7 S2DAT S2ADR DF D0 PSW(1) C8 T2CON(1) C0 P4(1) C7 B8 IP(1) BF B0 P3(1) A8 IE(1) A0 P2(1) 98 D7 T2MOD PSCL0L RCAP2L RCAP2H PSCL0H PSCL1L PWM4P PWM4W PWMCON PWM0 PWM1 SCON SBUF SCON2 SBUF2 90 P1(1) P1SFS 88 TCON(1) TMOD 80 P0(1) SP Note: 1. Register can be bit addressing 28/163 TL2 TH2 CF PSCL1H IPA WDKEY PWM2 PWM3 WDRST B7 AF IEA A7 9F P3SFS P4SFS ASCL TL0 TL1 TH0 TH1 DPL DPH ADAT ACON 97 8F PCON 87 uPSD3212A, uPSD3212C, uPSD3212CV Table 16. List of all SFR SFR Reg Name Addr Bit Register Name 7 6 5 4 3 2 1 0 Reset Comments Value 80 P0 FF Port 0 81 SP 07 Stack Ptr 82 DPL 00 Data Ptr Low 83 DPH 87 PCON SMOD 00 Data Ptr High TCLK1 PD IDLE 00 Power Ctrl 88 TCON TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 00 Timer / Cntr Control 89 TMOD Gate C/T M1 M0 Gate C/T M1 M0 00 Timer / Cntr Mode Control 8A TL0 00 Timer 0 Low 8B TL1 00 Timer 1 Low 8C TH0 00 Timer 0 High 8D TH1 00 Timer 1 High 90 P1 FF Port 1 91 P1SFS P1S7 P1S6 00 Port 1 Select Register 93 P3SFS P3S7 P3S6 00 Port 3 Select Register 94 P4SFS P4S7 P4S6 00 Port 4 Select Register 95 ASCL 00 8-bit Prescaler for ADC clock 96 ADAT 97 ACON 98 SCON 99 SBUF 9A SCON2 9B A0 SMOD1 LVREN ADSFINT RCLK1 P1S5 P4S5 P1S4 P4S4 P4S3 P4S2 P4S1 P4S0 ADAT3 ADAT2 ADAT1 ADAT0 00 ADC Data Register ADS1 ADS0 ADST ADSF 00 ADC Control Register TB8 RB8 TI RI 00 Serial Control Register 00 Serial Buffer 00 2nd UART Ctrl Register SBUF2 00 2nd UART Serial Buffer P2 FF Port 2 00 PWM Control Polarity A1 PWMCON ADAT7 ADAT6 ADAT5 ADAT4 ADEN SM0 SM0 PWML SM1 SM1 PWMP SM2 SM2 PWME REN REN CFG4 TB8 CFG3 RB8 CFG2 TI CFG1 RI CFG0 A2 PWM0 00 PWM0 Output Duty Cycle A3 PWM1 00 PWM1 Output Duty Cycle 29/163 uPSD3212A, uPSD3212C, uPSD3212CV SFR Reg Name Addr Bit Register Name 7 6 5 4 3 2 1 0 Reset Comments Value A4 PWM2 00 PWM2 Output Duty Cycle A5 PWM3 00 PWM3 Output Duty Cycle A6 WDRST 00 Watch Dog Reset A7 IEA 00 Interrupt Enable (2nd) A8 IE 00 Interrupt Enable EI2C ES2 EA - ET2 ES ET1 EX1 ET0 EX0 A9 AA PWM4P 00 PWM 4 Period AB PWM4W 00 PWM 4 Pulse Width AE WDKEY 00 Watch Dog Key Register B0 P3 FF Port 3 B1 PSCL0L 00 Prescaler 0 Low (8-bit) B2 PSCL0H 00 Prescaler 0 High (8-bit) B3 PSCL1L 00 Prescaler 1 Low (8-bit) B4 PSCL1H 00 Prescaler 1 High (8-bit) B7 IPA 00 Interrupt Priority (2nd) B8 IP 00 Interrupt Priority C0 P4 FF New Port 4 C8 T2CON 00 Timer 2 Control C9 T2MOD CA RCAP2L 00 Timer 2 Reload low CB RCAP2H 00 Timer 2 Reload High CC TL2 00 Timer 2 Low byte CD TH2 00 Timer 2 High byte D0 PSW 00 Program Status Word D1 30/163 PS2 PT2 TF2 EXF2 RCLK PS TCLK PI2C PT1 EXEN2 PX1 TR2 PT0 C/T2 PX0 CP/RL2 DCEN CY AC FO RS1 RS0 OV P 00 Timer 2 Mode uPSD3212A, uPSD3212C, uPSD3212CV SFR Reg Name Addr Bit Register Name 7 6 5 4 3 2 1 0 D2 S2SETUP Reset Comments Value 00 I2C (S2) Setup D4 D5 D6 D7 D8 D9 DA DB DC S2CON CR2 EN1 STA STO ADDR AA CR1 CR0 00 I2C Bus Control Reg DD S2STA GC Stop Intr TX-Md Bbusy Blost ACK_R SLV 00 I2C Bus Status DE S2DAT 00 Data Hold Register DF S2ADR 00 I2C address E0 ACC 00 Accumulator E1 USCL 00 8-bit Prescaler for USB logic E6 UDT1 UDT1.7 UDT1.6 UDT1.5 UDT1.4 UDT1.3 UDT1.2 UDT1.1 UDT1.0 00 USB Endpt1 Data Xmit E7 UDT0 UDT0.7 UDT0.6 UDT0.5 UDT0.4 UDT0.3 UDT0.2 UDT0.1 UDT0.0 00 USB Endpt0 Data Xmit E8 UISTA SUSPND — RESUMF 00 USB Interrupt Status E9 UIEN SUSPNDIE RSTE RSTFIE TXD0IE RXD0IE TXD1IE EOPIE RESUMIE 00 USB Interrupt Enable EA UCON0 TSEQ0 STALL0 TX0E TP0SIZ3 TP0SiZ2 TP0SIZ1 TP0SIZ0 00 USB Endpt0 Xmit Control EB UCON1 TSEQ1 EP12SEL — FRESUM TP1SIZ3 TP1SiZ2 TP1SIZ1 TP1SIZ0 00 USB Endpt1 Xmit Control EC UCON2 — — — SOUT STALL2 STALL1 00 USB Control Register ED USTA RSEQ SETUP IN OUT RP0SIZ3 RP0SIZ2 RP0SIZ1 RP0SIZ0 00 USB Endpt0 Status EE UADR USBEN UADD6 UADD5 UADD4 UADD0 00 USB Address Register EF UDR0 UDR0.7 UDR0.6 UDR0.5 UDR0.4 UDR0.3 UDR0.2 UDR0.1 UDR0.0 00 USB Endpt0 Data Recv F0 B 00 B Register RSTF TXD0F RX0E RXD0F EP2E RXD1F EP1E EOPF UADD3 UADD2 UADD1 31/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 17. PSD Module Register Address Offset CSIOP Addr Offset Register Name 00 Data In (Port A) Reads Port pins as input 02 Control (Port A) Configure pin between I/O or Address Out Mode. Bit = 0 selects I/ O 00 04 Data Out (Port A) Latched data for output to Port pins, I/O Output Mode 00 06 Direction (Port A) Configures Port pin as input or output. Bit = 0 selects input 00 08 Drive (Port A) Configures Port pin between CMOS, Open Drain or Slew rate. Bit = 0 selects CMOS 00 0A Input Macrocell (Port A) Reads latched value on Input Macrocells 0C Enable Out (Port A) Reads the status of the output enable control to the Port pin driver. Bit = 0 indicates pin is in input mode. 01 Data In (Port B) 03 Control (Port B) 00 05 Data Out (Port B) 00 07 Direction (Port B) 00 09 Drive (Port B) 00 0B Input Macrocell (Port B) 0D Enable Out (Port B) 10 Data In (Port C) 12 Data Out (Port C) 00 14 Direction (Port C) 00 16 Drive (Port C) 00 18 Input Macrocell (Port C) 1A Enable Out (Port C) 11 Data In (Port D) * * * * * * 13 Data Out (Port D) * * * * * * 00 Only Bit 1 and 2 are used 15 Direction (Port D) * * * * * * 00 Only Bit 1 and 2 are used 17 Drive (Port D) * * * * * * 00 Only Bit 1 and 2 are used 1B Enable Out (Port D) * * * * * * 20 Output Macrocells AB 32/163 Bit Register Name 7 6 5 4 3 2 1 0 Reset Value Comments Only Bit 1 and 2 are used Only Bit 1 and 2 are used uPSD3212A, uPSD3212C, uPSD3212CV CSIOP Addr Offset Register Name 21 Output Macrocells BC 22 Mask Macrocells AB 23 Mask Macrocells BC C0 Primary Flash Protection C2 Bit Register Name 7 Secondary Flash Security Protection _Bit B0 PMMR0 * B4 PMMR2 * E0 Page E2 VM Periphmode 6 * * 5 * * 3 * PLD array Cntl2 FL_ data 2 1 0 Reset Value Comments Sec3_ Sec2_ Sec1_ Prot Prot Prot Sec0_ Prot Bit = 1 sector is protected * Sec1_ Prot Sec0_ Prot Security Bit = 1 device is secured * APD enable * 00 Control PLD power consumption PLD array Cntl0 * * 00 Blocking inputs to PLD array 00 Page Register * PLD PLD PLD Mcells arrayTurbo clk clk PLD array Ale * 4 PLD array Cntl1 Boot_ data FL_ code Boot_ code SR_ code Configure 8032 Program and Data Space Note: (Register address = csiop address + address offset; where csiop address is defined by user in PSDsoft) * indicates bit is not used and need to set to '0.' 33/163 uPSD3212A, uPSD3212C, uPSD3212CV INTERRUPT SYSTEM There are interrupt requests from 10 sources as follows (see Figure 16., page 35). ■ INT0 External Interrupt ■ 2nd USART Interrupt ■ Timer 0 Interrupt ■ I2C Interrupt ■ INT1 External Interrupt (or ADC Interrupt) ■ Timer 1 Interrupt ■ USB Interrupt ■ USART Interrupt ■ Timer 2 Interrupt External Int0 – The INT0 can be either level-active or transition-active depending on Bit IT0 in register TCON. The flag that actually generates this interrupt is Bit IE0 in TCON. – When an external interrupt is generated, the corresponding request flag is cleared by the hardware when the service routine is vectored to only if the interrupt was transition activated. – If the interrupt was level activated then the interrupt request flag remains set until the requested interrupt is actually generated. Then it has to deactivate the request before the interrupt service routine is completed, or else another interrupt will be generated. Timer 0 and 1 Interrupts – Timer 0 and Timer 1 Interrupts are generated by TF0 and TF1 which are set by an overflow of their respective Timer/Counter registers (except for Timer 0 in Mode 3). – These flags are cleared by the internal hardware when the interrupt is serviced. Timer 2 Interrupt – Timer 2 Interrupt is generated by TF2 which is set by an overflow of Timer 2. This flag has to be cleared by the software - not by hardware. – It is also generated by the T2EX signal (Timer 2 External Interrupt P1.1) which is controlled 34/163 by EXEN2 and EXF2 Bits in the T2CON register. 2 I C Interrupt – The interrupt of the I2C is generated by Bit INTR in the register S2STA. – This flag is cleared by hardware. External Int1 – The INT1 can be either level active or transition active depending on Bit IT1 in register TCON. The flag that actually generates this interrupt is Bit IE1 in TCON. – When an external interrupt is generated, the corresponding request flag is cleared by the hardware when the service routine is vectored to only if the interrupt was transition activated. – If the interrupt was level activated then the interrupt request flag remains set until the requested interrupt is actually generated. Then it has to deactivate the request before the interrupt service routine is completed, or else another interrupt will be generated. – The ADC can take over the External INT1 to generate an interrupt on conversion being completed USB Interrupt – The USB Interrupt is generated when endpoint0 has transmitted a packet or received a packet, when endpoint1 or endpoint2 has transmitted a packet, when the suspend or resume state is detected and every EOP received. – When the USB Interrupt is generated, the corresponding request flag must be cleared by software. The interrupt service routine will have to check the various USB registers to determine the source and clear the corresponding flag. – Please see the dedicated interrupt control registers for the USB peripheral for more information. uPSD3212A, uPSD3212C, uPSD3212CV Figure 16. Interrupt System Interrupt Sources IP / IPA Priority IE / High INT0 Low USART Timer 0 I2C Interrupt Polling INT1 Timer 1 USB 2nd USART Timer 2 Global Enable AI07427b 35/163 uPSD3212A, uPSD3212C, uPSD3212CV USART Interrupt – The USART Interrupt is generated by RI (Receive Interrupt) OR TI (Transmit Interrupt). – When the USART Interrupt is generated, the corresponding request flag must be cleared by the software. The interrupt service routine will have to check the various USART registers to determine the source and clear the corresponding flag. – Both USART’s are identical, except for the additional interrupt controls in the Bit 4 of the additional interrupt control registers (A7H, B7H). Interrupt Priority Structure Each interrupt source can be assigned one of two priority levels. Interrupt priority levels are defined by the interrupt priority special function register IP and IPA. 0 = low priority 1 = high priority A low priority interrupt may be interrupted by a high priority interrupt level interrupt. A high priority interrupt routine cannot be interrupted by any other interrupt source. If two interrupts of different priority occur simultaneously, the high priority level request is serviced. If requests of the same priority are received simultaneously, an internal polling sequence determines which request is serviced. Thus, within each priority level, there is a second priority structure determined by the polling sequence. Interrupts Enable Structure Each interrupt source can be individually enabled or disabled by setting or clearing a bit in the interrupt enable special function register IE and IEA. All interrupt source can also be globally disabled by the clearing Bit EA in IE (see Table 19). Please see Tables 20, 21, 22, and 23 for individual bit descriptions. Table 18. Priority Levels Source Priority with Level Int0 0 (highest) 2nd USART 1 Timer 0 2 I²C 3 Int1 4 reserved 5 Timer 1 6 USB 7 1st USART 8 Timer 2+EXF2 9 (lowest) Table 19. SFR Register Bit Register Name SFR Addr Reg Name 7 6 5 4 3 2 1 0 A7 IEA — — — ES2 — — EI2C EUSB 00 Interrupt Enable (2nd) A8 IE EA — ET2 ES ET1 EX1 ET0 EX0 00 Interrupt Enable B7 IPA — — — PS2 — — PI2C PUSB 00 Interrupt Priority (2nd) B8 IP — — PT2 PS PT1 PX1 PT0 PX0 00 Interrupt Priority 36/163 Reset Comments Value uPSD3212A, uPSD3212C, uPSD3212CV Table 20. Description of the IE Bits. Bit Symbol Function 7 EA Disable all interrupts: 0: no interrupt with be acknowledged 1: each interrupt source is individually enabled or disabled by setting or clearing its enable bit 6 — Reserved 5 ET2 Enable Timer 2 Interrupt 4 ES Enable USART Interrupt 3 ET1 Enable Timer 1 Interrupt 2 EX1 Enable External Interrupt (Int1) 1 ET0 Enable Timer 0 Interrupt 0 EX0 Enable External Interrupt (Int0) Table 21. Description of the IEA Bits Bit Symbol Function 7 — Not used 6 — Not used 5 — Not used 4 ES2 3 — Not used 2 — Not used 1 EI2C Enable I²C Interrupt 0 EUSB Enable USB Interrupt Enable 2nd USART Interrupt Table 22. Description of the IP Bits Bit Symbol Function 7 — Reserved 6 — Reserved 5 PT2 Timer 2 Interrupt priority level 4 PS USART Interrupt priority level 3 PT1 Timer 1 Interrupt priority level 2 PX1 External Interrupt (Int1) priority level 1 PT0 Timer 0 Interrupt priority level 0 PX0 External Interrupt (Int0) priority level 37/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 23. Description of the IPA Bits Bit Symbol Function 7 — Not used 6 — Not used 5 — Not used 4 PS2 3 — Not used 2 — Not used 1 PI2C I²C Interrupt priority level 0 PUSB USB Interrupt priority level 2nd USART Interrupt priority level How Interrupts are Handled The interrupt flags are sampled at S5P2 of every machine cycle. The samples are polled during following machine cycle. If one of the flags was in a set condition at S5P2 of the preceding cycle, the polling cycle will find it and the interrupt system will generate an LCALL to the appropriate service routine, provided this H/W generated LCALL is not blocked by any of the following conditions: – An interrupt of equal priority or higher priority level is already in progress. – The current machine cycle is not the final cycle in the execution of the instruction in progress. – The instruction in progress is RETI or any access to the interrupt priority or interrupt enable registers. The polling cycle is repeated with each machine cycle, and the values polled are the values that were present at S5P2 of the previous machine cycle. Note: If an interrupt flag is active but being responded to for one of the above mentioned conditions, if the flag is still inactive when the blocking condition is removed, the denied interrupt will not be serviced. In other words, the fact that the interrupt flag was once active but not serviced is not remembered. Every polling cycle is new. The processor acknowledges an interrupt request by executing a hardware generated LCALL to the appropriate service routine. The hardware generated LCALL pushes the contents of the Program Counter on to the stack (but it does not save the PSW) and reloads the PC with an address that depends on the source of the interrupt being vectored to as shown in Table 24. 38/163 Execution proceeds from that location until the RETI instruction is encountered. The RETI instruction informs the processor that the interrupt routine is no longer in progress, then pops the top two bytes from the stack and reloads the Program Counter. Execution of the interrupted program continues from where it left off. Note: A simple RET instruction would also return execution to the interrupted program, but it would have left the interrupt control system thinking an interrupt was still in progress, making future interrupts impossible. Table 24. Vector Addresses Source Vector Address Int0 0003h 2nd USART 004Bh Timer 0 000Bh I²C 0043h Int1 0013h Timer 1 001Bh USB 0033h 1st USART 0023h Timer 2+EXF2 002Bh uPSD3212A, uPSD3212C, uPSD3212CV POWER-SAVING MODE Two software selectable modes of reduced power consumption are implemented (see Table 25). Idle Mode The following Functions are Switched Off. – CPU (Halted) The following Function Remain Active During Idle Mode. – External Interrupts – Timer 0, Timer 1, Timer 2 – PWM Units – USART – 8-bit ADC – I2C Interface – USB Interface Note: Interrupt or RESET terminates the Idle Mode. Power-Down Mode – System Clock Halted – LVD Logic Remains Active – SRAM contents remains unchanged – The SFRs retain their value until a RESET is asserted Note: The only way to exit Power-down Mode is a RESET. Power Control Register The Idle and Power-down Modes are activated by software via the PCON register (see Tables 26 and Table 27., page 40). Idle Mode The instruction that sets PCON.0 is the last instruction executed in the normal operating mode before Idle Mode is activated. Once in the Idle Mode, the CPU status is preserved in its entirety: Stack pointer, Program counter, Program status word, Accumulator, RAM and All other registers maintain their data during Idle Mode. There are three ways to terminate the Idle Mode. – Activation of any enabled interrupt will cause PCON.0 to be cleared by hardware terminating Idle mode. The interrupt is serviced, and following return from interrupt instruction RETI, the next instruction to be executed will be the one which follows the instruction that wrote a logic '1' to PCON.0. – External hardware reset: the hardware reset is required to be active for two machine cycle to complete the RESET operation. – Internal reset: the microcontroller restarts after 3 machine cycles in all cases. Power-Down Mode Table 25. Power-Saving Mode Power Consumption Mode Addr/Data Ports1,3,4 PWM I2C USB Idle Maintain Data Maintain Data Active Active Active Power-down Maintain Data Maintain Data Disable Disable Disable Table 26. Pin Status During Idle and Power-down Mode SFR Reg Addr Name 87 PCON Bit Register Name 7 SMOD 6 5 4 3 SMOD1 LVREN ADSFINT RCLK1 2 1 0 TCLK1 PD IDLE Reset Comments Value 00 Power Ctrl 39/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 27. Description of the PCON Bits Bit Symbol Function 7 SMOD Double Baud Data Rate Bit UART 6 SMOD1 Double Baud Data Rate Bit 2nd UART 5 LVREN LVR Disable Bit (active High) 4 ADSFINT 3 RCLK1 (1) 2 TCLK1(1) 1 PD Activate Power-down Mode (High enable) 0 IDL Activate Idle Mode (High enable) Enable ADC Interrupt Received Clock Flag (UART 2) Transmit Clock Flag (UART 2) Note: 1. See the T2CON register for details of the flag description I/O PORTS (MCU MODULE) The MCU Module has five ports: Port0, Port1, Port2, Port3 and Port 4. (Refer to the PSD Module section on I/O ports A,B,C and D). Ports P0 and P2 are dedicated for the external address and data bus and is not available in the 52-pin package devices. Port1 - Port3 are the same as in the standard 8032 micro-controllers, with the exception of the addi- tional special peripheral functions (see Table 28). All ports are bi-directional. Pins of which the alternative function is not used may be used as normal bi-directional I/O. The use of Port1- Port4 pins as alternative functions are carried out automatically by the uPSD321x Devices provided the associated SFR Bit is set HIGH. Table 28. I/O Port Functions 40/163 Port Name Main Function Alternate Port 1 GPIO Timer 2 - Bits 0,1 2nd UART - Bits 2,3 ADC - Bits 4..7 Port 3 GPIO UART - Bits 0,1 Interrupt - Bits 2,3 Timers - Bits 4,5 I2C - Bits 6,7 Port 4 GPIO PWM - Bits 3..7 uPSD3212A, uPSD3212C, uPSD3212CV The following SFR registers (Tables 29, 30, and 31) are used to control the mapping of alternate functions onto the I/O port bits. Port 1 alternate functions are controlled using the P1SFS register, except for Timer 2 and the 2nd UART which are enabled by their configuration registers. P1.0 to P1.3 are default to GPIO after reset. Port 3 pins 6 and 7 have been modified from the standard 8032. These pins that were used for READ and WRITE control signals are now GPIO or I2C bus pins. The READ and WRITE pins are assigned to dedicated pins. Port 3 (I2C) and Port 4 alternate functions are controlled using the P3SFS and P4SFS Special Function Selection registers. After a reset, the I/O pins default to GPIO. The alternate function is enabled if the corresponding bit in the PXSFS register is set to '1.' Other Port 3 alternative functions (UART, Interrupt, and Timer/Counter) are enabled by their configuration register and do not require setting of the bits in R3SFS. Table 29. P1SFS (91H) 7 6 5 4 0=Port 1.7 1=ACH3 0=Port 1.6 1=ACH2 0=Port 1.5 1=ACH1 0=Port 1.4 1=ACH0 5 4 3 2 Bits Reserved 1 0 Bits Reserved Table 30. P3SFS (93H) 7 6 0 = Port 3.7 0 = Port 3.6 1 = SDA 1 = SCL from I2C unit from I2C unit 3 2 1 0 Bits are reserved. Table 31. P4SFS (94H) 7 6 5 4 3 2 1 0 0=Port 4.7 1=PWM 4 0=Port 4.6 1=PWM 3 0=Port 4.5 1=PWM 2 0=Port 4.4 1=PWM 1 0=Port 4.3 1=PWM 0 0=Port 4.2 0=Port 4.1 0=Port 4.0 41/163 uPSD3212A, uPSD3212C, uPSD3212CV PORT Type and Description Figure 17. PORT Type and Description (Part 1) Symbol In / Out RESET I Circuit Description • Schmitt input with internal pull-up CMOS compatible interface NFC : 400ns NFC WR, RD,ALE, PSEN O XTAL1, XTAL2 I Output only On-chip oscillator On-chip feedback resistor Stop in the power down mode External clock input available CMOS compatible interface xon O PORT0 I/O Bidirectional I/O port Schmitt input Address Output ( Push-Pull ) CMOS compatible interface AI07438 42/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 18. PORT Type and Description (Part 2) Symbol PORT1 <3:0>, PORT3, PORT4<7:3,1:0> In/ Out Circuit Function I/O Bidirectional I/O port with internal pull-ups Schmitt input CMOS compatible interface I/O Bidirectional I/O port with internal pull-ups Schmitt input CMOS compatible interface Analog input option PORT2 PORT1 < 7:4 > an_enb PORT4.2 Bidirectional I/O port with internal I/O pull-ups Schmitt input. TTL compatible interface USB–, USB+ Bidirectional I/O port Schmitt input TTL compatible interface I/O + – AI07428b 43/163 uPSD3212A, uPSD3212C, uPSD3212CV OSCILLATOR The oscillator circuit of the uPSD321x Devices is a single stage inverting amplifier in a Pierce oscillator configuration (see Figure 19). The circuitry between XTAL1 and XTAL2 is basically an inverter biased to the transfer point. Either a crystal or ceramic resonator can be used as the feedback ele- ment to complete the oscillator circuit. Both are operated in parallel resonance. XTAL1 is the high gain amplifier input, and XTAL2 is the output. To drive the uPSD321x Devices externally, XTAL1 is driven from an external source and XTAL2 left open-circuit. Figure 19. Oscillator XTAL1 XTAL2 XTAL1 XTAL2 8 to 40 MHz External Clock AI06620 44/163 uPSD3212A, uPSD3212C, uPSD3212CV SUPERVISORY before it is released. On initial power-up the LVR is enabled (default). After power-up the LVR can be disabled via the LVREN Bit in the PCON Register. Note: The LVR logic is still functional in both the Idle and Power-down Modes. The reset threshold: ■ 5V operation: 4V +/- 0.25V ■ 3.3V operation: 2.5V +/-0.2V This logic supports approximately 0.1V of hysteresis and 1µs noise-cancelling delay. Watchdog Timer Overflow The Watchdog Timer generates an internal reset when its 22-bit counter overflows. See Watchdog Timer section for details. USB Reset The USB reset is generated by a detection on the USB bus RESET signal. A single-end zero on its upstream port for 4 to 8 times will set RSTF Bit in UISTA register. If Bit 6 (RSTE) of the UIEN Register is set, the detection will also generate the RESET signal to reset the CPU and other peripherals in the MCU. There are four ways to invoke a reset and initialize the uPSD321x Devices. ■ Via the external RESET pin ■ Via the internal LVR Block. ■ Via Watch Dog timer ■ Via USB bus reset signalling The RESET mechanism is illustrated in Figure 20. Each RESET source will cause an internal reset signal active. The CPU responds by executing an internal reset and puts the internal registers in a defined state. This internal reset is also routed as an active low reset input to the PSD Module. External Reset The RESET pin is connected to a Schmitt trigger for noise reduction. A RESET is accomplished by holding the RESET pin LOW for at least 1ms at power up while the oscillator is running. Refer to AC spec on other RESET timing requirements. Low VDD Voltage Reset An internal reset is generated by the LVR circuit when the VDD drops below the reset threshold. After VDD reaching back up to the reset threshold, the RESET signal will remain asserted for 10ms Figure 20. RESET Configuration Reset Noise Cancel CPU Clock Sync CPU & PERI. WDT S LVR Q R RSTE USB Reset 10ms Timer 10ms at 40Mhz 50ms at 8Mhz PSD_RST "Active-Low" AI07429b 45/163 uPSD3212A, uPSD3212C, uPSD3212CV WATCHDOG TIMER The hardware Watchdog Timer (WDT) resets the uPSD321x Devices when it overflows. The WDT is intended as a recovery method in situations where the CPU may be subjected to a software upset. To prevent a system reset the timer must be reloaded in time by the application software. If the processor suffers a hardware/software malfunction, the software will fail to reload the timer. This failure will result in a reset upon overflow thus preventing the processor running out of control. In the Idle Mode the watchdog timer and reset circuitry remain active. The WDT consists of a 22-bit counter, the Watchdog Timer RESET (WDRST) SFR and Watchdog Key Register (WDKEY). Since the WDT is automatically enabled while the processor is running. the user only needs to be concerned with servicing it. The 22-bit counter overflows when it reaches 4194304 (3FFFFFH). The WDT increments once every machine cycle. This means the user must reset the WDT at least every 4194304 machine cycles (1.258 seconds at 40MHz). To reset the WDT the user must write a value between 00-7EH to the WDRST register. The value that is written to the WDRST is loaded to the 7MSB of the 22-bit counter. This allows the user to pre-loaded the counter to an initial value to generate a flexible Watchdog time out period. Writing a “00” to WDRST clears the counter. The watchdog timer is controlled by the watchdog key register, WDKEY. Only pattern 01010101 (=55H), disables the watchdog timer. The rest of pattern combinations will keep the watchdog timer enabled. This security key will prevent the watchdog timer from being terminated abnormally when the function of the watchdog timer is needed. In Idle Mode, the oscillator continues to run. To prevent the WDT from resetting the processor while in Idle, the user should always set up a timer that will periodically exit Idle, service the WDT, and re-enter Idle Mode. Table 32. Watchdog Timer Key Register (WDKEY: 0AEH) 7 6 5 4 3 2 1 0 WDKEY7 WDKEY6 WDKEY5 WDKEY4 WDKEY3 WDKEY2 WDKEY1 WDKEY0 Table 33. Description of the WDKEY Bits Bit Symbol 7 to 0 WDKEY7 to WDKEY0 46/163 Function Enable or disable Watchdog Timer. 01010101 (=55h): disable watchdog timer. Others: enable watchdog timer uPSD3212A, uPSD3212C, uPSD3212CV Watchdog reset pulse width depends on the clock frequency. The reset period is TfOSC x 12 x 222. The RESET pulse width is TfOSC x 12 x 215. Figure 21. RESET Pulse Width Reset pulse width (about 10ms at 40Mhz, about 50ms at 8Mhz) Reset period (1.258 second at 40Mhz) (about 6.291 seconds at 8Mhz) AI06823 Table 34. Watchdog Timer Clear Register (WDRST: 0A6H) 7 6 5 4 3 2 1 0 Reserved WDRST6 WDRST5 WDRST4 WDRST3 WDRST2 WDRST1 WDRST0 Table 35. Description of the WDRST Bits Bit Symbol 7 — 6 to 0 WDRST6 to WDRST0 Function Reserved To reset Watchdog Timer, write any value beteen 00h and 7Eh to this register. This value is loaded to the 7 most significant bits of the 22-bit counter. For example: MOV WDRST,#1EH Note: The Watchdog Timer (WDT) is enabled at power-up or reset and must be served or disabled. 47/163 uPSD3212A, uPSD3212C, uPSD3212CV TIMER/COUNTERS (TIMER 0, TIMER 1 AND TIMER 2) The uPSD321x Devices has three 16-bit Timer/ Counter registers: Timer 0, Timer 1 and Timer 2. All of them can be configured to operate either as timers or event counters and are compatible with standard 8032 architecture. In the “Timer” function, the register is incremented every machine cycle. Thus, one can think of it as counting machine cycles. Since a machine cycle consists of 6 CPU clock periods, the count rate is 1/6 of the CPU clock frequency or 1/12 of Oscillator Frequency (fOSC). In the “Counter” function, the register is incremented in response to a 1-to-0 transition at its corresponding external input pin, T0 or T1. In this function, the external input is sampled during S5P2 of every machine cycle. When the samples show a high in one cycle and a low in the next cycle, the count is incremented. The new count value appears in the register during S3P1 of the cycle following the one in which the transition was detected. Since it takes 2 machine cycles (24 fOSC clock periods) to recognize a 1-to-0 transition, the maximum count rate is 1/24 of the fOSC. There are no restrictions on the duty cycle of the external input signal, but to ensure that a given level is sampled at least once before it changes, it should be held for at least one full cycle. In addition to the “Timer” or “Counter” selection, Timer 0 and Timer 1 have four operating modes from which to select. Timer 0 and Timer 1 The “Timer” or “Counter” function is selected by control bits C/T in the Special Function Register TMOD. These Timer/Counters have four operating modes, which are selected by bit-pairs (M1, M0) in TMOD. Modes 0, 1, and 2 are the same for Timers/ Counters. Mode 3 is different. The four operating modes are de-scribed in the following text. Table 36. Control Register (TCON) 7 6 5 4 3 2 1 0 TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 Table 37. Description of the TCON Bits Bit Symbol Function 7 TF1 Timer 1 overflow Flag. Set by hardware on Timer/Counter overflow. Cleared by hardware when processor vectors to interrupt routine 6 TR1 Timer 1 Run Control Bit. Set/cleared by software to turn Timer/Counter on or off 5 TF0 Timer 0 Overflow Flag. Set by hardier on Timer/Counter overflow. Cleared by hardware when processor vectors to interrupt routine 4 TR0 Timer 0 Run Control Bit. Set/cleared by software to turn Timer/Counter on or off 3 IE1 Interrupt 1 Edge Flag. Set by hardware when external interrupt edge detected. Cleared when interrupt processed 2 IT1 Interrupt 1 Type Control Bit. Set/cleared by software to specify falling-edge/low-level triggered external interrupt 1 IE0 Interrupt 0 Edge Flag. Set by hardware when external interrupt edge detected. Cleared when interrupt processed 0 IT0 Interrupt 0 Type Control Bit. Set/cleared by software to specify falling-edge/low-level triggered external interrupt Table 38. TMOD Register (TMOD) 7 6 5 4 3 2 1 0 Gate C/T M1 M0 Gate C/T M1 M0 48/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 39. Description of the TMOD Bits Bit Symbol Timer 7 Gate Gating control when set. Timer/Counter 1 is enabled only while INT1 pin is High and TR1 control pin is set. When cleared, Timer 1 is enabled whenever TR1 control bit is set 6 C/T Timer or Counter selector, cleared for timer operation (input from internal system clock); set for counter operation (input from T1 input pin) 5 M1 4 M0 3 Gate Gating control when set. Timer/Counter 0 is enabled only while INT0 pin is High and TR0 control pin is set. When cleared, Timer 0 is enabled whenever TR0 control bit is set 2 C/T Timer or Counter selector, cleared for timer operation (input from internal system clock); set for counter operation (input from T0 input pin) 1 M1 0 M0 Timer 1 Timer 0 Function (M1,M0)=(0,0): 13-bit Timer/Counter, TH1, with TL1 as 5-bit prescaler (M1,M0)=(0,1): 16-bit Timer/Counter. TH1 and TL1 are cascaded. There is no prescaler. (M1,M0)=(1,0): 8-bit auto-reload Timer/Counter. TH1 holds a value which is to be reloaded into TL1 each time it overflows (M1,M0)=(1,1): Timer/Counter 1 stopped (M1,M0)=(0,0): 13-bit Timer/Counter, TH0, with TL0 as 5-bit prescaler (M1,M0)=(0,1): 16-bit Timer/Counter. TH0 and TL0 are cascaded. There is no prescaler. (M1,M0)=(1,0): 8-bit auto-reload Timer/Counter. TH0 holds a value which is to be reloaded into TL0 each time it overflows (M1,M0)=(1,1): TL0 is an 8-bit Timer/Counter controlled by the standard TImer 0 control bits. TH0 is an 8-bit timer only controlled by Timer 1 control bits 49/163 uPSD3212A, uPSD3212C, uPSD3212CV Mode 0. Putting either Timer into Mode 0 makes it look like an 8048 Timer, which is an 8-bit Counter with a divide-by-32 prescaler. Figure 22 shows the Mode 0 operation as it applies to Timer 1. In this mode, the Timer register is configured as a 13-bit register. As the count rolls over from all '1s' to all '0s,' it sets the Timer Interrupt Flag TF1. The counted input is enabled to the Timer when TR1 = 1 and either GATE = 0 or /INT1 = 1. (Setting GATE = 1 allows the Timer to be controlled by external input /INT1, to facilitate pulse width measurements). TR1 is a control bit in the Special Function Register TCON (TCON Control Register). GATE is in TMOD. The 13-bit register consists of all 8 bits of TH1 and the lower 5 bits of TL1. The upper 3 bits of TL1 are indeterminate and should be ignored. Setting the run flag does not clear the registers. Mode 0 operation is the same for the Timer 0 as for Timer 1. Substitute TR0, TF0, and /INT0 for the corresponding Timer 1 signals in Figure 22. There are two different GATE Bits, one for Timer 1 and one for Timer 0. Mode 1. Mode 1 is the same as Mode 0, except that the Timer register is being run with all 16 bits. Figure 22. Timer/Counter Mode 0: 13-bit Counter fOSC ÷ 12 C/T = 0 C/T = 1 T1 pin TL1 (5 bits) TH1 (8 bits) TF1 Interrupt Control TR1 Gate INT1 pin AI06622 50/163 uPSD3212A, uPSD3212C, uPSD3212CV Mode 2. Mode 2 configures the Timer register as an 8-bit Counter (TL1) with automatic reload, as shown in Figure 23. Overflow from TL1 not only sets TF1, but also reloads TL1 with the contents of TH1, which is preset by software. The reload leaves TH1 unchanged. Mode 2 operation is the same for Timer/Counter 0. Timer 2 Like Timer 0 and 1, Timer 2 can operate as either an event timer or as an event counter. This is selected by Bit C/T2 in the special function register T2CON (see Table 40). It has three operating modes: Capture, Auto-reload, and Baud Rate Generator (see Table 41., page 52), which are selected by bits in the T2CON as shown in Table 42., page 52. In the Capture Mode there are two options which are selected by Bit EXEN2 in T2CON. if EXEN2 = 0, then Timer 2 is a 16-bit timer or counter which upon overflowing sets Bit TF2, the Timer 2 overflow bit, which can be used to generate an interrupt. If EXEN2 = 1, then Timer 2 still does the above, but with the added feature that a 1-to-0 transition at external input T2EX causes the current value in the Timer 2 registers, TL2 and TH2, to be captured into registers RCAP2L and RCAP2H, respectively. In addition, the transition at T2EX causes Bit EXF2 in T2CON to be set, and EXF2 like TF2 can generate an interrupt. The Capture Mode is illustrated in Figure 24., page 53. In the Auto-reload Mode, there are again two options, which are selected by bit EXEN2 in T2CON. If EXEN2 = 0, then when Timer 2 rolls over it not only sets TF2 but also causes the Timer 2 registers to be reloaded with the 16-bit value in registers RCAP2L and RCAP2H, which are preset by software. If EXEN2 = 1, then Timer 2 still does the above, but with the added feature that a 1-to-0 transition at external input T2EX will also trigger the 16-bit reload and set EXF2. The Auto-reload Mode is illustrated in Standard Serial Interface (UART) Figure 25., page 53. The Baud Rate Generation Mode is selected by (RCLK, RCLK1) = 1 and/or (TCLK, TCLK1) = 1. It will be described in conjunction with the serial port. Figure 23. Timer/Counter Mode 2: 8-bit Auto-reload fOSC ÷ 12 C/T = 0 C/T = 1 T1 pin TL1 (8 bits) TF1 Interrupt Control TR1 Gate INT1 pin TH1 (8 bits) AI06623 Table 40. Timer/Counter 2 Control Register (T2CON) 7 6 5 4 3 2 1 0 TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 CP/RL2 51/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 41. Timer/Counter 2 Operating Modes T2CON Mode 16-bit Autoreload Input Clock RxCLK or TxCLK CP/ RL2 TR2 T2MOD DECN T2CON EXEN P1.1 T2EX 0 0 1 0 0 x reload upon overflow 0 0 1 0 1 ↓ reload trigger (falling edge) 0 0 1 1 x 0 Down counting 0 0 1 1 x 1 Up counting 0 1 1 x 0 x 16-bit Timer/Counter (only up counting) 16-bit Capture 0 1 1 x 1 ↓ Capture (TH1,TL2) → (RCAP2H,RCAP2L) 1 x 1 x 0 x No Overflow Interrupt Request (TF2) Baud Rate Generator Off Remarks 1 x 1 x 1 ↓ Extra External Interrupt (Timer 2) x x 0 x x x Timer 2 stops Internal External (P1.0/T2) fOSC/12 MAX fOSC/24 fOSC/12 MAX fOSC/24 fOSC/12 MAX fOSC/24 — — Note: ↓ = falling edge Table 42. Description of the T2CON Bits Bit Symbol Function 7 TF2 Timer 2 Overflow Flag. Set by a Timer 2 overflow, and must be cleared by software. TF2 will not be set when either (RCLK, RCLK1)=1 or (TCLK, TCLK)=1 Timer 2 External Flag set when either a capture or reload is caused by a negative transition on T2EX and EXEN2=1. When Timer 2 Interrupt is enabled, EXF2=1 will cause the CPU to vector to the Timer 2 Interrupt routine. EXF2 must be cleared by software 6 EXF2 5 RCLK(1) Receive Clock Flag (UART 1). When set, causes the serial port to use Timer 2 overflow pulses for its receive clock in Modes 1 and 3. TCLK=0 causes Timer 1 overflow to be used for the receive clock 4 TCLK(1) Transmit Clock Flag (UART 1). When set, causes the serial port to use Timer 2 overflow pulses for its transmit clock in Modes 1 and 3. TCLK=0 causes Timer 1 overflow to be used for the transmit clock 3 EXEN2 Timer 2 External Enable Flag. When set, allows a capture or reload to occur as a result of a negative transition on T2EX if Timer 2 is not being used to clock the serial port. EXEN2=0 causes Time 2 to ignore events at T2EX 2 TR2 Start/stop control for Timer 2. A logic 1 starts the timer 1 C/T2 Timer or Counter Select for Timer 2. Cleared for timer operation (input from internal system clock, tCPU); set for external event counter operation (negative edge triggered) CP/RL2 Capture/Reload Flag. When set, capture will occur on negative transition of T2EX if EXEN2=1. When cleared, auto-reload will occur either with TImer 2 overflows, or negative transitions of T2EX when EXEN2=1. When either (RCLK, RCLK1)=1 or (TCLK, TCLK)=1, this bit is ignored, and timer is forced to auto-reload on Timer 2 overflow 0 Note: 1. The RCLK1 and TCLK1 Bits in the PCON Register control UART 2, and have the same function as RCLK and TCLK. 52/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 24. Timer 2 in Capture Mode fOSC ÷ 12 C/T2 = 0 C/T2 = 1 T2 pin TL2 (8 bits) TH2 (8 bits) TF2 Control TR2 Timer 2 Interrupt Capture RCAP2L RCAP2H Transition Detector T2EX pin EXP2 Control EXEN2 AI06625 Figure 25. Timer 2 in Auto-Reload Mode fOSC ÷ 12 C/T2 = 0 C/T2 = 1 T2 pin TL2 (8 bits) TH2 (8 bits) TF2 Control TR2 Timer 2 Interrupt Reload RCAP2L RCAP2H Transition Detector T2EX pin EXP2 Control EXEN2 AI06626 53/163 uPSD3212A, uPSD3212C, uPSD3212CV Mode 3. Timer 1 in Mode 3 simply holds its count. The effect is the same as setting TR1 = 0. Timer 0 in Mode 3 establishes TL0 and TH0 as two separate counters. The logic for Mode 3 on Timer 0 is shown in Figure 26. TL0 uses the Timer 0 control Bits: C/T, GATE, TR0, INT0, and TF0. TH0 is locked into a timer function (counting machine cycles) and takes over the use of TR1 and TF1 from Timer 1. Thus, TH0 now controls the “Timer 1“ Interrupt. Mode 3 is provided for applications requiring an extra 8-bit timer on the counter. With Timer 0 in Mode 3, an uPSD321x Devices can look like it has three Timer/Counters. When Timer 0 is in Mode 3, Timer 1 can be turned on and off by switching it out of and into its own Mode 3, or can still be used by the serial port as a baud rate generator, or in fact, in any application not requiring an interrupt. Figure 26. Timer/Counter Mode 3: Two 8-bit Counters fOSC ÷ 12 C/T = 0 C/T = 1 T0 pin TL0 (8 bits) TF0 Interrupt TH1 (8 bits) TF1 Interrupt Control TR0 Gate INT0 pin fOSC ÷ 12 Control TR1 54/163 AI06624 uPSD3212A, uPSD3212C, uPSD3212CV STANDARD SERIAL INTERFACE (UART) The uPSD321x Devices provides two standard 8032 UART serial ports. The first port is connected to pin P3.0 (RX) and P3.1 (TX). The second port is connected to pin P1.2 (RX) and P1.3(TX). The operation of the two serial ports are the same and are controlled by the SCON and SCON2 registers. The serial port is full duplex, meaning it can transmit and receive simultaneously. It is also receivebuffered, meaning it can commence reception of a second byte before a previously received byte has been read from the register. (However, if the first byte still has not been read by the time reception of the second byte is complete, one of the bytes will be lost.) The serial port receive and transmit registers are both accessed at Special Function Register SBUF (or SBUF2 for the second serial port). Writing to SBUF loads the transmit register, and reading SBUF accesses a physically separate receive register. The serial port can operate in 4 modes: Mode 0. Serial data enters and exits through RxD. TxD outputs the shift clock. 8 bits are transmitted/received (LSB first). The baud rate is fixed at 1/12 the fOSC. Mode 1. 10 bits are transmitted (through TxD) or received (through RxD): a start Bit (0), 8 data bits (LSB first), and a Stop Bit (1). On receive, the Stop Bit goes into RB8 in Special Function Register SCON. The baud rate is variable. Mode 2. 11 bits are transmitted (through TxD) or received (through RxD): start Bit (0), 8 data bits (LSB first), a programmable 9th data bit, and a Stop Bit (1). On Transmit, the 9th data bit (TB8 in SCON) can be assigned the value of '0' or '1.' Or, for example, the Parity Bit (P, in the PSW) could be moved into TB8. On receive, the 9th data bit goes into RB8 in Special Function Register SCON, while the Stop Bit is ignored. The baud rate is programmable to either 1/32 or 1/64 the oscillator frequency. Mode 3. 11 bits are transmitted (through TxD) or received (through RxD): a Start Bit (0), 8 data bits (LSB first), a programmable 9th data bit, and a Stop Bit (1). In fact, Mode 3 is the same as Mode 2 in all respects except baud rate. The baud rate in Mode 3 is variable. In all four modes, transmission is initiated by any instruction that uses SBUF as a destination register. Reception is initiated in Mode 0 by the condition RI = 0 and REN = 1. Reception is initiated in the other modes by the incoming start bit if REN = 1. Multiprocessor Communications Modes 2 and 3 have a special provision for multiprocessor communications. In these modes, 9 data bits are received. The 9th one goes into RB8. Then comes a Stop Bit. The port can be programmed such that when the Stop Bit is received, the serial port interrupt will be activated only if RB8 = 1. This feature is enabled by setting Bit SM2 in SCON. A way to use this feature in multi-processor systems is as follows: When the master processor wants to transmit a block of data to one of several slaves, it first sends out an address byte which identifies the target slave. An address byte differs from a data byte in that the 9th bit is '1' in an address byte and 0 in a data byte. With SM2 = 1, no slave will be interrupted by a data byte. An ad-dress byte, however, will interrupt all slaves, so that each slave can examine the received byte and see if it is being addressed. The addressed slave will clear its SM2 Bit and prepare to receive the data bytes that will be coming. The slaves that weren’t being addressed leave their SM2s set and go on about their business, ignoring the coming data bytes. SM2 has no effect in Mode 0, and in Mode 1 can be used to check the validity of the Stop Bit. In a Mode 1 reception, if SM2 = 1, the Receive Interrupt will not be activated unless a valid Stop Bit is received. 55/163 uPSD3212A, uPSD3212C, uPSD3212CV Serial Port Control Register The serial port control and status register is the Special Function Register SCON (SCON2 for the second port), shown in Figure 27. This register (see Tables 43 and 44) contains not only the mode selection bits, but also the 9th data bit for transmit and receive (TB8 and RB8), and the Serial Port Interrupt Bits (TI and RI). Figure 27. Serial Port Mode 0, Block Diagram Internal Bus Write to SBUF D S Q CL RxD P3.0 Alt Output Function SBUF Zero Detector Shift Start Tx Control S6 Tx Clock T Send Serial Port Interrupt Shift Clock REN Start R1 TxD P3.1 Alt Output Function Receive R Rx Clock Shift Rx Control 7 6 5 4 3 2 1 0 RxD P3.0 Alt Input Function Input Shift Register Load SBUF Shift SBUF Read SBUF Internal Bus AI06824 Table 43. Serial Port Control Register (SCON) 7 6 5 4 3 2 1 0 SM0 SM1 SM2 REN TB8 RB8 TI RI 56/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 44. Description of the SCON Bits Bit Symbol 7 SM0 6 SM1 Function (SM1,SM0)=(0,0): Shift Register. Baud rate = fOSC/12 (SM1,SM0)=(1,0): 8-bit UART. Baud rate = variable (SM1,SM0)=(0,1): 8-bit UART. Baud rate = fOSC/64 or fOSC/32 (SM1,SM0)=(1,1): 8-bit UART. Baud rate = variable 5 SM2 Enables the multiprocessor communication features in Mode 2 and 3. In Mode 2 or 3, if SM2 is set to '1,' RI will not be activated if its received 8th data bit (RB8) is '0.' In Mode 1, if SM2=1, RI will not be activated if a valid Stop Bit was not received. In Mode 0, SM2 should be '0' 4 REN Enables serial reception. Set by software to enable reception. Clear by software to disable reception 3 TB8 The 8th data bit that will be transmitted in Modes 2 and 3. Set or clear by software as desired 2 RB8 In Modes 2 and 3, this bit contains the 8th data bit that was received. In Mode 1, if SM2=0, RB8 is the Snap Bit that was received. In Mode 0, RB8 is not used 1 TI Transmit Interrupt Flag. Set by hardware at the end of the 8th bit time in Mode 0, or at the beginning of the Stop Bit in the other modes, in any serial transmission. Must be cleared by software 0 RI Receive Interrupt Flag. Set by hardware at the end of the 8th bit time in Mode 0, or halfway through the Stop Bit in the other modes, in any serial reception (except for SM2). Must be cleared by software 57/163 uPSD3212A, uPSD3212C, uPSD3212CV Baud Rates. The baud rate in Mode 0 is fixed: Mode 0 Baud Rate = fOSC / 12 The baud rate in Mode 2 depends on the value of Bit SMOD = 0 (which is the value on reset), the baud rate is 1/64 the oscillator frequency. If SMOD = 1, the baud rate is 1/32 the oscillator frequency. Mode 2 Baud Rate = (2SMOD / 64) x fOSC In the uPSD321x Devices, the baud rates in Modes 1 and 3 are determined by the Timer 1 overflow rate. Using Timer 1 to Generate Baud Rates. When Timer 1 is used as the baud rate generator, the baud rates in Modes 1 and 3 are determined by the Timer 1 overflow rate and the value of SMOD as follows (see Table 45., page 59): Mode 1,3 Baud Rate = (2SMOD / 32) x (Timer 1 overflow rate) The Timer 1 Interrupt should be disabled in this application. The Timer itself can be configured for either “timer” or “counter” operation, and in any of its 3 running modes. In the most typical applications, it is configured for “timer” operation, in the Auto-reload Mode (high nibble of TMOD = 0010B). In that case the baud rate is given by the formula: Mode 1,3 Baud Rate = (2SMOD / 32) x (fOSC / (12 x [256 – (TH1)])) One can achieve very low baud rates with Timer 1 by leaving the Timer 1 Interrupt enabled, and configuring the Timer to run as a 16-bit timer (high nibble of TMOD = 0001B), and using the Timer 1 Interrupt to do a 16-bit software reload. Figure 22., page 50 lists various commonly used baud rates and how they can be obtained from Timer 1. Using Timer/Counter 2 to Generate Baud Rates. In the uPSD321x Devices, Timer 2 selected as the baud rate generator by setting TCLK and/or RCLK (see Figure 22., page 50 Timer/ Counter 2 Control Register (T2CON)). Note: The baud rate for transmit and receive can be simultaneously different. Setting RCLK and/or TCLK puts Timer into its Baud Rate Generator Mode. The RCLK and TCLK Bits in the T2CON register configure UART 1. The RCLK1 and TCLK1 Bits in the PCON register configure UART 2. 58/163 The Baud Rate Generator Mode is similar to the Auto-reload Mode, in that a roll over in TH2 causes the Timer 2 registers to be reloaded with the 16-bit value in registers RCAP2H and RCAP2L, which are preset by software. Now, the baud rates in Modes 1 and 3 are determined at Timer 2’s overflow rate as follows: Mode 1,3 Baud Rate = Timer 2 Overflow Rate / 16 The timer can be configured for either “timer” or “counter” operation. In the most typical applications, it is configured for “timer” operation (C/T2 = 0). “Timer” operation is a little different for Timer 2 when it’s being used as a baud rate generator. Normally, as a timer it would increment every machine cycle (thus at the 1/6 the CPU clock frequency). In the case, the baud rate is given by the formula: Mode 1,3 Baud Rate = fOSC / (32 x [65536 (RCAP2H, RCAP2L)] where (RCAP2H, RCAP2L) is the content of RC2H and RC2L taken as a 16-bit unsigned integer. Timer 2 also be used as the Baud Rate Generating Mode. This mode is valid only if RCLK + TCLK = 1 in T2CON or in PCON. Note: A roll-over in TH2 does not set TF2, and will not generate an interrupt. Therefore, the Timer interrupt does not have to be disabled when Timer 2 is in the Baud Rate Generator Mode. Note: If EXEN2 is set, a 1-to-0 transition in T2EX will set EXF2 but will not cause a reload from (RCAP2H, RCAP2L) to (TH2, TL2). Thus when Timer 2 is in use as a baud rate generator, T2EX can be used as an extra external interrupt, if desired. It should be noted that when Timer 2 is running (TR2 = 1) in “timer” function in the Baud Rate Generator Mode, one should not try to READ or WRITE TH2 or TL2. Under these conditions the timer is being incremented every state time, and the results of a READ or WRITE may not be accurate. The RC registers may be read, but should not be written to, because a WRITE might overlap a reload and cause WRITE and/or reload errors. Turn the timer off (clear TR2) before accessing the Timer 2 or RC registers, in this case. uPSD3212A, uPSD3212C, uPSD3212CV Table 45. Timer 1-Generated Commonly Used Baud Rates Baud Rate fOSC SMOD Timer 1 C/T Mode Reload Value Mode 0 Max: 1MHz 12MHz X X X X Mode 2 Max: 375K 12MHz 1 X X X Modes 1, 3: 62.5K 12MHz 1 0 2 FFh 19.2K 11.059MHz 1 0 2 FDh 9.6K 11.059MHz 0 0 2 FDh 4.8K 11.059MHz 0 0 2 FAh 2.4K 11.059MHz 0 0 2 F4h 1.2K 11.059MHz 0 0 2 E8h 137.5 11.059MHz 0 0 2 1Dh 110 6MHz 0 0 2 72h 110 12MHz 0 0 1 FEEBh More About Mode 0. Serial data enters and exits through RxD. TxD outputs the shift clock. 8 bits are transmitted/received: 8 data bits (LSB first). The baud rate is fixed at 1/12 the fOSC. Figure 27., page 56 shows a simplified functional diagram of the serial port in Mode 0, and associated timing. Transmission is initiated by any instruction that uses SBUF as a destination register. The “WRITE to SBUF” signal at S6P2 also loads a '1' into the 9th position of the transmit shift register and tells the TX Control block to commence a transmission. The internal timing is such that one full machine cycle will elapse between “WRITE to SBUF” and activation of SEND. SEND enables the output of the shift register to the alternate out-put function line of RxD and also enable SHIFT CLOCK to the alternate output function line of TxD. SHIFT CLOCK is low during S3, S4, and S5 of every machine cycle, and high during S6, S1, and S2. At S6P2 of every machine cycle in which SEND is active, the contents of the transmit shift are shifted to the right one position. As data bits shift out to the right, zeros come in from the left. When the MSB of the data byte is at the output position of the shift register, then the '1' that was initially loaded into the 9th position, is just to the left of the MSB, and all positions to the left of that contain zeros. This condition flags the TX Control block to do one last shift and then deactivate SEND and set T1. Both of these actions occur at S1P1. Both of these actions occur at S1P1 of the 10th machine cycle after “WRITE to SBUF.” Reception is initiated by the condition REN = 1 and R1 = 0. At S6P2 of the next machine cycle, the RX Control unit writes the bits 11111110 to the receive shift register, and in the next clock phase activates RECEIVE. RECEIVE enables SHIFT CLOCK to the alternate output function line of TxD. SHIFT CLOCK makes transitions at S3P1 and S6P1 of every machine cycle in which RECEIVE is active, the contents of the receive shift register are shifted to the left one position. The value that comes in from the right is the value that was sampled at the RxD pin at S5P2 of the same machine cycle. As data bits come in from the right, '1s' shift out to the left. When the '0' that was initially loaded into the right-most position arrives at the left-most position in the shift register, it flags the RX Control block to do one last shift and load SBUF. At S1P1 of the 10th machine cycle after the WRITE to SCON that cleared RI, RECEIVE is cleared as RI is set. 59/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 28. Serial Port Mode 0, Waveforms Write to SBUF Send Shift RxD (Data Out) TxD (Shift Clock) T S6P2 D0 D1 S3P1 D2 D3 D4 D5 D6 Transmit D7 S6P1 Write to SCON RI Receive Shift RxD (Data In) TxD (Shift Clock) Clear RI Receive D0 D1 D2 D3 D4 D5 D6 D7 AI06825 More About Mode 1. Ten bits are transmitted (through TxD), or received (through RxD): a start Bit (0), 8 data bits (LSB first). and a Stop Bit (1). On receive, the Stop Bit goes into RB8 in SCON. In the uPSD321x Devices the baud rate is determined by the Timer 1 or Timer 2 overflow rate. Figure 29., page 61 shows a simplified functional diagram of the serial port in Mode 1, and associated timings for transmit receive. Transmission is initiated by any instruction that uses SBUF as a destination register. The “WRITE to SBUF” signal also loads a '1' into the 9th bit position of the transmit shift register and flags the TX Control unit that a transmission is requested. Transmission actually commences at S1P1 of the machine cycle following the next rollover in the divide-by-16 counter. (Thus, the bit times are synchronized to the divide-by-16 counter, not to the “WRITE to SBUF” signal.) The transmission begins with activation of SEND which puts the start bit at TxD. One bit time later, DATA is activated, which enables the output bit of the transmit shift register to TxD. The first shift pulse occurs one bit time after that. As data bits shift out to the right, zeros are clocked in from the left (see Figure 30., page 61). When the MSB of the data byte is at the output position of the shift register, then the '1' that was initially loaded into the 9th position is just to the left of the MSB, and all positions to the left of that contain zeros. This condition flags the TX Control unit to do one last shift and then deactivate SEND and set TI. This occurs at the 10th divide-by-16 rollover after “WRITE to SBUF.” Reception is initiated by a detected 1-to-0 transition at RxD. For this purpose RxD is sampled at a 60/163 rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-by-16 counter is immediately reset, and 1FFH is written into the input shift register. Resetting the divide-by-16 counter aligns its roll-overs with the boundaries of the incoming bit times. The 16 states of the counter divide each bit time into 16ths. At the 7th, 8th, and 9th counter states of each bit time, the bit detector samples the value of RxD. The value accepted is the value that was seen in at least 2 of the 3 samples. This is done for noise rejection. If the value accepted during the first bit time is not '0,' the receive circuits are reset and the unit goes back to looking for an-other 1-to0 transition. This is to provide rejection of false start bits. If the start bit proves valid, it is shifted into the input shift register, and reception of the reset of the rest of the frame will proceed. As data bits come in from the right, '1s' shift out to the left. When the start bit arrives at the left-most position in the shift register (which in Mode 1 is a 9-bit register), it flags the RX Control block to do one last shift, load SBUF and RB8, and set RI. The signal to load SBUF and RB8, and to set RI, will be generated if, and only if, the following conditions are met at the time the final shift pulse is generated: 1. R1 = 0, and 2. Either SM2 = 0, or the received Stop Bit = 1. If either of these two conditions is not met, the received frame is irretrievably lost. If both conditions are met, the Stop Bit goes into RB8, the 8 data bits go into SBUF, and RI is activated. At this time, whether the above conditions are met or not, the unit goes back to looking for a 1-to-0 transition in RxD. uPSD3212A, uPSD3212C, uPSD3212CV Figure 29. Serial Port Mode 1, Block Diagram Timer1 Overflow Timer2 Overflow Internal Bus TB8 Write to SBUF D S Q CL ÷2 0 TxD SBUF 1 Zero Detector SMOD 0 1 Shift Start TCLK Tx Control ÷16 0 Tx Clock Data Send TI Serial Port Interrupt 1 RCLK ÷16 Sample Rx Clock 1-to-0 Transition Detector Load SBUF RI Shift Rx Control 1FFh Start Rx Detector Input Shift Register Load SBUF RxD Shift SBUF Read SBUF Internal Bus AI06826 Figure 30. Serial Port Mode 1, Waveforms Tx Clock Write to SBUF Send S1P1 Transmit Data Shift TxD T1 Rx Clock Start Bit D0 D1 D2 D3 D4 D5 D6 D7 Stop Bit D1 D2 D3 D4 D5 D6 D7 Stop Bit ÷16 Reset Start Bit RxD Bit Detector Sample Times Shift RI D0 Receive AI06843 61/163 uPSD3212A, uPSD3212C, uPSD3212CV More About Modes 2 and 3. Eleven bits are transmitted (through TxD), or received (through RxD): a Start Bit (0), 8 data bits (LSB first), a programmable 9th data bit, and a Stop Bit (1). On transmit, the 9th data bit (TB8) can be assigned the value of '0' or '1.' On receive, the data bit goes into RB8 in SCON. The baud rate is programmable to either 1/16 or 1/32 the CPU clock frequency in Mode 2. Mode 3 may have a variable baud rate generated from Timer 1. Figure 31., page 63 and Figure 33., page 64 show a functional diagram of the serial port in Modes 2 and 3. The receive portion is exactly the same as in Mode 1. The transmit portion differs from Mode 1 only in the 9th bit of the transmit shift register. Transmission is initiated by any instruction that uses SBUF as a destination register. The “WRITE to SBUF” signal also loads TB8 into the 9th bit position of the transmit shift register and flags the TX Control unit that a transmission is requested. Transmission commences at S1P1 of the machine cycle following the next roll-over in the divide-by16 counter. (Thus, the bit times are synchronized to the divide-by-16 counter, not to the “WRITE to SBUF” signal.) The transmission begins with activation of SEND, which puts the start bit at TxD. One bit time later, DATA is activated, which enables the output bit of the transmit shift register to TxD. The first shift pulse occurs one bit time after that (see Figure 32., page 63 and Figure 34., page 64). The first shift clocks a '1' (the Stop Bit) into the 9th bit position of the shift register. There-after, only zeros are clocked in. Thus, as data bits shift out to the right, zeros are clocked in from the left. When TB8 is at the out-put position of the shift register, then the Stop Bit is just to the left of TB8, and all positions to the left of that contain zeros. This condition flags the TX Control unit to do one last shift and then de- 62/163 activate SEND and set TI. This occurs at the 11th divide-by 16 rollover after “WRITE to SUBF.” Reception is initiated by a detected 1-to-0 transition at RxD. For this purpose RxD is sampled at a rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-by-16 counter is immediately reset, and 1FFH is written to the input shift register. At the 7th, 8th, and 9th counter states of each bit time, the bit detector samples the value of R-D. The value accepted is the value that was seen in at least 2 of the 3 samples. If the value accepted during the first bit time is not '0,' the receive circuits are reset and the unit goes back to looking for another 1-to-0 transition. If the Start Bit proves valid, it is shifted into the input shift register, and reception of the rest of the frame will proceed. As data bits come in from the right, '1s' shift out to the left. When the Start Bit arrives at the left-most position in the shift register (which in Modes 2 and 3 is a 9-bit register), it flags the RX Control block to do one last shift, load SBUF and RB8, and set RI. The signal to load SBUF and RB8, and to set RI, will be generated if, and only if, the following conditions are met at the time the final shift pulse is generated: 1. RI = 0, and 2. Either SM2 = 0, or the received 9th data bit = 1 If either of these conditions is not met, the received frame is irretrievably lost, and RI is not set. If both conditions are met, the received 9th data bit goes into RB8, and the first 8 data bits go into SBUF. One bit time later, whether the above conditions were met or not, the unit goes back to looking for a 1-to-0 transition at the RxD input. uPSD3212A, uPSD3212C, uPSD3212CV Figure 31. Serial Port Mode 2, Block Diagram Phase2 Clock 1/2*fOSC Internal Bus TB8 Write to SBUF D S Q CL ÷2 0 TxD SBUF 1 Zero Detector SMOD Shift Start Tx Control ÷16 Tx Clock Data Send TI Serial Port Interrupt ÷16 Sample Load SBUF RI Rx Clock 1-to-0 Transition Detector Shift Rx Control 1FFh Start Rx Detector Input Shift Register Load SBUF RxD Shift SBUF Read SBUF Internal Bus AI06844 Figure 32. Serial Port Mode 2, Waveforms Tx Clock Write to SBUF Send S1P1 Data Transmit Shift TxD TI Stop Bit Generator Rx Clock Start Bit D0 D1 D2 D3 D4 D5 D6 D7 TB8 Stop Bit D1 D2 D3 D4 D5 D6 D7 RB8 Stop Bit ÷16 Reset Start Bit RxD Bit Detector Sample Times Shift RI D0 Receive AI06845 63/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 33. Serial Port Mode 3, Block Diagram Timer1 Overflow Timer2 Overflow Internal Bus TB8 Write to SBUF D S Q CL ÷2 0 TxD SBUF 1 Zero Detector SMOD 0 1 Shift Start TCLK Tx Control ÷16 0 Tx Clock Data Send TI Serial Port Interrupt 1 RCLK ÷16 Sample Load SBUF RI Rx Clock 1-to-0 Transition Detector Shift Rx Control 1FFh Start Rx Detector Input Shift Register Load SBUF RxD Shift SBUF Read SBUF Internal Bus AI06846 Figure 34. Serial Port Mode 3, Waveforms Tx Clock Write to SBUF Send S1P1 Data Transmit Shift TxD TI Stop Bit Generator Rx Clock Start Bit D0 D1 D2 D3 D4 D5 D6 D7 TB8 Stop Bit D1 D2 D3 D4 D5 D6 D7 RB8 Stop Bit ÷16 Reset Start Bit RxD Bit Detector Sample Times Shift RI D0 Receive AI06847 64/163 uPSD3212A, uPSD3212C, uPSD3212CV ANALOG-TO-DIGITAL CONVERTOR (ADC) The analog to digital (A/D) converter allows conversion of an analog input to a corresponding 8-bit digital value. The A/D module has four analog inputs, which are multiplexed into one sample and hold. The output of the sample and hold is the input into the converter, which generates the result via successive approximation. The analog supply voltage is connected to AVREF of ladder resistance of A/D module. The A/D module has two registers which are the control register ACON and A/D result register ADAT. The register ACON, shown in Table 46 and Table 47., page 66, controls the operation of the A/D converter module. To use analog inputs, I/O is selected by P1SFS register. Also an 8-bit prescaler ASCL divides the main system clock input down to approximately 6MHz clock that is required for the ADC logic. Appropriate values need to be loaded into the prescaler based upon the main MCU clock frequency prior to use. The processing of conversion starts when the Start Bit ADST is set to '1.' After one cycle, it is cleared by hardware. The register ADAT contains the results of the A/D conversion. When conversion is completed, the result is loaded into the ADAT the A/D Conversion Status Bit ADSF is set to '1.' The block diagram of the A/D module is shown in Figure 35. The A/D Status Bit ADSF is set auto- matically when A/D conversion is completed, cleared when A/D conversion is in process. The ASCL should be loaded with a value that results in a clock rate of approximately 6MHz for the ADC using the following formula (see Table 48., page 66): ADC clock input = (fOSC / 2) / (Prescaler register value +1) Where fOSC is the MCU clock input frequency The conversion time for the ADC can be calculated as follows: ADC Conversion Time = 8 clock * 8bits * (ADC Clock) ~= 10.67usec (at 6MHz) ADC Interrupt The ADSF Bit in the ACON register is set to '1' when the A/D conversion is complete. The status bit can be driven by the MCU, or it can be configured to generate a falling edge interrupt when the conversion is complete. The ADSF Interrupt is enabled by setting the ADSFINT Bit in the PCON register. Once the bit is set, the external INT1 Interrupt is disabled and the ADSF Interrupt takes over as INT1. INT1 must be configured as if it is an edge interrupt input. The INP1 pin (p3.3) is available for general I/O functions, or Timer1 gate control. Figure 35. A/D Block Diagram Ladder Resistor Decode AVREF ACH0 ACH1 Input MUX Successive Approximation Circuit S/H Conversion Complete Interrupt ACH2 ACH3 ACON ADAT INTERNAL BUS AI06627 65/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 46. ADC SFR Memory Map SFR Addr Reg Name 95 ASCL 96 ADAT 97 ACON Bit Register Name 7 ADAT7 6 ADAT6 5 4 ADAT5 3 ADAT4 ADEN 2 1 Reset Comments Value 0 00 8-bit Prescaler for ADC clock ADAT3 ADAT2 ADAT1 ADAT0 00 ADC Data Register ADS1 ADS0 ADST ADSF 00 ADC Control Register Table 47. Description of the ACON Bits Bit Symbol 7 to 6 — ADEN 5 4 — Function Reserved ADC Enable Bit: 0 : ADC shut off and consumes no operating current 1 : enable ADC Reserved ADS1, ADS0 Analog channel select 3 to 2 1 0 0, 0, 1, 1, 0 1 0 1 Channel0 (ACH0) Channel1 (ACH1) Channel2 (ACH2) Channel3 (ACH3) ADST ADC Start Bit: 0 : force to zero 1 : start an ADC; after one cycle, bit is cleared to '0' ADSF ADC Status Bit: 0 : A/D conversion is in process 1 : A/D conversion is completed, not in process Table 48. ADC Clock Input 66/163 MCU Clock Frequency Prescaler Register Value ADC Clock 40MHz 2 6.7MHz 36MHz 2 6MHz 24MHz 1 6MHz 12MHz 0 6MHz uPSD3212A, uPSD3212C, uPSD3212CV PULSE WIDTH MODULATION (PWM) The PWM block has the following features: ■ Four-channel, 8-bit PWM unit with 16-bit prescaler ■ One-channel, 8-bit unit with programmable frequency and pulse width ■ PWM Output with programmable polarity 4-channel PWM Unit (PWM 0-3) The 8-bit counter of a PWM counts module 256 (i.e., from 0 to 255, inclusive). The value held in the 8-bit counter is compared to the contents of the Special Function Register (PWM 0-3) of the corresponding PWM. The polarity of the PWM outputs is programmable and selected by the PWML Bit in PWMCON register. Provided the contents of a PWM 0-3 register is greater than the counter value, the corresponding PWM output is set HIGH (with PWML = 0). When the contents of this register is less than or equal to the counter value, the corresponding PWM output is set LOW (with PWML = 0). The pulse-width-ratio is therefore de- fined by the contents of the corresponding Special Function Register (PWM 0-3) of a PWM. By loading the corresponding Special Function Register (PWM 0-3) with either 00H or FFH, the PWM output can be retained at a constant HIGH or LOW level respectively (with PWML = 0). For each PWM unit, there is a 16-bit Prescaler that are used to divide the main system clock to form the input clock for the corresponding PWM unit. This prescaler is used to define the desired repetition rate for the PWM unit. SFR registers B1h B2h are used to hold the 16-bit divisor values. The repetition frequency of the PWM output is given by: fPWM8 = (fOSC / prescaler0) / (2 x 256) And the input clock frequency to the PWM counters is = fOSC / 2 / (prescaler data value + 1) See I/O PORTS (MCU Module), page 40 for more information on how to configure the Port 4 pin as PWM output. 67/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 36. Four-Channel 8-bit PWM Block Diagram DATA BUS x4 8 8 CPU rd/wr 8-bit PWM0-PWM3 Data Registers 8 x4 8 load 8-bit PWM0-PWM3 Comparators Registers 8 x4 16-bit Prescaler Register (B2h,B1h) CPU rd/wr 8-bit PWM0-PWM3 Comparators 4 Port4.3 Port4.4 Port4.5 Port4.6 PWMCON bit7 (PWML) 16 8 8-bit Counter 16-bit Prescaler Counter fOSC/2 clock Overflow load PWMCON bit5 (PWME) AI06647 68/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 49. PWM SFR Memory Map SFR Reg Name Addr Bit Register Name 7 6 5 4 3 2 1 0 Reset Value Comment s PWML PWMP PWME CFG4 CFG3 CFG2 CFG1 CFG0 00 PWM Control Polarity A1 PWMCON A2 PWM0 00 PWM0 Output Duty Cycle A3 PWM1 00 PWM1 Output Duty Cycle A4 PWM2 00 PWM2 Output Duty Cycle A5 PWM3 00 PWM3 Output Duty Cycle AA PWM4P 00 PWM 4 Period AB PWM4W 00 PWM 4 Pulse Width B1 PSCL0L 00 Prescaler 0 Low (8-bit) B2 PSCL0H 00 Prescaler 0 High (8-bit) B3 PSCL1L 00 Prescaler 1 Low (8-bit) B4 PSCL1H 00 Prescaler 1 High (8-bit) PWMCON Register Bit Definition: – PWML = PWM 0-3 polarity control – PWMP = PWM 4 polarity control – PWME = PWM enable (0 = disabled, 1= enabled) – – CFG3..CFG0 = PWM 0-3 Output (0 = Open Drain; 1 = Push-Pull) CFG4 = PWM 4 Output (0 = Open Drain; 1 = Push-Pull) 69/163 uPSD3212A, uPSD3212C, uPSD3212CV Programmable Period 8-bit PWM The PWM 4 channel can be programmed to provide a PWM output with variable pulse width and period. The PWM 4 has a 16-bit Prescaler, an 8bit Counter, a Pulse Width Register, and a Period Register. The Pulse Width Register defines the PWM pulse width time, while the Period Register defines the period of the PWM. The input clock to the Prescaler is fOSC/2. The PWM 4 channel is assigned to Port 4.7. Figure 37. Programmable PWM 4 Channel Block Diagram DATA BUS 8 CPU RD/WR 8 8 8-bit PWM4P Register (Period) 8-bit PWM4W Register (Width) 8 8 8-bit PWM4 Comparator Register 8-bit PWM4 Comparator Register 8 CPU RD/WR 16-bit Prescaler Register Load Port 4.7 (B4h, B3h) 8 PWM4 Control 8 16 8-bit PWM4 Comparator fOSC / 2 16-bit Prescaler Counter Load 8-bit PWM4 Comparator Match 8 PWMCON Bit 6 (PWMP) 8 PWMCON Bit 5 (PWME) 8-bit Counter Clock Reset AI07091 70/163 uPSD3212A, uPSD3212C, uPSD3212CV PWM 4 Channel Operation The 16-bit Prescaler1 divides the input clock (fOSC/2) to the desired frequency, the resulting clock runs the 8-bit Counter of the PWM 4 channel. The input clock frequency to the PWM 4 Counter is: f PWM4 = (fOSC/2)/(Prescaler1 data value +1) When the Prescaler1 Register (B4h, B3h) is set to data value '0,' the maximum input clock frequency to the PWM 4 Counter is fOSC/2 and can be as high as 20MHz. The PWM 4 Counter is a free-running, 8-bit counter. The output of the counter is compared to the Compare Registers, which are loaded with data from the Pulse Width Register (PWM4W, ABh) and the Period Register (PWM4P, AAh). The Pulse Width Register defines the pulse duration or the Pulse Width, while the Period Register defines the period of the PWM. When the PWM 4 channel is enabled, the register values are loaded into the Comparator Registers and are compared to the Counter output. When the content of the counter is equal to or greater than the value in the Pulse Width Register, it sets the PWM 4 output to low (with PWMP Bit = 0). When the Period Register equals to the PWM4 Counter, the Counter is cleared, and the PWM 4 channel output is set to logic 'high' level (beginning of the next PWM pulse). The Period Register cannot have a value of “00” and its content should always be greater than the Pulse Width Register. The Prescaler1 Register, Pulse Width Register, and Period Register can be modified while the PWM 4 channel is active. The values of these registers are automatically loaded into the Prescaler Counter and Comparator Registers when the current PWM 4 period ends. The PWMCON Register (Bits 5 and 6) controls the enable/disable and polarity of the PWM 4 channel. Figure 38. PWM 4 With Programmable Pulse Width and Frequency Defined by Period Register PWM4 Defined by Pulse Width Register Switch Level RESET Counter AI07090 71/163 uPSD3212A, uPSD3212C, uPSD3212CV I2C INTERFACE The serial port supports the twin line I2C-bus, consisting of a data line (SDA1), and a clock line (SCL1) as shown in Figure 39. Depending on the configuration, the SDA1 and SCL1 lines may require pull-up resistors. These lines also function as I/O port lines if the I2C bus is not enabled. The system is unique because data transport, clock generation, address recognition, and bus control arbitration are all controlled by hardware. The I2C serial I/O has complete autonomy in byte handling and operates in 4 modes. ■ Master transmitter ■ Master receiver Slave transmitter Slave receiver These functions are controlled by the SFRs (see Tables 50, 51, and Table 52., page 73): – S2CON: the control of byte handling and the operation of 4 mode. – S2STA: the contents of its register may also be used as a vector to various service routines. – S2DAT: data shift register. – S2ADR: slave address register. Slave address recognition is performed by On-Chip H/W. ■ ■ Figure 39. Block Diagram of the I2C Bus Serial I/O 7 0 Slave Address 7 0 Shift Register SDA1 Internal Bus Arbitration and Sync. Logic Bus Clock Generator SCL1 7 0 Control Register 7 0 Status Register AI07430 Table 50. Serial Control Register (S2CON) 7 6 5 4 3 2 1 0 CR2 ENII STA STO ADDR AA CR1 CR0 72/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 51. Description of the S2CON Bits Bit Symbol Function 7 CR2 This bit along with Bits CR1and CR0 determines the serial clock frequency when SIO is in the Master Mode. 6 ENII Enable IIC. When ENI1 = 0, the IIC is disabled. SDA and SCL outputs are in the high impedance state. 5 STA START Flag. When this bit is set, the SIO H/W checks the status of the I2C-bus and generates a START condition if the bus free. If the bus is busy, the SIO will generate a repeated START condition when this bit is set. 4 STO STOP Flag. With this bit set while in Master Mode a STOP condition is generated. When a STOP condition is detected on the I2C bus, the I2C hardware clears the STO Flag. Note: This bit have to be set before 1 cycle interrupt period of STOP. That is, if this bit is set, STOP condition in Master Mode is generated after 1 cycle interrupt period. 3 ADDR 2 AA 1 CR1 0 CR0 This bit is set when address byte was received. Must be cleared by software. Acknowledge enable signal. If this bit is set, an acknowledge (low level to SDA) is returned during the acknowledge clock pulse on the SCL line when: • Own slave address is received • A data byte is received while the device is programmed to be a Master Receiver • A data byte is received while the device is a selected Slave Receiver. When this bit is reset, no acknowledge is returned. SIO release SDA line as high during the acknowledge clock pulse. These two bits along with the CR2 Bit determine the serial clock frequency when SIO is in the Master Mode. Table 52. Selection of the Serial Clock Frequency SCL in Master Mode CR2 CR1 CR0 Bit Rate (kHz) at fOSC fOSC Divisor 12MHz 24MHz 36MHz 40MHz 0 0 0 16 375 750 X X 0 0 1 24 250 500 750 833 0 1 0 30 200 400 600 666 0 1 1 60 100 200 300 333 1 0 0 120 50 100 150 166 1 0 1 240 25 50 75 83 1 1 0 480 12.5 25 37.5 41 1 1 1 960 6.25 12.5 18.75 20 73/163 uPSD3212A, uPSD3212C, uPSD3212CV Serial Status Register (S2STA) S2STA is a “Read-only” register. The contents of this register may be used as a vector to a service routine. This optimized the response time of the software and consequently that of the I2C bus. The status codes for all possible modes of the I2C bus interface are given Table 54. This flag is set, and an interrupt is generated, after any of the following events occur: 1. Own slave address has been received during AA = 1: ack_int 2. The general call address has been received while GC(S2ADR.0) = 1 and AA = 1: 3. A data byte has been received or transmitted in Master Mode (even if arbitration is lost): ack_int 4. A data byte has been received or transmitted as selected slave: ack_int 5. A stop condition is received as selected slave receiver or transmitter: stop_int Data Shift Register (S2DAT) S2DAT contains the serial data to be transmitted or data which has just been received. The MSB (Bit 7) is transmitted or received first; that is, data shifted from right to left. Table 53. Serial Status Register (S2STA) 7 6 5 4 3 2 1 0 GC STOP INTR TX_MODE BBUSY BLOST /ACK_REP SLV Table 54. Description of the S2STA Bits Bit Symbol Function 7 GC 6 STOP 5 INTR(1,2) 4 TX_MODE 3 BBUSY Bus Busy Flag. This bit is set when the bus is being used by another master; otherwise, this bit is reset 2 BLOST Bus Lost Flag. This bit is set when the master loses the bus contention; otherwise this bit is reset 1 /ACK_REP 0 SLV General Call Flag Stop Flag. This bit is set when a STOP condition is received Interrupt Flag. This bit is set when an I²C Interrupt condition is requested Transmission Mode Flag. This bit is set when the I²C is a transmitter; otherwise this bit is reset Acknowledge Response Flag. This bit is set when the receiver transmits the not acknowledge signal This bit is reset when the receiver transmits the acknowledge signal Slave Mode Flag. This bit is set when the I²C plays role in the Slave Mode; otherwise this bit is reset Note: 1. Interrupt Flag Bit (INTR, S2STA Bit 5) is cleared by Hardware as reading S2STA register. 2. I2C Interrupt Flag (INTR) can occur in below case. Table 55. Data Shift Register (S2DAT) 7 6 5 4 3 2 1 0 S2DAT7 S2DAT6 S2DAT5 S2DAT4 S2DAT3 S2DAT2 S2DAT1 S2DAT0 74/163 uPSD3212A, uPSD3212C, uPSD3212CV Address Register (S2ADR) This 8-bit register may be loaded with the 7-bit slave address to which the controller will respond when programmed as a slave receive/transmitter. The Start/Stop Hold Time Detection and System Clock registers (Tables 57 and 58) are included in the I2C unit to specify the start/stop detection time to work with the large range of MCU frequency values supported. For example, with a system clock of 40MHz. Table 56. Address Register (S2ADR) 7 6 5 4 3 2 1 0 SLA6 SLA5 SLA4 SLA3 SLA2 SLA1 SLA0 — Note: SLA6 to SLA0: Own slave address. Table 57. Start /Stop Hold Time Detection Register (S2SETUP) SFR Address Register Name Reset Value Note D2h S2SETUP 00h To control the start/stop hold time detection for the multi-master I²C module in Slave Mode Table 58. System Cock of 40MHz S1SETUP, S2SETUP Register Value Number of Sample Clock (fOSC/2 – > 50ns) Required Start/ Stop Hold Time 00h 1EA 50ns 80h 1EA 50ns 81h 2EA 100ns 82h 3EA 150ns ... ... ... 8Bh 12EA 600ns ... ... ... FFh 128EA 6000ns Note When Bit 7 (enable bit) = 0, the number of sample clock is 1EA (ignore Bit 6 to Bit 0) Fast Mode I²C Start/Stop hold time specification Table 59. System Clock Setup Examples System Clock S1SETUP, S2SETUP Register Value Number of Sample Clock Required Start/Stop Hold Time 40MHz (fOSC/2 – > 50ns) 8Bh 12 EA 600ns 30MHz (fOSC/2 – > 66.6ns) 89h 9 EA 600ns 20MHz (fOSC/2 – > 100ns) 86h 6 EA 600ns 8MHz (fOSC/2 – > 250ns) 83h 3 EA 750ns 75/163 uPSD3212A, uPSD3212C, uPSD3212CV USB HARDWARE The characteristics of USB hardware are as follows: ■ Complies with the Universal Serial Bus specification Rev. 1.1 ■ Integrated SIE (Serial Interface Engine), FIFO memory and transceiver ■ Low speed (1.5Mbit/s) device capability ■ Supports control endpoint0 and interrupt endpoint1 and 2 ■ USB clock input must be 6MHz (requires MCU clock frequency to be 12, 24, or 36MHz). The analog front-end is an on-chip generic USB transceiver. It is designed to allow voltage levels equal to VDD from the standard logic to interface with the physical layer of the Universal Serial Bus. It is capable of receiving and transmitting serial data at low speed (1.5Mb/s). The SIE is the digital-front-end of the USB block. This module recovers the 1.5MHz clock, detects the USB sync word and handles all low-level USB protocols and error checking. The bit-clock recovery circuit recovers the clock from the incoming USB data stream and is able to track jitter and frequency drift according to the USB specification. The SIE also translates the electrical USB signals into bytes or signals. Depending upon the device USB address and the USB endpoint. Address, the USB data is directed to the correct endpoint on SIE interface. The data transfer of this H/W could be of type control or interrupt. The device’s USB address and the enabling of the endpoints are programmable in the SIE configuration header. USB related registers The USB block is controlled via seven registers in the memory: (UADR, UCON0, UCON1, UCON2, UISTA, UIEN, and USTA). Three memory locations on chip which communicate the USB block are: ■ USB endpoint0 data transmit register (UDT0) ■ USB endpoint0 data receive register (UDR0) ■ USB endpoint1 data transmit register (UDT1) Table 60. USB Address Register (UADR: 0EEh) 7 6 5 4 3 2 1 0 USBEN UADD6 UADD5 UADD4 UADD3 UADD2 UADD1 UADD0 Table 61. Description of the UADR Bits Bit Symbol R/W Function 7 USBEN R/W USB Function Enable Bit. When USBEN is clear, the USB module will not respond to any tokens from host. RESET clears this bit. 6 to 0 UADD6 to UADD0 R/W Specify the USB address of the device. RESET clears these bits. 76/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 62. USB Interrupt Enable Register (UIEN: 0E9h) 7 6 5 4 3 2 1 0 SUSPNDI RSTE RSTFIE TXD0IE RXD0IE TXD1IE EOPIE RESUMI Table 63. Description of the UIEN Bits Bit Symbol R/W Function 7 SUSPNDI R/W Enable SUSPND Interrupt 6 RSTE R/W Enable USB Reset; also resets the CPU and PSD Modules when bit is set to '1.' 5 RSTFIE R/W Enable RSTF (USB Bus Reset Flag) Interrupt 4 TXD0IE R/W Enable TXD0 Interrupt 3 RXD0IE R/W Enable RXD0 Interrupt 2 TXD1IE R/W Enable TXD1 Interrupt 1 EOPIE R/W Enable EOP Interrupt 0 RESUMI R/W Enable USB Resume Interrupt when it is the Suspend Mode 77/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 64. USB Interrupt Status Register (UISTA: 0E8h) 7 6 5 4 3 2 1 0 SUSPND — RSTF TXD0F RXD0F TXD1F EOPF RESUMF Table 65. Description of the UISTA Bits Bit Symbol R/W Function USB Suspend Mode Flag. To save power, this bit should be set if a 3ms constant idle state is detected on USB bus. Setting this bit stops the clock to the USB and causes the USB module to enter Suspend Mode. Software must clear this bit after the Resume flag (RESUMF) is set while this Resume Interrupt Flag is serviced 7 SUSPND R/W 6 — — Reserved R USB Reset Flag. This bit is set when a valid RESET signal state is detected on the D+ and D- lines. When the RSTE bit in the UIEN Register is set, this reset detection will also generate an internal reset signal to reset the CPU and other peripherals including the USB module. R/W Endpoint0 Data Transmit Flag. This bit is set after the data stored in Endpoint 0 transmit buffers has been sent and an ACK handshake packet from the host is received. Once the next set of data is ready in the transmit buffers, software must clear this flag. To enable the next data packet transmission, TX0E must also be set. If TXD0F Bit is not cleared, a NAK handshake will be returned in the next IN transactions. RESET clears this bit. R/W Endpoint0 Data Receive Flag. This bit is set after the USB module has received a data packet and responded with ACK handshake packet. Software must clear this flag after all of the received data has been read. Software must also set RX0E Bit to one to enable the next data packet reception. If RXD0F Bit is not cleared, a NAK handshake will be returned in the next OUT transaction. RESET clears this bit. 5 4 3 RSTF TXD0F RXD0F 2 TXD1F R/W Endpoint1 / Endpoint2 Data Transmit Flag. This bit is shared by Endpoints 1 and Endpoints 2. It is set after the data stored in the shared Endpoint 1/ Endpoint 2 transmit buffer has been sent and an ACK handshake packet from the host is received. Once the next set of data is ready in the transmit buffers, software must clear this flag. To enable the next data packet transmission, TX1E must also be set. If TXD1F Bit is not cleared, a NAK handshake will be returned in the next IN transaction. RESET clears this bit. 1 EOPF R/W End of Packet Flag. This bit is set when a valid End of Packet sequence is detected on the D+ and D-line. Software must clear this flag. RESET clears this bit. 0 RESUMF R/W Resume Flag. This bit is set when USB bus activity is detected while the SUSPND Bit is set. Software must clear this flag. RESET clears this bit. 78/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 66. USB Endpoint0 Transmit Control Register (UCON0: 0EAh) 7 6 5 4 3 2 1 0 TSEQ0 STALL0 TX0E RX0E TP0SIZ3 TP0SIZ2 TP0SIZ1 TP0SIZ0 Table 67. Description of the UCON0 Bits Bit 7 6 5 Symbol TSEQ0 STALL0 TX0E R/W Function R/W Endpoint0 Data Sequence Bit. (0=DATA0, 1=DATA1) This bit determines which type of data packet (DATA0 or DATA1) will be sent during the next IN transaction. Toggling of this bit must be controlled by software. RESET clears this bit R/W Endpoint0 Force Stall Bit. This bit causes Endpoint 0 to return a STALL handshake when polled by either an IN or OUT token by the USB Host Controller. The USB hardware clears this bit when a SETUP token is received. RESET clears this bit. R/W Endpoint0 Transmit Enable. This bit enables a transmit to occur when the USB Host Controller sends an IN token to Endpoint 0. Software should set this bit when data is ready to be transmitted. It must be cleared by software when no more Endpoint 0 data needs to be transmitted. If this bit is '0' or the TXD0F is set, the USB will respond with a NAK handshake to any Endpoint 0 IN tokens. RESET clears this bit. 4 RX0E R/W Endpoint0 receive enable. This bit enables a receive to occur when the USB Host Controller sends an OUT token to Endpoint 0. Software should set this bit when data is ready to be received. It must be cleared by software when data cannot be received. If this bit is '0' or the RXD0F is set, the USB will respond with a NAK handshake to any Endpoint 0 OUT tokens. RESET clears this bit. 3 to 0 TP0SIZ3 to TP0SIZ0 R/W The number of transmit data bytes. These bits are cleared by RESET. 79/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 68. USB Endpoint1 (and 2) Transmit Control Register (UCON1: 0EBh) 7 6 5 4 3 2 1 0 TSEQ1 EP12SEL TX1E FRESUM TP1SIZ3 TP1SIZ2 TP1SIZ1 TP1SIZ0 Table 69. Description of the UCON1 Bits Bit 7 6 5 Symbol TSEQ1 EP12SEL TX1E R/W Function R/W Endpoint 1/ Endpoint 2 Transmit Data Packet PID. (0=DATA0, 1=DATA1) This bit determines which type of data packet (DATA0 or DATA1) will be sent during the next IN transaction directed to Endpoint 1 or Endpoint 2. Toggling of this bit must be controlled by software. RESET clears this bit. R/W Endpoint 1/ Endpoint 2 Transmit Selection. (0=Endpoint 1, 1=Endpoint 2) This bit specifies whether the data inside the registers UDT1 are used for Endpoint 1 or Endpoint 2. If all the conditions for a successful Endpoint 2 USB response to a hosts IN token are satisfied (TXD1F=0, TX1E=1, STALL2=0, and EP2E=1) except that the EP12SEL Bit is configured for Endpoint 1, the USB responds with a NAK handshake packet. RESET clears this bit. R/W Endpoint1 / Endpoint2 Transmit Enable. This bit enables a transmit to occur when the USB Host Controller send an IN token to Endpoint 1 or Endpoint 2. The appropriate endpoint enable bit, EP1E or EP2E Bit in the UCON2 register, should also be set. Software should set the TX1E Bit when data is ready to be transmitted. It must be cleared by software when no more data needs to be transmitted. If this bit is '0' or TXD1F is set, the USB will respond with a NAK handshake to any Endpoint 1 or Endpoint 2 directed IN token. RESET clears this bit. 4 FRESUM R/W Force Resume. This bit forces a resume state (“K” on non-idle state) on the USB data lines to initiate a remote wake-up. Software should control the timing of the forced resume to be between 10ms and 15ms. Setting this bit will not cause the RESUMF Bit to set. 3 to 0 TP1SIZ3 to TP1SIZ0 R/W The number of transmit data bytes. These bits are cleared by RESET. 80/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 70. USB Control Register (UCON2: 0ECh) 7 6 5 4 3 2 1 0 — — — SOUT EP2E EP1E STALL2 STALL1 Table 71. Description of the UCON2 Bits Bit Symbol R/W Function 7 to 5 — — 4 SOUT R/W Status out is used to automatically respond to the OUT of a control READ transfer 3 EP2E R/W Endpoint2 enable. RESET clears this bit 2 EP1E R/W Endpoint1 enable. RESET clears this bit 1 STALL2 R/W Endpoint2 Force Stall Bit. RESET clears this bit 0 STALL1 R/W Endpoint1 Force Stall Bit. RESET clears this bit Reserved Table 72. USB Endpoint0 Status Register (USTA: 0EDh) 7 6 5 4 3 2 1 0 RSEQ SETUP IN OUT RP0SIZ3 RP0SIZ2 RP0SIZ1 RP0SIZ0 Table 73. Description of the USTA Bits Bit Symbol R/W Function 7 RSEQ R/W 6 SETUP R SETUP Token Detect Bit. This bit is set when the received token packet is a SEPUP token, PID = b1101. 5 IN R IN Token Detect Bit. This bit is set when the received token packet is an IN token. 4 OUT R OUT Token Detect Bit. This bit is set when the received token packet is an OUT token. 3 to 0 RP0SIZ3 to RP0SIZ0 R The number of data bytes received in a DATA packet Endpoint0 receive data packet PID. (0=DATA0, 1=DATA1) This bit will be compared with the type of data packet last received for Endpoint0 Table 74. USB Endpoint0 Data Receive Register (UDR0: 0EFh) 7 6 5 4 3 2 1 0 UDR0.7 UDR0.6 UDR0.5 UDR0.4 UDR0.3 UDR0.2 UDR0.1 UDR0.0 Table 75. USB Endpoint0 Data Transmit Register (UDT0: 0E7h) 7 6 5 4 3 2 1 0 UDT0.7 UDT0.6 UDT0.5 UDT0.4 UDT0.3 UDT0.2 UDT0.1 UDT0.0 Table 76. USB Endpoint1 Data Transmit Register (UDT1: 0E6h) 7 6 5 4 3 2 1 0 UDT1.7 UDT1.6 UDT1.5 UDT1.4 UDT1.3 UDT1.2 UDT1.1 UDT1.0 81/163 uPSD3212A, uPSD3212C, uPSD3212CV The USCL 8-bit Prescaler Register for USB is at E1h. The USCL should be loaded with a value that results in a clock rate of 6MHz for the USB using the following formula: USB clock input = (fOSC / 2) / (Prescaler register value +1) Where fOSC is the MCU clock input frequency. Note: USB works ONLY with the MCU Clock frequencies of 12, 24, or 36MHz. The Prescaler values for these frequencies are 0, 1, and 2. Table 77. USB SFR Memory Map SFR Reg Addr Name Bit Register Name 7 6 5 4 3 2 1 0 Reset Comments Value 00 8-bit Prescaler for USB logic UDT1.0 00 USB Endpt1 Data Xmit UDT0.1 UDT0.0 00 USB Endpt0 Data Xmit RXD1F EOPF RESUMF 00 USB Interrupt Status TXD1IE EOPIE RESUMIE 00 USB Interrupt Enable TP0SIZ3 TP0SIZ2 TP0SIZ1 TP0SIZ0 00 USB Endpt0 Xmit Control FRESUM TP1SIZ3 TP1SIZ2 TP1SIZ1 TP1SIZ0 00 USB Endpt1 Xmit Control 00 USB Control Register 00 USB Endpt0 Status E1 USCL E6 UDT1 UDT1.7 UDT1.6 UDT1.5 UDT1.4 UDT1.3 UDT1.2 UDT1.1 E7 UDT0 UDT0.7 UDT0.6 UDT0.5 UDT0.4 UDT0.3 UDT0.2 E8 UISTA SUSPND — RSTF TXD0F RXD0F E9 UIEN SUSPNDIE RSTE RSTFIE TXD0IE RXD0IE RX0E EA UCON0 TSEQ0 STALL0 TX0E EB UCON1 TSEQ1 EP12SEL — EC UCON2 — — — SOUT EP2E EP1E STALL2 STALL1 ED USTA RSEQ SETUP IN OUT EE UADR USBEN UADD6 UADD5 UADD4 UADD3 UADD2 UADD1 UADD0 00 USB Address Register EF UDR0 UDR0.7 UDR0.6 UDR0.5 UDR0.4 UDR0.3 UDR0.2 UDR0.1 UDR0.0 00 USB Endpt0 Data Recv 82/163 RP0SIZ3 RP0SIZ2 RP0SIZ1 RP0SIZ0 uPSD3212A, uPSD3212C, uPSD3212CV Transceiver USB Physical Layer Characteristics. The following section describes the uPSD321x Devices compliance to the Chapter 7 Electrical section of the USB Specification, Revision 1.1. The section contains all signaling, and physical layer specifications necessary to describe a low speed USB function. Low Speed Driver Characteristics. The uPSD321x Devices use a differential output driver to drive the Low Speed USB data signal onto the USB cable. The output swings between the differential high and low state are well balanced to minimize signal skew. The slew rate control on the driver minimizes the radiated noise and cross talk on the USB cable. The driver’s outputs support three-state operation to achieve bi-directional half duplex operation. The uPSD321x Devices driver tolerates a voltage on the signal pins of -0.5V to 3.6V with respect to local ground reference without damage. The driver tolerates this voltage for 10.0µs while the driver is active and driving, and tolerates this condition indefinitely when the driver is in its high impedance state. A low speed USB connection is made through an unshielded, untwisted wire cable a maximum of 3 meters in length. The rise and fall time of the signals on this cable are well controlled to reduce RFI emissions while limiting delays, signaling skews and distortions. The uPSD321x Devices driver reaches the specified static signal levels with smooth rise and fall times, resulting in segments between low speed devices and the ports to which they are connected. Figure 40. Low Speed Driver Signal Waveforms One Bit Time 1.5 Mb/s VSE(max) Driver Signal Pins Signal pins pass output spec levels with minimal reflections and ringing VSE(min) VSS AI06629 83/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 78. Transceiver DC Characteristics Symb Parameter Test Conditions(1) Min Max Unit VOH Static Output High 15kΩ ± 5% to GND(2,3) 2.8 3.6 V VOL Static Output Low Notes 2, 3 — 0.3 V VDI Differential Input Sensitivity |(D+) - (D-)|, Figure 43., page 86 0.2 — V VCM Differential Input Common Mode Figure 43., page 86 0.8 2.5 V VSE Single Ended Receiver Threshold — 0.8 2.0 V CIN Transceiver Capacitance — — 20 pF IIO Data Line (D+, D-) Leakage 0V < (D+,D-) < 3.3 –10 10 µA RPU External Bus Pull-up Resistance, D- 7.5kΩ ± 2% to VCC 7.35 7.65 kΩ RPD External Bus Pull-down Resistance 15kΩ ± 5% 14.25 15.75 kΩ Test Conditions(1) Min Max Unit 1.4775 1.5225 Mbit/s Note: 1. VCC = 5V ± 10%; VSS = 0V; TA = 0 to 70°C. 2. Level guaranteed for range of VCC = 4.5V to 5.5V. 3. With RPU, external idle resistor, 7.5κ±2%, D- to VCC . Table 79. Transceiver AC Characteristics Symb tDRATE Parameter Low Speed Data Rate Ave. bit rate (1.5Mb/s ± 1.5%) tDJR1 Receiver Data Jitter Tolerance To next transition, Figure 43., page 86(5) –75 75 ns tDJR2 Differential Input Sensitivity For paired transition, Figure 43., page 86(5) –45 45 ns tDEOP Differential to EOP Transition Skew Figure 44., page 87(5) –40 100 ns tEOPR1 EOP Width at Receiver Rejects as EOP(5,6) 165 — ns tEOPR2 EOP Width at Receiver Accepts as EOP(5) 675 — ns tEOPT Source EOP Width — –1.25 1.50 µs tUDJ1 Differential Driver Jitter To next transition, Figure 45., page 87 –95 95 ns tUDJ2 Differential Driver Jitter To paired transition, Figure 45., page 87 –150 150 ns tR USB Data Transition Rise Time Notes 2, 3, 4 75 300 ns tF USB Data Transition Fall Time Notes 2, 3, 4 75 300 ns tRFM Rise/Fall Time Matching tR / tF 80 120 % VCRS Output Signal Crossover Volt age — 1.3 2.0 V Note: 1. 2. 3. 4. 5. 6. 84/163 VCC = 5V ± 10%; VSS = 0V; TA = 0 to 70°C. Level guaranteed for range of VCC = 4.5V to 5.5V. With RPU, external idle resistor, 7.5κ±2%, D- to VCC . CL of 50pF(75ns) to 350pF (300ns). Measured at crossover point of differential data signals. USB specification indicates 330ns. uPSD3212A, uPSD3212C, uPSD3212CV Receiver Characteristics The uPSD321x Devices has a differential input receiver which is able to accept the USB data signal. The receiver features an input sensitivity of at least 200mV when both differential data inputs are in the range of at least 0.8V to 2.5V with respect to its local ground reference. This is the common mode range, as shown in Figure 41. The receiver tolerates static input voltages between -0.5V to 3.8V with respect to its local ground reference without damage. In addition to the differential receiver, there is a single-ended receiver for each of the two data lines. The single-ended receivers have a switching threshold between 0.8V and 2.0V (TTL inputs). Minimum Differential Sensitivity (volts) Figure 41. Differential Input Sensitivity Over Entire Common Mode Range 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Common Mode Input Voltage (volts) 2.6 2.8 3.0 3.2 AI06630 85/163 uPSD3212A, uPSD3212C, uPSD3212CV External USB Pull-Up Resistor The USB system specifies a pull-up resistor on the D- pin for low-speed peripherals. The USB Spec 1.1 describes a 1.5kΩ pull-up resistor to a 3.3V supply. An approved alternative method is a 7.5kΩ pull-up to the USB VCC supply. This alterna- tive is defined for low-speed devices with an integrated cable. The chip is specified for the 7.5kΩ pull-up. This eliminates the need for an external 3.3V regulator, or for a pin dedicated to providing a 3.3V output from the chip. Figure 42. USB Data Signal Timing and Voltage Levels tR VOH tF D+ 90% 90% VCR VOL 10% 10% D- AI06631 Figure 43. Receiver Jitter Tolerance TPERIOD Differential Data Lines TJR TJR1 TJR2 Consecutive Transitions N*TPERIOD+TJR1 Paired Transitions N*TPERIOD+TJR2 86/163 AI06632 uPSD3212A, uPSD3212C, uPSD3212CV Figure 44. Differential to EOP Transition Skew and EOP Width TPERIOD Crossover Point Extended Crossover Point Differential Data Lines Diff. Data to SE0 Skew N*TPERIOD+TDEOP Source EOP Width: TEOPT Receiver EOP Width TEOPR1, TEOPR2 AI06633 Figure 45. Differential Data Jitter TPERIOD Differential Data Lines Crossover Points Consecutive Transitions N*TPERIOD+TxJR1 Paired Transitions N*TPERIOD+TxJR2 AI06634 87/163 uPSD3212A, uPSD3212C, uPSD3212CV PSD MODULE The PSD Module provides configurable Program and Data memories to the 8032 CPU core (MCU). In addition, it has its own set of I/ O ports and a PLD with 16 macrocells for general logic implementation. ■ Ports A,B,C, and D are general purpose programmable I/O ports that have a port architecture which is different from the I/O ports in the MCU Module. ■ The PSD Module communicates with the MCU Module through the internal address, data bus (A0-A15, D0-D7) and control signals (RD, WR, PSEN, ALE, RESET). The user defines the Decoding PLD in the PSDsoft Development Tool and can map the resources in the PSD Module to any program or data address space. Figure 46 shows the functional blocks in the PSD Module. Functional Overview – 512Kbit Flash memory. This is the main Flash memory. It is divided into 4 sectors (16KBytes each) that can be accessed with userspecified addresses. – Secondary 128Kbit Flash boot memory. It is divided into 2 sectors (8KBytes each) that can be accessed with user-specified addresses. This secondary memory brings the ability to execute code and update the main Flash concurrently. – 16Kbit SRAM. The SRAM’s contents can be protected from a power failure by connecting an external battery. – CPLD with 16 Output Micro Cells (OMCs) and up to 20 Input Micro Cells (IMCs). The CPLD may be used to efficiently implement a variety of logic functions for internal and external control. Examples include state machines, loadable shift registers, and loadable counters. ■ 88/163 – Decode PLD (DPLD) that decodes address for selection of memory blocks in the PSD Module. – Configurable I/O ports (Port A,B,C and D) that can be used for the following functions: MCU I/Os; PLD I/Os; Latched MCU address output; and Special function I/Os. Note: I/O ports may be configured as open drain outputs. – Built-in JTAG compliant serial port allows fullchip, In-System Programmability (ISP). With it, you can program a blank device or reprogram a device in the factory or the field. – Internal page register that can be used to expand the 8032 MCU Module address space by a factor of 256. – Internal programmable Power Management Unit (PMU) that supports a low-power mode called Power-down Mode. The PMU can automatically detect a lack of the 8032 CPU core activity and put the PSD Module into Power-down Mode. – Erase/WRITE cycles: Flash memory - 100,000 minimum PLD - 1,000 minimum Data Retention: 15 year minimum (for Main Flash memory, Boot, PLD and Configuration bits) D0 – D7 WR_, RD_, PSEN_, ALE, RESET_, A0-A15 8032 Bus CLKIN (PD1) GLOBAL CONFIG. & SECURITY BUS Interface BUS Interface PLD INPUT BUS CLKIN 73 8 CSIOP CLKIN 16KBIT BATTERY BACKUP SRAM 128KBIT SECONDARY NON-VOLATILE MEMORY (BOOT OR DATA) 2 SECTORS 2 EXT CS TO PORT D JTAG SERIAL CHANNEL PORT A ,B & C 20 INPUT MACROCELLS PORT A ,B & C 16 OUTPUT MACROCELLS PLD, CONFIGURATION & FLASH MEMORY LOADER 8 SECTORS 512KBIT PRIMARY FLASH MEMORY RUNTIME CONTROL AND I/O REGISTERS PERIP I/O MODE SELECTS SRAM SELECT SECTOR SELECTS FLASH ISP CPLD (CPLD) FLASH DECODE PLD (DPLD) SECTOR SELECTS EMBEDDED ALGORITHM MACROCELL FEEDBACK OR PORT INPUT 73 PAGE REGISTER ADDRESS/DATA/CONTROL BUS PORT D PROG. PORT PORT C PROG. PORT PORT B PROG. PORT PORT A PROG. PORT POWER MANGMT UNIT PD1 – PD2 PC0 – PC7 PB0 – PB7 PA0 – PA7 VSTDBY (PC2) uPSD3212A, uPSD3212C, uPSD3212CV Figure 46. PSD MODULE Block Diagram AI07431 89/163 uPSD3212A, uPSD3212C, uPSD3212CV In-System Programming (ISP) Using the JTAG signals on Port C, the entire PSD MODULE device can be programmed or erased without the use of the MCU. The primary Flash memory can also be programmed in-system by the MCU executing the programming algorithms out of the secondary memory, or SRAM. The secondary memory can be programmed the same way by executing out of the primary Flash memory. The PLD or other PSD MODULE Configuration blocks can be programmed through the JTAG port or a device programmer. Table 80 indicates which programming methods can program different functional blocks of the PSD MODULE. Table 80. Methods of Programming Different Functional Blocks of the PSD MODULE Functional Block JTAG Programming Device Programmer Primary Flash Memory Yes Yes Yes Secondary Flash Memory Yes Yes Yes PLD Array (DPLD and CPLD) Yes Yes No PSD MODULE Configuration Yes Yes No 90/163 IAP uPSD3212A, uPSD3212C, uPSD3212CV DEVELOPMENT SYSTEM The uPSD3200 is supported by PSDsoft, a Windows-based software development tool (Windows-95, Windows-98, Windows-NT). A PSD MODULE design is quickly and easily produced in a point and click environment. The designer does not need to enter Hardware Description Language (HDL) equations, unless desired, to define PSD MODULE pin functions and memory map information. The general design flow is shown in Figure 47. PSDsoft is available from our web site (the ad- dress is given on the back page of this data sheet) or other distribution channels. PSDsoft directly supports a low cost device programmer from ST: FlashLINK (JTAG). The programmer may be purchased through your local distributor/representative. The uPSD3200 is also supported by third party device programmers. See our web site for the current list. Figure 47. PSDsoft Express Development Tool Choose µPSD Define µPSD Pin and Node Functions Point and click definition of PSD pin functions, internal nodes, and MCU system memory map Define General Purpose Logic in CPLD C Code Generation Point and click definition of combinatorial and registered logic in CPLD. Access HDL is available if needed GENERATE C CODE SPECIFIC TO PSD FUNCTIONS Merge MCU Firmware with PSD Module Configuration A composite object file is created containing MCU firmware and PSD configuration MCU FIRMWARE HEX OR S-RECORD FORMAT USER'S CHOICE OF 8032 COMPILER/LINKER *.OBJ FILE PSD Programmer FlashLINK (JTAG) *.OBJ FILE AVAILABLE FOR 3rd PARTY PROGRAMMERS AI07432 91/163 uPSD3212A, uPSD3212C, uPSD3212CV PSD MODULE REGISTER DESCRIPTION AND ADDRESS OFFSET Table 81 shows the offset addresses to the PSD MODULE registers relative to the CSIOP base address. The CSIOP space is the 256 bytes of address that is allocated by the user to the internal PSD MODULE registers. Table 81 provides brief descriptions of the registers in CSIOP space. The following section gives a more detailed description. Table 81. Register Address Offset Register Name Other1 Description Port A Port B Port C Port D Data In 00 01 10 11 Control 02 03 Data Out 04 05 12 13 Stores data for output to Port pins, MCU I/O Output Mode Direction 06 07 14 15 Configures Port pin as input or output Drive Select 08 09 16 17 Configures Port pins as either CMOS or Open Drain on some pins, while selecting high slew rate on other pins. Input Macrocell 0A 0B 18 Enable Out 0C 0D 1A Output Macrocells AB 20 20 Output Macrocells BC Mask Macrocells AB Mask Macrocells BC 21 22 Reads Port pin as input, MCU I/O Input Mode Selects mode between MCU I/O or Address Out Reads Input Macrocells Reads the status of the output enable to the I/O Port driver 1B READ – reads output of macrocells AB WRITE – loads macrocell flip-flops READ – reads output of macrocells BC WRITE – loads macrocell flip-flops 21 22 23 Blocks writing to the Output Macrocells AB 23 Blocks writing to the Output Macrocells BC Primary Flash Protection C0 Read-only – Primary Flash Sector Protection Secondary Flash memory Protection C2 Read-only – PSD MODULE Security and Secondary Flash memory Sector Protection PMMR0 B0 Power Management Register 0 PMMR2 B4 Power Management Register 2 Page E0 Page Register VM E2 Places PSD MODULE memory areas in Program and/or Data space on an individual basis. Note: 1. Other registers that are not part of the I/O ports. 92/163 uPSD3212A, uPSD3212C, uPSD3212CV PSD MODULE DETAILED OPERATION As shown in Figure 15., page 27, the PSD MODULE consists of five major types of functional blocks: ■ Memory Block ■ PLD Blocks ■ I/O Ports ■ Power Management Unit (PMU) ■ JTAG Interface The functions of each block are described in the following sections. Many of the blocks perform multiple functions, and are user configurable. MEMORY BLOCKS The PSD MODULE has the following memory blocks: ■ Primary Flash memory ■ Secondary Flash memory ■ SRAM The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are userdefined in PSDsoft Express. Primary Flash Memory and Secondary Flash memory Description The primary Flash memory is divided into 4 sectors (16KBytes each). The secondary Flash memory is divided into 2 sectors (8KBytes each). Each sector of either memory block can be separately protected from Program and Erase cycles. Flash memory may be erased on a sector-by-sector basis. Flash sector erasure may be suspended while data is read from other sectors of the block and then resumed after reading. During a Program or Erase cycle in Flash memory, the status can be output on Ready/Busy (PC3). This pin is set up using PSDsoft Express Configuration. Memory Block Select Signals The DPLD generates the Select signals for all the internal memory blocks (see PLDs, page 106). Each of the eight sectors of the primary Flash memory has a Select signal (FS0-FS3) which can contain up to three product terms. Each of the 2 sectors of the secondary Flash memory has a Select signal (CSBOOT0-CSBOOT1) which can contain up to three product terms. Having three product terms for each Select signal allows a given sector to be mapped in Program or Data space. Ready/Busy (PC3). This signal can be used to output the Ready/Busy status of the Flash memory. The output on Ready/Busy (PC3) is a 0 (Busy) when Flash memory is being written to, or when Flash memory is being erased. The output is a 1 (Ready) when no WRITE or Erase cycle is in progress. Memory Operation. The primary Flash memory and secondary Flash memory are addressed through the MCU Bus. The MCU can access these memories in one of two ways: – The MCU can execute a typical bus WRITE or READ operation. – The MCU can execute a specific Flash memory instruction that consists of several WRITE and READ operations. This involves writing specific data patterns to special addresses within the Flash memory to invoke an embedded algorithm. These instructions are summarized in Table 82. Typically, the MCU can read Flash memory using READ operations, just as it would read a ROM device. However, Flash memory can only be altered using specific Erase and Program instructions. For example, the MCU cannot write a single byte directly to Flash memory as it would write a byte to RAM. To program a byte into Flash memory, the MCU must execute a Program instruction, then test the status of the Program cycle. This status test is achieved by a READ operation or polling Ready/Busy (PC3). 93/163 uPSD3212A, uPSD3212C, uPSD3212CV Instructions An instruction consists of a sequence of specific operations. Each received byte is sequentially decoded by the PSD MODULE and not executed as a standard WRITE operation. The instruction is executed when the correct number of bytes are properly received and the time between two consecutive bytes is shorter than the time-out period. Some instructions are structured to include READ operations after the initial WRITE operations. The instruction must be followed exactly. Any invalid combination of instruction bytes or time-out between two consecutive bytes while addressing Flash memory resets the device logic into READ Mode (Flash memory is read like a ROM device). The Flash memory supports the instructions summarized in Table 82., page 95: Flash memory: ■ Erase memory by chip or sector ■ Suspend or resume sector erase ■ Program a Byte ■ RESET to READ Mode ■ Read Sector Protection Status 94/163 These instructions are detailed in Table 82. For efficient decoding of the instructions, the first two bytes of an instruction are the coded cycles and are followed by an instruction byte or confirmation byte. The coded cycles consist of writing the data AAh to address X555h during the first cycle and data 55h to address XAAAh during the second cycle. Address signals A15-A12 are Don’t Care during the instruction WRITE cycles. However, the appropriate Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) must be selected. The primary and secondary Flash memories have the same instruction set. The Sector Select signals determine which Flash memory is to receive and execute the instruction. The primary Flash memory is selected if any one of Sector Select (FS0FS3) is High, and the secondary Flash memory is selected if any one of Sector Select (CSBOOT0CSBOOT1) is High. uPSD3212A, uPSD3212C, uPSD3212CV Table 82. Instructions FS0-FS3 or CSBOOT0CSBOOT1 Cycle 1 READ(5) 1 “Read” RD @ RA READ Sector Protection(6,8,11) 1 Program a Flash Byte(11) Instruction Cycle 2 Cycle 3 AAh@ X555h 55h@ XAAAh 90h@ X555h Read status @ XX02h 1 AAh@ X555h 55h@ XAAAh A0h@ X555h PD@ PA Flash Sector Erase(7,11) 1 AAh@ X555h 55h@ XAAAh 80h@ X555h Flash Bulk Erase(11) 1 AAh@ X555h 55h@ XAAAh 80h@ X555h Suspend Sector Erase(9) 1 B0h@ XXXXh Resume Sector Erase(10) 1 30h@ XXXXh RESET(6) 1 F0h@ XXXXh Note: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. Cycle 4 Cycle 5 Cycle 6 Cycle 7 AAh@ X555h 55h@ XAAAh 30h@ SA 30h(7)@ next SA AAh@ X555h 55h@ XAAAh 10h@ X555h All bus cycles are WRITE bus cycles, except the ones with the “Read” label All values are in hexadecimal: X = Don’t care. Addresses of the form XXXXh, in this table, must be even addresses RA = Address of the memory location to be read RD = Data READ from location RA during the READ cycle PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of WRITE Strobe (WR, CNTL0). PA is an even address for PSD in Word Programming Mode. PD = Data word to be programmed at location PA. Data is latched on the rising edge of WRITE Strobe (WR, CNTL0) SA = Address of the sector to be erased or verified. The Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) of the sector to be erased, or verified, must be Active (High). Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) signals are active High, and are defined in PSDsoft Express. Only address Bits A11-A0 are used in instruction decoding. No Unlock or instruction cycles are required when the device is in the READ Mode The RESET Instruction is required to return to the READ Mode after reading the Sector Protection Status, or if the Error Flag Bit (DQ5) goes High. Additional sectors to be erased must be written at the end of the Sector Erase instruction within 80µs. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and (A1,A0)=(1,0) The system may perform READ and Program cycles in non-erasing sectors, read the Sector Protection Status when in the Suspend Sector Erase Mode. The Suspend Sector Erase instruction is valid only during a Sector Erase cycle. The Resume Sector Erase instruction is valid only during the Suspend Sector Erase Mode. The MCU cannot invoke these instructions while executing code from the same Flash memory as that for which the instruction is intended. The MCU must retrieve, for example, the code from the secondary Flash memory when reading the Sector Protection Status of the primary Flash memory. 95/163 uPSD3212A, uPSD3212C, uPSD3212CV Power-down Instruction and Power-up Mode Power-up Mode. The PSD MODULE internal logic is reset upon Power-up to the READ Mode. Sector Select (FS0-FS3 and CSBOOT0CSBOOT1) must be held Low, and WRITE Strobe (WR, CNTL0) High, during Power-up for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of WRITE Strobe (WR, CNTL0). Any WRITE cycle initiation is locked when VCC is below VLKO. READ Under typical conditions, the MCU may read the primary Flash memory or the secondary Flash memory using READ operations just as it would a ROM or RAM device. Alternately, the MCU may use READ operations to obtain status information about a Program or Erase cycle that is currently in progress. Lastly, the MCU may use instructions to read special data from these memory blocks. The following sections describe these READ functions. READ Memory Contents. Primary Flash memory and secondary Flash memory are placed in the READ Mode after Power-up, chip reset, or a Reset Flash instruction (see Table 82., page 95). The MCU can read the memory contents of the primary Flash memory or the secondary Flash memory by using READ operations any time the READ operation is not part of an instruction. READ Memory Sector Protection Status. The primary Flash memory Sector Protection Status is read with an instruction composed of 4 operations: 3 specific WRITE operations and a READ operation (see Table 82). During the READ operation, address Bits A6, A1, and A0 must be '0,' '1,' and '0,' respectively, while Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) designates the Flash memory sector whose protection has to be verified. The READ operation produces 01h if the Flash memory sector is protected, or 00h if the sector is not protected. The sector protection status for all NVM blocks (primary Flash memory or secondary Flash memory) can also be read by the MCU accessing the Flash Protection registers in PSD I/O space. See 96/163 Flash Memory Sector Protect, page 101, for register definitions. Reading the Erase/Program Status Bits. The Flash memory provides several status bits to be used by the MCU to confirm the completion of an Erase or Program cycle of Flash memory. These status bits minimize the time that the MCU spends performing these tasks and are defined in Table 83., page 97. The status bits can be read as many times as needed. For Flash memory, the MCU can perform a READ operation to obtain these status bits while an Erase or Program instruction is being executed by the embedded algorithm. See Programming Flash Memory, page 98, for details. Data Polling Flag (DQ7). When erasing or programming in Flash memory, the Data Polling Flag Bit (DQ7) outputs the complement of the bit being entered for programming/writing on the DQ7 Bit. Once the Program instruction or the WRITE operation is completed, the true logic value is read on the Data Polling Flag Bit (DQ7) (in a READ operation). – Data Polling is effective after the fourth WRITE pulse (for a Program instruction) or after the sixth WRITE pulse (for an Erase instruction). It must be performed at the address being programmed or at an address within the Flash memory sector being erased. – During an Erase cycle, the Data Polling Flag Bit (DQ7) outputs a '0.' After completion of the cycle, the Data Polling Flag Bit (DQ7) outputs the last bit programmed (it is a '1' after erasing). – If the byte to be programmed is in a protected Flash memory sector, the instruction is ignored. – If all the Flash memory sectors to be erased are protected, the Data Polling Flag Bit (DQ7) is reset to '0' for about 100µs, and then returns to the previous addressed byte. No erasure is performed. uPSD3212A, uPSD3212C, uPSD3212CV Toggle Flag (DQ6). The Flash memory offers another way for determining when the Program cycle is completed. During the internal WRITE operation and when either the FS0-FS3 or CSBOOT0CSBOOT1 is true, the Toggle Flag Bit (DQ6) toggles from 0 to 1 and 1 to 0 on subsequent attempts to read any byte of the memory. When the internal cycle is complete, the toggling stops and the data READ on the Data Bus D0-D7 is the addressed memory byte. The device is now accessible for a new READ or WRITE operation. The cycle is finished when two successive Reads yield the same output data. – The Toggle Flag Bit (DQ6) is effective after the fourth WRITE pulse (for a Program instruction) or after the sixth WRITE pulse (for an Erase instruction). – If the byte to be programmed belongs to a protected Flash memory sector, the instruction is ignored. – If all the Flash memory sectors selected for erasure are protected, the Toggle Flag Bit (DQ6) toggles to '0' for about 100µs and then returns to the previous addressed byte. Error Flag (DQ5). During a normal Program or Erase cycle, the Error Flag Bit (DQ5) is to 0. This bit is set to '1' when there is a failure during Flash memory Byte Program, Sector Erase, or Bulk Erase cycle. In the case of Flash memory programming, the Error Flag Bit (DQ5) indicates the attempt to program a Flash memory bit from the programmed state, '0,' to the erased state, '1,' which is not valid. The Error Flag Bit (DQ5) may also indicate a Time-out condition while attempting to program a byte. In case of an error in a Flash memory Sector Erase or Byte Program cycle, the Flash memory sector in which the error occurred or to which the programmed byte belongs must no longer be used. Other Flash memory sectors may still be used. The Error Flag Bit (DQ5) is reset after a Reset Flash instruction. Erase Time-out Flag (DQ3). The Erase Timeout Flag Bit (DQ3) reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase Time-out Flag Bit (DQ3) is reset to 0 after a Sector Erase cycle for a time period of 100µs + 20% unless an additional Sector Erase instruction is decoded. After this time period, or when the additional Sector Erase instruction is decoded, the Erase Time-out Flag Bit (DQ3) is set to '1.' Table 83. Status Bit Functional Block Flash Memory FS0-FS3/CSBOOT0CSBOOT1 VIH DQ7 DQ6 Data Polling Toggle Flag DQ5 Error Flag DQ4 X DQ3 Erase Timeout DQ2 X DQ1 X DQ0 X Note: 1. X = Not guaranteed value, can be read either '1' or '0.' 2. DQ7-DQ0 represent the Data Bus bits, D7-D0. 3. FS0-FS3 and CSBOOT0-CSBOOT1 are active High. 97/163 uPSD3212A, uPSD3212C, uPSD3212CV Programming Flash Memory Flash memory must be erased prior to being programmed. A byte of Flash memory is erased to all '1s' (FFh), and is programmed by setting selected bits to '0.' The MCU may erase Flash memory all at once or by-sector, but not byte-by-byte. However, the MCU may program Flash memory byte-bybyte. The primary and secondary Flash memories require the MCU to send an instruction to program a byte or to erase sectors (see Table 82). Once the MCU issues a Flash memory Program or Erase instruction, it must check for the status bits for completion. The embedded algorithms that are invoked support several means to provide status to the MCU. Status may be checked using any of three methods: Data Polling, Data Toggle, or Ready/Busy (PC3). Data Polling. Polling on the Data Polling Flag Bit (DQ7) is a method of checking whether a Program or Erase cycle is in progress or has completed. Figure 48 shows the Data Polling algorithm. When the MCU issues a Program instruction, the embedded algorithm begins. The MCU then reads the location of the byte to be programmed in Flash memory to check status. The Data Polling Flag Bit (DQ7) of this location becomes the complement of b7 of the original data byte to be programmed. The MCU continues to poll this location, comparing the Data Polling Flag Bit (DQ7) and monitoring the Error Flag Bit (DQ5). When the Data Polling Flag Bit (DQ7) matches b7 of the original data, and the Error Flag Bit (DQ5) remains '0,' the embedded algorithm is complete. If the Error Flag Bit (DQ5) is '1,' the MCU should test the Data Polling Flag Bit (DQ7) again since the Data Polling Flag Bit (DQ7) may have changed simultaneously with the Error Flag Bit (DQ5) (see Figure 48). The Error Flag Bit (DQ5) is set if either an internal time-out occurred while the embedded algorithm attempted to program the byte or if the MCU attempted to program a '1' to a bit that was not erased (not erased is logic '0'). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the 98/163 byte that was written to the Flash memory with the byte that was intended to be written. When using the Data Polling method during an Erase cycle, Figure 48 still applies. However, the Data Polling Flag Bit (DQ7) is '0' until the Erase cycle is complete. A '1' on the Error Flag Bit (DQ5) indicates a time-out condition on the Erase cycle; a '0' indicates no error. The MCU can read any location within the sector being erased to get the Data Polling Flag Bit (DQ7) and the Error Flag Bit (DQ5). PSDsoft Express generates ANSI C code functions which implement these Data Polling algorithms. Figure 48. Data Polling Flowchart START READ DQ5 & DQ7 at VALID ADDRESS DQ7 = DATA YES NO NO DQ5 =1 YES READ DQ7 DQ7 = DATA YES NO FAIL PASS AI01369B uPSD3212A, uPSD3212C, uPSD3212CV Data Toggle. Checking the Toggle Flag Bit (DQ6) is a method of determining whether a Program or Erase cycle is in progress or has completed. Figure 49 shows the Data Toggle algorithm. When the MCU issues a Program instruction, the embedded algorithm begins. The MCU then reads the location of the byte to be programmed in Flash memory to check status. The Toggle Flag Bit (DQ6) of this location toggles each time the MCU reads this location until the embedded algorithm is complete. The MCU continues to read this location, checking the Toggle Flag Bit (DQ6) and monitoring the Error Flag Bit (DQ5). When the Toggle Flag Bit (DQ6) stops toggling (two consecutive reads yield the same value), and the Error Flag Bit (DQ5) remains '0,' the embedded algorithm is complete. If the Error Flag Bit (DQ5) is '1,' the MCU should test the Toggle Flag Bit (DQ6) again, since the Toggle Flag Bit (DQ6) may have changed simultaneously with the Error Flag Bit (DQ5) (see Figure 49). The Error Flag Bit(DQ5) is set if either an internal time-out occurred while the embedded algorithm attempted to program the byte, or if the MCU attempted to program a '1' to a bit that was not erased (not erased is logic '0'). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the byte that was written to Flash memory with the byte that was intended to be written. When using the Data Toggle method after an Erase cycle, Figure 49 still applies. the Toggle Flag Bit (DQ6) toggles until the Erase cycle is complete. A '1' on the Error Flag Bit (DQ5) indicates a time-out condition on the Erase cycle; a '0' indicates no error. The MCU can read any location within the sector being erased to get the Toggle Flag Bit (DQ6) and the Error Flag Bit (DQ5). PSDsoft Express generates ANSI C code functions which implement these Data Toggling algorithms. Figure 49. Data Toggle Flowchart START READ DQ5 & DQ6 DQ6 = TOGGLE NO YES NO DQ5 =1 YES READ DQ6 DQ6 = TOGGLE NO YES FAIL PASS AI01370B 99/163 uPSD3212A, uPSD3212C, uPSD3212CV Erasing Flash Memory Flash Bulk Erase. The Flash Bulk Erase instruction uses six WRITE operations followed by a READ operation of the status register, as described in Table 82. If any byte of the Bulk Erase instruction is wrong, the Bulk Erase instruction aborts and the device is reset to the READ Flash memory status. During a Bulk Erase, the memory status may be checked by reading the Error Flag Bit (DQ5), the Toggle Flag Bit (DQ6), and the Data Polling Flag Bit (DQ7), as detailed in Programming Flash Memory, page 98. The Error Flag Bit (DQ5) returns a '1' if there has been an Erase Failure (maximum number of Erase cycles have been executed). It is not necessary to program the memory with 00h because the PSD MODULE automatically does this before erasing to 0FFh. During execution of the Bulk Erase instruction, the Flash memory does not accept any instructions. Flash Sector Erase. The Sector Erase instruction uses six WRITE operations, as described in Table 82., page 95. Additional Flash Sector Erase codes and Flash memory sector addresses can be written subsequently to erase other Flash memory sectors in parallel, without further coded cycles, if the additional bytes are transmitted in a shorter time than the time-out period of about 100µs. The input of a new Sector Erase code restarts the timeout period. The status of the internal timer can be monitored through the level of the Erase Time-out Flag Bit (DQ3). If the Erase Time-out Flag Bit (DQ3) is '0,' the Sector Erase instruction has been received and the time-out period is counting. If the Erase Time-out Flag Bit (DQ3) is '1,' the time-out period has expired and the embedded algorithm is busy erasing the Flash memory sector(s). Before and during Erase time-out, any instruction other than Suspend Sector Erase and Resume Sector Erase instructions abort the cycle that is currently in progress, and reset the device to READ Mode. During a Sector Erase, the memory status may be checked by reading the Error Flag Bit (DQ5), the Toggle Flag Bit (DQ6), and the Data Polling Flag Bit (DQ7), as detailed in Programming Flash Memory, page 98. 100/163 During execution of the Erase cycle, the Flash memory accepts only RESET and Suspend Sector Erase instructions. Erasure of one Flash memory sector may be suspended, in order to read data from another Flash memory sector, and then resumed. Suspend Sector Erase. When a Sector Erase cycle is in progress, the Suspend Sector Erase instruction can be used to suspend the cycle by writing 0B0h to any address when an appropriate Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) is High. (See Table 82., page 95). This allows reading of data from another Flash memory sector after the Erase cycle has been suspended. Suspend Sector Erase is accepted only during an Erase cycle and defaults to READ Mode. A Suspend Sector Erase instruction executed during an Erase time-out period, in addition to suspending the Erase cycle, terminates the time out period. The Toggle Flag Bit (DQ6) stops toggling when the internal logic is suspended. The status of this bit must be monitored at an address within the Flash memory sector being erased. The Toggle Flag Bit (DQ6) stops toggling between 0.1µs and 15µs after the Suspend Sector Erase instruction has been executed. The Flash memory is then automatically set to READ Mode. If an Suspend Sector Erase instruction was executed, the following rules apply: – Attempting to read from a Flash memory sector that was being erased outputs invalid data. – Reading from a Flash sector that was not being erased is valid. – The Flash memory cannot be programmed, and only responds to Resume Sector Erase and Reset Flash instructions (READ is an operation and is allowed). – If a Reset Flash instruction is received, data in the Flash memory sector that was being erased is invalid. Resume Sector Erase. If a Suspend Sector Erase instruction was previously executed, the erase cycle may be resumed with this instruction. The Resume Sector Erase instruction consists of writing 030h to any address while an appropriate Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) is High. (See Table 82., page 95.) uPSD3212A, uPSD3212C, uPSD3212CV Specific Features Flash Memory Sector Protect. Each primary and secondary Flash memory sector can be separately protected against Program and Erase cycles. Sector Protection provides additional data security because it disables all Program or Erase cycles. This mode can be activated through the JTAG Port or a Device Programmer. Sector protection can be selected for each sector using the PSDsoft Express Configuration program. This automatically protects selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash memory sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The MCU can read (but cannot change) the sector protection bits. Any attempt to program or erase a protected Flash memory sector is ignored by the device. The Verify operation results in a READ of the protected data. This allows a guarantee of the retention of the Protection status. The sector protection status can be read by the MCU through the Flash memory protection registers (in the CSIOP block). See Tables 84 and 85. Reset Flash. The Reset Flash instruction consists of one WRITE cycle (see Table 82., page 95). It can also be optionally preceded by the standard two WRITE decoding cycles (writing AAh to 555h and 55h to AAAh). It must be executed after: – Reading the Flash Protection Status or Flash ID – An Error condition has occurred (and the device has set the Error Flag Bit (DQ5) to '1' during a Flash memory Program or Erase cycle. The Reset Flash instruction puts the Flash memory back into normal READ Mode. If an Error condition has occurred (and the device has set the Error Flag Bit (DQ5) to '1' the Flash memory is put back into normal READ Mode within a few milliseconds of the Reset Flash instruction having been issued. The Reset Flash instruction is ignored when it is issued during a Program or Bulk Erase cycle of the Flash memory. The Reset Flash instruction aborts any on-going Sector Erase cycle, and returns the Flash memory to the normal READ Mode within a few milliseconds. Table 84. Sector Protection/Security Bit Definition – Flash Protection Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 not used not used not used not used Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot Note: Bit Definitions: Sec<i>_Prot 1 = Primary Flash memory or secondary Flash memory Sector <i> is write-protected. Sec<i>_Prot 0 = Primary Flash memory or secondary Flash memory Sector <i> is not write-protected. Table 85. Sector Protection/Security Bit Definition – Secondary Flash Protection Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Security_Bit not used not used not used not used not used Sec1_Prot Sec0_Prot Note: Bit Definitions: Sec<i>_Prot 1 = Secondary Flash memory Sector <i> is write-protected. Sec<i>_Prot 0 = Secondary Flash memory Sector <i> is not write-protected. Security_Bit 0 = Security Bit in device has not been set; 1 = Security Bit in device has been set. 101/163 uPSD3212A, uPSD3212C, uPSD3212CV SRAM The SRAM is enabled when SRAM Select (RS0) from the DPLD is High. SRAM Select (RS0) can contain up to two product terms, allowing flexible memory mapping. The SRAM can be backed up using an external battery. The external battery should be connected to Voltage Standby (VSTBY, PC2). If you have an external battery connected to the uPSD3200, the contents of the SRAM are retained in the event of a power loss. The contents of the SRAM are retained so long as the battery voltage remains at 2V or greater. If the supply voltage falls below the battery voltage, an internal power switchover to the battery occurs. PC4 can be configured as an output that indicates when power is being drawn from the external battery. Battery-on Indicator (VBATON, PC4) is High with the supply voltage falls below the battery voltage and the battery on Voltage Standby (VSTBY, PC2) is supplying power to the internal SRAM. SRAM Select (RS0), Voltage Standby (VSTBY, PC2) and Battery-on Indicator (VBATON, PC4) are all configured using PSDsoft Express Configuration. Sector Select and SRAM Select Sector Select (FS0-FS3, CSBOOT0-CSBOOT1) and SRAM Select (RS0) are all outputs of the DPLD. They are setup by writing equations for them in PSDsoft Express. The following rules apply to the equations for these signals: 1. Primary Flash memory and secondary Flash memory Sector Select signals must not be larger than the physical sector size. 2. Any primary Flash memory sector must not be mapped in the same memory space as another Flash memory sector. 3. A secondary Flash memory sector must not be mapped in the same memory space as another secondary Flash memory sector. 4. SRAM, I/O, and Peripheral I/O spaces must not overlap. 5. A secondary Flash memory sector may overlap a primary Flash memory sector. In case of overlap, priority is given to the secondary Flash memory sector. 102/163 6. SRAM, I/O, and Peripheral I/O spaces may overlap any other memory sector. Priority is given to the SRAM, I/O, or Peripheral I/O. Example. FS0 is valid when the address is in the range of 8000h to BFFFh, CSBOOT0 is valid from 8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0 always accesses the SRAM. Any address in the range of CSBOOT0 greater than 87FFh (and less than 9FFFh) automatically addresses secondary Flash memory segment 0. Any address greater than 9FFFh accesses the primary Flash memory segment 0. You can see that half of the primary Flash memory segment 0 and one-fourth of secondary Flash memory segment 0 cannot be accessed in this example. Note: An equation that defined FS1 to anywhere in the range of 8000h to BFFFh would not be valid. Figure 50 shows the priority levels for all memory components. Any component on a higher level can overlap and has priority over any component on a lower level. Components on the same level must not overlap. Level one has the highest priority and level 3 has the lowest. Figure 50. Priority Level of Memory and I/O Components in the PSD MODULE Highest Priority Level 1 SRAM, I /O, or Peripheral I /O Level 2 Secondary Non-Volatile Memory Level 3 Primary Flash Memory Lowest Priority AI02867D uPSD3212A, uPSD3212C, uPSD3212CV Memory Select Configuration in Program and Data Spaces. The MCU Core has separate address spaces for Program memory and Data memory. Any of the memories within the PSD MODULE can reside in either space or both spaces. This is controlled through manipulation of the VM Register that resides in the CSIOP space. The VM Register is set using PSDsoft Express to have an initial value. It can subsequently be changed by the MCU so that memory mapping can be changed on-the-fly. For example, you may wish to have SRAM and primary Flash memory in the Data space at Boot-up, and secondary Flash memory in the Program space at Boot-up, and later swap the primary and secondary Flash memories. This is easily done with the VM Register by using PSDsoft Express Configuration to configure it for Boot-up and having the MCU change it when desired. Table 86 describes the VM Register. Table 86. VM Register Bit 7 PIO_EN Bit 6 Bit 5 Bit 4 Primary FL_Data 0 = disable PIO Mode not used not used 0 = RD can’t access Flash memory 1= enable PIO Mode not used not used 1 = RD access Flash memory Bit 3 Secondary Data Bit 2 Primary FL_Code Bit 1 Secondary Code Bit 0 SRAM_Code 0 = RD can’t access Secondary Flash memory 0 = PSEN can’t access Flash memory 0 = PSEN can’t access Secondary Flash memory 0 = PSEN can’t access SRAM 1 = RD access Secondary Flash memory 1 = PSEN access Flash memory 1 = PSEN access Secondary Flash memory 1 = PSEN access SRAM 103/163 uPSD3212A, uPSD3212C, uPSD3212CV Separate Space Mode. Program space is separated from Data space. For example, Program Select Enable (PSEN) is used to access the program code from the primary Flash memory, while READ Strobe (RD) is used to access data from the secondary Flash memory, SRAM and I/O Port blocks. This configuration requires the VM Register to be set to 0Ch (see Figure 51). Combined Space Modes. The Program and Data spaces are combined into one memory space that allows the primary Flash memory, secondary Flash memory, and SRAM to be accessed by either Program Select Enable (PSEN) or READ Strobe (RD). For example, to configure the primary Flash memory in Combined space, Bits b2 and b4 of the VM Register are set to '1' (see Figure 52). Figure 51. Separate Space Mode DPLD Secondary Flash Memory Primary Flash Memory RS0 SRAM CSBOOT0-1 FS0-FS3 CS CS OE CS OE OE PSEN RD AI07433 Figure 52. Combined Space Mode DPLD RD RS0 Primary Flash Memory Secondary Flash Memory SRAM CSBOOT0-1 FS0-FS3 CS CS OE CS OE OE VM REG BIT 3 VM REG BIT 4 PSEN VM REG BIT 1 VM REG BIT 2 RD VM REG BIT 0 AI07434 104/163 uPSD3212A, uPSD3212C, uPSD3212CV Page Register The 8-bit Page Register increases the addressing capability of the MCU Core by a factor of up to 256. The contents of the register can also be read by the MCU. The outputs of the Page Register (PGR0-PGR7) are inputs to the DPLD decoder and can be included in the Sector Select (FS0FS3, CSBOOT0-CSBOOT1), and SRAM Select (RS0) equations. If memory paging is not needed, or if not all 8 page register bits are needed for memory paging, then these bits may be used in the CPLD for general logic. Figure 53 shows the Page Register. The eight flipflops in the register are connected to the internal data bus D0-D7. The MCU can write to or read from the Page Register. The Page Register can be accessed at address location CSIOP + E0h. Figure 53. Page Register RESET D0 D0 - D7 Q0 D1 Q1 D2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 Q7 PGR0 INTERNAL PSD MODULE SELECTS AND LOGIC PGR1 PGR2 PGR3 PGR4 DPLD AND CPLD PGR5 PGR6 PGR7 R/W PAGE REGISTER PLD AI05799 105/163 uPSD3212A, uPSD3212C, uPSD3212CV PLDS The PLDs bring programmable logic functionality to the uPSD. After specifying the logic for the PLDs in PSDsoft Express, the logic is programmed into the device and available upon Power-up. Table 87. DPLD and CPLD Inputs Input Source Input Name Number of Signals MCU Address Bus A15-A0 16 MCU Control Signals PSEN, RD, WR, ALE 4 RESET RST 1 Power-down PDN 1 Port A Input Macrocells1 PA7-PA0 8 Port B Input Macrocells PB7-PB0 8 Port C Input Macrocells PC7, PC4-PC2 4 Port D Inputs PD2-PD1 2 Page Register PGR7-PGR0 8 Macrocell AB Feedback MCELLAB.FB7FB0 8 Macrocell BC Feedback MCELLBC.FB7FB0 8 Flash memory Program Status Bit Ready/Busy 1 Note: 1. These inputs are not available in the 52-pin package. 106/163 The PSD MODULE contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD). The PLDs are briefly discussed in the next few paragraphs, and in more detail in Decode PLD (DPLD), page 108, and Complex PLD (CPLD), page 109. Figure 54., page 107 shows the configuration of the PLDs. The DPLD performs address decoding for Select signals for PSD MODULE components, such as memory, registers, and I/O ports. The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the Output Macrocells (OMC), Input Macrocells (IMC), and the AND Array. The CPLD can also be used to generate External Chip Select (ECS1-ECS2) signals. The AND Array is used to form product terms. These product terms are specified using PSDsoft. The PLD input signals consist of internal MCU signals and external inputs from the I/O ports. The input signals are shown in Table 87. The Turbo Bit in PSD MODULE The PLDs can minimize power consumption by switching off when inputs remain unchanged for an extended time of about 70ns. Resetting the Turbo Bit to '0' (Bit 3 of PMMR0) automatically places the PLDs into standby if no inputs are changing. Turning the Turbo Mode off increases propagation delays while reducing power consumption. See POWER MANAGEMENT, page 122, on how to set the Turbo Bit. Additionally, five bits are available in PMMR2 to block MCU control signals from entering the PLDs. This reduces power consumption and can be used only when these MCU control signals are not used in PLD logic equations. Each of the two PLDs has unique characteristics suited for its applications. They are described in the following sections. uPSD3212A, uPSD3212C, uPSD3212CV Figure 54. PLD Diagram 8 PAGE REGISTER DECODE PLD 73 4 PRIMARY FLASH MEMORY SELECTS 2 SECONDARY NON-VOLATILE MEMORY SELECTS 1 SRAM SELECT 1 CSIOP SELECT PLD INPUT BUS 2 16 PERIPHERAL SELECTS DIRECT MACROCELL ACCESS FROM MCU DATA BUS OUTPUT MACROCELL FEEDBACK CPLD 16 OUTPUT MACROCELL PT ALLOC. 73 20 INPUT MACROCELL (PORT A,B,C) MACROCELL ALLOC. I/O PORTS DATA BUS MCELLAB TO PORT A OR B1 8 MCELLBC TO PORT B OR C 8 2 EXTERNAL CHIP SELECTS TO PORT D DIRECT MACROCELL INPUT TO MCU DATA BUS 20 INPUT MACROCELL & INPUT PORTS 2 PORT D INPUTS AI07435 Note: 1. Ports A is not available in the 52-pin package 107/163 uPSD3212A, uPSD3212C, uPSD3212CV Decode PLD (DPLD) The DPLD, shown in Figure 55, is used for decoding the address for PSD MODULE and external components. The DPLD can be used to generate the following decode signals: – 4 Sector Select (FS0-FS3) signals for the primary Flash memory (three product terms each) – – – – 2 Sector Select (CSBOOT0-CSBOOT1) signals for the secondary Flash memory (three product terms each) 1 internal SRAM Select (RS0) signal (two product terms) 1 internal CSIOP Select signal (selects the PSD MODULE registers) 2 internal Peripheral Select signals (Peripheral I/O Mode). Figure 55. DPLD Logic Array (INPUTS) I /O PORTS (PORT A,B,C)1 3 CSBOOT 0 3 CSBOOT 1 3 FS0 (20) 3 MCELLAB.FB [7:0] (FEEDBACKS) FS1 (8) 3 MCELLBC.FB [7:0] (FEEDBACKS) (8) PGR0 - PGR7 (8) FS2 3 A[15:0]2 (16) PD[2:1] (2) PDN (APD OUTPUT) (1) PSEN, RD, WR, ALE2 (4) 2 (1) RD_BSY (1) RESET 4 PRIMARY FLASH MEMORY SECTOR SELECTS FS3 2 RS0 1 CSIOP 1 PSEL0 1 PSEL1 SRAM SELECT I/O DECODER SELECT PERIPHERAL I/O MODE SELECT AI07436 Note: 1. Port A inputs are not available in the 52-pin package 2. Inputs from the MCU module 108/163 uPSD3212A, uPSD3212C, uPSD3212CV Complex PLD (CPLD) The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols, state machines, and random logic. The CPLD can also be used to generate External Chip Select (ECS1-ECS2), routed to Port D. Although External Chip Select (ECS1-ECS2) can be produced by any Output Macrocell (OMC), these External Chip Select (ECS1-ECS2) on Port D do not consume any Output Macrocells (OMC). As shown in Figure 54, the CPLD has the following blocks: ■ 20 Input Macrocells (IMC) ■ 16 Output Macrocells (OMC) ■ Macrocell Allocator ■ Product Term Allocator AND Array capable of generating up to 137 product terms ■ Four I/O Ports. Each of the blocks are described in the sections that follow. The Input Macrocells (IMC) and Output Macrocells (OMC) are connected to the PSD MODULE internal data bus and can be directly accessed by the MCU. This enables the MCU software to load data into the Output Macrocells (OMC) or read data from both the Input and Output Macrocells (IMC and OMC). This feature allows efficient implementation of system logic and eliminates the need to connect the data bus to the AND Array as required in most standard PLD macrocell architectures. ■ Figure 56. Macrocell and I/O Port PLD INPUT BUS PRODUCT TERMS FROM OTHER MACROCELLS MCU ADDRESS / DATA BUS TO OTHER I/O PORTS CPLD MACROCELLS I/O PORTS DATA LOAD CONTROL PT PRESET MCU DATA IN PRODUCT TERM ALLOCATOR LATCHED ADDRESS OUT DATA MCU LOAD I/O PIN Q D MUX POLARITY SELECT MUX CPLD OUTPUT PR DI LD D/T MUX PT CLOCK GLOBAL CLOCK CK CL CLOCK SELECT SELECT Q D/T/JK FF SELECT COMB. /REG SELECT CPLD OUTPUT PDR MACROCELL TO I/O PORT ALLOC. INPUT Q DIR REG. D WR PT CLEAR PT OUTPUT ENABLE (OE) MACROCELL FEEDBACK INPUT MACROCELLS I/O PORT INPUT MUX PLD INPUT BUS MACROCELL OUT TO MCU PT INPUT LATCH GATE/CLOCK ALE MUX AND ARRAY WR UP TO 10 PRODUCT TERMS Q D Q D G AI06602 109/163 uPSD3212A, uPSD3212C, uPSD3212CV Output Macrocell (OMC) Eight of the Output Macrocells (OMC) are connected to Ports A and B pins and are named as McellAB0-McellAB7. The other eight macrocells are connected to Ports B and C pins and are named as McellBC0-McellBC7. If an McellAB output is not assigned to a specific pin in PSDsoft, the Macrocell Allocator block assigns it to either Port A or B. The same is true for a McellBC output on Port B or C. Table 88 shows the macrocells and port assignment. The Output Macrocell (OMC) architecture is shown in Figure 57. As shown in the figure, there are native product terms available from the AND Array, and borrowed product terms available (if unused) from other Output Macrocells (OMC). The polarity of the product term is controlled by the XOR gate. The Output Macrocell (OMC) can implement either sequential logic, using the flip-flop element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer output can drive a port pin and has a feedback path to the AND Array inputs. The flip-flop in the Output Macrocell (OMC) block can be configured as a D, T, JK, or SR type in PSDsoft. The flip-flop’s clock, preset, and clear inputs may be driven from a product term of the AND Array. Alternatively, CLKIN (PD1) can be used for the clock input to the flip-flop. The flip-flop is clocked on the rising edge of CLKIN (PD1). The preset and clear are active High inputs. Each clear input can use up to two product terms. Table 88. Output Macrocell Port and Data Bit Assignments Output Macrocell Port Assignment(1) Native Product Terms Maximum Borrowed Product Terms Data Bit for Loading or Reading McellAB0 Port A0, B0 3 6 D0 McellAB1 Port A1, B1 3 6 D1 McellAB2 Port A2, B2 3 6 D2 McellAB3 Port A3, B3 3 6 D3 McellAB4 Port A4, B4 3 6 D4 McellAB5 Port A5, B5 3 6 D5 McellAB6 Port A6, B6 3 6 D6 McellAB7 Port A7, B7 3 6 D7 McellBC0 Port B0(2) 4 5 D0 McellBC1 Port B1(2) 4 5 D1 McellBC2 Port B2, C2 4 5 D2 McellBC3 Port B3, C3 4 5 D3 McellBC4 Port B4, C4 4 6 D4 McellBC5 Port B5(2) 4 6 D5 McellBC6 Port B6(2) 4 6 D6 McellBC7 Port B7, C7 4 6 D7 Note: 1. McellAB0-McellAB7 can only be assigned to Port B in the 52-pin package. 2. Port PC0, PC1, PC5 and PC6 are assigned to JTAG pins, and are not available as macrocell outputs 110/163 uPSD3212A, uPSD3212C, uPSD3212CV Product Term Allocator The CPLD has a Product Term Allocator. PSDsoft uses the Product Term Allocator to borrow and place product terms from one macrocell to another. The following list summarizes how product terms are allocated: – McellAB0-McellAB7 all have three native product terms and may borrow up to six more – McellBC0-McellBC3 all have four native product terms and may borrow up to five more – McellBC4-McellBC7 all have four native product terms and may borrow up to six more. Each macrocell may only borrow product terms from certain other macrocells. Product terms already in use by one macrocell are not available for another macrocell. If an equation requires more product terms than are available to it, then “external” product terms are required, which consume other Output Macrocells (OMC). If external product terms are used, extra delay is added for the equation that required the extra product terms. This is called product term expansion. PSDsoft Express performs this expansion as needed. Loading and Reading the Output Macrocells (OMC). The Output Macrocells (OMC) block occupies a memory location in the MCU address space, as defined by the CSIOP block (see I/O PORTS (PSD MODULE), page 113). The flipflops in each of the 16 Output Macrocells (OMC) can be loaded from the data bus by a MCU. Loading the Output Macrocells (OMC) with data from the MCU takes priority over internal functions. As such, the preset, clear, and clock inputs to the flipflop can be overridden by the MCU. The ability to load the flip-flops and read them back is useful in such applications as loadable counters and shift registers, mailboxes, and handshaking protocols. Data can be loaded to the Output Macrocells (OMC) on the trailing edge of WRITE Strobe (WR, edge loading) or during the time that WRITE Strobe (WR) is active (level loading). The method of loading is specified in PSDsoft Express Configuration. Figure 57. CPLD Output Macrocell MASK REG. MACROCELL CS MCU DATA BUS D[7:0] RD PT ALLOCATOR WR DIRECTION REGISTER ENABLE (.OE) AND ARRAY PLD INPUT BUS PRESET(.PR) COMB/REG SELECT PT PT DIN PR MUX PT LD POLARITY SELECT I/O PIN MACROCELL ALLOCATOR IN CLEAR (.RE) CLR PORT DRIVER PROGRAMMABLE FF (D/T/JK /SR) PT CLK CLKIN Q MUX FEEDBACK (.FB) PORT INPUT INPUT MACROCELL AI06617 111/163 uPSD3212A, uPSD3212C, uPSD3212CV The OMC Mask Register. There is one Mask Register for each of the two groups of eight Output Macrocells (OMC). The Mask Registers can be used to block the loading of data to individual Output Macrocells (OMC). The default value for the Mask Registers is 00h, which allows loading of the Output Macrocells (OMC). When a given bit in a Mask Register is set to a '1,' the MCU is blocked from writing to the associated Output Macrocells (OMC). For example, suppose McellAB0McellAB3 are being used for a state machine. You would not want a MCU write to McellAB to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellAB (Mask Macrocell AB) with the value 0Fh. The Output Enable of the OMC. The Output Macrocells (OMC) block can be connected to an I/ O port pin as a PLD output. The output enable of each port pin driver is controlled by a single product term from the AND Array, ORed with the Direction Register output. The pin is enabled upon Power-up if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft Express. If the Output Macrocell (OMC) output is declared as an internal node and not as a port pin output in the PSDabel file, the port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND Array. Input Macrocells (IMC) The CPLD has 20 Input Macrocells (IMC), one for each pin on Ports A and B, and four on Port C. The architecture of the Input Macrocells (IMC) is shown in Figure 58. The Input Macrocells (IMC) are individually configurable, and can be used as a latch, register, or to pass incoming Port signals prior to driving them onto the PLD input bus. The outputs of the Input Macrocells (IMC) can be read by the MCU through the internal data bus. The enable for the latch and clock for the register are driven by a multiplexer whose inputs are a product term from the CPLD AND Array or the MCU Address Strobe (ALE). Each product term output is used to latch or clock four Input Macrocells (IMC). Port inputs 3-0 can be controlled by one product term and 7-4 by another. Configurations for the Input Macrocells (IMC) are specified by equations written in PSDsoft (see Application Note AN1171). Outputs of the Input Macrocells (IMC) can be read by the MCU via the IMC buffer. See I/O PORTS (PSD MODULE), page 113. Figure 58. Input Macrocell D [ 7:0] MCU DATA BUS INPUT MACROCELL _ RD DIRECTION REGISTER ENABLE ( .OE ) AND ARRAY PLD INPUT BUS PT OUTPUT MACROCELLS BC AND MACROCELL AB I/O PIN PT PORT DRIVER MUX Q D PT MUX ALE D FF FEEDBACK Q D G LATCH INPUT MACROCELL AI06603 112/163 uPSD3212A, uPSD3212C, uPSD3212CV I/O PORTS (PSD MODULE) There are four programmable I/O ports: Ports A, B, C, and D in the PSD MODULE. Each of the ports is eight bits except Port D, which is 3 bits. Each port pin is individually user configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft Express Configuration or by the MCU writing to on-chip registers in the CSIOP space. Port A is not available in the 52-pin package. The topics discussed in this section are: ■ General Port architecture ■ Port operating modes ■ Port Configuration Registers (PCR) ■ Port Data Registers ■ Individual Port functionality. General Port Architecture The general architecture of the I/O Port block is shown in Figure 59. Individual Port architectures are shown in Figure 61., page 118 to Figure 64., page 121. In general, once the purpose for a port pin has been defined, that pin is no longer available for other purposes. Exceptions are noted. As shown in Figure 59, the ports contain an output multiplexer whose select signals are driven by the configuration bits in the Control Registers (Ports A and B only) and PSDsoft Express Configuration. Inputs to the multiplexer include the following: ■ Output data from the Data Out register ■ Latched address outputs ■ CPLD macrocell output ■ External Chip Select (ECS1-ECS2) from the CPLD. The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read. The Port Data Buffer (PDB) is connected to the Internal Data Bus for feedback and can be read by the MCU. The Data Out and macrocell outputs, Direction and Control Registers, and port pin input are all connected to the Port Data Buffer (PDB). Figure 59. General I/O Port Architecture DATA OUT REG. D Q D Q DATA OUT WR ADDRESS ALE ADDRESS PORT PIN OUTPUT MUX G MACROCELL OUTPUTS EXT CS READ MUX MCU DATA BUS P OUTPUT SELECT D DATA IN B CONTROL REG. D Q ENABLE OUT WR DIR REG. D Q WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL CPLD- INPUT AI06604 113/163 uPSD3212A, uPSD3212C, uPSD3212CV The Port pin’s tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND Array enable product term and the Direction Register. If the enable product term of any of the Array outputs are not defined and that port pin is not defined as a CPLD output in the PSDsoft, then the Direction Register has sole control of the buffer that drives the port pin. The contents of these registers can be altered by the MCU. The Port Data Buffer (PDB) feedback path allows the MCU to check the contents of the registers. Ports A, B, and C have embedded Input Macrocells (IMC). The Input Macrocells (IMC) can be configured as latches, registers, or direct inputs to the PLDs. The latches and registers are clocked by Address Strobe (ALE) or a product term from the PLD AND Array. The outputs from the Input Macrocells (IMC) drive the PLD input bus and can be read by the MCU. See Input Macrocell, page 112. Port Operating Modes The I/O Ports have several modes of operation. Some modes can be defined using PSDsoft, some by the MCU writing to the Control Registers in CSIOP space, and some by both. The modes that can only be defined using PSDsoft must be programmed into the device and cannot be changed unless the device is reprogrammed. The modes that can be changed by the MCU can be done so dynamically at run-time. The PLD I/O, Data Port, Address Input, and Peripheral I/O Modes are the only modes that must be defined before programming the device. All other modes can be changed by the MCU at run-time. See Application Note AN1171 for more detail. Table 89., page 115 summarizes which modes are available on each port. Table 92., page 116 shows how and where the different modes are configured. Each of the port operating modes are described in the following sections. MCU I/O Mode In the MCU I/O Mode, the MCU uses the I/O Ports block to expand its own I/O ports. By setting up the CSIOP space, the ports on the PSD MODULE are mapped into the MCU address space. The addresses of the ports are listed in Table 81., page 92. A port pin can be put into MCU I/O Mode by writing a '0' to the corresponding bit in the Control Register. The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Register, or by the output enable product term. See Peripheral I/O Mode, page 114. When the pin 114/163 is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the MCU can read the port input through the Data In buffer. See Figure 59., page 113. Ports C and D do not have Control Registers, and are in MCU I/O Mode by default. They can be used for PLD I/O if equations are written for them in PSDabel. PLD I/O Mode The PLD I/O Mode uses a port as an input to the CPLD’s Input Macrocells (IMC), and/or as an output from the CPLD’s Output Macrocells (OMC). The output can be tri-stated with a control signal. This output enable control signal can be defined by a product term from the PLD, or by resetting the corresponding bit in the Direction Register to '0.' The corresponding bit in the Direction Register must not be set to '1' if the pin is defined for a PLD input signal in PSDsoft. The PLD I/O Mode is specified in PSDsoft by declaring the port pins, and then writing an equation assigning the PLD I/ O to a port. Address Out Mode Address Out Mode can be used to drive latched MCU addresses on to the port pins. These port pins can, in turn, drive external devices. Either the output enable or the corresponding bits of both the Direction Register and Control Register must be set to a '1' for pins to use Address Out Mode. This must be done by the MCU at run-time. See Table 91., page 115 for the address output pin assignments on Ports A and B for various MCUs. Peripheral I/O Mode Peripheral I/O Mode can be used to interface with external peripherals. In this mode, all of Port A serves as a tri-state, bi-directional data buffer for the MCU. Peripheral I/O Mode is enabled by setting Bit 7 of the VM Register to a '1.' Figure 60., page 115 shows how Port A acts as a bi-directional buffer for the MCU data bus if Peripheral I/O Mode is enabled. An equation for PSEL0 and/ or PSEL1 must be written in PSDsoft. The buffer is tri-stated when PSEL0 or PSEL1 is low (not active). The PSEN signal should be “ANDed” in the PSEL equations to disable the buffer when PSEL resides in the data space. JTAG In-System Programming (ISP) Port C is JTAG compliant, and can be used for InSystem Programming (ISP). For more information on the JTAG Port, see PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE, page 127. uPSD3212A, uPSD3212C, uPSD3212CV Figure 60. Peripheral I/O Mode RD PSEL0 PSEL PSEL1 D0 - D7 VM REGISTER BIT 7 PA0 - PA7 DATA BUS WR AI02886 Table 89. Port Operating Modes Port A(2) Port Mode Port B Port C Port D MCU I/O Yes Yes Yes Yes PLD I/O McellAB Outputs McellBC Outputs Additional Ext. CS Outputs PLD Inputs Yes No No Yes Yes Yes No Yes No Yes(3) No Yes No No Yes Yes Address Out Yes (A7 – 0) Yes (A7 – 0) No No Peripheral I/O Yes No No No JTAG ISP No No Yes(1) No Note: 1. JTAG pins (TMS, TCK, TDI, TDO) are dedicated pins. 2. Port A is not available in the 52-pin package. 3. On pins PC2, PC3, PC4 and PC7 only. Table 90. Port Operating Mode Settings Mode Control Register Setting Defined in PSDsoft Direction Register Setting VM Register Setting MCU I/O Declare pins only 0 1 = output, 0 = input (Note 1) N/A PLD I/O Logic equations N/A (Note 1) N/A Address Out (Port A,B) Declare pins only 1 1 (Note 1) N/A Peripheral I/O (Port A) Logic equations (PSEL0 & 1) N/A N/A PIO Bit = 1 Note: N/A = Not Applicable Note: 1. The direction of the Port A,B,C, and D pins are controlled by the Direction Register ORed with the individual output enable product term (.oe) from the CPLD AND Array. Table 91. I/O Port Latched Address Output Assignments Port A (PA3-PA0) Address a3-a0 Port A (PA7-PA4) Address a7-a4 Port B (PB3-PB0) Address a3-a0 Port B (PB7-PB4) Address a7-a4 115/163 uPSD3212A, uPSD3212C, uPSD3212CV Port Configuration Registers (PCR) Each Port has a set of Port Configuration Registers (PCR) used for configuration. The contents of the registers can be accessed by the MCU through normal READ/WRITE bus cycles at the addresses given in Table 81., page 92. The addresses in Table 81 are the offsets in hexadecimal from the base of the CSIOP register. The pins of a port are individually configurable and each bit in the register controls its respective pin. For example, Bit 0 in a register refers to Bit 0 of its port. The three Port Configuration Registers (PCR), shown in Table 92, are used for setting the Port configurations. The default Power-up state for each register in Table 92 is 00h. Control Register. Any bit reset to '0' in the Control Register sets the corresponding port pin to MCU I/O Mode, and a '1' sets it to Address Out Mode. The default mode is MCU I/O. Only Ports A and B have an associated Control Register. Direction Register. The Direction Register, in conjunction with the output enable (except for Port D), controls the direction of data flow in the I/O Ports. Any bit set to '1' in the Direction Register causes the corresponding pin to be an output, and any bit set to '0' causes it to be an input. The default mode for all port pins is input. Figure 61., page 118 and Figure 62., page 119 show the Port Architecture diagrams for Ports A/B and C, respectively. The direction of data flow for Ports A, B, and C are controlled not only by the direction register, but also by the output enable product term from the PLD AND Array. If the output enable product term is not active, the Direction Register has sole control of a given pin’s direction. An example of a configuration for a Port with the three least significant bits set to output and the remainder set to input is shown in Table 95. Since Port D only contains two pins (shown in Figure 64., page 121), the Direction Register for Port D has only two bits active. Drive Select Register. The Drive Select Register configures the pin driver as Open Drain or CMOS for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain. A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a '1.' The default pin drive is CMOS. 116/163 Note: The slew rate is a measurement of the rise and fall times of an output. A higher slew rate means a faster output response and may create more electrical noise. A pin operates in a high slew rate when the corresponding bit in the Drive Register is set to '1.' The default rate is slow slew. Table 96., page 117 shows the Drive Register for Ports A, B, C, and D. It summarizes which pins can be configured as Open Drain outputs and which pins the slew rate can be set for. Table 92. Port Configuration Registers (PCR) Register Name Port MCU Access Control A,B WRITE/READ Direction A,B,C,D WRITE/READ Drive Select(1) A,B,C,D WRITE/READ Note: 1. See Table 96., page 117 for Drive Register Bit definition. Table 93. Port Pin Direction Control, Output Enable P.T. Not Defined Direction Register Bit Port Pin Mode 0 Input 1 Output Table 94. Port Pin Direction Control, Output Enable P.T. Defined Direction Register Bit Output Enable P.T. Port Pin Mode 0 0 Input 0 1 Output 1 0 Output 1 1 Output Table 95. Port Direction Assignment Example Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 0 1 1 1 uPSD3212A, uPSD3212C, uPSD3212CV Port Data Registers The Port Data Registers, shown in Table 97, are used by the MCU to write data to or read data from the ports. Table 97 shows the register name, the ports having each register type, and MCU access for each register type. The registers are described below. Data In. Port pins are connected directly to the Data In buffer. In MCU I/O Input Mode, the pin input is read through the Data In buffer. Data Out Register. Stores output data written by the MCU in the MCU I/O Output Mode. The contents of the Register are driven out to the pins if the Direction Register or the output enable product term is set to '1.' The contents of the register can also be read back by the MCU. Output Macrocells (OMC). The CPLD Output Macrocells (OMC) occupy a location in the MCU’s address space. The MCU can read the output of the Output Macrocells (OMC). If the OMC Mask Register Bits are not set, writing to the macrocell loads data to the macrocell flip-flops. See PLDs, page 106. OMC Mask Register. Each OMC Mask Register Bit corresponds to an Output Macrocell (OMC) flipflop. When the OMC Mask Register Bit is set to a '1,' loading data into the Output Macrocell (OMC) flip-flop is blocked. The default value is '0' or unblocked. Input Macrocells (IMC). The Input Macrocells (IMC) can be used to latch or store external inputs. The outputs of the Input Macrocells (IMC) are routed to the PLD input bus, and can be read by the MCU. See PLDs, page 106. Enable Out. The Enable Out register can be read by the MCU. It contains the output enable values for a given port. A '1' indicates the driver is in output mode. A '0' indicates the driver is in tri-state and the pin is in input mode. Table 96. Drive Register Pin Assignment Drive Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Port A Open Drain Open Drain Open Drain Open Drain Slew Rate Slew Rate Slew Rate Slew Rate Port B Open Drain Open Drain Open Drain Open Drain Slew Rate Slew Rate Slew Rate Slew Rate Port C Open Drain NA(1) NA(1) Open Drain Open Drain Open Drain NA(1) NA(1) Port D NA(1) NA(1) NA(1) NA(1) NA(1) Slew Rate Slew Rate NA(1) Note: 1. NA = Not Applicable. Table 97. Port Data Registers Register Name Port MCU Access Data In A,B,C,D READ – input on pin Data Out A,B,C,D WRITE/READ Output Macrocell A,B,C READ – outputs of macrocells WRITE – loading macrocells flip-flop Mask Macrocell A,B,C WRITE/READ – prevents loading into a given macrocell Input Macrocell A,B,C READ – outputs of the Input Macrocells Enable Out A,B,C READ – the output enable control of the port driver 117/163 uPSD3212A, uPSD3212C, uPSD3212CV Ports A and B – Functionality and Structure Ports A and B have similar functionality and structure, as shown in Figure 61. The two ports can be configured to perform one or more of the following functions: ■ MCU I/O Mode ■ CPLD Output – Macrocells McellAB7McellAB0 can be connected to Port A or Port B. McellBC7-McellBC0 can be connected to Port B or Port C. ■ ■ ■ ■ CPLD Input – Via the Input Macrocells (IMC). Latched Address output – Provide latched address output as per Table 91., page 115. Open Drain/Slew Rate – pins PA3-PA0 and PB3-PB0 can be configured to fast slew rate, pins PA7-PA4 and PB7-PB4 can be configured to Open Drain Mode. Peripheral Mode – Port A only (80-pin package) Figure 61. Port A and Port B Structure DATA OUT REG. D Q D Q DATA OUT WR ADDRESS ALE ADDRESS A[ 7:0] G PORT A OR B PIN OUTPUT MUX MACROCELL OUTPUTS READ MUX MCU DATA BUS P OUTPUT SELECT D DATA IN B CONTROL REG. D Q ENABLE OUT WR DIR REG. D Q WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL CPLD-INPUT AI06605 118/163 uPSD3212A, uPSD3212C, uPSD3212CV Port C – Functionality and Structure Port C can be configured to perform one or more of the following functions (see Figure 62): ■ MCU I/O Mode ■ CPLD Output – McellBC7-McellBC0 outputs can be connected to Port B or Port C. ■ CPLD Input – via the Input Macrocells (IMC) ■ In-System Programming (ISP) – JTAG pins (TMS, TCK, TDI, TDO) are dedicated pins for device programming. (See PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE, page 127, for more information on JTAG programming.) Open Drain – Port C pins can be configured in Open Drain Mode ■ Battery Backup features – PC2 can be configured for a battery input supply, Voltage Standby (VSTBY). PC4 can be configured as a Battery-on Indicator (VBATON), indicating when VCC is less than VBAT. Port C does not support Address Out Mode, and therefore no Control Register is required. ■ Figure 62. Port C Structure DATA OUT REG. D DATA OUT Q WR SPECIAL FUNCTION PORT C PIN 1 OUTPUT MUX MCELLBC[ 7:0] MCU DATA BUS READ MUX P OUTPUT SELECT D DATA IN B ENABLE OUT DIR REG. D Q WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL CPLD - INPUT SPECIAL FUNCTION 1 CONFIGURATION BIT AI06618 Note: 1. ISP or battery back-up 119/163 uPSD3212A, uPSD3212C, uPSD3212CV Port D – Functionality and Structure Port D has two I/O pins (only one pin, PD1, in the 52-pin package). See Figure 63 and Figure 64., page 121. This port does not support Address Out Mode, and therefore no Control Register is required. Of the eight bits in the Port D registers, only Bits 2 and 1 are used to configure pins PD2 and PD1. Port D can be configured to perform one or more of the following functions: ■ MCU I/O Mode ■ CPLD Output – External Chip Select (ECS1ECS2) CPLD Input – direct input to the CPLD, no Input Macrocells (IMC) ■ Slew rate – pins can be set up for fast slew rate Port D pins can be configured in PSDsoft Express as input pins for other dedicated functions: ■ CLKIN (PD1) as input to the macrocells flipflops and APD counter ■ PSD Chip Select Input (CSI, PD2). Driving this signal High disables the Flash memory, SRAM and CSIOP. ■ Figure 63. Port D Structure DATA OUT REG. DATA OUT D Q WR PORT D PIN OUTPUT MUX ECS [ 2:1] MCU DATA BUS READ MUX OUTPUT SELECT P D DATA IN B ENABLE PRODUCT TERM (.OE) DIR REG. D WR 120/163 Q CPLD-INPUT AI06606 uPSD3212A, uPSD3212C, uPSD3212CV External Chip Select The CPLD also provides two External Chip Select (ECS1-ECS2) outputs on Port D pins that can be used to select external devices. Each External Chip Select (ECS1-ECS2) consists of one product term that can be configured active High or Low. The output enable of the pin is controlled by either the output enable product term or the Direction Register. (See Figure 64.) Figure 64. Port D External Chip Select Signals ENABLE (.OE) PD1 PIN ECS1 POLARITY BIT CPLD AND ARRAY PLD INPUT BUS PT1 DIRECTION REGISTER ENABLE (.OE) PT2 DIRECTION REGISTER ECS2 POLARITY BIT PD2 PIN AI06607 121/163 uPSD3212A, uPSD3212C, uPSD3212CV POWER MANAGEMENT All PSD MODULE offers configurable power saving options. These options may be used individually or in combinations, as follows: – The primary and secondary Flash memory, and SRAM blocks are built with power management technology. In addition to using special silicon design methodology, power management technology puts the memories into Standby Mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected memory “wakes up,” changes and latches its outputs, then goes back to standby. The designer does not have to do anything special to achieve Memory Standby Mode when no inputs are changing—it happens automatically. The PLD sections can also achieve Standby Mode when its inputs are not changing, as described in the sections on the Power Management Mode Registers (PMMR). – As with the Power Management Mode, the Automatic Power Down (APD) block allows the PSD MODULE to reduce to standby current automatically. The APD Unit can also block MCU address/data signals from reaching the memories and PLDs. The APD Unit is described in more detail in POWER MANAGEMENT, page 122. Built in logic monitors the Address Strobe of the MCU for activity. If there is no activity for a certain time period (MCU is asleep), the APD Unit initiates Power-down Mode (if enabled). – – Once in Power-down Mode, all address/data signals are blocked from reaching memory and PLDs, and the memories are deselected internally. This allows the memory and PLDs to remain in Standby Mode even if the address/data signals are changing state externally (noise, other devices on the MCU bus, etc.). Keep in mind that any unblocked PLD input signals that are changing states keeps the PLD out of Standby Mode, but not the memories. PSD Chip Select Input (CSI, PD2) can be used to disable the internal memories, placing them in Standby Mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. This is a good alternative to using the APD Unit. There is a slight penalty in memory access time when PSD Chip Select Input (CSI, PD2) makes its initial transition from deselected to selected. The PMMRs can be written by the MCU at runtime to manage power. The PSD MODULE supports “blocking bits” in these registers that are set to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their inputs (see Figure 68 and Figure 69., page 128). Significant power savings can be achieved by blocking signals that are not used in DPLD or CPLD logic equations. Figure 65. APD Unit APD EN PMMR0 BIT 1=1 TRANSITION DETECTION DISABLE BUS INTERFACE ALE CLR RESET CSI CSIOP SELECT FLASH SELECT EDGE DETECT CLKIN PD PLD SRAM SELECT POWER DOWN (PDN) SELECT DISABLE FLASH/SRAM 122/163 PD APD COUNTER AI06608 uPSD3212A, uPSD3212C, uPSD3212CV The PSD MODULE has a Turbo Bit in PMMR0. This bit can be set to turn the Turbo Mode off (the default is with Turbo Mode turned on). While Turbo Mode is off, the PLDs can achieve standby current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current), compared to when Turbo Mode is on. When the Turbo Mode is on, there is a significant DC current component and the AC component is higher. Automatic Power-down (APD) Unit and Powerdown Mode. The APD Unit, shown in Figure 65., page 122, puts the PSD MODULE into Power-down Mode by monitoring the activity of Address Strobe (ALE). If the APD Unit is enabled, as soon as activity on Address Strobe (ALE) stops, a four-bit counter starts counting. If Address Strobe (ALE/AS, PD0) remains inactive for fifteen clock periods of CLKIN (PD1), Power-down (PDN) goes High, and the PSD MODULE enters Power-down Mode, as discussed next. Power-down Mode. By default, if you enable the APD Unit, Power-down Mode is automatically enabled. The device enters Power-down Mode if Address Strobe (ALE) remains inactive for fifteen periods of CLKIN (PD1). The following should be kept in mind when the PSD MODULE is in Power-down Mode: – If Address Strobe (ALE) starts pulsing again, the PSD MODULE returns to normal Operating mode. The PSD MODULE also returns to normal Operating mode if either PSD Chip Select Input (CSI, PD2) is Low or the RESET input is High. – The MCU address/data bus is blocked from all memory and PLDs. – Various signals can be blocked (prior to Power-down Mode) from entering the PLDs by setting the appropriate bits in the PMMR registers. The blocked signals include MCU control signals and the common CLKIN (PD1). Note: Blocking CLKIN (PD1) from the PLDs does not block CLKIN (PD1) from the APD Unit. – All memories enter Standby Mode and are drawing standby current. However, the PLD and I/O ports blocks do not go into Standby Mode because you don’t want to have to wait for the logic and I/O to “wake-up” before their outputs can change. See Table 98 for Powerdown Mode effects on PSD MODULE ports. – Typical standby current is of the order of microamperes. These standby current values assume that there are no transitions on any PLD input. Other Power Saving Options. The PSD MODULE offers other reduced power saving options that are independent of the Power-down Mode. Except for the SRAM Standby and PSD Chip Select Input (CSI, PD2) features, they are enabled by setting bits in PMMR0 and PMMR2. Figure 66. Enable Power-down Flow Chart RESET Enable APD Set PMMR0 Bit 1 = 1 OPTIONAL Disable desired inputs to PLD by setting PMMR0 bits 4 and 5 and PMMR2 bits 2 through 6. ALE idle for 15 CLKIN clocks? No Yes PSD Module in Power Down Mode AI06609 Table 98. Power-down Mode’s Effect on Ports Port Function Pin Level MCU I/O No Change PLD Out No Change Address Out Undefined Peripheral I/O Tri-State 123/163 uPSD3212A, uPSD3212C, uPSD3212CV PLD Power Management The power and speed of the PLDs are controlled by the Turbo Bit (Bit 3) in PMMR0 (see Table 99). By setting the bit to '1,' the Turbo Mode is off and the PLDs consume the specified standby current when the inputs are not switching for an extended time of 70ns. The propagation delay time is increased by 10ns (for a 5V device) after the Turbo Bit is set to '1' (turned off) when the inputs change at a composite frequency of less than 15MHz. When the Turbo Bit is reset to '0' (turned on), the PLDs run at full power and speed. The Turbo Bit affects the PLD’s DC power, AC power, and propagation delay. When the Turbo Mode is off, the uPSD3200 input clock frequency is reduced by 5MHz from the maximum rated clock frequency. Blocking MCU control signals with the bits of PMMR2 (see Table 100., page 125) can further reduce PLD AC power consumption. SRAM Standby Mode (Battery Backup). The SRAM in the PSD MODULE supports a battery backup mode in which the contents are retained in the event of a power loss. The SRAM has Voltage Standby (VSTBY, PC2) that can be connected to an external battery. When VCC becomes lower than VSTBY then the SRAM automatically connects to Voltage Standby (VSTBY, PC2) as a power source. The SRAM Standby Current (ISTBY) is typically 0.5 µA. The SRAM data retention voltage is 2V minimum. The Battery-on Indicator (VBATON) can be routed to PC4. This signal indicates when the VCC has dropped below VSTBY. PSD Chip Select Input (CSI, PD2) PD2 of Port D can be configured in PSDsoft Express as PSD Chip Select Input (CSI). When Low, the signal selects and enables the PSD MODULE Flash memory, SRAM, and I/O blocks for READ or WRITE operations. A High on PSD Chip Select Input (CSI, PD2) disables the Flash memory, and SRAM, and reduces power consumption. However, the PLD and I/O signals remain operational when PSD Chip Select Input (CSI, PD2) is High. Input Clock CLKIN (PD1) can be turned off, to the PLD to save AC power consumption. CLKIN (PD1) is an input to the PLD AND Array and the Output Macrocells (OMC). During Power-down Mode, or, if CLKIN (PD1) is not being used as part of the PLD logic equation, the clock should be disabled to save AC power. CLKIN (PD1) is disconnected from the PLD AND Array or the Macrocells block by setting Bits 4 or 5 to a '1' in PMMR0. Input Control Signals The PSD MODULE provides the option to turn off the MCU signals (WR, RD, PSEN, and Address Strobe (ALE)) to the PLD to save AC power consumption (see Table 101., page 125). These control signals are inputs to the PLD AND Array. During Power-down Mode, or, if any of them are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They are disconnected from the PLD AND Array by setting Bits 2, 3, 4, 5, and 6 to a '1' in PMMR2. Table 99. Power Management Mode Registers PMMR0 Bit 0 X Bit 1 APD Enable 0 Not used, and should be set to zero. 0 = off Automatic Power-down (APD) is disabled. 1 = on Automatic Power-down (APD) is enabled. Bit 2 X 0 Not used, and should be set to zero. 0 = on PLD Turbo Mode is on Bit 3 Bit 4 PLD Turbo 1 = off PLD Turbo Mode is off, saving power. uPSD3200 operates at 5MHz below the maximum rated clock frequency 0 = on CLKIN (PD1) input to the PLD AND Array is connected. Every change of CLKIN (PD1) Powers-up the PLD when Turbo Bit is '0.' PLD Array clk 1 = off CLKIN (PD1) input to PLD AND Array is disconnected, saving power. 0 = on CLKIN (PD1) input to the PLD macrocells is connected. Bit 5 PLD MCell clk 1 = off CLKIN (PD1) input to PLD macrocells is disconnected, saving power. Bit 6 X 0 Not used, and should be set to zero. Bit 7 X 0 Not used, and should be set to zero. 124/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 100. Power Management Mode Registers PMMR2 Bit 0 X 0 Not used, and should be set to zero. Bit 1 X 0 Not used, and should be set to zero. PLD Array WR 0 = on WR input to the PLD AND Array is connected. Bit 2 PLD Array RD 0 = on RD input to the PLD AND Array is connected. Bit 3 1 = off WR input to PLD AND Array is disconnected, saving power. 1 = off RD input to PLD AND Array is disconnected, saving power. PLD Array PSEN 0 = on PSEN input to the PLD AND Array is connected. PLD Array ALE 0 = on ALE input to the PLD AND Array is connected. Bit 6 X 0 Not used, and should be set to zero. Bit 7 X 0 Not used, and should be set to zero. Bit 4 Bit 5 1 = off PSEN input to PLD AND Array is disconnected, saving power. 1 = off ALE input to PLD AND Array is disconnected, saving power. Note: The bits of this register are cleared to zero following Power-up. Subsequent RESET pulses do not clear the registers. Table 101. APD Counter Operation APD Enable Bit ALE Level APD Counter 0 X Not Counting 1 Pulsing Not Counting 1 0 or 1 Counting (Generates PDN after 15 Clocks) 125/163 uPSD3212A, uPSD3212C, uPSD3212CV RESET TIMING AND DEVICE STATUS AT RESET Upon Power-up, the PSD MODULE requires a Reset (RESET) pulse of duration tNLNH-PO after VCC is steady. During this period, the device loads internal configurations, clears some of the registers and sets the Flash memory into operating mode. After the rising edge of Reset (RESET), the PSD MODULE remains in the Reset Mode for an additional period, tOPR, before the first memory access is allowed. The Flash memory is reset to the READ Mode upon Power-up. Sector Select (FS0-FS3 and CSBOOT0-CSBOOT1) must all be Low, WRITE Strobe (WR, CNTL0) High, during Power-on RESET for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of WRITE Strobe (WR). Any Flash memory WRITE cycle initiation is prevented automatically when VCC is below VLKO. Warm RESET Once the device is up and running, the PSD MODULE can be reset with a pulse of a much shorter duration, tNLNH. The same tOPR period is needed before the device is operational after a Warm RESET. Figure 67 shows the timing of the Power-up and Warm RESET. I/O Pin, Register and PLD Status at RESET Table 102 shows the I/O pin, register and PLD status during Power-on RESET, Warm RESET, and Power-down Mode. PLD outputs are always valid during Warm RESET, and they are valid in Poweron RESET once the internal Configuration bits are loaded. This loading is completed typically long before the VCC ramps up to operating level. Once the PLD is active, the state of the outputs are determined by the PLD equations. Figure 67. Reset (RESET) Timing VCC(min) VCC tNLNH-PO Power-On Reset tOPR tNLNH tOPR Warm Reset RESET AI07437 Table 102. Status During Power-on RESET, Warm RESET and Power-down Mode Port Configuration Power-on RESET Warm RESET Power-down Mode MCU I/O Input mode Input mode Unchanged PLD Output Valid after internal PSD configuration bits are loaded Valid Depends on inputs to PLD (addresses are blocked in PD Mode) Address Out Tri-stated Tri-stated Not defined Peripheral I/O Tri-stated Tri-stated Tri-stated Register Power-on RESET Warm RESET Power-down Mode PMMR0 and PMMR2 Cleared to '0' Unchanged Unchanged Macrocells flip-flop status Cleared to '0' by internal Power-on RESET Depends on .re and .pr equations Depends on .re and .pr equations VM Register(1) Initialized, based on the selection in PSDsoft Configuration menu Initialized, based on the selection in PSDsoft Configuration menu Unchanged All other registers Cleared to '0' Cleared to '0' Unchanged Note: 1. The SR_cod and PeriphMode Bits in the VM Register are always cleared to '0' on Power-on RESET or Warm RESET. 126/163 uPSD3212A, uPSD3212C, uPSD3212CV PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE The JTAG Serial Interface pins (TMS, TCK, TDI, TDO) are dedicated pins on Port C (see Table 103). All memory blocks (primary and secondary Flash memory), PLD logic, and PSD MODULE Configuration Register Bits may be programmed through the JTAG Serial Interface block. A blank device can be mounted on a printed circuit board and programmed using JTAG. The standard JTAG signals (IEEE 1149.1) are TMS, TCK, TDI, and TDO. Two additional signals, TSTAT and TERR, are optional JTAG extensions used to speed up Program and Erase cycles. By default, on a blank device (as shipped from the factory or after erasure), four pins on Port C are the basic JTAG signals TMS, TCK, TDI, and TDO. Standard JTAG Signals At power-up, the standard JTAG pins are inputs, waiting for a JTAG serial command from an external JTAG controller device (such as FlashLINK or Automated Test Equipment). When the enabling command is received, TDO becomes an output and the JTAG channel is fully functional. The same command that enables the JTAG channel may optionally enable the two additional JTAG signals, TSTAT and TERR. The RESET input to the uPS3200 should be active during JTAG programming. The active RESET puts the MCU module into RESET Mode while the PSD Module is being programmed. See Application Note AN1153 for more details on JTAG InSystem Programming (ISP). The uPSD321x Devices supports JTAG In-System-Configuration (ISC) commands, but not Boundary Scan. The PSDsoft Express software tool and FlashLINK JTAG programming cable implement the JTAG In-System-Configuration (ISC) commands. Table 103. JTAG Port Signals Port C Pin JTAG Signals Description JTAG Extensions TSTAT and TERR are two JTAG extension signals enabled by an “ISC_ENABLE” command received over the four standard JTAG signals (TMS, TCK, TDI, and TDO). They are used to speed Program and Erase cycles by indicating status on uPDS signals instead of having to scan the status out serially using the standard JTAG channel. See Application Note AN1153. TERR indicates if an error has occurred when erasing a sector or programming a byte in Flash memory. This signal goes Low (active) when an Error condition occurs, and stays Low until an “ISC_CLEAR” command is executed or a chip Reset (RESET) pulse is received after an “ISC_DISABLE” command. TSTAT behaves the same as Ready/Busy described in Ready/Busy (PC3), page 93. TSTAT is High when the PSD MODULE device is in READ Mode (primary and secondary Flash memory contents can be read). TSTAT is Low when Flash memory Program or Erase cycles are in progress, and also when data is being written to the secondary Flash memory. TSTAT and TERR can be configured as “open drain” type signals during an “ISC_ENABLE” command. Security and Flash memory Protection When the Security Bit is set, the device cannot be read on a Device Programmer or through the JTAG Port. When using the JTAG Port, only a Full Chip Erase command is allowed. All other Program, Erase and Verify commands are blocked. Full Chip Erase returns the part to a non-secured blank state. The Security Bit can be set in PSDsoft Express Configuration. All primary and secondary Flash memory sectors can individually be sector protected against erasures. The sector protect bits can be set in PSDsoft Express Configuration. PC0 TMS Mode Select INITIAL DELIVERY STATE PC1 TCK Clock PC3 TSTAT Status (optional) PC4 TERR Error Flag (optional) PC5 TDI Serial Data In PC6 TDO Serial Data Out When delivered from ST, the uPSD321x Devices have all bits in the memory and PLDs set to '1.' The code, configuration, and PLD logic are loaded using the programming procedure. Information for programming the device is available directly from ST. Please contact your local sales representative. 127/163 uPSD3212A, uPSD3212C, uPSD3212CV AC/DC PARAMETERS The following are issues concerning the parameters presented: – In the DC specification the supply current is given for different modes of operation. – The AC power component gives the PLD, Flash memory, and SRAM mA/MHz specification. Figures 68 and 69 show the PLD mA/MHz as a function of the number of Product Terms (PT) used. – In the PLD timing parameters, add the required delay when Turbo Bit is '0.' These tables describe the AD and DC parameters of the uPSD321x Devices: ➜ DC Electrical Specification ➜ AC Timing Specification ■ PLD Timing – Combinatorial Timing – Synchronous Clock Mode – Asynchronous Clock Mode – Input Macrocell Timing ■ MCU Module Timing – READ Timing – WRITE Timing – Power-down and RESET Timing Figure 68. PLD ICC /Frequency Consumption (5V range) 110 VCC = 5V 100 ) 00% N (1 O BO TUR 90 FF 70 BO TUR O O 60 RB 50 ON (25% ) TU ICC – (mA) 80 40 30 20 O RB TU 10 F OF PT 100% PT 25% 0 0 5 10 15 20 25 HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz) AI02894 Figure 69. PLD ICC /Frequency Consumption (3V range) 60 VCC = 3V B TUR 40 O FF 30 TU RB O ICC – (mA) ) 100% N( O O 50 20 O TU R B 10 O RB TU 5 ON (2 %) PT 100% PT 25% F OF 0 0 5 10 15 20 HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz) 128/163 25 AI03100 uPSD3212A, uPSD3212C, uPSD3212CV Table 104. PSD MODULE Example, Typ. Power Calculation at VCC = 5.0V (Turbo Mode Off) Conditions MCU Clock Frequency = 12MHz Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) = 8MHz = 2MHz % Flash memory Access = 80% % SRAM access = 15% % I/O access = 5% (no additional power above base) Operational Modes % Normal = 40% % Power-down Mode = 60% Number of product terms used (from fitter report) = 45 PT % of total product terms = 45/182 = 24.7% Turbo Mode = Off Calculation (using typical values) ICC total = ICC(MCUactive) x %MCUactive + ICC(PSDactive) x %PSDactive + IPD(pwrdown) x %pwrdown ICC(MCUactive) = 20mA IPD(pwrdown) = 250µA ICC(PSDactive) = ICC(ac) + ICC(dc) = %flash x 2.5mA/MHz x Freq ALE + %SRAM x 1.5mA/MHz x Freq ALE + % PLD x (from graph using Freq PLD) = 0.8 x 2.5mA/MHz x 2MHz + 0.15 x 1.5mA/MHz x 2MHz + 24mA = (4 + 0.45 + 24) mA = 28.45mA ICC total = 20mA x 40% + 28.45mA x 40% + 250µA x 60% = 8mA + 11.38mA + 150µA = 19.53mA This is the operating power with no Flash memory Erase or Program cycles in progress. Calculation is based on all I/O pins being disconnected and IOUT = 0mA. 129/163 uPSD3212A, uPSD3212C, uPSD3212CV MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not im- plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 105. Absolute Maximum Ratings Symbol Parameter TSTG Storage Temperature TLEAD Lead Temperature during Soldering (20 seconds max.)(1) Min. Max. Unit –65 125 °C 235 °C VIO Input and Output Voltage (Q = VOH or Hi-Z) –0.5 6.5 V VCC Supply Voltage –0.5 6.5 V VPP Device Programmer Supply Voltage –0.5 14.0 V –2000 2000 V VESD Electrostatic Discharge Voltage (Human Body Model) (2) Note: 1. IPC/JEDEC J-STD-020A 2. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 Ω, R2=500 Ω) 130/163 uPSD3212A, uPSD3212C, uPSD3212CV EMC CHARACTERISTICS Susceptibility test are performed on a sample basis during product characterization. Functional EMS (Electromagnetic Susceptibility) Based on a simple running application on the product (toggling 2 LEDs through I/O ports), the product is stressed by two electromagnetic events until a failure occurs (indicated by the LEDs). ESD. Electro-Static Discharge (positive and negative) is applied on all pins of the device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 Standard. FTB. A burst of Fast Transient voltage (positive and negative) is applied to VDD and VSS through a 100pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 Standard. A device reset allows normal operations to be resumed. The test results are given in Table 106, based on the EMS levels and classes defined in Application Note AN1709. Designing Hardened Software To Avoid Noise Problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore, it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for the user’s application. Software Recommendations. The software flowchart must include the management of ‘runaway’ conditions, such as: – Corrupted program counter – Unexpected reset – Critical data corruption (e.g., control registers) Prequalification trials. Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the RESET pin or the oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see Application Note AN1015). Absolute Maximum Ratings (Electrical Sensitivity) Based on three different tests (ESD, LU, and DLU) and using specific measurement methods, the product is stressed in order to determine its performance in terms of electrical sensitivity. For more details, refer to the Application Note AN1181. Electro-Static Discharge (ESD). Electro-Static discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). The Human Body Model is simulated (see Table 107). This test conforms to the JESD22-A114A Standard. Table 106. EMS Test Results Symbol Parameter Conditions Level/ Class(1) VFESD Voltage limits to be applied on any I/O pin to induce a functional disturbance VDD = 4V; TA = 25°C; fOSC = 40MHz; WDT off conforms to IEC 1000-4-2 3C Note: 1. Data based on characterization results, not tested in production. Table 107. ESD Absolute Maximum Ratings Symbol VESD(HBM) Parameter Electro-static discharge voltage (Human Body Model) Conditions Maximum Value(1) Unit TA = 25°C 2000 V Note: 1. Data based on characterization results, not tested in production 131/163 uPSD3212A, uPSD3212C, uPSD3212CV LU. 3 complementary static tests are required on 10 parts to assess the latch-up performance. A supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output, and configurable I/O pin) are performed on each sample. This test conforms to the EIA/JESD 78 IC Latch-up Standard (see Table 108). For more details, refer to the Application Note, AN1181. DLU. Electro-static discharges (one positive then one negative test) are applied to each pin of 3 samples when the micro is running to assess the latch-up performance in dynamic mode. Power supplies are set to the typical values, the oscillator is connected as near as possible to the pins of the micro, and the component is put in reset mode. This test conforms to the IEC 1000-4-2 and SAEJ1752/3 Standards (see Table 108). For more details, refer to the Application Note, AN1181. Table 108. Latch-up and Dynamic Latch-up Electrical Sensitivities Symbol LU DLU Parameter Static Latch-up Class Dynamic Latch-up Class Conditions Level/ Class(1) TA = 25°C A VDD = 5V; TA = 25°C; fOSC = 40MHz A Note: 1. Class description: A Class is an STMicroelectronics internal specification. All of its limits are higher than the JEDEC specifications. This means when a device belongs to “Class A,” it exceeds the JEDEC standard. “Class B” strictly covers all of the JEDEC criteria (International standards). 132/163 uPSD3212A, uPSD3212C, uPSD3212CV DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measure- ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 109. Operating Conditions (5V Devices) Symbol VCC Parameter Min. Max. Unit Supply Voltage 4.5 5.5 V Ambient Operating Temperature (Industrial) –40 85 °C 0 70 °C Min. Max. Unit Supply Voltage 3.0 3.6 V Ambient Operating Temperature (Industrial) –40 85 °C 0 70 °C TA Ambient Operating Temperature (Commercial) Table 110. Operating Conditions (3V Devices) Symbol VCC Parameter TA Ambient Operating Temperature (Commercial) Table 111. AC Signal Letter Symbols for Signal Letters Timing Note: Example: tAVLX = Time from Address Valid to ALE Invalid. A Address C Clock D Input Data I Instruction t Time L ALE L Logic Level Low or ALE N RESET Input or Output H Logic Level High P PSEN signal V Valid Q Output Data X No Longer a Valid Logic Level R RD signal Z Float W WR signal B VSTBY Output M Output Macrocell Table 112. AC Signal Behavior Symbols for Timing Signal Behavior PW Pulse Width Note: Example: tAVLX = Time from Address Valid to ALE Invalid. 133/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 70. Switching Waveforms – Key WAVEFORMS INPUTS OUTPUTS STEADY INPUT STEADY OUTPUT MAY CHANGE FROM HI TO LO WILL BE CHANGING FROM HI TO LO MAY CHANGE FROM LO TO HI WILL BE CHANGING LO TO HI DON'T CARE CHANGING, STATE UNKNOWN OUTPUTS ONLY CENTER LINE IS TRI-STATE AI03102 134/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 113. Major Parameters Parameters/Conditions/ Comments 5V Test Conditions 5.0V Value 3.3V Test Conditions 3.3V Value Operating Voltage – 4.5 to 5.5 – 3.0 to 3.6 V Operating Temperature – –40 to 85 – –40 to 85 °C MCU Frequency 12MHz (min) for USB; 8MHz (min) for I2C – 1 Min, 40 Max – 24MHz MCU clock, 12MHz PLD input frequency, 4MHz ALE 72 12MHz MCU clock, 6MHz PLD input frequency, 2MHz ALE 21 mA Idle Current, Typical (CPU halted but some peripherals active; 25°C operation; 45 PLD product terms used; PLD Turbo mode Off) 24MHz MCU clock, 12MHz PLD input frequency 25 12MHz MCU clock, 1MHz PLD input frequency 7 mA Standby Current, Typical (Power-down Mode, requires reset to exit mode; without Low-Voltage Detect (LVD) Supervisor) 180µA with LVD 110 100µA with LVD 60 µA SRAM Backup Current, Typical (If external battery is attached.) – 0.5 – 0.5 µA VOL = 0.25V (max); VOH = 3.9V (min) IOL = 8 (max); IOH = –2 (min) VOL = 0.15V (max); VOH = 2.6V (min) IOL = 4 (max); IOH = –1 (min) mA PLD Macrocells (For registered or combinatorial logic) – 16 – 16 – PLD Inputs (Inputs from pins, macrocell feedback, or MCU addresses) – 69 – 69 – PLD Outputs (Output to pins or internal feedback) – 16 – 16 – PLD Propagation Delay, Typical (PLD input to output, Turbo Mode) – 15 – 22 ns Active Current, Typical (25°C operation; 80% Flash and 15% SRAM accesses, 45 PLD product terms used; PLD Turbo mode Off) I/O Sink/Source Current Ports A, B, C, and D Unit 1 Min, 24 Max MHz 135/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 114. DC Characteristics (5V Devices) Symbol Parameter Test Condition (in addition to those in Table 109., page 133) Min. VIH Input High Voltage (Ports 1, 2, 3, 4[Bits 7,6,5,4,3,1,0], XTAL1, RESET) 4.5V < VCC < 5.5V VIH1 Input High Voltage (Ports A, B, C, D, 4[Bit 2]) VIL VIL1 VOL Max. Unit 0.7VCC VCC + 0.5 V 4.5V < VCC < 5.5V 2.0 VCC + 0.5 V Input Low Voltage (Ports 1, 2, 3, 4[Bits 7,6,5,4,3,1,0], XTAL1, RESET) 4.5V < VCC < 5.5V VSS – 0.5 0.3VCC V Input Low Voltage (Ports A, B, C, D) 4.5V < VCC < 5.5V –0.5 0.8 V Input Low Voltage (Port 4[Bit 2]) 4.5V < VCC < 5.5V VSS – 0.5 0.8 V Output Low Voltage (Ports A,B,C,D) Typ. IOL = 20µA VCC = 4.5V 0.01 0.1 V IOL = 8mA VCC = 4.5V 0.25 0.45 V VOL1 Output Low Voltage (Ports 1,2,3,4, WR, RD) IOL = 1.6mA 0.45 V VOL2 Output Low Voltage (Port 0, ALE, PSEN) IOL = 3.2mA 0.45 V VOH Output High Voltage (Ports A,B,C,D) IOH = –20µA VCC = 4.5V 4.4 4.49 V IOH = –2mA VCC = 4.5V 2.4 3.9 V IOH = –80µA 2.4 V IOH = –10µA 4.05 V Output High Voltage (Port 0 in ext. Bus Mode, ALE, PSEN) IOH = –800µA 2.4 V IOH = –80µA 4.05 V VOH3 Output High Voltage VSTBYON IOH = –1µA VSTBY – 0.8 V VLVR Low Voltage RESET 0.1V hysteresis 3.75 VOP XTAL Open Bias Voltage (XTAL1, XTAL2) IOL = 3.2mA VLKO VOH1 VOH2 Output High Voltage (Ports 1,2,3,4, WR, RD) 4.25 V 2.0 3.0 V VCC(min) for Flash Erase and Program 2.5 4.2 V VSTBY SRAM (PSD) Standby Voltage 2.0 VCC – 0.2 V VDF SRAM (PSD) Data Retention Voltage IIL Logic '0' Input Current (Ports 1,2,3,4) ITL Logic 1-to-0 Transition Current (Ports 1,2,3,4) 136/163 4.0 Only on VSTBY 2 VIN = 0.45V (0V for Port 4[pin 2]) –10 –50 µA VIN = 3.5V (2.5V for Port 4[pin 2]) –65 –650 µA V uPSD3212A, uPSD3212C, uPSD3212CV Symbol Parameter Test Condition (in addition to those in Table 109., page 133) ISTBY SRAM (PSD) Standby Current (VSTBY input) VCC = 0V IIDLE SRAM (PSD) Idle Current (VSTBY input) VCC > VSTBY IRST Reset Pin Pull-up Current (RESET) IFR XTAL Feedback Resistor Current (XTAL1) ILI Input Leakage Current ILO IPD (1) Typ. Max. Unit 0.5 1 µA –0.1 0.1 µA VIN = VSS –10 –55 µA XTAL1 = VCC XTAL2 = VSS –20 –50 µA VSS < VIN < VCC –1 1 µA Output Leakage Current 0.45 < VOUT < VCC –10 10 µA 250 µA Power-down Mode VCC = 5.5V LVD logic disabled LVD logic enabled 380 µA 20 30 mA 8 10 mA 30 38 mA 15 20 mA 40 62 mA 20 30 mA Active (12MHz) VCC = 5V Idle (12MHz) ICC_CPU(2,3,5) Active (24MHz) VCC = 5V Idle (24MHz) Active (40MHz) VCC = 5V Idle (40MHz) PLD Only ICC_PSD (DC)(5) Operating Supply Current Flash memory SRAM PLD AC Base ICC_PSD (AC)(5) Note: 1. 2. 3. 4. 5. 6. 7. 8. 9. Min. PLD_TURBO = Off, f = 0MHz(4) 0 PLD_TURBO = On, f = 0MHz 400 700 µA/PT During Flash memory WRITE/Erase Only 15 30 mA Read only, f = 0MHz 0 0 mA f = 0MHz 0 0 mA µA/PT(5) Note 4 Flash memory AC Adder 2.5 3.5 mA/ MHz SRAM AC Adder 1.5 3.0 mA/ MHz IPD (Power-down Mode) is measured with: XTAL1=VSS; XTAL2=not connected; RESET=VCC; Port 0 =VCC; all other pins are disconnected. PLD not in Turbo Mode. ICC_CPU (active mode) is measured with: XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC – 0.5V, XTAL2 = not connected; RESET=VSS; Port 0=VCC; all other pins are disconnected. ICC would be slightly higher if a crystal oscillator is used (approximately 1mA). ICC_CPU (Idle Mode) is measured with: XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC– 0.5V, XTAL2 = not connected; Port 0 = VCC; RESET=VCC; all other pins are disconnected. See Figure 68., page 128 for the PLD current calculation. I/O current = 0mA, all I/O pins are disconnected. 137/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 115. DC Characteristics (3V Devices) Symbol Parameter Test Condition (in addition to those in Table 110., page 133) Min. VIH Input High Voltage (Ports 1, 2, 3, 4[Bits 7,6,5,4,3,1,0], A, B, C, D, XTAL1, RESET) 3.0V < VCC < 3.6V VIH1 Input High Voltage (Port 4[Bit 2]) VIL VIL1 VOL VOL1 VOL2 VOH VOH1 VOH2 Max. Unit 0.7VCC VCC + 0.5 V 3.0V < VCC < 3.6V 2.0 VCC + 0.5 V Input High Voltage (Ports 1, 2, 3, 4[Bits 7,6,5,4,3,1,0], XTAL1, RESET) 3.0V < VCC < 3.6V VSS – 0.5 0.3VCC V Input Low Voltage (Ports A, B, C, D) 3.0V < VCC < 3.6V –0.5 0.8 V Input Low Voltage (Port 4[Bit 2]) 3.0V < VCC < 3.6V VSS – 0.5 0.8 V Output Low Voltage (Ports A,B,C,D) Output Low Voltage (Ports 1,2,3,4, WR, RD) Output Low Voltage (Port 0, ALE, PSEN) Output High Voltage (Ports A,B,C,D) Output High Voltage (Ports 1,2,3,4, WR, RD) Output High Voltage (Port 0 in ext. Bus Mode, ALE, PSEN) VOH3 Output High Voltage VSTBYON VLVR Low Voltage Reset VOP XTAL Open Bias Voltage (XTAL1, XTAL2) VLKO Typ. IOL = 20µA VCC = 3.0V 0.01 0.1 V IOL = 4mA VCC = 3.0V 0.15 0.45 V IOL = 1.6mA 0.45 V IOL = 100µA 0.3 V IOL = 3.2mA 0.45 V IOL = 200µA 0.3 V IOH = –20µA VCC = 3.0V 2.9 2.99 V IOH = –1mA VCC = 3.0V 2.4 2.6 V IOH = –20µA 2.0 V IOH = –10µA 2.7 V IOH = –800µA 2.0 V IOH = –80µA 2.7 V IOH = –1µA VSTBY – 0.8 V 0.1V hysteresis 2.3 IOL = 3.2mA 2.7 V 1.0 2.0 V VCC(min) for Flash Erase and Program 1.5 2.2 V VSTBY SRAM (PSD) Standby Voltage 2.0 VCC – 0.2 V VDF SRAM (PSD) Data Retention Voltage IIL 138/163 Logic '0' Input Current (Ports 1,2,3,4) Only on VSTBY 2 VIN = 0.45V (0V for Port 4[pin 2]) –1 2.5 V –50 µA uPSD3212A, uPSD3212C, uPSD3212CV Symbol Parameter Test Condition (in addition to those in Table 110., page 133) ITL Logic 1-to-0 Transition Current (Ports 1,2,3,4) VIN = 3.5V (2.5V for Port 4[pin 2]) ISTBY SRAM (PSD) Standby Current (VSTBY input) VCC = 0V IIDLE SRAM (PSD) Idle Current (VSTBY input) VCC > VSTBY IRST Reset Pin Pull-up Current (RESET) IFR XTAL Feedback Resistor Current (XTAL1) ILI Input Leakage Current ILO IPD (1) Max. Unit –250 µA 1 µA –0.1 0.1 µA VIN = VSS –10 –55 µA XTAL1 = VCC XTAL2 = VSS –20 –50 µA VSS < VIN < VCC –1 1 µA Output Leakage Current 0.45 < VOUT < VCC –10 10 µA VCC = 3.6V LVD logic disabled 110 µA Power-down Mode LVD logic enabled 180 µA 8 10 mA 4 5 mA 15 20 mA 8 10 mA Active (12MHz) ICC_CPU(2,3,5) VCC = 3.6V Idle (12MHz) Active (24MHz) VCC = 3.6V Idle (24MHz) PLD Only ICC_PSD (DC)(5) Operating Supply Current Flash memory SRAM PLD AC Base ICC_PSD (AC)(5) Note: 1. 2. 3. 4. 5. 6. 7. 8. 9. Min. –25 Typ. 0.5 PLD_TURBO = Off, f = 0MHz(4) 0 PLD_TURBO = On, f = 0MHz 200 400 µA/PT During Flash memory WRITE/Erase Only 10 25 mA Read only, f = 0MHz 0 0 mA f = 0MHz 0 0 mA µA/PT(5) Note 4 Flash memory AC Adder 1.5 2.0 mA/MHz SRAM AC Adder 0.8 1.5 mA/MHz IPD (Power-down Mode) is measured with: XTAL1=VSS; XTAL2=not connected; RESET=VCC; Port 0 =VCC; all other pins are disconnected. PLD not in Turbo mode. ICC_CPU (active mode) is measured with: XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC – 0.5V, XTAL2 = not connected; RESET=VSS; Port 0=VCC; all other pins are disconnected. ICC would be slightly higher if a crystal oscillator is used (approximately 1mA). ICC_CPU (Idle Mode) is measured with: XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC– 0.5V, XTAL2 = not connected; Port 0 = VCC; RESET=VCC; all other pins are disconnected. See Figure 68., page 128 for the PLD current calculation. I/O current = 0mA, all I/O pins are disconnected. 139/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 71. External Program Memory READ Cycle tLLPL tLHLL ALE tAVLL tPLPH tLLIV tPLIV PSEN tPXAV tLLAX tPXIZ tAZPL PORT 0 INSTR IN A0-A7 tAVIV A0-A7 tPXIX A8-A11 PORT 2 A8-A11 AI06848 Table 116. External Program Memory AC Characteristics (with the 5V MCU Module) Symbol Parameter(1) 40MHz Oscillator Min Max Variable Oscillator 1/tCLCL = 24 to 40MHz Min Unit Max tLHLL ALE pulse width 35 2tCLCL – 15 ns tAVLL Address set up to ALE 10 tCLCL – 15 ns tLLAX Address hold after ALE 10 tCLCL – 15 ns tLLIV ALE Low to valid instruction in tLLPL ALE to PSEN 10 tCLCL – 15 ns tPLPH PSEN pulse width 60 3tCLCL – 15 ns tPLIV PSEN to valid instruction in tPXIX Input instruction hold after PSEN tPXIZ(2) Input instruction float after PSEN tPXAV(2) Address valid after PSEN tAVIV Address to valid instruction in tAZPL Address float to PSEN 4tCLCL – 45 55 3tCLCL – 45 30 0 0 tCLCL – 5 20 –5 –5 ns ns 5tCLCL – 55 70 ns ns tCLCL – 10 15 ns ns ns Note: 1. Conditions (in addition to those in Table 109., page 133, VCC = 4.5 to 5.5V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF; CL for other outputs is 80pF 2. Interfacing the uPSD321x Devices to devices with float times up to 20ns is permissible. This limited bus contention does not cause any damage to Port 0 drivers. 140/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 117. External Program Memory AC Characteristics (with the 3V MCU Module) Symbol (1) 24MHz Oscillator Parameter Min Max Variable Oscillator 1/tCLCL = 8 to 24MHz Min Unit Max tLHLL ALE pulse width 43 2tCLCL – 40 ns tAVLL Address set up to ALE 17 tCLCL – 25 ns tLLAX Address hold after ALE 17 tCLCL – 25 ns tLLIV ALE Low to valid instruction in tLLPL ALE to PSEN 22 tCLCL – 20 ns tPLPH PSEN pulse width 95 3tCLCL – 30 ns tPLIV PSEN to valid instruction in tPXIX Input instruction hold after PSEN tPXIZ(2) Input instruction float after PSEN tPXAV(2) Address valid after PSEN tAVIV Address to valid instruction in tAZPL Address float to PSEN 4tCLCL – 87 80 3tCLCL – 65 60 0 0 tCLCL – 5 37 –10 –10 ns ns 5tCLCL – 60 148 ns ns tCLCL – 10 32 ns ns ns Note: 1. Conditions (in addition to those in Table 110., page 133, VCC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF, for 5V devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices) 2. Interfacing the uPSD321x Devices to devices with float times up to 35ns is permissible. This limited bus contention does not cause any damage to Port 0 drivers. 141/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 72. External Data Memory READ Cycle ALE tLHLL tWHLH PSEN tLLDV tLLWL tRLRH RD tLLAX2 tRLAZ A0-A7 from RI or DPL PORT 0 tRHDZ tRLDV tAVLL tRHDX DATA IN A0-A7 from PCL INSTR IN tAVWL tAVDV PORT 2 P2.0 to P2.3 or A8-A11 from DPH A8-A11 from PCH AI07088 Table 118. External Clock Drive (with the 5V MCU Module) Parameter(1) Symbol 40MHz Oscillator Min Max Variable Oscillator 1/tCLCL = 24 to 40MHz Min Max Unit tRLRH Oscillator period 25 41.7 ns tWLWH High time 10 tCLCL – tCLCX ns tLLAX2 Low time 10 tCLCL – tCLCX ns tRHDX Rise time 10 ns tRHDX Fall time 10 ns Note: 1. Conditions (in addition to those in Table 109., page 133, VCC = 4.5 to 5.5V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF; CL for other outputs is 80pF Table 119. External Clock Drive (with the 3V MCU Module) Parameter(1) Symbol 24MHz Oscillator Min Max Variable Oscillator 1/tCLCL = 8 to 24MHz Unit Min Max 41.7 125 ns tRLRH Oscillator period tWLWH High time 12 tCLCL – tCLCX ns tLLAX2 Low time 12 tCLCL – tCLCX ns tRHDX Rise time 12 ns tRHDX Fall time 12 ns Note: 1. Conditions (in addition to those in Table 110., page 133, VCC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF, for 5V devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices) 142/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 73. External Data Memory WRITE Cycle ALE tLHLL tWHLH PSEN tLLWL tWLWH WR tLLAX A0-A7 from RI or DPL PORT 0 tWHQX tQVWX tAVLL tQVWH DATA OUT A0-A7 from PCL INSTR IN tAVWL PORT 2 P2.0 to P2.3 or A8-A11 from DPH A8-A11 from PCH AI07089 Table 120. External Data Memory AC Characteristics (with the 5V MCU Module) Symbol Parameter(1) 40MHz Oscillator Min Max Variable Oscillator 1/tCLCL = 24 to 40MHz Min Unit Max tRLRH RD pulse width 120 6tCLCL – 30 ns tWLWH WR pulse width 120 6tCLCL – 30 ns tLLAX2 Address hold after ALE 10 tCLCL – 15 ns tRHDX RD to valid data in tRHDX Data hold after RD tRHDZ Data float after RD 38 2tCLCL – 12 ns tLLDV ALE to valid data in 150 8tCLCL – 50 ns tAVDV Address to valid data in 150 9tCLCL – 75 ns tLLWL ALE to WR or RD 60 tCLCL + 15 ns tAVWL Address valid to WR or RD 70 tWHLH WR or RD High to ALE High 10 tQVWX Data valid to WR transition 5 tCLCL – 20 ns tQVWH Data set up before WR 125 7tCLCL – 50 ns tWHQX Data hold after WR 5 tCLCL – 20 ns tRLAZ Address float after RD 5tCLCL – 50 75 0 0 90 3tCLCL – 15 ns 4tCLCL – 30 40 0 tCLCL – 15 ns ns tCLCL + 15 0 ns ns Note: 1. Conditions (in addition to those in Table 109., page 133, VCC = 4.5 to 5.5V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF; CL for other outputs is 80pF 143/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 121. External Data Memory AC Characteristics (with the 3V MCU Module) Symbol Parameter(1) Variable Oscillator 1/tCLCL = 8 to 24MHz 24MHz Oscillator Min Max Min Unit Max tRLRH RD pulse width 180 6tCLCL – 70 ns tWLWH WR pulse width 180 6tCLCL – 70 ns tLLAX2 Address hold after ALE 56 2tCLCL – 27 ns tRHDX RD to valid data in tRHDX Data hold after RD tRHDZ Data float after RD 63 2tCLCL – 20 ns tLLDV ALE to valid data in 200 8tCLCL – 133 ns tAVDV Address to valid data in 220 9tCLCL – 155 ns tLLWL ALE to WR or RD 75 tCLCL + 50 ns tAVWL Address valid to WR or RD 67 tWHLH WR or RD High to ALE High 17 tQVWX Data valid to WR transition 5 tCLCL – 37 ns tQVWH Data set up before WR 170 7tCLCL – 122 ns tWHQX Data hold after WR 15 tCLCL – 27 ns tRLAZ Address float after RD 5tCLCL – 90 118 0 0 3tCLCL – 50 175 ns 4tCLCL – 97 tCLCL – 25 67 ns ns tCLCL + 25 0 0 ns ns Note: 1. Conditions (in addition to those in Table 110., page 133, VCC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF, for 5V devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices) Table 122. A/D Analog Specification Symbol Parameter Test Condition Min. Typ. Max. Unit AVREF Analog Power Supply Input Voltage Range VSS VCC V VAN Analog Input Voltage Range VSS – 0.3 AVREF + 0.3 V IAVDD Current Following between VCC and VSS 200 µA CAIN Overall Accuracy ±2 l.s.b. NNLE Non-Linearity Error ±2 l.s.b. NDNLE Differential Non-Linearity Error ±2 l.s.b. NZOE Zero-Offset Error ±2 l.s.b. NFSE Full Scale Error ±2 l.s.b. NGE Gain Error ±2 l.s.b. 20 µs TCONV 144/163 Conversion Time at 8MHz clock uPSD3212A, uPSD3212C, uPSD3212CV Figure 74. Input to Output Disable / Enable INPUT tER tEA INPUT TO OUTPUT ENABLE/DISABLE AI02863 Table 123. CPLD Combinatorial Timing (5V Devices) Symbol Parameter Conditions Min Max PT Aloc Turbo Off Slew rate(1) Unit +2 + 10 –2 ns tPD(2) CPLD Input Pin/Feedback to CPLD Combinatorial Output 20 tEA CPLD Input to CPLD Output Enable 21 + 10 –2 ns tER CPLD Input to CPLD Output Disable 21 + 10 –2 ns tARP CPLD Register Clear or Preset Delay 21 + 10 –2 ns tARPW CPLD Register Clear or Preset Pulse Width tARD CPLD Array Delay 10 Any macrocell + 10 11 ns +2 ns Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount 2. tPD for MCU address and control signals refers to delay from pins on Port 0, Port 2, RD WR, PSEN and ALE to CPLD combinatorial output (80-pin package only) Table 124. CPLD Combinatorial Timing (3V Devices) Symbol Parameter Conditions Min Max PT Aloc Turbo Off Slew rate(1) Unit +4 + 20 –6 ns tPD(2) CPLD Input Pin/Feedback to CPLD Combinatorial Output 40 tEA CPLD Input to CPLD Output Enable 43 + 20 –6 ns tER CPLD Input to CPLD Output Disable 43 + 20 –6 ns tARP CPLD Register Clear or Preset Delay 40 + 20 –6 ns tARPW CPLD Register Clear or Preset Pulse Width tARD CPLD Array Delay 25 Any macrocell + 20 25 +4 ns ns Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount 2. tPD for MCU address and control signals refers to delay from pins on Port 0, Port 2, RD WR, PSEN and ALE to CPLD combinatorial output (80-pin package only) 145/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 75. Synchronous Clock Mode Timing – PLD tCH tCL CLKIN tS tH INPUT tCO REGISTERED OUTPUT AI02860 Table 125. CPLD Macrocell Synchronous Clock Mode Timing (5V Devices) Symbol Parameter Maximum Frequency External Feedback fMAX Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data Conditions Min Max PT Aloc Turbo Off Slew rate(1) Unit 1/(tS+tCO) 40.0 MHz 1/(tS+tCO–10) 66.6 MHz 1/(tCH+tCL) 83.3 MHz tS Input Setup Time 12 tH Input Hold Time 0 ns tCH Clock High Time Clock Input 6 ns tCL Clock Low Time Clock Input 6 ns tCO Clock to Output Delay Clock Input 13 tARD CPLD Array Delay Any macrocell 11 tMIN Minimum Clock Period(2) tCH+tCL +2 + 10 –2 +2 12 Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount. 2. CLKIN (PD1) tCLCL = tCH + tCL. 146/163 ns ns ns ns uPSD3212A, uPSD3212C, uPSD3212CV Table 126. CPLD Macrocell Synchronous Clock Mode Timing (3V Devices) Symbol Parameter Maximum Frequency External Feedback fMAX Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data Conditions Min Max PT Aloc Turbo Off Slew rate(1) Unit 1/(tS+tCO) 22.2 MHz 1/(tS+tCO–10) 28.5 MHz 1/(tCH+tCL) 40.0 MHz tS Input Setup Time 20 tH Input Hold Time 0 ns tCH Clock High Time Clock Input 15 ns tCL Clock Low Time Clock Input 10 ns tCO Clock to Output Delay Clock Input 25 tARD CPLD Array Delay Any macrocell 25 tMIN Minimum Clock Period(2) tCH+tCL +4 + 20 ns –6 +4 ns ns 25 ns Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount. 2. CLKIN (PD1) tCLCL = tCH + tCL. Figure 76. Asynchronous RESET / Preset tARPW RESET/PRESET INPUT tARP REGISTER OUTPUT AI02864 Figure 77. Asynchronous Clock Mode Timing (Product Term Clock) tCHA tCLA CLOCK tSA tHA INPUT tCOA REGISTERED OUTPUT AI02859 147/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 127. CPLD Macrocell Asynchronous Clock Mode Timing (5V Devices) Symbol fMAXA Slew Rate Maximum Frequency External Feedback 1/(tSA+tCOA) 38.4 MHz 1/(tSA+tCOA–10) 62.5 MHz 1/(tCHA+tCLA) 71.4 MHz Maximum Frequency Pipelined Data Max Turbo Off Conditions Maximum Frequency Internal Feedback (fCNTA) Min PT Aloc Parameter Unit tSA Input Setup Time 7 tHA Input Hold Time 8 tCHA Clock Input High Time 9 + 10 ns tCLA Clock Input Low Time 9 + 10 ns tCOA Clock to Output Delay tARDA CPLD Array Delay tMINA Minimum Clock Period +2 1/fCNTA ns ns 21 Any macrocell + 10 11 + 10 –2 +2 ns ns 16 ns Table 128. CPLD Macrocell Asynchronous Clock Mode Timing (3V Devices) Symbol fMAXA Slew Rate Maximum Frequency External Feedback 1/(tSA+tCOA) 21.7 MHz 1/(tSA+tCOA–10) 27.8 MHz 1/(tCHA+tCLA) 33.3 MHz Maximum Frequency Pipelined Data Max Turbo Off Conditions Maximum Frequency Internal Feedback (fCNTA) Min PT Aloc Parameter Unit tSA Input Setup Time 10 tHA Input Hold Time 12 tCHA Clock High Time 17 + 20 ns tCLA Clock Low Time 13 + 20 ns tCOA Clock to Output Delay tARD CPLD Array Delay tMINA Minimum Clock Period 148/163 +4 1/fCNTA 25 36 ns ns 36 Any macrocell + 20 + 20 +4 –6 ns ns ns uPSD3212A, uPSD3212C, uPSD3212CV Figure 78. Input Macrocell Timing (Product Term Clock) t INH t INL PT CLOCK t IS t IH INPUT OUTPUT t INO AI03101 Table 129. Input Macrocell Timing (5V Devices) Symbol Parameter Conditions Min Max PT Aloc Turbo Off Unit tIS Input Setup Time (Note 1) 0 tIH Input Hold Time (Note 1) 15 tINH NIB Input High Time (Note 1) 9 ns tINL NIB Input Low Time (Note 1) 9 ns tINO NIB Input to Combinatorial Delay (Note 1) ns + 10 34 +2 + 10 ns ns Note: 1. Inputs from Port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to tAVLX and tLXAX. Table 130. Input Macrocell Timing (3V Devices) Symbol Parameter Conditions Min Max PT Aloc Turbo Off Unit tIS Input Setup Time (Note 1) 0 tIH Input Hold Time (Note 1) 25 tINH NIB Input High Time (Note 1) 12 ns tINL NIB Input Low Time (Note 1) 12 ns tINO NIB Input to Combinatorial Delay (Note 1) ns + 20 46 +4 + 20 ns ns Note: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to tAVLX and tLXAX. 149/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 131. Program, WRITE and Erase Times (5V Devices) Symbol Parameter Min. Flash Program Typ. 8.5 Flash Bulk Erase(1) (pre-programmed) 3 Flash Bulk Erase (not pre-programmed) 5 tWHQV3 Sector Erase (pre-programmed) 1 tWHQV2 Sector Erase (not pre-programmed) 2.2 tWHQV1 Byte Program 14 Program / Erase Cycles (per Sector) tWHWLO tQ7VQV Max. s 30 s s 30 s s 150 100,000 Sector Erase Time-out Unit µs cycles 100 (2) DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling) µs 30 ns Max. Unit Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading. Table 132. Program, WRITE and Erase Times (3V Devices) Symbol Parameter Min. Flash Program Typ. 8.5 Flash Bulk Erase(1) (pre-programmed) 3 Flash Bulk Erase (not pre-programmed) 5 tWHQV3 Sector Erase (pre-programmed) 1 tWHQV2 Sector Erase (not pre-programmed) 2.2 tWHQV1 Byte Program 14 Program / Erase Cycles (per Sector) tWHWLO tQ7VQV 30 Sector Erase Time-out s s 30 s s 150 100,000 µs cycles 100 (2) DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling) Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading. 150/163 s µs 30 ns uPSD3212A, uPSD3212C, uPSD3212CV Figure 79. Peripheral I/O READ Timing ALE ADDRESS A/D BUS DATA VALID tAVQV (PA) tSLQV (PA) CSI tRLQV (PA) tRHQZ (PA) RD tDVQV (PA) DATA ON PORT A AI06610 Table 133. Port A Peripheral Data Mode READ Timing (5V Devices) Symbol Parameter tAVQV–PA Address Valid to Data Valid tSLQV–PA CSI Valid to Data Valid tRLQV–PA RD to Data Valid tDVQV–PA tRHQZ–PA Conditions Min (Note 1) Max Turbo Off Unit 37 + 10 ns 27 + 10 ns 32 ns Data In to Data Out Valid 22 ns RD to Data High-Z 23 ns (Note 2) Note: 1. Any input used to select Port A Data Peripheral Mode. 2. Data is already stable on Port A. Table 134. Port A Peripheral Data Mode READ Timing (3V Devices) Symbol Parameter tAVQV–PA Address Valid to Data Valid tSLQV–PA CSI Valid to Data Valid tRLQV–PA RD to Data Valid tDVQV–PA tRHQZ–PA Conditions (Note 1) Min Max Turbo Off Unit 50 + 20 ns 37 + 20 ns 45 ns Data In to Data Out Valid 38 ns RD to Data High-Z 36 ns (Note 2) Note: 1. Any input used to select Port A Data Peripheral Mode. 2. Data is already stable on Port A. 151/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 80. Peripheral I/O WRITE Timing ALE A / D BUS ADDRESS DATA OUT tWLQV tWHQZ (PA) (PA) WR tDVQV (PA) PORT A DATA OUT AI06611 Table 135. Port A Peripheral Data Mode WRITE Timing (5V Devices) Symbol Parameter tWLQV–PA WR to Data Propagation Delay tDVQV–PA Data to Port A Data Propagation Delay tWHQZ–PA WR Invalid to Port A Tri-state Conditions Min (Note 1) Max Unit 25 ns 22 ns 20 ns Max Unit 42 ns 38 ns 33 ns Note: 1. Data stable on Port 0 pins to data on Port A. Table 136. Port A Peripheral Data Mode WRITE Timing (3V Devices) Symbol Parameter tWLQV–PA WR to Data Propagation Delay tDVQV–PA Data to Port A Data Propagation Delay tWHQZ–PA WR Invalid to Port A Tri-state Note: 1. Data stable on Port 0 pins to data on Port A. 152/163 Conditions (Note 1) Min uPSD3212A, uPSD3212C, uPSD3212CV Figure 81. Reset (RESET) Timing VCC VCC(min) tNLNH-PO Power-On Reset tOPR tNLNH tOPR Warm Reset RESET AI07437 Table 137. Reset (RESET) Timing (5V Devices) Symbol Parameter tNLNH RESET Active Low Time(1) tNLNH–PO Power-on Reset Active Low Time tOPR RESET High to Operational Device Conditions Min Max Unit 150 ns 1 ms 120 ns Max Unit Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. Table 138. Reset (RESET) Timing (3V Devices) Symbol Parameter tNLNH RESET Active Low Time(1) tNLNH–PO Power-on Reset Active Low Time tOPR RESET High to Operational Device Conditions Min 300 ns 1 ms 300 ns Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. Table 139. VSTBYON Definitions Timing (5V Devices) Symbol Parameter Conditions Min Typ Max Unit tBVBH VSTBY Detection to VSTBYON Output High (Note 1) 20 µs tBXBL VSTBY Off Detection to VSTBYON Output Low (Note 1) 20 µs Note: 1. VSTBYON timing is measured at VCC ramp rate of 2ms. Table 140. VSTBYON Timing (3V Devices) Symbol Parameter Conditions Min Typ Max Unit tBVBH VSTBY Detection to VSTBYON Output High (Note 1) 20 µs tBXBL VSTBY Off Detection to VSTBYON Output Low (Note 1) 20 µs Note: 1. VSTBYON timing is measured at VCC ramp rate of 2ms. 153/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 82. ISC Timing t ISCCH TCK t ISCCL t ISCPSU t ISCPH TDI/TMS t ISCPZV t ISCPCO ISC OUTPUTS/TDO t ISCPVZ ISC OUTPUTS/TDO AI02865 Table 141. ISC Timing (5V Devices) Symbol Parameter Conditions Min Max Unit 20 MHz tISCCF Clock (TCK, PC1) Frequency (except for PLD) (Note 1) tISCCH Clock (TCK, PC1) High Time (except for PLD) (Note 1) 23 ns tISCCL Clock (TCK, PC1) Low Time (except for PLD) (Note 1) 23 ns tISCCFP Clock (TCK, PC1) Frequency (PLD only) (Note 2) tISCCHP Clock (TCK, PC1) High Time (PLD only) (Note 2) 240 ns tISCCLP Clock (TCK, PC1) Low Time (PLD only) (Note 2) 240 ns tISCPSU ISC Port Set Up Time 7 ns tISCPH ISC Port Hold Up Time 5 ns tISCPCO ISC Port Clock to Output 21 ns tISCPZV ISC Port High-Impedance to Valid Output 21 ns tISCPVZ ISC Port Valid Output to High-Impedance 21 ns Note: 1. For non-PLD Programming, Erase or in ISC By-pass Mode. 2. For Program or Erase PLD only. 154/163 2 MHz uPSD3212A, uPSD3212C, uPSD3212CV Table 142. ISC Timing (3V Devices) Symbol Parameter Conditions Min Max Unit 12 MHz tISCCF Clock (TCK, PC1) Frequency (except for PLD) (Note 1) tISCCH Clock (TCK, PC1) High Time (except for PLD) (Note 1) 40 ns tISCCL Clock (TCK, PC1) Low Time (except for PLD) (Note 1) 40 ns tISCCFP Clock (TCK, PC1) Frequency (PLD only) (Note 2) tISCCHP Clock (TCK, PC1) High Time (PLD only) (Note 2) 240 ns tISCCLP Clock (TCK, PC1) Low Time (PLD only) (Note 2) 240 ns tISCPSU ISC Port Set Up Time 12 ns tISCPH ISC Port Hold Up Time 5 ns tISCPCO ISC Port Clock to Output 30 ns tISCPZV ISC Port High-Impedance to Valid Output 30 ns tISCPVZ ISC Port Valid Output to High-Impedance 30 ns 2 MHz Note: 1. For non-PLD Programming, Erase or in ISC By-pass Mode. 2. For Program or Erase PLD only. Figure 83. MCU Module AC Measurement I/O Waveform VCC – 0.5V 0.2 VCC + 0.9V Test Points 0.2 VCC – 0.1V 0.45V AI06650 Note: AC inputs during testing are driven at VCC–0.5V for a logic '1,' and 0.45V for a logic '0.' Timing measurements are made at VIH(min) for a logic '1,' and VIL(max) for a logic '0' Figure 84. PSD MODULE AC Float I/O Waveform VOH – 0.1V VLOAD + 0.1V Test Reference Points VLOAD – 0.1V 0.2 VCC – 0.1V VOL + 0.1V AI06651 Note: For timing purposes, a Port pin is considered to be no longer floating when a 100mV change from load voltage occurs, and begins to float when a 100mV change from the loaded VOH or VOL level occurs IOL and IOH ≥ 20mA 155/163 uPSD3212A, uPSD3212C, uPSD3212CV Figure 85. External Clock Cycle Figure 86. Recommended Oscillator Circuits Note: C1, C2 = 30pF ± 10pF for crystals For ceramic resonators, contact resonator manufacturer Oscillation circuit is designed to be used either with a ceramic resonator or crystal oscillator. Since each crystal and ceramic resonator have their own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. Figure 87. PSD MODULE AC Measurement I/O Waveform Figure 88. PSD MODULEAC Measurement Load Circuit 2.01 V 195 Ω 3.0V Test Point 1.5V Device Under Test 0V CL = 30 pF (Including Scope and Jig Capacitance) AI03103b AI03104b Table 143. Capacitance Symbol Parameter Test Condition Typ.(1) Max. Unit CIN Input Capacitance (for input pins) VIN = 0V 4 6 pF VOUT = 0V 8 12 COUT Output Capacitance (for input/ output pins) Note: Sampled only, not 100% tested. 1. Typical values are for TA = 25°C and nominal supply voltages. 156/163 pF uPSD3212A, uPSD3212C, uPSD3212CV PACKAGE MECHANICAL INFORMATION Figure 89. TQFP52 – 52-lead Plastic Thin, Quad, Flat Package Outline D D1 D2 A2 e E2 E1 E Ne b N 1 A Nd CP L1 c QFP-A A1 α L Note: Drawing is not to scale. 157/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 144. TQFP52 – 52-lead Plastic Thin, Quad, Flat Package Mechanical Data mm inches Symb Typ Min Max Typ Min Max A – – 1.75 – – 0.069 A1 – 0.05 0.020 – 0.002 0.008 A2 – 1.25 1.55 – 0.049 0.061 b – 0.02 0.04 – 0.007 0.016 c – 0.07 0.23 – 0.002 0.009 D 12.00 – – 0.473 – – D1 10.00 – – 0.394 – – E 12.00 – – 0.473 – – E1 10.00 – – 0.394 – – e 0.65 – – 0.026 – – L – 0.45 0.75 – 0.018 0.030 L1 1.00 – – 0.039 – – α – 0° 7° – 0° 7° D2 E2 n 52 52 Nd 13 13 Ne 13 13 CP 158/163 – – 0.10 – – 0.004 uPSD3212A, uPSD3212C, uPSD3212CV Figure 90. TQFP80 – 80-lead Plastic Thin, Quad, Flat Package Outline D D1 D2 A2 e E2 E1 E Ne b N 1 A Nd CP L1 c QFP-A A1 α L Note: Drawing is not to scale. 159/163 uPSD3212A, uPSD3212C, uPSD3212CV Table 145. TQFP80 – 80-lead Plastic Thin, Quad, Flat Package Mechanical Data mm inches Symb Typ Min Max Typ Min Max A – – 1.60 – – 0.063 A1 – 0.05 0.15 – 0.002 0.006 A2 1.40 1.35 1.45 0.055 0.053 0.057 b 0.22 0.17 0.27 0.009 0.007 0.011 c – 0.09 0.20 – 0.004 0.008 D 14.00 – – 0.551 – – D1 12.00 – – 0.472 – – D2 9.50 – – 0.374 – – E 14.00 – – 0.551 – – E1 12.00 – – 0.472 – – E2 9.50 – – 0.374 – – e 0.50 – – 0.020 – – L 0.60 0.45 0.75 0.024 0.018 0.030 L1 1.00 – – 0.039 – – α 3.5 0° 7° 3.5 0° 7° n 80 80 Nd 20 20 Ne 20 20 CP 160/163 – – 0.08 – – 0.003 uPSD3212A, uPSD3212C, uPSD3212CV PART NUMBERING Table 146. Ordering Information Scheme Example: uPSD 3 2 1 2 C V – 24 U 6 T Device Type uPSD = Microcontroller PSD Family 3 = 8032 core PLD Size 2 = 16 Macrocells SRAM Size 1 = 2K bytes Main Flash Memory Size 2 = 64K bytes IP Mix A = USB, I2C, PWM, ADC, (2) UARTs Supervisor (Reset Out, Reset In, LVD, WD) C = I2C, PWM, ADC, (2) UARTs Supervisor (Reset Out, Reset In, LVD, WD) Operating Voltage blank = VCC = 4.5 to 5.5V V = VCC = 3.0 to 3.6V Speed –24 = 24MHz –40 = 40MHz Package T = 52-pin TQFP U = 80-pin TQFP Temperature Range 6 = –40 to 85°C Shipping Option T = Tape and Reel Packing For other options, or for more information on any aspect of this device, please contact the ST Sales Office nearest you. 161/163 uPSD3212A, uPSD3212C, uPSD3212CV REVISION HISTORY Table 147. Document Revision History Date Version 18-Dec-2002 1.0 First Issue 04-Mar-03 1.1 Updates: port information (Table 30); interface information (Figure 30, Table 44); remove programming guide; PSD Module information (Table 82); PLD information (Figure 55); electrical characteristics (Table 114, 115, 131, 132) 02-Sep-03 1.2 Update references for Product Catalog 03-Feb-04 2.0 Reformatted; correct package dimensions (Table 145) 02-July-04 3.0 Reformatted; add EMC characteristics information (Table 106, 107, 108) 04-Nov-04 4.0 Updates per requested data brief changes (Figure 3, 4; Table 1, 2, 113) 03-Dec-04 5.0 Add USB feature to document (Figure 2, 3, 4, 15, 16, 18, 20, 40, 41, 42, 43, 44, 45; Table 1, 2, 15, 16, 18, 19, 21, 23, 24, 25, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 146) 162/163 Revision Details uPSD3212A, uPSD3212C, uPSD3212CV Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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