SEOUL WH108

*Customer:
Specification
Preliminary
ITEM
MODEL
CHIP LED DEVICE
WH108
REVISION DATE
Rev0.0(071106)
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Soldering profile
5. Outline dimension
6. Packing
7. Reel packing structure
8. Precaution for use
Drawn by
SSC-QP-0401-06(REV.0)
Checked by
Approved by
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
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SSC-WH104-#
Seoul Semiconductor
1. Features
Package : 1.6 × 0.8 × 0.17 mm
Color coordinates: X = 0. 25
Y = 0.24
according to CIE 1931
Tape and reel packing
2. Absolute Maximum Ratings
(Ta=25℃)
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
70
㎽
Forward Current
IF
20
㎃
Peak Forward Current
IFM*1
60
㎃
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30 ~ 80
℃
Storage Temperature
Tstg
-40 ~ 100
℃
*1 IFM conditions: Pulse width Tw≤ 0.1ms, Duty ratio≤ 1/10
3. Electro-Optical Characteristics
Characteristics
(Ta=25℃)
Symbol
Condition
Forward Voltage
VF
IF=5㎃
Reverse Current
IR
VR=5V
-
-
10
㎂
Luminous Intensity *2
IV
IF=5㎃
150
240
350
mcd
X
IF=5㎃
0.227
0.270
0.321
Y
IF=5㎃
0.220
0.265
0.310
IF=5㎃
-
130
-
Chromaticity Coordinates *3
Viewing Angle
: Y Direction
2θ
1/2
Min
Typ
Max
3.0
Unit
V
˚
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3 The CIE standard colorimetric system
[Note] ( Tolerance : IV±10%, color coordinate ±0.01, VF ±0.1 )
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 2/9 -
SSC-WH104-#
4. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
°C
Operation heating
240
150
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
~
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
LED Surface temperature
°C
Operation heating
260
150
Pre-heating
Temperature
rise: 5°C/sec. MAX.
Cooling:
-5°C/sec.
~
120
0
60 to 150 sec.
10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
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SSC-WH104-#
Tolerance: ±0.05, Unit: ㎜
6. Outline Dimension
0.4
0.10
Cathode
1.3
1.4
1.6
Mold
PCB
Anode
1.1
0.17 ±0.03
0.8
7. Packing
±0.1
±0.2
±0.05
8.0
±0.05
1.75
0.2
(2.75)
1.85
±0.05
1.5
±0.1
2.0 ±0.05
3.5
4.0
+0.1
-0
4.0 ±0.1
0.5 ±0.08
180
0.95
±0.05
0.35±0.05
11.4
+0
-3
9
±0.3
60
+0.2
-0
2 ±0.2
22
13 ±0.2
Label
Tolerance ±0.2, Unit :
mm
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10℃ angle to be the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
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SSC-WH104-#
8. Reel Packing Structure
Reel
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제품명 SSC-WH108
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수량 : 4000
Aluminum Vinyl Bag
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제품명 SSC-WH108
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수량 : 4000
Outer Box
*Material: Paper(SW3B(B))
SIZE(mm)
TYPE
a
7inch 245
b
220
c
142
c
CHIP LED
PART : SSC-WH108
CODE :
Q'YT : 40,000EA
CHIP LED
b
a
LOT NO :
DATE :
SEOUL SEMICONDUCTOR CO.,LTD
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 5/9 -
SSC-WH104-#
9. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator)
with a desiccant . Otherwise, to store them in the following environment is recommended.
Temperature : 5~30
Humidity : 60%HR max.
(2) Attention after opened
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the
light transmission efficiency, causing the light intensity to drop. Attention in followed.
a. After opened and mounted, the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40℃
Humidity : less than 30%
(3) In case of more than 1 week passed after opening or change color of indicator on desiccant
components shall be dried 10-12hr. at 60±5℃.
(4) In case of supposed the components is humid, shall be dried dip-solder just before.
100Hr at 80±5℃ or 12Hr at 100±5℃.
(5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temp. after soldering.
(6) Quick cooling shall not be avoid.
(7) Components shall not be mounted on warped direction of PCB.
(8) Anti radioactive ray design is not considered for the products listed here in.
(9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When
washing is required, IPA should be used.
(10) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
(11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage.
(12) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry
place.
(14) The appearance and specifications of the product may be modified for improvement without notice.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 6/9 -
SSC-WH104-#