SMTY18AM ® LOW FORWARD VOLTAGE TVS: Transky™ FEATURES AND BENEFITS ■ ■ ■ ■ ■ ■ High peak pulse power: 400W (8/20µs) Stand-off voltage 16V Low forward voltage: 0.48V @ 0.85A @ 25°C Low clamping factor VCL/VBR A K Fast response time Very thin package (1.0mm overall component height) STmite (DO-216AA) DESCRIPTION The Transky™ is designed specifically for portable equipments and miniaturized electronics devices subject to ESD transient overvoltages. The Transky™ combines the performance of a Transil™ or TVS (Tansient Voltage Supressor) and low forward voltage Schottky diode in a monolithic structure. Table 1: Order Code Part Number SMTY18AM Marking Y18 K COMPLIES WITH FOLLOWING STANDARDS IEC 61000-4-2 Level 4: 15kV (Air discharge) 8kV (Contact discharge) MIL Standard 883E-Method 3015-7: class 3C Human Body Model (HBM) A Table 2: Absolute Ratings (limiting values) Symbol Parameter Value Unit Air discharge Contact discharge 15 8 kV Peak pulse power dissipation (see note 1) Tj initial = Tamb 400 W IFSM Non repetitive surge peak forward current Tp = 10 ms Tj = initial = Tamb 25 A Tstg Storage temperature range -65 to + 175 °C 150 °C VPP IEC 61000-4-2 standard PPP Tj Maximum operating junction temperature Note 1: 8/20µs pulse waveform September 2004 REV. 2 1/6 SMTY18AM Table 3: Thermal Resistances Symbol Rth(j-a) Parameter Symbol 250 °C/W I IF Parameter VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current VCL VBR VRM VF V IRM IR IPP Capacitance IRM max @ VRM VCL max @ IPP VF max @ 0.85A Note 2 Note 3 Note 4 αT max C typ @ 0V mA V V A V 10-4/°C pF 4 16 20 1 0.48 8.8 500 Note 2: Tamb = 85°C Note 3: 8/20µs pulse waveform Note 4: Pulse test tp = 500µs, d< 2% 2/6 Unit Junction to ambient on PCB with recommended pad layout Table 4: Static Electrical Characteristics (Tamb = 25°C) C Value SMTY18AM Figure 1: Peak pulse power versus exponential pulse duration Figure 2: Relative variation of peak pulse power versus initial junction temperature % PPP(W) 110 1000 Tj initial = 25°C 100 90 80 70 60 100 50 40 30 20 10 tp(ms) Tj(°C) 0 10 0.01 0.10 1.00 10.00 Figure 3: Average power dissipation versus ambient temperature 0 25 50 75 100 125 150 175 Figure 4: Variation of thermal impedance junction to ambient versus pulse duration (Epoxy FR4, ecu=35µm) P(W) Zth(j-a)(°C/W) 0.5 1000.0 Printed circuit board FR4 (eCU=35µm) µ , recommended pad layout SCU=0.135cm²² 0.4 100.0 SCU=2cm²² 0.3 10.0 0.2 1.0 0.1 Tamb (°C) tp(s) 0.0 0.1 0 25 50 75 100 125 150 Figure 5: Thermal resistance junction to ambient versus copper surface under tab 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 6: Reverse leakage current versus junction temperature (typical values) IR(µA) Rth(j-a)(°C/W) 1.E+05 250 VR=VRM 200 1.E+04 150 1.E+03 100 1.E+02 50 1.E+01 SCU(cm²) Tj(°C) 0 1.E+00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 3/6 SMTY18AM Figure 7: Clamping voltage versus peak pulse current (typical values) Figure 8: Junction capacitance versus reverse voltage applied (typical values) C(pF) IPP(A) 1000 100.0 Tj initial =25°C F=1MHz VOSC=30mVRMS Tj=25°C 8/20µs 10.0 10/1000µs 1.0 VCL(V) VR(V) 100 0.1 10 12 14 16 18 20 22 24 26 28 30 Figure 9: Forward voltage drop versus forward current (typical values) IF(A) 10.00 1.00 Tj=85°C Tj=25°C 0.10 VF(V) 0.01 0.0 4/6 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1 10 100 SMTY18AM Figure 10: STmite Package Mechanical Data REF. L3 A A1 b b2 c D E H L L2 L3 D b2 b H L2 L E R C A A1 0° to 6° R1 R R1 DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. Max. 0.85 1.00 1.15 0.033 0.039 0.045 -0.05 0.05 -0.002 0.002 0.40 0.65 0.016 0.025 0.70 1.00 0.027 0.039 0.10 0.25 0.004 0.010 1.75 1.90 2.05 0.069 0.007 0.081 1.75 1.90 2.05 0.069 0.007 0.081 3.60 3.75 3.90 0.142 0.148 0.154 0.50 0.63 0.80 0.019 0.025 0.031 1.20 1.35 1.50 0.047 0.053 0.059 0.50 0.019 ref ref 0.07 0.003 0.07 0.003 Figure 11: Foot Print Dimensions (in millimeters) 1.82 1.38 2.03 0.75 1.10 0.50 0.71 Table 5: Ordering Information Ordering type Marking Package Weight Base qty Delivery mode SMTY18AM Y18 STmite 15.5 mg 12000 Tape & reel Table 6: Revision History Date Revision Description of Changes 09-Jul-2004 1 First issue 13-Sep-2004 2 STmite package dimensions reference A1 change: from blank (min) to -0.05mm and from 0.10 (max) to 0.05mm. 5/6 SMTY18AM Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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