*Customer: SPECIFICATION ITEM MODEL Top View LED SSC-YGURHT811-BS [Contents] 1. Features ------------------------------------------------------------- 2 2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics --------------------------------------- 3 5. Rank of YGURHT811-BS --------------------------------------------- 4 6. Soldering Profile ---------------------------------------------------- 5 7. Outline Dimension 8. Packing ----------------------------------------------- 6 ------------------------------------------------------------- 6 9. Reel Packing Structure ------------------------------------------------ 7 10. Precaution for Use ------------------------------------------------------ 8 11. Handling of Silicone Resin LEDs --------------------------------------- 9 CUSTOMER Checked by Approved by SUPPLIER Drawn by SSC-QP-0401-06(REV.0.4) Checked by Approved by SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 1/10 - SSC-YGURHT811-BS 1. Features Pb-free Reflow Soldering application RoHS Compliant Upper Surface Black colored SMT package and colorless clear window Suitable for all SMT assembly methods ; Suitable for all soldering methods Encapsulating Resin : Silicone Resin 2. Application Led Dot Matrix Indoor and outdoor displays LCD Backlights etc. R, Y/G – displays Automotive Indicator 3. Absolute Maximum Ratings *1 (Ta=25ºC) Value Parameter Symbol Yellowish Green Red Power Dissipation Pd 90 90 mW Forward Current IF 30 30 mA 90 90 mA Forward Peak Surge Current IFM *2 Unit Reverse Voltage VR 5 V Operating Temperature Topr -30 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 2/10 - SSC-YGURHT811-BS 4. Electro-Optical Characteristics Parameter Forward Voltage Yellowish Green (Ta=25ºC) Symbo l Condition VF IF =20mA Red Reverse Current Yellowish Green IR *1 Yellowish Green Red Dominant Wavelength Spectral Bandwidth Yellowish Green Red Yellowish Green IV IF =20mA λd IF =20mA ∆λ IF =20mA Red Viewing Angle *2 R, G 2θ½ Typ Max 1.9 2.1 2.5 IF =40mA Total Unit V 1.5 1.9 2.3 - - 1 - - 1 30 50 70 20 30 40 565 570 575 635 640 645 - 20 - VR=5V Red Luminance Intensity Min µA mcd nm nm - 30 - - 120 - deg. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 3/10 - SSC-YGURHT811-BS 5. Rank of YGURHT811-BS 1) Rank Name X1 X2 X3 X4 Iv - Red Iv - YG λd Red λd YG 2) Test Condition Parameter Symbol Forward Current If Reverse Voltage Vr 3) Luminous Intensity [Iv] Rank R Name MIN MAX N 20 25 O 25 30 P 30 35 Q 35 43 4) Dominant Wavelength [λd] Rank G Name MIN MAX A 635 645 Value R 20 10 Rank Name SSC-QP-0401-06(REV.0.4) mA V YG N O P Q MIN 30 40 50 60 Rank Name A B C D E X MIN 565 567 569 571 573 565 5) Forward Voltage [Vf] R YG MIN MAX MIN MAX 1.5 2.3 1.9 2.5 6) Reverse Current [Ir] YG R MIN MAX MIN MAX 1 1 Unit YG 20 10 MAX 40 50 60 70 YG MAX 567 569 571 573 575 575 mcd Unit nm Unit V Unit uA SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 4/10 - Unit SSC-YGURHT811-BS 6. Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder) Temp [°C] Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 Pre-heating ~ 180 Cooling -5 °C/sec Rising 5 °C/sec 150 0 Time [Hr] (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (3) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 5/10 - SSC-YGURHT811-BS 7. Outline Dimension Upper Surface Black Package Marking (Cathode) Red Anode 4 3 1 Yellowish/Green Anode 4 2 3 1 Front View Recommended Solder Pad Circuit Diagram Package Outlines Right View 2 Red Cathode Rear View Yellowish/Green Cathode ( Tolerance: ±0.2, Unit: mm ) 8. Packing 1.75±0.1 0.22±0.05 3.83±0.1 5° 3.5±0.1 8±0.1 1.55 ± 0.05 4.0±0.1 2.0±0.05 1.0±0.1 8° 3.1±0.1 2.22±0.1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 13 30° 10 ±0.2 60 2.0 ± 0.2 22 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000 pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 6/10 - SSC-YGURHT811-BS 9. Reel Packing Structure Reel XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX XXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX XXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c XXXX 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : RoHS XXXXXX a SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-0401-06(REV.0.4) b SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 7/10 - SSC-YGURHT811-BS 10. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%HR (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) In the case of that the components is humided, the components shall be dried; 24Hr at 80±5ºC or 12Hr at 100±5ºC. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of L/F. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 8/10 - SSC-YGURHT811-BS 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. SSC-QP-0401-06(REV.0.4) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 9/10 - SSC-YGURHT811-BS