A Product Line of Diodes Incorporated ZXLD1366 High accuracy 1A, 60V LED driver with internal switch Description The ZXLD1366 is a continuous mode inductive step-down converter, designed for driving single or multiple series connected LEDs efficiently from a voltage source higher than the LED voltage. The device operates from an input supply between 6V and 60V and provides an externally adjustable output current of up to 1A. Depending upon supply voltage and external components, this can provide up to 48 watts of output power. The ZXLD1366 includes the output switch and a high-side output current sensing circuit, which uses an external resistor to set the nominal average output current. Output current can be adjusted above, or below the set value, by applying an external control signal to the 'ADJ' pin. The ADJ pin will accept either a DC voltage or a PWM waveform. Depending upon the control frequency, this will provide either a continuous (dimmed) or a gated output current. Soft-start can be forced using an external capacitor from the ADJ pin to ground. Applying a voltage of 0.2V or lower to the ADJ pin turns the output off and switches the device into a low current standby state. Features Applications • • • • • • • • • • • • • • • • • Typically better than 0.8% output current accuracy Available in thermally enhanced DFN package Simple and with low part count Single pin on/off and brightness control using DC voltage or PWM PWM resolution up to 1000:1 High efficiency (up to 97%) Wide input voltage range: 6V to 60V Inherent open-circuit LED protection Pin connections Low voltage halogen replacement LEDs Automotive lighting Low voltage industrial lighting LED back-up lighting Illuminated signs Emergency lighting SELV lighting LCD TV backlighting Refrigeration lights Typical application circuit D1 Rs VIN (24V) 0.2⍀ 5 VIN LX 1 GND 2 4 ISENSE ADJ 3 LX VIN GND GND L1 ISENSE ADJ C1 TSOT23-5 Top view 4.7F DFN633 Top view 100nF VIN ISENSE ADJ ZXLD1366 LX GND GND Issue 2 - September 2008 © Diodes Incorporated 2008 1 www.zetex.com www.diodes.com ZXLD1366 Absolute maximum ratings (voltages to GND unless otherwise stated) Input voltage (VIN) ISENSE voltage (VSENSE) LX output voltage (VLX) Adjust pin input voltage (VADJ) Switch output current (ILX) Power dissipation (Ptot) -0.3V to +60V (65V for 0.5 sec) +0.3V to -5V (measured with respect to VIN) -0.3V to +60V (65V for 0.5 sec) -0.3V to +6V 1.25A SOT23-5; 1W: DFN; 1.8W (Refer to package thermal de-rating curve on page 26) Operating temperature (TOP) Storage temperature (TST) Junction temperature (Tj MAX) -40 to 125°C -55 to 150°C 150°C These are stress ratings only. Operation outside the absolute maximum ratings may cause device failure. Operation at the absolute maximum ratings, for extended periods, may reduce device reliability. Thermal resistance Junction to ambient (R⍜JA) Junction to board (RΨJB) Junction to case (R⍜JC) TSOT23-5 DFN 82°C/W 33°C/W - 44°C/W 14°C/W Electrical characteristics (test conditions: VIN=24V, Tamb=25°C unless otherwise stated)(a) Symbol VIN Parameter Input voltage VSU Internal regulator start-up threshold VSD Internal regulator shutdown threshold IINQoff Quiescent supply current with output off Quiescent supply current with output switching(c) IINQon Conditions See note(b) Min. 6 Typ. Max. 60 4.85 5.2 4.4 4.75 ADJ pin grounded VSENSE ADJ pin floating, L=68H, 3 LEDs, f = 260kHz Mean current sense threshold voltage Measured on ISENSE pin (Defines LED current setting accuracy) with respect to VIN VADJ = 1.25V; VIN=18V VSENSEHYS Sense threshold hysteresis ISENSE ISENSE pin input current VSENSE = VIN -0.2 VREF Internal reference voltage Measured on ADJ pin with pin floating 65 VADJoff External control voltage range on ADJ pin for DC brightness control(d) DC voltage on ADJ pin to switch device from active (on) state to quiescent (off) state 108 4 205 10 0.15 0.2 A V 50 VADJ falling mV % 1.25 0.3 A mA ±15 ⌬VREF /⌬T Temperature coefficient of VREF VADJ 200 V V 1.6 195 Unit V ppm/°C 2.5 V 0.27 V NOTES: (a) Production testing of the device is performed at 25°C. Functional operation of the device and parameters specified over a -40°C to +105°C temperature range, are guaranteed by design, characterization and process control. (b) VIN > 16V to fully enhance output transistor. Otherwise out current must be derated - see graphs. Operation at low supply may cause excessive heating due to increased on-resistance. Tested at 7V guaranteed for 6V by design. (c) Static current of device is approximately 700 A, see Graph, Page 17 (d) 100% brightness corresponds to VADJ = VADJ(nom) = VREF. Driving the ADJ pin above VREF will increase the VSENSE. threshold and output current proportionally. Issue 2 - September 2008 © Diodes Incorporated 2008 2 www.zetex.com www.diodes.com ZXLD1366 Electrical characteristics (test conditions: VIN=24V, Tamb=25°C unless otherwise stated) (cont.) Symbol VADJon RADJ Parameter DC voltage on ADJ pin to switch device from quiescent (off) state to active (on) state Resistance between ADJ pin and VREF ILXmean Continuous LX switch current RLX LX Switch ‘On’ resistance ILX(leak) LX switch leakage current Conditions VADJ rising Min. 0.2 Typ. 0.25 Max. 0.3 Unit V 0< VADJ < VREF VADJ > VREF +100mV 30 10.4 50 14.2 65 18 k⍀ k⍀ 1 A 0.75 ⍀ 5 A @ ILX = 1 A DPWM(LF) Duty cycle range of PWM signal applied to ADJ pin during low frequency PWM dimming mode Brightness control range DCADJ (*) DC Brightness control range PWM frequency <300Hz PWM amplitude = VREF Measured on ADJ pin TSS Soft start time fLX Operating frequency (See graphs for more detail) 0.001 TONmin Minimum switch ‘ON’ time TOFFmin Minimum switch ‘OFF’ time LX switch ‘OFF’ 1 1000:1 5:1 See note (*) Time taken for output current to reach 90% of final value after voltage on ADJ pin has risen above 0.3V Requires external capacitor 22nF. See graphs for more details ADJ pin floating L = 68H (0.2⍀) IOUT = 1A @ VLED = 3.6V Driving 3 LEDs LX switch ‘ON’ TPWmin_REC Recommended minimum switch pulse width Recommended maximum fLXmax operating frequency DLX Recommended duty cycle range of output switch at fLXmax 0.5 LX switch 'ON' or ‘OFF’ 2 ms 260 kHz 130 (†) ns 70 (†) 800 ns ns 500 0.3 kHz 0.7 NOTES: (*) Ratio of maximum brightness to minimum brightness before shutdown VREF = 1.25/0.3. VREF externally driven to 2.5V, ratio 10:1. (†) Parameters are not tested at production. Parameters are guaranteed by design, characterization and process control. Issue 2 - September 2008 © Diodes Incorporated 2008 3 www.zetex.com www.diodes.com ZXLD1366 Pin description LX 1 5 VIN GND 2 4 ISENSE ADJ 3 LX VIN GND GND ISENSE ADJ DFN633 Top view TSOT23-5 Top view Name Pin no. LX 1 Drain of NDMOS switch GND 2 Ground (0V) ADJ 3 Multi-function On/Off and brightness control pin: • Leave floating for normal operation.(VADJ = VREF = 1.25V giving nominal average output current IOUTnom = 0.2V/RS) • Drive to voltage below 0.2V to turn off output current • Drive with DC voltage (0.3V < VADJ < 2.5V) to adjust output current from 25% to 200% of IOUTnom • Connect a capacitor from this pin to ground to set soft-start time. Soft start time increases approximately 0.2ms/nF ISENSE 4 Connect resistor RS from this pin to VIN to define nominal average output current IOUTnom = 0.2V/RS (Note: RSMIN = 0.2⍀ with ADJ pin open-circuit) VIN 5 Input voltage (6V to 60V). Decouple to ground with 4.7F or higher X7R ceramic capacitor close to device Tab Description Not internally connected. Connect to ground plane to improve thermal efficiency Ordering information Device Reel size (inches) Reel width (mm) Quantity per reel ZXLD1366ET5TA 7” 8 3,000 1366 ZXLD1366DACTC 13” 12 3,000 1366 Issue 2 - September 2008 © Diodes Incorporated 2008 4 Device mark www.zetex.com www.diodes.com ZXLD1366 D1 VIN L1 RS 5 5V C1 4.7F 4 VIN 1 ISENSE LX R1 Voltage regulator + 0.2V + Low voltage detector MN + Adj 3 R4 50K D1 1.25V Gnd R5 20K 600KHz R2 + R3 1.35V 2 Figure 1 Issue 2 - September 2008 © Diodes Incorporated 2008 Block diagram - Pin connection for TSOT package 5 www.zetex.com www.diodes.com ZXLD1366 Device description The device, in conjunction with the coil (L1) and current sense resistor (RS), forms a selfoscillating continuous-mode buck converter. Device operation (refer to Figure 1 - Block diagram and Figure 2 Operating waveforms) Operation can be best understood by assuming that the ADJ pin of the device is unconnected and the voltage on this pin (VADJ) appears directly at the (+) input of the comparator. When input voltage VIN is first applied, the initial current in L1 and RS is zero and there is no output from the current sense circuit. Under this condition, the (-) input to the comparator is at ground and its output is high. This turns MN on and switches the LX pin low, causing current to flow from VIN to ground, via RS, L1 and the LED(s). The current rises at a rate determined by VIN and L1 to produce a voltage ramp (VSENSE) across RS. The supply referred voltage VSENSE is forced across internal resistor R1 by the current sense circuit and produces a proportional current in internal resistors R2 and R3. This produces a ground referred rising voltage at the (-) input of the comparator. When this reaches the threshold voltage (VADJ), the comparator output switches low and MN turns off. The comparator output also drives another NMOS switch, which bypasses internal resistor R3 to provide a controlled amount of hysteresis. The hysteresis is set by R3 to be nominally 15% of VADJ. When MN is off, the current in L1 continues to flow via D1 and the LED(s) back to VIN. The current decays at a rate determined by the LED(s) and diode forward voltages to produce a falling voltage at the input of the comparator. When this voltage returns to VADJ, the comparator output switches high again. This cycle of events repeats, with the comparator input ramping between limits of VADJ ± 15%. Switching thresholds With VADJ = VREF, the ratios of R1, R2 and R3 define an average VSENSE switching threshold of 200mV (measured on the ISENSE pin with respect to VIN). The average output current IOUTnom is then defined by this voltage and RS according to: IOUTnom = 200mV/RS Nominal ripple current is ±30mV/RS Adjusting output current The device contains a low pass filter between the ADJ pin and the threshold comparator and an internal current limiting resistor (50k⍀ nom) between ADJ and the internal reference voltage. This allows the ADJ pin to be overdriven with either DC or pulse signals to change the VSENSE switching threshold and adjust the output current. Details of the different modes of adjusting output current are given in the applications section. Output shutdown The output of the low pass filter drives the shutdown circuit. When the input voltage to this circuit falls below the threshold (0.2V nom.), the internal regulator and the output switch are turned off. The voltage reference remains powered during shutdown to provide the bias current for the shutdown circuit. Quiescent supply current during shutdown is nominally 60A and switch leakage is below 5A. Issue 2 - September 2008 © Diodes Incorporated 2008 6 www.zetex.com www.diodes.com ZXLD1366 VIN LX voltage 0V Toff Ton VIN 170mV 230mV 200mV VSENSE- SENSE voltage VSENSE+ IOUTnom +15% IOUTnom Coil current IOUTnom -15% 0V Comparator input voltage 0.15VADJ VADJ 0.15VADJ Comparator output 5V 0V Figure 2 Issue 2 - September 2008 © Diodes Incorporated 2008 Theoretical operating waveforms 7 www.zetex.com www.diodes.com ZXLD1366 Actual operating waveforms [VIN=15V, RS=0.2⍀, L=68µH] Normal operation. Output current (Ch3) and LX voltage (Ch2) Actual operating waveforms [VIN=30V, RS=0.2⍀, L=68µH] Normal operation. Output current (Ch3) and LX voltage (Ch2) Actual operating waveforms [VIN=60V, RS=0.2⍀, L=68µH] Normal operation. Output current (Ch3) and LX voltage (Ch2) Issue 2 - September 2008 © Diodes Incorporated 2008 8 www.zetex.com www.diodes.com ZXLD1366 Intentionally left blank Issue 2 - September 2008 © Diodes Incorporated 2008 9 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Output Current L=68μH 1.100 01 LEDs 03 LEDs 1.080 05 LEDs 07 LEDs 09 LEDs 11 LEDs Output Current (A) 1.060 13 LEDs 15 LEDs 1.040 1.020 1.000 0.980 0 10 20 30 40 50 60 40 50 60 40 50 60 Supply Voltage (V) ZXLD1366 Output Current Deviation L=68μH 10% 8% Output Current Deviation (%) 6% 4% 2% 0% 01 LEDs -2% 03 LEDs 05 LEDs -4% 07 LEDs 09 LEDs -6% 11 LEDs 13 LEDs -8% 15 LEDs -10% 0 10 20 30 Supply Voltage (V) ZXLD1366 Efficiency L=68μH 100% 01 LEDs 95% 03 LEDs 05 LEDs 90% 07 LEDs 09 LEDs Efficiency (%) 85% 11 LEDs 13 LEDs 80% 15 LEDs 75% 70% 65% 60% 55% 50% 0 10 20 30 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 10 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Switching Frequency L=68μH 500 450 01 LEDs 03 LEDs 400 Switching Frequency (kHz) 05 LEDs 07 LEDs 350 09 LEDs 11 LEDs 300 13 LEDs 15 LEDs 250 200 150 100 50 0 0 10 20 30 40 50 40 50 60 Supply Voltage (V) ZXLD1366 Duty Cycle L=68μH 100% 90% 80% Duty Cycle (%) 70% 60% 50% 01 LEDs 03 LEDs 40% 05 LEDs 07 LEDs 30% 09 LEDs 11 LEDs 20% 13 LEDs 15 LEDs 10% 0% 0 10 20 30 60 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 11 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Output Current L=100μH 1.100 01 LEDs 03 LEDs 1.080 05 LEDs 07 LEDs 09 LEDs Output Current (A) 1.060 11 LEDs 13 LEDs 15 LEDs 1.040 1.020 1.000 0.980 0.960 0 10 20 30 40 50 60 Supply Voltage (V) ZXLD1366 Output Current Deviation L=100μH 10% 8% Output Current Deviation (%) 6% 4% 2% 0% 01 LEDs -2% 03 LEDs 05 LEDs -4% 07 LEDs 09 LEDs -6% 11 LEDs 13 LEDs -8% 15 LEDs -10% 0 10 20 30 40 50 60 Supply Voltage (V) ZXLD1366 Efficiency L=100μH 100% 01 LEDs 95% 03 LEDs 05 LEDs 90% 07 LEDs 09 LEDs Efficiency (%) 85% 11 LEDs 13 LEDs 80% 15 LEDs 75% 70% 65% 60% 55% 50% 0 10 20 30 40 50 60 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 12 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Switching Frequency L=100μH 500 450 01 LEDs 03 LEDs 400 Switching Frequency (kHz) 05 LEDs 07 LEDs 350 09 LEDs 11 LEDs 300 13 LEDs 15 LEDs 250 200 150 100 50 0 0 10 20 30 40 50 60 Supply Voltage (V) ZXLD1366 Duty Cycle L=100μH 100% 90% 80% Duty Cycle (%) 70% 60% 50% 01 LEDs 40% 03 LEDs 05 LEDs 30% 07 LEDs 09 LEDs 20% 11 LEDs 13 LEDs 10% 15 LEDs 0% 0 10 20 30 40 50 60 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 13 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Output Current L=150μH 1.100 01 LEDs 03 LEDs 1.080 05 LEDs 07 LEDs Output Current (A) 09 LEDs 1.060 11 LEDs 13 LEDs 15 LEDs 1.040 1.020 1.000 0.980 0 10 20 30 40 50 60 50 60 Supply Voltage (V) ZXLD1366 Output Current Deviation L=150μH 10% 8% Output Current Deviation (%) 6% 4% 2% 0% 01 LEDs -2% 03 LEDs 05 LEDs -4% 07 LEDs 09 LEDs -6% 11 LEDs 13 LEDs -8% 15 LEDs -10% 0 10 20 30 40 Supply Voltage (V) ZXLD1366 Efficiency L=150μH 100% 01 LEDs 95% 03 LEDs 05 LEDs 90% 07 LEDs 09 LEDs Efficiency (%) 85% 11 LEDs 13 LEDs 80% 15 LEDs 75% 70% 65% 60% 55% 50% 0 10 20 30 40 50 60 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 14 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Switching Frequency L=150μH 500 450 01 LEDs 03 LEDs Switching Frequency (kHz) 400 05 LEDs 07 LEDs 350 09 LEDs 11 LEDs 300 13 LEDs 15 LEDs 250 200 150 100 50 0 0 10 20 30 40 50 40 50 60 Supply Voltage (V) ZXLD1366 Duty Cycle L=150μH 100% 90% 80% Duty Cycle (%) 70% 60% 50% 01 LEDs 40% 03 LEDs 05 LEDs 30% 07 LEDs 09 LEDs 20% 11 LEDs 13 LEDs 10% 15 LEDs 0% 0 10 20 30 60 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 15 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Output Current L=220μH 1.100 01 LEDs 1.080 03 LEDs 05 LEDs Output Current (A) 07 LEDs 09 LEDs 1.060 11 LEDs 13 LEDs 15 LEDs 1.040 1.020 1.000 0.980 0 10 20 30 40 50 60 Supply Voltage (V) ZXLD1366 Output Current Deviation L=220μH 10% 8% Output Current Deviation (%) 6% 4% 2% 0% -2% 01 LEDs -4% 05 LEDs 03 LEDs 07 LEDs 09 LEDs -6% 11 LEDs 13 LEDs -8% 15 LEDs -10% 0 10 20 30 40 50 60 40 50 60 Supply Voltage (V) ZXLD1366 Efficiency L=220μH 100% 95% 01 LEDs 03 LEDs 90% 05 LEDs 07 LEDs 85% 09 LEDs Efficiency (%) 11 LEDs 80% 13 LEDs 15 LEDs 75% 70% 65% 60% 55% 50% 0 10 20 30 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 16 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions ZXLD1366 Switching Frequency L=220μH 500 450 01 LEDs 03 LEDs 400 Switching Frequency (kHz) 05 LEDs 07 LEDs 350 09 LEDs 11 LEDs 300 13 LEDs 15 LEDs 250 200 150 100 50 0 0 10 20 30 40 50 60 40 50 60 Supply Voltage (V) ZXLD1366 Duty Cycle L=220μH 100% 90% 80% Duty Cycle (%) 70% 60% 50% 40% 01 LEDs 03 LEDs 30% 05 LEDs 07 LEDs 20% 09 LEDs 11 LEDs 10% 13 LEDs 15 LEDs 0% 0 10 20 30 Supply Voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 17 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions LED Current vs Vadj 1200 1000 LED Current (mA) 800 600 400 200 0 0 1 2 3 ADJ Pin Voltage (V) R=200mΩ R=300mΩ R=680mΩ Supply current 800 Supply current (A) 700 600 500 400 Output transistor fully enhanced 300 Output transistor not fully enhanced 200 100 0 0 10 20 30 40 50 60 70 Supply voltage (V) Vref ADJ pin voltage (V) 1.243 1.2425 1.242 1.2415 1.241 1.2405 1.24 1.2395 1.239 1.2385 1.238 0 10 20 30 40 50 60 70 Supply voltage (V) Shutdown current Shutdown current (A) 90 80 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 Supply voltage (V) Issue 2 - September 2008 © Diodes Incorporated 2008 18 www.zetex.com www.diodes.com ZXLD1366 Typical operating conditions Lx on-resistance vs supply voltage O n -resistan ce (O h m s) 2 .5 2 1 .5 -4 0 oC 2 5 oC 1 2 5 oC 1 0 .5 0 0 10 20 30 40 50 60 70 S u p p ly V o lta g e (V ) Vadj vs Temperature 1.262 1.26 1.258 Vadj (V) 1.256 7V 9V 12V 20V 30V 1.254 1.252 1.25 1.248 1.246 1.244 -50 0 50 100 150 200 Temperature (C) Lx on-resistance vs die temperature 1.6 On-resistance (Ohms) 1.4 1.2 1 7V 9V 12V 20V 30V 0.8 0.6 0.4 0.2 0 -50 0 50 100 150 200 Die Temperature (C) Issue 2 - September 2008 © Diodes Incorporated 2008 19 www.zetex.com www.diodes.com ZXLD1366 Application notes Setting nominal average output current with external resistor RS The nominal average output current in the LED(s) is determined by the value of the external current sense resistor (RS) connected between VIN and ISENSE and is given by: IOUTnom = 0.2/RS [for RS ⱖ 0.2⍀] The table below gives values of nominal average output current for several preferred values of current setting resistor (RS) in the typical application circuit shown on page 1: RS (⍀) Nominal average output current (mA) 0.20 1000 0.27 740 0.56 357 The above values assume that the ADJ pin is floating and at a nominal voltage of VREF (=1.25V). Note that RS = 0.2⍀ is the minimum allowed value of sense resistor under these conditions to maintain switch current below the specified maximum value. It is possible to use different values of RS if the ADJ pin is driven from an external voltage. (See next section). Output current adjustment by external DC control voltage The ADJ pin can be driven by an external dc voltage (VADJ), as shown, to adjust the output current to a value above or below the nominal average value defined by RS. + ADJ ZXLD1366 GND DC GND The nominal average output current in this case is given by: IOUTdc = (VADJ /1.25) x (0.2/RS) [for 0.3< VADJ <2.5V] Note that 100% brightness setting corresponds to VADJ = VREF. When driving the ADJ pin above 1.25V, RS must be increased in proportion to prevent IOUTdc exceeding 1A maximum. The input impedance of the ADJ pin is 50k⍀ ±25% for voltages below VREF and 14.2k⍀ ±25% for voltages above VREF +100mV. Issue 2 - September 2008 © Diodes Incorporated 2008 20 www.zetex.com www.diodes.com ZXLD1366 Output current adjustment by PWM control Directly driving ADJ input A Pulse Width Modulated (PWM) signal with duty cycle DPWM can be applied to the ADJ pin, as shown below, to adjust the output current to a value above or below the nominal average value set by resistor RS: PWM VADJ ADJ 0V ZXLD1366 GND GND Driving the ADJ input via open collector transistor The recommended method of driving the ADJ pin and controlling the amplitude of the PWM waveform is to use a small NPN switching transistor as shown below: ADJ PWM ZXLD1366 GND GND This scheme uses the 50k resistor between the ADJ pin and the internal voltage reference as a pull-up resistor for the external transistor. Driving the ADJ input from a microcontroller Another possibility is to drive the device from the open drain output of a microcontroller. The diagram below shows one method of doing this: MCU 3.3k ADJ ZXLD1366 GND If the NMOS transistor within the microcontroller has high Gate / Drain capacitance, this arrangement can inject a negative spike into ADJ input of the ZXLD1366 and cause erratic operation but the addition of a Schottky clamp diode (eg Diodes Inc. SD103CWS) to ground and inclusion of a series resistor (3.3k) will prevent this. See the section on PWM dimming for more details of the various modes of control using high frequency and low frequency PWM signals. Issue 2 - September 2008 © Diodes Incorporated 2008 21 www.zetex.com www.diodes.com ZXLD1366 Shutdown mode Taking the ADJ pin to a voltage below 0.2V for more than approximately 100µs will turn off the output and supply current to a low standby level of 65µA nominal. Note that the ADJ pin is not a logic input. Taking the ADJ pin to a voltage above VREF will increase output current above the 100% nominal average value. (See page 18 graphs for details). Soft-start An external capacitor from the ADJ pin to ground will provide a soft-start delay, by increasing the time taken for the voltage on this pin to rise to the turn-on threshold and by slowing down the rate of rise of the control voltage at the input of the comparator. Adding capacitance increases this delay by approximately 0.2ms/nF. The graph below shows the variation of soft-start time for different values of capacitor. Soft Start Time vs Capacitance from ADJ pin to Ground 16 14 Soft Start Time (ms) 12 10 8 6 4 2 0 -2 0 20 40 60 Capacitance (nf) 80 100 120 Actual operating waveforms [VIN=60V, RS=0.2⍀, L=68µH, 22nF on ADJ] Soft-start operation. LX voltage (CH2) and Output current (CH3) using a 22nF external capacitor on the ADJ pin. 2 3 Issue 2 - September 2008 © Diodes Incorporated 2008 Ch3 500mA M 400μs 5.0 S/s Ch 2 20.0V A Ch2 \ 12.0 V 22 200 ns/pt www.zetex.com www.diodes.com ZXLD1366 VIN capacitor selection A low ESR capacitor should be used for input decoupling, as the ESR of this capacitor appears in series with the supply source impedance and lowers overall efficiency. This capacitor has to supply the relatively high peak current to the coil and smooth the current ripple on the input supply. To avoid transients into the IC, the size of the input capacitor will depend on the VIN voltage: VIN = 6 to 40V CIN = 2.2F VIN = 40 to 50V CIN = 4.7F VIN = 50 to 60V CIN = 10F When the input voltage is close to the output voltage the input current increases which puts more demand on the input capacitor. The minimum value of 2.2F may need to be increased to 4.7F; higher values will improve performance at lower input voltages, especially when the source impedance is high. The input capacitor should be placed as close as possible to the IC. For maximum stability over temperature and voltage, capacitors with X7R, X5R, or better dielectric is recommended. Capacitors with Y5V dielectric are not suitable for decoupling in this application and should NOT be used. When higher voltages are used with the CIN = 10F, an electrolytic capacitor can be used provided that a suitable 1F ceramic capacitor is also used and positioned as close to the VIN pin as possible. A suitable capacitor would be NACEW100M1006.3x8TR13F (NIC Components). The following web sites are useful when finding alternatives: www.murata.com www.niccomp.com www.kemet.com Issue 2 - September 2008 © Diodes Incorporated 2008 23 www.zetex.com www.diodes.com ZXLD1366 Inductor selection Recommended inductor values for the ZXLD1366 are in the range 68 µH to 220 µH. Higher values of inductance are recommended at higher supply voltages in order to minimize errors due to switching delays, which result in increased ripple and lower efficiency. Higher values of inductance also result in a smaller change in output current over the supply voltage range. (see graphs pages 10-17). The inductor should be mounted as close to the device as possible with low resistance connections to the LX and VIN pins. The chosen coil should have a saturation current higher than the peak output current and a continuous current rating above the required mean output current. Suitable coils for use with the ZXLD1366 may be selected from the MSS range manufactured by Coilcraft, or the NPIS range manufactured by NIC components. The following websites may be useful in finding suitable components www.coilcraft.com www.niccomp.com www.wuerth-elektronik.de The inductor value should be chosen to maintain operating duty cycle and switch 'on'/'off' times within the specified limits over the supply voltage and load current range. The graph Figure 3 below can be used to select a recommended inductor based on maintaining the ZXLD1366 case temperature below 60°C. For detailed performance characteristics for the inductor values 68, 100, 150 and 220µH see graphs on pages 10-17. Minimum Recommended Inductor 2% Accuracy, <60°C Case Temperature 15 Legend 14 68uH 13 100uH 12 150uH Number of LEDs 11 220uH 10 9 8 7 6 5 4 3 2 1 0 10 20 30 40 50 60 Supply Voltage (V) Figure 3 Issue 2 - September 2008 © Diodes Incorporated 2008 ZXLD1366 Minimum recommended inductor (TSOT) 24 www.zetex.com www.diodes.com ZXLD1366 M in im u m R e c o m m e n d e d In d u c to r 2% A ccuracy, <60°C C ase T em perature 16 Legend 15 68µH 14 100µH 13 150µH 12 220µH N u m b er o f L E D s 11 10 9 8 7 6 5 4 3 2 1 0.00 10.00 20.00 30.00 40.00 50.00 60.00 S u p p ly V o ltag e (V ) Figure 4 ZXLD1366 Minimum recommended inductor (DFN) Diode Selection For maximum efficiency and performance, the rectifier (D1) should be a fast low capacitance Schottky diode* with low reverse leakage at the maximum operating voltage and temperature. They also provide better efficiency than silicon diodes, due to a combination of lower forward voltage and reduced recovery time. It is important to select parts with a peak current rating above the peak coil current and a continuous current rating higher than the maximum output load current. It is very important to consider the reverse leakage of the diode when operating above 85°C. Excess leakage will increase the power dissipation in the device and if close to the load may create a thermal runaway condition. The higher forward voltage and overshoot due to reverse recovery time in silicon diodes will increase the peak voltage on the LX output. If a silicon diode is used, care should be taken to ensure that the total voltage appearing on the LX pin including supply ripple, does not exceed the specified maximum value. *A suitable Schottky diode would be B3100 (Diodes Inc). Issue 2 - September 2008 © Diodes Incorporated 2008 25 www.zetex.com www.diodes.com ZXLD1366 Reducing output ripple Peak to peak ripple current in the LED(s) can be reduced, if required, by shunting a capacitor Cled across the LED(s) as shown below: D1 VIN Rs LED Cled L1 VIN ISENSE LX ZXLD1366 A value of 1F will reduce the supply ripple current by a factor three (approx.). Proportionally lower ripple can be achieved with higher capacitor values. Note that the capacitor will not affect operating frequency or efficiency, but it will increase start-up delay, by reducing the rate of rise of LED voltage. By adding this capacitor the current waveform through the LED(s) changes from a triangular ramp to a more sinusoidal version without altering the mean current value . Operation at low supply voltage Below the under-voltage lockout threshold (VSD) the drive to the output transistor is turned off to prevent device operation with excessive on-resistance of the output transistor. The output transistor is not full enhanced until the supply voltage exceeds approximately 17V. At supply voltages between VSD and 17V care must be taken to avoid excessive power dissipation due to the on-resistance. If the supply voltage is always less than 30V continuous (or less than 40V for less than 0.5s) an alternative device is available, the ZXLD1360. Note that when driving loads of two or more LEDs, the forward drop will normally be sufficient to prevent the device from switching below approximately 6V. This will minimize the risk of damage to the device. Thermal considerations When operating the device at high ambient temperatures, or when driving maximum load current, care must be taken to avoid exceeding the package power dissipation limits. The graph below gives details for power derating. This assumes the device to be mounted on a 25mm2 PCB with 1oz copper standing in still air. Issue 2 - September 2008 © Diodes Incorporated 2008 26 www.zetex.com www.diodes.com ZXLD1366 Maximum Power Dissipation 2000 1800 DFN 1600 Power (mW) 1400 1200 1000 TSOT 800 600 400 200 0 -50 -30 -10 10 30 50 70 90 110 130 150 Ambient Temperature (Deg C) Note that the device power dissipation will most often be a maximum at minimum supply voltage. It will also increase if the efficiency of the circuit is low. This may result from the use of unsuitable coils, or excessive parasitic output capacitance on the switch output. Thermal compensation of output current High luminance LEDs often need to be supplied with a temperature compensated current in order to maintain stable and reliable operation at all drive levels. The LEDs are usually mounted remotely from the device so, for this reason, the temperature coefficients of the internal circuits for the ZXLD1366 have been optimized to minimize the change in output current when no compensation is employed. If output current compensation is required, it is possible to use an external temperature sensing network - normally using Negative Temperature Coefficient (NTC) thermistors and/or diodes, mounted very close to the LED(s). The output of the sensing network can be used to drive the ADJ pin in order to reduce output current with increasing temperature. Issue 2 - September 2008 © Diodes Incorporated 2008 27 www.zetex.com www.diodes.com ZXLD1366 Layout considerations LX pin The LX pin of the device is a fast switching node, so PCB tracks should be kept as short as possible. To minimize ground 'bounce', the ground pin of the device should be soldered directly to the ground plane. Coil and decoupling capacitors and current sense resistor It is particularly important to mount the coil and the input decoupling capacitor as close to the device pins as possible to minimize parasitic resistance and inductance, which will degrade efficiency. It is also important to minimize any track resistance in series with current sense resistor RS. Its best to connect VIN directly to one end of RS and Isense directly to the opposite end of RS with no other currents flowing in these tracks. It is important that the cathode current of the Schottky diode does not flow in a track between RS and VIN as this may give an apparent higher measure of current than is actual because of track resistance. ADJ pin The ADJ pin is a high impedance input for voltages up to 1.35V so, when left floating, PCB tracks to this pin should be as short as possible to reduce noise pickup. A 100nF capacitor from the ADJ pin to ground will reduce frequency modulation of the output under these conditions. An additional series 3.3k⍀ resistor can also be used when driving the ADJ pin from an external circuit (see below). This resistor will provide filtering for low frequency noise and provide protection against high voltage transients. 3.3k ADJ 100nF ZXLD1366 GND GND High voltage tracks Avoid running any high voltage tracks close to the ADJ pin, to reduce the risk of leakage currents due to board contamination. The ADJ pin is soft-clamped for voltages above 1.35V to desensitize it to leakage that might raise the ADJ pin voltage and cause excessive output current. However, a ground ring placed around the ADJ pin is recommended to minimize changes in output current under these conditions. Evaluation PCB ZXLD1366 evaluation boards are available on request. Terminals allow for interfacing to customers own LED products. Issue 2 - September 2008 © Diodes Incorporated 2008 28 www.zetex.com www.diodes.com ZXLD1366 Dimming output current using PWM Low frequency PWM mode When the ADJ pin is driven with a low frequency PWM signal (eg 100Hz), with a high level voltage VADJ and a low level of zero, the output of the internal low pass filter will swing between 0V and VADJ, causing the input to the shutdown circuit to fall below its turn-off threshold (200mV nom) when the ADJ pin is low. This will cause the output current to be switched on and off at the PWM frequency, resulting in an average output current IOUTavg proportional to the PWM duty cycle. (See Figure 4 - Low frequency PWM operating waveforms). VADJ Ton PWM Voltage Toff 0V IOUTnom 0.2 / Rs IOUTavg Output Current 0 Figure 4 Low frequency PWM operating waveforms The average value of output current in this mode is given by: IOUTavg 0.2DPWM/RS [for DPWM >0.001] This mode is preferable if optimum LED 'whiteness' is required. It will also provide the widest possible dimming range (approx. 1000:1) and higher efficiency at the expense of greater output ripple. Issue 2 - September 2008 © Diodes Incorporated 2008 29 www.zetex.com www.diodes.com ZXLD1366 Package outline - TSOT23-5 DIM A A1 A2 b c D E E1 e e1 L L2 a° Millimeters Min. 0.01 0.84 0.30 0.12 Inches Max. 1.00 0.10 0.90 0.45 0.20 Min. 0.0003 0.0330 0.0118 0.0047 2.90 BSC 2.80 BSC 1.60 BSC 0.95 BSC 1.90 BSC 0.30 0.114 BSC 0.110 BSC 0.062 BSC 0.0374 BSC 0.0748 BSC 0.50 0.0118 12° 4° 0.25 BSC 4° Max. 0.0393 0.0039 0.0354 0.0177 0.0078 0.0196 0.010 BSC 12° Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 2 - September 2008 © Diodes Incorporated 2008 30 www.zetex.com www.diodes.com ZXLD1366 Package outline - DFN633 e1 D E E2 L D2 b TOP VIEW e BOTTOM VIEW A3 A1 A PIN 1 DOT BY MARKING PIN #1 IDENTIFICATION CHAMFER 0.300X45° SIDE VIEW DIM Millimeters Inches DIM Min. Max. Min. Max. A 0.700 0.800 0.0275 0.0315 D2 A1 0.000 0.050 0.000 0.00197 e A3 0.203 REF 0.008 Millimeters Inches Min. Max. Min. Max. 1.950 2.050 0.0768 0.0807 0.950 BSC 0.0374 BSC E 2.950 3.050 0.116 0.120 1.150 1.250 0.0452 0.0492 b 0.300 0.400 0.0118 0.0157 E2 D 2.950 3.050 0.116 0.120 e1 L 1.900REF 0.450 0.550 0.0748 0.0177 0.0216 Note controlling dimensions in millimetres. Approximate dimensions are provided in inches Issue 2 - September 2008 © Diodes Incorporated 2008 31 www.zetex.com www.diodes.com ZXLD1366 Definitions Product change Diodes Incorporated reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Diodes Inc. with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Diodes Inc. does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Diodes Inc. products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labelling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Diodes Inc. terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Diodes sales office. Quality of product Diodes Zetex Semiconductors Limited is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Diodes Zetex or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com or www.diodes.com Diodes Inc does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Diodes Inc. is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Diodes Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Diodes Zetex sales offices Europe Americas Asia Pacific Corporate Headquarters Zetex GmbH Kustermann-Park Balanstraße 59 D-81541 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 [email protected] Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Diodes Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Diodes Incorporated 15660 N. Dallas Parkway Suite 850, Dallas, X57248, USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 [email protected] Telephone: (852) 26100 611 Fax: (852) 24250 494 [email protected] Telephone: (1) 972 385 2810 www.diodes.com © 2008 Diodes Incorporated 2008 Issue 2 - September 2008 © Diodes Incorporated 2008 32 www.zetex.com www.diodes.com