DIODES ZXTP03200BZTA

A Product Line of
Diodes Incorporated
ZXTP03200BZ
2 00 V PN P L OW V C E ( s a t ) TRAN SIST OR IN SOT -89
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Features
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Mechanical Data
BVCEO > -200V
BVECO > -2V
Continuous current IC(cont) = 2A
VCE(sat < -160mV @ -1A
RCE(sat)=130mΩ
PD = 2.4W
2 Amps continuous current
Up to 5 Amps peak current
Very low saturation voltage
Enhanced switching performance
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Case: SOT-89
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish
Weight: 0.052 grams (approximate)
Applications
•
DC-DC Convertors
SOT-89
Top View
Device symbol
Pin Configuration
Ordering Information
Product
ZXTP03200BZTA
Marking
1N2
Reel size (inches)
7
Tape width (mm)
12
Quantity per reel
1000
Marking Information
1N2 = Product type Marking Code
ZXTP03200BZ
Document Number DS31902 Rev. 2 - 2
1 of 7
www.diodes.com
August 2009
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP03200BZ
2 00 V PN P L OW V C E ( s a t ) TRAN SIST OR IN SOT -89
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current (Note a)
Base Current
Peak Pulse Current
Symbol
VCBO
VCEO
VEBO
IC
IB
ICM
Value
-220
-200
-7
-2
-1
-5
Unit
V
V
V
A
A
A
Symbol
Value
1.1
8.8
1.8
14.4
2.4
19.2
4.46
35.7
38.7
309.6
117
68
51
28
3.23
-55 to +150
Unit
W
mW /°C
W
mW /°C
W
mW /°C
W
mW /°C
W
mW /°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C
Thermal Characteristics
Characteristic
Power Dissipation at TA = 25°C (Note a)
Linear derating factor
Power Dissipation at TA = 25°C (Note b)
Linear derating factor
Power Dissipation at TA = 25°C (Note c)
Linear derating factor
Power Dissipation at TA = 25°C (Note d)
Linear derating factor
Power Dissipation at TA = 25°C (Note e)
Linear derating factor
Junction to Ambient (Note a)
Junction to Ambient (Note b)
Junction to Ambient (Note c)
Junction to Ambient (Note d)
Junction to Lead (Note e)
Operating and Storage Temperature Range
Notes:
PD
PD
PD
PD
PD
RθJA
RθJA
RθJA
RθJA
RθJL
TJ, TSTG
a. For a device surface mounted on 15mm X 15mm X 1.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions
b. Mounted on 25mm X 25mm X 1.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions.
c. Mounted on 25mm X 25mm X 1.6mm FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions.
d. As (c) above measured at t<5 seconds
e. Junction to lead from collector Tab. Typical
ZXTP03200BZ
Document Number DS31902 Rev. 2 - 2
2 of 7
www.diodes.com
August 2009
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP03200BZ
2 00 V PN P L OW V C E ( s a t ) TRAN SIST OR IN SOT -89
Thermal Characteristics and Derating information
ZXTP03200BZ
Document Number DS31902 Rev. 2 - 2
3 of 7
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August 2009
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP03200BZ
2 00 V PN P L OW V C E ( s a t ) TRAN SIST OR IN SOT -89
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note f)
Emitter-Base Breakdown Voltage
Symbol
V(BR)CBO
V(BR)CER
V(BR)CEO
V(BR)EBO
Collector-Base Cutoff Current
ICBO
Emitter Cutoff Current
IEBO
Static Forward Current Transfer Ratio (Note f)
Min
-220
-220
-220
-7
Typ
-245
-245
-225
-8.4
<1
<1
100
100
20
hFE
195
179
50
5
Max
-50
-0.5
-10
Unit
V
V
V
V
nA
µA
nA
300
Collector-Emitter Saturation Voltage (Note f)
VCE(SAT)
-37
-120
-130
-160
-50
-155
-160
-260
mV
mV
mV
mV
Base-Emitter Saturation Voltage (Note f)
Base-Emitter Turn-On Voltage (Note f)
Output Capacitance (Note f)
VBE(sat)
VBE(ON)
Cobo
-940
-840
31
-1100
-1000
mV
mV
pF
Transition Frequency
fT
105
MHz
Delay Time
Rise Time
Storage Time
Fall Time
td
tr
Ts
Tf
21
18
680
75
ns
ns
ns
ns
Notes:
Test Condition
IC = -100µA
IC = -1µA, RBE ≤ 1kΩ
IC = -10mA
IE = -100µA
VCB = -200V
VCB = -200V, Tamb = 100°C
VEB = -6V
IC = -10mA, VCE = -5V
IC = -1A, VCE = -5V
IC = -2A, VCE = -5V
IC = -5A, VCE = -5V
IC = -100mA, IB = -10mA
IC = -500mA, IB = -25mA
IC = -1A, IB = -100mA
IC = -2A, IB = -400mA
IC = -2A, IB = -400mV
IC = -2A, VCE = -5V
VCB = -10V. f = 1MHz
VCE = -10V, IC = -100mA
f = 50MHz
VCC = -50V, IC = -1A
IB1 = -IB2 = -100mA
f. Measured under pulsed conditions. Pulse width = 300 µs. Duty cycle ≤ 2%
ZXTP03200BZ
Document Number DS31902 Rev. 2 - 2
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August 2009
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP03200BZ
2 00 V PN P L OW V C E ( s a t ) TRAN SIST OR IN SOT -89
Typical Characteristics
ZXTP03200BZ
Document Number DS31902 Rev. 2 - 2
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© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP03200BZ
2 00 V PN P L OW V C E ( s a t ) TRAN SIST OR IN SOT -89
Package Outline Dimensions
Suggested Pad Layout
ZXTP03200BZ
Document Number DS31902 Rev. 2 - 2
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August 2009
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP03200BZ
2 00 V PN P L OW V C E ( s a t ) TRAN SIST OR IN SOT -89
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising
out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under
its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such
applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are
represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales
channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
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Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and
markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the
express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A.
B.
Life support devices or systems are devices or systems which:
1.
are intended to implant into the body, or
2.
support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in
the labeling can be reasonably expected to result in significant injury to the user.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems,
and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their
products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devicesor systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes
Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life
support devices or systems.
Copyright © 2009, Diodes Incorporated
www.diodes.com
ZXTP03200BZ
Document Number DS31902 Rev. 2 - 2
7 of 7
www.diodes.com
August 2009
© Diodes Incorporated